JP2010232269A - Organic el device, method for manufacturing organic el device, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve light emitting quality of an organic EL device. <P>SOLUTION: The organic EL device includes: a pixel electrode 29 having an electrode surface 125; a second electrode facing the electrode surface 125; a partition wall 71, and a hole injection layer 105, the hole injection layer 105 including, on a surface, a bottom surface 121 and a curved surface 123. If a plane 131 parallel to the electrode surface 125 is moved to the bottom surface 121 in parallel along the normal line 135 in a cross section cut along the direction of a normal line 135 to take the intersection of the plane 131 to the curved surface 123 as a first point 137, the intersection of the plane 131 to the wall surface 127 as a second point 139, the middle point between the first point 137 and the second point 139 as a third point 141, and the intersection of the normal line 135 passing the third point 141 to the curved surface 123 as a fourth point 143, the angle formed by the line connecting the first point 137 to the fourth point 143 and the plane 131 is 50° or less. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL device, a method for manufacturing the organic EL device, an electronic device, and the like.

Conventionally, as one of electro-optical devices, there is an organic EL (Electro Luminescence) device having a pair of electrodes and a light emitting layer interposed between the pair of electrodes. In an organic EL device, an organic layer including a light emitting layer is interposed between a pair of electrodes.
Conventionally, such an organic EL device has a partition including pixels, an organic layer deposited in a light emitting region surrounded by the partition, and an electrode deposited on the organic layer. (For example, refer to Patent Document 1).

JP 2008-192477 A

As an organic EL device having a partition, a deposited organic layer, and a deposited electrode, for example, a configuration of an organic EL device 800 shown in FIG. 16 can be considered. In the organic EL device 800, an organic layer 805 including a light emitting layer (not shown) is interposed between the pixel electrode 801 and the common electrode 803. In the organic EL device 800, the pixel electrode 801 and the common electrode 803 correspond to a pair of electrodes.
In the organic EL device 800, the pixel region 807 is partitioned for each pixel by a partition wall 809. One pixel region 807 is surrounded by a partition 809. The common electrode 803 is provided across a plurality of pixels and functions in common across the plurality of pixels.

By the way, in the common electrode 803 formed by vapor deposition on the partition 809, the common electrode 803 is easily interrupted at the corner portion 811 as shown in FIG. 17 which is an enlarged view of a Q portion in FIG. This is because the shape of the corner portion 813 between the wall surface of the partition wall 809 and the pixel electrode 801 is easily reflected in the deposited organic layer 805.
When the common electrode 803 is interrupted, the light emitting state of the light emitting layer is likely to vary between pixels.
That is, the conventional organic EL device has a problem that it is difficult to improve the light emission quality.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A first electrode having a plane, a second electrode facing the plane of the first electrode on the plane side of the first electrode, and the second electrode than the plane of the first electrode. A partition wall having a wall surface projecting toward the electrode and surrounding at least a part of the plane, and an organic layer interposed between the first electrode and the second electrode in the region surrounded by the wall surface And the organic layer includes a plurality of layers including a light emitting layer, and the second electrode is provided from the region surrounded by the wall surface to at least the wall surface, At least one of the plurality of layers faces the intersection line between the bottom surface that overlaps the plane in a plan view, the wall surface, and the first electrode on the surface on the second electrode side, and the intersection line side. Curved surface curved in a direction that becomes concave toward In a cross section when the first electrode, the second electrode, the partition wall, and the organic layer are cut along the normal direction of the plane, a plane parallel to the plane is defined as the normal line. In the direction to the bottom surface, the intersection point of the surface and the curved surface as a first point, the intersection point of the surface and the wall surface as a second point, between the first point and the second point The third point is the third point, and the intersection point of the curved line and the normal passing through the third point is the fourth point, and the line connecting the first point and the fourth point An organic EL device characterized in that an angle formed by a surface is 50 degrees or less.

The organic EL device of this application example includes a first electrode, a second electrode, a partition, and an organic layer. The first electrode has a flat surface. The second electrode faces the plane of the first electrode on the plane side of the first electrode. The partition wall protrudes to the second electrode side from the plane of the first electrode. The partition has a wall surface. The wall surface surrounds at least a part of the plane of the first electrode. The organic layer is interposed between the first electrode and the second electrode in a region surrounded by the wall surface. The organic layer includes a plurality of layers including a light emitting layer. The second electrode is provided from the region surrounded by the wall surface to at least the wall surface.
At least one of the plurality of layers included in the organic layer includes a bottom surface and a curved surface on the surface on the second electrode side. The bottom surface overlaps the plane of the first electrode in plan view. The curved surface faces the line of intersection between the wall surface and the first electrode. The curved surface is curved in a direction that becomes concave toward the intersecting line side.
With the above configuration, the curved surface is easily reflected in the second electrode located on the opposite side of the layer having the curved surface from the first electrode side. That is, a curved surface can be formed on the second electrode in a region from the region surrounded by the wall surface to the wall surface. Thereby, compared with the case where a 2nd electrode is provided across a corner | angular part, for example, it can make it easy to suppress that the 2nd electrode interrupts low.
In this organic EL device, the first electrode, the second electrode, the partition walls, and the organic layer are moved in parallel to a plane parallel to the plane to the bottom in a cross section when the plane is cut along the plane normal direction. The intersection between the surface and the curved surface is the first point, the intersection between the surface and the wall is the second point, the midpoint between the first point and the second point is the third point, and passes through the third point When the intersection point between the normal line and the curved surface is the fourth point, the angle formed by the line connecting the first point and the fourth point and the surface is 50 degrees or less.
Thereby, it can suppress that the 2nd electrode interrupts low, and can make it easy to improve the light emission quality.

  Application Example 2 The first electrode, the second electrode facing the first electrode, the second electrode projecting from the first electrode, and surrounding at least a part of the first electrode. An organic EL device including a partition having a wall surface and a plurality of layers including a light emitting layer, and an organic layer interposed between the first electrode and the second electrode in a region surrounded by the wall surface The organic layer forming step of forming the organic layer for each of the plurality of layers in the region surrounded by the wall surface, and after the organic layer forming step, A step of forming two electrodes, wherein the organic layer forming step includes forming a part of the plurality of layers by a vapor deposition method, and forming a layer of the plurality of layers. A coating layer forming step of forming the other layer by a coating method, and In the cloth layer forming step, the organic material is disposed by disposing at least a part of the liquid contained in the liquid material, the disposing step of arranging the liquid material containing the organic material in the region surrounded by the wall surface A layer forming step of forming the layer at a step, wherein, in the layer forming step, the wall surface and the first electrode on a surface opposite to the first electrode side of the layer formed in the layer forming step. A method of manufacturing an organic EL device, comprising: forming a curved surface that faces a line of intersection and curves in a direction that becomes concave toward the line of intersection.

An organic EL device to which the manufacturing method of this application example can be applied includes a first electrode, a second electrode, a partition, and an organic layer. The second electrode is opposed to the first electrode. The partition wall protrudes closer to the second electrode than the first electrode. The partition has a wall surface. The wall surface surrounds at least a part of the first electrode. The organic layer includes a plurality of layers including a light emitting layer. The organic layer is interposed between the first electrode and the second electrode in a region surrounded by the wall surface.
And the manufacturing method of this application example includes an organic layer forming step and a step of forming the second electrode. In the organic layer forming step, an organic layer is formed in a region surrounded by the wall surface. At this time, the organic layer is formed for each of the plurality of layers. The second electrode is formed after the organic layer forming step.
The organic layer forming step includes a vapor deposition layer forming step and a coating layer forming step. In the vapor deposition layer forming step, a part of the plurality of layers in the organic layer is formed by a vapor deposition method. In the coating layer forming step, another layer of the plurality of layers in the organic layer is formed by a coating method.
The coating layer forming step includes an arrangement step and a layer forming step. In the arranging step, a liquid material containing an organic material is arranged in a region surrounded by the wall surface. In the layer forming step, a layer is formed from an organic material by removing at least a part of the liquid contained in the liquid.
In the layer forming step, a curved surface is formed on the surface opposite to the first electrode side of the layer formed in the layer forming step. The curved surface faces an intersection line between the wall surface and the first electrode, and is curved in a direction that becomes concave toward the intersection line side.
According to this manufacturing method, it is possible to form a curved surface on the second electrode in the region from the region surrounded by the wall surface to the wall surface. Thereby, compared with the case where a 2nd electrode is provided across a corner | angular part, for example, it can make it easy to suppress that the 2nd electrode interrupts low. As a result, the light emission quality in the organic EL device can be easily improved.

