JP2010243732A - Optical module and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module using a package less in production cost, without having to assemble a package made of a number of components. <P>SOLUTION: The optical module 10 has at least a package 1, and a section 2 to fix an unitized optical wave guide 3 on a surface 1a of this package. This section has a hole 20 made through a surface, and the optical wave guide is inserted into this hole and fixed. At this section, the hole is made of two specific inner surfaces 21a, 22a facing each other, and the optical wave guide is sandwiched between them and is fixed with the adhesive 5 filled therein. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical module used in optical communication, optical transmission technology, and optical information recording technology, and more particularly, to a package structure that reduces the cost of an optical module and a manufacturing method thereof.

  Until now, optical modules have been mainly used for medium and long-distance optical communication applications called metro and backbone systems. However, in recent years, with the spread of FTTH (Fiber To The Home) and the like, optical communication has been carried out between a base station and a general household. In addition, the capacity of data transmission in devices is increasing, and in the future, wiring between boards and racks of high-speed routers in supercomputers, wiring in devices such as personal computers (PCs), internals of notebook PCs and mobile phones, etc. Optical wiring is expected to be used as the wiring.

  Along with this, low-cost optical modules have been developed for the purpose of reducing the financial burden on users. For example, an optical module has been developed in which an optical waveguide whose surface is metallized is inserted into a cylindrical optical waveguide fixing portion of a package and fixed by soldering. In such an optical module, the cost is reduced by not using a ferrule or a receptacle for the optical waveguide fixing portion.

  Specifically, as shown in FIG. 9, an optical module having a package composed of a case 101 and a cylindrical optical waveguide fixing portion 104 has been proposed (see Patent Document 1). In this optical module, the surface of the optical waveguide 103 is partially metallized, and the metallized portion 103a of the optical waveguide 103 is fixed to the cylindrical optical waveguide fixing portion 104 by solder injected from the solder injection port 104a. .

  Further, as shown in FIG. 10, an optical module is proposed in which a package is composed of case portions 112, 113, 114 made of a plurality of plate members and a cylindrical optical waveguide fixing portion 115 (see Patent Document 2). . In this optical module, a part of the surface of the optical waveguide 121 is metallized, and the metallized surface 125 and the inner surface of the cylindrical optical waveguide fixing portion 115 are fixed by solder 124.

However, the conventional optical modules described in Patent Document 1 and Patent Document 2 have the following two problems.
The first problem is that the manufacturing cost of the package is high because the package is composed of a plurality of members.
Secondly, when soldering the optical waveguide to the package, it is necessary to apply the solder onto the optical waveguide. Therefore, there is a problem that the optical waveguide is easily displaced from the alignment position and the manufacturing yield is poor.

  In particular, in the optical module described in Patent Document 1, since the case 101 and the cylindrical optical waveguide fixing portion 104 constituting the package are individually manufactured and then integrated by welding, the manufacturing cost of the package There was a problem of high. Further, when the optical waveguide 103 is fixed to the cylindrical optical waveguide fixing portion 104, it is necessary to supply solder from the solder injection port 104a of the cylindrical optical waveguide fixing portion 104 and apply it to the surface of the optical waveguide 103. In addition, there is a problem that the optical waveguide 103 is easily displaced from the alignment position due to the weight of the applied solder, and the manufacturing yield is poor.

  Moreover, in the optical module described in Patent Document 2, since the package is configured by integrating a plurality of plate members 112, 113, 114 and the cylindrical optical waveguide fixing portion 115 by welding, the package is manufactured. There was a problem of high cost. Further, when the optical waveguide 121 is fixed to the optical waveguide insertion hole of the package, it is necessary to supply the solder 124 while heating the metallized portion 125 of the optical waveguide 121 with a soldering iron. There is a problem that the optical waveguide 121 is displaced from the alignment position in contact with the optical waveguide 121, and the manufacturing yield is poor.

