JP2010234499A - Apparatus and method for forming coating film - Google Patents

Apparatus and method for forming coating film Download PDF

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JP2010234499A
JP2010234499A JP2009087122A JP2009087122A JP2010234499A JP 2010234499 A JP2010234499 A JP 2010234499A JP 2009087122 A JP2009087122 A JP 2009087122A JP 2009087122 A JP2009087122 A JP 2009087122A JP 2010234499 A JP2010234499 A JP 2010234499A
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electrolytic solution
film forming
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JP5358252B2 (en
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Takeo Sakashita
武雄 坂下
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Dowa Thermotech Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a coating film in which the time for attaching/detaching a workpiece to/from a workpiece holding jig and time for surface treatment of the workpiece are shortened and formation of the coating film onto a surface of the workpiece is efficiently performed by continuously performing the surface treatment of the workpiece and the formation of the coating film onto the surface of the workpiece in one process with one device. <P>SOLUTION: In the apparatus for forming the coating film, the surface treatment is applied to the workpiece supported in a treatment chamber to impart compressive residual stress to the workpiece and the coating film is formed on the workpiece. The apparatus includes a surface treatment mechanism movable along the workpiece to spray electrolytic solution containing projection material to the surface of the workpiece with high pressure and impart the compressive residual stress, and a coating film forming mechanism movable along the workpiece to spray the electrolytic solution to the surface of the workpiece with low pressure and form the coating film. The workpiece is electrically connected to a power source in a positive electrode side, and an electrode of the coating film forming mechanism is electrically connected to the power source in a negative electrode side. Respective jet nozzles of the surface treatment mechanism and jet nozzles of the coating film forming mechanism are concentrically arranged. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えば歯車等のワーク(被加工材)に対して圧縮残留応力を付与する表面処理を行い、かつ皮膜形成を行う皮膜形成装置および皮膜形成方法に関する。   The present invention relates to a film forming apparatus and a film forming method for performing a surface treatment for applying a compressive residual stress to a work (workpiece) such as a gear and forming a film.

例えば、ギア類、ベアリング類、各種のピン、ピボット類、ピストンやシリンダー類等の、相手方の金属部材の表面と摺動面において接して動くワークでは、潤滑油の存在下でも異常摩耗と焼付きが問題となる。この問題を軽減させるための手段として、ショットピーニング等のピーニング処理を施すことによって残留圧縮応力を導入し、ワークの疲労強度を改善する方法が知られており、また、ワーク(特に摺動面)の表面に硫化鉄系、硫化モリブデン系、硫化タングステン系等の硫化物系固体潤滑膜を形成する方法が知られている。   For example, for workpieces that move in contact with the surface of the other metal member, such as gears, bearings, various pins, pivots, pistons, cylinders, etc., in the presence of lubricating oil, abnormal wear and seizure Is a problem. As a means to alleviate this problem, a method is known in which residual compressive stress is introduced by performing peening treatment such as shot peening to improve the fatigue strength of the workpiece, and the workpiece (especially the sliding surface). There is known a method of forming a sulfide-based solid lubricating film such as iron sulfide-based, molybdenum sulfide-based, or tungsten sulfide-based on the surface thereof.

特許文献1、2には、ワークの金属材料疲労強度の改善方法として、ワーク表面に微細なショットを投射して材料強度を高めるショットピーニング方法が開示されている。このピーニング方法によれば、未処理エリアの発生を防いで効率的なピーニング処理を行うことができ、ワークの品質を向上させることが可能となる。また、特許文献3には、ワークの表面処理とともにその洗浄を行うことが可能な処理方法、処理装置が記載されている。   Patent Documents 1 and 2 disclose a shot peening method for projecting a fine shot on a work surface to increase the material strength as a method for improving the metal material fatigue strength of the work. According to this peening method, generation of unprocessed areas can be prevented and efficient peening processing can be performed, and the quality of the workpiece can be improved. Further, Patent Document 3 describes a processing method and a processing apparatus that can perform cleaning along with surface treatment of a workpiece.

また、特許文献4、5には、摺動面に硫化物系固体潤滑膜を形成する等の硫化処理を行った摺動部材およびその製法が開示されている。特許文献1に記載の発明によれば、作業性のよく、安価な硫化物系固体潤滑膜を有する耐焼付き性の優れた摺動部材が提供される。   Patent Documents 4 and 5 disclose a sliding member that has undergone a sulfurization treatment such as forming a sulfide-based solid lubricating film on the sliding surface, and a method for manufacturing the same. According to the invention described in Patent Document 1, there is provided a sliding member having good workability and excellent seizure resistance having an inexpensive sulfide-based solid lubricating film.

特開平8−155836号公報JP-A-8-155836 特開2002−326161号公報JP 2002-326161 A 特開2003−62492号公報JP 2003-62492 A 特開2001−115177号公報JP 2001-115177 A 特開平11−302897号公報Japanese Patent Laid-Open No. 11-302897

しかしながら、従来、上記特許文献1〜3に記載されるワークの表面処理を行う工程と、上記特許文献4、5に記載のワーク摺動面に硫化物系固体潤滑膜を形成する工程とは、別々の工程として行われ、各処理を行う装置やワーク保持治具も異なったもので行われていた。この場合、ワークの表面処理と、硫化物系固体潤滑膜を形成する工程を連続的には行えず、ワーク保持治具に対しワークを着脱するための時間が個々にかかる等により処理時間が長時間となってしまうという問題点があった。さらに、各処理を行う装置とワーク保持治具が別々であるため、それら装置の設置スペースや設備コストならびにワーク保持治具コストの増大といった問題点があった。   However, conventionally, the step of performing the surface treatment of the workpiece described in Patent Literatures 1 to 3 and the step of forming a sulfide-based solid lubricant film on the workpiece sliding surface described in Patent Literatures 4 and 5 It was performed as a separate process, and the apparatus and workpiece holding jig for performing each process were performed with different ones. In this case, the surface treatment of the workpiece and the step of forming the sulfide-based solid lubricating film cannot be performed continuously, and the processing time is long due to the individual time required to attach and detach the workpiece to and from the workpiece holding jig. There was a problem of time. Furthermore, since the apparatus for performing each process and the work holding jig are separate, there is a problem that the installation space and equipment cost of these apparatuses and the work holding jig cost increase.

