JP2010236783A - Floor heating structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a floor heating structure keeping a floor surface temperature near a prescribed temperature for a long time without introducing a complicated temperature control device and exerting high energy-saving effect. <P>SOLUTION: This floor heating structure is constituted by successively stacking a heat-resisting layer 2, a sheet heating element 3 and a floor material layer 4 on an upper side of a heat storage layer 1, and a temperature sensor 7 for controlling a temperature is disposed at a lower side of the heat storage layer 1. Thus the temperature sensor 7 does not detect temperature rise before heat is sufficiently stored in the heat storage layer 1, and the heat can be sufficiently stored in the heat storage layer 1. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a floor heating structure.

Conventionally, a floor heating system having a heating element has been provided with a temperature control device such as a temperature sensor, and the floor surface temperature is kept substantially constant around a predetermined temperature.
That is, a cycle is repeated in which heat is generated by the heating element until the predetermined temperature is reached (power ON), heat generation is stopped when the predetermined temperature is reached (power OFF), and heat is generated when the temperature falls to the predetermined temperature (power ON). As a result, the floor temperature is kept substantially constant around a predetermined temperature.

  Many of these floor heating systems have a structure in which a floor material layer is laminated on a heating element, and in order to minimize the error between the temperature detected by the temperature sensor and the sensory temperature, the temperature sensor The installation location is often installed near the floor layer or near the heating element.

  In recent years, in floor heating systems having a heating element, those having a heat storage body have appeared (for example, Patent Documents 1 and 2). By storing a part of heat from the heating element in the heat storage body, this can be maintained for a long time near a predetermined temperature even after the power is turned off. If such a heat storage type floor heating system is used, the power ON / OFF cycle can be reduced, and heat storage by midnight power can also be used. As a result, the power consumption can be suppressed, which plays a major role in the energy saving effect. Can be fulfilled.

Japanese Patent No. 3138959 Japanese Patent No. 3620461

  However, in the floor heating systems such as Patent Documents 1 and 2, since the temperature sensor and the heating element are arranged near the floor (for example, Patent Document 1 FIG. 1 and Patent Document 2 FIG. 5), the heat from the heating element. Before the temperature is sufficiently stored in the heat storage body, the temperature sensor detects and the power ON / OFF temperature control device operates, and the heat storage effect may not be sufficiently exhibited.

  In order to solve the above-mentioned problems, the present invention has been intensively studied, and as a result, the temperature of the floor heating structure in which the planar heating element and the flooring layer are sequentially laminated on the upper side of the heat storage layer is lower than that of the heat storage layer. By installing a temperature sensor for control, the floor surface temperature can be kept near a predetermined temperature for a long time without introducing a complicated temperature control device, and the power ON / OFF cycle can be reduced. The inventors have found that the heat storage effect by the heat storage layer can be sufficiently exhibited and has a great effect on energy saving, and the present invention has been completed.

That is, the present invention has the following characteristics.
1. On the upper side of the heat storage layer is a floor heating structure in which a planar heating element and a flooring layer are laminated in order,
A floor heating structure in which a temperature sensor for temperature control is installed below the heat storage layer.
2. 1. A heat-resistant layer is laminated between the heat storage layer and the planar heating element. The floor heating structure described in 1.
3. 1. The thickness of the heat storage layer is 1 mm or more and 20 mm or less. To 2. The floor heating structure described in 1.

  The floor heating structure of the present invention can perform temperature control without introducing a complicated temperature control device, and can maximize the energy saving effect due to the heat storage effect.

  Hereinafter, modes for carrying out the present invention will be described.

<Floor heating structure>
In the floor heating structure of the present invention, a sheet heating element and a floor material layer are sequentially laminated on the upper side of the heat storage layer, and a temperature sensor for temperature control is installed on the lower side of the heat storage layer. It is.
In addition, the temperature sensor is connected to a temperature control device that controls the heat generated by the planar heating layer, and the temperature detected by the temperature sensor is transmitted to the temperature control device to control the heating by the planar heating layer. (Power ON-OFF).
As the temperature sensor and the temperature control device, known ones may be used, and the temperature control device only needs to be located at an easy-to-operate place such as the upper side or the wall surface of the flooring layer.
If both the temperature sensor and the planar heating element are on the upper side of the heat storage layer, there is immediate effect, but the temperature control program operates without sufficient heat storage in the heat storage layer, and the heat storage effect cannot be fully demonstrated. . When the planar heating element is under the heat storage layer or inside the heat storage layer, it lacks immediate effect.