JP-A-2005-165200 JP 7-191238 A

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical module using a package that does not require assembly of a package from a plurality of members and that has a reduced manufacturing cost.
It is another object of the present invention to provide a method for manufacturing an optical module with a high yield without causing the optical waveguide to deviate from the alignment position.

  According to a first aspect of the present invention, there is provided an optical module including a package containing a semiconductor element, a single piece of the package, a hole portion extending in a direction penetrating the one surface, and a light guide in the hole portion. A portion for inserting the waveguide and fixing the optical waveguide, and at least two specific surfaces forming the inner surface of the portion constitute the hole portion and are arranged opposite to each other, The optical waveguide is fixed between the two surfaces by a bonding material.

  An optical module according to a second aspect of the present invention is the optical module according to the first aspect, wherein the two surfaces are arranged so that the two surfaces protrude in an external direction and / or an internal direction of the package. .

  An optical module according to a third aspect of the present invention is characterized in that, in the optical module according to the first or second aspect, the two surfaces are provided with a gap that causes capillary action on the bonding material.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing an optical module, comprising: a package including a semiconductor element; and a single piece of the package, the hole being provided in a direction penetrating the one surface. At least a portion for inserting the optical waveguide into the portion and fixing the optical waveguide, and two specific surfaces forming the inner surface of the portion constitute the hole portion and are arranged opposite to each other A method of manufacturing an optical module in which the optical waveguide is fixed between the two surfaces by a bonding material, the step A of inserting the optical waveguide into the hole, and the capillary phenomenon between the two surfaces. It is characterized by comprising at least a step B of filling a bonding material and a step C of curing the bonding material after the bonding material has permeated between the hole and the optical waveguide.

According to the optical module of the present invention, the part for fixing the optical waveguide is integrated and arranged on one surface of the package containing the semiconductor element, and the optical waveguide is bonded between the two specific surfaces forming the inner surface. It is fixed by. Therefore, a part for fixing the optical waveguide is manufactured separately from the package, and after that, there is no need to integrate this part into the package, and a specific part forming the inner surface of the part arranged integrally on one side of the package. On the two sides, the optical waveguide can be fixed by a bonding material.
Therefore, it is not necessary to assemble a package from a plurality of members, and an optical module using a package that reduces manufacturing costs can be provided.

According to the method of manufacturing an optical module of the present invention, the optical waveguide is inserted into a hole having a direction penetrating one surface of the package containing the semiconductor element, and the inner surface of the portion for fixing the optical waveguide is formed. The bonding material is filled between the two surfaces by capillary action, and the bonding material is cured after the bonding material penetrates between the hole and the optical waveguide. Therefore, it is not necessary to apply the bonding material directly onto the optical waveguide, and the risk of shifting the optical waveguide from the alignment position when applying the bonding material can be eliminated.
Therefore, it is possible to provide a method for manufacturing an optical module with a high yield without causing the optical waveguide to deviate from the alignment position.

The figure which shows one Embodiment of the optical module which concerns on this invention. The figure which shows the example of a shape of the site | part which comprises the optical module which concerns on this invention. The figure which shows the example of a shape of the hole which comprises the optical module which concerns on this invention. The figure which shows the example of a shape of 2 surfaces (the inner surface of a 1st site | part piece, and the inner surface of a 2nd site | part piece) which comprise the optical module which concerns on this invention. The figure explaining the manufacturing method of the optical module which concerns on this invention. The figure which shows the optical module of Example 1 which concerns on this invention. The figure which shows the optical module of Example 2 which concerns on this invention. The figure which shows the optical module of Example 3 which concerns on this invention. The figure which shows the conventional 1st optical module. The figure which shows the conventional 2nd optical module.

Hereinafter, an optical module embodying the present invention and a manufacturing method thereof will be described with reference to the drawings.
1A and 1B are diagrams showing an embodiment of an optical module according to the present invention. FIG. 1A is a front view of the optical module, and FIG. 1B is an AA line shown in FIG. FIG. 1C shows a cross-sectional view taken along the line BB shown in FIG. 1A.
As shown in FIG. 1, the optical module 10 according to the present invention includes at least a package 1 and a portion 2 for fixing the optical waveguide 3, which is integrated and arranged on one surface 1 a of the package 1.

