JP2010138494A - Method for producing flake copper powder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing flake copper powder which is composed of fine grains, has a sharp grain size distribution, has large crystallites, and has excellent oxidation resistance. <P>SOLUTION: The method for producing flake copper powder comprises: a first step where an aqueous solution comprising a copper salt and a complexing agent is prepared; a second step where alkali hydroxide is added to the aqueous solution so as to prepare first slurry comprising cupric oxide; a third step where a first reducing agent capable of reducing cupric oxide into cuprous oxide is added to the first slurry so as to prepare second slurry comprising cuprous oxide; and a fourth step where a second reducing agent capable of reducing cuprous oxide into copper is added to the second slurry so as to obtain flake copper powder. The method is characterized in that phosphoric acid and the salt thereof are added in at least one step among the first to third steps, and/or phosphoric acid and the salt thereof are added to the second slurry in the fourth step. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to the production how the flaky copper powder, particularly, for example, the circuit formation of the printed wiring board is used as a raw material for the copper paste used for electrical conduction securing external electrodes such as a ceramic capacitor flakes those concerning the manufacturing how the copper powder.

  Conventionally, as a method of forming electrodes and circuits for electronic components, etc., after a conductive paste in which copper powder, which is a conductive material, is dispersed in a paste is printed on a substrate, the paste is baked or cured and cured. A method of forming is known.

  In recent years, electronic devices have been demanded to reduce the size and density of electronic devices due to higher functionality. For this reason, copper powder, which is a material for conductive pastes, has good paste filling properties when used as conductive pastes. Thus, it is desired that the particle size distribution is sharp and fine.

  In addition, the copper powder used in the conductive paste is formed when the copper powder is oxidized by contact with oxygen, particularly when the solvent is removed, that is, when the paste is removed from the conductive paste by firing. This is not preferable because the resistance of the thick film is increased. For this reason, it is desirable that the copper powder has excellent oxidation resistance, but the oxidation resistance can be enhanced by increasing the crystallites in the copper powder and reducing the crystal grain boundaries in the copper powder. It is done. Accordingly, it is desired that the copper powder has as large a crystallite as possible in the copper powder.

  In addition, as a substrate on which the conductive paste is printed, a ceramic substrate is used in a portion where heat generation is large such as an IC package. However, when a conductive paste is printed on this ceramic substrate, the thermal shrinkage rate of the ceramic substrate and the thermal shrinkage rate of the copper thick film generated from the printed conductive paste are generally different. There is a possibility that the ceramic substrate and the copper thick film are peeled off or the substrate itself is deformed. For this reason, it is preferable that the thermal contraction rate of the ceramic substrate and the thermal contraction rate of the copper thick film generated from the printed conductive paste are as close as possible.

  One reason for the thermal contraction of the copper thick film during firing is that the voids remaining between the copper powders in the conductive paste are reduced by sintering the copper powders during the removal of the conductive paste. It is thought that there is to do. For this reason, in order to obtain a copper powder-containing conductive paste with little heat shrinkage, there should be as few voids as possible between the copper powders, that is, a shape in which the copper powders are easily filled with each other. Is desired. Moreover, in order to improve the electroconductivity of the copper thick film obtained by baking an electroconductive paste, it is preferable that the shape of a copper powder becomes a thing where the contact area of the copper powder in an electroconductive paste becomes large. . Furthermore, the shape anisotropy is lower as the shape of the copper powder of the conductive paste is closer to a sphere, and the shape anisotropy is higher as the shape of the copper powder is flatter. In view of the demand for the shape of the copper powder, it has been conventionally studied to use a flake copper powder in which the shape of the copper powder itself is not spherical but flakes.

  The flake copper powder preferably has a sharp particle size distribution so that the dispersibility in the paste is good when the conductive paste is prepared.

  As described above, the copper powder used for the conductive paste, particularly the flake copper powder, is desired to be fine, have a sharp particle size distribution, and have a large crystallite.

On the other hand, in Patent Document 1 (Japanese Patent Laid-Open No. 2003-119501), the particle size is 10 μm or less, and the SD / D ₅₀ is expressed using the volume cumulative particle size D50 and the standard deviation SD of the particle size distribution. There is 0.15 to 0.35, and the aspect ratio represented by the thickness and the volume cumulative particle diameter _{D 50} of the powder grains forming the flaky copper powder (thickness] / _{[D 50])} is The flake copper powder which is 0.3-0.7 is disclosed, According to this invention, the flake copper powder which is a fine particle and exhibits a flat flake shape is obtained.

JP 2003-119501 A (second page)

  However, although the flake copper powder described in Patent Document 1 is fine, it is produced by pulverizing the copper powder in an agglomerated state and compressing and deforming the pulverized copper powder by a high energy ball mill. Therefore, there is a problem that the copper powder is easily oxidized or distorted during compression deformation, and the crystallites are reduced.

Accordingly, an object of the present invention is to provide a method for producing flake copper powder which is fine and has a sharp particle size distribution, a large crystallite, and excellent oxidation resistance.

  In this situation, as a result of intensive studies, the present inventors have found that flake copper powder containing P, particularly flake copper powder having a specific powder shape, is suitable for the intended conductive paste. I found out. Moreover, in the wet manufacturing method of such flake copper powder, specific phosphoric acid and at least one of a plurality of steps of reducing copper (II) ions contained in the copper salt in the starting material and precipitating the copper powder When the salt is added, flake copper powder having a small particle size, a large crystallite diameter, and excellent oxidation resistance can be obtained without performing compression deformation treatment as in Patent Document 1, and the flake copper powder. Has found that the particle size distribution tends to be sharp, and has completed the present invention.