<Heat storage layer>
The heat storage layer of the present invention contains a latent heat storage material, and examples of the latent heat storage material include inorganic latent heat storage materials and organic latent heat storage materials.

  Examples of the inorganic latent heat storage material include hydrates such as sodium sulfate decahydrate, sodium carbonate decahydrate, sodium hydrogen phosphate dodecahydrate, sodium thiosulfate pentahydrate, calcium chloride hexahydrate, etc. Examples of the organic latent heat storage material such as salt include aliphatic hydrocarbons, long chain alcohols, long chain fatty acids, long chain fatty acid esters, fatty acid triglycerides, polyether compounds and the like, and one of these latent heat storage materials. Or 2 or more types can be used.

  In the present invention, an organic latent heat storage material can be particularly preferably used. Organic latent heat storage materials are preferred because they have a high boiling point and are less likely to volatilize, so there is almost no volume change (thinning) during the heat storage layer molding and the heat storage performance lasts for a long time. Furthermore, when an organic latent heat storage material is used, it is easy to set the phase change temperature according to the application. For example, by mixing two or more organic latent heat storage materials having different phase change temperatures, the phase change temperature can be easily set. Can be set.

  As the aliphatic hydrocarbon, for example, an aliphatic hydrocarbon having 8 to 36 carbon atoms can be used. Specifically, n-tetradecane (melting point: 8 ° C.), pentadecane (melting point: 10 ° C.), n-hexadecane ( Melting point 17 ° C), n-heptadecane (melting point 22 ° C), n-octadecane (melting point 28 ° C), n-nonadecane (melting point 32 ° C), icosane (melting point 36 ° C), docosan (melting point 44 ° C), and mixtures thereof N-paraffin, paraffin wax, etc. comprised by these.

  As the long chain alcohol, for example, a long chain alcohol having 8 to 36 carbon atoms can be used. Specifically, capryl alcohol (melting point: 7 ° C.), lauryl alcohol (melting point: 24 ° C.), myristyl alcohol (melting point: 38 ° C.) ), Stearyl alcohol (melting point: 58 ° C.), and the like.

  As the long chain fatty acid, for example, a long chain fatty acid having 8 to 36 carbon atoms can be used. Specifically, octanoic acid (melting point: 17 ° C.), decanoic acid (melting point: 32 ° C.), dodecanoic acid (melting point: 44 ° C.). ), Fatty acids such as tetradecanoic acid (melting point 50 ° C.), octadecanoic acid (melting point 70 ° C.), hexadecanoic acid (melting point 63 ° C.), and the like.

  As the long-chain fatty acid ester, for example, a long-chain fatty acid ester having 8 to 36 carbon atoms can be used. Specifically, methyl laurate (melting point 5 ° C.), methyl myristate (melting point 19 ° C.), palmitic acid Examples include methyl (melting point: 30 ° C.), methyl stearate (melting point: 38 ° C.), butyl stearate (melting point: 25 ° C.), and methyl arachidate (melting point: 45 ° C.).

  Examples of the fatty acid triglyceride include vegetable oils such as coconut oil and palm kernel oil, and medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides that are refined processed products thereof.

  Examples of the polyether compound include diethylene glycol, triethylene glycol, tetraethylene glycol, triethylene glycol monomethyl ether, tetraethylene glycol dimethyl ether, polypropylene glycol, polyethylene glycol, polypropylene glycol diacrylate, and ethyl ethylene glycol.

  In the present invention, aliphatic hydrocarbons, long-chain fatty acids, and long-chain fatty acid esters having a phase change temperature (melting point) in a practical temperature range of 25 ° C. to 55 ° C. are particularly high in latent heat amount as a latent heat storage material. Excellent in stability and preferable.

