JP2010251449A - Component mounting system, and inspection signal transmission method in the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting system and an inspection signal transmission method in the same, capable of ensuring correspondence of individual inspection data outputted from an inspection apparatus and a substrate received and passed to a component mounting apparatus even when a substrate distribution apparatus with a simple structure is used. <P>SOLUTION: In a configuration that a substrate distribution apparatus M3 that distributes a substrate passed from an inspection apparatus M2 to a plurality of component mounting lanes is used, a component mounting system properly sets a sequence of signals directly received via a first signal line 38 and second signal lines 41A and 41B, such as an inspection complete signal A, a substrate reception possible signal C, a substrate request signal B, a conveyance possible signal D, or the like. Thereby, the timings of transmission of the individual inspection data from the inspection apparatus M2 to the component mounting parts M4A and M4B and conveyance of the substrate 4 from the inspection apparatus M2 to the component mounting parts M4A and M4B, which are performed via a LAN line 30, are substantially synchronized. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting system for mounting a component on a board and an inspection signal transmission method in the component mounting system for outputting individual inspection data output from an inspection device to a downstream device in the component mounting system.

  In a component mounting system that mounts components on a substrate, a component mounting line is generally configured by connecting a plurality of component mounting apparatuses such as a printing apparatus and a component mounting apparatus. In such a component mounting system, the board sequentially passes through these component mounting apparatuses, and predetermined operations such as solder printing work and component mounting work are sequentially performed in each component mounting apparatus. In recent years, in order to improve the mounting quality, an inspection apparatus has been arranged between the processes on the component mounting line (see Patent Document 1). In the example shown in this patent document, an inspection is performed to detect the positional deviation of the printed solder by imaging the substrate after being printed by the printing apparatus, and the inspection data is fed forward to the downstream component mounting apparatus. Thus, the component mounting position is adjusted according to the solder misalignment state.

Japanese Patent No. 3685035

  By the way, in recent years, equipment having a plurality of board transfer lanes has been introduced for the purpose of improving area productivity in a component mounting line. In other words, when a product with a high mounting density is targeted, it takes time to mount the components, so components are mounted on a plurality of boards simultaneously by a plurality of lanes, thereby increasing the production volume. I have to.

  However, when the above-described feed-forward function for inspection results is introduced into a component mounting line having a plurality of board conveyance lanes, the following inconvenience may occur. That is, in order to pass the substrate after the inspection work is completed by the inspection device to the plurality of substrate transfer lanes, a substrate distribution device that distributes the substrates in a predetermined order is required. As this substrate distribution device, a device having a simple configuration in which the substrate transferred from the upstream side is shifted in the direction orthogonal to the transport direction is used in order to connect the substrate delivered from the upstream side to a plurality of downstream substrate transport rails. In many cases, such a simple board distribution apparatus generally does not have a control function, and the upstream apparatus and the downstream apparatus are simply signal lines for transmitting whether or not to allow transfer of the substrate. It is the structure connected by. For this reason, when such a simple board distribution device is used in a component mounting line having a plurality of substrate transfer lanes, the individual inspection data output from the upstream inspection device and the actual downstream component mounting device are used. There arises a situation in which the correspondence with the delivered substrate is not necessarily guaranteed.

  Accordingly, the present invention provides a component that can guarantee the correspondence between the individual inspection data output from the inspection apparatus and the board delivered to the component mounting apparatus even when a simple board distribution device is used. It is an object of the present invention to provide an inspection signal transmission method in a mounting system and a component mounting system.