The package 1 is mounted on a substrate 4 and includes a semiconductor element 6 and an electronic component 7 mounted on the substrate 4.
Examples of the material of the package 1 include various resins and metals, alumina ceramics, aluminum nitride, and the like.

As the substrate 4, for example, a ceramic substrate or a resin substrate can be used.
The semiconductor element 6 is an optical element that converts an electrical signal into an optical signal and transmits it, or receives an optical signal and converts it into an electrical signal. For example, a laser diode or the like is used at the light incident side end to the optical waveguide 3. A light receiving element such as a photodiode is used at a light emitting element and a light emitting side end from the optical waveguide 3.
The electronic component 7 can be, for example, an integrated circuit (IC) for driving a light emitting element and / or amplifying a light receiving element.

The site | part 2 has the hole 20 in the direction which penetrates the one surface 1a, The optical waveguide 3 is inserted in this hole 20, and the optical waveguide 3 is fixed. Further, in this portion 2, specific two surfaces 21a and 22a forming the inner surface constitute a hole portion 20 and are arranged opposite to each other, and an optical waveguide sandwiched between the two surfaces 21a and 22a. 3 is fixed by the bonding material 5 filling the space between the two surfaces 21a and 22a.
In FIG. 1, the part 2 is shown as having a first part piece 21 and a second part piece 22 which are perpendicular to the surface 1a and face each other, and the inner surfaces thereof constitute two faces 21a and 22a. ing.

Further, the part 2 has a function of sucking and holding the bonding material 5 between the two surfaces 21a and 22a by capillary action. When the bonding material 5 is sucked and filled between the two surfaces 21a and 22a, the height h [m] of the sucked bonding material 5 is the surface tension σ [N / m] and the density of the bonding material 5 to be used. It can be obtained from h = 2σ · cos θ / ρgd using ρ [kg / m ³ ], the contact angle θ [rad] between the bonding material 5 and the inner surface, and the distance d [m] between the two surfaces 21a and 22a. Here, g represents gravitational acceleration [m / s ² ].

An experiment was conducted to confirm the height of solder rise using a metal package with a gold plating on the surface, a solder paste, and a metal-coated fiber having an outer diameter of φ0.12 mm. At that time, the shape of the part 2 was a flat surface shown in FIG. 1, and the interval was d = 0.5 [mm]. The rising heights of the five experimental samples of solder were, on average, h = 17.5 [mm], and a value close to the theoretical value h = 18 [mm] was obtained. For the calculation of the theoretical value, σ = 0.15 [N / m], θ = 45 [rad], ρ = 7370 [kg / m ³ ], d = 0.5 [mm], g = 9. 8 [m / s ² ] was used.

  Therefore, it was confirmed that a desired bonding material rising height h can be obtained by selecting the bonding material and setting the distance d between the two surfaces. However, the actual height h of the bonding material is generally less than the theoretical value due to various obstruction factors. To obtain an ascending height of the bonding material that is close to the theoretical value, select a bonding material that has good adhesion and wettability with the two inner surfaces of the region, or make the two surfaces wet with bonding by surface modification. It is effective to do.

  Further, the height l of the two surfaces 21a and 22a constituting the portion 2 and the distance d are designed in accordance with the size of the optical waveguide 3 to be inserted and the height at which the optical waveguide 3 is inserted. In order to increase the fixing strength of the optical waveguide 3, it is desirable to cover the entire periphery of the optical waveguide 3 with the bonding material 5. In order to realize this, it is necessary to set the distance d between the two surfaces 21 a and 22 a so that the rising height h of the bonding material 5 is higher than the upper surface of the optical waveguide 3.

