JP2010231076A - Optical film, manufacturing method thereof, and light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical film capable of manufacturing the optical film, without the use of lapping. <P>SOLUTION: Laser light L<SB>1</SB>is irradiated to a plurality of positions on a substrate film 91 (Fig.15 (A)), to form a plurality of through-holes 91A in the substrate film 91 (Fig.15 (B)), and then a light-reflecting film 92 is formed along a side surface 91D of each through-hole 91A, by using a vacuum vapor deposition method, a sputtering method, or the like (Fig.15 (C)). Next, after at least each through-hole 91A is filled with a liquid energy-curable transparent resin 93D, the substrate film 91 is interposed between two plane plates (a drive panel 70 and a sealing panel 80), facing each other so as to be put on and under them (Fig.15 (D)). Next, the transparent resin 93D is heated to make the transparent resin 93D cure. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical film that corrects the radiation angle of incident light, a method for manufacturing the same, and a light-emitting device that includes the optical film.

  In recent years, an organic EL display using an organic EL (electro-luminescence) element has been put into practical use as a display device replacing a liquid crystal display. Since the organic EL element is a self-luminous type, the viewing angle is wider than that of liquid crystal and the like, and it is considered that the organic EL element has sufficient response to a high-definition high-speed video signal.

  The organic EL element has, for example, a first electrode, an organic layer including a light emitting layer, and a second electrode in order on a substrate, and a DC voltage is applied between the first electrode and the second electrode. Then, hole-electron recombination occurs in the light emitting layer, and light is generated. The generated light is generally extracted from the second electrode side.

  In the organic EL element, since the refractive index inside the element is high (for example, 1.5 or more), total reflection is likely to occur at the interface with the air layer (refractive index 1.0), and the emitted light can be sufficiently extracted outside. Have difficulty. Therefore, a method has been proposed in which a reflector (reflector) is disposed on the light extraction side of the organic EL element to correct the radiation angle of the emitted light and increase the light extraction efficiency (for example, Patent Documents 1 and 2). ). In the reflectors described in Patent Documents 1 and 2, a plurality of protrusions are formed on a glass substrate corresponding to the arrangement of the organic EL elements, and the side surfaces of the protrusions are covered with a reflecting member.

  The reflector can be manufactured as follows, for example. First, after a plurality of convex portions are regularly formed on one main surface of a glass substrate using, for example, a nanoimprint method, a reflective member is formed on the entire surface by vapor deposition, for example. Next, after embedding the reflecting member with resin and curing the resin, the upper surface of the convex portion is surfaced by lapping, for example. In the reflector thus manufactured, a part of the light incident on the upper surface of the convex portion is reflected by the reflecting member formed on the side surface of the convex portion, and the light whose radiation angle is corrected is an angle less than the critical angle. Then, the light enters the interface between the glass substrate and the air and is emitted to the outside from the glass substrate side.

Japanese Patent No. 3573393 JP-T-2005-53102

  By the way, when the reflector was manufactured as described above, there were problems in the following two points. First, since the first problem is that a reflective member is formed on the entire surface, it is necessary to use wrapping to form the light incident surface of the reflector. In other words, it is difficult to ensure high accuracy in the surface. The second problem is that an interface is always formed on the light incident surface of the reflector because of the process of chamfering the upper surface of the convex portion by lapping, and light extraction efficiency is caused by reflection at this interface. Will be reduced.

  This invention is made | formed in view of this problem, The 1st objective is to provide the manufacturing method of the optical film which can be manufactured without using lapping. Another object of the present invention is to provide an optical film capable of eliminating a decrease in light extraction efficiency due to reflection at the interface of the light incident surface, and a light emitting device including the optical film.

  The manufacturing method of the optical film of this invention includes the process of forming a light reflection film along the inner surface of each through-hole after forming a several through-hole in a base film. In the method for producing an optical film of the present invention, a light reflecting film is formed on the inner surface of the through hole formed in the base film. At this time, since no structure is provided in the opening of the through hole, no light reflecting film is formed in the opening of the through hole.

  The optical film of the present invention includes a base film in which a plurality of through holes are formed. This optical film includes a light reflecting film along the inner surface of each through hole, and includes a light transmission portion formed collectively on both surfaces of the base film through each through hole. The light emitting device of the present invention includes a light emitting panel having a plurality of light emitting elements on a support substrate, and an optical film provided on the light emitting element side in relation to the light emitting panel. The optical film mounted on the light emitting device has the same components as the optical film. In the optical film and the light emitting device of the present invention, the light transmission part is collectively formed inside each through hole and on both surfaces of the base film, and no interface exists at the opening of the through hole.

  According to the method for producing an optical film of the present invention, since no structure is provided in the opening of the through hole, no light reflecting film is formed in the opening of the through hole, and light is incident. There is no need to use wrapping to form the surface. Therefore, in the next step, for example, after filling the resin in each through hole, the base film is sandwiched between two flat plates facing each other and overlapped, and the resin is cured to form a light transmission part. An optical film can be completed. Therefore, an optical film can be manufactured without using lapping.