また、摺動面を有するワークには様々な種類があるため、上述したように、複数の工程・装置を用いる場合、ワークの種類に応じてそのワーク保持治具を変更させる手間がかかりその作業効率や作業コストが問題となっていた。   In addition, since there are various types of workpieces having sliding surfaces, as described above, when using a plurality of processes / devices, it takes time and effort to change the workpiece holding jig according to the type of workpiece. Efficiency and work costs were issues.

そこで本発明の目的は、ワークの表面処理およびワーク表面への皮膜の形成を1つの装置でもって、1つの工程あるいは複数の工程を連続的に行うことにより、ワーク保持治具に対するワーク着脱時間や表面処理等の処理時間を短縮し、効率的にワークの表面処理およびワーク表面への皮膜形成を行うことにある。   Therefore, an object of the present invention is to perform workpiece surface treatment and formation of a film on the workpiece surface with a single apparatus, by continuously performing one step or a plurality of steps, thereby reducing the workpiece attachment / detachment time with respect to the workpiece holding jig. The object is to reduce the processing time for surface treatment, etc., and to efficiently perform surface treatment of the workpiece and film formation on the workpiece surface.

本発明によれば、処理室内に支持されるワークに圧縮残留応力を付与する表面処理を施し、前記ワークに皮膜形成を行う皮膜形成装置であって、前記ワークの表面に投射材入り電解液を高圧で噴射させ圧縮残留応力を付与する、前記ワークに沿って移動自在な表面処理機構と、前記ワークの表面に電解液を低圧で噴射させ皮膜を形成させる、前記ワークに沿って移動自在な皮膜形成機構とを備え、前記ワークは電源の陽極側に電気的に接続し、前記皮膜形成機構の電極は電源の陰極側に電気的に接続し、前記表面処理機構の噴射口と前記皮膜形成機構の噴射口は同心状に配置される、皮膜形成装置が提供される。   According to the present invention, there is provided a film forming apparatus that performs a surface treatment for imparting compressive residual stress to a work supported in a processing chamber, and forms a film on the work. A surface treatment mechanism that is sprayed at a high pressure to impart compressive residual stress, and is movable along the workpiece, and a coating that is movable along the workpiece is formed by spraying an electrolyte on the surface of the workpiece at a low pressure. A work mechanism, the work is electrically connected to the anode side of the power supply, the electrode of the film forming mechanism is electrically connected to the cathode side of the power supply, the spray port of the surface treatment mechanism and the film formation mechanism A film forming apparatus is provided in which the nozzles are arranged concentrically.

前記投射材入り電解液および前記電解液は、前記処理室下部の貯留部に分けて貯留され、前記投射材入り電解液および前記電解液は同軸方向に向けて前記投射材入り電解液の周囲を前記電解液が取り囲むように噴出され、前記投射材入り電解液は0.1MPa〜300MPaで噴射され、前記電解液は0.01MPa〜1MPaで噴射される。また、前記表面処理機構と前記皮膜形成機構は一体的に移動し、前記ワークは鉄または鉄合金からなり、前記皮膜形成機構によって形成される皮膜は硫化物系固体潤滑膜である。   The electrolytic solution containing the projection material and the electrolytic solution are stored separately in a storage portion at the lower part of the processing chamber, and the electrolytic solution containing the projection material and the electrolytic solution are disposed around the electrolytic solution containing the projection material in the coaxial direction. The electrolytic solution is ejected so as to surround it, the electrolytic solution containing a projection material is injected at 0.1 MPa to 300 MPa, and the electrolytic solution is injected at 0.01 MPa to 1 MPa. Further, the surface treatment mechanism and the film forming mechanism move integrally, the workpiece is made of iron or an iron alloy, and the film formed by the film forming mechanism is a sulfide-based solid lubricating film.

また、別の観点からの本発明によれば、ワークに皮膜を形成させる皮膜形成方法であって、正に帯電し、回転する前記ワークに投射材入り電解液を高圧で噴射するとともに、前記投射材入り電解液と同心状に、負に帯電する電解液を前記ワークに低圧で噴射する、皮膜形成方法が提供される。   According to another aspect of the present invention, there is provided a film forming method for forming a film on a workpiece, which is positively charged and sprays an electrolytic solution containing a projectile material onto the rotating workpiece at a high pressure, and the projection A film forming method is provided in which a negatively charged electrolytic solution is sprayed onto the workpiece at a low pressure concentrically with a material-containing electrolytic solution.

前記投射材入り電解液および前記電解液は同軸方向に向けて前記投射材入り電解液の周囲を前記電解液が取り囲むように噴出され、前記投射材入り電解液は0.1MPa〜300MPaで噴射され、前記電解液は0.01MPa〜1MPaで噴射される。また、前記ワークは鉄または鉄合金からなり、前記皮膜形成機構によって形成される皮膜は硫化物系固体潤滑膜である。   The electrolytic solution containing the projecting material and the electrolytic solution are ejected in a coaxial direction so that the electrolytic solution surrounds the electrolytic solution containing the projecting material, and the electrolytic solution containing the projecting material is injected at 0.1 MPa to 300 MPa. The electrolyte is injected at 0.01 MPa to 1 MPa. The workpiece is made of iron or an iron alloy, and the film formed by the film forming mechanism is a sulfide-based solid lubricating film.