Also, the height l of the two surfaces 21a and 22a needs to be set higher than the rising height h of the bonding material 5. Thus, the rising height h of the bonding material 5 between the two surfaces 21a and 22a depends on the distance d between the two surfaces 21a and 22a and is limited by the height l of the two surfaces 21a and 22a. Therefore, the rising height h of the bonding material 5 does not depend on the other shape elements of the two surfaces 21a and 22a.
Further, the rising height h of the bonding material 5 does not depend on the protruding length of the two surfaces 21a and 22a, but the fixing strength of the optical waveguide 3 depends on the protruding length of the two surfaces 21a and 22a. It is good to design so that the tensile strength can be obtained.

As shown in FIG. 2A, the portion 2 can be formed by projecting the two surfaces 21 a and 22 a toward the outside of the package 1.
Fig.2 (a) is a cross-sectional view of the 1st form which shows the example of a shape of a site | part.
In FIG. 2A, the inner surface 21a of the first part piece 21A and the inner face 22a of the second part piece 22A constitute two surfaces, and the hole 20 is formed and protrudes in the outward direction of the package 1. It is shown as forming one form of site 2A.
Thereby, it can be set as the package 1 with which site | part 2A for fixing an optical waveguide was integrated.

Further, as shown in FIG. 2B, the part 2 may be formed by projecting the two surfaces 21 b and 22 b toward the inside of the package 1.
FIG. 2B is a cross-sectional view of the second embodiment showing an example of the shape of the part.
In FIG. 2B, the inner surface 21b of the first part piece 21B and the inner face 22b of the second part piece 22B constitute two surfaces, and the hole portion 20 is formed and protrudes in the inner direction of the package 1. It is shown as forming part 2B in two forms.
Thereby, it can be set as the compact package 1 which has integrally the site | part 2B for fixing an optical waveguide, and this site | part 2 does not protrude outside.

Further, as shown in FIG. 2C, the part 2 may be formed by projecting the two surfaces 21 c and 22 c in the external direction and the internal direction of the package 1.
FIG. 2C is a cross-sectional view of a third embodiment showing an example of the shape of the part.
In FIG. 2 (c), the inner surface 21c of the first part piece 21C and the inner face 22c of the second part piece 22C constitute two surfaces, and the hole 20 is formed, and the package 1 is arranged in the external direction and the internal direction. It is shown as protruding to form a third form of site 2C.
Thereby, it can be set as the package 1 which has integrally the site | part 2C with large tensile strength which fixes an optical waveguide firmly.

Further, as shown in FIG. 2 (d), the part 2 may be formed not on the center of one surface of the package but on the edge.
FIG.2 (d) is a cross-sectional view of the 4th form which shows the example of a shape of a site | part.
In FIG. 2D, a part of the adjacent portion on the other surface 1b adjacent to the one surface 1a of the package 1 is regarded as the second portion piece 22D, and the first portion piece 21D provided on the one surface 1a of the package 1 is shown. The inner surface 21d and the inner surface 22d of the second part piece 22D constitute two surfaces and the hole part 20, and the inner surface 21d of the first part piece 21D protrudes inward at one end of one surface of the package 1 4 forms part 2D.
Thereby, while reducing the usage-amount of the raw material used for the site | part 2 and reducing cost, it can be set as the package 1 which has integrated the site | part 2D which simplified the design.

Further, the shape of the two surfaces is not particularly limited as long as it forms a gap that causes a capillary phenomenon to the bonding material 5.
Therefore, as described above, the inner surface 21a of the first part piece 21 and the inner face 22a of the second part piece 22 provided in the package 1 are the first surfaces that are vertically configured while maintaining the distance therebetween. In addition to this form, as shown in FIGS. 3A to 3C, other forms of two surfaces having various shapes may be adopted.

First, FIG. 3A is a cross-sectional view of a second embodiment showing an example of the shape of two surfaces.
In FIG. 3 (a), the inner surface 23a of the first part piece 23 and the inner face 24a of the second part piece 24 provided in the package 1 constitute two surfaces, and the distance between them gradually increases or decreases gradually. Two planes are shown.
In the case of the configuration example of FIG. 3A, the interval between the two surfaces on the side where the bonding material 5 is filled can be made as narrow as possible, and the bonding material 5 can be easily sucked and filled.