  According to the optical film and the light emitting device of the present invention, since no interface is present at the opening of the through hole, it is possible to eliminate a decrease in light extraction efficiency due to reflection at the interface of the light incident surface.

1 is a schematic configuration diagram of a light emitting device according to a first embodiment of the present invention. It is a block diagram of a pixel drive circuit. It is sectional drawing of the light-emitting device of FIG. It is sectional drawing of the modification of the light-emitting device of FIG. 4 is a top view of the reflector of FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of an example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. FIG. 4 is a perspective view, a top view, and a side view of another example of the through hole in FIG. 3. It is sectional drawing for demonstrating an example of the manufacturing process of the reflector of FIG. It is sectional drawing for demonstrating the other example of the manufacturing process of the reflector of FIG. It is a schematic block diagram of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the modification of the light-emitting device of FIG. It is a top view showing schematic structure of the module containing the light-emitting device of each said embodiment. It is a perspective view showing the external appearance of the application example 1 of the light-emitting device of each said embodiment. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the invention will be described in detail with reference to the drawings. The description will be given in the following order.

1. First Embodiment (Reflector has an adhesive layer. See FIGS. 3 and 4)
2. Second Embodiment (Reflector has no adhesive layer. See FIGS. 17 and 18)
3. Application examples (digital cameras, etc., see FIGS. 19 to 24)

<First Embodiment>
(Outline configuration)
FIG. 1 shows a schematic configuration of a light emitting device 1 according to a first embodiment of the present invention. The light emitting device 1 is used for an ultra-thin organic light emitting color display device or the like. The light emitting device 1 includes, for example, a display region 20 in which a plurality of organic EL elements 10R, 10G, and 10B (light emitting elements) are arranged in a matrix. In the present embodiment, for example, the organic EL elements 10R, 10G, and 10B adjacent to each other in the display region 20 constitute one pixel 11. Hereinafter, the organic EL element 10 is used as a general term for the organic EL elements 10R, 10G, and 10B. The light emitting device 1 further includes a signal line driving circuit 30, a scanning line driving circuit 40, and a power supply line driving circuit 50 around the display area 20.

(Circuit configuration)
FIG. 2 shows an example of a circuit configuration in the display area 20. In the display area 20, for example, a pixel drive circuit 60 illustrated in FIG. 2 is formed. The pixel driving circuit 60 is formed on a driving substrate 71 described later. The pixel drive circuit 60 is configured by, for example, a drive transistor Tr1, a write transistor Tr2, a storage capacitor Cs, and the organic light emitting element 10, and has a 2Tr1C circuit configuration. The drive transistor Tr1 and the write transistor Tr2 are formed of, for example, an n-channel MOS thin film transistor (TFT (Thin Film Transistor)). The type of TFT is not particularly limited, and may be, for example, an inverted stagger structure (so-called bottom gate type) or a stagger structure (top gate type). The drive transistor Tr1 or the write transistor Tr2 may be a p-channel MOS type TFT.

  In the pixel driving circuit 60, a plurality of signal lines DTL are arranged in the column direction, and a plurality of scanning lines WSL and power supply lines Vcc are arranged in the row direction. The intersection of each signal line DTL and each scanning line WSL corresponds to one of the organic light emitting elements 10 (subpixel). Each signal line DTL is connected to the signal line drive circuit 30 so that an image signal is supplied from the signal line drive circuit 30 to the source electrode or drain electrode (not shown) of the write transistor Tr2 via the signal line DTL. It has become. Each scanning line WSL is connected to the scanning line driving circuit 40, and scanning signals are sequentially supplied from the scanning line driving circuit 40 to the gate electrode (not shown) of the writing transistor Tr2 via the scanning line WSL. . Each power supply line Vcc is connected to the power supply line drive circuit 60, and a power supply voltage is supplied from the power supply line drive circuit 60 to the source electrode or drain electrode (not shown) of the drive transistor Tr1 via the power supply line Vcc. ing.

(Cross section configuration)
FIG. 3 illustrates an example of a cross-sectional configuration of a part of the light emitting device 1, specifically, one pixel 11. The light emitting device 1 has a structure in which, for example, in one pixel 11, a drive panel 70 (light emitting panel) and a sealing panel 80 are bonded together via a reflector 90 (optical film). A certain layer (for example, an adhesive layer) may be provided between the drive panel 70 and the reflector 90. Similarly, some layer (for example, an adhesive layer) may be provided between the sealing panel 80 and the reflector 90. In addition, when the light-emitting device 1 is manufactured by a manufacturing method described later, a resin 93D described later serves as an adhesive layer. Therefore, even if the above-described adhesive layer is not provided, there is no possibility that the drive panel 70 and the sealing panel 80 are peeled off from the reflector 90.