  The component mounting system of the present invention is a component mounting system that performs a component mounting operation by distributing a board that has been subjected to a predetermined operation by an upstream working device to a plurality of component mounting devices, and the predetermined operation is performed. An inspection device that receives a substrate, performs inspection on the result of the operation, and outputs individual inspection data indicating the inspection result for each individual substrate in accordance with a substrate receiving order in which the substrate is received from the upstream side, and inspection by the inspection device The board distribution device that receives the board after the process is executed and distributes and distributes the boards to the plurality of component mounting apparatuses according to a predetermined distribution order, and the inspection apparatus and the plurality of component mounting apparatuses are connected to each other. A LAN line is connected to the inspection device and the substrate distribution device, and is provided between the inspection device and the substrate distribution device. A first signal line for mutually transmitting data on whether or not a board is exchanged, and the board distribution device and the plurality of component mounting apparatuses are connected to each other, and the board distribution apparatus and the component mounting are provided. A plurality of second signal lines for mutually transmitting data on whether or not the board can be exchanged with the apparatus, the individual inspection data output from the inspection apparatus and received by the component mounting apparatus, and the board distribution apparatus A correspondence relationship control unit that controls the inspection device and the plurality of component mounting devices, so that a one-to-one correspondence relationship with the board passed to the component mounting device is secured. The relation control unit is configured to transmit the board from the one component mounting apparatus that should receive the board at the time among the plurality of component mounting apparatuses via the second signal line. Substrate request step for sending a substrate request signal to the sorting apparatus, and completion of inspection for transmitting, through the first signal line, that the inspection of the substrate to be delivered at that time is completed from the inspection apparatus to the substrate distribution apparatus Substrate acceptance that communicates via the first signal line that the substrate can be received from the substrate distribution device to the inspection device after the transmission step and the inspection completion transmission step After the transmission step, and after the board request step and the inspection completion transmission step, the board distribution device can transfer a board transfer enable signal indicating that the board can be transferred to the one component mounting apparatus. After the signal transmission step and the transportable signal transmission step, the one component mounting apparatus passes through the LAN line. After the inspection data requesting step for requesting the individual inspection data for the board to the inspection device, and after the substrate acceptable transmission step and the inspection data requesting step, the inspection device sends the one component mounting device via the LAN line. After the inspection data transmission step for transmitting individual inspection data for the substrate, the substrate acceptance transmission step, and the inspection data request step, the substrate is transferred from the inspection device to the one component mounting device via the substrate distribution device. Among the transport operation execution step for performing the transport operation for performing the inspection data transmission step and the transport operation execution step, the subsequent step is completed within a predetermined time after completion of the preceding step completed previously. If confirmed, correspondence between the board and the individual inspection data A mounting operation execution step of engaging is to be determined that the correct starting component mounting operation by the one component mounting apparatus, the inspection apparatus to execute the substrate sorter and the plurality of component mounting apparatus.

An inspection signal transmission method in a component mounting system according to the present invention receives a substrate on which a predetermined operation has been performed, performs inspection on the result of the operation, and outputs individual inspection data indicating the inspection result for each individual substrate upstream of the substrate. An inspection apparatus that outputs in accordance with the board receiving order received from the side, and a board distribution apparatus that receives the board after the inspection is executed by the inspection apparatus, and distributes and distributes the board to a plurality of component mounting apparatuses according to a predetermined distribution order A LAN line that interconnects the inspection apparatus and the plurality of component mounting apparatuses, and the inspection apparatus and the board distribution apparatus, which are connected to each other, between the inspection apparatus and the board distribution apparatus. A first signal line for mutually transmitting data on whether or not the board can be exchanged, the board distributing apparatus, and the plurality of component mounting apparatuses; A plurality of second signal lines that are connected to each other and transmit data on whether or not the board can be exchanged between the board distribution apparatus and the component mounting apparatus, and are output from the inspection apparatus. In order to ensure a one-to-one correspondence between the individual inspection data received by the component mounting apparatus and the board passed to the component mounting apparatus via the board distribution apparatus, the inspection apparatus and the In a component mounting system that includes a correspondence control unit that controls a plurality of component mounting apparatuses, and distributes a board on which a predetermined operation has been performed by an upstream working device to the plurality of component mounting apparatuses to perform a component mounting operation. An inspection signal transmission method in a component mounting system for transmitting the individual inspection data from the inspection device to the plurality of component mounting devices, A board requesting step of sending a board request signal to the board distribution apparatus via the second signal line from one component mounting apparatus that should receive the board at that time among several component mounting apparatuses; and the inspection apparatus An inspection completion transmission step for transmitting through the first signal line that the inspection of the substrate to be delivered at that time is completed to the substrate distribution device from the substrate distribution device, and the inspection from the substrate distribution device after the inspection completion transmission step. Substrate acceptable transmission step for transmitting to the apparatus that the substrate after the completion of the inspection can be received via the first signal line, and the substrate distribution after the substrate request step and the inspection completion transmission step A board transfer enable signal indicating that the board can be transferred from the apparatus to the one component mounting apparatus. A transferable signal transmission step for transmitting a signal, and an inspection data requesting step for requesting individual inspection data for the board from the one component mounting device to the inspection device via the LAN line after the transferable signal transmission step, An inspection data transmission step for transmitting individual inspection data for the board from the inspection device to the one component mounting apparatus via the LAN line after the substrate acceptance transmission step and the inspection data request step, and the substrate acceptance transmission After the step and the inspection data request step, a transfer operation execution step for executing a transfer operation for transferring the board from the inspection apparatus to the one component mounting apparatus via the board distribution apparatus, the inspection data transmission step, and the The preceding step completed first in the transfer operation execution step. If the completion of the subsequent step is confirmed within a predetermined time after completion of the step, it is determined that the correspondence between the board and the individual inspection data is correct, and the component mounting operation by the one component mounting apparatus The inspection apparatus, the board distribution apparatus, and the plurality of component mounting apparatuses are caused to execute a mounting operation execution step for starting the operation.

