JP2010230391A - Header member of flow sensor and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a header member of a flow sensor capable of achieving both productivity and planarity with a low manufacturing cost. <P>SOLUTION: The header member 100 of the flow sensor is the header member on which the flow sensor 1 is mounted. The header member 100 includes: a lead pin 102 connected to lead patterns 7a, 7b, 7c of the flow sensor 1; a header body 101 including a through-hole 103 to which the lead pin 102 is inserted and being a rigid member on which the flow sensor 1 is mounted; and an insulating resin fixing member 105 for fixing the lead pin 102 to the through-hole 103 of the header body 101. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a header member for a flow sensor and a method for manufacturing the header member, and more particularly to a header member for a flow sensor and a method for manufacturing the header member that are preferably used for measuring minute flow rates.

  For example, as a flow measurement device (flow sensor) that detects the flow rate of a fluid such as a gas used in a semiconductor manufacturing apparatus, heat that measures the flow rate by applying heat to the fluid and measuring the temperature difference of the fluid at a predetermined position A flow rate measuring device of the type has been proposed (see, for example, Patent Document 1).

  FIG. 5 shows a perspective view of the flow sensor 1 as viewed from obliquely above. The flow sensor 1 includes a flow sensor chip 2 and a lower surface 3a joined to the upper surface 2a of the flow sensor chip 2 to form a minute flow path 4 of a fluid to be measured such as a gas in cooperation with the flow sensor chip 2. A path forming member 3. The flow path forming member 3 is made of a transparent glass chip (hereinafter, the same reference numeral 3 as that of the flow path forming member is attached). At both ends of the flow path 4, a fluid inlet 4 a and a fluid outlet 4 b that open to the upper surface 3 b of the glass chip 3 are formed.

  The flow sensor chip 2 includes a silicon substrate 5. On the upper surface of the silicon substrate 5, an insulating film (thin film) 6 of silicon nitride or silicon dioxide is formed. On the upper surface of the insulating film 6, a flow rate detection unit (sensor unit) 7 is formed at a position corresponding to the center position of the flow path 4. The flow rate detector 7 is covered with an insulating film 8 of silicon nitride or silicon dioxide. In FIG. 5, the insulating films 6 and 8 are drawn transparently to make the flow rate detection unit 7 easy to understand.

  At the center position of the upper surface 2a of the flow sensor chip 2, a hollow recess 2c is formed at a position below the flow rate detection unit 7 (hereinafter, the surface of the flow sensor chip 2 on which the flow rate detection unit 7 is formed is the upper surface. 2a, and the back side is referred to as the lower surface 2b). A portion covering the recess 2c of the insulating film 6 where the flow rate detection unit 7 is formed is formed in a diaphragm shape so that the flow rate detection unit 7 and the silicon substrate 5 are thermally blocked. The flow rate detection unit 7 is a thermal detection unit, a heater as a heating element made of, for example, a platinum (Pt) thin film on the insulating film 6, and platinum, for example, disposed at equal intervals on the upstream side and the downstream side of the heater. It is composed of a temperature measuring element as a resistance element made of a thin film.

Each lead pattern 7a, 7b, 7c as signal extraction wiring of the heater and the temperature measuring element of the flow rate detection unit 7 passes between the upper surface 2a of the flow sensor chip 2 and the lower surface 3a of the glass chip 3 on both sides of the flow sensor 1. It extends in the direction (width direction). In addition, a notch 3c is formed at the center position of both side portions along the longitudinal direction of the glass chip 3, and the connection end portion at the tip of the lead patterns 7a, 7b, 7c can be exposed and connected to an external flow measurement circuit. It is said that.
The upper surface 2a of the flow sensor chip 2 and the lower surface 3a of the glass chip 3 are joined by a low melting point glass (for example, frit glass) 9 as shown in FIG.

  In such a flow sensor 1, the lower surface 2 b of the flow sensor chip 2 is joined to the header member a via the glass pedestal 10, accommodated in the flow path body 22, and fixed with the bolts 23. The fluid inlet 4a and the fluid outlet 4b of the flow path 4 of the glass chip 3 are airtightly connected to the fluid inlet 22a and the fluid outlet 22b formed in the flow path body 22 via a rubber O-ring 24. Is done.

  As shown in FIG. 7, the header member a includes a header body 101 and lead pins 102. The header body 101 is fixed to the flow path body 22 via the O-ring 24 in a state where the flow sensor 1 is joined. At this time, when the glass chip 3 constituting the flow sensor 1 comes into contact with the flow path body 22 made of metal, the glass chip 3 is broken. For this reason, the header body 101 is required to have flatness so that the tolerance between the glass chip 3 and the flow path body 22 is constant. Therefore, the header body 101 is made of a metal such as stainless steel which is a rigid member. That is, if the header body is made of resin, when the header body is fixed with the bolts 23, the rigidity cannot be ensured and deformed, and the flatness cannot be maintained.