Manufacturing method of flake copper powder according to the present application: The manufacturing method of flake copper powder according to the present application is a first step of preparing an aqueous solution containing a copper salt and a complexing agent, and oxidizing by adding an alkali hydroxide to the aqueous solution. the second step of preparing a first slurry containing cupric, the first slurry, the first reducing agent capable of reducing cupric oxide to cuprous oxide, by adding a reducing sugar, the oxidation A third step of preparing a second slurry containing monocopper, and a second reducing agent capable of reducing cuprous oxide to copper in the second slurry as hydrazine, hydrated hydrazine, hydrazine sulfate, hydrazine carbonate and hydrochloric acid A method for producing flake copper powder comprising a fourth step of obtaining flake copper powder by adding at least one selected from the group consisting of hydrazine , wherein phosphorus is added in at least one of the first to third steps. Acid and its salts And / or adding phosphoric acid and a salt thereof to the second slurry in the fourth step.

In the method for producing flake copper powder according to the present application, the phosphoric acid and its salt added in at least one of the first to third steps, and / or the second slurry in the fourth step. total amount of the phosphoric acid and its salts, P in terms of the amount of the phosphoric acid and the salt is, with respect to copper to 1 mole of the contained before Symbol second slurry, to 0.001 mol to 3 mol Is preferred.

  In the method for producing flake copper powder according to the present application, it is preferable that the first slurry contains 1.05 equivalents to 1.50 equivalents of the alkali hydroxide with respect to 1 equivalent of the copper salt.

  In the method for producing flake copper powder according to the present application, the complexing agent is preferably an amino acid.

  In the method for producing flake copper powder according to the present application, the aqueous solution contains 0.005 mol to 10 mol of the complexing agent with respect to 1 mol of copper contained in the aqueous solution, the first slurry, or the second slurry. Is preferred.

The method for producing flake copper powder according to the present invention can efficiently produce flake copper powder having the following characteristics . That is, the flake copper powder obtained by the method for producing flake copper powder according to the present invention is not oxidized or distorted because it has not undergone a compression deformation operation, is fine, has a sharp particle size distribution, and has crystallites. Because of its large size, when used in a conductive paste, it has excellent oxidation resistance during removal of the solvent, dispersibility in the paste and filling property of the conductive paste, and finer electrodes and circuits formed from thick copper films. Can be And the conductive paste using the flake copper powder obtained by the method for producing flake copper powder according to the present invention is excellent in oxidation resistance and filling property at the time of removal of the solvent, and is an electrode or circuit formed from a copper thick film. Etc. can be further refined, and the obtained copper thick film can be made excellent in heat shrinkage resistance.

(Method for producing flake copper powder according to the present invention)
The method for producing flake copper powder according to the present invention includes a first step of preparing an aqueous solution containing a copper salt and a complexing agent (hereinafter referred to as “copper salt aqueous solution”), and an alkali hydroxide is added to the aqueous solution. the second step of preparing a first slurry containing cupric oxide, in the first slurry, the first reducing agent capable of reducing cupric oxide to cuprous oxide, by adding a reducing sugar, oxidation A third step of preparing a second slurry containing cuprous, and a second reducing agent capable of reducing cuprous oxide to copper in the second slurry include hydrazine, hydrated hydrazine, hydrazine sulfate, hydrazine carbonate, and A method for producing flake copper powder comprising a fourth step of obtaining flake copper powder by adding at least one selected from the group consisting of hydrazine hydrochloride , wherein at least one of the first to third steps Add phosphoric acid and its salts Rukoto, and / or performs the addition of phosphoric acid and salts thereof to the second slurry in the fourth step.

(First step)
In the first step, first, an aqueous copper salt solution is prepared. In the present invention, an aqueous copper salt solution is an aqueous solution obtained by blending a copper salt and a complexing agent, and copper (II) ions derived from the copper salt are combined with the complexing agent to form a Cu complex. Say things.

  As the copper salt used in the present invention, a copper salt that is soluble in water is used. For example, copper sulfate, copper nitrate, copper acetate, or a hydrate thereof can be used. Among these, copper sulfate pentahydrate and copper nitrate are preferable because they have high solubility as a salt, can increase the copper concentration, and easily obtain flake copper powder with high uniformity in particle size. The complexing agent used in the present invention is a complexing agent for copper ions in an aqueous solution. In the present invention, the copper (II) ion obtained from the copper salt is converted into a Cu complex, whereby hydroxylation in the second step. It has the effect | action which makes uniform the formation of CuO by addition of an alkali. As the complexing agent, for example, amino acid, tartaric acid and the like can be used. Moreover, as an amino acid, aminoacetic acid, alanine, glutamic acid, etc. can be used, for example. Of these, aminoacetic acid is preferable because flake copper powder having a highly uniform particle size is easily obtained. Complexing agents can be used alone or in combination of two or more.

  An aqueous copper salt solution is prepared by dissolving a copper salt and a complexing agent in water. In addition, the dissolution method and dissolution order of the copper salt and complexing agent in water are not particularly limited. Examples of the method for dissolving the copper salt and the complexing agent in water include a method in which water is kept in a stirred state, and the copper salt and the complexing agent are added thereto and stirred. As water used for the preparation of the copper salt aqueous solution, pure water, ion-exchanged water, ultrapure water and the like are preferable because the flake copper powder is fine and the crystallite diameter tends to increase. Moreover, the water temperature is 50 to 90 degreeC normally in the case of preparation of copper salt aqueous solution, Preferably it is 60 to 80 degreeC. It is preferable for the water temperature to be within this range because copper oxide having a uniform particle size is easily formed in the next step.