  Application Example 3 In the above-described organic EL device manufacturing method, the layer forming step includes a drying step of removing at least a part of the liquid by drying at least a part of the liquid. A method of manufacturing an organic EL device characterized by the above.

  In this application example, the layer forming step includes a drying step. In the drying step, at least a part of the liquid is removed by drying at least a part of the liquid. Thereby, a layer can be formed.

  Application Example 4 In the above-described method for manufacturing an organic EL device, the drying step includes a reduced-pressure drying step of drying at least a part of the liquid in a reduced pressure environment reduced to a pressure lower than atmospheric pressure. A method of manufacturing an organic EL device, comprising:

  In this application example, the drying process includes a vacuum drying process. In the reduced pressure drying step, at least a part of the liquid is dried under a reduced pressure environment reduced to a pressure lower than the atmospheric pressure. Thereby, at least a part of the liquid contained in the liquid can be dried.

  Application Example 5 A method for manufacturing an organic EL device according to the above-described method, wherein in the layer forming step, the curved surface is formed in the reduced-pressure drying step.

  Application Example 6 In the above-described method for manufacturing an organic EL device, the reduced-pressure drying step uses a first pump to reduce the pressure to a first pressure lower than atmospheric pressure. Then, following the first depressurization step, the first pump and the second pump are used together to depressurize the first pressure to a second pressure lower than the first pressure. An organic EL device manufacturing method, comprising: 2 decompression steps.

  In this application example, the reduced pressure drying step includes a first reduced pressure step and a second reduced pressure step. In the first pressure reducing step, the pressure is reduced to a first pressure lower than the atmospheric pressure using the first pump. Subsequent to the first pressure reduction step, in the second pressure reduction step, the first pump and the second pump are used together to reduce the first pressure to a second pressure lower than the first pressure. Thereby, a curved surface can be formed in the layer.

  Application Example 7 In the above-described organic EL device manufacturing method, in the organic layer forming step, the vapor deposition layer forming step is performed after the coating layer forming step. Method.

In this application example, the vapor deposition layer forming step is performed after the coating layer forming step in the organic layer forming step.
For example, when the coating layer forming step is performed after the vapor deposition layer forming step, the liquid material is disposed on the layer formed by the vapor deposition method. At this time, the layer formed by the vapor deposition method may be dissolved in the liquid. That is, when the coating layer forming step is performed after the vapor deposition layer forming step, it may be difficult to stably form each layer.
On the other hand, in this application example, since the vapor deposition layer forming step is performed after the coating layer forming step, each of the plurality of layers can be easily formed stably. As a result, it is possible to further improve the light emission quality in the organic EL device.

  Application Example 8 An electronic apparatus having the organic EL device described above.

The electronic apparatus of this application example has an organic EL device. This organic EL device has a first electrode, a second electrode, a partition, and an organic layer. The first electrode has a flat surface. The second electrode faces the plane of the first electrode on the plane side of the first electrode. The partition wall protrudes to the second electrode side from the plane of the first electrode. The partition has a wall surface. The wall surface surrounds at least a part of the plane of the first electrode. The organic layer is interposed between the first electrode and the second electrode in a region surrounded by the wall surface. The organic layer includes a plurality of layers including a light emitting layer. The second electrode is provided from the region surrounded by the wall surface to at least the wall surface.
At least one of the plurality of layers included in the organic layer includes a bottom surface and a curved surface on the surface on the second electrode side. The bottom surface overlaps the plane of the first electrode in plan view. The curved surface faces the line of intersection between the wall surface and the first electrode. The curved surface is curved in a direction that becomes concave toward the intersecting line side.
With the above configuration, the curved surface is easily reflected in the second electrode located on the opposite side of the layer having the curved surface from the first electrode side. That is, a curved surface can be formed on the second electrode in a region from the region surrounded by the wall surface to the wall surface. Thereby, compared with the case where a 2nd electrode is provided across a corner | angular part, for example, it can make it easy to suppress that the 2nd electrode interrupts low.
In this organic EL device, the first electrode, the second electrode, the partition walls, and the organic layer are moved in parallel in a plane parallel to the plane to the bottom surface in a cross section when cut along the plane normal direction. The intersection between the surface and the curved surface is the first point, the intersection between the surface and the wall is the second point, the midpoint between the first point and the second point is the third point, and passes through the third point When the intersection point between the normal line and the curved surface is the fourth point, the angle formed by the line connecting the first point and the fourth point and the surface is 50 degrees or less.
Thereby, it can suppress that the 2nd electrode interrupts low, and can make it easy to improve the light emission quality.
And since the electronic device of an application example has this organic EL device, it can make it easy to improve the light emission quality in this organic EL device.

The top view which shows the display apparatus in this embodiment. Sectional drawing in the AA in FIG. FIG. 3 is a plan view showing a part of a plurality of pixels in the embodiment. 1 is a diagram showing a circuit configuration of a display device in an embodiment. Sectional drawing in the CC line | wire in FIG. The enlarged view of the organic EL element in FIG. Sectional drawing which shows the hole injection layer in this embodiment. The enlarged view of the F section in FIG. The figure explaining the manufacturing process of the element substrate in this embodiment. The figure explaining the manufacturing process of the element substrate in this embodiment. The figure explaining the manufacturing process of the element substrate in this embodiment. Sectional drawing explaining the kind of board | substrate in an Example. The figure explaining the main structure of the drying apparatus applied to the reduced pressure drying in this embodiment. Sectional drawing which shows the positive hole injection layer in a comparative example. The perspective view of the electronic device to which the display apparatus in this embodiment is applied. The figure explaining the subject in a prior art. The enlarged view of the Q section in FIG.

Embodiments will be described with reference to the drawings, taking a display device using an organic EL device as an example.
The display device 1 according to the embodiment has a display surface 3 as shown in FIG.

Here, a plurality of pixels 5 are set in the display device 1. The plurality of pixels 5 are arranged in the X direction and the Y direction in the drawing within the display area 7, and constitute a matrix M in which the X direction is the row direction and the Y direction is the column direction.
In the present embodiment, the X direction is a direction in which a scanning line GT described later extends as shown in FIG. The Y direction is a direction orthogonal to (crossing) the X direction. In the present embodiment, a data line SI to be described later extends along the Y direction. For this reason, the Y direction is also a direction in which the data line SI extends.

  The display device 1 can display an image on the display surface 3 by selectively emitting light from the plurality of pixels 5 illustrated in FIG. 1 to the outside of the display device 1 via the display surface 3. The display area 7 is an area where an image can be displayed. In FIG. 1, the pixels 5 are exaggerated and the number of the pixels 5 is reduced for easy understanding of the configuration.

The display device 1 includes an element substrate 11 and a sealing substrate 13 as shown in FIG. 2 which is a cross-sectional view taken along the line AA in FIG.
The element substrate 11 is provided with an organic EL element, which will be described later, corresponding to each of the plurality of pixels 5 on the display surface 3 side, that is, the sealing substrate 13 side. The surface 15 of the element substrate 11 opposite to the display surface 3 side is set as the bottom surface of the display device 1. Hereinafter, the surface 15 is referred to as a bottom surface 15.

The sealing substrate 13 is provided in a state facing the element substrate 11 on the display surface 3 side with respect to the element substrate 11. The element substrate 11 and the sealing substrate 13 are bonded via an adhesive 16. In the display device 1, the organic EL element is covered with the adhesive 16 from the display surface 3 side.
Further, the element substrate 11 and the sealing substrate 13 are sealed with a sealing material 17 that surrounds the display region 7 inside the periphery of the display device 1. That is, in the display device 1, the organic EL element and the adhesive 16 are sealed with the element substrate 11, the sealing substrate 13, and the sealing material 17.

Here, each of the plurality of pixels 5 in the display device 1 has a red color (R), a green color (G), and a blue color (B) as shown in FIG. Is set to one of these. That is, the plurality of pixels 5 constituting the matrix M include a pixel 5R that emits R light, a pixel 5G that emits G light, and a pixel 5B that emits B light.
In the following description, the term “pixel 5” and the term “pixels 5R, 5G, and 5B” are appropriately used.