  The lead pin 102 is passed through the through hole 103 of the header body 101, and is fixed to the through hole 103 using a hermetic seal technique. One end of the lead pin 102 is connected to each lead pattern 7a, 7b, 7c of the flow sensor 1 joined to the header member a by wire bonding (not shown). Furthermore, the other end of the lead pin 102 is connected to an external flow rate measurement circuit (not shown).

JP 2008-70323 A

  When the hermetic sealing technique is used, for example, the lead pin 102 is passed through the through hole 103 of the header body 101 and the glass b is baked and hardened in the through hole 103, thereby fixing the lead pin 102 to the through hole 103.

  However, the conditions required when fixing the lead pin 102 to the header body 101 are fixing the lead pin 102 and insulation from the header body 101. That is, a strict sealing property like a hermetic seal is not required.

  When such a hermetic sealing technique is used, the manufacturing cost increases and the manufacturing is complicated. Therefore, it is assumed that the header body 101 is made of resin, and the header member 101 is manufactured by integrally molding the header body 101 and the lead pin 102, but if the header body 101 is made of resin as described above, Flatness cannot be maintained.

  An object of the present invention is to provide a header member for a flow sensor and a method for manufacturing the header member, which can be manufactured at low cost and can achieve both productivity and flatness.

A header member of a flow sensor according to the present invention is a header member on which a flow sensor is mounted, and includes a lead pin connected to a lead pattern of the flow sensor, and a through hole through which the lead pin passes. A header body that is a rigid member on which the sensor is mounted; and an insulating resin fixing member that fixes the lead pin to a through hole of the header body.
Thereby, the lead pin can be easily fixed to the through hole of the header body simply by passing the lead pin through the through hole of the header body and filling the resin fixing member. And since a resin fixing member has insulation, it can insulate a header main body and a lead pin satisfactorily. Further, the header body, which is a rigid member, can maintain flatness when it is fixed to the flow path body with a bolt. Therefore, the header member has a low manufacturing cost and can achieve both productivity and flatness.

It is preferable that the resin fixing member is formed so as to restrain the flow sensor.
Furthermore, it is preferable that the resin fixing member is formed so as to surround an outer peripheral portion of the flow sensor.
Thus, the flow sensor can be easily fixed at a predetermined position simply by fitting the flow sensor into the resin fixing member. Therefore, productivity can be further improved.
The header body is preferably made of metal.

A method of manufacturing a header member of a flow sensor according to the present invention is a method of manufacturing a header member on which a flow sensor is mounted. The lead pin is positioned through a through-hole of a header body, which is a rigid member, and is insulated. The lead pin is fixed to the through hole of the header body by the resin fixing member.
Thereby, the lead pin can be easily fixed to the through hole of the header body simply by passing the lead pin through the through hole of the header body and filling the resin fixing member. And since a resin fixing member has insulation, it can insulate a header main body and a lead pin satisfactorily. Further, the header body, which is a rigid member, can maintain flatness when it is fixed to the flow path body with a bolt. Therefore, the header member has a low manufacturing cost and can achieve both productivity and flatness.

The resin fixing member is preferably formed so as to restrain a flow sensor mounted on the header body.
Furthermore, it is preferable that the resin fixing member is formed so as to surround an outer peripheral portion of the flow sensor.
Thus, the flow sensor can be easily fixed at a predetermined position simply by fitting the flow sensor into the resin fixing member. Therefore, productivity can be further improved.

It is preferable that the header body and the lead pin are fixed integrally by injection molding of the resin fixing member.
Thereby, the resin fixing member provided with the function which fixes a lead pin to the through-hole of a header main body, and the positioning function of a flow sensor can be shape | molded at once. In addition, since the resin fixing member is filled with high pressure, the resin fixing member can be satisfactorily filled between the outer peripheral surface of the lead pin and the inner peripheral surface of the through hole of the header body, and the lead pin is securely inserted into the through hole of the header body. Can be fixed to.

  According to the present invention, the manufacturing cost is low, and both productivity and flatness can be ensured.

It is process drawing which shows roughly the manufacturing method of the header member of the flow sensor which concerns on this invention. It is process drawing which shows roughly the manufacturing method of the header member of the flow sensor which concerns on this invention. It is process drawing which shows roughly the manufacturing method of the header member of the flow sensor which concerns on this invention. It is process drawing which shows roughly the manufacturing method of the header member of the flow sensor which concerns on this invention. It is a see-through | perspective perspective view which shows a general flow sensor roughly. It is sectional drawing which shows the usage example of a flow sensor roughly. It is a figure which shows the conventional header member schematically.