  According to the present invention, a one-to-one correspondence between the individual inspection data output from the inspection apparatus and received by the component mounting apparatus and the board passed to the component mounting apparatus via the board distribution apparatus is ensured. And a correspondence control unit that controls the inspection device and the plurality of component mounting devices, and the correspondence control unit distributes the substrate from one component mounting device that should receive the substrate at that time among the plurality of component mounting devices. A substrate request step for sending a substrate request signal to the apparatus, an inspection completion transmission step for transmitting that the inspection of the substrate to be delivered at the time is completed from the inspection apparatus to the substrate distribution apparatus, and a substrate distribution apparatus after the inspection completion transmission step A substrate acceptable transmission step for communicating to the inspection device that it is possible to accept the substrate after completion of the inspection; After the board request step and the inspection completion transmission step, the board distribution apparatus transmits a board transportable signal indicating that the board can be transported to one component mounting apparatus, and a transportable signal transmission step. After the signal transmission step, an inspection data request step for requesting individual inspection data for the board from the one component mounting apparatus to the inspection apparatus via the LAN line, and after the board accepting transmission step and the inspection data request step, the LAN from the inspection apparatus After the inspection data transmission step for transmitting the individual inspection data for the board to one component mounting apparatus via the line, the board accepting transmission step, and the inspection data requesting step, the board is transferred from the inspection apparatus to the board distribution device. Carrying transport operation to transport to a single component mounting device If the completion of the subsequent step is confirmed within a predetermined time after completion of the preceding step completed earlier among the transfer operation execution step, the inspection data transmission step, and the transfer operation execution step, By making the inspection device, the board distribution device, and the plurality of component mounting devices execute the mounting operation execution step for determining that the correspondence relationship of the individual inspection data is correct and starting the component mounting operation by one component mounting device, it is easy. Even in the case of using a board distribution apparatus having a different configuration, it is possible to guarantee the correspondence between the individual inspection data output from the inspection apparatus and the board delivered to the component mounting apparatus.

The block diagram of the component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting system of one embodiment of this invention Flow chart of inspection signal transmission processing in component mounting system of one embodiment of the present invention The chart figure of the inspection signal transmission processing in the component mounting system of one embodiment of the present invention

  First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting an electronic component on a substrate to manufacture a mounting substrate, and is configured by connecting a plurality of electronic component mounting devices in series. Here, component mounting apparatuses M4 and M5 each having a plurality of (two in this case) component mounting lanes are connected in series downstream of the serially connected printing apparatus M1, inspection apparatus M2, and substrate sorting apparatus M3. It has become the composition.

  Hereinafter, the configuration of each apparatus will be described. The printing apparatus M1 has a function of printing a solder paste for joining electronic components on a substrate to be mounted. A substrate transport mechanism 3 that transports the substrate 4 to be mounted in the substrate transport direction on the upper surface of the base 2 and A substrate positioning unit 5 that positions and holds the conveyed substrate 4 is disposed. A mask plate 15 extended on the mask frame 14 is disposed above the substrate positioning unit 5, and a squeegee unit 13 held by the moving beam 12 is disposed above the mask plate 15 by the Y-axis table 11. A printing mechanism 34 (see FIG. 2) configured to be driven horizontally is disposed.

  The upper surface of the mask plate 15 supplied from the upstream side (arrow a) and brought into contact with the lower surface of the mask plate 15 by the substrate positioning portion 5 and driving the Y-axis table 11 to supply the solder paste. By sliding the squeegee unit 13, the solder paste is printed on the substrate 4 through the pattern holes provided in the mask plate 15. That is, the printing apparatus M1 that is an upstream working apparatus performs a solder paste printing operation that is a predetermined work on the substrate 4.