  Copper salt aqueous solution contains 0.005 mol-10 mol normally with respect to 1 mol of copper contained in this, Preferably it is 0.01 mol-5 mol. It is preferable that the compounding ratio of the complexing agent with respect to the copper salt is within the above range because the flake copper powder is fine, the crystallite diameter is large, and the shape tends to be a flake shape having a high flatness.

  The aqueous copper salt solution usually contains 10 to 50 parts by weight, preferably 20 to 40 parts by weight of the copper salt with respect to 100 parts by weight of water. It is preferable for the blending ratio of the copper salt to water to be within this range because flake copper powder having a highly uniform particle size can be easily obtained.

(Second step)
In the second step, an alkali hydroxide is added to the copper salt aqueous solution to prepare a first slurry containing cupric oxide. In the present invention, the first slurry refers to a slurry obtained by adding alkali hydroxide to the copper salt aqueous solution, in which fine particles of cupric oxide (CuO) are precipitated in the liquid. Examples of the method for adding alkali hydroxide to the copper salt aqueous solution include a method in which the copper salt aqueous solution is stirred and the alkali hydroxide aqueous solution is added thereto and stirred. In preparing the first slurry, the liquid temperature is usually 50 ° C. to 90 ° C., preferably 60 ° C. to 80 ° C. When the liquid temperature is within this range, it is preferable because a flake copper powder having a high particle size with a small primary particle aggregation is easily obtained.

  The alkali hydroxide used in the present invention has an effect of converting the Cu complex in the copper salt aqueous solution into cupric oxide (CuO) in the present invention. As the alkali hydroxide, for example, sodium hydroxide, potassium hydroxide, ammonia, aqueous ammonia and the like can be used. Of these, sodium hydroxide is preferable because it is inexpensive and easily controls the reaction to form cupric oxide. In addition, when the alkali hydroxide is in an aqueous solution state, when the alkali hydroxide is added to the aqueous solution, the reaction of the Cu complex in the aqueous copper salt solution to cupric oxide (CuO) is rapidly performed. The flake copper powder is preferable because the variation in the particle size tends to be small.

  A 1st slurry contains 1.05 equivalent-1.50 equivalent normally with respect to 1 equivalent of the said copper salt, Preferably 1.10 equivalent-1.30 equivalent. It is preferable that the blending ratio of the alkali hydroxide is within the above range because a flake copper powder having a highly uniform particle size can be easily obtained. Here, the equivalents of copper salt and alkali hydroxide refer to equivalents as an acid and equivalents as a base, respectively.

  In the second step, an alkali hydroxide is added to the aqueous copper salt solution to prepare the first slurry, and then it is usually further stirred for 10 minutes to 60 minutes, preferably 20 minutes to 40 minutes. If stirring is continued even after the addition of the alkali hydroxide in this way, the reaction of the Cu complex to cupric oxide (CuO) is sufficiently performed, so that flake copper powder with high particle size uniformity is easily obtained. preferable.

(Third step)
In the third step, a first slurry containing cuprous oxide is prepared by adding a first reducing agent capable of reducing cupric oxide to cuprous oxide to the first slurry. In the present invention, the second slurry refers to a slurry obtained by adding a first reducing agent to the first slurry and having cuprous oxide (Cu ₂ O) precipitated in the liquid. Examples of the method for adding the first reducing agent to the first slurry include a method in which the first slurry is kept in a stirred state, and an aqueous solution of the first reducing agent is added thereto and stirred. In preparing the second slurry, the liquid temperature is usually 50 ° C. to 90 ° C., preferably 60 ° C. to 80 ° C. When the liquid temperature is within this range, it is preferable because a flake copper powder having a high particle size with a small primary particle aggregation is easily obtained.

First reducing agent used in the present invention has an effect of reducing the cupric oxide in the first slurry in the present invention (CuO) a cuprous oxide (Cu 2 _O). As the first reducing agent, for example, reducing sugar, hydrazine and the like can be used. Moreover, as reducing sugar, glucose, fructose, lactose etc. can be used, for example. Among these, glucose is preferable because the reaction is easily controlled. A 1st reducing agent can be used individually by 1 type or in combination of 2 or more types. In addition, when the first reducing agent is in an aqueous solution state, cupric oxide (Cu ₂ ) of cupric oxide (CuO) in the first slurry when the first reducing agent is added to the first slurry. O) is preferable because the reduction reaction to O) is performed quickly and the variation in the particle size of the flake copper powder tends to be small.

A 2nd slurry contains 0.1 mol-3.0 mol of 1st reducing agents normally with respect to 1 mol of copper salts contained in a 1st slurry, Preferably 0.3 mol-1,5 mol. When the blending ratio of the first reducing agent with respect to the copper salt is within the range, the cupric oxide (CuO) is sufficiently reduced to cuprous oxide (Cu ₂ O to be synthesized, and the flake copper powder is synthesized. Is preferable because it tends to have a low aggregation of primary particles.

In the third step, after the first reducing agent is added to the first slurry to prepare the second slurry, it is further usually stirred for 10 minutes to 60 minutes, preferably 20 minutes to 40 minutes. In the present invention, if the reduction reaction of cupric oxide (CuO) to cuprous oxide (Cu ₂ O) is sufficiently performed by continuing stirring even after the addition of alkali hydroxide in this way, synthesis is performed. The flake copper powder to be used is preferable because it tends to have a low aggregation of primary particles.

(4th process)
In the fourth step, a flake copper powder is obtained by adding a second reducing agent capable of reducing cuprous oxide to copper to the second slurry. However, in the present invention, phosphoric acid and its salt are added in at least one of the first to third steps and / or added to the second slurry in the fourth step. When the second reducing agent is added in the process, phosphoric acid and its salt are always present in the second slurry.

