JP2010225575A - Silver paste - Google Patents
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- JP2010225575A JP2010225575A JP2009242555A JP2009242555A JP2010225575A JP 2010225575 A JP2010225575 A JP 2010225575A JP 2009242555 A JP2009242555 A JP 2009242555A JP 2009242555 A JP2009242555 A JP 2009242555A JP 2010225575 A JP2010225575 A JP 2010225575A
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- silver
- reducing agent
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- fine particles
- silver paste
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- 239000004332 silver Substances 0.000 title claims abstract description 127
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 127
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 122
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 79
- 239000002245 particle Substances 0.000 claims abstract description 32
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000010419 fine particle Substances 0.000 claims description 50
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 18
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 8
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 230000001376 precipitating effect Effects 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000007639 printing Methods 0.000 description 14
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 230000000740 bleeding effect Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- 229910001961 silver nitrate Inorganic materials 0.000 description 5
- -1 silver organic compound Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- ZBCATMYQYDCTIZ-UHFFFAOYSA-N 4-methylcatechol Chemical compound CC1=CC=C(O)C(O)=C1 ZBCATMYQYDCTIZ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- LPZWALGCJLVUNT-UHFFFAOYSA-N hydrazine silver Chemical compound [Ag].NN LPZWALGCJLVUNT-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
- Conductive Materials (AREA)
Abstract
Description
本発明は、電子機器の電極材料などに使用される銀ペーストに関し、より詳しくは、電極や電気回路などの断線や短絡を生じない銀ペーストに関する。 The present invention relates to a silver paste used for an electrode material of an electronic device, and more particularly to a silver paste that does not cause disconnection or short circuit of an electrode or an electric circuit.
電子機器の内部電極は、一般に、銀微粒子などを含有する導電ペーストを用いて電極回路を印刷し、これを積層し焼成して形成されている。例えば、特許文献１には、磁性体シートと誘電体シートに導電ペーストを用いて電極回路を印刷し、これを積層し焼成して内部電極を形成することが記載されている。また、特許文献２には、セラミックスシートに導電ペーストを用いて電極回路を印刷し、これを積層し焼成して内部電極を形成することが記載されている。さらに、特許文献３には、絶縁基板上の電極を形成する材料として銀の有機化合物を含む銀ペーストを用い、この銀ペーストを焼成することによって有機物は熱分解して銀が析出し、電極がほぼ銀で形成されることが記載されている。 The internal electrode of an electronic device is generally formed by printing an electrode circuit using a conductive paste containing silver fine particles, and laminating and baking the electrode circuit. For example, Patent Document 1 describes that an electrode circuit is printed on a magnetic sheet and a dielectric sheet using a conductive paste, and this is laminated and fired to form an internal electrode. Patent Document 2 describes that an electrode circuit is printed on a ceramic sheet using a conductive paste, and this is laminated and fired to form an internal electrode. Furthermore, in Patent Document 3, a silver paste containing a silver organic compound is used as a material for forming an electrode on an insulating substrate. By firing this silver paste, the organic matter is thermally decomposed to deposit silver, It is described that it is formed of almost silver.
セラミックス電子部品の内部電極などを形成する導電性ペーストとして、銀微粒子を含むペースト（銀ペーストと云う）が用いられており、従来、銀ペーストに含まれる銀微粒子は粒子径および密度の範囲が広いものが使用されている。また、銀ペーストの粘度も多様である。 A paste containing silver fine particles (referred to as silver paste) is used as a conductive paste for forming internal electrodes of ceramic electronic parts. Conventionally, silver fine particles contained in silver paste have a wide range of particle diameter and density. Things are used. Also, the viscosity of the silver paste is various.
セラミックス電子部品などの内部電極は、セラミックスグリーンシートに銀ペーストを用いて電極回路を印刷し、これを積層し、焼成して形成することが一般的であるが、従来、内部電極の断線や短絡等の欠陥によって電気特性の不良率が高くなることが問題になっている。この電極の短絡は主に印刷時に生じ、電極の断線は主に焼成時に生じる。 Internal electrodes such as ceramic electronic parts are generally formed by printing an electrode circuit using a silver paste on a ceramic green sheet, laminating it, and firing it. There is a problem that the defect rate of electrical characteristics increases due to defects such as these. This short circuit of the electrode occurs mainly during printing, and the disconnection of the electrode occurs mainly during firing.