  The inspection apparatus M2 has a function of receiving the substrate 4 after the printing operation is executed by the printing apparatus M1 and performing a print inspection. On the upper surface of the base 2 of the inspection device M2, a substrate transport mechanism 3 and a substrate positioning unit 6 connected to the printing device M1 are disposed. Further, an inspection unit 17 that is horizontally moved by a camera moving mechanism including a Y-axis table 11 and a moving beam 16 is disposed above the substrate positioning unit 6. By driving the camera moving mechanism, the inspection unit 17 moves in the horizontal direction above the substrate 4 and images an arbitrary position of the substrate 4. A print inspection is executed by performing a recognition process on the imaging result by a recognition processing unit (not shown). In this print inspection, solder misalignment data indicating the misalignment state of the solder paste from the normal position on the board is generated for each individual board 4 along with the determination result of the print quality.

The solder position deviation data is output to the downstream component mounting apparatuses M4 and M5 in accordance with the board receiving order in which the boards are received from the upstream side. In the component mounting apparatuses M4 and M5, the component mounting position when the electronic component is mounted on the board is corrected based on the solder position deviation data. The Y-axis table 11, the camera moving mechanism including the moving beam 12, the inspection unit 17, and the recognition processing unit (not shown) include an inspection processing unit 37 (see FIG. 2) that performs a print inspection on the substrate 4 after the printing operation. Constitute. That is, the inspection apparatus M2 receives the substrate 4 on which the printing operation, which is a predetermined operation, has been performed by the printing apparatus M1, performs inspection on the result of the printing operation, and displays individual inspection data indicating the inspection result for each individual substrate. 4 is output in accordance with the substrate receiving order received from the upstream side.

  The substrate distribution device M3 disposed downstream of the inspection device M2 is provided with a distribution conveyor 18 provided with a conveyor mechanism that conveys the substrate 4 in the substrate conveyance direction on the upper surface of the base 2, and the distribution conveyor 18 is a conveyor. It can be freely shifted (arrow b) in the Y direction orthogonal to the substrate transport direction by a moving mechanism (not shown). The distribution conveyor 18 and the conveyor moving mechanism are board distribution mechanisms 40 (see FIG. 2) that distribute the board 4 received from the upstream side to two component mounting lanes LA and LB provided in the component mounting apparatuses M4 and M5 described below. ).

  The component mounting devices M4 and M5 downstream of the substrate distribution device M3 are component mounting units M4A, which are component mounting devices that can be individually operated on the two substrate transport mechanisms 19A and 19B arranged in the X direction. M4B, M5A, and M5B are provided. The substrate transport mechanism 19A and the component mounting portions M4A and M5A have one component mounting lane LA, and the substrate transport mechanism 19B and the component mounting portions M4B and M5B have one similarly. One component mounting lane LB is configured. Here, the operation order of the substrate distribution mechanism 40 is set so that the substrates 4 are alternately transferred to the downstream substrate transport mechanisms 19A and 19B in accordance with a predetermined order. That is, the board distribution apparatus M3 receives the board 4 after the inspection is performed by the inspection apparatus M2, and distributes a preset distribution to a plurality of (two in this case) component mounting apparatuses (component mounting units M4A and M4B). It has the function of sorting and delivering according to the order.

  Next, the configuration of the component mounting apparatuses M4 and M5 will be described. The component mounting apparatuses M4 and M5 have the same configuration. Here, only the component mounting apparatus M4 will be described with reference numerals attached to the respective components. In the center of the base 20, two pairs of substrate transport mechanisms 19A and 19B are arranged in parallel to the substrate transport direction (X direction). The board transport mechanisms 19A and 19B transport the board 4 passed from the inspection apparatus M2 via the board sorter M3, and position the board 4 on a mounting stage for performing a component mounting work by a component mounting mechanism described below.

  Component supply units 23A and 23B are provided outside the board conveyance mechanisms 19A and 19B, respectively, and a plurality of tape feeders 24 are arranged in parallel in the component supply units 23A and 23B. The tape feeder 24 feeds an electronic component to a component pickup position by a component mounting mechanism by pitch-feeding a carrier tape holding the electronic component mounted on the substrate 4. A Y-axis movement table 21 is disposed at the end of the base 20 on the X direction side. The two X-axis movement tables 22A and 22B coupled to the Y-axis movement table 21 are respectively mounted with a mounting head 25A. , 25B. The mounting heads 25A and 25B include a plurality of unit mounting heads, and hold electronic components by vacuum suction using suction nozzles mounted on the unit mounting heads.