  In the present invention, phosphoric acid and its salt mean a substance capable of supplying phosphate ions such as orthophosphate ion, pyrophosphate ion, metaphosphate ion or the like in the presence of water or less, and in the flake copper powder obtained in the present invention P is contained, and it is presumed that the flake copper powder has the effect of reducing the particle size and increasing the crystallite size. Examples of phosphoric acid and salts thereof used in the present invention include polyphosphoric acid such as phosphoric acid and pyrophosphoric acid, metaphosphoric acid such as trimetaphosphoric acid; phosphate such as sodium phosphate and potassium phosphate, sodium pyrophosphate, and pyrolin. Examples thereof include polyphosphates such as potassium acid, and metaphosphates such as sodium trimetaphosphate and potassium trimetaphosphate.

  In addition, the total amount of phosphoric acid and its salt added in at least one of the first to third steps and / or its salt added in the fourth slurry in the fourth step is P (phosphorus) conversion amount in the acid and its salt is usually 0.001 mol to 3 mol, preferably 0.01 with respect to 1 mol of copper contained in the copper salt aqueous solution, the first slurry or the second slurry. Mol to 1 mol. It is preferable that the P conversion amount of the total addition amount is within this range because the oxidation resistance of the obtained flake copper powder tends to be high. On the other hand, when the P conversion amount is less than 0.001 mol, the oxidation resistance of the obtained flake copper powder is likely to be insufficient, or the flake copper powder is difficult to flatten. Moreover, since the resistance of flake copper powder will become high easily when this P conversion amount exceeds 3 mol, it is unpreferable.

  Examples of the method for adding the second reducing agent to the second slurry include a method in which the second slurry is kept in a stirred state, and an aqueous solution of the second reducing agent is added thereto and stirred. Moreover, at the 4th process, when adding a 2nd reducing agent to a 2nd slurry, liquid temperature is 50 to 90 degreeC normally, Preferably it is 60 to 80 degreeC. When the liquid temperature is within this range, it is preferable because a flake copper powder having a high particle size with a small primary particle aggregation is easily obtained.

The second reducing agent used in the present invention has an action of reducing cuprous oxide (Cu ₂ O) in the second slurry to Cu in the present invention. As the second reducing agent, for example, at least one selected from the group consisting of hydrazine, hydrated hydrazine (N ₂ H ₄ .H ₂ O), hydrazine sulfate, hydrazine carbonate, and hydrazine hydrochloride can be used.

  Moreover, when adding a 2nd reducing agent to a 1st slurry at once, when adding gradually little by little over time, the particle size of the obtained flake copper powder is made into the flake copper which concerns on the said invention. Since it is easy to make it within the range of the particle size of the powder, it is preferable. The time required for the addition is usually 1 minute to 60 minutes, preferably 3 minutes to 40 minutes.

4th process WHEREIN: A 2nd reducing agent is 0.5 mol-6.0 mol normally with respect to 1 mol of copper salts contained in a 2nd slurry, Preferably 0.8 mol-3.0 mol are included. When the mixing ratio of the second reducing agent to the copper salt is within the above range, the reduction reaction of cuprous oxide (Cu ₂ O) to Cu is sufficiently performed, so that the flake copper having a high particle size uniformity is obtained. It is preferable because powder is easily obtained.

In the fourth step, after the second reducing agent is added to the second slurry, it is usually further stirred for 20 minutes to 2 hours, preferably 40 minutes to 1.5 hours. Thus, if stirring is continued even after the addition of the second reducing agent, the reduction reaction of cuprous oxide (Cu ₂ O) to Cu is sufficiently performed, so that flake copper powder with less aggregation of primary particles can be obtained. Since it is easy to obtain, it is preferable.

  When the fourth step is performed, flake copper powder is generated in the slurry. The flake copper powder can be obtained, for example, by filtering the slurry using a Nutsche or the like, then washing the filter cake with pure water, washing with a methanol solution containing oleic acid or the like, and drying. In addition, although the mechanism by which flake copper powder is obtained only by performing a reducing action in the present invention is unclear, in the present invention phosphoric acid and the second slurry before adding the second reducing agent used in the fourth step Since the flake copper powder is obtained if the salt is present, it is assumed that when the cuprous oxide is reduced to copper, phosphoric acid and its salt cause some action to form the flake copper powder. Is done.

  Moreover, when forming an organic surface treatment layer on the surface of flake copper powder, as a method of forming the layer, for example, the organic compound is applied to the surface of the flake copper powder using a known method such as a dry method or a wet method. The method of making it coat | cover is mentioned.

( Flake copper powder obtained by the method for producing flake copper powder according to the present invention)
Next, the flake copper powder obtained by the method for producing flake copper powder according to the present invention will be described.
The flake copper powder obtained by the method for producing flake copper powder according to the present invention is a powder in which the microscopic shape of the particles is flake-like. In the present invention, the powder having a flaky shape means that the primary particles of the copper powder have a flaky shape, and does not indicate the properties of the secondary particles produced by aggregation of the primary particles.

The flaky copper powder _{is, D 50} is usually 0.3Myuemu～7myuemu, preferably 0.5 m to 5 m, more preferably from 0.5Myuemu～4myuemu. If D ₅₀ is within the range, preferred liable filling of the conductive paste prepared by using the flaky copper powder are improved. On the other hand, if D ₅₀ is less than 0.3 μm, the viscosity of the conductive paste tends to increase, which is not preferable. If it exceeds 7 μm, it is difficult to make the copper thick film formed from the conductive paste thinner or fine line. Since it becomes easy to become, it is not preferable. Note that D ₁₀ , D ₅₀ and D ₉₀ used in the present invention are the cumulative volume particle diameters (μm) at 10 volume%, 50 volume% and 90 volume%, respectively, according to the laser diffraction scattering particle size distribution measurement method. Show.

