JP2010225762A - Device for housing wiring board, and luminaire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for housing a wiring board, the device reliably supporting and housing the wiring board and advantageous in terms of cost, and to provide a luminaire. <P>SOLUTION: The device 10 for housing a wiring board includes: the wiring board 12 with an electronic component 11 arranged thereon; a case member 13 for housing the wiring board therein; and electric insulation materials 15 located on the wiring board and on both side face sides 13a3 of the case member and separately filled in a dotted form. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wiring board housing device such as a discharge lamp lighting device that supports and houses a wiring board on which an electronic component is mounted, and a lighting fixture.

  Conventionally, in a discharge lamp lighting device, for example, there are components that generate heat in the electronic components constituting the lighting circuit, and the reliability of the lighting device has been improved by reducing the temperature rise of these components. Yes. For example, in Patent Document 1, a wiring block is configured by wiring various electronic components to a substrate, and the wiring block is stored and held in the case. A wiring block housing structure in which resin is locally filled so as to dissipate heat of the electronic component is shown in the corresponding part.

JP 2001-326306 A

  However, what is shown in Patent Document 1 is locally filled with a resin so as to dissipate the heat of the electronic component in a portion corresponding to the electronic component that requires heat dissipation in the case. For this reason, as shown in FIGS. 8A and 8B of the present application, when the electronic component 1 that requires heat dissipation is arranged to be offset toward one side of the substrate 2, the resin 3 is placed in the case 4 when the substrate is assembled. The substrate 1 is partly applied to one side of the inside, and the substrate 1 is stored obliquely starting from the application portion of the resin 3, and the substrate cannot be horizontally supported and stored in the case. Moreover, in order to solve this, if a resin is filled in the whole case, a board | substrate can be supported horizontally, However, The usage-amount of resin increases significantly and a cost problem arises.

  In general, in this type of wiring board housing apparatus, the case is made of metal, and an insulating sheet is provided on the inner surface of the case for electrical insulation between the wiring board and the case. Since a gap is formed between them, heat dissipation is hindered, and how to realize a wiring board housing device that can dissipate heat more effectively is a problem.

  The present invention has been made in view of the problems and problems described above, and an object of the present invention is to provide a wiring board housing device and a lighting fixture that can reliably support and house a wiring board and are advantageous in terms of cost. Furthermore, the present invention is intended to provide a wiring board housing device and a lighting fixture capable of effectively radiating electronic components.

  The invention of the wiring board accommodation apparatus according to claim 1 includes: a wiring board on which electronic components are disposed; a case member that accommodates the wiring board; and located on both side surfaces of the wiring board and the case member and spaced apart in a dotted manner. And an electrically insulating material to be filled. According to the present invention, the wiring board can be reliably supported and accommodated by the electrical insulating material which is located on both side surfaces of the wiring board and the case member and is filled in a dotted manner and is advantageous in terms of cost. A storage device can be configured.

  In the present invention, the wiring board housing device is preferably used for a lighting device such as a fluorescent lamp or a high-pressure discharge lamp. However, the power supply device such as a light-emitting diode and electronic components are not limited to these lighting devices. The present invention can be applied to various electronic devices using the provided wiring board.

  The wiring board is a member for arranging electronic components for constituting various electronic circuits, and is composed of, for example, a synthetic resin such as an epoxy resin, a non-metallic member such as a glass epoxy material or a paper phenol material. It is preferable that a wiring pattern is formed on the surface and an electronic component is mounted on the wiring pattern, but the configuration of the substrate and the means for mounting are not limited to a specific one. The board material is also made of a metal with good thermal conductivity such as aluminum, copper, and stainless steel. A wiring pattern is formed on the surface of the board via an electrical insulating layer such as silicon resin, and electronic components are mounted on the wiring pattern. It may be arranged. Further, it may be made of ceramics. In addition, the shape of the wiring board is preferably a rectangular long shape in the case of constituting a discharge lamp lighting device or the like, but is not limited to these shapes and is not limited to these shapes. Alternatively, it may be a polygonal shape such as a quadrangle or a hexagon, or an elliptical shape, and all shapes for obtaining a desired function are allowed.