本発明者等は、銀ペーストに含まれる銀微粒子の平均粒径が０.５μｍ以下であると過焼結が起こって断線が生じ易くなり、また銀微粒子の平均粒径が大き過ぎると焼結し難くなり十分な導電率が得られなくなる傾向があり、従って、銀ペーストに用いる銀微粒子には好ましい粒径範囲があることを見出した。 The inventors of the present invention have found that when the average particle size of the silver fine particles contained in the silver paste is 0.5 μm or less, oversintering is likely to cause disconnection, and when the average particle size of the silver fine particles is too large, It has been found that there is a tendency that it becomes difficult to obtain sufficient electrical conductivity, and therefore, the silver fine particles used in the silver paste have a preferable particle size range.
さらに、銀ペーストの粘性が高過ぎると、印刷後の表面平坦性が劣化し、印刷した電極回路の凹部が５μｍ以下の部分が発生して断線が生じ易くなり、また、銀ペーストの粘性が低過ぎると、電極間のスペースが狭いのでペーストの滲みによって配線の短絡が生じ易いと云う問題がある。 Furthermore, if the viscosity of the silver paste is too high, the surface flatness after printing is deteriorated, the concave portions of the printed electrode circuit are less than 5 μm, and breakage is likely to occur, and the viscosity of the silver paste is low. If it is too large, the space between the electrodes is narrow, and there is a problem that a short circuit of the wiring is likely to occur due to the spread of the paste.
本発明は、上記知見に基づき、電極の断線や短絡の原因になる従来の上記問題を解決したものであり、電気回路や電極の断線や短絡などを生じない銀ペーストを提供する。 Based on the above knowledge, the present invention solves the above-mentioned problems that cause disconnection and short-circuiting of electrodes, and provides a silver paste that does not cause disconnection or short-circuiting of electric circuits and electrodes.
本発明は以下の構成によって上記課題を解決した銀ペースト、該銀ペーストによって形成された電気回路または内部電極に関する。
〔１〕銀イオン溶液に還元剤を添加して銀微粒子を還元析出させる方法において、主還元剤と、主還元剤より還元力の強い副還元剤とを併用し、銀イオン溶液に副還元剤の存在下で主還元剤を加えて析出させた、平均粒径０.８μｍ以上〜１.０μｍ以下、およびタップ密度４ｇ/cm3以上の銀微粒子を含有し、粘度が１７００００ｃｐ以上〜１９００００ｃｐ以下であることを特徴とする銀ペースト。
〔２〕銀濃度に対する副還元剤のモル比（銀副還元剤比）を１.０×１０-5〜２.０×１０-6に調整して析出させた、平均粒径０.８μｍ以上〜１.０μｍ以下、およびタップ密度４ｇ/cm3以上の銀微粒子を含有し、粘度が１７００００ｃｐ以上〜１９００００ｃｐ以下である上記[１]に記載する銀ペースト。
〔３〕銀イオン溶液としてアンモニア水を加えた硝酸銀溶液を用い、主還元剤としてヒドロキノン液を用い、副還元剤としてヒドラジンを用いて析出させた銀微粒子を含有する上記[１]または上記[２]の何れかに記載する銀ペースト。
〔４〕主還元剤のヒドロキノン液に副還元剤のヒドラジン液を少量混合したものを用い、あるいは、銀イオン溶液に副還元剤のヒドラジン液を少量添加した後に直ちに主還元剤のヒドロキノン液を添加して析出させた銀微粒子を含有する上記[１]〜上記[３]の何れかに記載する銀ペースト。
〔５〕電子部品の電気回路または内部電極の形成に用いる上記[１]〜上記[４]の何れかに記載する銀ペースト。
〔６〕電子部品の電気回路または内部電極であって、上記[１]〜上記[５]の何れかに記載する銀ベーストによって形成されたことを電気回路または内部電極。
〔７〕上記[６]の電気回路または内部電極を有する電子部品。
The present invention relates to a silver paste that solves the above problems by the following configuration, and an electric circuit or an internal electrode formed by the silver paste.
