JP2010225434A - Flexible electronics device substrate, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible electronics device substrate excellent in heat resistant dimensional stability in performing flexible device processing, and to provide a method of manufacturing the same. <P>SOLUTION: The flexible electronics device substrate includes a process member having an adhesive layer on one surface of a glass plate and a laminate formed by laminating a biaxially oriented polyester film on the surface of the adhesive layer. A maximum dimensional change rate of the laminate after heat treatment of the laminate at 200°C for 30 minutes is at least 0.0% and not more than 0.1%. The substrate is obtained by performing flexible electronics device processing using the laminate and thereafter pealing the process member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a flexible electronic device substrate and a manufacturing method thereof, and more particularly to a flexible electronic device substrate excellent in heat-resistant dimensional stability during flexible device processing and a manufacturing method thereof.

  Polyester films, especially biaxially stretched films of polyethylene terephthalate and polyethylene naphthalate, have excellent mechanical properties, heat resistance, and chemical resistance. Therefore, magnetic tape, ferromagnetic thin film tape, photographic film, packaging film, electronic parts It is widely used as a material such as a film for electrical use, an electrical insulation film, a film for metal lamination, a film to be attached to the surface of a glass display, and a protective film for various members.

Conventionally, a glass substrate has been used for an image display device represented by a liquid crystal display. In recent years, however, image display devices have been studied from heavy and fragile glass substrates to highly transparent polymer film substrates because of demands for thinness, weight reduction, large screen, freedom of shape, and curved surface display. .
In recent years, development of self-luminous elements typified by organic EL has progressed in recent years, and it has been necessary to adopt a backlight like a liquid crystal display, so it is going to change for an image display device that requires many members. Even in such applications, demands for improving the ease of breaking and weight, which are one of the drawbacks of glass, are increasing year by year.

  Therefore, various thermoplastic resins including polypropylene, polyethylene terephthalate, and polycarbonate have been studied as polymer film substrates. However, these polymer film substrates generally have a larger dimensional change with respect to heat than glass substrates, and can be used when processing flexible devices. A dimensional change occurred in the polymer film substrate, and it was difficult to realize a high-definition display. Therefore, a polyethylene naphthalate film has been studied as one of materials having higher heat-resistant dimensional stability, for example, as disclosed in Patent Document 1. In order to realize a high-definition display by enhancing dimensional stability against temperature change, for example, in Patent Document 2, the temperature expansion coefficient (αt) at 30 to 100 ° C. is 15 ppm in both the longitudinal direction and the width direction of the film. A biaxially oriented polyester film having a temperature of / ° C. or lower has been proposed.

As described above, the conventional study was an attempt to suppress the dimensional change of the substrate in the flexible device processing by improving the heat resistance characteristics of the polyester film itself. However, applicable polyester films are limited, and Some polyester films are still not fully compatible.
Therefore, further improvement is required for the heat-resistant dimensional stability of the film substrate when performing flexible device processing.

JP 2004-9362 A International Publication No. 2005/110718 Pamphlet

  An object of the present invention is to provide a flexible electronic device substrate excellent in heat-resistant dimensional stability at the time of performing flexible device processing and a method for producing the same, by solving the problems of the conventional technology.

  As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention, the dimensional change of the flexible electronic device processing substrate occurs exclusively during the flexible device processing, so if the dimensional change during high temperature processing can be suppressed, Based on the knowledge that dimensional change is less likely to occur in the processing process and usage environment, if processing is performed by attaching a process material containing a glass plate to a polyester film with a certain heat-resistant dimensional stability during flexible device processing, As a result, the present inventors have completed the present invention.

  That is, an object of the present invention is a laminate comprising a process member having an adhesive layer on one side of a glass plate and a laminate in which a biaxially oriented polyester film is laminated on the adhesive layer surface, and the laminate is heat-treated at 200 ° C. for 30 minutes. A flexible electronic device substrate having a maximum dimensional change rate of 0.0% or more and 0.1% or less, wherein a flexible electronic device is processed using the laminate, and a process member is peeled after the processing Achieved.

  As a preferred embodiment of the flexible electronic device substrate of the present invention, the thermal contraction rate after heat treatment at 200 ° C. for 30 minutes of the biaxially oriented polyester film constituting the laminate is 0.1% or more and 1.0% or less. The polyester constituting the biaxially oriented polyester film is polyethylene naphthalene dicarboxylate, or the flexible electronic device is at least one selected from the group consisting of a flexible organic EL display, electronic paper, and a solar cell. At least one.