  The case member accommodates the wiring board and preferably has a box having a bottom surface and both side surfaces. The case member is preferably configured by, for example, a case body that supports the wiring board and a lid case that covers the case body so as to cover the wiring board and the electronic component. It may be configured only by a case body that supports the.

  The material of the case member is preferably made of a metal having good thermal conductivity, for example, a metal such as aluminum or stainless steel, in order to enhance heat dissipation of the electronic component, but a synthetic resin such as PBT (polybutylene terephthalate). It may be configured by. Furthermore, you may comprise with synthetic resins, such as high heat conductive resin. As in the case of the wiring board, the external shape is preferably formed in a rectangular long shape when forming a discharge lamp lighting device or the like, but is not limited to these shapes. All shapes to obtain function are allowed.

  The electrical insulating material is located on both side surfaces of the wiring board and the case member, and is filled in a dotted manner so as to reliably support and accommodate the wiring board in a substantially horizontal state with respect to the case member. For example, it is preferable that the two side surfaces of the case member are filled in a staggered manner in a dotted manner. However, the members are filled in a dotted manner so as to face the two side surfaces of the case member. The point is that the wiring board is positioned on both side surfaces of the wiring board and the case member without being inclined obliquely starting from the electrical insulating material, and is filled in a dotted manner. Good. Electronic components with heat generation disposed on the wiring board are preliminarily disposed on both side surfaces of the case member so as to face each other in a zigzag manner, and the electrical insulating material is filled in a position facing the electronic components. However, in this case, the purpose is to ensure that the wiring board is securely supported by the case member, and the electrical insulation material is filled without facing the heat-generating electronic components. It may be.

  The material of the electrical insulation material is suitable when, for example, a synthetic resin foam material having electrical insulation properties such as polyurethane resin and silicon resin and having thermal conductivity is considered in terms of heat dissipation. The wiring board may be made of an adhesive made of silicon resin, epoxy resin, or the like that does not have foaming properties for securely supporting and housing the wiring board in the case member.

  The invention according to claim 2 is the wiring board housing device according to claim 1, wherein the case member is made of metal and has an insulating sheet provided between the lower surface of the case member and the wiring board. The insulating sheet is provided with a gap between the case member and an opening is formed at a position facing the electronic component with heat generation mounted on the wiring board, and the opening area of the opening is defined as the opening of the electronic component. It is characterized in that it is substantially equal to or larger than the part facing area, and the gap is filled with the electrical insulating material through the opening. ADVANTAGE OF THE INVENTION According to this invention, the wiring board accommodation apparatus which can perform the thermal radiation of an electronic component effectively can be comprised.

  In the present invention, the insulating sheet is a member for making electrical insulation between the case member made of metal and the wiring board, and is provided between the lower surface of the case member and the wiring board. The material of the insulating sheet is preferably composed of a synthetic resin having flexibility such as PET (polyethylene terephthalate), but may be composed of a paper material or a nonwoven fabric in a sheet shape. The insulating sheet is provided with a gap between the case member, and even if the gap is formed by bending of the insulating sheet itself or the like, before the electric insulating material made of resin is cured. It may be a gap formed.

 Moreover, the opening part formed facing the electronic component accompanied by heat generation in the insulating sheet may be formed on the bottom surface or the side surface of the insulating sheet, or both the bottom surface and the side surface. The shape of the opening is the same as the shape of the surface facing the opening of the electronic component that generates heat, that is, if the shape of the surface facing the opening of the electronic component is circular, the circle corresponding to this circle However, it is not always necessary to have the same shape. For example, if the electronic component is circular, a square opening having a size that surrounds and encloses the electronic component is formed. In short, the opening area of the opening may be substantially equal to or larger than the opening facing area of the electronic component, and the electrical insulating material may be filled into the gap through the opening.

 According to a third aspect of the present invention, in the wiring board housing apparatus according to the first aspect, the case member is made of metal, and a cross section provided between the lower surface of the case member and the wiring board is substantially U-shaped. The insulating sheet is provided with a side surface facing the side surface of the case member and having a gap between the case member and a position facing the heat-generating electronic component mounted on the wiring board. An opening is formed, and the electrical insulating member is filled so as to reach the side surface of the insulating sheet and the side surface of the wiring board, and the gap is filled through the opening.

  An invention of a lighting fixture according to claim 4 comprises: a wiring board housing device according to any one of claims 1 to 3 that constitutes a lighting device that turns on a light source; and a fixture body having the wiring board housing device. It is characterized by.