  Further, as the latent heat storage material, aliphatic hydrocarbons having 8 to 36 carbon atoms, long chain alcohols having 8 to 36 carbon atoms, long chain fatty acids having 8 to 36 carbon atoms, and long chain fatty acid esters having 8 to 36 carbon atoms are used. It is preferable to use aliphatic hydrocarbons having 8 to 36 carbon atoms and long chain fatty acid esters having 8 to 36 carbon atoms. Among them, it is preferable to use a long-chain fatty acid ester having 15 to 22 carbon atoms and an aliphatic hydrocarbon having 15 to 22 carbon atoms. Such a latent heat storage material has a high latent heat amount and has a phase change temperature in a practical temperature range. Since it has a (melting point), it is easy to use for various purposes.

  In the present invention, a heat storage layer having a wide application temperature range can be obtained by using two or more kinds of latent heat storage materials having different melting points.

Furthermore, the heat storage layer can be used by mixing a latent heat storage material with a compatibilizing agent, a viscosity adjusting agent, a heat conductive substance, or the like.
The compatibilizing agent is effective when two or more kinds of latent heat storage materials, particularly two or more kinds of organic latent heat storage materials are mixed and used, and can improve the compatibility between the latent heat storage materials.

  In the present invention, a method for obtaining a heat storage layer by enclosing the latent heat storage material in a film as it is, a method for obtaining a heat storage layer by immobilizing an encapsulated latent heat storage material, filling a porous body with the latent heat storage material, The heat storage layer can be obtained by a method of obtaining, a method of obtaining a heat storage layer by gelling and solidifying the latent heat storage material, and the like.

  In the method of enclosing the latent heat storage material in the film as it is, for example, as the film, one or two selected from organic materials such as polyethylene, polypropylene, nylon, polyester, polyethylene terephthalate, vinylidene chloride, ethylene / vinyl acetate copolymer, etc. One or more metals, one or more metals selected from aluminum, gold, silver, copper, iron, chromium, zinc, magnesium, titanium, nickel, bismuth, tin, cobalt, or oxides, chlorides, sulfides of these metals, A film mainly composed of one or more selected from carbonates, silicates, phosphates, nitrates, sulfates, and composites thereof can be used. What is necessary is just to enclose a latent heat storage material using such a film.

  In the method of encapsulating the latent heat storage material, for example, the latent heat storage material may be encapsulated by the method described in JP-A-2006-063314, JP-A-2007-119715, or the like.

  When the encapsulated heat storage capsule is used as the heat storage layer, it may be fixed by some method. For example, the heat storage capsule can be encapsulated in the film as it is, or the heat storage capsule and the binder are kneaded. The molded product of slurry may be used as a heat storage layer, or various materials may be impregnated with a heat storage capsule by dipping, decompression or pressure injection, etc., or a heat storage layer may be produced by combining these methods. May be.

  For example, as a method of encapsulating the heat storage capsule as it is in the film, the heat storage capsule dispersed in a solvent such as water or a solid fine powder of the heat storage capsule may be enclosed in the film.

Moreover, what is necessary is just to use a well-known thing as a method of forming the slurry which knead | mixed the heat storage capsule and binder.
Examples of such binders include acrylic resin, silicon resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, polycarbonate resin, fluororesin, vinyl acetate resin, acrylic / acetic acid Solvent soluble types such as vinyl resin, acrylic / urethane resin, acrylic / silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, vinyl chloride resin, ABS resin, AS resin Synthetic rubber such as resin, NAD type resin, water soluble resin, water dispersion type resin, solventless type resin, chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methyl methacrylate-butadiene rubber, butadiene rubber Organic binder such as Examples include inorganic binders such as Portland cement, blast furnace cement, silica cement, fly ash cement, white cement, calcined gypsum, colloidal silica, and water-soluble alkali metal silicates. Use one or more of these. Can do. Using such a binder, the sheet may be formed into a sheet by a known method to obtain a heat storage layer, or the film may be encapsulated with slurry to obtain a heat storage layer.
In addition to the binder, the slurry includes a solvent, a pigment, an aggregate, a viscosity modifier, a buffer, a dispersant, an antifoaming agent, a plasticizer, an antiseptic, an antifungal agent, an antialgae, a flame retardant, Various additives such as a leveling agent, an anti-settling agent, an anti-sagging agent, and a dehydrating agent can be kneaded.