(Drive panel 70)
The drive panel 70 has a plurality of organic EL elements 10 arranged in a matrix at a predetermined pitch (for example, 20 μm to 100 μm) on the drive substrate 71 (support substrate) on which the pixel drive circuit 60 described above is formed. is doing. In the present embodiment, for example, three adjacent elements among the plurality of organic EL elements 10 arranged in a matrix form correspond to the organic EL elements 10R, 10G, and 10B, and constitute one pixel 11. ing. Each organic EL element 10R, 10G, 10B has a first electrode 72 on a driving substrate 71, and an organic layer 73 and a second electrode 75 are arranged on the surface of the first electrode in this order from the driving substrate 71 side. Have.

  Here, the first electrode 72 has not only a function as an electrode (anode) for injecting current into the organic layer 73 but also a function of reflecting light generated in the light emitting layer described later. The first electrode 72 is made of a metal such as aluminum, for example. For example, the organic layer 73 is made of a material different for each of the organic EL elements 10R, 10G, and 10B. The organic layer 73 (73R) in the organic EL element 10R includes a light emitting layer made of a material that emits red light. The organic layer 73 (73G) in the organic EL element 10G includes a light emitting layer made of a material that emits green light. The organic layer 73 (73B) in the organic EL element 10B includes a light emitting layer made of a material that generates blue light emission. The second electrode 75 is formed over the entire surface including the upper surface of the organic layer 73 and an insulating film 74 described later, and functions as a common electrode for the organic EL elements 10R, 10G, and 10B. The second electrode 75 is made of a transparent conductive film such as ITO (Indium Tin Oxide).

  The drive panel 70 also has an insulating film 74 between the adjacent organic layers 73. The insulating film 74 ensures insulation between the first electrode 72 and the second electrode 75 and defines an opening for each subpixel. The insulating film 74 is made of, for example, a photosensitive resin. The insulating film 74 has an opening 74 </ b> A in a region facing the first electrode 72. Accordingly, in the organic layer 73, a contact portion with a portion of the first electrode 72 exposed in the opening 74A becomes a light emitting region (not shown). From the viewpoint of light extraction efficiency, the opening 74A is preferably formed in a region facing a light incident side opening 91B of a reflector 90 described later.

  3 illustrates the case where the upper surface of the drive panel 70 is the second electrode 75, but some layer (for example, an insulating protective film) may be formed on the second electrode 75. Good. From the viewpoint of light extraction efficiency, the insulating protective film preferably has a thickness such that the distance between the upper surface of the organic EL element 10 and an opening 91B of a reflector 90 described later is 10 μm or less.

(Sealing panel 80)
The sealing panel 80 has a sealing substrate 81 that seals the organic EL element 10. The sealing substrate 81 is made of a material such as glass that is transparent to the light generated by the organic EL element 10. The sealing panel 80 includes a color filter 82, for example. For example, the color filter 82 is provided on the surface of the sealing substrate 81 on the side on which the light of the organic EL element 10 is incident. The color filter 82 includes, for example, a red filter 82R, a green filter 82G, and a blue filter 82B corresponding to each of the organic EL elements 10R, 10G, and 10B. The color filter 82 has, for example, a black matrix 82BM along the boundaries of the filters 82R, 82G, and 82B.

  The filters 82R, 82G, and 82B are formed in a matrix with the same arrangement pitch as the organic EL elements 10, and are formed to face the organic layer 73, respectively. These are each composed of a resin mixed with a pigment, and by selecting the pigment, the light transmittance in the target red, green or blue wavelength range is high, and the light transmittance in other wavelength ranges is low. It has been adjusted to be. The black matrix 82BM improves the contrast by absorbing the incident external light that is reflected in the drive panel 70 and the sealing panel 80 and travels toward the sealing substrate 81 side. The black matrix 82BM is made of, for example, a black resin mixed with a black colorant.

  FIG. 3 illustrates the case where the color filter 82 is provided on the lower surface of the sealing panel 80, but some layer (for example, an optical element such as a color conversion filter or a polarization filter) instead of the color filter 82. May be provided. Here, the color conversion filter is for converting light of a single color (for example, blue) into light of RGB three colors, for example. Therefore, when a color conversion filter is provided in place of the color filter 82, each organic layer 73 may include a light emitting layer made of a material that emits light of a single color (for example, blue). preferable.

  3 illustrates the case where the color filter 82 is provided on the sealing panel 80, for example, the color filter 82 is removed from the sealing panel 80 as shown in FIG. Also good. In this case, the organic layer 73 may be made of a material different for each of the organic EL elements 10R, 10G, and 10B, and each organic layer 73 is a light emission made of a material that emits light of a single color (for example, white). You may be comprised including the layer.

(Reflector 90)
The reflector 90 increases the light extraction efficiency by correcting the radiation angle of the light emitted from the organic EL element 10. For example, as shown in FIGS. 3 and 5, the reflector 90 includes a base film 91 in which a plurality of through holes 91 </ b> A are formed, a light reflecting film 92, and a light transmitting portion 93. FIG. 5 illustrates an example of a top surface configuration when the base film 91 is viewed from the sealing panel 80 side.

