JP2010235142A - Transportation tray and shipping method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase a utilization efficiency of an inner space in a packaging body for a module or a sub-module under application of the same transportation tray when the module or the sub-module is transferred. <P>SOLUTION: A packaging body for a sub-module is equipped with: comprises film trays 5A, 5B; and sub-modules 20A, 20B. A packaging body for a module is equipped with film trays 5A, 5B and modules 30A, 30B. The film trays 5A, 5B is equipped with spaces 12A, 12B and 12D. The inside of the space 12B of the film tray 5B has a shape in which the bottom surface member 24 of the sub-module 20B is in contact with it. The inside of the space 12A of the film tray 5B has a shape in which a casing 31 of the module 30B is in contact with it. The top surface member 22 of the sub-module 20A or the module 30A is in contact with the lower part of the film tray 5B. The protrusion member 23 of the sub-module 20A or the module 30A is arranged in the inside part of the space 12D of the film tray 5B. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a transport tray used for shipping an article, and a method for shipping a sub-module package and a module package using the transport tray in common.

  When a module that is a component of the final product is delivered from the second factory to the first factory that assembles the final product, a package containing a plurality of modules is shipped from the second factory. This package is a package in which transport trays loaded with modules are stacked. In addition, when a sub-module, which is a component of the module, is delivered from the third factory to the second factory that assembles the module, a package containing a plurality of sub-modules is shipped from the third factory. As described above, when a package is shipped a plurality of times, resource saving may be achieved by sharing a transport tray (see, for example, Patent Document 1).

  In the above document, a configuration in which a holding groove having a step portion is provided in a transport tray is disclosed. At the time of shipment of the resolver (module), a ring-shaped iron core constituting a part of the resolver is mounted in the groove portion of the transport tray. In addition, a coil protective cover that constitutes another part of the resolver is mounted on the step portion of the transport tray. Further, when the annular iron core (submodule) is shipped, the annular iron core is mounted in the groove portion of the transport tray.

JP 2008-155944 A

  When shipping modules and submodules, the greater the number of articles that can be stored in the package, the lower the logistics cost. For this reason, it is desirable to increase the exclusive area of articles mounted on each transport tray and improve the utilization efficiency of the internal space in the package.

  Therefore, the present invention provides a transport tray and a shipping method that can use the same transport tray when the module is shipped and when the sub-module is shipped, and the use efficiency of the internal space in the package can be increased. For the purpose.

  The transport tray of the present invention is shared when the module is shipped and when the submodule is shipped. The module is constructed by incorporating a submodule. The transport tray includes a first concave portion, a second concave portion, and a first convex portion. The first recess is provided in the first region of the transport tray. The second recess is provided in the second region. The second area is included in the first area. The first convex portion is provided in the third region of the transport tray. The third area is included in the second area. A 1st recessed part is a shape where a submodule contacts an inner side when a submodule is stacked on the upper side. A 2nd recessed part is a shape where a module contacts inside, when a module is stacked on the upper side. A 1st convex part is a shape by which a part of module or a submodule is arrange | positioned inside when it accumulates on the upper side of a module or a submodule.

  In addition, the shipping method of the present invention includes a sub-module delivery step, a module assembly step, a module packaging step, and a module shipping step, and shares the transport tray when the sub-module and the module are shipped. The submodule and the module include a bottom surface portion, a top surface portion, and a protruding portion. The top surface portion is disposed above the bottom surface portion. The protruding portion protrudes above the top surface portion. The transport tray includes a first concave portion, a second concave portion, and a first convex portion. The first recess is provided in the first region of the transport tray. The second recess is provided in the second region. The second area is included in the first area. The first convex portion is provided in the third region of the transport tray. The third area is included in the second area.

  In the sub-module delivery step, the sub-module package is delivered. In this submodule package, the bottom surface of the first submodule is brought into contact with the inside of the second recess of the first transport tray, and the first submodule is stacked on the first transport tray. is there. Further, the second transport tray is brought into contact with the top surface portion of the first submodule while the protruding portion of the first submodule is disposed inside the first convex portion of the second transport tray, and the first submodule is protruded. The second transport tray is stacked on the submodule. Further, the second submodule is stacked on the second transport tray with the bottom surface of the second submodule being brought into contact with the inside of the second recess of the second transport tray. In the module assembling step, the sub-module taken out from the sub-module package is assembled to form a module. The module packing step constitutes a module package. The package of this module is a state in which the first module is stacked on the first transport tray with the bottom surface of the first module in contact with the inside of the first recess of the first transport tray. Further, the first module is brought into contact with the top surface portion of the first module while the protruding portion of the first module is disposed inside the first convex portion of the second transport tray. And the second transport tray is stacked. Further, the second module is stacked on the second transport tray with the bottom surface of the second module being brought into contact with the inside of the first recess of the second transport tray. The shipping step ships the module package.