[1] In a method of reducing and precipitating silver fine particles by adding a reducing agent to a silver ion solution, a main reducing agent and an auxiliary reducing agent having a reducing power stronger than that of the main reducing agent are used in combination, and the auxiliary reducing agent is added to the silver ion solution. Containing silver fine particles having an average particle diameter of 0.8 μm or more and 1.0 μm or less and a tap density of 4 g / cm 3 or more, and having a viscosity of 170000 cp or more and 190000 cp or less. Silver paste characterized by being.
[2] The average particle size of 0.8 μm or more deposited by adjusting the molar ratio of the secondary reducing agent to the silver concentration (silver secondary reducing agent ratio) to 1.0 × 10 −5 to 2.0 × 10 −6. The silver paste according to the above [1], which contains silver fine particles having a tap density of 4 g / cm 3 or more and a viscosity of 170000 cp or more and 190000 cp or less.
[3] The above [1] or [2] containing silver fine particles precipitated using a silver nitrate solution added with aqueous ammonia as a silver ion solution, using a hydroquinone solution as a main reducing agent, and using hydrazine as a secondary reducing agent. ] The silver paste described in any one of.
[4] Use a mixture of a main reducing agent hydroquinone solution and a small amount of a secondary reducing agent hydrazine solution, or add a small amount of a secondary reducing agent hydrazine solution to a silver ion solution and immediately add the main reducing agent hydroquinone solution. The silver paste as described in any one of [1] to [3] above, which contains silver fine particles precipitated in this manner.
[5] The silver paste according to any one of [1] to [4], which is used for forming an electric circuit of an electronic component or an internal electrode.
[6] An electric circuit or internal electrode of an electronic component, wherein the electric circuit or internal electrode is formed of the silver base described in any one of [1] to [5].
[7] An electronic component having the electric circuit or internal electrode of [6] above.
本発明の銀ペーストは、ペーストに含まれる銀微粒子の平均粒径とタップ密度、およびペーストの粘度が電気回路や電極の形成に適する範囲に限定されているので、断線や短絡を生じない電気回路や電極を形成することができる。 The silver paste of the present invention has an average particle diameter and tap density of silver fine particles contained in the paste, and the viscosity of the paste is limited to a range suitable for forming an electric circuit or an electrode, so that an electric circuit that does not cause a disconnection or a short circuit And electrodes can be formed.
具体的には、銀微粒子の平均粒径が１.０μｍ以下であるので焼結しやすく、また、銀微粒子の平均粒径が０.８μmより大きいので過焼結を生じ難い。さらに、銀微粒子のタップ密度が４ｇ/cm3以上であるので焼成収縮が小さく断線を生じ難い。また、銀ペーストの粘度が１９００００ｃｐ以下であるので、印刷後の表面の平坦性が良好であり、印刷面の凹凸が少ないので断線が生じ難く、銀ペーストの粘性が１７００００ｃｐより高いのでペーストの滲みによる短絡が生じ難い。 Specifically, since the average particle diameter of the silver fine particles is 1.0 μm or less, it is easy to sinter, and since the average particle diameter of the silver fine particles is larger than 0.8 μm, it is difficult to cause oversintering. Furthermore, since the tap density of the silver fine particles is 4 g / cm 3 or more, the firing shrinkage is small and disconnection is unlikely to occur. In addition, since the viscosity of the silver paste is 190000 cp or less, the flatness of the surface after printing is good, and the printed surface is less uneven, so that disconnection is less likely to occur, and the viscosity of the silver paste is higher than 170000 cp. Short circuit is unlikely to occur.
本発明の銀ペーストに用いる銀微粒子は、銀イオン溶液に還元剤を添加して銀微粒子を還元析出させる方法において、主還元剤と、主還元剤より還元力の強い副還元剤とを併用し、銀イオン溶液に副還元剤の存在下で主還元剤を加えて析出させたものであり、好適な平均粒径とタップ密度を有し、かつ分散性が良いので、銀ペースト用の銀微粒子に適する。この銀微粒子を含む本発明の銀ペーストは断線や短絡を生じない電気回路や電極を形成することができるので、セラミックス電子部品などの各種電子部品の電気回路や内部電極の形成材料として最適である。 The silver fine particles used in the silver paste of the present invention are a method of adding a reducing agent to a silver ion solution and reducing and precipitating silver fine particles, and using a main reducing agent and a secondary reducing agent having a stronger reducing power than the main reducing agent. The silver fine particles for silver paste are precipitated by adding a main reducing agent to a silver ion solution in the presence of a secondary reducing agent, having a suitable average particle diameter and tap density, and having good dispersibility. Suitable for. Since the silver paste of the present invention containing the silver fine particles can form an electric circuit or an electrode that does not cause disconnection or short circuit, it is optimal as a material for forming an electric circuit or an internal electrode of various electronic parts such as ceramic electronic parts. .