  The base film 91 is made of, for example, a resin film such as polyimide, and has a thickness of about 0.2 to 1.0 times the pitch of the through holes 91A, for example. The plurality of through holes 91 </ b> A are formed in a matrix at the same arrangement pitch as the organic EL elements 10, and are formed to face the organic layer 73.

  When the color filter 82 is formed, the opening 91C on the upper surface side (sealing panel 80 side) of the through hole 91A is formed in a region facing the filters 82R, 82G, and 82B. That is, the lateral width W1 of the opening 91C is the same as or narrower than the lateral width W2 of the filters 82R, 82G, and 82B (see FIG. 3). The area of the opening 91C and the area of the opening 91B on the lower surface side (drive panel 70 side) of the through hole 91A are different from each other. Specifically, the area of the opening 91C is larger than the area of the opening 91B. That is, the through hole 91A has a mortar shape when viewed from the sealing panel 80 side. Here, the central axis (not shown) of the through hole 91A is, for example, parallel to the normal line of the base film 91 and passes through the center points (not shown) of the openings 91B and 91C. It is preferable. The opening 91B is preferably formed in a region facing the opening 91C.

  Between the outer edge of the opening 91B and the outer edge of the opening 91C, a side surface 91D (the inner surface of the through hole 91A) that defines the shape of the through hole 91A in the axial direction is provided. As illustrated in FIG. 5, the side surface 91D has an annular shape connected to the outer edge of the opening 91B and the outer edge of the opening 91C, and faces the sealing panel 80 side. The cross-sectional shape when the side surface 91D is cut in a plane parallel to the normal line of the base film 91, that is, the outline of the cross section of each through hole 91A in the plane parallel to the normal line of the base film 91 is, for example, It is linear or parabolic. The side surface 91 </ b> D has n-fold rotational symmetry (n is an integer of 2 or more) or complete rotational symmetry about a single line segment (not shown) parallel to the normal direction of the base film 91. When the central axis of the through hole 91A is parallel to the normal direction of the base film 91, the side surface 91D has, for example, n-fold rotational symmetry or complete rotational symmetry about the central axis of the through-hole 91A. It has become.

  Here, n-fold rotational symmetry means that there are n rotational positions that are symmetrical with respect to before rotation while the object to be rotated is rotated 360 degrees about a predetermined axis. Completely rotationally symmetric means that, unlike the rotationally symmetric in the normal sense, even if the object to be rotated is rotated at any angle from 0 degrees to 360 degrees around a predetermined axis, the object is symmetrical with respect to that before the rotation. The specific shape of the through hole 91A will be described later.

  The light reflecting film 92 is made of, for example, aluminum (Al), silver (Ag), an Al alloy, an Ag alloy, or the like, and is formed using, for example, a vacuum evaporation method or a sputtering method. The light reflecting film 92 is formed along at least the side surface 91D. Therefore, like the side surface 91D, the light reflecting film 92 has an annular shape and faces the sealing panel 80 side. Further, the light reflecting film 92 has the same symmetry as the side surface 91D, and is n-fold rotationally symmetric about one line segment (not shown) parallel to the normal direction of the base film 91. It has become. When the central axis of the through hole 91A is parallel to the normal direction of the base film 91, the light reflecting film 92 is, for example, two-fold rotationally symmetric about the central axis of the through hole 91A, four times It is rotationally symmetric or fully rotationally symmetric. When the side surface 91D has a light reflecting function, the light reflecting film 92 may not be formed.

  The light transmission part 93 allows the light emitted from the organic EL element 10 to pass to the sealing panel 80 side, and is made of an energy curable transparent resin. Examples of the energy curable transparent resin include a thermosetting resin and an ultraviolet curable resin. The light transmission part 93 is filled in each through hole 91A, and is formed in layers on both surfaces (upper surface 91E, lower surface 91F) of the base film 91. Of the light transmitting portion 93, the portion filled in each through hole 91A and the portions (adhesive layers 93A, 93B) formed in layers on both surfaces (upper surface 91E, lower surface 91F) of the base film 91 are manufactured. In the process, they are formed in a lump and there is no interface between them. That is, no interface exists in the openings 91B and 91C of each through hole 91A.

  Here, the thickness of the adhesive layer 93A is such that the upper surface of the organic EL element 10 and an opening 91B of a reflector 90 to be described later are reduced in order to reduce a decrease in light extraction efficiency due to reflection and absorption on the lower surface 91F of the base film 91. Is preferably half or less of the thickness of the base film 91. On the other hand, the thickness of the adhesive layer 93B is about 15% or less with respect to the pixel pitch (the arrangement pitch of the organic EL elements 10) when the color filter 82 is provided on the lower surface of the sealing panel 80. Preferably it is. The thickness of the adhesive layer 93B is preferably as small as possible in order to reduce light leakage (crosstalk) to an adjacent element and absorption (vignetting) in the black matrix 82BM.