Moreover, FIG.3 (b) is a cross-sectional view of the 3rd form which shows the shape example of 2 surfaces.
In FIG. 3B, the inner surface 25 a of the first part piece 25 and the inner face 26 a of the second part piece 26 provided in the package 1 constitute two surfaces, and the distance between them approaches the optical waveguide 3. Two surfaces are shown which are configured to gradually expand and gradually narrow away from the optical waveguide 3.
Also in the configuration example of FIG. 3B, as in the configuration example of FIG. 3A, the interval between the two surfaces other than the portion sandwiching the optical waveguide 3 is made as narrow as possible, and the bonding material 5 is provided between the two surfaces. Can be filled efficiently and quickly. 3B, the bonding material 5 can be sucked up to a higher position as compared with the shape of the portion 2 in the configuration example of FIG.

Moreover, FIG.3 (c) is a cross-sectional view of the 4th form which shows the shape example of 2 surfaces.
In FIG. 3C, the inner surface 27a of the first part piece 27 and the inner face 28a of the second part piece 28 provided in the package 1 constitute two surfaces, and are inclined while maintaining the distance therebetween. Two sides are shown.
In the case of the configuration example of FIG. 3C, the bonding material 5 can be applied and sucked up at any position other than just below the optical waveguide 3 (pointing to the lower side in the figure).

  Further, the hole 20 may be a round hole 20A having a closed periphery as shown in FIG. 4A, or a groove shape having an open portion around as shown in FIG. 4B. The hole 20B may be used. In the case of the round hole 20A, the optical waveguide 3 can be easily fixed while being held. In the case of the groove-shaped hole 20B, the hole can be easily formed, and the optical waveguide can be easily inserted into the hole.

The optical waveguide 3 is formed by a core having a high refractive index and a clad having a low refractive index provided in contact with the periphery of the core, and an optical signal incident on the core is repeatedly totally reflected at the boundary between the core and the clad. Propagate while. As the optical waveguide 3, an optical fiber, a plastic optical fiber, a quartz optical waveguide, a polymer optical waveguide, or the like can be used. Further, an optical waveguide whose surface is partially or entirely metallized with metal may be used. Optical waveguide metallization can be realized by using techniques such as sputter deposition, electroless plating, and electrolytic plating. The optical waveguide 3 is aligned with the semiconductor element 6 and optically coupled.
In FIG. 1B and FIG. 1C, the optical waveguide 3 is shown as an optical fiber composed of an optical fiber 31, a metal coat portion 32, and a covering material 33.

The bonding material 5 has a role of protecting the optical semiconductor element 6 and the like from dust and moisture by sealing the optical semiconductor element 6 and the like in the package 1 and improving the reliability of the optical module 10.
For the bonding material 5, UV curable or thermosetting adhesive (resin), silver paste, solder, or the like can be used. As the solder, either Pb, Sn, In alloy alloy solder called soft solder, or Au alloy solder such as Au—Ge called hard solder may be used. Further, not only solid solder but also solder paste called cream solder or solder paste may be used.

Next, an example of the manufacturing method of the optical module which implemented this invention is demonstrated.
FIG. 5 is a front view sequentially illustrating a method for manufacturing an optical module according to the present invention.
First, as shown in FIG. 5A, the optical waveguide 3 is installed in the hole 20 provided between the first part piece 21 and the second part piece 22.
Next, as illustrated in FIG. 5B, the bonding material 5 a is supplied onto the substrate 4 between the two surfaces formed by the inner surface 21 a of the first part piece 21 and the inner surface 22 a of the second part piece 22.
Subsequently, as shown in FIG. 5C, the bonding material 5a is filled between the two surfaces 21a and 22a by capillary action. At this time, when the bonding material 5a is in the form of solid solder or solder paste, the bonding material 5a is melted.
Then, after the bonding material 5a permeates between the hole 20 and the optical waveguide 3, the optical waveguide 3 is fixed by the bonding material 5 by curing (or solidifying) the bonding material 5a. 3 can be manufactured.