以下、本発明を実施例と共に具体的に説明する。
本発明の銀ペーストは、銀イオン溶液に還元剤を添加して銀微粒子を還元析出させる方法において、主還元剤と、主還元剤より還元力の強い副還元剤とを併用し、銀イオン溶液に副還元剤の存在下で主還元剤を加えて析出させた、平均粒径０.８μｍ以上〜１.０μｍ以下、およびタップ密度４ｇ/cm3以上の銀微粒子を含有し、粘度が１７００００ｃｐ以上〜１９００００ｃｐ以下であることを特徴とする銀ペーストである。
Hereinafter, the present invention will be specifically described together with examples.
The silver paste of the present invention is a method of adding a reducing agent to a silver ion solution to reduce and deposit silver fine particles, and using a main reducing agent and an auxiliary reducing agent having a reducing power stronger than that of the main reducing agent in combination. Containing silver fine particles having an average particle size of 0.8 μm to 1.0 μm and a tap density of 4 g / cm 3 or more precipitated by adding a main reducing agent in the presence of a secondary reducing agent and having a viscosity of 170,000 cp or more. It is a silver paste characterized by being ˜190,000 cp or less.
本発明の銀ペーストに含まれる銀微粒子は、平均粒径が０.８μmより大きいので過焼結が生じ難く、また平均粒径が１.０μｍ以下であるので焼結しやすい。従って、過焼結による断線や焼結不足による導電性不良などの問題を生じない。さらに、銀微粒子のタップ密度が４ｇ/cm3以上であるので焼成収縮が小さく断線を生じ難い。 Since the silver fine particles contained in the silver paste of the present invention have an average particle size larger than 0.8 μm, oversintering hardly occurs, and since the average particle size is 1.0 μm or less, it is easy to sinter. Therefore, problems such as disconnection due to oversintering and poor conductivity due to insufficient sintering do not occur. Furthermore, since the tap density of the silver fine particles is 4 g / cm 3 or more, the firing shrinkage is small and disconnection is unlikely to occur.
ペーストに含まれる銀微粒子の平均粒径が０.８μｍ未満であると焼結時に過焼結を生じて断線しやすくなるので好ましくない。また、銀微粒子の平均粒径が１.０μｍを上回ると焼結し難くなる。さらに、銀微粒子のタップ密度が４ｇ/cm3未満であると、単位体積当たりの銀微粒子の量が少なくなるので、焼結時の収縮によって断線を生じやすくなる。 If the average particle size of the silver fine particles contained in the paste is less than 0.8 μm, oversintering occurs during sintering, and disconnection tends to occur. Further, when the average particle diameter of the silver fine particles exceeds 1.0 μm, it becomes difficult to sinter. Furthermore, when the tap density of the silver fine particles is less than 4 g / cm 3 , the amount of silver fine particles per unit volume is reduced, and therefore disconnection is likely to occur due to shrinkage during sintering.
本発明の銀ペーストは、ペーストの粘度が１９００００ｃｐ以下であるので、ペーストが均一に印刷され、表面が平坦であり、印刷面の凹凸が少ない。従って、凹部による断線が生じ難い。また、銀ペーストの粘性が１７００００ｃｐより高いのでペーストの滲みが少なく、従って短絡が生じ難い。なお、ペーストの粘度はペーストに含まれる銀微粒子・樹脂・分散剤・溶剤の種類および含有量を調整して定めればよい。 In the silver paste of the present invention, since the viscosity of the paste is 190000 cp or less, the paste is printed uniformly, the surface is flat, and the printed surface has less unevenness. Therefore, disconnection due to the recess is unlikely to occur. Further, since the viscosity of the silver paste is higher than 170000 cp, the paste does not bleed, and therefore a short circuit hardly occurs. The viscosity of the paste may be determined by adjusting the type and content of silver fine particles, resin, dispersant, and solvent contained in the paste.