  Here, the color of R is not limited to a pure red hue, and includes orange and the like. The color of G is not limited to a pure green hue, and includes bluish green and yellowish green. The color of B is not limited to a pure blue hue, and includes bluish purple and blue-green. From another viewpoint, light exhibiting the color of R can be defined as light having a light wavelength peak in a range of 570 nm or more in the visible light region. The light exhibiting the color G can be defined as light having a light wavelength peak in the range of 500 nm to 565 nm. Light exhibiting the color B can be defined as light having a light wavelength peak in the range of 415 nm to 495 nm.

In the matrix M, a plurality of pixels 5 arranged in a line along the Y direction form one pixel column 18. A plurality of pixels 5 arranged in a line along the X direction form one pixel row 19.
Each pixel 5 in one pixel column 18 has a light color set to one of R, G, and B. That is, the matrix M includes a pixel column 18R in which a plurality of pixels 5R are arranged in the Y direction, a pixel column 18G in which a plurality of pixels 5G are arranged in the Y direction, and a pixel column 18B in which a plurality of pixels 5B are arranged in the Y direction. have. In the display device 1, the pixel column 18R, the pixel column 18G, and the pixel column 18B are repeatedly arranged in this order along the X direction.
In the following, the notation of the pixel column 18 and the notation of the pixel column 18R, the pixel column 18G, and the pixel column 18B are appropriately used.

The display device 1 includes a selection transistor 21, a drive transistor 23, a capacitor element 25, and an organic EL element 27 for each pixel 5, as shown in FIG. The organic EL element 27 includes a pixel electrode 29, a functional layer 31, and a common electrode 33. Each of the selection transistor 21 and the driving transistor 23 is configured by a TFT (Thin Film Transistor) element and has a function as a switching element.
In addition, the display device 1 includes a scanning line driving circuit 37, a data line driving circuit 38, a plurality of scanning lines GT, a plurality of data lines SI, and a plurality of power supply lines PW.

The plurality of scanning lines GT are respectively connected to the scanning line driving circuit 37, and extend in the X direction with a space therebetween in the Y direction.
The plurality of data lines SI are respectively connected to the data line driving circuit 38 and extend in the Y direction with a space therebetween in the X direction.
The plurality of power supply lines PW extend in the X direction in a state in which the power supply lines PW are spaced from each other in the Y direction, and the power supply lines PW and the scanning lines GT are spaced in the Y direction.

Each pixel 5 is set corresponding to the intersection of each scanning line GT and each data line SI. Each scanning line GT and each power supply line PW correspond to each pixel row 19 shown in FIG. Each data line SI corresponds to each pixel column 18 shown in FIG.
The gate electrode of each selection transistor 21 shown in FIG. 4 is electrically connected to each corresponding scanning line GT. The source electrode of each select transistor 21 is electrically connected to each corresponding data line SI. The drain electrode of each select transistor 21 is electrically connected to the gate electrode of each drive transistor 23 and one electrode of each capacitive element 25.

The other electrode of the capacitive element 25 and the source electrode of the drive transistor 23 are electrically connected to the corresponding power supply line PW.
The drain electrode of each driving transistor 23 is electrically connected to each pixel electrode 29. Each pixel electrode 29 and the common electrode 33 constitute a pair of electrodes having the pixel electrode 29 as an anode and the common electrode 33 as a cathode.
Here, the common electrode 33 is provided in a series of states between the plurality of pixels 5 constituting the matrix M, and functions in common between the plurality of pixels 5.
The functional layer 31 interposed between each pixel electrode 29 and the common electrode 33 includes a light emitting layer to be described later. In the functional layer 31, the light emitting layer emits light due to the current generated between the pixel electrode 29 and the common electrode 33.

  The selection transistor 21 is turned on when a selection signal is supplied to the scanning line GT connected to the selection transistor 21. At this time, a data signal is supplied from the data line SI connected to the selection transistor 21, and the driving transistor 23 is turned on. The gate potential of the driving transistor 23 is held for a certain period by holding the potential of the data signal in the capacitor 25 for a certain period. As a result, the ON state of the drive transistor 23 is held for a certain period. Each data signal is generated at a potential corresponding to the gradation display.

When the ON state of the drive transistor 23 is maintained, a current corresponding to the gate potential of the drive transistor 23 flows from the power supply line PW to the common electrode 33 through the pixel electrode 29 and the functional layer 31. Then, the light emitting layer included in the functional layer 31 emits light with a luminance corresponding to the amount of current flowing through the functional layer 31. Thereby, the display device 1 can perform gradation display.
The display device 1 is one of top emission type organic EL devices in which a light emitting layer included in the functional layer 31 emits light, and light from the light emitting layer is emitted from the display surface 3 through the sealing substrate 13. In the display device 1, the expression “display surface 3 side” is also expressed as the upper side, and the expression “bottom surface 15 side” is also expressed as the lower side.

Here, the details of the configurations of the element substrate 11 and the sealing substrate 13 will be described.
The element substrate 11 includes a first substrate 41 and an element layer 42 as shown in FIG. 5 which is a cross-sectional view taken along the line CC in FIG. In FIG. 5, the selection transistor 21, the capacitor 25, the data line SI, and the power supply line PW are omitted for easy understanding of the configuration.
The first substrate 41 is made of a light-transmitting material such as glass or quartz, for example, and includes a first surface 43a directed to the display surface 3 side, and a second surface 43b directed to the bottom surface 15 side. have.

The element layer 42 is provided on the first surface 43 a of the first substrate 41. The element layer 42 includes a gate insulating film 44, an insulating film 45, an insulating film 47, a partition wall 71, a functional layer 31, an auxiliary electrode 75, and a common electrode 33. The element layer 42 includes a drive transistor 23, a pixel electrode 29, a source electrode 55, and a reflective film 61 provided for each pixel 5.
Note that the selection transistor 21, the capacitive element 25, the data line SI, and the power supply line PW (not shown) are also included in the element layer 42.

The gate insulating film 44 is provided on the first surface 43 a of the first substrate 41. The insulating film 45 is provided on the display surface 3 side of the gate insulating film 44. The insulating film 47 is provided on the display surface 3 side of the insulating film 45.
A semiconductor layer 51 is provided on the first surface 43 a of the first substrate 41 so as to correspond to the drive transistor 23 of each pixel 5. The semiconductor layer 51 is covered with the gate insulating film 44 from the display surface 3 side. As a material of the gate insulating film 44, for example, a material such as silicon oxide can be adopted.

  On the display surface 3 side of the gate insulating film 44, a gate electrode 53 is provided in a region overlapping the semiconductor layer 51 in plan view. As a material of the gate electrode 53, for example, a metal such as aluminum, copper, molybdenum, tungsten, or chromium, or an alloy containing these metals can be used. The gate electrode 53 is covered with the insulating film 45 from the display surface 3 side.

  On the display surface 3 side of the insulating film 45, a source electrode 55 is provided in a region overlapping a source region (not shown) of the semiconductor layer 51 in plan view. The source electrode 55 is connected to a source region (not shown) of the semiconductor layer 51 through a contact hole 57 provided in the insulating film 45 and the gate insulating film 44. As a material of the source electrode 55, for example, a metal such as aluminum, copper, molybdenum, tungsten, or chromium, or an alloy containing these metals can be employed. The source electrode 55 is covered with the insulating film 47 from the display surface 3 side.

The reflective film 61 is provided on the display surface 3 side of the insulating film 47 for each pixel 5. As a material of the reflective film 61, for example, a metal having high light reflectivity such as silver, platinum, aluminum, or copper, or an alloy containing these can be employed.
A pixel electrode 29 is provided on the display surface 3 side of the reflective film 61. The pixel electrode 29 is connected to a drain region (not shown) of the semiconductor layer 51 through a contact hole 63 provided in the insulating film 47, the insulating film 45, and the gate insulating film 44.

As a material of the pixel electrode 29, ITO (Indium Tin Oxide), indium zinc oxide (Indium Zinc Oxide), or the like can be adopted. In this embodiment, ITO is used as the material of the pixel electrode 29.
Further, as the material of the insulating films 45 and 47, for example, materials such as silicon oxide, silicon nitride, and acrylic resin can be adopted.