  Therefore, by mounting the submodule in the second recess provided in the transport tray and mounting the module in the first recess, the same transport tray can be used when the module is shipped and when the submodule is shipped. it can. Further, since the projecting portions of the modules and submodules disposed below the transport tray are configured to be disposed inside the first convex portion, the internal space of the packing body in the direction in which the transport trays are stacked Use efficiency can be increased.

  The transport tray of the present invention is preferably provided with a third recess. The third recess is provided in the fourth region of the transport tray. The fourth area is included in the second area together with the third area.

  Generally, the transport tray is configured to be thin with a substantially constant thickness. When mounting modules and submodules on such a transport tray and stacking them, if the mounted articles come in contact with each other via the tray, there is a risk of causing damage even with a small impact. Therefore, in this configuration, a buffer space is secured between the modules and the sub modules by providing the third recess. In this case, the use efficiency of the internal space in the direction of stacking the transport trays in the packing body is reduced by the amount of the buffer space. However, by arranging the protruding portion of the article inside the first convex portion, the packaging Reduction of the utilization efficiency of the internal space in the direction of stacking the transport trays in the body can be suppressed.

  According to the present invention, in order to increase the utilization efficiency of the article mounting area in each transport tray, in the transport tray, one set of the first concave portion, the second concave portion, and the first convex portion is different from the other set. You may arrange | position symmetrically.

  According to the present invention, the sub-module is mounted in the second recess provided in the transport tray, and the module is mounted in the third recess, so that the same transport tray is used when the module is shipped and when the sub-module is shipped. Can be used. Moreover, since the protrusion part of the module and submodule arrange | positioned under the transport tray is comprised inside the 1st convex part, the utilization efficiency of the internal space in a package can be improved.

It is a figure explaining the outline of the dispatch method which concerns on embodiment of this invention. It is a perspective view explaining the schematic structure of the package which concerns on embodiment of this invention. It is an expanded view explaining schematic structure of the transport tray which concerns on embodiment of this invention. It is a figure explaining the schematic structure of the submodule which concerns on embodiment of this invention. It is a top view of the state which mounted the submodule in the transport tray which concerns on embodiment of this invention. It is a figure explaining schematic structure of the module concerning the embodiment of the present invention. It is a top view of the state which mounted the module in the transport tray which concerns on embodiment of this invention. It is a fragmentary sectional view of the packing object concerning the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 is a diagram for explaining an outline of a shipping method according to the present embodiment. FIG. 1A is a conceptual diagram of this shipping method, and FIG. 1B is a diagram showing a schematic flow in this shipping method.

  In this embodiment, a package 2A in which a submodule (not shown) is packed is shipped from the submodule manufacturing factory 1A to the module manufacturing factory 1B. Further, a package 2B in which modules (not shown) are packed is sent from the module manufacturing factory 1B to the final product manufacturing factory 1C.

  In the submodule manufacturing factory 1A, first, a submodule is manufactured (S11). Next, the submodule is packed to form the package 2A (S12). Then, the package 2A is shipped (S13).

  In the module manufacturing factory 1B, the delivered package 2A is first opened (S21). Next, a submodule is taken out from the package 2A, and a module incorporating the submodule is manufactured (S22). Next, the module is packed to form the package 2B (S23). Then, the package 2B is shipped (S24).

  In the final product manufacturing factory 1C, first, the delivered package 2B is opened (S31). Next, the module is taken out from the package 2B, and a final product (not shown) incorporating the module is manufactured (S32). The final product manufactured by the above flow is individually packaged and shipped.

  FIG. 2 is an exploded perspective view illustrating a schematic configuration of the packing bodies 2A and 2B.

  The packaging bodies 2 </ b> A and 2 </ b> B include an outer layer box 3, a plastic bag 4, and a plurality of film trays 5. The film tray 5 is a transport tray of the present invention, and a module (not shown) or a submodule (not shown) is mounted on the upper surface. The plurality of film trays 5 are stacked and stored in the plastic bag 4 in that state. The plastic bag 4 is stored in the outer box 3 with its mouth closed. The outer layer box 3 is sealed. In this way, the packing bodies 2A and 2B are configured by packing a plurality of modules or a plurality of submodules into one.

  3 is a development view of the film tray 5, FIG. 3B is a plan view of the film tray, FIG. 3A is a cross-sectional view taken along line AA in FIG. 3B, and FIG. It is CC sectional drawing in 3 (B).