本発明によれば、ワークの表面処理およびワーク表面への皮膜の形成を1つの装置でもって、1つの工程あるいは複数の工程を連続的に行うことにより、ワーク保持治具に対するワークの着脱時間や表面処理等の処理時間を短縮し、効率的にワークの表面処理およびワーク表面への皮膜形成を行うことができる。   According to the present invention, the surface treatment of a workpiece and the formation of a film on the workpiece surface can be performed with one apparatus, and by continuously performing one process or a plurality of processes, Processing time such as surface treatment can be shortened, and surface treatment of the workpiece and film formation on the workpiece surface can be efficiently performed.

皮膜形成装置1を側方から見た断面図である。It is sectional drawing which looked at the film formation apparatus 1 from the side.

以下、本発明の実施の形態について図面を参照して説明する。なお、本明細書および図面において、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重複説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

図1は本発明にかかる皮膜形成装置1を側方から見た断面図である。皮膜形成装置1は、上部の処理室10と、処理室10の下部に設置される投射材入り電解液Aを貯留する貯留部12および電解液Bを貯留する貯留部13から構成される。また、貯留部12と貯留部13は仕切り板11によって仕切られており、貯留部13から貯留部12にのみ電解液がオーバーフロー可能な構成となっている。ここで、処理室10と各貯留容器12、13とは電気絶縁体14を介して結合されている。処理室10の内部にはワーク15を取り付けたワーク保持治具16を載せる載置台17が設置され、例えば鉄または鉄合金の歯車等である複数のワーク15が垂直(図1中上下方向)にワーク保持治具16に取り付けられ、載置台17上に設置されている。ここで、ワーク15の摺動面である皮膜形成対象面が外周面となるように複数のワーク15は処理室10内に堆積される。また、載置台17には図示しない例えばモーター等で駆動する回転機構が備えられ、回転自在である載置台17の回転に伴って、複数のワーク15は水平方向に回転自在となっている。なお、載置台17およびワーク15は随時回転していてもよいが、より好ましくは、表面処理時と皮膜形成時のみに回転動作が行われる。   FIG. 1 is a sectional view of a film forming apparatus 1 according to the present invention as seen from the side. The film forming apparatus 1 includes an upper processing chamber 10, a storage portion 12 that stores a projection material-containing electrolytic solution A and a storage portion 13 that stores an electrolytic solution B, which are installed in the lower portion of the processing chamber 10. Moreover, the storage part 12 and the storage part 13 are partitioned off by the partition plate 11, and the electrolyte solution can overflow only from the storage part 13 to the storage part 12. Here, the processing chamber 10 and the storage containers 12 and 13 are coupled via an electrical insulator 14. Inside the processing chamber 10 is placed a mounting table 17 on which a workpiece holding jig 16 with a workpiece 15 attached is placed, and a plurality of workpieces 15 such as iron or iron alloy gears are vertically (in the vertical direction in FIG. 1). It is attached to the work holding jig 16 and installed on the mounting table 17. Here, the plurality of workpieces 15 are deposited in the processing chamber 10 so that the film formation target surface, which is the sliding surface of the workpiece 15, becomes the outer peripheral surface. Further, the mounting table 17 is provided with a rotation mechanism (not shown) that is driven by a motor or the like, and the plurality of workpieces 15 are rotatable in the horizontal direction as the mounting table 17 rotates. The mounting table 17 and the workpiece 15 may be rotated at any time, but more preferably, the rotating operation is performed only during the surface treatment and the film formation.

処理室10内部には、表面処理機構20および皮膜形成機構30が配置されている。図1に示すように、表面処理機構20は皮膜形成機構30に囲まれるように、その内部に配置される。ここで、表面処理機構20および皮膜形成機構30は図示しない昇降機構によって処理室10内において昇降自在となっており、その昇降は一体的に行われる。また、表面処理機構20には噴射口21が、皮膜形成機構30には噴射口31がそれぞれ設けられており、噴射口21および噴射口31は常時ワーク15の外周面に対向しており、上記表面処理機構20および皮膜形成機構30の昇降は、噴射口21および噴射口31がワーク15の外周面に対向する範囲内で行われる。   A surface treatment mechanism 20 and a film formation mechanism 30 are disposed inside the processing chamber 10. As shown in FIG. 1, the surface treatment mechanism 20 is disposed inside the film formation mechanism 30 so as to be surrounded by the film formation mechanism 30. Here, the surface treatment mechanism 20 and the film formation mechanism 30 can be moved up and down in the processing chamber 10 by a lifting mechanism (not shown), and the lifting and lowering is performed integrally. Further, the surface treatment mechanism 20 is provided with an injection port 21, and the film formation mechanism 30 is provided with an injection port 31. The injection port 21 and the injection port 31 are always opposed to the outer peripheral surface of the workpiece 15, and The surface treatment mechanism 20 and the film forming mechanism 30 are moved up and down within a range where the injection port 21 and the injection port 31 face the outer peripheral surface of the workpiece 15.