A partition wall 71 is provided across the region 72 between the adjacent pixel electrodes 29. The partition wall 71 is made of, for example, an organic material such as an acrylic resin or a polyimide resin containing a material having a high light absorption property such as carbon black or chromium. In the present embodiment, an acrylic resin is employed as the material of the partition wall 71.
The partition walls 71 are provided in a lattice shape over the display region 7 (FIG. 1) in plan view. The partition wall 71 surrounds the light emitting region 73 for each pixel 5. For this reason, the light emitting region 73 is partitioned by the partition 71 as shown in FIG.
In the display area 7, a light emitting area 73 is partitioned for each pixel 5 by a partition wall 71. Focusing on one pixel 5, the partition wall 71 is provided in an annular shape in plan view. The pixel electrode 29 overlaps the light emitting region 73 surrounded by the partition wall 71 in plan view.

A functional layer 31 is provided on the display surface 3 side of the pixel electrode 29. The functional layer 31 has a plurality of layers. In the functional layer 31, a part of the plurality of layers extends over the plurality of light emitting regions 73 across the region 72.
In the light emitting region 73, the common electrode 33 is provided on the display surface 3 side of the functional layer 31. The common electrode 33 is provided in a series over a plurality of light emitting regions 73. As a material of the common electrode 33, for example, an alloy containing magnesium and silver, calcium, or the like can be adopted. In the present embodiment, an alloy containing magnesium and silver (hereinafter referred to as MgAg) is employed as the material for the common electrode 33.

  Here, in the region 72, the auxiliary electrode 75 is interposed between the functional layer 31 and the common electrode 33. The auxiliary electrode 75 has a function of assisting the electric conduction of the common electrode 33. As the material of the auxiliary electrode 75, for example, a metal having high electrical conductivity such as gold, silver, copper, or aluminum, or an alloy containing one or more of them can be employed. In this embodiment, an alloy containing aluminum is employed as the material of the auxiliary electrode 75.

  In the display device 1, the region effective for light emission in each pixel 5 can be defined as a region where the pixel electrode 29, the functional layer 31, and the common electrode 33 overlap in a plan view. In each pixel 5, a group of elements that exhibit a light emitting function can be defined as one organic EL element 27. In the display device 1, one organic EL element 27 includes one pixel electrode 29, a functional layer 31 corresponding to the one pixel electrode 29, and a common electrode 33 corresponding to the one pixel electrode 29. It is out.

The sealing substrate 13 includes a second substrate 81 and a counter layer 82. The second substrate 81 is made of a light-transmitting material such as glass or quartz, for example, and has an outward surface 83a directed to the display surface 3 side and an opposing surface 83b directed to the bottom surface 15 side. is doing.
The facing layer 82 is provided on the facing surface 83 b of the second substrate 81. The facing layer 82 includes a light shielding layer 85, a color filter 87, and an overcoat layer 89.

The light shielding layer 85 is provided over the region 91 on the facing surface 83b. The region 91 is a region that overlaps the region 72 in plan view. That is, similarly to the partition wall 71, the light shielding layer 85 is provided in a lattice shape over the display region 7 (FIG. 1) in plan view. The light shielding layer 85 surrounds the filter region 93 for each pixel 5. For this reason, the filter region 93 is partitioned by the light shielding layer 85 as shown in FIG. The filter region 93 overlaps the light emitting region 73 in plan view.
As the light shielding layer 85, for example, an organic material such as an acrylic resin or a polyimide resin containing a material having a high light absorption property such as carbon black or chromium may be employed.

A color filter 87 that covers the filter region 93 from the bottom surface 15 side is provided on the facing surface 83 b of the second substrate 81 for each filter region 93.
Here, the color filter 87 can transmit light in a predetermined wavelength region of incident light. The color filter 87 is made of a resin colored in a different color for each of the pixels 5R, 5G, and 5B. The color filter 87 corresponding to the pixel 5R can transmit R light. The color filter 87 corresponding to the pixel 5G can transmit G light, and the color filter 87 corresponding to the pixel 5B can transmit B light. Hereinafter, when R, G, and B are identified for each color filter 87, the notation of color filters 87R, 87G, and 87B is used.

An overcoat layer 89 is provided on the bottom surface 15 side of the light shielding layer 85 and the color filter 87. The overcoat layer 89 is made of a light-transmitting resin or the like, and covers the light shielding layer 85 and the color filter 87 from the bottom surface 15 side.
In the element substrate 11 and the sealing substrate 13 having the above-described configuration, the common electrode 33 of the element substrate 11 and the overcoat layer 89 of the sealing substrate 13 are bonded via an adhesive 16.
In the display device 1, the sealing material 17 illustrated in FIG. 2 is sandwiched between the first surface 43 a of the first substrate 41 and the facing surface 83 b of the second substrate 81 illustrated in FIG. 5. That is, in the display device 1, the organic EL element 27 and the adhesive 16 are sealed with the first substrate 41, the second substrate 81, and the sealing material 17. The sealing material 17 may be provided between the facing surface 83 b and the common electrode 33. In this case, the organic EL element 27 and the adhesive 16 can be regarded as being sealed by the element substrate 11, the sealing substrate 13, and the sealing material 17.

By the way, in this embodiment, the functional layer 31 includes the organic layer 101 and the electron injection layer 103 as shown in FIG. 6 which is an enlarged view of the organic EL element 27 in FIG.
The organic layer 101 is provided on the display surface 3 side of the pixel electrode 29. The electron injection layer 103 is provided on the display surface 3 side of the organic layer 101.
The organic layer 101 includes a hole injection layer 105, a hole transport layer 107, a light emitting layer 109, an intermediate layer 111, a light emitting layer 113, and a light emitting layer 117.

The hole injection layer 105 is made of a material containing an organic material, and is provided on the display surface 3 side of the pixel electrode 29 in a region surrounded by the partition walls 71 in a plan view.
As an organic material of the hole injection layer 105, a mixture of a polythiophene derivative such as 3,4-polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) can be employed. As the organic material for the hole injection layer 105, polystyrene, polypyrrole, polyaniline, polyacetylene, derivatives thereof, and the like can be employed.

  The hole transport layer 107 is made of a material containing an organic material, and is provided on the display surface 3 side of the hole injection layer 105. As a material of the hole transport layer 107, for example, HT320 (manufactured by Idemitsu Kosan Co., Ltd.) can be adopted. Then, the hole transport layer 107 can be provided by disposing the HT 320 using a vapor deposition technique. In addition, the arrangement | positioning of the material using a vapor deposition technique is called a vapor deposition method. In the present embodiment, a method of forming the hole transport layer 107 over the display region 7 (FIG. 1) by vapor deposition is employed. Thereby, the hole transport layer 107 is formed across the plurality of pixels 5. For this reason, the hole transport layer 107 is also formed on the display surface 3 side of the partition wall 71.

The light emitting layer 109 is made of a material containing an organic material and is provided on the display surface 3 side of the hole transport layer 107.
As a material of the light emitting layer 109, a material obtained by mixing a host material that ensures conductivity with a dopant having a function of emitting light by the combination of electrons and holes can be used. In this embodiment, the light emitting layer 109 is formed by a vapor deposition method.
The light emitting layer 109 is a layer that emits R light. As a material of the light emitting layer 109 that emits R light, for example, a configuration in which RD001 (manufactured by Idemitsu Kosan Co., Ltd.) as a dopant is mixed into NPB as a host material can be employed.

The intermediate layer 111 is made of a material containing an organic material, and is provided on the display surface 3 side of the light emitting layer 109. As a material constituting the intermediate layer 111, for example, NPB may be employed.
The light emitting layer 113 is made of a material containing an organic material, and is provided on the display surface 3 side of the intermediate layer 111.
As the material of the light emitting layer 113, a material obtained by mixing a host material ensuring conductivity with a dopant having a function of emitting light by the combination of electrons and holes can be used. In the present embodiment, the light emitting layer 113 is formed by a vapor deposition method.
The light emitting layer 113 is a layer that emits B light. As a material of the light emitting layer 113 that emits B light, for example, a configuration in which BD052 (manufactured by Idemitsu Kosan Co., Ltd.) as a dopant is mixed into BH215 (manufactured by Idemitsu Kosan Co., Ltd.) as a host material can be adopted.