Further, in the method of impregnation by the dipping method, the reduced pressure / pressure injection method or the like, the material shown below may be impregnated with the heat storage capsule.
Materials include, for example, inorganic materials such as concrete, gypsum board, mortar, slate board, synthetic fibers such as glass fiber, pulp fiber, polyethylene fiber, polypropylene fiber, vinylon fiber, tetron fiber, polyester fiber, cellulose fiber, nylon fiber, etc. , Cotton, cotton, asbestos, hemp, palm, cork, kenaf and other natural fiber materials, acrylic resin, silicone resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, Polycarbonate resin, fluororesin, vinyl acetate resin, acrylic / vinyl acetate resin, acrylic / urethane resin, acrylic / silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, chloride Nyl resin, ABS resin, AS resin, chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methyl methacrylate-butadiene rubber, organic materials such as synthetic rubber such as butadiene rubber, pine, lawan, beech, hinoki, plywood Wood materials, etc., paper, synthetic paper, ceramic paper, etc. are mentioned, These 1 type (s) or 2 or more types can be used.

  The material in which the latent heat storage material is filled in the porous body is not particularly limited as long as the latent heat storage material is supported and held in the porous body.

  The shape of the porous body is not particularly limited as long as the latent heat storage material can be supported and held, and examples thereof include those having a shape such as a particle aggregation type porous material, a sponge type porous material, and a three-dimensional stitch structure type porous material. . In the present invention, in particular, a three-dimensional stitch structure type porous body is preferable because the latent heat storage material is more easily supported and held.

  The porous body can be used without any particular limitation, such as an inorganic porous body or an organic porous body, but an organic porous body is preferably used from the viewpoint of more easily carrying and holding the latent heat storage material. Furthermore, the organic porous body can also prevent cracking and shape change of the heat storage layer due to volume shrinkage due to phase change (particularly, change from liquid to solid) of the latent heat storage material.

  The porous body may be produced by a known method, and examples thereof include the methods described in Japanese Patent Application Nos. 2005-322930 and 2006-280575.

In the method of gelling and solidifying the latent heat storage material, for example, the latent heat storage material can be gelled and solidified by mixing the polymer resin and the latent heat storage material.
Such a polymer resin is not particularly limited as long as it is compatible with the latent heat storage material and can be gelled and solidified. For example, acrylic resin, polyester resin, acrylic silicon resin, silicon resin, urethane resin, epoxy Resin, polyvinyl alcohol resin, butyral resin, amino resin, phenol resin, fluororesin, synthetic rubber, acrylic resin, silicone resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, Polycarbonate resin, fluororesin, vinyl acetate resin, acrylic / vinyl acetate resin, acrylic / urethane resin, acrylic / silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, salt Solvent-soluble resins such as vinyl resin, ABS resin, AS resin, NAD-type resin, water-soluble resin, water-dispersible resin, solvent-free resin, chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber And synthetic rubbers such as methyl methacrylate-butadiene rubber and butadiene rubber.
In the present invention, it is particularly preferable that the latent heat storage material is gelled and solidified with a polymer resin containing a hydroxyl value. Such a polymer resin is excellent in compatibility with the latent heat storage material, and can be easily gelled and solidified. The mixing ratio of the polymer resin and the latent heat storage material is preferably about 200 parts by weight or more and 1500 parts by weight or less for the latent heat storage material with respect to 100 parts by weight of the polymer resin (solid content).

  The heat storage layer of the present invention includes the above-described latent heat storage material, or encapsulating the latent heat storage material, filling the latent heat storage material in a porous body, encapsulating the latent heat storage material in a film, latent heat storage material gel Or solidified. The latent heat storage material content in the heat storage layer is preferably 40% by weight or more, and more preferably 50% by weight or more.