銀ペーストの粘度が１９００００ｃｐを上回ると、印刷後の表面の平坦性が低下して印刷面に凹凸を生じる場合があるので断線が生じ易く、また銀ペーストの粘性が１７００００ｃｐより低いとペーストの滲みが大きくなり短絡が生じやすくなる。 If the viscosity of the silver paste exceeds 190,000 cp, the flatness of the surface after printing may be reduced and unevenness may occur on the printed surface, so disconnection is likely to occur, and if the viscosity of the silver paste is lower than 170000 cp, the paste will bleed. It becomes large and short circuit easily occurs.
本発明の銀ペーストに用いる銀微粒子は、銀イオン溶液に還元剤を添加して銀微粒子を還元析出させる方法において、主還元剤と主還元剤より還元力の強い副還元剤とを併用し、銀イオン溶液に副還元剤の存在下で主還元剤を加えて析出させた、平均粒径０.８μｍ以上〜１.０μｍ以下、およびタップ密度４ｇ/cm3以上のものである。 Silver fine particles used in the silver paste of the present invention, in a method of reducing and precipitating silver fine particles by adding a reducing agent to a silver ion solution, in combination with a main reducing agent and a secondary reducing agent having a reducing power stronger than the main reducing agent, The silver ion solution was precipitated by adding a main reducing agent in the presence of a secondary reducing agent, and having an average particle size of 0.8 μm to 1.0 μm and a tap density of 4 g / cm 3 or more.
銀イオン溶液としてはアンモニア水を加えた硝酸銀溶液などを用いることができる。この溶液では銀アンミン錯体が形成され、還元剤を添加することによって銀が還元されて析出する。アンモニアの添加量は液中にアンミン錯体を形成しない銀イオンが残留しない量が適当であり、その量は銀１モルに対してアンモニアが２〜３モルとなる量が好ましい。 As the silver ion solution, a silver nitrate solution to which ammonia water is added can be used. In this solution, a silver ammine complex is formed, and silver is reduced and precipitated by adding a reducing agent. The amount of ammonia added is suitably such that silver ions that do not form an ammine complex do not remain in the solution, and the amount is preferably such that ammonia is 2 to 3 moles per mole of silver.
主還元剤としては、ヒドロキノン液〔OH(C6H4)OH〕、ピロガロール液、３,４-ジヒドロキシトルエン液のようにフェノール基を持つ有機還元剤の溶液を用いると良い。副還元剤としては、ヒドラジン液〔N2H4〕、水素化ホウ素ナトリウム〔NaBH4〕、ジメチルアミンボラン〔BH3・HN(CH3)2〕などを用いることができ、還元力の強いヒドラジン等が好ましい。 As the main reducing agent, a solution of an organic reducing agent having a phenol group such as hydroquinone liquid [OH (C 6 H 4 ) OH], pyrogallol liquid, and 3,4-dihydroxytoluene liquid may be used. As a secondary reducing agent, hydrazine liquid [N 2 H 4 ], sodium borohydride [NaBH 4 ], dimethylamine borane [BH 3 · HN (CH 3 ) 2 ] and the like can be used, and hydrazine having a strong reducing power. Etc. are preferred.
主還元剤と該主還元剤より還元力の強い副還元剤とを併用し、副還元剤の存在下で主還元剤を添加することによって、最初に還元力の強い副還元剤によって銀が還元され、多数の初期核を形成できるので、銀濃度に対する副還元剤のモル比（銀副還元剤比）を調整することによって、銀ペーストに適する平均粒径およびタップ密度を有する銀微粒子を容易に得ることができる。なお、主還元剤の量は銀イオン溶液の銀イオンを十分に還元する量であれば良い。 By combining the main reducing agent and a secondary reducing agent having a stronger reducing power than the main reducing agent and adding the primary reducing agent in the presence of the secondary reducing agent, silver is first reduced by the secondary reducing agent having a strong reducing power. Since many initial nuclei can be formed, by adjusting the molar ratio of the secondary reducing agent to the silver concentration (silver secondary reducing agent ratio), silver fine particles having an average particle size and tap density suitable for the silver paste can be easily obtained. Obtainable. The amount of the main reducing agent may be an amount that sufficiently reduces the silver ions in the silver ion solution.