表面処理機構20は、連通路22および混合機構25を介し、処理室10下方に配置され電解液Bが貯留されている貯留部13に連通している。ここで、連通路22には、高圧ポンプ23が取り付けられ、高圧ポンプ23の稼動により貯留部13から電解液Bが表面処理機構20に設けられている混合機構25へ導入される。また、表面処理機構20は、連通路26および混合機構25を介し、処理室10下方に配置され投射材入り電解液Aが貯留されている貯留部12とも連通している。連通路26には低圧ポンプ27が取り付けられ、低圧ポンプ27の稼動により貯留部12から投射材入り電解液Aが表面処理機構20に設けられている混合機構25へ導入される。混合機構25において投射材入り電解液Aと電解液Bが混合され、投射材入り電解液Aと電解液Bが混合された混合電解液(即ち、投射材入り電解液)が表面処理機構20の噴射口21からワーク15に対し高圧で噴射される構成となっている。上述したように、噴射口21はワーク15の外周面に対向しているため、前記混合電解液(即ち、投射材入り電解液)はワーク15の外周面に高圧で噴射される。そして、ワーク15外周面に噴射された後、前記混合電解液は落下し貯留部12に集められる。   The surface treatment mechanism 20 communicates with the storage unit 13 disposed below the processing chamber 10 and storing the electrolytic solution B through the communication path 22 and the mixing mechanism 25. Here, the high-pressure pump 23 is attached to the communication path 22, and the electrolytic solution B is introduced from the storage unit 13 to the mixing mechanism 25 provided in the surface treatment mechanism 20 by the operation of the high-pressure pump 23. Further, the surface treatment mechanism 20 communicates with the storage unit 12 disposed below the processing chamber 10 and storing the electrolytic solution A containing the projection material through the communication path 26 and the mixing mechanism 25. A low-pressure pump 27 is attached to the communication path 26, and the operation of the low-pressure pump 27 introduces the projection material-containing electrolyte A from the reservoir 12 into the mixing mechanism 25 provided in the surface treatment mechanism 20. In the mixing mechanism 25, the electrolytic solution A and the electrolytic solution B containing the projecting material are mixed, and the mixed electrolytic solution (that is, the electrolytic solution containing the projecting material) obtained by mixing the electrolytic solution A and the electrolytic solution B containing the projecting material is the surface treatment mechanism 20. The structure is such that high pressure is injected from the injection port 21 to the work 15. As described above, since the injection port 21 faces the outer peripheral surface of the work 15, the mixed electrolytic solution (that is, the electrolytic solution containing a projection material) is injected to the outer peripheral surface of the work 15 at a high pressure. Then, after being injected onto the outer peripheral surface of the work 15, the mixed electrolyte falls and is collected in the storage unit 12.

また、貯留部12および連通路28にはサイクロン40が接続されており、サイクロン40には貯留部41が接続される。ここで、サイクロン40は、貯留部12内の投射材入り電解液Aに含まれている投射材を分球するための装置である。投射材入り電解液Aをワーク15に噴射させると、投射材がワーク15と衝突するため、投射材の粒径が小さくなる、あるいは投射材が砕ける等の現象が起こる。これら不良形状となった投射材は、サイクロン40において除去され、再利用可能な投射材入り電解液Aのみが貯留部12に戻され貯留される。また、それ以外の電解液A(基本的には投射材の入っていない電解液A、ただし投射材の粒径が小さくなる、あるいは投射材の砕けてつかえないものが入った電解液Aも含まれる)は貯留部41に貯留される。   A cyclone 40 is connected to the reservoir 12 and the communication path 28, and a reservoir 41 is connected to the cyclone 40. Here, the cyclone 40 is a device for dividing the projection material contained in the electrolyte solution A containing the projection material in the reservoir 12. When the electrolytic solution A containing the projecting material is sprayed onto the work 15, the projecting material collides with the work 15, so that a phenomenon such as a decrease in the particle size of the projecting material or a breakage of the projecting material occurs. The projection material having such a defective shape is removed in the cyclone 40, and only the reusable electrolyte A containing the projection material is returned to the storage unit 12 and stored. In addition, other electrolyte solutions A (basically electrolyte solution A containing no projection material, but also electrolyte solution A containing a projection material with a smaller particle size or a projection material that cannot be crushed are included. Is stored in the storage unit 41.

一方、皮膜形成機構30は、連通路32を介し、処理室10下方に配置され、電解液Bが貯留されている貯留部13に連通している。ここで、連通路32には、低圧ポンプ33が取り付けられ、低圧ポンプ33の稼動により貯留部13から電解液Bが皮膜形成機構30へ導入され、皮膜形成機構30の噴射口31から電解液Bが噴射される構成となっている。噴射口31はワーク15の外周面に対向しているため、電解液Bはワーク15の外周面に低圧で噴射される。そして、電解液Bはワーク15の外周面に噴射された後、落下して貯留部12に集められる。   On the other hand, the film forming mechanism 30 is disposed below the processing chamber 10 via the communication path 32 and communicates with the storage unit 13 in which the electrolytic solution B is stored. Here, a low pressure pump 33 is attached to the communication path 32, and the electrolytic solution B is introduced from the reservoir 13 to the film forming mechanism 30 by the operation of the low pressure pump 33, and the electrolytic solution B is injected from the injection port 31 of the film forming mechanism 30. Is configured to be injected. Since the injection port 31 faces the outer peripheral surface of the work 15, the electrolytic solution B is injected onto the outer peripheral surface of the work 15 at a low pressure. Then, the electrolytic solution B is sprayed on the outer peripheral surface of the work 15 and then falls and is collected in the storage unit 12.

また、連通路32にはフィルター35が設置されている。フィルター35は、貯留部13内の電解液Bに混入してしまった投射材や表面処理時に発生するワーク15からの脱落粒子(バリ等)や皮膜形成反応により生成する不溶性スラッジ等を除去するために取り付けられている。フィルター35において、電解液Bから上記脱落粒子や不溶性スタッツを濾過し除去することにより、これらによる皮膜形成機構30の損傷や損耗を防止することが可能となる。 A filter 35 is installed in the communication path 32. The filter 35 removes the projection material mixed in the electrolytic solution B in the storage unit 13, falling particles (such as burrs) from the work 15 generated during the surface treatment, insoluble sludge generated by the film formation reaction, and the like. Is attached. In the filter 35, the falling particles and the insoluble stats are filtered and removed from the electrolytic solution B, thereby preventing the film forming mechanism 30 from being damaged or worn out.