The light emitting layer 117 is made of a material containing an organic material, and is provided on the display surface 3 side of the light emitting layer 113.
As a material for the light emitting layer 117, a material obtained by mixing a host material that ensures conductivity with a dopant having a function of emitting light by the combination of electrons and holes can be used. In the present embodiment, the light emitting layer 117 is formed by a vapor deposition method.
The light emitting layer 117 is a layer that emits G light. As a material of the light emitting layer 117 that emits G light, for example, a configuration in which quinacridone as a dopant is mixed in Alq3 can be adopted.

Note that the intermediate layer 111 has a function of adjusting the mobility of electrons and holes. The light emitting function of each of the light emitting layer 109, the light emitting layer 113, and the light emitting layer 117 is maintained by the intermediate layer 111.
The electron injection layer 103 is provided on the display surface 3 side of the light emitting layer 117. As a material for the electron injection layer 103, lithium fluoride, calcium fluoride, magnesium oxide, or the like may be employed. In the present embodiment, lithium fluoride is adopted as the material of the electron injection layer 103.

  By the way, in this embodiment, for each pixel 5, the organic EL element 27 corresponds to each of the color filters 87R, 87G, and 87B as shown in FIG. The organic EL element 27 corresponding to the color filter 87R is referred to as an organic EL element 27R. Similarly, the organic EL element 27 corresponding to the color filter 87G is called an organic EL element 27G, and the organic EL element 27 corresponding to the color filter 87B is called an organic EL element 27B.

  The organic EL element 27R overlaps the color filter 87R in plan view. The organic EL element 27G overlaps the color filter 87G in plan view. The organic EL element 27B overlaps the color filter 87B in plan view. For this reason, the organic EL element 27R and the color filter 87R have a mutually corresponding relationship. Similarly, the organic EL element 27G and the color filter 87G have a correspondence relationship, and the organic EL element 27B and the color filter 87B have a correspondence relationship.

In the present embodiment, the distance between the reflective film 61 and the common electrode 33 is set to a different distance between the organic EL elements 27R, 27G, and 27B.
In the organic EL element 27R, the distance between the reflective film 61 and the common electrode 33 is set to the distance D1. In the organic EL element 27G, the distance between the reflective film 61 and the common electrode 33 is set to the distance D2. In the organic EL element 27B, the distance between the reflective film 61 and the common electrode 33 is set to the distance D3.
In the present embodiment, D1, D2, and D3 satisfy the relationship D1>D2> D3.
In the present embodiment, the relationship of D1>D2> D3 is realized by setting the thickness of the pixel electrode 29 to a different thickness between the organic EL elements 27R, 27G, and 27B.

  In the display device 1, when a voltage is applied between the pixel electrode 29 and the common electrode 33 using the pixel electrode 29 as an anode, the common electrode 33 as a cathode, and a current flows through the organic layer 101 (FIG. 6). At this time, a light emission phenomenon appears in each of the light emitting layer 109, the light emitting layer 113, and the light emitting layer 117. At this time, the light from the organic layer 101 includes R light from the light emitting layer 109, B light from the light emitting layer 113, and G light from the light emitting layer 117.

Part of the light traveling from the organic layer 101 toward the common electrode 33 is transmitted through the common electrode 33 and enters the color filter 87 (FIG. 5).
A part of the light traveling from the organic layer 101 toward the pixel electrode 29 is transmitted through the pixel electrode 29 and then reflected by the reflective film 61 toward the common electrode 33. A part of the light reflected by the reflective film 61 and traveling toward the common electrode 33 side passes through the common electrode 33 and enters the color filter 87.
Light incident on the color filter 87 from the organic layer 101 is emitted from the second substrate 81 toward the display surface 3 as light of a color corresponding to each of the color filters 87R, 87G, and 87B.

The remaining part of the light traveling from the organic layer 101 toward the common electrode 33 is reflected by the common electrode 33 and travels toward the pixel electrode 29. A part of the light reflected by the common electrode 33 and traveling toward the pixel electrode 29 is transmitted through the pixel electrode 29 and then reflected by the reflective film 61 toward the common electrode 33.
At this time, in the organic EL element 27 </ b> R, among the light reflected by the reflective film 61 to the common electrode 33 side, the R light is strengthened by the resonance phenomenon. In the organic EL element 27G, among the light reflected by the reflective film 61 toward the common electrode 33, the G light is strengthened by the resonance phenomenon. In the organic EL element 27B, among the light reflected by the reflective film 61 toward the common electrode 33, the B light is strengthened by the resonance phenomenon.

In the present embodiment, in the organic EL element 27R (FIG. 5), the distance between the common electrode 33 and the reflective film 61 is set to the distance D1 that enhances the R light. In the organic EL element 27G, the distance between the common electrode 33 and the reflective film 61 is set to a distance D2 that enhances the G light. In the organic EL element 27B, the distance between the common electrode 33 and the reflective film 61 is set to a distance D3 that enhances the B light.
By setting the distances D1, D2 and D3, the color purity of light is increased in each of the pixels 5R, 5G and 5B. Thereby, the display quality in the display of the display device 1 is improved.

By the way, in this embodiment, the hole injection layer 105 has the bottom surface 121 and the curved surface 123 on the surface at the side of the common electrode 33 as shown in FIG.
The bottom surface 121 overlaps the electrode surface 125 of the pixel electrode 29 in plan view. The electrode surface 125 is formed in a plane.
The curved surface 123 is connected to the bottom surface 121. The curved surface 123 extends from the bottom surface 121 to the wall surface 127 of the partition wall 71. The curved surface 123 faces an intersection line 128 between the electrode surface 125 and the wall surface 127. In the present embodiment, the curved surface 123 overlaps the intersection line 128 in plan view. The curved surface 123 is curved in a concave direction toward the intersection line 128.

In the present embodiment, as shown in FIG. 6, the hole injection layer 105 includes a plurality of layers included in the organic layer 101, when counted sequentially from the pixel electrode 29 side toward the common electrode 33 side. It corresponds to the first layer. The shape of the curved surface 123 (FIG. 7) of the hole injection layer 105 is reflected in each layer on the display surface 3 side from the hole transport layer 107, including the second hole transport layer 107.
As a result, the common electrode 33 has a curved portion 129 as shown in FIG.
In the present embodiment, the degree of curvature of the curved surface 123 is defined in the hole injection layer 105. The degree of bending of the curved surface 123 is defined by the angle θ as shown in FIG. 8 which is an enlarged view of the F portion in FIG.

The angle θ is an angle between the surface 131 and the line 133.
The surface 131 is a surface parallel to the electrode surface 125. The surface 131 is a virtual surface when a surface parallel to the electrode surface 125 is moved to the bottom surface 121 of the hole injection layer 105 along the normal line 135 of the electrode surface 125.
Here, the intersection of the surface 131 and the curved surface 123 is a first point 137, the intersection of the surface 131 and the wall surface 127 is a second point 139, and the midpoint between the first point 137 and the second point 139 is a third point. Let it be a point 141. Further, the intersection point between the normal line 135 passing through the third point 141 and the curved surface 123 is defined as a fourth point 143.
A line connecting the first point 137 and the fourth point 143 is a line 133.

In the present embodiment, the angle θ is set to 50 degrees or less. Thereby, it is possible to suppress the common electrode 33 from being interrupted at the curved portion 129 (FIG. 6).
Here, a method for manufacturing the display device 1 will be described.
The manufacturing method of the display device 1 is roughly divided into a step of manufacturing the element substrate 11, a step of manufacturing the sealing substrate 13, and a step of assembling the display device 1.

  In the process of manufacturing the element substrate 11, first, the drive element layer 151 is formed on the first surface 43 a of the first substrate 41 as shown in FIG. The drive element layer 151 includes the selection transistor 21 (FIG. 4), the drive transistor 23, the capacitor element 25 (FIG. 4), the power supply line PW (FIG. 4), the reflective film 61, the pixel electrode 29, and the gate insulating film 44. Insulating film 45, insulating film 47, and the like are included.