  Moreover, this invention is a laminated body by which the process member which has an adhesion layer on the single side | surface of a glass plate, and the biaxially-oriented polyester film were laminated | stacked on the adhesion layer surface, The laminated body after heat-processing this laminated body for 30 minutes at 200 degreeC. And a laminate for flexible electronic devices having a maximum dimensional change rate of 0.0% or more and 0.1% or less.

  The present invention also comprises a process member having an adhesive layer on one side of a glass plate and a laminate in which a biaxially oriented polyester film is laminated on the adhesive layer surface, and the laminate is heat-treated at 200 ° C. for 30 minutes. Flexible electronics device substrate having a maximum dimensional change rate of 0.0% or more and 0.1% or less, performing flexible electronic device processing using the laminate, and peeling the biaxially oriented polyester film from the process member after the processing It relates to the manufacturing method.

  The flexible electronic device substrate of the present invention is a highly delicate device in which a dimensional change during processing is suppressed by attaching a polyester film having a certain heat-resistant dimensional stability to a process material including a glass plate and performing flexible device processing. Since it can be processed and then can be used as a flexible substrate by peeling a process material including a glass plate, a flexible electronic device substrate suitable for a high-definition display can be provided.

The present invention will be described in detail below.
<Process members>
(Glass plate)
The glass plate which comprises the process member of this invention is comprised with the inorganic glass plate used normally. The thickness of the glass plate is preferably from 0.01 mm to 10 mm, and more preferably from 0.5 mm to 5 mm. The thickness of the glass plate is more preferably within a range where no damage occurs during device processing.

(Adhesive layer)
The pressure-sensitive adhesive layer constituting the process member of the present invention has pressure-sensitive adhesiveness or adhesiveness with the glass substrate and the polyester film, can maintain the pressure-sensitive adhesive properties or adhesive properties during device processing, and peels from the polyester film after device processing There is no particular limitation if possible.
For example, a layer using a pressure-sensitive adhesive that is thermocompression-bonded or a type that is cured by heat or light can be used. For example, an acrylic pressure-sensitive adhesive can be used. Moreover, when peeling from a polyester film, not only the method of peeling as it is but the method of peeling after performing the process which weakens adhesive force or adhesive force is also included.

The thickness of the adhesive layer is not particularly limited, but is preferably in the range of 3 μm or more and 50 μm or less.
The pressure-sensitive adhesive layer is formed by coating on one side of a glass plate and constitutes a process member. When laminating a process member including a glass plate and a biaxially oriented polyester film, the biaxially oriented polyester film is laminated on the adhesive layer surface.

<Biaxially oriented polyester film>
(polyester)
The polyester constituting the biaxially oriented polyester film of the present invention is a linear saturated polyester synthesized from an aromatic dibasic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof.
Specific examples of the polyester include polyethylene terephthalate, polyethylene isophthalate, polyethylene isophthalate, polybutylene terephthalate, poly (1,4-cyclohexylenedimethylene terephthalate), and polyethylene naphthalene dicarboxylate. Among these polyesters, polyethylene terephthalate and polyethylene naphthalene dicarboxylate are preferable because they have a good balance of thermal characteristics, mechanical properties, optical properties, and the like. In particular, polyethylene naphthalene dicarboxylate is preferable, and polyethylene-2,6-dicarboxylate is most preferable in terms of high heat resistance, high mechanical strength, and excellent gas barrier properties.

The polyester may be a homopolymer, a copolymer obtained by copolymerizing the third component, or a blend with another resin, but a homopolymer is preferred.
When the polyester is a copolymer, examples of the copolymer component include isophthalic acid, terephthalic acid, 4,4′-diphenyldicarboxylic acid, 2,7-naphthalenedicarboxylic acid, and p-oxybenzoic acid. Examples include trimethylene glycol, hexamethylene glycol, neopentyl glycol, ethylene oxide adducts of bisphenol sulfone. Such a copolymer component is preferably 10 mol% or less, more preferably 5 mol% or less, based on the total acid component or total diol component of the polyester constituting the biaxially oriented polyester film.
In the case of blending, polyesters other than the main components can be used from specific examples of polyester.