(Variation of through hole 91A)
Next, with reference to FIGS. 6A and 6B to FIGS. 14A and 14B, various shapes of the through hole 91A will be described. However, FIGS. 6A, 7A, 8A, 9A, 10A, 11A, 12A, 13A, FIG. 14A shows the through hole 91 </ b> A as viewed obliquely from above. 6B, FIG. 7B, FIG. 8B, FIG. 9B, FIG. 10B, FIG. 11B, FIG. 12B, FIG. 13B, FIG. (B) is a top view and a side view of the through hole 91A. The side view is viewed from two directions (first direction and second direction) orthogonal to each other in the plane of the base film 91. The first direction corresponds to, for example, the horizontal direction, and the second direction corresponds to, for example, the vertical direction.

  6A and 6B show an example of complete rotational symmetry. The through hole 91A has a completely rotationally symmetrical shape. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light equally to each other in both the first direction and the second direction. Each of the upper surface 91E and the lower surface 91F has a circular shape, and a cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E has a circular shape. The side surface 91D has the same shape when viewed from all directions within the surface of the base film 91 including the first direction and the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  FIGS. 7A and 7B show another example of complete rotational symmetry. The through hole 91A has a completely rotationally symmetrical shape. Therefore, the through hole 91A also has a function of correcting the viewing angle of incident light equally in both the first direction and the second direction. Each of the upper surface 91E and the lower surface 91F has a circular shape, and a cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E has a circular shape. The side surface 91D has the same shape when viewed from all directions within the surface of the base film 91 including the first direction and the second direction. The side surface 91D is configured by a conical surface, and the outline of the cross section of the through hole 91A in a plane parallel to the normal line of the upper surface 91E is linear.

  8A and 8B show an example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. The upper surface 91E has an elliptical shape extending in the first direction, and the lower surface 91F has a circular shape. The cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E changes from a circular shape to an elliptical shape as it goes from the lower surface 91F to the upper surface 91E. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  FIGS. 9A and 9B show another example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. Each of the upper surface 91E and the lower surface 91F has an elliptical shape extending in the first direction, and the cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E is also an elliptical shape extending in the first direction. ing. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  FIGS. 10A and 10B show another example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. The upper surface 91E has an elliptical shape extending in the first direction, and the lower surface 91F has an elliptical shape extending in the second direction. Regarding the cross section when the through-hole 91A is cut along a plane parallel to the upper surface 91E, the length in the second direction becomes shorter than the length in the first direction from the lower surface 91F toward the upper surface 91E. The direction changes from the second direction to the first direction. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  FIGS. 11A and 11B show an example of four-fold rotational symmetry. The through hole 91A has a four-fold rotationally symmetric shape. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light equally to each other in both the first direction and the second direction. Each of the upper surface 91E and the lower surface 91F has a square shape, and the cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E has a square shape. The side surface 91D has the same shape when viewed from the first direction and when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  12A and 12B show another example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. The upper surface 91E has a rectangular shape extending in the first direction, and the lower surface 91F has a circular shape. The cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E changes from a circular shape to a rectangular shape from the lower surface 91F toward the upper surface 91E. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  FIGS. 13A and 13B show another example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. The upper surface 91E has a rectangular shape extending in the first direction, and the lower surface 91F has an elliptical shape extending in the first direction. The cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E changes from an elliptical shape to a rectangular shape from the lower surface 91F toward the upper surface 91E. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  14A and 14B show another example of two-fold rotational symmetry. The through hole 91A has a two-fold rotational symmetry shape. The upper surface 91E has a rectangular shape extending in the first direction, and the lower surface 91F has an elliptical shape extending in the second direction. The cross section when the through hole 91A is cut along a plane parallel to the upper surface 91E changes from an elliptical shape to a rectangular shape from the lower surface 91F toward the upper surface 91E. Further, regarding the cross section when the through hole 91A is cut by a plane parallel to the upper surface 91E, the length in the second direction becomes shorter than the length in the first direction from the lower surface 91F toward the upper surface 91E, The major axis direction changes from the second direction to the first direction. Accordingly, the through hole 91A has a function of correcting the viewing angle of incident light to be large in the first direction and to be small in the second direction. The side surface 91D has the narrowest shape when viewed from the first direction, and the widest shape when viewed from the second direction. The side surface 91D is configured by a parabolic surface, and the outline of the cross section of the through hole 91A on a plane parallel to the normal line of the upper surface 91E is a parabolic shape.

  In the through hole 91A described in FIGS. 8A, 8B to 14A, 14B, the outline of the cross section of the through hole 91A in a plane parallel to the normal line of the upper surface 91E is straight. It may be in the shape. Above, description is complete | finished about the various shapes of 91 A of through-holes.

(Production method)
Next, a method for manufacturing the light emitting device 1 of the present embodiment will be described.

15A to 15D illustrate an example of a method for manufacturing the light emitting device 1 in the order of steps. First, after preparing a substrate film 91 is irradiated with laser light L ₁ at a plurality of base film 91 (FIG. 15 (A)). At this time, a mask having an opening corresponding to the shape of the through hole 91 </ b> A to be formed may be disposed on the base film 91. Thereby, a plurality of through holes 91A are formed in the base film 91 (FIG. 15B).