  According to the first aspect of the present invention, the wiring board can be reliably supported and accommodated by the electrical insulating material that is located on both side surfaces of the wiring board and the case member and is filled in a dotted manner, and the electrical insulating material. Therefore, it is possible to provide a wiring board housing apparatus that can reduce the amount of use of the wiring board and is advantageous in terms of cost.

  According to the invention of claim 2, the insulating sheet is provided with a gap between the case member and the opening is formed at a position facing the electronic component with heat generation mounted on the wiring board, Since the opening area of the opening is substantially equal to or larger than the opening facing area of the electronic component, and the electrical insulating material is filled in the gap through the opening, the heat dissipation of the electronic component is effectively performed. Therefore, it is possible to provide a wiring board housing apparatus that can perform the above-described operation.

  According to the third aspect of the present invention, the insulating sheet is provided with a side surface facing the side surface of the case member and having a gap between the insulating member and the electronic sheet mounted on the wiring board. An opening is formed at the position where the electrical insulating member is filled so as to reach the side surface of the insulating sheet and the side surface of the wiring board, and the gap is filled through the opening. A wiring board housing device that can be reliably supported by the case member and can effectively dissipate the electronic components can be configured.

  According to the fourth aspect of the present invention, it is possible to provide a lighting apparatus using a lighting device that is advantageous in terms of cost and that can effectively dissipate heat of electronic components.

The wiring board accommodation apparatus which is 1st Embodiment of this invention is shown, (a) is a top view which shows the state which filled the case with the electrical insulating material, (b) accommodates the wiring board in (a), and A- The figure cut along the A line, and (c) is an enlarged sectional view showing the main part in (b), that is, the filling state of the electrical insulating material. The wiring board accommodation apparatus is similarly shown, (a) is a top view of the wiring board, (b) is a cross-sectional view of a cover case, an upper insulating sheet and a lower insulating sheet formed in a box shape, and a case body. Sectional drawing which shows roughly the lighting fixture incorporating the wiring board accommodation apparatus similarly. Similarly, FIG. 1B shows a modified example of the wiring board housing device, where FIG. 1A is a view corresponding to FIG. 1A showing the first modified example, and FIG. FIG. 1C is an equivalent diagram, and FIG. 1C is a diagram corresponding to FIG. The wiring board accommodation apparatus which is 2nd Embodiment of this invention is shown, (a) is a equivalent figure of FIG.1 (b), (b) is a bottom view of (a) shown partially cut away, (c) is. Sectional drawing which shows the state which installed (a) in the ceiling surface. Sectional drawing which shows roughly four types of wiring board accommodation apparatuses used for the experiment for confirming the thermal radiation performance in the wiring board accommodation apparatus which is 2nd Embodiment similarly. The graph which similarly shows an experimental result. The conventional wiring board accommodation apparatus is shown, (a) is a figure equivalent to Fig.1 (a), (b) is the figure which accommodated the wiring board in (a) and was cut along the AA line.

  Embodiments of a wiring board housing device according to the present invention will be described below with reference to the drawings.

  The wiring board housing device 10 of this embodiment constitutes a lighting device for a fluorescent lamp. As shown in FIG. 1, the wiring board 12 on which the electronic component 11 is disposed, and the case member 13 that houses the wiring board. The insulating sheet 14 is used for electrical insulation between the case member and the wiring board, and the electrical insulating material 15 is filled between the wiring board and the insulating sheet 14.

  In this embodiment, the electronic component 11 includes a plurality of electronic components constituting a lighting device for lighting a fluorescent lamp, that is, an inverter transformer 11a, a switching transistor 11b, an inductor 11c, a control unit 11d that controls switching of the inverter, and a smoothing capacitor. 11e, and other resistors. Among these various electronic components, the windings such as the inverter transformer 11a and the inductor 11c, the switching transistor 11b, and the resistor are components that generate heat (FIG. 2A).