  Embodiments of a header member of a flow sensor according to the present invention and a method for manufacturing the header member will be described. However, the present invention is not limited to the following embodiment. In addition, for clarity of explanation, the following description and drawings are simplified as appropriate.

For convenience, the manufacturing method of the header member 100 (FIG. 3) of the flow sensor will be described first.
First, as shown in FIG. 1, a header body 101 is prepared. The header main body 101 is a plate-like rigid member made of metal such as stainless steel, and has a rigidity capable of maintaining flatness when it is fixed to the flow path body 22 with a bolt 23. A region R in which the flow sensor 1 is mounted is secured at the center position of the header body 101 in plan view. In the header body 101, three through holes 103 are formed on both sides of the region R. That is, the lead hole 102 passed through the through hole 103 and the lead pattern 7a, 7b, 7c of the flow sensor 1 can be well connected via the bonding wire 106 (FIG. 4). Is arranged. The diameter of the through hole 103 is appropriately changed depending on the diameter of the lead pin 102 passed through the inside. That is, the diameter of the through hole 103 is such that the resin fixing member 105 can be satisfactorily filled between the outer peripheral surface of the lead pin 102 and the inner peripheral surface of the through hole 103 in a state in which the lead pin 102 is inserted later, and the lead pin 102 penetrates. The size can be fixed to the hole 103. The header body 101 is formed with a bolt hole 104 through which the bolt 23 passes so that the header body 101 can be fixed to the flow path body 22 with the bolt 23.

  Next, as shown in FIG. 2, the lead pin 102 is passed through each through-hole 103 in a substantially vertical direction, and the lead pin 102 is positioned with a jig or the like (not shown). The lead pin 102 is a conducting wire. One end of the lead pin 102 protrudes from the mounting surface 101a so as to be substantially the same height as the lead patterns 7a, 7b, 7c when the flow sensor 1 is mounted on the header body 101. The other end of the lead pin 102 protrudes from the surface 101b opposite to the mounting surface so that a connector for connecting to an external flow rate measurement circuit (not shown) can be fitted to a predetermined depth.

  Next, as shown in FIG. 3, when the lead pin 102 is fixed to the through hole 103 of the header body 101 by the resin fixing member 105, the header member 100 is completed. The resin fixing member 105 is not particularly limited as long as it is an insulating resin. For example, polyphenylene sulfide resin (PPS), engineering plastic, or the like can be used. The resin fixing member 105 is formed in a substantially rectangular frame shape on the mounting surface 101a of the header body 101, and the mounting surface 101a is exposed at the central portion (portion indicated by a horizontally long rectangle in the center of FIG. 3). The exposed portion functions as the region R described above.

  Thus, the lead pin 102 can be easily fixed to the through hole 103 of the header body 101 simply by filling the resin fixing member 105 through the lead pin 102 into the through hole 103 of the header body 101 having a predetermined rigidity. Since the resin fixing member 105 has an insulating property, the header body 101 and the lead pin 102 can be well insulated. Further, the header body 101 can maintain flatness when it is fixed to the flow path body 22 with the bolts 23. Therefore, the manufacturing method of the header member mentioned above is low in manufacturing cost, and can achieve both productivity and flatness.

  The resin fixing member 105 is preferably formed so that the flow sensor 1 mounted in the region R of the header body 101 can be restrained. In the present embodiment, the resin fixing member 105 is formed so as to surround the outer periphery of the flow sensor 1 mounted in the region R of the header body 101. That is, the inner periphery of the resin fixing member 105 is substantially equal to the outer periphery of the flow sensor 1, and the flow sensor 1 can be easily fixed at a predetermined position simply by fitting the flow sensor 1 into the resin fixing member 105. Can do. Therefore, productivity can be further improved. The height of the resin fixing member 105 is not particularly limited as long as the lead pin 102 and the lead patterns 7a, 7b, and 7c of the flow sensor 1 can be satisfactorily connected via the bonding wire 106.

  As a molding method of the resin fixing member 105, a usual injection molding method can be used. That is, the header body 101 and the lead pin 102 are integrally fixed by sandwiching the header body 101 with a mold and filling the resin fixing member 105 in the mold. Thus, the resin fixing member 105 having the function of fixing the lead pin 102 to the through hole 103 of the header body 101 and the positioning function of the flow sensor 1 can be molded at a time by the injection molding method. In addition, since the resin fixing member 105 is filled at a high pressure in the mold, the resin fixing member 105 can be satisfactorily filled between the outer peripheral surface of the lead pin 102 and the inner peripheral surface of the through hole 103 of the header body 101. 102 can be securely fixed to the through hole 103 of the header body 101.