<Surface heating element>
The planar heating element of the present invention is not particularly limited, and a known planar heating element can be used. As the planar heating element, for example, a nichrome wire meandering and disposed on the surface of the insulator, an electric resistance heating element and an electrode laminated, a PTC planar heating element, and the like can be cited.

The electric resistance heating element is not particularly limited as long as the electric resistance value is 1 × 10 ³ Ω · cm or less (preferably 1 × 10 ² Ω · cm or less). Those consisting of are preferred. When the electric resistance value of the electric resistance heating element is larger than 1 × 10 ³ Ω · cm, the power consumption is increased, which is not preferable.

Resin components include acrylic resin, polyester resin, acrylic silicone resin, silicone resin, urethane resin, epoxy resin, polyvinyl alcohol resin, butyral resin, amino resin, phenol resin, fluororesin, synthetic rubber, acrylic resin, silicone resin , Polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, polycarbonate resin, fluorine resin, vinyl acetate resin, acrylic / vinyl acetate resin, acrylic / urethane resin, acrylic / silicone resin, silicone modified Acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, vinyl chloride resin, ABS resin, AS resin and other solvent soluble resins, NAD resin, water soluble resin, water dispersion type Organic binders such as oils, solvent-free resins, etc., synthetic rubbers such as chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methyl methacrylate-butadiene rubber, butadiene rubber, and resins that combine these. It is done.
In the present invention, for example, urethane resin, epoxy resin, acrylic resin, silicon resin, phenol resin, synthetic rubber and the like are preferably used as the flexible resin.

  Examples of conductive powder include graphite powder, scaly graphite, flake graphite, carbon powder such as carbon nanotube, graphitized fiber, carbon fiber such as fiber carrying graphite, silver, gold, copper, nickel, aluminum Metal fine particles such as zinc, platinum, palladium, iron, etc., conductive fibers in which conductive components such as these metal fine particles are supported on the fiber surface, and metal fine particles on the surface of powder such as mica, mica, talc, titanium oxide In addition, a conductive powder supported on a conductive oxide, or a conductive oxide such as fluorine-doped tin oxide, tin-doped indium oxide, antimony-doped tin oxide, or conductive zinc oxide can be used.

The electric resistance heating element can be manufactured by mixing the conductive powder so as to be uniformly dispersed in the resin and forming the conductive powder into a film or a sheet by a known method.
The mixing amount of the conductive powder is not particularly limited, but it may be mixed so that the electric resistance value of the electric resistance heating element can be adjusted to 1 × 10 ³ Ω · cm or less, and the solid content of the resin component is 100 parts by weight. And 10 parts by weight or more and 300 parts by weight or less (preferably 30 parts by weight or more and 100 parts by weight or less).

Moreover, as long as the electrical resistance value is within a range of 1 × 10 ³ Ω · cm or less, in addition to the resin component, an antifoaming agent, a thickener, an antiseptic agent, an antibacterial agent, a denaturing agent, an ultraviolet ray absorbing agent, if necessary Additives such as an agent, a curing agent, a curing catalyst, a film increasing aid, and a solvent can also be added.

  The thickness of the electric resistance heating element is preferably 3 mm or less. If it is thicker than 3 mm, the flexibility is lowered, and temperature unevenness is likely to occur in the electric resistance heating element, which may make it difficult to achieve a uniform temperature.

  The electrode is not particularly limited as long as the electric resistance value is lower than that of the electric resistance heating element. Preferably, an electrode made of metal fine particles and / or a paste in which these metal fine particles are mixed can be used. Although it does not specifically limit as metal microparticles, Silver, copper, gold | metal | money, platinum, etc. can be used.

  The electrode can be laminated on the electric resistance heating element by a known method. For example, it can be laminated by spraying, roller, brush coating, dip coating, sputtering, vapor deposition, screen printing method, doctor blade method and the like.

The PTC sheet heating element utilizes PTC (Positive Temperature Coefficient) characteristics, and is formed by printing a special heating ink exhibiting PTC characteristics on a resin film such as a polyester film or a PET film. can do. As a material for the special heat-generating ink, barium titanate-based ceramics that are made into a semiconductor by doping a small amount of rare earth elements such as yttrium, antimony, and lanthanum are used.
Such a PTC planar heating element quickly rises in temperature when energized due to the PTC characteristics, reaches a predetermined temperature, and can control and maintain the temperature itself, so there is no need to use a sensor controller.