  The film tray 5 is formed by molding a plastic film having a substantially constant thickness, and a total of eight article pair mounting chambers H are formed in an array of 4 columns and 2 rows from the top surface 10A to a recess. These article pair mounting chambers H have the same shape. Each article pair mounting chamber H has a point-symmetrical shape when viewed from above, with the Y direction along the array column as the long side and the X direction along the array row as the short side. The article pair mounting chamber H can mount two modules or sub modules side by side in the Y direction.

  The film tray 5 has a configuration in which the top surfaces 11A, 11B, 11C, 11D, 11E, and 11F are formed in order from the top surface 10A, and the top surface 11G is formed at the same depth as the top surface 11F. The back surfaces of the upper surface 11F and the upper surface 11G constitute the lowermost surface 10B of the film tray 5. The wall surface between the top surface 10A and the top surfaces 11A to 11G is formed with an inclination of about 5 ° from the vertically upward direction Z. This inclination makes it easy to insert and remove modules and submodules.

  The upper surface 11 </ b> A is located between the two article pair mounting chambers H arranged in the Y direction in the film tray 5. The upper surface 11B is located between each of the four article pair mounting chambers H arranged in the X direction in the film tray 5. The upper surface 11 </ b> C is located in each article pair mounting chamber H at a position that divides between two modules or submodules to be mounted, that is, in the center of each article pair mounting chamber H. The upper surface 11G is located at each end in the Y direction in each article pair mounting chamber H. The upper surface 11D is located between the upper surfaces 11G in the Y direction in each article pair mounting chamber H. The top surface 11D is formed in each article pair mounting chamber H in a point-symmetric shape with the center of the article pair mounting chamber H as the center, in this case, an S-shape with the Y direction facing upward. The upper surface 11E and the upper surface 11F are located in two rectangular regions sandwiched on both sides in the Y direction by an S-shaped upper surface 11D. The upper surface 11E and the upper surface 11F are formed in each article pair mounting chamber H in a point-symmetric arrangement with respect to the center of the article pair mounting chamber H. In addition, the upper surface 11F is formed in each article pair mounting chamber H in an H shape with the X direction facing upward here.

  Here, each article pair mounting chamber H has a configuration in which two spaces 12A, 12B, 12C, and 12D are arranged on both sides in the Y direction.

  The space portion 12A is the first concave portion of the present invention and is provided in the first region of the present invention. The first region is a region that overlaps the upper surface 11G, the upper surface 11D, the upper surface 11F, and the upper surface 11E on one end side of each article pair mounting chamber H when the film tray 5 is viewed from above. The space portion 12A includes a space on the uppermost surface 10A side from the upper surface 11D and a space on the lowermost surface 10B side from the upper surface 11C, and a space on the uppermost surface 10A side from the upper surface 11G and on the lowermost surface 10B side. Has been.

  The space portion 12B is the second concave portion of the present invention and is provided in the second region of the present invention. The second region is a region overlapping the upper surface 11F and the upper surface 11E on one end side of each article pair mounting chamber H when the film tray 5 is viewed from above. This second region is included inside the first region. The space portion 12B is configured by a space on the uppermost surface 10A side with respect to the upper surface 11E and on the lowermost surface 10B side with respect to the upper surface 11D.

  The space portion 12C is the third concave portion of the present invention, and is provided in the fourth region of the present invention. The fourth region is a region overlapping the upper surface 11F. This fourth region is included inside the second region. The space portion 12C is configured as a space on the uppermost surface 10A side with respect to the upper surface 11F and on the lowermost surface 10B side with respect to the upper surface 11E.

  The space portion 12D is the first convex portion of the present invention, and is provided in the third region of the present invention. The third region is provided point-symmetrically in two rectangular regions sandwiched on both sides in the Y direction by the upper surface 11F of the upper surface 11E. This third region is included inside the second region. The space 12D is configured by a space on the uppermost surface 10A side from the lowermost surface 10B and on the lowermost surface 10B side from the rear surface of the upper surface 11E.

  FIG. 4A is a plan view illustrating the schematic configuration of the submodule, and FIG. 4B is a side view illustrating the schematic configuration of the submodule. FIG. 5 is a plan view of a state in which the submodule is mounted on the film tray 5.