  By driving the Y-axis movement table 21 and the X-axis movement tables 22A and 22B, the mounting heads 25A and 25B move horizontally in the X direction and the Y direction. As a result, the mounting heads 25A and 25B suck and take out the electronic components from the tape feeders 24 of the component supply units 23A and 23B, respectively, and transfer and mount them on the substrate 5 positioned on the mounting stage of the substrate transport mechanisms 19A and 19B. Component recognition cameras 26A and 26B are provided on the movement paths of the mounting heads 25A and 25B, and the mounting heads 25A and 25B holding electronic components move above the component recognition cameras 26A and 26B, thereby The recognition cameras 26A and 26B capture and recognize the electronic components held by the mounting heads 25A and 25B from below. That is, the component mounting system 1 having the above-described configuration distributes a board on which a predetermined operation, that is, a printing operation has been performed by the printing device M1 that is an upstream working device, to component mounting units M4A and M4B that are a plurality of component mounting devices. The component mounting work is performed.

  Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. In FIG. 2, two component mounting portions M4A and M4B of a printing apparatus M1, an inspection apparatus M2, and a component mounting apparatus M4 are connected to each other via a LAN line 30. Further, the LAN line 30 is connected to a management computer 31. It is connected. The two component mounting units M5A and M5B of the component mounting apparatus M5 are also connected to the LAN line 30 in the same manner, but are not shown in FIG. 2, and in the following description, the component mounting units M4A and M4B are omitted. Describe only. That is, the LAN line 30 is configured to mutually connect the inspection device M2 and the component mounting units M4A and M4B, which are a plurality of component mounting devices.

  The management computer 31 includes a correspondence relationship control unit 31a. As described below, the correspondence relationship control unit 31a outputs an inspection result from the inspection device M2 and is output from the inspection device M2, and the component mounting units M4A and M4B. The inspection device M2 and the component mounting unit M4A are ensured so as to ensure a one-to-one correspondence between the individual inspection data received by the circuit board 4 and the substrate 4 passed to the component mounting units M4A and M4B via the substrate distribution device M3. , M4B is controlled.

  The printing apparatus M1 includes a communication unit 32 and a control unit 33. The communication unit 32 exchanges signals with the management computer 31 and other devices via the LAN line 30. The control unit 33 controls the printing mechanism 34 described above based on the control signal received via the communication unit 32. The inspection apparatus M2 includes a communication unit 35 and a control unit 36. The communication unit 35 exchanges signals with the management computer 31 and other devices via the LAN line 30, and will be described below. Data about whether or not the substrate 4 can be exchanged is transmitted to and from the communication unit 39 via one signal line 38. The control unit 36 controls the above-described inspection processing unit 37 based on a control signal received via the communication unit 35.

  The substrate distribution device M3 includes a communication unit 39 and a substrate distribution mechanism 40. Here, since the substrate sorting apparatus M3 adopts a low-cost and simple configuration, it does not have a dedicated control function, and the signal received via the communication unit 39 according to a preset operation sequence. Only responding actions are performed. Then, based on a signal indicating the state of the substrate distribution mechanism 40 such as a sensor for detecting the position of the distribution conveyor 18 in the substrate distribution mechanism 40 and a detection result of the sensor for detecting the substrate in the distribution conveyor 18, the substrate transfer of the inspection apparatus M 2 is performed. A signal indicating that the board 4 can be received from the mechanism 3 (board-acceptable signal) and a state in which the board 4 can be carried out to any of the component mounting portions M4A and M4B. A signal indicating that this is possible (a signal that can be carried out) is output.

  The component mounting units M4A and M4B include a communication unit 42A, a control unit 43A, a mounting mechanism 44A, a communication unit 42B, a control unit 43B, and a mounting mechanism 44B, respectively. The communication units 42A and 42B exchange signals with other devices and the management computer 31 via the LAN line 30 and communicate with the communication unit 39 via second signal lines 41A and 41B described below. Data on whether or not the substrate 4 can be exchanged is transmitted to each other. The control unit 43A and the control unit 43B control the operation of the mounting mechanisms 44A and 44B according to the control signal received via the communication units 42A and 42B.

  In the above configuration, the first signal line 38 is provided by connecting the inspection device M2 and the substrate distribution device M3, and exchanges data about whether or not the substrate 4 is exchanged between the inspection device M2 and the substrate distribution device M3. It has a function to transmit to. The second signal lines 41A and 41B are provided by connecting the substrate distribution device M3 and each of the component mounting units M4A and M4B, which are a plurality of component mounting devices, and the substrate distribution device and the component mounting device. It has a function of mutually transmitting data on whether or not substrates can be exchanged between the two.