  Further, since the PTC sheet heating element is a printing method using the special heating ink, the PTC sheet heating element can be formed thin, and thus can be reduced in weight and thickness. Furthermore, this PTC planar heating element has a low resistance value from when the power is turned on until it reaches a predetermined temperature, so that power consumption required for temperature rise can be suppressed. Therefore, it can be heated efficiently.

<Floor material layer>
As the flooring layer of the present invention, resin tiles and resin sheets such as vinyl chloride and polyolefin, monolithic boards, flooring materials, plywood, particle boards, cork tiles and other wood materials, fiber materials, ceramic tiles and other ceramic materials Stone materials such as marble, granite, and terrazzo, concrete materials such as mortar, natural resin tiles such as rubber and linoleum, natural resin sheets, and the like can be used. Tatami mats, carpets, carpets, etc. can also be used as the flooring layer. In the present invention, those having heat resistance are more preferable.

<Method for forming floor heating structure>
As a method for forming the floor heating structure of the present invention, for example, a floor heating panel including a temperature sensor, a heat storage layer, a planar heating layer, and a floor material layer is prepared in advance, and a base material (concrete, mortar, etc.) is prepared. And a method of laminating on an existing flooring, a method of laminating a temperature sensor, a heat storage layer, a planar heating layer, and a flooring layer on a base material and an existing flooring.
Specifically, a planar heating layer is installed on the upper side of the heat storage layer obtained by the manufacturing method described above, a temperature sensor is installed on the lower side of the thermal storage layer, and a floor material layer is further installed on the upper side of the planar heating layer. Can be applied with a known adhesive or adhesive tape to produce a floor heating panel and laminated on a base material or existing flooring via a known adhesive or adhesive tape.
The temperature control device for controlling the heat generation by the planar heating layer is connected to the temperature sensor and the planar heating layer, and the temperature detected by the temperature sensor is transmitted to the temperature control device, so that the planar heating layer The temperature control device only needs to be in an easy-to-operate place such as the upper side of the flooring layer or the wall surface.

  As the thickness of the floor heating structure, the thickness of the heat storage layer is usually 1 mm to 20 mm, more preferably about 2 mm to 15 mm, and the thickness of the planar heating element is usually about 5 mm or less, further about 3 mm or less. The thickness of the material layer is usually 1 to 20 mm, preferably about 2 to 15 mm. When the heat storage layer is too thick, it takes time until heat is stored in the heat storage layer, which may lack immediate effect, and may require excessive power consumption.

The total thickness of the floor heating structure is usually 40 mm or less, and in the present invention, it is particularly preferably 25 mm or less, preferably 20 mm or less, more preferably 15 mm or less. By reducing the thickness of the floor heating structure, it can be reduced in weight and can be constructed easily. Especially in renovation, it is possible to maintain a comfortable living space without being compressed after construction. it can.
In addition, since the floor heating structure of the present invention has excellent heat storage performance, even a thin film suppresses the movement of heat under the floor during floor heating operation, and the temperature of the room temperature and the floor temperature after the floor heating is stopped. Can be prevented. Therefore, the amount of power consumption can be suppressed and a comfortable living environment can be maintained.

<Heat resistant layer>
In the floor heating structure of the present invention, a heat-resistant layer can also be laminated, and it is particularly preferred to laminate between the heat storage layer and the planar heating element.
By laminating the heat-resistant layer, deformation of the heat storage layer can be suppressed against an excessive temperature rise such as a heating wire.
Examples of the heat resistant layer include a glass layer having a heat resistant temperature of 100 ° C. or higher, a metal layer, a heat resistant resin layer, and the like. In consideration of the thinness in the present invention, the thickness of the heat-resistant layer is preferably 5 mm or less.
In addition, the heat-resistant temperature as used in the field of this invention means the upper limit temperature at which a heat-resistant layer does not deform | transform. That is, when the temperature is higher than the heat resistant temperature, the heat resistant layer may be deformed.