  The sub module 20 includes a sub substrate 21, a top surface member 22, a projecting member 23, a bottom surface member 24, and lead wires 25A and 25B. The sub-board 21 is provided with a bottom member 24 on the bottom surface and a top member 22 and a protruding member 23 on the top surface. The bottom surface member 24 corresponds to the bottom surface portion of the present invention, and the bottom surface has a substantially constant height from the sub-board 21. The top surface member 22 corresponds to the top surface portion of the present invention, and the top surface has a certain height from the sub-board 21. The protruding member 23 corresponds to the protruding portion of the present invention, and protrudes upward from the top surface member 22. The lead wire 25A is drawn out from the sub-board 21, and the lead wire 25B is drawn out from the top surface member 22, and each is routed so as to protrude from a specific end (input / output end) of the sub-board 21.

  When the package of the submodule 20 is configured, the space portion 12B of the film tray 5 is a space for accommodating the submodule 20 as shown in FIG.

  In the present embodiment, since the lead wires 25A and 25B protrude from the sub-board 21 in the sub-module 20, in order to increase the ratio of the area occupied by the sub-module 20 in the film tray 5, the input / output ends of the sub-module 20 are connected to the article. Lead wires 25 </ b> A and 25 </ b> B are arranged on the side of the submodule 20 to be paired toward the center of the mounting chamber H.

  FIG. 6A is a plan view illustrating the schematic configuration of the module, and FIG. 6B is a side view illustrating the schematic configuration of the module. FIG. 7 is a plan view of the module mounted on the film tray 5.

  The module 30 includes a housing 31, an input / output unit 32, and a sub module 20. The housing 31 corresponds to the bottom surface portion of the present invention. The sub module 20 is mounted on the housing 31. The top surface member 22 and the projecting member 23 of the submodule 20 project from the housing 31 to form the top surface and the projecting portion of the module 30 of the present invention. The lead wires 25A and 25B are routed to the input / output unit 32 provided at one end (input / output end) of the casing 31.

  When the package of the module 30 is configured, the space portion 12 </ b> A of the film tray 5 is a space for housing the module 30 as shown in FIG. 7.

  In the present embodiment, the size of the input / output end side of the module 30 is larger than that of the submodule 20 by the amount of the formation area of the input / output unit 32 in the module 30. Therefore, in order to mount the module 30 on the film tray without shifting the arrangement position of the projecting member 23 and the top surface member 22 on the film tray from the case of the submodule 20, The direction is opposite to the direction of the input / output end of the submodule 20 in the package. That is, the direction of arrangement of the projecting member 23 and the top surface member 22 is reversed between the module package and the sub-module package. Therefore, in the above-mentioned film tray 5, the top view shape of the upper surface 11F is made point-symmetric.

  FIG. 8A is a partial cross-sectional view of a sub-module package.

  In the sub-module package, the first sub-module 20A is disposed above the first film tray 5A. The second film tray 5B is disposed above the first submodule 20A. The second submodule 20B is disposed above the second film tray 5B. The film trays 5A and 5B have the same configuration as the above-described film tray 5, and the sub modules 20A and 20B have the same configuration as the above-described sub module 20.

  In a state where the submodule 20A is mounted on the film tray 5A, the bottom member 24 of the submodule 20A contacts the inside of the space portion 12B of the film tray 5A, and the sub board 21 of the submodule 20A is inside the space portion 12A of the film tray 5A. To touch.

  In a state where the film tray 5B is mounted on the submodule 20A, the upper surface of the top surface member 22 of the submodule 20A is in contact with the lower surface of the space portion 12C of the film tray 5B, and the protruding member 23 of the submodule 20A is the space of the film tray 5B. It arrange | positions inside the part 12D.

  In a state where the submodule 20B is mounted on the film tray 5B, the bottom member 24 of the submodule 20B contacts the inside of the space portion 12B of the film tray 5B, and the sub-board 21 of the submodule 20B is inside the space portion 12A of the film tray 5B. To touch.

  Thus, the bottom members 24 of the submodules 20A and 20B can be mounted in the space 12B of the film trays 5A and 5B, and the film trays 5A and 5B can be used for packing the submodules 20A and 20B. At that time, the space portion 12C of the film tray 5B functions as a space for buffering the submodules 20A and 20B stacked vertically. Therefore, in this packing body, it can prevent that submodule 20A, 20B contacts via the film tray 5B, and can prevent damage of both. Further, since the projecting member 23 of the submodule 20A is disposed inside the space 12D of the film tray 5B, the space utilization efficiency in the stacking direction of the film tray 5B and the submodule 20A can be enhanced.

  FIG. 8B is a partial cross-sectional view of the module package.

  In the module package, the first module 30A is arranged above the first film tray 5A. The second film tray 5B is disposed above the first module 30A. The second module 30B is disposed above the second film tray 5B. The modules 30A and 30B have the same configuration as the module 30 described above.