  According to the manufacturing method according to the present embodiment, since the optical waveguide is not shifted from the alignment position during the manufacturing of the optical module, a high-performance optical module can be manufactured and the yield can be improved.

Next, examples of the present invention will be described.
<Example 1>
6A and 6B are diagrams illustrating the optical module according to the first embodiment of the present invention, in which FIG. 6A is a front view of the optical module, and FIG. 6B is a CC line illustrated in FIG. FIG. 6C shows a cross-sectional view taken along the line DD shown in FIG. 6A.
The optical module 10A according to Example 1 used the copper alloy package 1A having high strength and the solder bonding material 5A in order to prevent damage due to external force.
The package 1A was plated with the entire surface with gold in order to improve the wettability of the solder bonding material 5A and to prevent metal oxidation. Reference numeral 8 in the figure indicates a metal coat portion plated with gold.
Furthermore, in order to improve the wettability of the solder bonding material 5A, the surface of the package 1A was modified by plasma cleaning.

As the substrate 4A, a ceramic substrate with good heat dissipation was used to suppress the heat generation of the optical semiconductor element 6.
Further, a metal coated fiber was used for the optical waveguide 3.
And the metal coat fiber 3 is installed between two surfaces of the inner surface 21a of the 1st site | part piece 21 and the 2nd site | part piece 22 which comprise the hole 20, and it is soldered based on the manufacturing method of the optical module mentioned above. The metal coated fiber 3 was fixed to the package 1A with the bonding material 5A, and the durability against the tension of the metal coated fiber 3 was enhanced.

  Further, in the optical module 10A of the present embodiment, the package 1A is machined by soldering the metal package 1A, the ceramic substrate 4A, and the metal coated fiber 3 with the package 1A filled with dry nitrogen or helium. The optical semiconductor element 6, the electronic component 7, and the electric circuit in the optical module 10 </ b> A were protected from moisture.

  As described above, according to the first embodiment, first, the portion for fixing the optical waveguide is integrally manufactured as a part of the package, so that the package is formed from a plurality of members as in the conventional optical module. There is an advantage that the manufacturing cost of the package can be reduced.

  Secondly, since the bonding material sucking function is provided at the site, it is not necessary to apply the bonding material directly onto the optical waveguide. Therefore, unlike the conventional optical module, the optical waveguide is shifted from the alignment position when the bonding material is applied. The production yield of optical joules can be improved.

  Third, by covering the surface of the part with a metal having good solder wettability, poor soldering and sealing errors are unlikely to occur, and the production yield of the optical module can be improved. In addition, since it is not necessary to obtain solder wettability for the package material, a material with a low price can be selected, and the price of the optical module can be reduced.

  Fourth, the metal is metalized on the surface of the optical waveguide by using a metal-coated fiber, so that the optical waveguide is metal-bonded to the site via solder, so it is highly resistant to tensile of the optical waveguide. Sex is obtained.

<Example 2>
FIG. 7 is a diagram illustrating the optical module according to the first embodiment of the present invention. FIG. 7A is a front view of the optical module, and FIG. 7B is an EE line illustrated in FIG. FIG. 7C shows a cross-sectional view taken along the line FF shown in FIG. 7A.
The optical module 10B according to the second embodiment has substantially the same structure as the optical module 10A according to the first embodiment, except that a resin is used as a material for the package, the substrate, and the bonding material. That is, the resin package 1B, the resin substrate 4B, and the resin bonding material 5B were used.