具体的には、銀濃度に対する副還元剤のモル比（銀副還元剤比）を１.０×１０-5〜２.０×１０-6に調整することによって、平均粒径０.８μｍ以上〜１.０μｍ以下、およびタップ密度４ｇ/cm3以上の銀微粒子を９９％以上の高い収率で得ることができる。 Specifically, by adjusting the molar ratio of the secondary reducing agent to the silver concentration (silver secondary reducing agent ratio) to 1.0 × 10 −5 to 2.0 × 10 −6 , the average particle size is 0.8 μm or more. Silver fine particles having a diameter of ˜1.0 μm or less and a tap density of 4 g / cm 3 or more can be obtained with a high yield of 99% or more.
例えば、アンモニア水を加えた硝酸銀溶液にヒドロキノン液を添加して銀イオンを還元析出させる場合に、銀ヒドラジン比（Ｎ2Ｈ4/銀）を１.０×１０-5〜２.０×１０-6に調整すればよい。 For example, when a hydroquinone solution is added to a silver nitrate solution to which aqueous ammonia is added to reduce and precipitate silver ions, the silver hydrazine ratio (N 2 H 4 / silver) is set to 1.0 × 10 −5 to 2.0 × 10. Adjust to -6 .
なお、主還元剤を添加した後に副還元剤を添加するまでの時間が長いと上記効果が得られない。従って、主還元剤に少量の副還元剤を添加して用いるか、または少量の副還元剤を添加した後に直ちに主還元剤を添加するのが好ましい。 In addition, if the time from adding the main reducing agent to adding the secondary reducing agent is long, the above effect cannot be obtained. Therefore, it is preferable to add a small amount of a secondary reducing agent to the main reducing agent, or to add the primary reducing agent immediately after adding a small amount of the secondary reducing agent.
以下、本発明を実施例によって具体的に示す。
粒径の測定はレーザー散乱／回折法により個数基準で演算して求めた。タップ密度は規格（JIS-Z2512）で定められた方法によって測定した。ペーストの粘度は規格（JIS--K7117-1）で定められた方法に従い、ブルックフィールド粘度計（HBDV−II+Pro Cp）によって測定した。
Hereinafter, the present invention will be specifically described by way of examples.
The measurement of the particle size was obtained by calculation on the basis of the number by laser scattering / diffraction method. The tap density was measured by the method defined in the standard (JIS-Z2512). The viscosity of the paste was measured with a Brookfield viscometer (HBDV-II + Pro Cp) according to the method defined in the standard (JIS--K7117-1).
〔実施例１〕
表１に示すアンモニア水を加えた硝酸銀溶液を用い、主還元剤としてヒドロキノン液を用い、副還元剤Ａとしてヒドラジン液を用い、あらかじめ副還元剤液を添加したヒドロキノン液を硝酸銀溶液に加えて銀微粒子を還元析出させた。副還元剤液の添加量は表２に示す濃度に調整し、析出した銀微粒子の平均粒径をレーザー散乱／回折法によって測定した。なお、副還元剤を添加しないもの（比較１）、副還元剤の量が少ないもの（比較２）を比較試料として示した。この結果を表２に示した。
[Example 1]
Using a silver nitrate solution to which ammonia water shown in Table 1 is added, using a hydroquinone solution as a main reducing agent, using a hydrazine solution as an auxiliary reducing agent A, adding a hydroquinone solution to which an auxiliary reducing agent solution has been added in advance to the silver nitrate solution Fine particles were reduced and precipitated. The amount of the auxiliary reducing agent solution added was adjusted to the concentration shown in Table 2, and the average particle size of the precipitated silver fine particles was measured by a laser scattering / diffraction method. In addition, the thing which does not add a secondary reducing agent (comparative 1) and the thing with a small quantity of a secondary reducing agent (comparative 2) were shown as a comparative sample. The results are shown in Table 2.