高圧ポンプ23の吐出圧は0.1MPa以上(数百MPaまでの高圧ポンプが使用可能となるが、5MPa〜300MPa程度が常用範囲)であり、より好ましくは25MPa〜100MPaである。また、低圧ポンプ27の吐出圧は0.05MPa以上(数MPaまでの低圧ポンプが使用可能となるが、0.1MPa〜0.5MPa程度が常用範囲)であり、好ましくは0.05MPa〜0.35MPaである。低圧ポンプ33の吐出圧は0.01MPa以上(数MPaまでの低圧ポンプが使用可能となるが、0.1MPa〜1MPa程度が常用範囲)であり、好ましくは0.15MPa〜0.5MPaである。ここで、高圧ポンプ23および低圧ポンプ33の吐出圧は、前述した圧力の範囲内において、処理対象のワーク15の材質および前処理、ならびに使用条件に応じて、ワーク15表面に付与する圧縮残留応力とその分布を好適に得られる吐出圧を選定することが望ましい。 The discharge pressure of the high-pressure pump 23 is 0.1 MPa or more (high-pressure pumps up to several hundred MPa can be used, but the normal range is about 5 MPa to 300 MPa), and more preferably 25 MPa to 100 MPa. Further, the discharge pressure of the low-pressure pump 27 is 0.05 MPa or more (a low-pressure pump up to several MPa can be used, but about 0.1 MPa to 0.5 MPa is a normal range), preferably 0.05 MPa to 0.00. 35 MPa. The discharge pressure of the low-pressure pump 33 is 0.01 MPa or more (a low-pressure pump up to several MPa can be used, but about 0.1 MPa to 1 MPa is a normal range), preferably 0.15 MPa to 0.5 MPa. Here, the discharge pressures of the high-pressure pump 23 and the low-pressure pump 33 are the compressive residual stress applied to the surface of the work 15 in accordance with the material and pretreatment of the work 15 to be processed and the use conditions within the above-described pressure range. It is desirable to select a discharge pressure that suitably obtains the distribution.

また、皮膜形成機構30の内周部には電極60が設置されており、電極60は処理室10外部に備えられる例えばDC電源である電源62の陰極側と電気的に接続している。そのため、電源62の稼動により皮膜形成機構30内部に導入された電解液Bは負に帯電する。一方、ワーク保持治具16は電源62の陽極側と電気的に接続しており、電源62の稼動によりワーク保持治具16上に保持されるワーク15は正に帯電する。   In addition, an electrode 60 is provided on the inner periphery of the film forming mechanism 30, and the electrode 60 is electrically connected to the cathode side of a power source 62, for example, a DC power source provided outside the processing chamber 10. Therefore, the electrolytic solution B introduced into the film forming mechanism 30 by the operation of the power supply 62 is negatively charged. On the other hand, the work holding jig 16 is electrically connected to the anode side of the power supply 62, and the work 15 held on the work holding jig 16 is positively charged by the operation of the power supply 62.

貯留部12にはアルカリ金属もしくはアルカリ土類金属のチオシアン酸塩またはチオ硫酸塩の一種または二種以上を溶解した水溶液に1〜50vol%の投射材が含まれる投射材入り電解液Aが貯留される。投射材の種類としては、例えば電解液と反応しない粒径5〜300μmのアルミナが例示されるが、ワーク15の材質および前処理ならびに使用条件に対応しワーク15表面に付与する圧縮残留応力とその分布を得るのに好適な投射材を選定すればよい。また、貯留部13は、仕切り板11を挟んで貯留部12に隣接し、貯留部13には投射材を含まないアルカリ金属もしくはアルカリ土類金属のチオシアン酸塩またはチオ硫酸塩の一種または二種以上を溶解した水溶液である電解液Bが貯留されている。   The reservoir 12 stores a projection material-containing electrolyte A containing 1 to 50 vol% of a projection material in an aqueous solution in which one or more of thiocyanate or thiosulfate of an alkali metal or alkaline earth metal is dissolved. The Examples of the type of the projecting material include alumina having a particle size of 5 to 300 μm that does not react with the electrolytic solution, and the compressive residual stress applied to the surface of the work 15 corresponding to the material and pretreatment and use conditions of the work 15 and its A projection material suitable for obtaining the distribution may be selected. Further, the storage unit 13 is adjacent to the storage unit 12 with the partition plate 11 interposed therebetween, and the storage unit 13 includes one or two kinds of alkali metal or alkaline earth metal thiocyanate or thiosulfate that does not include a projection material. The electrolytic solution B which is an aqueous solution in which the above is dissolved is stored.

一方、貯留部41と貯留部13は供給路65を介して連通しており、貯留部41に貯留された投射材を含まない電解液が貯留部13へ供給される。ここで、貯留部41には図示しないPh計、電磁濃度計、温度計、フィルター等が設置されており、貯留部13にはこれらPh計、電磁濃度計、温度計によって再利用可能と判断された電解液を供給する。また、投射材は貯留部12に直接投入され、貯留部12において電解液と混合され投射材入り電解液Aとなる。   On the other hand, the storage part 41 and the storage part 13 are connected via the supply path 65, and the electrolyte solution which does not contain the projection material stored by the storage part 41 is supplied to the storage part 13. Here, a Ph meter, an electromagnetic concentration meter, a thermometer, a filter, and the like (not shown) are installed in the storage unit 41, and it is determined that the storage unit 13 can be reused by these Ph meter, electromagnetic concentration meter, and thermometer. Supply the electrolyte. Moreover, a projection material is directly injected | thrown-in to the storage part 12, is mixed with electrolyte solution in the storage part 12, and becomes the electrolyte solution A containing a projection material.