Next, as illustrated in FIG. 9B, the partition wall 71 is formed in a region overlapping the periphery of the pixel electrode 29 and the insulating film 47 (region 72 illustrated in FIG. 5) in plan view.
In the formation of the partition 71, first, a resin film that covers the pixel electrode 29 and the insulating film 47 in a plan view is formed with a photosensitive acrylic resin. In the formation of the resin film, spin coating technology, printing technology, or the like can be used.
Next, the resin film is pre-baked. As prebaking conditions, for example, a temperature range of 70 ° C. to 90 ° C. and a processing time of 1 minute to 3 minutes may be employed.
Next, the resin film is patterned by utilizing, for example, a photolithography technique.
Next, post-baking treatment is performed on the patterned resin. As conditions for the post-bake treatment, for example, a temperature range of 110 ° C. to 170 ° C. and a treatment time of 1 minute to 3 minutes may be employed.
Next, the post-baking resin is baked. As conditions for the bake treatment, for example, a temperature range of 210 ° C. to 250 ° C. and a treatment time of 20 minutes to 40 minutes may be employed. Thereby, the partition wall 71 can be formed.
The first substrate 41 on which the structure from the drive element layer 151 to the partition 71 is formed is referred to as a substrate 153 below.

Subsequent to the formation of the partition 71, the substrate 153 is subjected to oxygen plasma treatment as shown in FIG. Thereby, the lyophilicity with respect to the liquid material 105a mentioned later is provided to the pixel electrode 29.
Next, as shown in FIG. 10B, the substrate 153 is subjected to CF ₄ plasma treatment. Thereby, the partition 71 is provided with liquid repellency with respect to the liquid 105a described later.

Next, as illustrated in FIG. 11A, the liquid material 105 a is disposed in each region (the light emitting region 73 illustrated in FIG. 5) surrounded by the partition walls 71. The liquid material 105 a contains an organic material that forms the hole injection layer 105.
An ink jet method using a droplet discharge head 155 can be used for the arrangement of the liquid material 105a. In the ink jet method, the liquid material 105a is ejected as droplets 105b.
A technique for ejecting the liquid material 105a and the like as the droplet 105b from the droplet ejection head 155 is called an inkjet technique. A method of arranging the liquid material 105a and the like at a predetermined position using the ink jet technique is called an ink jet method. This ink jet method is one of coating methods.

The hole injection layer 105 shown in FIG. 11B can be formed by drying the liquid 105a disposed in the region surrounded by the partition walls 71 by a reduced pressure drying method. At this time, a bottom surface 121 and a curved surface 123 may be formed in the hole injection layer 105 as shown in FIG.
Note that the liquid 105a containing the organic material constituting the hole injection layer 105 may employ a configuration in which a mixture of PEDOT and PSS is dissolved in a solvent. As the solvent, for example, diethylene glycol, isopropyl alcohol, normal butanol and the like can be employed.
The reduced pressure drying method is a drying method performed under a reduced pressure environment, and is also called a vacuum drying method. In this embodiment, in the drying by the reduced pressure drying method (hereinafter referred to as reduced pressure drying), a dry pump and a turbo molecular pump are used for reducing the pressure.

Following the formation of the hole injection layer 105, a hole transport layer 107 is formed on the display surface 3 side of the hole injection layer 105 as shown in FIG. The hole transport layer 107 is formed by disposing the material of the hole transport layer 107 by a vapor deposition method.
Next, a light emitting layer 109 is formed on the display surface 3 side of the hole transport layer 107 by an evaporation method.
Similarly, the functional layer 31 is formed by forming each of the intermediate layer 111, the light emitting layer 113, the light emitting layer 117, and the electron injection layer 103 by an evaporation method.

Next, as shown in FIG. 6, on the display surface 3 side of the electron injection layer 103, an auxiliary electrode 75 is formed in a region where the electron injection layer 103 and the partition wall 71 overlap. In forming the auxiliary electrode 75, for example, a film forming technique such as a sputtering technique or a vacuum deposition technique, or a patterning technique such as a photolithography technique or an etching technique can be used.
Next, the common electrode 33 is formed on the display surface 3 side of the electron injection layer 103 and the auxiliary electrode 75. In forming the common electrode 33, for example, a film forming technique such as a sputtering technique or a vacuum evaporation technique can be used. In this embodiment, an MgAg film is formed on the display surface 3 side of the electron injection layer 103 and the auxiliary electrode 75 by utilizing a vacuum deposition technique. Thereby, the common electrode 33 can be formed.
The element substrate 11 can be manufactured by the above method.

  In the process of manufacturing the sealing substrate 13, first, as illustrated in FIG. 5, the light shielding layer 85 is first formed in a lattice shape on the facing surface 83 b of the second substrate 81 in a plan view. The light shielding layer 85 can be formed by forming a resin film containing carbon black, chromium, or the like and then patterning the resin film using, for example, a photolithography technique.

Next, a color filter 87 is formed in each filter region 93 surrounded by the light shielding layer 85. The color filter 87 can be formed by disposing a resin containing a colorant corresponding to each of R, G, and B light in each filter region 93. In addition, arrangement | positioning of resin in each filter area | region 93 can be performed by utilizing an inkjet technique or a vapor deposition technique, for example.
Next, an overcoat layer 89 is formed on the light shielding layer 85 and the color filter 87. The overcoat layer 89 can be formed of a light transmissive resin by using, for example, a spin coat technique.
The sealing substrate 13 can be manufactured by the above method.

In the process of assembling the display device 1, as shown in FIG. 2, the element substrate 11 and the sealing substrate 13 are joined via an adhesive 16 and a sealing material 17.
At this time, the element substrate 11 and the sealing substrate 13 are bonded in a state where the first surface 43a of the first substrate 41 and the facing surface 83b of the sealing substrate 13 face each other, as shown in FIG. Thereby, the display apparatus 1 can be manufactured.

In the present embodiment, the pixel electrode 29 corresponds to the first electrode, the common electrode 33 corresponds to the second electrode, the dry pump corresponds to the first pump, and the turbo molecular pump corresponds to the second pump. Yes. In addition, the formation of the hole injection layer 105 corresponds to the coating layer forming process, and the drying of the liquid 105a by drying under reduced pressure corresponds to the drying process in the layer forming process. The formation of the hole transport layer 107, the light emitting layer 109, the intermediate layer 111, the light emitting layer 113, and the light emitting layer 117 corresponds to the vapor deposition layer forming step.
In the present embodiment, the angle θ shown in FIG. 8 is set to 50 degrees or less. Thereby, it is possible to suppress the common electrode 33 from being interrupted at the curved portion 129 (FIG. 6). As a result, the display quality in the display of the display device 1 can be easily improved.

In the present embodiment, the hole injection layer 105 which is the first layer counted from the bottom surface 15 side among the layers constituting the organic layer 101 is formed by a coating method.
For example, the curved portion 129 can be formed on the common electrode 33 even if the first layer is formed by a vapor deposition method and the second layer is formed by a coating method. However, when the first layer is formed by the vapor deposition method and the second layer is formed by the coating method, the solvent in the liquid containing the second layer organic material may dissolve the first layer. As a result, display quality may be impaired.
On the other hand, in this embodiment in which the first layer is formed by the coating method, it is possible to suppress the first layer and the second layer from being damaged each other. In this respect, it is preferable to form the first layer by a coating method.

Here, examples and comparative examples will be described.
In the examples and comparative examples described below, two types of samples are used as the substrate 153 shown in FIG. As shown in FIG. 12, the two types of samples have different values of the angle θ2 between the partition wall 71 and the pixel electrode 29. Two types of angles θ2 of 50 degrees and 60 degrees are employed.
Hereinafter, the substrate 153 whose angle θ2 is 50 degrees is referred to as a substrate 153a. The substrate 153 having an angle θ2 of 60 degrees is called a substrate 153b.
Note that the substrate 153a and the substrate 153b have different post-bake processing conditions in the formation of the partition walls 71 described above.
For the substrate 153a, the post-baking process was performed at a processing temperature of 160 ° C. and a processing time of about 2 minutes.
For the substrate 153b, the post-baking process was performed at a processing temperature of 120 ° C. and a processing time of about 2 minutes.
By varying the post-bake processing conditions, the value of the angle θ2 can be varied between the substrate 153a and the substrate 153b.