  Next, the light reflecting film 92 is formed along the side surface 91D of the base film 91 by using, for example, a vacuum deposition method or a sputtering method (FIG. 15C). Subsequently, after at least each through-hole 91A is filled with a liquid energy-curable transparent resin 93D, the base film 91 is sandwiched between two flat plates facing each other and overlapped. At this time, for example, a thermosetting resin is used as the liquid energy curable transparent resin 93D. Moreover, as a flat plate which pinches | interposes the base film 91, as shown to FIG 15 (D), the drive panel 70 and the sealing panel 80 are used, for example.

  In the above process, when the base film 91 is sandwiched between two flat plates and overlapped, the transparent resin 93D is not only inside each through hole 91A but also on the upper surface 91E side and the lower surface 91F side of the base film 91. Is also present at a certain thickness. Therefore, for example, as shown in FIG. 15D, the transparent resin 93D is also present between the upper surface and the lower surface 91F of the drive panel 70 and between the lower surface and the upper surface 91E of the sealing panel 80. The interfaces do not exist in the openings 91B and 91C of the through holes 91A.

  Next, the transparent resin 93D is cured by irradiating energy (for example, heat) to the transparent resin 93D. Thereby, the light transmission part 93 is integrally formed in the inside of each through-hole 91A, and the upper surface 91E and the lower surface 91F of the base film 91 (refer FIG. 3). In this way, the reflector 90 and the light emitting device 1 of the present embodiment are manufactured.

  In addition, about preparation of 91 A of through-holes to the base film 91, it is possible to take another method. FIGS. 16A to 16C show another example of the manufacturing process of the through hole 91A in the order of processes.

  First, after preparing the base film 91, a photosensitive resist layer 100 is formed on the surface of the base film 91 by coating or the like (FIG. 16A). Next, the resist layer 100 is exposed and developed through a mask (not shown) having an opening corresponding to the shape of the through hole 91A to be formed on the resist layer 100. Thereby, an opening 100A is formed at a predetermined position of the resist layer 100 (FIG. 16B).

  Next, the base film 91 is selectively removed through the opening 100A by using, for example, a wet etching method, a dry etching method, or a sand blasting method. Thereby, the through-hole 91 is formed in the part of the base film 91 just under the opening 100A (FIG. 16C). Thereafter, the resist layer 100 is removed. Even in this way, it is possible to produce a plurality of through holes 91 </ b> A in the base film 91.

  Next, the operation and effect of the light emitting device 1 of the present embodiment will be described.

  In the light emitting device 1 according to the present embodiment, the driving transistor Tr1 is controlled to be turned on / off for each subpixel, and a driving current is injected into the organic EL element 10 of each subpixel, whereby holes and electrons are recombined. Light emission occurs. This light is multiple-reflected between the first electrode 72 and the second electrode 75, and is transmitted through the second electrode 75, the light transmitting portion 93, the filters 82R, 82G, and 82B, and the sealing substrate 81 and extracted.

  By the way, in this Embodiment, the light transmissive part 93 is filled inside each through-hole 91A, and is formed in layers on both surfaces (upper surface 91E, lower surface 91F) of the base film 91. And the part with which the inside of each through-hole 91A was filled among the light transmissive parts 93, and the part (adhesion layer 93A, 93B) formed in layers on both surfaces (upper surface 91E, lower surface 91F) of the base film 91 are formed. These are formed in a lump in the manufacturing process, and no interface exists between them. As described above, in this embodiment, since there is no interface in the openings 91B and 91C of each through hole 91A, light from the organic EL element 10 may be reflected in the openings 91B and 91C of each through hole 91A. There is no. Thereby, in the openings 91 </ b> B and 91 </ b> C of each through-hole 91 </ b> A, it is possible to eliminate the possibility that the light extraction efficiency is reduced due to reflection at the interface.

  In the manufacturing method of the present embodiment, after a plurality of through holes 91A are formed in the base film 91, light reflection is performed along the side surface 91D of each through hole 91A using, for example, a vacuum deposition method or a sputtering method. A film 92 is formed. At this time, no structures are provided in the openings 91B and 91C of the through holes 91A, and the light reflecting film 92 is not formed in the openings 91B and 91C. It is not necessary to use wrapping that has been used in the past for forming the. Therefore, in the next step, for example, after the transparent resin 93D is filled in each through hole 91A, the base film 91 is sandwiched between two flat plates and overlapped, and the transparent resin 93D is cured to form the light transmitting portion 93. The reflector 90 can be completed only by doing. Therefore, in the manufacturing method of the present embodiment, the reflector 90 can be manufactured without using lapping, so that in-plane accuracy can be easily ensured at low cost.