  In a state where the module 30A is mounted on the film tray 5A, the housing 31 of the module 30A comes into contact with the inside of the space portion 12A of the film tray 5A.

  When the film tray 5B is mounted on the module 30A, the upper surface of the top surface member 22 of the module 30A is in contact with the lower surface of the space portion 12C of the film tray 5B, and the protruding member 23 of the module 30A is inside the space portion 12D of the film tray 5B. Placed in.

  In a state where the module 30B is mounted on the film tray 5B, the casing 31 of the module 30B contacts the inside of the space portion 12A of the film tray 5B.

  Thus, the housings 31 of the modules 30A and 30B can be mounted in the space 12A of the film trays 5A and 5B, and the film trays 5A and 5B can be used for packing the modules 30A and 30B. At that time, the space portion 12C of the film tray 5B functions as a space for buffering the modules 30A and 30B stacked one above the other. Therefore, in this packing body, it can prevent that module 30A, 30B contacts via the film tray 5B, and can prevent damage of both. Moreover, since the projecting member 23 of the module 30A is disposed inside the space portion 12D of the film tray 5B, the space utilization efficiency in the stacking direction of the film tray 5B and the module 30A can be enhanced.

DESCRIPTION OF SYMBOLS 1A ... Submodule manufacturing factory 1B ... Module manufacturing factory 1C ... Final product manufacturing factory 2A, 2B ... Package 3 ... Outer box 4 ... Plastic bag 5, 5A, 5B ... Film tray 10A ... Top surface 10B ... Bottom surface 11A, 11B , 11C, 11D, 11E, 11F, 11G ... upper surface 12A, 12B, 12C, 12D ... space 20, 20A, 20B ... sub-module 21 ... sub-board 22 ... top surface member 23 ... protruding member 24 ... bottom surface member 25A, 25B ... Lead wire 30, 30A, 30B ... Module 31 ... Housing 32 ... Input / output unit H ... Article pair mounting chamber

Claims (4)

A transport tray that is shared at the time of shipping the submodule and at the time of shipping the module configured to incorporate the submodule,
The transport tray includes a first recess provided in a first area, a second recess provided in a second area included in the first area, and a third recess included in the second area. A first protrusion provided in the region,
The first recess has a shape in which the submodule contacts the inside when the submodule is stacked on the upper side,
The second recess is shaped so that the module contacts the inside when the module is stacked on the upper side,
The first convex portion has a shape in which a part of the module or the submodule is disposed inside when being stacked on the upper side of the module or the submodule.
Transport tray.   The transport tray according to claim 1, wherein the transport tray includes a third recess in a fourth region included in the second region together with the third region.   The said transport tray is the structure which has arrange | positioned one set of the said 1st recessed part, the said 2nd recessed part, and the said 1st convex part point-symmetrically with another set. Transport tray. At the time of shipping the sub-module and the module, comprising a bottom surface portion, a top surface portion arranged on the upper side of the bottom surface portion, and a projecting portion protruding above the top surface portion,
A first recess provided in the first region, a second recess provided in the second region included in the first region, and a third region provided in the third region. 1 is a shipping method for sharing a transportation tray comprising a convex portion,
A sub-module delivery step in which a package of sub-modules configured by packing a plurality of sub-modules and a plurality of transport trays in a stacked state is delivered;
A module assembly step of configuring the module by incorporating the submodule taken out from the package of the submodule;
A module packing step of packing a plurality of the modules and a plurality of the transport trays in a stacked state to form a package of modules;
A module shipping step of shipping the package of the module;
Have
The submodule delivery step includes:
Stacking the first submodule on the first transport tray by bringing the bottom portion of the first submodule into contact with the inside of the second recess of the first transport tray;
The second transport tray is brought into contact with the top surface portion of the first submodule while disposing the protruding portion of the first submodule inside the first convex portion of the second transport tray, Stacking a second transport tray on one sub-module,
With the bottom surface portion of the second submodule in contact with the inside of the second recess of the second transport tray, the second submodule is stacked on the second transport tray,
The package of the submodule is delivered,
The module packing step includes:
Stacking the first module on the first transport tray by bringing the bottom surface of the first module into contact with the inside of the first recess of the first transport tray;
The second transport tray is brought into contact with the top surface portion of the first module while the projecting portion of the first module is disposed inside the first convex portion of the second transport tray. Stack the second transport tray on the module,
With the bottom surface of the second module in contact with the inside of the first recess of the second transport tray, the second module is stacked on the second transport tray.
Constituting a package of the module;
shipping method.

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