  The header member 100 manufactured in this way has a lead pin 102 connected to the lead patterns 7a, 7b, 7c of the flow sensor 1 and a through hole 103 through which the lead pin 102 passes, and the flow sensor 1 is mounted thereon. A header main body 101 that is a rigid member, and an insulating resin fixing member 105 that fixes the lead pin 102 to the through hole 103 of the header main body 101. As shown in FIG. 4, the header member 100 has the flow sensor 1 fitted into the region R of the header body 101, that is, the resin fixing member 105, and the lead pin 102 and the lead patterns 7a, 7b, 7c of the flow sensor 1 are connected. When connected via the bonding wire 106, the flow path body 22 can be connected.

  As described above, the header member of the flow sensor and the header member manufacturing method according to the present invention can be easily obtained by simply filling the resin fixing member 105 through the lead pin 102 into the through hole 103 of the header body 101 having a predetermined rigidity. 102 can be fixed to the through hole 103 of the header body 101. Since the resin fixing member 105 has an insulating property, the header body 101 and the lead pin 102 can be well insulated. Further, the header body 101 can maintain flatness when it is fixed to the flow path body 22 with the bolts 23. Therefore, the header member of the flow sensor and the method for manufacturing the header member according to the present invention are low in manufacturing cost and can achieve both productivity and flatness.

Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention.
For example, in the above embodiment, the resin fixing member 105 is formed so as to surround the outer peripheral portion of the flow sensor 1, but this is not restrictive. The resin fixing member 105 may be formed so as to fix four corners of the flow sensor 1 and two corners arranged on a diagonal line connecting the corners of the flow sensor 1. In short, as long as the flow sensor 1 can be fixed to the region R of the header body 101, the shape of the resin fixing member 105 is not particularly limited. Of course, the resin fixing member 105 only needs to have a function of fixing the lead pin 102 to the through hole 103 of the header body 101, and the positioning function of the flow sensor 1 may be omitted. In this case, the flow sensor 1 is fixed to the header body 101 with a bonding means such as an adhesive.

  In the above embodiment, three lead pins 102 are arranged on both sides with the flow sensor 1 interposed therebetween, but the number of lead pins 102 is appropriately changed according to the number of lead patterns of the flow sensor 1. Of course, the number of through holes 103 in the header body 101 is also changed as appropriate in accordance with the number of lead pins 102.

DESCRIPTION OF SYMBOLS 1 Flow sensor 2 Flow sensor chip, 2a The upper surface of a flow sensor chip, 2b The lower surface of a flow sensor chip, 2c The recessed part of a flow sensor chip 3 Flow path formation member (glass chip), 3a The lower surface of a flow path formation member, 3b Flow path formation Upper surface of member, 3c Notch portion of flow path forming member 4 flow path, 4a fluid inlet port, 4b fluid outlet port 5 Silicon substrate 6, 8 Insulating film 7 Flow rate detectors 7a, 7b, 7c Lead pattern 10 Glass base 22 Flow channel Body, 22a Fluid inlet of channel body, 22b Fluid outlet of channel body 23 Bolt 24 O-ring 100 Header member 101 Header body, 101a Flow sensor mounting surface on header body, 101b Flow sensor mounting surface on header body Opposite surface 102 Lead pin 103 Through hole 104 Bolt hole 105 Resin solid Member 106 bonding wires a header member b region glass R flow sensor is mounted

Claims (8)

A header member on which a flow sensor is mounted,
A lead pin connected to the lead pattern of the flow sensor;
A header body which is a rigid member having a through-hole through which the lead pin is passed and the flow sensor is mounted;
An insulating resin fixing member for fixing the lead pin to the through hole of the header body;
A header member of a flow sensor comprising:   The header member of the flow sensor according to claim 1, wherein the resin fixing member is formed to restrain the flow sensor.   The header member of the flow sensor according to claim 2, wherein the resin fixing member is formed so as to surround an outer peripheral portion of the flow sensor.   The header member of the flow sensor according to claim 1, wherein the header body is made of metal. A method for manufacturing a header member on which a flow sensor is mounted,
Position the lead pin through the lead pin through the through hole of the header body, which is a rigid member,
A method of manufacturing a header member of a flow sensor, wherein the lead pin is fixed to a through hole of the header body by an insulating resin fixing member.   6. The method for manufacturing a header member of a flow sensor according to claim 5, wherein the resin fixing member is formed so as to restrain a flow sensor mounted on the header body.   The said resin fixing member is formed so that the outer peripheral part of the said flow sensor may be surrounded, The manufacturing method of the header member of the flow sensor of Claim 6 characterized by the above-mentioned.   The method for manufacturing a header member according to claim 5, wherein the header body and the lead pin are integrally fixed by injection molding of the resin fixing member.

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