  Further, in the manufacturing method of the present embodiment, the thickness of the adhesive layer 93B can be suppressed to 70% or less as compared with the conventional case where a plurality of convex portions are regularly formed using, for example, a nanoimprint method. Is possible. As described above, it is understood from the simulation result that the light extraction efficiency is improved by about 5% and the radiation angle characteristic is improved by about 2 to 3% as a result of the thickness of the adhesive layer 93B being suppressed to 70% or less. It was. Therefore, it can be said that the manufacturing method of the present embodiment is a useful method capable of improving the light extraction efficiency and the radiation angle characteristic.

<Second Embodiment>
FIG. 17 illustrates an example of a cross-sectional configuration of the light emitting device 2 according to the second embodiment of the present invention. The light emitting device 2 is different from the configuration of the light emitting device 1 of the above embodiment in that the adhesive layers 93A and 93B are not provided on the reflector 90. Therefore, in the following, differences will be mainly described, and common points will be omitted as appropriate.

  As described above, the reflector 90 of the present embodiment does not have the adhesive layers 93A and 93B. Therefore, the upper surface 91E of the base film 91 and the opening 91C of the through hole 91 are in direct contact with the sealing panel 80, and the lower surface 91F of the base film 91 and the opening 91B of the through hole 91 are directly connected to the drive panel 70. Is in contact with

  17 illustrates the case where the color filter 82 is provided on the sealing panel 80, for example, the color filter 82 is removed from the sealing panel 80 as shown in FIG. Also good. In this case, the organic layer 73 may be made of a material different for each of the organic EL elements 10R, 10G, and 10B, and each organic layer 73 is a light emission made of a material that emits light of a single color (for example, white). It is composed of layers.

(Production method)
The light emitting device 2 of the present embodiment can be manufactured by the same method as the light emitting device 1 of the above embodiment. First, after preparing the base film 91, the laser light L ₁ is irradiated to a plurality of locations on the base film 91. At this time, a mask having an opening corresponding to the shape of the through hole 91 </ b> A to be formed may be disposed on the base film 91. Thereby, a plurality of through holes 91 </ b> A are formed in the base film 91.

  Next, the light reflecting film 92 is formed along the side surface 91D of the base film 91 by using, for example, a vacuum deposition method or a sputtering method. Subsequently, after filling the liquid energy curable transparent resin 93D only inside each through hole 91A, the base film 91 is sandwiched between two flat plates facing each other and overlapped. At this time, for example, a thermosetting resin is used as the liquid energy curable transparent resin 93D. Moreover, as a flat plate which pinches | interposes the base film 91, the drive panel 70 and the sealing panel 80 are used, for example. In order to fill the transparent resin 93D only inside each through hole 91A, for example, the following method is effective. First, the base film 91 is disposed in contact with the drive panel 70. Next, the transparent resin 93D is dropped only inside each through-hole 91A using, for example, an inkjet method. Next, the sealing panel 80 is overlaid on the upper surface of the base film 91. In this way, it is possible to fill the transparent resin 93D only inside each through hole 91A.

  In the above process, when the base film 91 is sandwiched between two flat plates and overlapped, the transparent resin 93D exists only in each through hole 91A. Therefore, for example, as shown in FIG. 15D, the transparent resin 93D exists between the upper surface and the lower surface 91F of the drive panel 70 or between the lower surface and the upper surface 91E of the sealing panel 80. Absent.

  Next, the transparent resin 93D is cured by irradiating energy (for example, heat) to the transparent resin 93D. Thereby, the light transmission part 93 is formed only inside each through-hole 91A. In this way, the reflector 90 and the light emitting device 2 of the present embodiment are manufactured.

  In the present embodiment, the light transmission part 93 is provided only inside each through hole 91A. Therefore, the upper surface 91E of the base film 91 and the opening 91C of the through hole 91 are in direct contact with the sealing panel 80, and the lower surface 91F of the base film 91 and the opening 91B of the through hole 91 are directly connected to the drive panel 70. Is in contact with Thereby, since the distance of the upper surface of the organic layer 73 and the opening 91B of the reflector 90 can be made small, the light emitted from the organic layer 73 is reflected in parts other than the through-hole 91 among the base film 91. Or the rate of absorption can be reduced. As a result, the light extraction efficiency can be improved.

  In the manufacturing method of the present embodiment, after a plurality of through holes 91A are formed in the base film 91, light reflection is performed along the side surface 91D of each through hole 91A using, for example, a vacuum deposition method or a sputtering method. A film 92 is formed. At this time, no structures are provided in the openings 91B and 91C of the through holes 91A, and the light reflecting film 92 is not formed in the openings 91B and 91C. It is not necessary to use wrapping that has been used in the past for forming the. Therefore, in the next step, for example, by using an inkjet method, the transparent resin 93D is dropped only inside each through hole 91A, and then the sealing panel 80 is overlaid on the upper surface of the base film 91 to cure the transparent resin 93D. Only the reflector 90 can be completed. Therefore, in the manufacturing method of the present embodiment, the reflector 90 can be manufactured without using lapping, so that in-plane accuracy can be easily ensured at low cost.