The flake copper powder has a crystallite diameter of 25 nm or more, preferably 35 nm or more. If the crystallite diameter is within this range, the copper thick film undergoes thermal contraction due to a dimensional change of the copper thick film before and after the formation of the copper thick film by the conductive paste using the flake copper powder. It is difficult for the film to peel off from the ceramic substrate or to deform due to the dimensional change of the copper thick film, and the oxidation resistance of the flake copper powder tends to be high when the paste is removed from the conductive paste. preferable. On the other hand, if the crystallite diameter is less than 25 nm, the copper thick film undergoes thermal contraction due to a dimensional change of the copper thick film before and after the formation of the copper thick film by the conductive paste using the flake copper powder. The thick film is likely to peel off from the ceramic substrate, or the ceramic substrate is easily deformed by the dimensional change of the copper thick film, and the oxidation resistance of the flake copper powder tends to be low when the paste is removed from the conductive paste. Therefore, it is not preferable. Note that the binding crystallite diameter, to flaky copper powder sample obtained by performing X-ray diffraction means the average crystallite diameter obtained from the half width of the peak of the diffraction angle of each crystal face.

The flaky copper powder had a crystallite diameter _{/ D IA} is usually 0.01 or more, preferably 0.015 or more. If the crystallite diameter / _DIA is within this range, the copper thick film undergoes thermal contraction due to the dimensional change of the copper thick film before and after the formation of the copper thick film by the conductive paste using the flake copper powder. This is preferable because it is difficult and the oxidation resistance of the flake copper powder tends to be high when the paste is removed from the conductive paste. On the other hand, if the crystallite diameter / _DIA is less than 0.01, the heat of the copper thick film due to the dimensional change of the copper thick film before and after the formation of the copper thick film by the conductive paste using the flake copper powder. This is not preferable because it tends to shrink and the oxidation resistance of the flake copper powder tends to be low when the paste is removed from the conductive paste.

Flaky copper powder according to the present _{invention, D IA} is usually 0.3Myuemu～8myuemu. When D _IA are within the range, preferred liable filling of the conductive paste prepared by using the flaky copper powder are improved. On the other hand, if the _DIA is less than 0.3 μm, the viscosity of the conductive paste tends to increase, which is not preferable. If the DIA exceeds 8 μm, it is difficult to make the copper thick film formed from the conductive paste thinner or fine line. Since it becomes easy to become, it is not preferable. Note that the D _IA As used herein, unlike the D ₅₀ is the volume-cumulative particle diameter ([mu] m) in cumulative volume 50% by volume by laser diffraction scattering particle size distribution measuring method, a scanning electron microscope (SEM) The average particle diameter (μm) of the major axis (μm) of each flaky copper powder (the number of measurement samples of the flaky copper powder is 10 or more) measured from the SEM image obtained by direct observation at 5000 to 20000 times Indicates.

The flaky copper powder has _an aspect ratio obtained by dividing the _{D IA} with thickness of the flake copper powder _{t (μm) (D IA /} t) is usually 2 to 50, preferably 2 to 20, more preferably 3 -10. When the aspect ratio (D _IA / t) is within this range, it is preferable because the contact area between the copper powders in the conductive paste can be increased and the resistance of the copper thick film can be easily reduced. On the other hand, if the aspect ratio (D _IA / t) is less than 2, the contact area between the copper powders in the conductive paste is not sufficiently large, and it is difficult to reduce the resistance of the copper thick film. When it exceeds, there exists a possibility that the viscosity of an electrically conductive paste may rise rapidly. In the present invention, the thickness t (μm) of the flake copper powder means an average thickness measured by direct observation of a scanning electron micrograph.

The said flake copper powder contains P in flake copper powder. Content of P in flake copper powder is 10 ppm-200 ppm normally, Preferably it is 30 ppm-100 ppm, More preferably, it is 50 ppm-80 ppm. It is preferable for the P content to fall within this range since the oxidation resistance of the flake copper powder tends to be high. On the other hand, if the content of P is less than 10 ppm, the oxidation resistance of the flake copper powder is not sufficient, or the flake copper powder is difficult to flatten. Further, if the P content exceeds 200 ppm, the resistance of the flake copper powder tends to increase, such being undesirable. In this specification , ppm means parts per million by weight.

The flake copper powder usually has an SD / D ₅₀ of 0.45 or less, preferably 0.4 or less. When the SD / D ₅₀ is within the above range, the particle size distribution of the flake copper powder is sharp, which is preferable because the filling property of the conductive paste produced using the flake copper powder tends to be good. When the SD / D ₅₀ is out of the above range, the particle size distribution of the flake copper powder is broad, which is not preferable because the filling property of the conductive paste produced using the flake copper powder tends to decrease. In the present specification , SD indicates the standard deviation (μm) of the particle size distribution obtained by the laser diffraction / scattering particle size distribution measuring method.

The flaky copper powder _is, D 90 _{/ D 10} is usually 3.0 or less, preferably 2.5 or less. On the other hand, if D ₉₀ / D ₁₀ is out of the above range, the particle size distribution of the flake copper powder is broad, which is not preferable because the filling property of the conductive paste prepared using the flake copper powder tends to be lowered.

The flaky copper powder has a specific surface area of usually 0.2m ² /g~4.0m ² / g, preferably 0.3m ² /g~2.2m ² / g. When the specific surface area exceeds 4.0 m ² / g, the viscosity of the conductive paste formed from the flake copper powder may be too high, which is not preferable. In this specification , the specific surface area refers to the BET specific surface area.