以上説明したように構成される皮膜形成装置1において、ワーク15への表面処理および皮膜形成が行われる。貯留部12に貯留される投射材入り電解液Aは、投射材が入っているため高圧ポンプ23を使用して表面処理に好適な吐出圧力までの加圧には適さない。そのため、低圧ポンプ27の稼動により連通路26を介し混合機構25へ導入され、貯留部13に貯留される電解液Bには投射材が入っていないため高圧ポンプ23を使用して表面処理に好適な吐出圧力まで加圧可能であり、高圧ポンプ23の稼動により連通路22を介し混合機構25へ導入される。そして、投射材入り電解液Aと電解液Bが混合された混合電解液(即ち、投射材入り電解液)が噴射口21からワーク15に対し高圧で噴射される。混合電解液のワーク15外周面(摺動面)に対する高圧噴射により、従来より知られる、圧縮残留応力を付与するピーニング処理が行われ、ワーク15の疲労強度の向上が実現されることとなる。ここで、ワーク15は水平方向(図1中左右方向)に回転しているため、噴射口21からの混合電解液の噴射はワーク15外周面に均等に行われることとなる。さらに、表面処理機構20は、噴射口21がワーク15外周面に沿うように昇降しながら混合電解液をワーク15に噴射するため、複数堆積されたワーク15の何れにも均等に混合電解液が噴射される。従って、ワーク15の回転と表面処理機構20の昇降によって、複数堆積されたワーク15の外周面全てに均等に表面処理が施される。   In the film forming apparatus 1 configured as described above, surface treatment and film formation on the workpiece 15 are performed. Since the projection material-containing electrolyte A stored in the storage unit 12 contains the projection material, it is not suitable for pressurization up to a discharge pressure suitable for surface treatment using the high-pressure pump 23. Therefore, since the projecting material is not contained in the electrolytic solution B introduced into the mixing mechanism 25 through the communication path 26 by the operation of the low-pressure pump 27 and stored in the storage unit 13, it is suitable for surface treatment using the high-pressure pump 23. It is possible to pressurize to a proper discharge pressure and is introduced into the mixing mechanism 25 through the communication path 22 by the operation of the high-pressure pump 23. Then, a mixed electrolytic solution obtained by mixing the electrolytic solution A and the electrolytic solution B (that is, the electrolytic solution containing the projecting material) is injected from the injection port 21 to the work 15 at a high pressure. By the high-pressure injection of the mixed electrolytic solution onto the outer peripheral surface (sliding surface) of the work 15, a conventionally known peening process for imparting compressive residual stress is performed, and the fatigue strength of the work 15 is improved. Here, since the work 15 rotates in the horizontal direction (left and right direction in FIG. 1), the injection of the mixed electrolyte from the injection port 21 is performed uniformly on the outer peripheral surface of the work 15. Furthermore, since the surface treatment mechanism 20 injects the mixed electrolyte solution onto the work 15 while moving up and down so that the injection port 21 extends along the outer peripheral surface of the work 15, the mixed electrolyte solution is equally applied to any of the plurality of stacked workpieces 15. Be injected. Therefore, by rotating the workpiece 15 and raising / lowering the surface treatment mechanism 20, all the outer peripheral surfaces of the plurality of deposited workpieces 15 are uniformly surface-treated.

また、貯留部13に貯留される電解液Bは、低圧ポンプ33の稼動により連通路32を介し皮膜形成機構30へ導入され、噴射口31からワーク15に対し低圧で噴射される。ここで、上述したように、ワーク15は正に帯電、電極60は負に帯電している。そのため、電解液Bのワーク15を陽極とする電気化学反応によって、ワーク15の外周面(摺動面)には皮膜が形成される。ここで、この皮膜形成の一例である常温硫化プロセスについて以下に説明する。   Further, the electrolytic solution B stored in the storage unit 13 is introduced into the film forming mechanism 30 through the communication path 32 by the operation of the low pressure pump 33, and is injected from the injection port 31 to the workpiece 15 at a low pressure. Here, as described above, the workpiece 15 is positively charged and the electrode 60 is negatively charged. Therefore, a film is formed on the outer peripheral surface (sliding surface) of the work 15 by an electrochemical reaction using the work 15 of the electrolytic solution B as an anode. Here, a room temperature sulfidation process as an example of the film formation will be described below.

常温硫化プロセスとは、特許文献4、5に記載されたワーク摺動面に硫化物系固体潤滑膜を形成させる処理であり、硫黄を含むアルカリ金属塩の常温溶液中に被処理品(ワーク)を浸漬保持し、被処理品を陽極として、電気化学反応で被処理品表面に数μmの硫化鉄層を形成させる常温硫化処理技術である。被処理品を浸漬させる電解液としては主にアルカリ金属もしくはアルカリ土類金属のチオシアン酸塩またはチオ硫酸塩の一種または二種以上を溶解した水溶液が用いられる。これらの電解液を使用して常温硫化プロセスを行うことにより、鉄や鉄合金の表面に硫化鉄皮膜(硫化物系固体潤滑膜)を形成させることができる。また、常温硫化プロセスは室温処理であるため、焼入れ硬さ・ショットピーニング等によって得られる圧縮残留応力が維持され、熱による被処理品の歪み等を防止することができ、処理後の被処理品の硬さ等が担保される。すなわち本発明の前記投射材の噴射による表面処理により硬化された圧縮残留応力が維持されたまま、硫化鉄皮膜を形成することができる。   The room temperature sulfidation process is a process for forming a sulfide-based solid lubricating film on the workpiece sliding surface described in Patent Documents 4 and 5, and the article to be processed (work) in a room temperature solution of an alkali metal salt containing sulfur. Is a room temperature sulfidation treatment technique in which an iron sulfide layer having a thickness of several μm is formed on the surface of an article to be treated by an electrochemical reaction using the article to be treated as an anode. As the electrolytic solution for immersing the article to be treated, an aqueous solution in which one or more of thiocyanate or thiosulfate of alkali metal or alkaline earth metal is dissolved is mainly used. An iron sulfide film (sulfide-based solid lubricant film) can be formed on the surface of iron or an iron alloy by performing a room temperature sulfidation process using these electrolytes. In addition, since the room temperature sulfidation process is a room temperature treatment, the compressive residual stress obtained by quenching hardness, shot peening, etc. is maintained, and distortion of the article to be treated due to heat can be prevented. The hardness etc. are secured. That is, the iron sulfide film can be formed while maintaining the compressive residual stress cured by the surface treatment by the spraying of the projection material of the present invention.