(Modules and application examples)
Hereinafter, application examples of the light-emitting device described in the first and second embodiments will be described. The light emitting device of each of the above embodiments is a video signal input from the outside or a video signal generated internally, such as a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone or a video camera. The present invention can be applied to display devices for electronic devices in various fields that display images or videos.

(module)
The light-emitting device of each said embodiment is integrated in various electronic devices, such as the application examples 1-5 mentioned later, for example as a module as shown in FIG. In this module, for example, a region 210 exposed from the sealing substrate 81 is provided on one side of the driving substrate 71, and the signal line driving circuit 30, the scanning line driving circuit 40, and the power line driving circuit are provided in the exposed region 210. 50 wirings are extended to form external connection terminals (not shown). The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 20 illustrates an appearance of a television device to which the light-emitting device of each of the above embodiments is applied. The television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to each of the above embodiments. .

(Application example 2)
FIG. 21 shows the appearance of a digital camera to which the light emitting device of each of the above embodiments is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to each of the above embodiments. Yes.

(Application example 3)
FIG. 22 shows an appearance of a notebook personal computer to which the light emitting device of each of the above embodiments is applied. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 is a display according to each of the above embodiments. It is comprised by the apparatus.

(Application example 4)
FIG. 23 shows an appearance of a video camera to which the light emitting device of each of the above embodiments is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to each of the above embodiments.

(Application example 5)
FIG. 24 shows the appearance of a mobile phone to which the light emitting device of each of the above embodiments is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to each of the above embodiments.

  While the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made.

  For example, in the above embodiment, the case where the first electrode 72 is the anode and the second electrode 75 is the cathode has been described. However, the anode and the cathode are reversed, the first electrode 72 is the cathode, and the second electrode 75 is the anode. It is good.

  In each of the above embodiments, the case of an active matrix display device has been described. However, the present invention can also be applied to a passive matrix display device. The configuration of the pixel driving circuit for active matrix driving is not limited to that described in each of the above embodiments, and a capacitor or a transistor may be added as necessary. In that case, a necessary drive circuit may be added in addition to the signal line drive circuit 30, the scanning line drive circuit 40, and the power supply line drive circuit 50 described above according to the change of the pixel drive circuit.

  DESCRIPTION OF SYMBOLS 1, 2 ... Light-emitting device 10, 10R, 10G, 10B ... Organic EL element, 11 ... Pixel, 20 ... Display area, 30 ... Signal drive circuit, 40 ... Scanning line drive circuit, 50 ... Power supply line drive circuit, 60 ... Pixel drive circuit, 70 ... drive panel, 71 ... drive substrate, 72 ... first electrode, 73, 73R, 73G, 73B ... organic layer, 74 ... insulating film, 75 ... second electrode, 80 ... sealing panel, 81 ... sealing substrate, 82 ... color filter, 82R, 82G, 82B ... filter, 82BM ... black matrix, 90 ... reflector, 91 ... base film, 91A ... through hole, 91B, 91C ... opening, 91D ... side face, 91E ... upper surface, 91F ... lower surface, 92 ... light reflecting film, 93 ... light transmitting portion, 93A, 93B ... adhesive layer, 93D ... transparent resin, Cs ... holding capacity, d1, d2 ... thickness, DTL ... signal line, L1 ... Les The light, Tr1, Tr2 ... transistors, Vcc ... power supply line, W1, W2 ... width, WSL ... scan line.

Claims (8)

A method for producing an optical film, comprising: forming a light reflecting film along an inner surface of each through hole after forming a plurality of through holes in a base film. Filling each through-hole with a liquid curable resin, sandwiching the base film between two flat plates facing each other, and overlapping to form a light transmitting portion by curing the curable resin Furthermore, the manufacturing method of the optical film of Claim 1. A base film in which a plurality of through holes are formed;
A light reflecting film formed along the inner surface of each through hole;
The optical film provided with the light transmissive part collectively formed in the inside of each said through-hole, and both surfaces of the said base film. The optical film according to claim 3, wherein one opening area of the through hole and the other opening area of the through hole are different from each other. The inner surface of each through hole is n-fold rotationally symmetric (n is an integer of 2 or more) or completely rotationally symmetric about a single line segment parallel to the normal direction of the base film. The optical film described in 1. The optical film according to claim 4, wherein a contour of a cross section of each through-hole in a plane parallel to a normal line of the base film is linear or parabolic. The light transmitting portion is formed by filling each through-hole with a liquid curable resin, sandwiching the base film between two flat plates facing each other, and superimposing and curing the curable resin. The optical film according to any one of claims 3 to 6. A light-emitting panel having a plurality of light-emitting elements on a support substrate;
An optical film provided on the light emitting element side in relation to the light emitting panel,
The optical film is
A base film in which a through hole is formed for each region facing the light emitting element;
A light reflecting film formed along the inner surface of each through hole;
A light emitting device comprising: a light transmission portion formed in a lump on the inside of each through hole and on both surfaces of the base film.

Images