  Next, referring to FIGS. 3 and 4, in the component mounting system 1 having the above-described configuration, the individual inspection showing the result of the print inspection for each board from the inspection apparatus M2 to a plurality of downstream component mounting portions M4A and M4B. An inspection signal transmission method in the component mounting system for transmitting data will be described.

  Here, the board distribution operation is performed in which the printing apparatus M1 performs the printing operation and the substrate distribution apparatus M3 distributes the board 4 after the printing state inspection is performed to one of the component mounting lanes LA and LB. Accordingly, a process for associating the individual inspection data with each substrate 4 is shown. Note that the board distribution operation shown here is based on the premise that the board 4 is always transferred alternately from the inspection apparatus M2 to the component mounting portions M4A and M4B.

  In FIG. 3, first, out of one of the component mounting units M4A and M4B, one of the component mounting apparatuses in the order in which the substrate 4 should be received at the time of the board distribution, that is, the component mounting units M4A and M4B, the second A substrate request signal (substrate request signal B shown in FIG. 4) is sent to the substrate distribution device M3 via either of the signal lines 41A and 41B (substrate request step) (ST1). Before and after this, the fact that the inspection of the substrate 4 to be delivered at that time from the inspection device M2 to the substrate distribution device M3 has been completed (inspection completion signal A shown in FIG. 4) is made via the first signal line 38. Transmit (inspection completion transmission step) (ST2). Note that (ST1) and (ST2) may be preceded by the operation state at that time.

  Next, the substrate sorting apparatus M3 to which the inspection completion signal is transmitted in (ST2), if the state of the substrate sorting mechanism 40 becomes a state in which a new substrate 4 can be received from the upstream side, that is, When the substrate distribution operation being executed at the time is completed and the distribution conveyor 18 returns to the upstream substrate receiving position, which is the original position, the inspection apparatus M2 receives the substrate 4 after completion of the inspection. (Substrate acceptable signal C shown in FIG. 4) is transmitted via the first signal line 38 (Substrate acceptable transmission step) (ST3).

  After the board request step (ST1) and the inspection completion transmission step (ST2), that is, after it is confirmed that the board can be exchanged in both the inspection apparatus M2 and the downstream component mounting apparatus. Then, a status indicating that the board 4 can be transported (a transportable signal D shown in FIG. 4) is transmitted to the one component mounting portion in the order in which the board 4 should be received from the board distribution device M3 (transportable). Signal transmission step) (ST4).

  Next, after the transportable signal transmission step (ST4), as indicated by an arrow c in FIG. 4, an individual inspection of the board 4 is performed from one component mounting unit that should receive the board to the inspection apparatus M2 via the LAN line 30. Data is requested (inspection data requesting step) (ST5). Next, after the board acceptable transmission step (ST3) and the inspection data requesting step (ST5), as shown by an arrow d in FIG. 4, the order in which the boards 4 should be received from the inspection apparatus M2 via the LAN line 30 is shown. The individual inspection data for the board 4 is transmitted to the component mounting part (inspection data transmission step) (ST6).

  Then, after the substrate acceptance transmission step (ST3) and the inspection data request step (ST5), the substrate 4 is transferred from the inspection apparatus M2 to the one component mounting portion in the order in which the substrate 4 should be received via the substrate distribution device M3. The transfer operation is executed (transfer operation execution step) (ST7). That is, as shown in FIG. 4, first, the substrate 4 is carried from the inspection device M2 to the substrate distribution device M3 (arrow e), and then necessary substrate distribution operation in the substrate distribution device M3 is executed (arrow f). The board 4 is transferred from the board distribution device M3 to the corresponding component mounting portion of the component mounting apparatus M4 (arrow g).

  The transfer operation execution step (ST7) and the inspection data transmission step (ST6) may be somewhat before and after, but within a predetermined time (for example, about 30 seconds), Completion of all the transfer operation execution steps is a condition for determining that the correspondence between the substrate 4 and the individual inspection data is correct. That is, it is monitored whether or not the subsequent step is completed within a predetermined time after completion of the preceding step completed first among the inspection data transmission step and the conveyance operation execution step (ST8). Since the completion of the inspection data transmission step usually precedes, it is monitored whether or not the conveyance operation execution step is completed within a predetermined time after completion of the inspection data transmission step.