Example 1
Oxygen plasma treatment and CF ₄ plasma treatment were performed on the substrate 153a having an angle θ2 of 50 degrees. The order and conditions of these processes were made the same as the order and conditions described above.
Next, the hole injection layer 105 was formed on the substrate 153a. In this example, an ink jet method and a reduced pressure drying method were used for forming the hole injection layer 105. The hole injection layer 105 is formed by the method described above.
Next, each of the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 was sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this embodiment is referred to as a sample 1.

Here, in the vacuum drying for forming the hole injection layer 105, a drying device 161 shown in FIG. 13 was used. The drying device 161 includes a processing chamber 163, a turbo molecular pump 165, a dry pump 167, a valve 169, a valve 171, a valve 173, an exhaust system 175, and an exhaust system 177.
The exhaust system 175 reaches the dry pump 167 via the valve 169 from the processing chamber 163. The valve 169 is provided between the processing chamber 163 and the dry pump 167 in the exhaust system 175.
The exhaust system 177 reaches the dry pump 167 from the processing chamber 163 through the valve 171, the turbo molecular pump 165, and the valve 173 in this order. The valve 171 is provided between the processing chamber 163 and the turbo molecular pump 165 in the exhaust system 177. The valve 173 is provided between the turbo molecular pump 165 and the dry pump 167 in the exhaust system 177.

In Sample 1, the dry pump 167 and the turbo molecular pump 165 were used in combination for the reduced pressure of the reduced pressure drying in the formation of the hole injection layer 105.
In Sample 1, the following reduced pressure conditions are employed as the reduced pressure drying conditions.
In Sample 1, the valve 169 was opened, the valves 171 and 173 were closed, and the pressure was reduced from 10 ⁵ Pa to about 50 Pa using the dry pump 167 for about 0.8 minutes. When the pressure is reduced to about 50 Pa, the valve 169 is closed, the valves 171 and 173 are opened, and the exhaust from the dry pump 167 and the exhaust from the turbo molecular pump 165 are used in combination. Depressurization up to 1 Pa was performed in about 1.5 minutes.
Hereinafter, this vacuum drying condition is referred to as drying condition 1. In this example, the hole injection layer 105 was formed by adopting the drying condition 1.

(Example 2)
Oxygen plasma treatment and CF ₄ plasma treatment were performed on the substrate 153a having an angle θ2 of 50 degrees. The order and conditions of these processes were made the same as the order and conditions described above.
Next, the hole injection layer 105 was formed on the substrate 153a. In this example, an ink jet method and a reduced pressure drying method were used for forming the hole injection layer 105. The hole injection layer 105 is formed by the method described above.
Next, each of the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 was sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this embodiment is referred to as a sample 2.

In sample 2, the dry pump 167 and the turbo molecular pump 165 were used in combination for the reduced pressure of the reduced pressure drying in the formation of the hole injection layer 105.
In sample 2, the following reduced pressure conditions are adopted as reduced pressure drying conditions.
In Sample 2, the valve 169 was opened, the valves 171 and 173 were closed, and the pressure was reduced from 10 ⁵ Pa to about 10 ³ Pa using the dry pump 167 for about 1 minute. When the pressure is reduced to about 10 ³ Pa, the valve 169 is closed, the valves 171 and 173 are opened, and the exhaust from the dry pump 167 and the exhaust from the turbo molecular pump 165 are used together. The pressure was reduced to 0.1 Pa for about 0.3 minutes.
Hereinafter, this vacuum drying condition is referred to as drying condition 2. In this example, the hole injection layer 105 was formed by adopting the drying condition 2.

Example 3
The substrate 153b having an angle θ2 of 60 degrees was subjected to oxygen plasma treatment and CF ₄ plasma treatment. The order and conditions of these processes were made the same as the order and conditions described above.
Next, the hole injection layer 105 was formed on the substrate 153b. In this example, an ink jet method and a reduced pressure drying method were used for forming the hole injection layer 105. The hole injection layer 105 is formed by the method described above.
Next, the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 were sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this embodiment is referred to as a sample 3.

In Sample 3, a dry pump 167 and a turbo molecular pump 165 were used in combination for the reduced pressure of the reduced pressure drying in the formation of the hole injection layer 105.
Moreover, the drying condition 2 mentioned above was employ | adopted as conditions under reduced pressure drying. In this example, the hole injection layer 105 was formed by adopting the drying condition 2.

(Comparative Example 1)
Oxygen plasma treatment and CF ₄ plasma treatment were performed on the substrate 153a having an angle θ2 of 50 degrees. The order and conditions of these processes were made the same as the order and conditions described above.
Next, the hole injection layer 105 was formed on the substrate 153a. In this comparative example, the ink jet method and the reduced pressure drying method were utilized for forming the hole injection layer 105. The hole injection layer 105 is formed by the method described above.
Next, each of the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 was sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this comparative example is referred to as a sample 4.

In the sample 4, only the dry pump 167 was used for the decompression of the decompression drying in the formation of the hole injection layer 105.
In Sample 4, the following reduced pressure conditions are employed as reduced pressure drying conditions.
In the sample 4, the valve 169 was opened, the valves 171 and 173 were closed, and a reduced pressure from 10 ⁵ Pa to about 2 Pa was achieved using the dry pump 167 in about 10 minutes.
Hereinafter, this vacuum drying condition is referred to as drying condition 3. In this comparative example, the hole injection layer 105 was formed by adopting the drying condition 3.

(Comparative Example 2)
The hole injection layer 105 was formed on the substrate 153a having an angle θ2 of 50 degrees. In this comparative example, a vapor deposition method was used to form the hole injection layer 105. Note that HI406 (manufactured by Idemitsu Kosan Co., Ltd.) was used as the material of the hole injection layer 105.
Next, each of the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 was sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this comparative example is referred to as a sample 5.

(Comparative Example 3)
The hole injection layer 105 was formed on the substrate 153b having an angle θ2 of 60 degrees. In this comparative example, a vapor deposition method was used to form the hole injection layer 105. Note that HI406 (manufactured by Idemitsu Kosan Co., Ltd.) was used as the material of the hole injection layer 105.
Next, each of the hole transport layer 107, the light-emitting layer 109, the intermediate layer 111, the light-emitting layer 113, the light-emitting layer 117, and the electron injection layer 103 was sequentially formed on this substrate by a vapor deposition method.

Next, the element substrate 11 was formed by sequentially forming the auxiliary electrode 75 and the common electrode 33 on the substrate.
Next, the display device 1 was assembled by bonding the element substrate 11 and the sealing substrate 13 via the adhesive 16 and the sealing material 17. Hereinafter, the display device 1 in this comparative example is referred to as a sample 6.

In each of Examples 1 to 3 and Comparative Examples 1 to 3, the measurement results of the angle θ and the occurrence results of defects are shown in Table 1 below.
Note that the number of occurrences of dark spots when the pixels 5 for which a predetermined light emission luminance was not obtained was taken as a dark spot was adopted as a result of occurrence of defects. This result indicates that the more dark spots are generated, the more defects are generated.

実施例１〜実施例３及び比較例１〜比較例３の結果から、角度θの値が５０度以下であると、不良の発生を低く抑えやすくすることができることがわかる。
なお、比較例１の試料４においては、角度θを特定することができなかった。これは、試料４において、正孔注入層１０５が、図１４に示すように、交線１２８に平面的に重なる領域に、表示面３側に向かって凸となる凸部１８１を有しているためである。試料４では、正孔注入層１０５において、図７に示す湾曲面１２３が形成されなかったため、角度θを特定することができなかった。
これに対し、試料１〜試料３では、正孔注入層１０５に湾曲面１２３が形成された。

From the results of Examples 1 to 3 and Comparative Examples 1 to 3, it can be seen that when the value of the angle θ is 50 degrees or less, the occurrence of defects can be easily suppressed.
In the sample 4 of Comparative Example 1, the angle θ could not be specified. In the sample 4, the hole injection layer 105 has a convex portion 181 that is convex toward the display surface 3 side in a region that overlaps the intersection line 128 in a plane as shown in FIG. Because. In Sample 4, since the curved surface 123 shown in FIG. 7 was not formed in the hole injection layer 105, the angle θ could not be specified.
On the other hand, in Sample 1 to Sample 3, the curved surface 123 was formed in the hole injection layer 105.

