JP2010251666A5 - - Google Patents
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- Publication number
- JP2010251666A5 JP2010251666A5 JP2009102328A JP2009102328A JP2010251666A5 JP 2010251666 A5 JP2010251666 A5 JP 2010251666A5 JP 2009102328 A JP2009102328 A JP 2009102328A JP 2009102328 A JP2009102328 A JP 2009102328A JP 2010251666 A5 JP2010251666 A5 JP 2010251666A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting substrate
- sealing member
- light emitting
- emitting device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 66
- 238000007789 sealing Methods 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- 238000000748 compression moulding Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 claims description 2
- 238000005266 casting Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009102328A JP5347681B2 (ja) | 2009-04-20 | 2009-04-20 | 発光装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009102328A JP5347681B2 (ja) | 2009-04-20 | 2009-04-20 | 発光装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013122108A Division JP5747947B2 (ja) | 2013-06-10 | 2013-06-10 | 発光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010251666A JP2010251666A (ja) | 2010-11-04 |
| JP2010251666A5 true JP2010251666A5 (https=) | 2012-05-24 |
| JP5347681B2 JP5347681B2 (ja) | 2013-11-20 |
Family
ID=43313645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009102328A Expired - Fee Related JP5347681B2 (ja) | 2009-04-20 | 2009-04-20 | 発光装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5347681B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134253A (ja) | 2010-12-20 | 2012-07-12 | Toyoda Gosei Co Ltd | 照明用ｌｅｄモジュール |
| JP6318495B2 (ja) | 2013-08-07 | 2018-05-09 | 日亜化学工業株式会社 | 発光装置 |
| JP6201617B2 (ja) | 2013-10-17 | 2017-09-27 | 日亜化学工業株式会社 | 発光装置 |
| USD747817S1 (en) | 2014-03-27 | 2016-01-19 | Nichia Corporation | Light emitting diode |
| JP6252302B2 (ja) | 2014-03-28 | 2017-12-27 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP6432656B2 (ja) * | 2017-08-22 | 2018-12-05 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1977394A (zh) * | 2004-06-29 | 2007-06-06 | 皇家飞利浦电子股份有限公司 | 发光二极管模块 |
| US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
| JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
-
2009
- 2009-04-20 JP JP2009102328A patent/JP5347681B2/ja not_active Expired - Fee Related
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