  The wiring board 12 is provided with each of the electronic components described above. In this embodiment, the wiring board 12 is made of a synthetic resin made of a rectangular thin and long flat plate-like epoxy resin, and a wiring made of copper foil on the surface thereof. A pattern is formed, and the plurality of electronic components 11 described above are mounted and disposed on the wiring pattern to constitute a lighting device. In this case, electronic components that generate heat, that is, the inverter transformer 11a, the inductor 11c, the switching transistor 11b, and the like are located on both side edges in the longitudinal direction of the wiring board 12 and are formed in a dot pattern so as to form a staggered pattern. They are spaced apart (FIG. 2 (a)).

  As shown in FIGS. 1B and 2B, the case member 13 covers a case body 13a made of a metal having good thermal conductivity, which is aluminum in this embodiment, and an opening of the case body. It consists of a lid case 13b. The case body 13a is configured as a box body in which both end portions are closed and an opening portion 13a1 is formed on the upper side, and a longitudinal cross-sectional shape having a lower surface 13a2 and both side surfaces 13a3 is substantially U-shaped and has a long rectangular shape. Similarly, the lid case 13b is formed in a rectangular box having a substantially U-shaped vertical cross-sectional shape, and the wiring board 12 is supported and accommodated in the case body 13a, and then the opening 13a1 of the case body. It is fitted to cover from the outside.

  The insulating sheet 14 is a synthetic resin made of PET (polyethylene terephthalate), and includes a lower insulating sheet 14a provided on the case body 13a of the case member 13 and an upper insulating sheet 14b provided on the lid case 13b. Similarly to the case body 13a, the lower insulating sheet 14a is formed in a box shape in which both end portions are closed and an opening portion 14a1 is provided on the upper side, and a cross section having a lower surface 14a2 and both side surfaces 14a3 is substantially U-shaped. That is, a box having a shape that faces and matches the inner surface of the case body 13a, that is, the lower surface 13a2 and both side surfaces 13a2, so that the case member 13 made of aluminum is electrically insulated from the wiring board 12 and the electronic component 11. Formed.

  Similarly to the lid case 13b, the upper insulating sheet 14b is formed in a box shape in which both end portions are closed and an opening portion 14b1 is formed below, and the upper surface 14b2 and both side surfaces 14b3 are substantially U-shaped in cross section. In order to provide electrical insulation between the lid case 13b and the wiring board 12 or the electronic component 11, it is formed in a box having a shape that faces and matches the inner surface of the lid case 13b, that is, the upper surface 13b2 and both side surfaces 13b2.

  In this embodiment, the electrical insulating material 15 is made of a synthetic resin foam material having thermal conductivity made of polyurethane resin. As shown in FIGS. 1A and 1B, both sides of the wiring board 12 and the case body 13a of the case member are provided. Heat generated on the surface 13a3 side, in other words, on both side surfaces 14a3 side of the lower insulating sheet 14a interposed between the wiring board 12 and the case body 13a and spaced apart in a staggered manner in the form of dots. It is filled in a position facing the accompanying electronic components 11a, 11b, 11c and the like. As a result, the individual electrical insulation materials 15 filled in a zigzag pattern are formed on the back side of the wiring board 12 on which the electronic components 11a and the like that generate heat are mounted, and from the lower surface 14a2 of the lower insulating sheet 14a to one side surface 14a3 and the wiring. It is closely packed so as to reach the upper surface of the wiring board slightly beyond the side surface 12a of the substrate 12 (electrical insulating material 15a in FIG. 1C).

  Thereby, the wiring board 12 is reliably supported by the case body 13a, and the upper edge portion of the lower insulating sheet 14a and the electric insulating material 15a slightly reaching the upper surface of the wiring board beyond the side surface 12a of the wiring board 12 and The side surface 12a of the wiring board 12 is pressed, the positional displacement in the longitudinal direction of the lower insulating sheet 14a and the wiring board 12 is prevented, and the lower insulating sheet 14a can be reliably supported on the case body 13a. At the same time, a heat dissipation path of the electronic component 11 → the wiring board 12 → the electrical insulating material 15 → the lower insulating sheet 14a → the case body 13a is formed (FIG. 1B).

  Next, an assembly procedure of the wiring board housing apparatus 10 configured as described above will be described. Each electronic component 11 is mounted on the surface of the wiring board 12 in advance. At this time, the electronic components that generate heat, that is, the inverter transformer 11a, the inductor 11c, and the switching transistor 11b are mounted on both side edges in the longitudinal direction of the wiring board 12 and spaced apart in a staggered manner. To do.