上記常温硫化プロセスを利用し、本実施の形態にかかる皮膜形成装置1において、投射材入り電解液Aおよび電解液Bとしてアルカリ金属もしくはアルカリ土類金属のチオシアン酸塩またはチオ硫酸塩の一種または二種以上を溶解した水溶液を用い鉄および鉄合金等からなるワーク15に電解液Bを噴射させることにより、ワーク15の外周面に硫化鉄からなる皮膜を形成させることができる。ワーク15に皮膜を形成させることにより摺動面におけるワークの焼付きや異常摩耗等の問題が解決されることとなる。   In the film forming apparatus 1 according to the present embodiment using the room temperature sulfidation process, as the electrolytic solution A and the electrolytic solution B containing the projection material, one or two of thiocyanate or thiosulfate of alkali metal or alkaline earth metal is used. A coating made of iron sulfide can be formed on the outer peripheral surface of the work 15 by injecting the electrolytic solution B onto the work 15 made of iron, an iron alloy or the like using an aqueous solution in which seeds or more are dissolved. By forming a film on the workpiece 15, problems such as seizure of the workpiece on the sliding surface and abnormal wear are solved.

即ち、表面処理機構20からの混合電解液の高圧噴射によって、ワーク15の外周面(摺動面)にピーニング処理が施され、疲労強度の向上が実現される。同時に、皮膜形成機構30からの電解液Bの低圧噴射によって、ワーク15の外周面(摺動面)に皮膜形成がなされる。本実施の形態にかかる皮膜形成装置1によれば、上記ピーニング処理と皮膜形成をほぼ同時に連続的に行うことが可能であり、また、複数のワーク15の外周面(摺動面)に均一に行うことが可能となる。従来は、ショットピーニング等のピーニング処理と皮膜形成は異なる装置・工程で行われていたが、本実施の形態にかかる皮膜形成装置1を用いることにより、ワーク15の表面処理(ピーニング処理)およびワーク15表面への皮膜形成を1つの工程および1つの装置でもって連続的に行うこととなり、ワーク15のワーク保持治具16に対する着脱時間や表面処理等の処理時間を短縮し、効率的にワーク15の表面処理およびワーク15表面への皮膜形成を行うことができる。なお、本発明の装置を用いて上記ピーニング処理と皮膜形成は順に連続して行うこともできる。   That is, peening treatment is performed on the outer peripheral surface (sliding surface) of the workpiece 15 by high-pressure injection of the mixed electrolyte from the surface treatment mechanism 20, thereby improving fatigue strength. At the same time, a film is formed on the outer peripheral surface (sliding surface) of the work 15 by low-pressure injection of the electrolytic solution B from the film forming mechanism 30. According to the film forming apparatus 1 according to the present embodiment, the peening process and the film formation can be performed continuously almost simultaneously, and the outer peripheral surfaces (sliding surfaces) of the plurality of workpieces 15 can be uniformly formed. Can be done. Conventionally, peening processing such as shot peening and film formation have been performed by different apparatuses and processes. However, by using the film forming apparatus 1 according to the present embodiment, surface treatment (peening processing) of the work 15 and work The film formation on the surface 15 is continuously performed with one process and one apparatus, and the work 15 can be attached to and detached from the work holding jig 16 and the processing time such as the surface treatment can be shortened. Surface treatment and film formation on the surface of the workpiece 15 can be performed. In addition, the said peening process and film formation can also be sequentially performed using the apparatus of this invention.

以上、本発明の実施の形態の一例を説明したが、本発明は図示の形態に限定されない。当業者であれば、特許請求の範囲に記載された思想の範疇内において、各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although an example of embodiment of this invention was demonstrated, this invention is not limited to the form of illustration. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

上記実施の形態において、ワークは鉄または鉄合金からなるとしたが、これに限られるものではなく、上述した常温硫化プロセスを用いて皮膜形成が可能であるような鋼種であればよい。例えば、SCM、SCr、SK、SUJ、SACM、SS、SKD、SUS等のマルテンサイト系の鋼種およびSACM等の窒化鋼種が例示される。   In the above embodiment, the workpiece is made of iron or an iron alloy. However, the present invention is not limited to this, and any steel type that can form a film using the above-described room temperature sulfidation process may be used. For example, martensitic steel types such as SCM, SCr, SK, SUJ, SACM, SS, SKD, and SUS and nitrided steel types such as SACM are exemplified.

本発明は、例えば歯車等のワーク(被加工材)に対して圧縮残留応力を付与する表面処理を行い、かつ皮膜形成を行う皮膜形成装置および皮膜形成方法に適用できる。   INDUSTRIAL APPLICABILITY The present invention can be applied to a film forming apparatus and a film forming method for performing a surface treatment for applying a compressive residual stress to a work (workpiece) such as a gear and forming a film.

1…皮膜形成装置
10…処理室
11…仕切り板
12、13…貯留部
14…電気絶縁体
15…ワーク
16…ワーク保持治具
17…載置台
20…表面処理機構
21…噴射口
22、26、28、32…連通路
23…高圧ポンプ
25…混合機構
27、33…低圧ポンプ
30…皮膜形成機構
31…噴射口
35…フィルター
40…サイクロン
41…貯留部
60…電極
62…電源
DESCRIPTION OF SYMBOLS 1 ... Film formation apparatus 10 ... Processing chamber 11 ... Partition plate 12, 13 ... Storage part 14 ... Electric insulator 15 ... Work 16 ... Work holding jig 17 ... Mounting table 20 ... Surface treatment mechanism 21 ... Injection port 22, 26, DESCRIPTION OF SYMBOLS 28, 32 ... Communication path 23 ... High pressure pump 25 ... Mixing mechanism 27, 33 ... Low pressure pump 30 ... Film formation mechanism 31 ... Injection port 35 ... Filter 40 ... Cyclone 41 ... Storage part 60 ... Electrode 62 ... Power supply