  Here, if the completion of the subsequent step is confirmed before the predetermined time elapses from the preceding step, it is determined that the correspondence between the board 4 and the individual inspection data is correct, and the component mounting by the component mounting unit is performed. The work is started (mounting work execution step) (ST9). On the other hand, if the completion of the subsequent step is not confirmed before the predetermined time elapses from the preceding step, an error notification is made (ST10). For example, if the substrate transport is not completed even after a predetermined time has elapsed after completion of the inspection data transmission step, a substrate transport error is notified. In addition, if reception of inspection data cannot be confirmed after a predetermined time has elapsed after completion of the substrate transfer step, an inspection data transmission error is notified.

  Each processing step described above is executed by the correspondence control unit 31a of the management computer 31 controlling the inspection device M2 and the plurality of component mounting units M4A and M4B, and is thereby output from the inspection device M2 and the component mounting unit M4A. A one-to-one correspondence between the individual inspection data received by M4B and the board 4 passed to the component mounting units M4A and M4B via the board sorting apparatus M3 is ensured. In the above-described embodiment, the correspondence relationship control unit 31a is positioned as a function of the management computer 31 independent of each device constituting the component mounting system 1, but any one of the functions of the correspondence relationship control unit 31a is provided. And may be configured to function as the above-described correspondence control unit 31a.

  As described above, the inspection signal transmission method in the electronic component mounting system shown in the present embodiment is a distribution conveyor for distributing the substrate 4 delivered from the upstream side to the plurality of component mounting lanes LA and LB on the downstream side. In a configuration using a substrate sorting apparatus M3 that does not have a control function in a simple configuration of a method that shifts in a direction orthogonal to the transport direction, an inspection completion signal, a substrate acceptable signal, a substrate request signal, a transportable signal, etc. Signals directly exchanged via the first signal line 338 connecting the inspection apparatus M2 and the board distribution apparatus M3 and the second signal lines 41A and 41B connecting the board distribution apparatus M3 and the component mounting portions M4A and M4B. By appropriately setting the sequence, the inspection apparatus M2 performed via the LAN line 30 is connected to the component mounting units M4A and M4B. The transmission of another inspection data, and component mounting unit M4A from the inspection apparatus M2, the timing of the transfer of the substrate 4 to M4B and so as to substantially synchronized. As a result, even when a board distribution apparatus having a simple configuration is used, it is possible to guarantee the correspondence between the individual inspection data output from the inspection apparatus and the board delivered to the component mounting apparatus.

  The component mounting system and the inspection signal transmission method in the component mounting system of the present invention are handed over to the individual inspection data output from the inspection device and the component mounting device even when a board distribution device having a simple configuration is used. This has the effect of ensuring the correspondence with the substrate, and is useful in the field of manufacturing a mounting substrate by mounting components such as electronic components on the substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting system 3 Board | substrate conveyance mechanism 4 Board | substrate 18 Distribution conveyor 19A, 19B Board conveyance mechanism 30 LAN line 38 1st signal line 41A, 41B 2nd signal line M1 Printing apparatus M2 Inspection apparatus M3 Board distribution apparatus M4, M5 Parts Mounting device M4A, M4B Component mounting part (component mounting device)

Claims (2)