The flaky copper powder had a tap density of typically 2.0 g / cm ³ or more, preferably ^{3.3g / cm 3 ~5.0g / cm 3} . When the tap density is within the above range, the dispersibility of the flake copper powder in the paste is good during the preparation of the conductive paste, and the preparation of the conductive paste is easy. When the coating film is baked due to the formation of appropriate gaps between the flake copper powders, the removal of the solvent from the coating film is facilitated and the density of the baked film is improved, resulting in the resistance of the copper thick film. Is preferred because it tends to be low.

If the surface of the flake copper powder is further formed with an organic surface treatment layer, the surface of the flake copper powder in the paste is baked when the conductive paste film is baked to form a copper thick film. It is preferable that a copper oxide film can be prevented from being oxidized on the surface by being oxidized by oxygen in the atmosphere, thereby preventing an increase in electrical resistance of the copper thick film over time.

The organic surface treatment layer is formed by coating an organic compound on the surface of the flake copper powder. Examples of the organic compound used here include saturated fatty acids, unsaturated fatty acids, nitrogen-containing organic compounds, sulfur-containing organic compounds, and silane coupling agents.

The saturated fatty acids, for example, enanthate _{(C 6} H 13 COOH), caprylic acid _{(C 7} H 15 COOH), pelargonic acid _{(C 8} H 17 COOH), capric acid _{(C 9} H 19 COOH), undecylic acid (C ₁₀ H ₂₁ COOH), lauric acid (C ₁₁ H ₂₃ COOH), tridecylic acid (C ₁₂ H ₂₅ COOH), myristic acid (C ₁₃ H ₂₇ COOH), pentadecylic acid (C ₁₄ H ₂₉ COOH), palmitic acid (C ₁₅ H ₃₁ COOH), heptadecyl acid (C ₁₆ H ₃₃ COOH), stearic acid (C ₁₇ H ₃₅ COOH), nonadecanoic acid (C ₁₈ H ₃₇ COOH), arachidic acid (C ₁₉ H ₃₉ COOH) and behenic acid (C ₂₁ H ₄₃ COOH) and the like.

Examples of unsaturated fatty acids used in the present invention include acrylic acid (CH ₂ ═CHCOOH), crotonic acid (CH ₃ CH═CHCOOH), isocrotonic acid (CH ₃ CH═CHCOOH), undecylenic acid (CH ₂ ═CH ( CH ₂ ) ₉ COOH), oleic acid (C ₁₇ H ₃₃ COOH), elaidic acid (CH ₃ (CH ₂ ) ₇ CH═CH (CH ₂ ) ₇ COOH), setoleic acid (CH ₃ (CH ₂ ) ₉ CH═ CH (CH ₂ ) ₉ COOH), brassic acid (C ₂₁ H ₄₁ COOH), erucic acid (C ₂₁ H ₄₁ COOH), sorbic acid (C ₅ H ₇ COOH), linoleic acid (C ₁₇ H ₃₁ COOH), linolenic acid _{(C 17} H 29 COOH) and arachidonic acid _{(C 13} H 31 COOH), and the like.

The nitrogen-containing organic compounds, for example, 1,2,3-benzotriazole, carboxybenzotriazole, N ', N'-bis (benzotriazolyl methyl) urea, IH-1,2,4-triazole and 3 -Triazole compounds having a substituent such as amino-1H-1,2,4-triazole and the like.

The sulfur-containing organic compounds, for example, the sulfur-containing organic compounds, mercaptobenzothiazole, thiocyanuric acid and 2-benzimidazole thiol, and the like.

The silane-coupling agent, for example, vinyl trimethoxy silane coupling agent, aminosilane coupling agent, tetramethoxy silane coupling agent, methyl trimethoxysilane coupling agents, such as diphenyl dimethoxy silane coupling agent.

These types Symbol organic compounds, oleic acid, the use of capric acid or stearic acid, liable increases the filling of the conductive paste produced from oxidation resistance and the flaky copper powder of flake copper powder preferred. Organic compounds, the saturated fatty acids, unsaturated fatty acids, nitrogen-containing organic compounds, among such sulfur-containing organic compounds and silane coupling agents may be used singly or in combination of two or more thereof.

In the flake copper powder, the organic surface treatment layer has a coverage of usually 0.05% by weight to 2% by weight, preferably 0.1% by weight to 1% by weight, based on the flake copper powder. In this specification, the coverage of the organic surface treatment layer means the ratio of the weight of the organic surface treatment layer to the weight of the untreated flake copper powder not forming the organic surface treatment layer. It is preferable that the coverage of the organic surface treatment layer is in the above range because the oxidation resistance of the conductive paste is easily improved, and the oxidation resistance of the flake copper powder is easily improved. On the other hand, when the coverage of the organic surface treatment layer exceeds 2% by weight, it is not preferable because the temporal stability of the viscosity of the conductive paste tends to be low.

The flaky copper powder, when the formation of the organic surface treatment layer, typically 0.1m specific surface area ^{2 /g~3.5m 2} / g, preferably 0.2m ² /g~2.0m ² / g is there. When the specific surface area exceeds 3.5 m ² / g, the viscosity of the conductive paste formed from the flake copper powder may be too high, which is not preferable.

The flaky copper powder, when the formation of the organic surface treatment layer, a tap density of typically 3.0 g / cm ³ or more, preferably ^{3.5g / cm 3 ~5.5g / cm 3} . When the tap density is within the above range, the dispersibility of the flake copper powder in the paste is good during the preparation of the conductive paste, and the preparation of the conductive paste is easy. When the coating film is baked due to the formation of appropriate gaps between the flake copper powders, the removal of the solvent from the coating film is facilitated and the density of the baked film is improved, resulting in the resistance of the copper thick film. is not preferred because tends to be low.