  Next, the lower insulating sheet 14a previously formed in a box shape is mounted so as to face and match the inner surface of the case body 13a, that is, the lower surface 13a2 and both side surfaces 13a3. Next, a predetermined position on the inner surface of the lower insulating sheet 14a, that is, a case body 13a facing the heat generating electronic component 11a and the like that are mounted in a staggered manner and spaced apart in a dotted manner, that is, the lower side The electrical insulating material 15 is filled and applied in a staggered manner so as to form a staggered pattern on the lower surface 14a2 and both side surfaces 14a3 side of the side insulating sheet 14a (FIG. 1 (a)).

  Next, with respect to the electrical insulating material 15 applied as described above, the wiring board 12 on which the electronic component 11 is mounted is arranged so that the electronic component is above and the electronic component 11a with heat generation corresponds to the electrical insulating material 15. In other words, from the opening 13a1 of the case body 13a, the rear surface side of the wiring board 12 where the electronic component 11a and the like that generate heat are mounted and the applied electrical insulating material 15 are bonded. By inserting and heating, the electrical insulating material 15 is cured and hardened and accommodated.

  At this time, since the electrical insulation material 15 is filled and applied in a staggered manner so as to form a staggered pattern, the wiring board 12 is not inclined obliquely as shown in FIG. It is supported substantially horizontally, that is, without being inclined with respect to the lower surface 13a2 of the case body 13a. At the same time, the wiring board 12 has the lower surface 14a2 and both side surfaces 14a3 of the lower insulating sheet 14a by the electrical insulating material 15, in other words, the lower surface 13a2 and both sides of the case body 13a that are in close contact with the lower insulating sheet 14a. Since it is connected and fixed to the surface 13a3, it is supported reliably.

  At this time, the electrical insulating material 15 is filled so as to slightly reach the upper surface of the wiring board from the bottom surface 14a2 of the lower insulating sheet 14a over the side surface 14a3 and the side surface 12a of the wiring board 12. Thus, the upper edge portion of the lower insulating sheet 14a and the side surface 12a of the wiring board 12 are pressed (FIG. 1C).

  Next, the opening 13a1 of the case body 13a is covered with the opening 13b1 of the lid case 13b on which the upper insulating sheet 14b is mounted so as to cover the wiring board 12 and the electronic component 11, and both are covered by means such as screws. The wiring board housing device 10 is configured as a lighting device for a fluorescent lamp.

  At this time, as shown in FIG. 1C, the lower edge portion of the side surface 14b3 of the upper insulating sheet 14b is sandwiched and held between the upper edge portion of the lower insulating sheet 14a and the side surface 13b3 of the lid case 13b. Is done. In this case, since the upper edge portion of the lower insulating sheet 14a is pressed by the electric insulating material 15a filled so as to reach the upper surface of the wiring substrate 12 slightly, the wiring substrate at the upper edge portion of the lower insulating sheet 14a. The falling to the 12 side (indicated by a dotted line and an arrow in the figure) can be suppressed as much as possible, and the upper insulating sheet 14b can also be reliably supported by the lid case 13b.

  The wiring board housing device 10 that is a lighting device for a fluorescent lamp configured as described above is a lighting fixture that is incorporated in a lighting fixture and uses a fluorescent lamp as a light source. That is, as shown in FIG. 3, reference numeral 20 denotes a lighting fixture, and two straight tube fluorescent lamps 21 are installed along the reflector 23 of the fixture main body 22, and are lit in the fixture main body on the back side of the reflector. A wiring board housing apparatus 10 that is an apparatus is incorporated, and a line-type lighting fixture 20 that is directly attached to the ceiling surface X is configured. An input line from the power supply unit is connected to the input terminal of the wiring board 12 housed in the wiring board housing device 10, and an output line is connected to the output terminal, so that a lighting output is supplied to the fluorescent lamp 21 as a light source. The

  When the lighting fixture 20 configured as described above is turned on, the temperatures of the electronic components constituting the lighting device, in particular, the inverter transformer 11a, the inductor 11c, and the switching transistor 11b, which are electronic components that generate heat, are increased and heat is generated. The heat is effectively radiated to the outside through the heat radiation path of the electronic component 11 → the wiring board 12 → the electrical insulating material 15 → the lower insulating sheet 14a → the case body 13a. Further, the heat generated in the case member 13 is also radiated to the outside from the lid case 13b via the upper insulating sheet 14b.