From the results shown in Table 1 above, it can be seen that the occurrence of defects can be more easily suppressed when the value of the angle θ is 30 degrees or less.
Further, it can be seen that when the value of the angle θ is 20 degrees or less, the occurrence of defects can be easily suppressed to a very low level.
From the above results, it is preferable to form at least one of the layers constituting the organic layer 101 by a coating method.
In addition, when forming at least one of the layers constituting the organic layer 101 by a coating method, it is preferable to use two different types of pumps together for reducing the pressure when drying the layer formed by the coating method. In particular, in this case, in the reduced pressure in the reduced pressure drying, the first reduced pressure step using only one of the two types of pumps and the second reduced pressure step using both of the two types of pumps after the first reduced pressure step. It is preferable to reduce the pressure.

In the drying condition 1 described above, performing the pressure reduction from 10 ⁵ Pa to about 50 Pa in about 0.8 minutes using a dry pump corresponds to the first pressure reduction step. In addition, in the drying condition 1, when the pressure is reduced to about 50 Pa, the exhaust by the dry pump and the exhaust by the turbo molecular pump are used in combination, and the pressure is reduced to about 0.1 Pa in about 1.5 minutes. This corresponds to 2 decompression steps.
In the drying condition 2, using a dry pump to reduce the pressure from 10 ⁵ Pa to about 10 ³ Pa in about 1 minute corresponds to the first pressure reduction step. In addition, when the pressure is reduced to about 10 ³ Pa in the drying condition 2, the pressure reduction to about 0.1 Pa is performed in about 0.3 minutes by using both the exhaust by the dry pump and the exhaust by the turbo molecular pump. Corresponds to the second decompression step.

  In the present embodiment, the display device 1 in which a plurality of pixels 5 are set and the organic EL element 27 is provided for each pixel 5 has been described as an example, but the embodiment is not limited thereto. As an embodiment, there is also a form such as a lighting device in which the organic EL elements 27 are arranged in a series over the display region 7. In such a lighting device, the light from the functional layer 31 can be emitted in a planar shape over the display region 7. For this reason, such an illuminating device is suitable for light sources, such as a liquid crystal display device.

In the present embodiment, the top emission type organic EL device that emits light from the functional layer 31 from the display surface 3 through the sealing substrate 13 is described as an example. However, the organic EL device is not limited to this. As the organic EL device, a bottom emission type in which light from the functional layer 31 is emitted from the bottom surface 15 through the element substrate 11 may be employed.
In the case of the bottom emission type, since the light from the functional layer 31 is emitted from the bottom surface 15, the display surface 3 is set on the bottom surface 15 side. That is, in the bottom emission type, the bottom surface 15 of the display device 1 and the display surface 3 are interchanged. In the bottom emission type, the bottom surface 15 side corresponds to the upper side, and the display surface 3 side corresponds to the lower side.

  In the case of the bottom emission type, ITO, indium zinc oxide, or the like can be adopted as the material of the pixel electrode 29. Further, calcium or the like can be adopted as a material for the electron injection layer 103. Aluminum or the like can be used as the material of the common electrode 33.

  The display device 1 described above can be applied to, for example, the display unit 510 of the electronic device 500 shown in FIG. The electronic device 500 is a mobile phone. This electronic device 500 has an operation button 511. The display unit 510 can display various information including information input by the operation buttons 511 and incoming call information. In the electronic apparatus 500, the display device 1 is applied to the display unit 510. In the display device 1, it is possible to suppress the common electrode 33 from being interrupted at the bending portion 129 (FIG. 6). For this reason, in the electronic device 500, it is possible to keep the common electrode 33 from being interrupted in the display unit 510, so that the display quality in the display unit 510 can be easily improved.

  The electronic device 500 is not limited to a mobile phone, and includes various electronic devices such as mobile computers, digital still cameras, digital video cameras, in-vehicle devices such as display devices for car navigation systems, and audio devices.

  DESCRIPTION OF SYMBOLS 1 ... Display apparatus, 3 ... Display surface, 5 ... Pixel, 7 ... Display area, 11 ... Element substrate, 13 ... Sealing substrate, 15 ... Bottom surface, 27 ... Organic EL element, 29 ... Pixel electrode, 31 ... Functional layer, 33 ... Common electrode, 41 ... First substrate, 71 ... Partition, 73 ... Light emitting region, 81 ... Second substrate, 87 ... Color filter, 101 ... Organic layer, 103 ... Electron injection layer, 105 ... Hole injection layer, 105a Liquid body 105b Droplet 107 Hole transport layer 109 Light emitting layer 111 Intermediate layer 113 Light emitting layer 117 Light emitting layer 121 Bottom surface 123 Curved surface 125 Electrode surface 127 ... Wall surface, 128 ... Intersection line, 129 ... Curve, 131 ... Surface, 133 ... Line, 135 ... Normal, 137 ... First point, 139 ... Second point, 141 ... Third point, 143 ... Fourth point 153, substrate, 500, electronic device, 510, display unit, 511,. Create button, θ ... angle.

Claims (8)

A first electrode having a plane;
A second electrode facing the plane of the first electrode on the plane side of the first electrode;
A partition wall having a wall surface protruding from the plane of the first electrode to the second electrode side and surrounding at least a part of the plane;
An organic layer interposed between the first electrode and the second electrode in a region surrounded by the wall surface;
Have
The organic layer includes a plurality of layers including a light emitting layer,
The second electrode is provided from the region surrounded by the wall surface to at least the wall surface,
At least one of the plurality of layers is on the surface on the second electrode side,
A bottom surface overlapping the plane in plan view;
A curved surface that faces an intersection line between the wall surface and the first electrode and is curved in a direction that becomes concave toward the intersection line side;
Contains
In the cross section when cutting the first electrode, the second electrode, the partition and the organic layer along the normal direction of the plane,
A plane parallel to the plane is translated to the bottom surface in the normal direction;
The first point is the intersection of the surface and the curved surface,
The intersection of the surface and the wall surface is the second point,
The midpoint between the first point and the second point is the third point,
When the intersection of the normal line passing through the third point and the curved surface is the fourth point,
An angle formed by a line connecting the first point and the fourth point and the surface is 50 degrees or less. A first electrode;
A second electrode facing the first electrode;
A partition wall having a wall surface protruding from the first electrode to the second electrode side and surrounding at least a partial region of the first electrode;
An organic layer that includes a plurality of layers including a light emitting layer and is interposed between the first electrode and the second electrode in a region surrounded by the wall surface;
A method of manufacturing an organic EL device having
An organic layer forming step of forming the organic layer for each of the plurality of layers in the region surrounded by the wall surface;
Forming the second electrode after the organic layer forming step,
The organic layer forming step includes
A vapor deposition layer forming step of forming a part of the plurality of layers by a vapor deposition method;
A coating layer forming step of forming the other layer of the plurality of layers by a coating method,
The coating layer forming step includes
An arrangement step of arranging a liquid material containing an organic material in a region surrounded by the wall surface;
A layer forming step of forming the layer with the organic material by removing at least a part of the liquid contained in the liquid;
Including
In the layer forming step, on the surface opposite to the first electrode side of the layer formed in the layer forming step, the line faces the intersection line of the wall surface and the first electrode, and on the intersection line side. Forming a curved surface that curves in a concave direction
A method for manufacturing an organic EL device. The layer forming step includes a drying step of removing at least a part of the liquid by drying at least a part of the liquid.
The method of manufacturing an organic EL device according to claim 2. The drying step includes a reduced pressure drying step of drying at least a part of the liquid in a reduced pressure environment reduced to a pressure lower than atmospheric pressure.
The method of manufacturing an organic EL device according to claim 3.   5. The method of manufacturing an organic EL device according to claim 4, wherein in the layer forming step, the curved surface is formed in the reduced-pressure drying step. The vacuum drying step includes
A first pressure reduction step of reducing the pressure to a first pressure lower than the atmospheric pressure using a first pump;
Subsequent to the first pressure reducing step, the first pressure and the second pump are used in combination to reduce the first pressure to a second pressure lower than the first pressure. Including a process,
The method of manufacturing an organic EL device according to claim 5.   The method for manufacturing an organic EL device according to claim 2, wherein in the organic layer forming step, the vapor deposition layer forming step is performed after the coating layer forming step.   An electronic apparatus comprising the organic EL device according to claim 1.

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