The conductive paste using the flake copper powder obtained by the above-described method for producing flake copper powder according to the present invention will be described. The said conductive paste contains the said flake copper powder and resin. Examples of the resin used in the conductive paste, for example, acrylic resin, epoxy resin, ethyl cellulose, carboxymethyl cellulose and the like.

Moreover, the conductive paste, the content of off Lake copper powder, typically 30% to 98% by weight, it is desirable that preferably 40% to 90% by weight. It is preferable that the content of the flake copper powder is within the range because the specific resistance of the formed copper wiring tends to be low.

Upper notated Lake copper powder can be mixed with itself or other spherical powder or the like, using a raw material of sintered applications of the electrode, the application of the material such as conductive paste. Moreover, the flaky copper powder, for example, by mixing with known paste used in the preparation of the conductive paste, conductive paste flaky copper powder is dispersed is obtained. The conductive paste can be used, for example, as a copper paste used for circuit formation of a printed wiring board, ensuring electrical continuity of an external electrode of a ceramic capacitor, and EMI countermeasures.

  Examples are shown below, but the present invention is not construed as being limited thereto.

Add 6 kg of copper sulfate pentahydrate, 120 g of aminoacetic acid and 50 g of sodium phosphate to 6 L of pure water at 70 ° C. and stir, and then add pure water to adjust the amount of the aqueous solution to 8 L, and stir for 30 minutes. Continued.
Next, with the aqueous solution being stirred, 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes. After adding 1.5 kg of glucose, stirring was continued for 30 minutes. .
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 5 minutes, and then the stirring was continued for 1 hour to complete the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was dried to obtain flake copper powder.
The obtained flaky copper powder, the following measurement _{method, D 10, D 50, D} 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.

(Measuring method of particle size D ₁₀ , D ₅₀ , D ₉₀ , D _max , SD): First, 0.2 g of a copper powder sample was added to a 0.1 wt% aqueous solution of SN Dispersant 5468 (manufactured by Sannobuco Co., Ltd.) and It was mixed with a nonionic surfactant Triton X-100 (polyoxyethylene octylphenyl ether) manufactured by Kojunkaku Kogyo Co., Ltd. and dispersed for 5 minutes with an ultrasonic homogenizer (US-300T manufactured by Nippon Seiki Seisakusho Co., Ltd.). Next, using Nikkiso Co., Ltd. Microtrac HRA9320-X100 (Leeds + Northrup Co., Ltd.), the particle size at the time when the cumulative volume determined by the laser diffraction scattering method is 10%, 50%, 90% and 100% ( μm) was D ₁₀ , D ₅₀ , D ₉₀ and D _max , respectively, and the standard deviation (μm) of the particle size distribution obtained during these measurements was SD.
(Measurement method of particle size _{D IA):} observed copper powder sample directly SEM (magnification: 5000 times ～20000 times) copper powder particles 200 a major axis ([mu] m) of the circular plate of the copper powder particles of the copper powder in the sample Each piece was measured and the average value of the major axis was obtained.
(Measurement method of crystallite diameter): Determined by crystallite analysis software using Rigaku Corporation X-ray diffraction apparatus RINT200V.
(Measurement method of P content): The sample powder was dissolved in dilute nitric acid, the P concentration of the solution was measured using an ICP emission analyzer, and the P content in the powder was calculated from the concentration.
(Measurement method of aspect ratio): measuring the average thickness of the powder using a scanning electron microscope (t ([mu] m)), and the above D _IA and aspect ratio divided by the t.

Add 6 kg of copper sulfate pentahydrate, 120 g of aminoacetic acid and 75 g of sodium phosphate to 6 L of pure water at 70 ° C. Continued.
Next, with the aqueous solution being stirred, 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes. After adding 1.5 kg of glucose, stirring was continued for 30 minutes. .
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, and then the stirring was continued for 1 hour to complete the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was dried to obtain flake copper powder. The obtained flaky copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.
Moreover, about the obtained flake copper powder, the thermogravimetry (TG) was performed according to the following method, and the oxidation start temperature was measured. The results are shown in Table 3.
(Measuring method of TG): The copper powder was heated in the air atmosphere at a heating rate of 10 ° C./min, and the weight change of the copper powder was measured.

Add 6 kg of copper sulfate pentahydrate, 120 g of aminoacetic acid, and 75 g of sodium phosphate to 6 L of pure water at 70 ° C., stir, and then add pure water to adjust the volume of the aqueous solution to 8 L, and stir for 30 minutes. Continued.
Next, with the aqueous solution being stirred, 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes. After adding 1.5 kg of glucose, stirring was continued for 30 minutes. .
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, and then the stirring was continued for 1 hour to complete the reaction.
After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was immersed in a methanol solution obtained by dissolving 1 g of oleic acid in 3 L of methanol for 1 hour, washed with methanol, and dried to obtain flake copper powder.
Place filter paper on the bottom of Nutsche, place the flake copper powder on the filter paper, add a solution of 1 g of oleic acid in 1 liter of methanol and leave it for 30 minutes, then operate the suction pump. And filtered with suction.
The flake copper powder remaining on the glass filter paper was taken out and dried at 70 ° C. for 5 hours to obtain flake copper powder whose surface was coated with oleic acid.
The obtained flaky copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.

To 6 L of pure water at 70 ° C., 4 kg of copper sulfate pentahydrate and 120 g of aminoacetic acid were added and stirred. Further, pure water was added to adjust the amount of the aqueous solution to 8 L, and stirring was continued for 30 minutes.
Next, with the aqueous solution being stirred, 75 g of sodium phosphate was added to the aqueous solution, and then 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added, followed by stirring for 30 minutes and further addition of 1.5 kg of glucose. Then, stirring was continued for 30 minutes.
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, and then the stirring was continued for 1 hour to complete the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was dried to obtain flake copper powder.
The obtained flaky copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.
Further, the obtained flake copper powder was subjected to thermogravimetry (TG) in the same manner as in Example 2 to measure the oxidation start temperature. The results are shown in Table 3.