Claims (8)

処理室内に支持されるワークに圧縮残留応力を付与する表面処理を施し、前記ワークに皮膜形成を行う皮膜形成装置であって、
前記ワークの表面に投射材入り電解液を高圧で噴射させ圧縮残留応力を付与する、前記ワークに沿って移動自在な表面処理機構と、
前記ワークの表面に電解液を低圧で噴射させ皮膜を形成させる、前記ワークに沿って移動自在な皮膜形成機構とを備え、
前記ワークは電源の陽極側に電気的に接続し、
前記皮膜形成機構の電極は電源の陰極側に電気的に接続し、
前記表面処理機構の噴射口と前記皮膜形成機構の噴射口は同心状に配置される、皮膜形成装置。
A film forming apparatus for applying a surface treatment to impart compressive residual stress to a work supported in a processing chamber and forming a film on the work,
A surface treatment mechanism that is movable along the workpiece, and applies compressive residual stress by injecting an electrolytic solution containing a projectile material onto the surface of the workpiece at a high pressure,
A film forming mechanism that is movable along the work, and forms a film by injecting an electrolyte on the surface of the work at a low pressure;
The workpiece is electrically connected to the anode side of the power source,
The electrode of the film forming mechanism is electrically connected to the cathode side of the power source,
The film forming apparatus, wherein the spray port of the surface treatment mechanism and the spray port of the film forming mechanism are arranged concentrically.
前記投射材入り電解液および前記電解液は、前記処理室下部の貯留部に分けて貯留される、請求項1に記載の皮膜形成装置。 The coating film forming apparatus according to claim 1, wherein the projection material-containing electrolytic solution and the electrolytic solution are separately stored in a storage portion at a lower portion of the processing chamber. 前記投射材入り電解液および前記電解液は同軸方向に向けて前記投射材入り電解液の周囲を前記電解液が取り囲むように噴出され、前記投射材入り電解液は0.1MPa〜300MPaで噴射され、前記電解液は0.01MPa〜1MPaで噴射される、請求項1または2に記載の皮膜形成装置。 The electrolytic solution containing the projecting material and the electrolytic solution are ejected in a coaxial direction so that the electrolytic solution surrounds the electrolytic solution containing the projecting material, and the electrolytic solution containing the projecting material is injected at 0.1 MPa to 300 MPa. The film forming apparatus according to claim 1, wherein the electrolytic solution is sprayed at 0.01 MPa to 1 MPa. 前記表面処理機構と前記皮膜形成機構は一体的に移動する、請求項1〜3のいずれかに記載の皮膜形成装置。 The film forming apparatus according to claim 1, wherein the surface treatment mechanism and the film forming mechanism move integrally. 前記ワークは鉄または鉄合金からなり、前記皮膜形成機構によって形成される皮膜は硫化物系固体潤滑膜である、請求項1〜4のいずれかに記載の皮膜形成装置。 The film forming apparatus according to claim 1, wherein the workpiece is made of iron or an iron alloy, and the film formed by the film forming mechanism is a sulfide-based solid lubricating film. ワークに皮膜を形成させる皮膜形成方法であって、
正に帯電し、回転する前記ワークに投射材入り電解液を高圧で噴射するとともに、
前記投射材入り電解液と同心状に、負に帯電する電解液を前記ワークに低圧で噴射する、皮膜形成方法。
A film forming method for forming a film on a workpiece,
While positively charging and injecting the projecting material-containing electrolyte at high pressure onto the rotating workpiece,
A film forming method in which a negatively charged electrolytic solution is sprayed onto the workpiece at a low pressure concentrically with the electrolytic solution containing the projection material.
前記投射材入り電解液および前記電解液は同軸方向に向けて前記投射材入り電解液の周囲を前記電解液が取り囲むように噴出され、前記投射材入り電解液は0.1MPa〜300MPaで噴射され、前記電解液は0.01MPa〜1MPaで噴射される、請求項6に記載の皮膜形成方法。 The electrolytic solution containing the projecting material and the electrolytic solution are ejected toward the coaxial direction so that the electrolytic solution surrounds the electrolytic solution containing the projecting material, and the electrolytic solution containing the projecting material is injected at 0.1 MPa to 300 MPa. The film forming method according to claim 6, wherein the electrolytic solution is sprayed at 0.01 MPa to 1 MPa. 前記ワークは鉄または鉄合金からなり、前記皮膜形成機構によって形成される皮膜は硫化物系固体潤滑膜である、請求項6または7に記載の皮膜形成方法。 The film forming method according to claim 6 or 7, wherein the workpiece is made of iron or an iron alloy, and the film formed by the film forming mechanism is a sulfide-based solid lubricating film.
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JPH06136504A (en) * 1992-10-23 1994-05-17 Toyota Motor Corp Thermal spraying method of inner surface of tubular member
JPH09256136A (en) * 1996-03-19 1997-09-30 Toyota Central Res & Dev Lab Inc Thermal spraying method
JP2006052449A (en) * 2004-08-13 2006-02-23 Nippon Steel Corp Cold spray coating film formation method
JP2006188720A (en) * 2004-12-28 2006-07-20 Mitsubishi Heavy Ind Ltd Surface-treated light alloy member and production method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136504A (en) * 1992-10-23 1994-05-17 Toyota Motor Corp Thermal spraying method of inner surface of tubular member
JPH09256136A (en) * 1996-03-19 1997-09-30 Toyota Central Res & Dev Lab Inc Thermal spraying method
JP2006052449A (en) * 2004-08-13 2006-02-23 Nippon Steel Corp Cold spray coating film formation method
JP2006188720A (en) * 2004-12-28 2006-07-20 Mitsubishi Heavy Ind Ltd Surface-treated light alloy member and production method therefor

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