  As described above, according to the present embodiment, since the electrical insulating material 15 is filled and applied in a dotted manner so as to form a staggered pattern, the wiring board 12 is automatically made substantially horizontal without being inclined obliquely. While being held, it can be reliably supported and accommodated, and a process for holding it horizontally is not required, and the assembly work can be simplified. At the same time, the wiring substrate 12 has the lower surface 13a2 of the lower insulating sheet 14a and both side surfaces 14a3 of the lower insulating sheet 14a by the electric insulating material 15, in other words, the lower surface 13a2 of the case body 13a that is in close contact with the lower insulating sheet 14a. Since it is connected and fixed to both side surfaces 13a3, it can be reliably supported and accommodated.

  At the same time, the electrical insulating material 15 is spaced apart in a dot pattern so as to form a zigzag pattern at a position facing the heat-generating electronic component 11a and the like that are mounted in a staggered pattern on the wiring board 12 so as to form a dot pattern. Therefore, the heat generated from the electronic component 11a or the like that generates heat is effectively radiated from the back surface of the wiring board 12 to the outside through the electrical insulating material 15 having thermal conductivity. In particular, since the electrical insulating material 15 is connected and fixed to the lower surface 14a2 and both side surfaces 14a3 of the insulating sheet, heat can be reliably transferred to the case body 13a and more effectively dissipated. It is possible to provide a wiring board housing device and a lighting fixture capable of improving the reliability of components while exhibiting the effect of reliably supporting and housing the substrate 12 on the case member 13.

  In addition, since the electronic components 11a and the like that generate heat are mounted on the wiring board 12 in a staggered manner so as to be spaced apart in a dotted pattern, thermal interference between the heat generating components is reduced, and the temperature rise of the components is suppressed. You can also In addition, since the electrical insulating material 15 is filled and applied while being spaced apart in the form of dots, it is possible to reduce the amount of use and to provide a wiring board housing device and a lighting fixture that are advantageous in terms of cost.

  Further, since the electrical insulating material 15 is filled in close contact with the lower surface 14a2 of the lower insulating sheet 14a so as to reach the upper surface of the wiring board slightly beyond the one side surface 14a3 and the side surface 12a of the wiring board 12, it is electrically insulated. The upper edge portion of the lower insulating sheet 14a and the side surface 12a of the wiring board are pressed by the material 15a, so that the lower insulating sheet 14a and the wiring board 12 are prevented from being displaced in the longitudinal direction, and the lower insulating sheet 14a is attached to the case body 13a. Can be reliably supported. At the same time, the lower edge of the side surface 14b3 of the upper insulating sheet 14b is sandwiched and held between the upper edge of the lower insulating sheet 14a and the side surface 13b2 of the lid case 13b, and the upper edge of the lower insulating sheet 14a. However, since it is pressed by the electrical insulating material 15a filled so as to reach the upper surface of the wiring board 12 slightly, the upper edge of the lower insulating sheet 14a can be suppressed to the wiring board 12 side as much as possible. The upper insulating sheet 14b can also be reliably supported by the lid case 13b.

  As described above, in the present embodiment, the electrical insulating material 1 is filled and applied in a staggered manner so as to form a staggered pattern. However, as shown in FIG. May be spaced apart in the form of dots so as to face each other. In this case, the electronic parts 11a and the like that generate heat are also disposed and mounted on the wiring board 12 so as to be spaced apart in a dotted manner so as to face the both side surfaces 13a3 of the case member 13, respectively. According to this, the wiring board 12 can be surely supported and accommodated in a state where it is automatically kept substantially horizontal, the assembling work can be simplified, and the wiring board 12 can be simplified by the lower surface 13a2 of the case body 13a. In addition, the electronic components can be securely supported and accommodated by being connected to both side surfaces 13a3, and each electronic component can be effectively arranged and mounted with a reduced dead space. Miniaturization of the wiring board housing device can be achieved.