To 6 L of pure water at 70 ° C., 4 kg of copper sulfate pentahydrate and 120 g of aminoacetic acid were added and stirred. Further, pure water was added to adjust the amount of the aqueous solution to 8 L, and stirring was continued for 30 minutes.
Next, with stirring the aqueous solution, 5.8 kg of 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes, 75 g of sodium phosphate was added, and 1.5 kg of glucose was further added. Thereafter, stirring was continued for 30 minutes.
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, and then the stirring was continued for 1 hour to complete the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was dried to obtain flake copper powder.
The obtained flaky copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.
Further, the obtained flake copper powder was subjected to thermogravimetry (TG) in the same manner as in Example 2 to measure the oxidation start temperature. The results are shown in Table 3.

To 6 L of pure water at 70 ° C., 4 kg of copper sulfate pentahydrate and 120 g of aminoacetic acid were added and stirred. Further, pure water was added to adjust the amount of the aqueous solution to 8 L, and stirring was continued for 30 minutes.
Next, with the aqueous solution being stirred, 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes. After adding 1.5 kg of glucose, stirring was continued for 30 minutes. .
Next, after adding 75 g of sodium phosphate with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, followed by stirring for 1 hour. To finish the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was dried to obtain flake copper powder.
The obtained flaky copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.
Further, the obtained flake copper powder was subjected to thermogravimetry (TG) in the same manner as in Example 2 to measure the oxidation start temperature. The results are shown in Table 3.
[Comparative Example 1]

4 kg of copper sulfate pentahydrate and 120 g of aminoacetic acid were added to 6 L of pure water at 70 ° C., and pure water was added to adjust the amount of the aqueous solution to 8 L, and stirring was continued for 30 minutes.
Next, with the aqueous solution being stirred, 5.8 kg of a 25 wt% aqueous sodium hydroxide solution was added to the aqueous solution, and then stirring was continued for 30 minutes. After adding 1.5 kg of glucose, stirring was continued for 30 minutes. .
Next, with stirring the aqueous solution, 1 kg of 100 wt% hydrated hydrazine (N ₂ H ₄ .H ₂ O) was gradually added over 30 minutes, and then the stirring was continued for 1 hour to complete the reaction. After completion of the reaction, the obtained slurry was filtered using a Nutsche, and the filter cake was washed with pure water and further washed with methanol. The filter cake was immersed for 1 hour in a methanol solution obtained by dissolving 1 g of oleic acid in 3 L of methanol, washed with methanol, and dried to obtain copper powder.
Using the copper powder as a medium dispersion mill, The copper powder was plastically deformed by a treatment for 60 minutes using a dyno mill KDL manufactured by Bachofen AG Maskinfabrik, 0.7 mm zirconia beads as media, and methanol as a solvent. The obtained copper powder, in the same manner as in Example _{1, D 10, D 50,} D 90, D max, SD, crystallite diameter was measured P content and aspect ratio. SD / D ₅₀ and crystallite diameter / D _IA were also calculated. The results are shown in Tables 2 and 3.
Further, the obtained flake copper powder was subjected to thermogravimetry (TG) in the same manner as in Example 2 to measure the oxidation start temperature. The results are shown in Table 3.

  From Tables 1 to 3, the copper powder produced by blending phosphoric acid and its salt as a raw material is fine, has a sharp particle size distribution, a large crystallite size, and plastic deformation as in Comparative Example 1. It can be seen that flakes are formed without any treatment. In addition, the crystallite diameter of the comparative example 1 is small because the plastic deformation process was performed.

Method for producing a flaky copper powder of the present invention, for example, the circuit formation of the printed wiring board, it is possible to provide a copper paste or a raw material used for electrical conduction securing external electrodes or the like of the ceramic capacitor.

Claims (5)

A first step of preparing an aqueous solution comprising a copper salt and a complexing agent;
A second step of preparing a first slurry containing cupric oxide by adding alkali hydroxide to the aqueous solution;
The first slurry, a third step of preparing a first reducing agent capable of reducing cupric oxide to cuprous oxide, by adding a reducing sugar, the second slurry containing the acid cuprous,
And at least one selected from the group consisting of hydrazine, hydrated hydrazine, hydrazine sulfate, hydrazine carbonate, and hydrazine hydrochloride as a second reducing agent capable of reducing cuprous oxide to copper. A method for producing flake copper powder having a fourth step of obtaining flake copper powder,
Flakes characterized by adding phosphoric acid and salts thereof in at least one of the first to third steps and / or adding phosphoric acid and salts thereof to the second slurry in the fourth step. A method for producing copper powder. The total addition amount of the phosphoric acid and salt thereof added in at least one of the first step to the third step and / or the phosphoric acid and salt thereof added to the second slurry in the fourth step is: P equivalent amount of the phosphoric acid and the salt is, with respect to copper to 1 mole of the contained before Symbol second slurry, method of manufacturing a flaky copper powder according to claim 2, 0.001 mol to 3 mol. The method for producing flake copper powder according to claim 1 or 2 , wherein the first slurry contains 1.05 equivalents to 1.50 equivalents of the alkali hydroxide with respect to 1 equivalent of the copper salt. The complexing agent, method for producing a flaky copper powder according to any one of claims 1 to 3, characterized in that the amino acids. Wherein the aqueous solution, said aqueous solution, with respect to copper 1 mol included in the first slurry or the second slurry of claim 1 to claim 4, characterized in that it comprises the complexing agent 0.005 to 10 moles The manufacturing method of the flake copper powder in any one.