〔実施例２〕
銀微粒子（平均粒径、タップ密度を図１〜図２に示す）を８５質量％含有する銀ペースト（粘度180000cp）を用い、チタン酸バリウム系のセラミックスグリーンシート表面に膜厚7μmの電極を印刷し、このシートを積層し、８３０℃で３時間、焼成して内部電極を形成し、その断線発生率を調べた。電極はライン・アンド・スペース３０μｍのコイルとし両端を外部に露出し、その両端の導通を調べることによって断線発生率を調べた。この結果を図１、図２に示した。また、平均粒径０.５μm〜２.０μmの銀微粒子を用い、上記と同様の条件で電極を印刷して電気抵抗率を調べた。この結果を図３に示した。
[Example 2]
Using a silver paste (viscosity 180,000 cp) containing 85% by mass of silver fine particles (average particle diameter, tap density shown in FIGS. 1 to 2), an electrode having a thickness of 7 μm is printed on the surface of a barium titanate ceramic green sheet. Then, this sheet was laminated and fired at 830 ° C. for 3 hours to form an internal electrode, and the disconnection occurrence rate was examined. The electrode was a coil with a line and space of 30 μm, both ends were exposed to the outside, and the disconnection occurrence rate was examined by examining the conduction at both ends. The results are shown in FIGS. In addition, using silver fine particles having an average particle diameter of 0.5 μm to 2.0 μm, electrodes were printed under the same conditions as described above, and the electrical resistivity was examined. The results are shown in FIG.
図１に示すように、ペーストに含まれる銀微粒子のタップ密度が４.０ｇ/cm3未満になると断線の発生率が増加し、例えば、タップ密度が３.０ｇ/cm3以下では断線発生率が概ね１０％以上になる。一方、銀微粒子のタップ密度が４.０ｇ/cm3より高いと、断線発生率が概ね５％以下である。 As shown in FIG. 1, when the tap density of the silver fine particles contained in the paste is less than 4.0 g / cm 3 , the disconnection rate increases. For example, when the tap density is less than 3.0 g / cm 3 , the disconnection rate Is approximately 10% or more. On the other hand, when the tap density of the silver fine particles is higher than 4.0 g / cm 3 , the disconnection occurrence rate is approximately 5% or less.
図２に示すように、ペーストに含まれる銀微粒子の平均粒径が０.８μｍでは断線発生率が概ね５％以下であるが、平均粒径が０.５μｍ以下では断線発生率が１０％以上に増加する。また、図３に示すように、銀微粒子の平均粒径が１.０μｍを上回ると電気抵抗率が急激に増加し、焼結し難くなることを示している。この結果から、銀微粒子の平均粒径は０.８μm〜１.０μｍが好ましい。 As shown in FIG. 2, when the average particle size of the silver fine particles contained in the paste is 0.8 μm, the disconnection rate is approximately 5% or less, but when the average particle size is 0.5 μm or less, the disconnection rate is 10% or more. To increase. Further, as shown in FIG. 3, when the average particle size of the silver fine particles exceeds 1.0 μm, the electrical resistivity increases rapidly and it becomes difficult to sinter. From this result, the average particle diameter of the silver fine particles is preferably 0.8 μm to 1.0 μm.
〔実施例３〕
銀微粒子を含有する銀ペースト（銀の平均粒径１.０μｍ、タップ密度４.５/cm3、銀含有量８５質量％、ペーストの粘度は図４、図５に示すとおり）を用い、実施例２と同様の条件で電極を印刷し、８３０℃で３時間、焼成し、断線の発生状態を調べた。この結果を図４および図５に示した。
Example 3
Conducted using a silver paste containing silver fine particles (average particle diameter of silver 1.0 μm, tap density 4.5 / cm 3 , silver content 85% by mass, paste viscosity as shown in FIGS. 4 and 5) An electrode was printed under the same conditions as in Example 2, fired at 830 ° C. for 3 hours, and the occurrence of disconnection was examined. The results are shown in FIG. 4 and FIG.