  Further, as shown in FIG. 4B, an opening 14a4 penetrating the lower surface 14a2 and both side surfaces 14a3 of the lower insulating sheet 14a is formed, and the electrical insulating material 15 is passed through the opening 14a4 to the lower surface of the case body 13a. You may comprise so that it may fill toward 13a2 and both side surfaces 13a3. According to this, since the electrical insulating material 15 and the case body 13a are connected in direct contact with each other, heat can be more effectively transferred to the case member 13, and more effective heat dissipation can be performed. The wiring board 12 can be more firmly supported and accommodated in the case body 13a. In this case, the opening 14a4 may be provided on either the lower surface 14a2 or the both side surfaces 14a3 of the insulating sheet 14.

  The case member 13 is made of a metal made of aluminum. However, as shown in FIG. 4C, the case member 13 may be made of an electrically insulating synthetic resin such as PBT (polybutylene terephthalate). In this case, an insulating sheet for electrical insulation is omitted, and the electrical insulating material 15 is directly filled and applied to the lower surface 13a2 and both side surfaces 13a3 of the case body 13a. According to this, the wiring board 12 can be directly supported and accommodated in the case body 13 a, and heat can be directly transmitted from the electrical insulating material 15 to the case member 13. In FIG. 4 showing the modification, the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this embodiment, the heat of the electronic component that generates heat is more reliably radiated, and the wiring board is reliably supported and accommodated. That is, as shown in FIGS. 5A and 5B, the case member 13 is composed of a case body 13a made of aluminum and a lid case 13b as in the first embodiment, and the lower surface of the case body 13a and the wiring board 12 are formed. And an insulating sheet 14 provided between the two.

  The insulating sheet 14 includes a lower insulating sheet 14a and an upper insulating sheet 14b. In particular, the insulating sheet 14 is provided with a gap s between the lower insulating sheet 14a and the lower surface of the case body 13a. An opening 14a5 is formed at a position facing the electronic component 11a with heat generation mounted on the opening, and the opening area s1 of the opening is substantially equal to or larger than the opening facing area s2 of the electronic component 11a with heat generation (s1 ≧ s2), the gap s is filled with the electrical insulating material 15 through the opening 14a5. Note that the gap s is a gap of about 1 mm generated by bending of the insulating sheet 14 made of synthetic resin. Further, the electrical insulating material 15 is filled so as to surround the periphery of the electronic component 11a.

  According to the above configuration, it was confirmed by the following experiment that heat of the electronic component 11a accompanied by heat generation can be more reliably transmitted to the case member 13 and can be radiated more effectively. That is, the electronic component 11a with heat generation is mounted on the back surface of the wiring board 12, and the electric insulating material 15 is filled between the lower insulating sheet 14a so as to surround the periphery of the electronic component (FIG. 6A). (D)) was compared with the wiring board housing device having the configuration.

  First, a configuration in which the lower insulating sheet 14a is completely adhered to the lower surface of the case member 13 (FIG. 6A), and a gap s of about 1 mm is intentionally formed between the lower insulating sheet 14a and the lower surface of the case member 13. The formed structure (FIG. 6B), a 1 mm gap s is formed between the lower insulating sheet 14 a and the bottom surface of the case member 13, and faces the electronic component 11 a with heat generation mounted on the wiring board 12. The opening 14a5 is formed at the position, the opening area s1 of the opening is set to be approximately 15% of the opening facing area s2 of the electronic component 11a, and the electric insulating material 15 is directed from the opening 14a5 toward the mobile support member 13. In the electronic component 11a with a heat generation (FIG. 6C), a 1 mm gap s formed between the lower insulating sheet 14a and the bottom surface of the case member 13, and mounted on the wiring board 12. Open in the opposite position 14a5 is formed, the opening area s1 of the opening is set to be substantially the same size as the opening facing area s2 of the electronic component 11a, and the electrical insulating material 15 is filled from the opening 14a5 toward the mobile support member 13 (FIG. 6 (D)), the temperature rise value (deg) of the electronic component 11a with heat generation in each configuration was measured.

  In addition, the electronic component 11a accompanied by heat generation is disposed in the front stage of the inverter in the lighting device for a fluorescent lamp, and a thyristor through which current always flows during operation is mounted on the back side of the wiring board 12. The thyristor is approximately 6 mm square, the opening 14a5 in the configuration of FIG. 6C is formed to be approximately 2.33 mm square, and the opening area s1 of the opening is approximately 15% of the opening facing area s2 of the electronic component 11 ( s1≈15 / 100s2), the opening 14a5 in the configuration of FIG. 6D is formed to be approximately 6 mm square, and the opening area s1 of the opening and the opening facing area s2 of the electronic component 11 are substantially equal (s1). ≈ s2) (FIG. 5B).