Further, a metal coated fiber was used for the optical waveguide 3.
And the metal coat fiber 3 is installed between two surfaces of the inner surface 21a of the 1st site | part piece 21 and the 2nd site | part piece 22 which comprise the hole 20, and resin is based on the manufacturing method of the optical module mentioned above. The metal-coated fiber 3 is fixed to the package 1B with the bonding material 5B, and the package 1B is sealed by resin bonding to the resin substrate 4B, so that the optical semiconductor element 6, the electronic component 7, and the electric circuit in the optical module 10B are damp. Protected from.

  As described above, according to the second embodiment, the reliability is inferior to the hermetic sealing package of the optical module described in the first embodiment. However, since the resin is used as the material, the member cost is low, and the optical module is used. The cost can be reduced.

<Example 3>
FIG. 8 is a diagram illustrating the optical module according to the first embodiment of the present invention. FIG. 8A is a front view of the optical module, and FIG. 8B is a GG line illustrated in FIG. FIG. 8C shows a cross-sectional view taken along the line HH shown in FIG. 8A.
The optical module 10C according to the third embodiment has substantially the same structure as the optical module 10B according to the second embodiment, but uses a solder bonding material 5A, and the surfaces of the two opposing surfaces 21a and 22a are metallized. Is different. That is, the resin package 1B, the resin substrate 4B, and the solder bonding material 5A were used.

Moreover, the code | symbol 9 in a figure shows the metal coat part in which metallization was made. The range to be metallized is not limited to the surfaces of the two surfaces 21a and 22a, and the entire package 1B may be metallized. As a method for metallization, there are methods such as sputter deposition, electroless plating, and MID. The metal to be metallized is preferably gold, tin, nickel or the like with good solder wettability.
Furthermore, in order to improve solder wettability, it is preferable to plasma-clean the metal coat portion 9 on the two surfaces 21a and 22a.

  As described above, according to the third embodiment, since the metal with good solder wettability is metalized on the surfaces 21a and 22a, the optical waveguide 3 can be satisfactorily fixed even in the resin package 1B in which the solder is not directly wetted. Can do. The same advantage can be obtained when a ceramic package is used instead of the resin package 1B.

As described above, according to the present invention, since the number of members constituting the package is smaller than that of the conventional optical module, the manufacturing cost of the package can be reduced.
Further, since the bonding material can be supplied without directly touching the optical waveguide, the manufacturing yield of the optical module is good, and the manufacturing cost of the optical module can be reduced.

  DESCRIPTION OF SYMBOLS 1 Package, 1a 1 surface, 2 parts, 3 Optical waveguide, 4 Substrate, 5 Bonding material, 6 Optical semiconductor element, 7 Electronic component, 8, 9 Metal coat (metallization) part, 10 Optical module, 20 Hole part, 21 1st Part piece, 21a Inner surface of (first part piece), 22 Second part piece, 22a Inner surface of (second part piece), 31 strand, 32 Metal coat (metallized) part, 33 Coating material.

Claims (4)

A package containing a semiconductor element;
At least a portion that is arranged integrally with one surface of the package, has a hole in a direction penetrating the one surface, and inserts the optical waveguide into the hole to fix the optical waveguide. ,
Two specific surfaces forming the inner surface of the part constitute the hole portion and are arranged to face each other, and the optical waveguide is fixed between the two surfaces by a bonding material. Optical module.   2. The optical module according to claim 1, wherein the two portions are arranged so that the two surfaces protrude in an external direction and / or an internal direction of the package.   The optical module according to claim 1, wherein the two surfaces are provided with a gap that causes capillary action on the bonding material. A package containing a semiconductor element; and a package integrated with one surface of the package, having a hole in a direction penetrating the one surface, and inserting the optical waveguide into the hole to fix the optical waveguide. And two specific surfaces forming the inner surface of the portion constitute the hole portion and are arranged to face each other, and the optical waveguide is formed by a bonding material between the two surfaces. A method of manufacturing a fixed optical module, comprising:
Inserting the optical waveguide into the hole, step A;
Step B of filling the bonding material by capillary action between the two surfaces;
An optical module manufacturing method comprising: at least a step C of curing the bonding material after the bonding material has permeated between the hole and the optical waveguide.

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