  Examples of the glass layer include a glass plate or a glass fiber layer in which glass fibers are arranged in a mesh, spots or randomly.

  Examples of the metal layer include one or more metals selected from aluminum, gold, silver, copper, iron, chromium, zinc, magnesium, titanium, nickel, bismuth, tin, and cobalt, or oxides and chlorides of these metals. , Sulfides, carbonates, silicates, phosphates, nitrates, sulfates, and composites containing one or more selected from these.

  Examples of the heat-resistant resin layer include those in which one or more of synthetic resins such as polyethylene terephthalate and polypropylene are formed in a plate shape or a film shape.

By laminating such a heat-resistant layer, it is possible to suppress deformation and combustion of the heat storage layer accompanying an excessive increase in temperature. Furthermore, leakage of the latent heat storage material associated with deformation of the heat storage layer can be prevented.
In addition, such a heat-resistant layer also has a soaking effect that makes the entire floor surface a uniform temperature. For example, when a planar heating element is laminated on a part of the floor surface, Can be spread over the entire surface. In particular, by laminating a layer having a high thermal conductivity such as a metal layer, a more excellent soaking effect can be exhibited.
In addition, a rapid increase in temperature can be prevented by laminating a glass layer having a low thermal conductivity and a heat-resistant resin layer.
In the present invention, in addition to heat resistance, considering a soaking effect and an effect of preventing a rapid temperature rise, a heat resistant layer obtained by laminating a metal layer, a glass layer and / or a heat resistant resin layer, and further, a metal layer and a glass layer A heat-resistant layer in which is laminated can be suitably applied. Moreover, you may laminate | stack a metal layer, a glass layer, and / or a heat-resistant resin layer by two layers or 3 layers or more.

  In the present invention, when the heat-resistant layer is formed by laminating a metal layer and a glass layer and / or a heat-resistant resin layer, the heat-resistant layer is laminated so that the glass layer or the heat-resistant resin layer is laminated at least on the heat storage layer side. Are preferably laminated.

The method of laminating the heat-resistant layer is not particularly limited, but the method of laminating the heat storage layer and the heat-resistant layer in advance by the above-mentioned method, the method of laminating the heat-storage layer and then laminating the heat-resistant layer, the sheet heat generation in advance And a method of laminating a body and a heat-resistant layer by the above-described method.
The heat-resistant layer only needs to be laminated at least where the planar heating element is laminated, and may be laminated on the entire surface of the heat storage layer.

<Insulation layer>
In the present invention, a heat insulating layer can be further laminated.
By laminating the heat insulating layer, it is possible to moderate the external temperature change and to efficiently heat the heat generated by the planar heating element to the outside and to warm the floor surface efficiently.

  Although it does not specifically limit as a location which laminates | stacks a heat insulation layer, Between a base material or the existing flooring and a thermal storage layer is preferable. Moreover, although a heat insulation layer can be newly laminated | stacked, you may use the heat insulation layer which already exists.

  Although it does not specifically limit as a heat insulation layer, Thermal conductivity is less than 0.1 W / (m * K) (More preferably, 0.08 W / (m * K) or less, More preferably, 0.05 W / (m * K) It is preferable that it has the heat insulation property of the following). When the thermal conductivity is less than 0.1 W / (m · K), it has excellent heat insulating properties.

  Examples of such a heat insulating layer include polystyrene foam, polyurethane foam, acrylic resin foam, phenol resin foam, polyethylene resin foam, foam rubber, glass wool, rock wool, foam ceramic, and the like, or a composite thereof. Etc. Moreover, you may use a commercially available heat insulation layer.

  The thickness of the heat insulating layer is usually preferably 1 mm or more and 30 mm or less.