  The result of the above experiment is shown in the graph of FIG. This graph plots the temperature rise value (deg) of the electronic component 11a accompanied by heat generation in the wiring board housing apparatuses having the respective configurations shown in A, B, C, and D of FIG. The temperature rise value in the configuration of (A), the point b is the temperature rise value in the configuration of FIG. 6B, the point c is the temperature rise value in the configuration of FIG. 6C, and the point d is the configuration of FIG. The temperature rise values at are shown respectively.

  As is clear from the above, the temperature rise values (deg) at the points a and d are substantially the same value, and the heat dissipation performance is substantially the same as the structure of FIG. 6A even in the structure of FIG. It became clear to have. Even if a gap is formed in the lower insulating sheet 14a, the opening area s1 of the opening 14a5 is substantially equal to or larger than the opening facing area s2 of the electronic component 11a (s1 ≧ s2), and the opening 14a5. If the electric insulating material 15 is filled in the gap s through the lower insulating sheet 14a, the lower insulating sheet 14a is as good as the structure in which the lower insulating sheet 14a is completely adhered to the bottom surface of the case member 13 (FIG. 6A). It was confirmed that the heat dissipation performance can be exhibited.

  Therefore, according to the wiring board housing device 10 having the configuration in the present embodiment, even if a gap of about 1 mm generated by the bending of the insulating sheet 14 made of synthetic resin is formed between the insulating sheet 14 and the case member 13. Good heat dissipation performance can be exhibited. Furthermore, even if a gap is formed between the insulating sheet 14 and the case member 13 due to impact or the like before the electrical insulating material 14 made of resin is cured, good heat dissipation performance can be exhibited. Furthermore, in the lighting device for a fluorescent lamp, as shown in FIG. 5C, for example, when the lower surface side of the case member 13 is installed on the ceiling surface X or the like, the wiring board 12 and the electronic component 11 or the like Gravity is applied in the direction in which the lower insulating sheet 14a is separated from the lower surface of the case body 13a due to the weight, and the gap s is easily formed. However, even in this case, good heat dissipation performance can be exhibited. As is clear from these, according to the wiring board housing device 10 of the present example, even when the gap s is generated between the insulating sheet 14 and the case member 13, a heat radiation path can be reliably ensured, Good heat dissipation performance can be exhibited.

  5 and 6 showing the present embodiment, the same parts as those in FIGS. 1 to 4 of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In addition, other configurations, functions, effects, and modifications in the present embodiment are the same as those in the first embodiment. The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Wiring board accommodation apparatus 11 Electronic component 12 Wiring board 13 Case member 14 Insulation sheet 14a4, 14a5 Opening part 15 Electrical insulating material s Gap 20 Lighting fixture 21 Light source 22 Appliance main body

Claims (4)

A wiring board on which electronic components are disposed;
A case member for housing the wiring board;
An electrical insulating material that is located on both sides of the wiring board and the case member and is filled in a dotted manner;
A wiring board housing device comprising: The case member is made of metal and has an insulating sheet provided between the lower surface of the case member and the wiring board. The insulating sheet is provided with a gap between the case member and the wiring board. An opening is formed at a position facing the electronic component with heat generation mounted on the opening, and the opening area of the opening is substantially equal to or larger than the opening facing area of the electronic component. The wiring board accommodation device according to claim 1, wherein the gap is filled. The case member is made of metal, and has an insulating sheet having a substantially U-shaped cross section provided between the lower surface of the case member and the wiring board. The insulating sheet has a side surface facing the side surface of the case member. A gap is provided between the case member and the opening, and an opening is formed at a position facing an electronic component with heat generation mounted on the wiring board. 2. The wiring board accommodating device according to claim 1, wherein the wiring board is filled so as to reach the side surface and is filled in the gap through the opening. The wiring board housing device according to any one of claims 1 to 3, comprising a lighting device that turns on a light source;
An instrument body having a wiring board housing device;
The lighting fixture characterized by comprising.

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