図４に示すように、ペースト粘度が１７００００ｃｐ未満であると、印刷時の滲み発生までの印刷回数が２０回未満であり、具体的には、ペースト粘度が１３００００ｃｐ〜１５００００ｃｐの範囲では滲み発生の印刷回数が１０回程度、ペースト粘度が９００００ｃｐ〜１１００００ｃｐの範囲では滲み発生の印刷回数が数回〜１０回未満である。従って、ペースト粘度が１７００００ｃｐ未満であると印刷時の滲みのために電極の短絡を生じやすい。 As shown in FIG. 4, when the paste viscosity is less than 170000 cp, the number of printings until the occurrence of bleeding at the time of printing is less than 20 times. Specifically, when the paste viscosity is in the range of 130,000 cp to 150,000 cp, printing with occurrence of bleeding is performed. When the number of times is about 10 times and the paste viscosity is in the range of 90000 cp to 110000 cp, the number of times printing has occurred is less than several times to less than 10 times. Therefore, if the paste viscosity is less than 170000 cp, short-circuiting of the electrodes tends to occur due to bleeding during printing.
ペースト粘度が１７００００ｃｐ〜１９００００ｃｐの範囲では、滲みが発生する印刷回数が２０回以上であり、印刷時の滲みが発生し難いので、電極の短絡を防止することができる。一方、図５に示すように、ペースト粘度が２０００００ｃｐ以上では断線発生率が急激に増加する。この結果から、銀ペーストの粘度は１７００００ｃｐ以上〜１９００００ｃｐ以下が好ましい。 When the paste viscosity is in the range of 170000 cp to 190000 cp, the number of times of printing where bleeding occurs is 20 times or more, and it is difficult for bleeding to occur during printing, so that it is possible to prevent short-circuiting of the electrodes. On the other hand, as shown in FIG. 5, when the paste viscosity is 200,000 cp or more, the disconnection rate increases rapidly. From this result, the viscosity of the silver paste is preferably 170000 cp to 190000 cp.
Claims (7)
In a method of reducing and precipitating silver fine particles by adding a reducing agent to a silver ion solution, a main reducing agent and a secondary reducing agent having a reducing power stronger than that of the primary reducing agent are used in combination, and the silver ion solution is present in the presence of the secondary reducing agent. And containing silver fine particles having an average particle size of 0.8 μm to 1.0 μm and a tap density of 4 g / cm 3 or more, which are precipitated by adding a main reducing agent at a viscosity of 170000 cp to 190000 cp. Characteristic silver paste.
The average particle size of 0.8 μm or more and 1.-1. Deposited by adjusting the molar ratio of the secondary reducing agent to the silver concentration (silver secondary reducing agent ratio) to 1.0 × 10 −5 to 2.0 × 10 −6 . 2. The silver paste according to claim 1, comprising silver fine particles of 0 μm or less and a tap density of 4 g / cm 3 or more and having a viscosity of 170000 cp to 190000 cp.
The silver ion solution containing ammonia water is used as the silver ion solution, the hydroquinone liquid is used as the main reducing agent, and silver fine particles precipitated using hydrazine as the auxiliary reducing agent are contained. Silver paste to be described.
Precipitate by adding a small amount of the hydrazine liquid of the secondary reducing agent to the hydroquinone liquid of the primary reducing agent, or immediately after adding a small amount of the hydrazine liquid of the secondary reducing agent to the silver ion solution. The silver paste in any one of Claims 1-3 containing the silver fine particle made to make.
The silver paste in any one of Claims 1-4 used for formation of the electric circuit or internal electrode of an electronic component.
An electric circuit or internal electrode of an electronic component, wherein the electric circuit or internal electrode is formed of the silver base according to any one of claims 1 to 5.
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| WO2013133103A1 (en) * | 2012-03-07 | 2013-09-12 | 住友金属鉱山株式会社 | Silver powder and method for producing same |
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| WO2013133103A1 (en) * | 2012-03-07 | 2013-09-12 | 住友金属鉱山株式会社 | Silver powder and method for producing same |
| JP2014098212A (en) * | 2012-03-07 | 2014-05-29 | Sumitomo Metal Mining Co Ltd | Silver powder and method for producing the same |
| US9744593B2 (en) | 2012-03-07 | 2017-08-29 | Sumitomo Metal Mining Co., Ltd. | Silver powder and method for producing same |
| CN102699341A (en) * | 2012-04-26 | 2012-10-03 | 蔡雄辉 | Wet-chemical preparation method for silver micro/nanowires |
| CN102699341B (en) * | 2012-04-26 | 2015-09-23 | 蔡雄辉 | A kind of wet chemical preparation method of silver-colored micro-/ nano line |
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