Example 1
On a plywood (300 × 180 mm, thickness 5 mm), a temperature sensor, a heat storage layer / heat-resistant layer, a planar heat generation layer, and a flooring layer were sequentially laminated to prepare a test specimen.
Heat storage layer / heat-resistant layer: 80 parts by weight of methyl stearate (phase change temperature 38 ° C., latent heat 220 kJ / kg), polyester polyol (polycondensate of 2,4-diethyl-1,5-pentamethylenediol and adipic acid, hydroxyl group 15.8 parts by weight of 58 mg KOH / g, molecular weight 2000, solid content 100%) and 4.2 parts by weight of hexamethylene diisocyanate (NCO% 17.4%, solid content 100%) were uniformly mixed at a temperature of 35 ° C. 0.1 part by weight of dibutyltin dilaurate was added and stirred sufficiently. After stirring, it was poured into a 300 × 180 × 5 mm mold with a heat-resistant layer (glass layer / aluminum layer, thickness 100 μm), cured at 50 ° C. for 180 minutes, demolded, and methyl stearate (heat storage material) ) Filled with a heat storage layer (thickness 5 mm) and a heat-resistant layer (heat storage layer / glass layer / aluminum layer). The NCO / OH ratio was 1.0.
Planar heating layer: Silicon rubber heater (300 x 180 mm, thickness 2 mm) with nichrome wire meandering in silicon rubber
Floor material layer: heat-resistant flooring (300 x 180 mm, thickness 12 mm)

(Floor heating performance evaluation)
As shown in FIG. 1, polystyrene foam having a thickness of 25 mm is installed on the side surface, top surface, and bottom surface so that the inner dimension is 300 × 180 × 200 mm, and the floor material layer side of the test specimen is on the bottom surface. The test body box was prepared.
Furthermore, in order to measure the floor surface temperature, a thermocouple was installed at the center of the floor material surface as shown in FIG. Moreover, as shown in FIG. 1, the temperature control apparatus (temperature regulator transformer) was attached to the floor surface, and it connected with the temperature sensor and the planar heating element.
This test body box was installed in a thermostat and the following experiment was conducted.
The temperature in the thermostat was set to 10 ° C. and left for 15 hours. Thereafter, the planar heating layer was heated while the temperature in the thermostat was set to 10 ° C. At this time, the temperature control device was set so that when the temperature detected by the temperature sensor exceeded 38 ° C., the power was turned off, and when the temperature was lower than 33 ° C., the power was turned on.
As the floor heating performance evaluation, changes in the floor surface temperature (measured by a thermocouple) were measured and shown in FIG. The measurement was performed for 6 hours.

(Comparative Example 1)
As shown in FIG. 2, the test body was produced by the same method as Example 1 except the position of the temperature sensor, and floor heating performance evaluation was performed. The results are shown in FIG. In such a floor heating structure, sufficient heat storage performance cannot be exhibited, the power ON / OFF cycle is short, and the energy saving effect cannot be exhibited sufficiently.

(Comparative Example 2)
As shown in FIG. 3, Example 1 and Example 1 except that a sheet heating layer, a temperature sensor, a heat storage layer / heat-resistant layer, and a flooring layer were sequentially stacked on a plywood (300 × 180 mm, thickness 5 mm). By the same method, the test body was produced and floor heating performance evaluation was performed. The results are shown in FIG. In such a floor heating structure, the temperature rise from the rise on the floor surface becomes gradual and lacks immediate effect.

2 is a cross-sectional view of a test specimen box used in Example 1. FIG. 3 is a cross-sectional view of a test specimen box used in Comparative Example 1. FIG. 6 is a cross-sectional view of a specimen box used in Comparative Example 2. FIG. 4 is a temperature change graph of the floor surface of Example 1, Comparative Example 1 and Comparative Example 2.

1: heat storage layer 2: heat-resistant layer 3: planar heating layer 4: flooring layer 5: plywood 6: polystyrene foam 7: temperature sensor 8: temperature controller 9: thermocouple

Claims (3)

On the upper side of the heat storage layer is a floor heating structure in which a planar heating element and a flooring layer are laminated in order,
A floor heating structure in which a temperature sensor for temperature control is installed below the heat storage layer.   The floor heating structure according to claim 1, wherein a heat-resistant layer is laminated between the heat storage layer and the planar heating element. The floor heating structure according to claim 1 or 2, wherein the heat storage layer has a thickness of 1 mm or more and 20 mm or less.

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