A component mounting system that performs a component mounting operation by distributing a board that has been subjected to a predetermined operation by an upstream working device to a plurality of component mounting devices,
An inspection apparatus that receives a substrate on which the predetermined operation has been performed, performs inspection on the result of the operation, and outputs individual inspection data indicating the inspection result for each individual substrate in accordance with a substrate receiving order in which the substrate is received from the upstream side. And a board distribution device that receives the board after the inspection is performed by the inspection apparatus, and distributes and distributes the plurality of component mounting apparatuses according to a predetermined distribution order;
A LAN line that interconnects the inspection device and the plurality of component mounting devices, and a substrate between the inspection device and the substrate distribution device, provided by connecting the inspection device and the substrate distribution device. A first signal line for transmitting / receiving data on whether or not to accept / receive data to each other, and the substrate distribution device and each of the plurality of component mounting devices are connected to each other, and the substrate distribution device and the component mounting device A plurality of second signal lines for mutually transmitting data on whether or not the board can be exchanged with each other,
A one-to-one correspondence between the individual inspection data output from the inspection apparatus and received by the component mounting apparatus and the board passed to the component mounting apparatus via the board distribution apparatus is ensured. A correspondence control unit for controlling the inspection device and the plurality of component mounting devices;
The correspondence control unit sends a substrate request signal to the substrate distribution device via the second signal line from one of the plurality of component mounting devices that should receive the substrate at that time. A substrate request step, an inspection completion transmission step for transmitting through the first signal line that the inspection of the substrate to be delivered at that time from the inspection device to the substrate distribution device is completed, and the inspection completion transmission step Substrate receivable transmission step of transmitting via the first signal line that the substrate after the inspection can be received from the substrate distribution device to the inspection device, and the substrate requesting step; A statuser capable of transporting the board from the board sorting apparatus to the one component mounting apparatus after the inspection completion transmission step. A transferable signal transmission step for transmitting a signal indicating that the board can be transferred, and after the transferable signal transmission step, individual inspection data for the board is sent from the one component mounting apparatus to the inspection apparatus via the LAN line. Requesting inspection data request step, and inspection data transmission for transmitting individual inspection data for the board from the inspection device to the one component mounting apparatus via the LAN line after the board acceptable transmission step and the inspection data request step A transfer operation executing step for executing a transfer operation for transferring the substrate from the inspection apparatus to the one component mounting apparatus via the substrate distribution apparatus after the substrate acceptable transfer step and the inspection data request step; The inspection data transmission step and the transfer operation execution step. If the completion of the succeeding step is confirmed within a predetermined time after the completion of the preceding step completed earlier, it is determined that the correspondence between the substrate and the individual inspection data is correct, and A component mounting system that causes the inspection device, the board distribution device, and the plurality of component mounting devices to execute a mounting operation execution step of starting a component mounting operation by the component mounting device. An inspection apparatus that receives a substrate on which a predetermined operation has been performed, inspects the result of the operation, and outputs individual inspection data indicating the inspection result for each individual substrate in accordance with the substrate reception order received from the upstream side; A board distribution device that receives the board after the inspection is performed by the inspection apparatus, and distributes the substrates according to a predetermined distribution order to a plurality of component mounting apparatuses, the inspection apparatus, and the plurality of component mounting apparatuses. Are connected to each other, and the inspection device and the substrate distribution device are connected to each other, and data on whether or not the substrate can be exchanged between the inspection device and the substrate distribution device is mutually transmitted. A first signal line; and the substrate distribution device, wherein the substrate distribution device is connected to each of the plurality of component mounting devices. A plurality of second signal lines for mutually transmitting data on whether or not the board can be exchanged with the component mounting apparatus; the individual inspection data output from the inspection apparatus and received by the component mounting apparatus; A correspondence control unit that controls the inspection device and the plurality of component mounting devices so as to ensure a one-to-one correspondence relationship with the substrate delivered to the component mounting device via the substrate distribution device; A component mounting system for performing a component mounting operation by distributing a board, on which a predetermined operation has been performed by an upstream working device, to the plurality of component mounting devices, from the inspection device to the plurality of component mounting devices. An inspection signal transmission method in a component mounting system for transmitting inspection data,
A board requesting step of sending a board request signal to the board distribution apparatus via the second signal line from one component mounting apparatus that should receive the board at that time among the plurality of component mounting apparatuses; An inspection completion transmission step for transmitting, through the first signal line, that the inspection of the substrate to be delivered at that time is completed from the apparatus to the substrate distribution apparatus; and after the inspection completion transmission step, from the substrate distribution apparatus to the substrate distribution apparatus Substrate acceptable transmission step for transmitting to the inspection apparatus via the first signal line that it is possible to accept the substrate after completion of the inspection, and the substrate after the substrate request step and the inspection completion transmission step. The board can be conveyed from the sorting device to the one component mounting apparatus indicating that the board can be conveyed. A transportable signal transmitting step for transmitting a signal, and an inspection data requesting step for requesting individual inspection data for the board from the one component mounting apparatus to the inspection apparatus via the LAN line after the transportable signal transmitting step; An inspection data transmission step of transmitting individual inspection data for the substrate from the inspection device to the one component mounting apparatus via the LAN line after the substrate acceptable transmission step and the inspection data request step; and the substrate acceptance A transfer operation execution step for executing a transfer operation for transferring the board from the inspection apparatus to the one component mounting apparatus via the board distribution apparatus after the transmission step and the inspection data request step; and the inspection data transmission step; Completed earlier in the transfer operation execution step If completion of the subsequent step is confirmed within a predetermined time after completion of the row step, it is determined that the correspondence between the board and the individual inspection data is correct, and the component mounting operation by the one component mounting apparatus The inspection signal transmission method in the component mounting system, wherein the inspection device, the board distribution device, and the plurality of component mounting devices are caused to execute a mounting operation execution step of starting the operation.

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