The polyester of the present invention can be obtained by a conventionally known method, for example, a method in which a polyester having a low polymerization degree is obtained directly by a reaction of a dicarboxylic acid component and a diol component, followed by a polymerization reaction in the presence of a polymerization catalyst. Further, as another conventionally known method, it can be obtained by a method in which a lower alkyl ester of a dicarboxylic acid and a diol component are reacted using an ester exchange catalyst, and then a polymerization reaction is performed in the presence of a polymerization catalyst. .
The intrinsic viscosity of the polyester is preferably 0.40 dl / g or more, and the upper limit is more preferably 0.90 dl / g or less. If the intrinsic viscosity is less than 0.40 dl / g, process cutting may occur frequently. If the intrinsic viscosity is higher than 0.9 dl / g, melt extrusion is difficult because of high melt viscosity, and the polymerization time is long and uneconomical.
Further, the intrinsic viscosity of the polyester after being formed on the biaxially oriented film is preferably 0.45 dl / g or more and 0.85 dl / g or less, and preferably 0.47 dl / g or more and 0.80 g / dl or less. Further preferred.
The intrinsic viscosity is a value (unit: dl / g) measured at 35 ° C. using o-chlorophenol as a solvent.

(Lubricant)
It is preferable that the biaxially oriented polyester film of the present invention does not contain a lubricant or has a small particle size and a small amount so as not to affect the transparency and adhesion problems of the present invention.
When a lubricant is contained, it is preferably contained at 1.0% by weight or less based on the weight of the film. The average particle size of the lubricant is not particularly limited, but is preferably 0.001 to 1 μm.
The type of lubricant is not particularly specified, and examples thereof include calcium carbonate, calcium oxide, aluminum oxide, kaolin, silica, crosslinked acrylic resin particles, crosslinked polystyrene resin particles, melamine resin particles, and crosslinked silicone resin particles.

(Film characteristics)
The biaxially oriented polyester film of the present invention is an oriented film stretched in the biaxial direction. In the case of an unstretched or uniaxial polyester film, the shrinkage in the unstretched direction is large at the substrate processing temperature, and the bonding with the process member including the glass plate is peeled off.

The biaxially oriented polyester film preferably has a thermal shrinkage ratio of 0.1% to 1.0% after heat treatment at 200 ° C. for 30 minutes. The heat shrinkage rate is more preferably in the range of 0.5% to 0.60%. The heat shrinkage characteristics are measured in the longitudinal direction of the film (hereinafter, sometimes referred to as a continuous film forming method, longitudinal direction, MD direction) and the width direction of the film (hereinafter, sometimes referred to as lateral direction, TD direction). It is preferable to satisfy both directions.
When the flexible device processing is performed in the state of the laminated body bonded to the process member, the maximum dimensional change rate characteristic as the laminated body can be satisfied by the film having the heat shrinkage rate within such a range. Device processing can be performed.
In order to set the heat shrinkage ratio of the biaxially oriented polyester film in such a range, a method of performing a stretching treatment in the longitudinal direction and the transverse direction at a stretching ratio of 2.5 to 4.0 times is mentioned, and further, a heat setting treatment The thermal contraction rate can be further reduced by performing the thermal relaxation treatment.

The thickness of the biaxially oriented polyester film in the present invention is preferably 5 μm or more and 250 μm or less. When the film thickness is within such a range, the strength and flexibility necessary for use as a substrate of a flexible electronic device can be provided. When the thickness of the film is less than the lower limit, sufficient strength may not be exhibited when used for a substrate. If the thickness of the film exceeds the upper limit, it may not be possible to obtain free flexibility when used for a substrate.
The biaxially oriented polyester film preferably has a temperature expansion coefficient (αt) at 100 to 180 ° C. in the range of 10 ppm / ° C. to 30 ppm / ° C.
The αt is obtained from the average value of αt in the film longitudinal direction and the width direction. The upper limit of the temperature expansion coefficient (αt) at 100 to 180 ° C. of the biaxially oriented polyester film is preferably 25 ppm / ° C., more preferably 20 ppm / ° C. When the temperature expansion coefficient (αt) deviates from the above range, when the flexible device processing is performed in the state of the laminated body bonded to the process member, the temperature expansion coefficient difference with the process member increases, Peeling may occur between the glass plate and the polyester film.

The temperature expansion coefficient of the present invention is determined by using a TMA apparatus, pre-treating under a temperature condition of 180 ° C. for 30 minutes under a load of 40 mN with a distance between chucks of 20 mm, and then lowering the temperature to room temperature. The film is heated up to 180 ° C. at a heating rate of 5 ° C./min, the dimensional change of the film is measured, and the dimensional change rate calculated by the following formula (1) is obtained.
[alpha] t = _{{[(L 2 -L 1) × 10} 6 ] _{/ (L 1 × ΔT)}} ··· (1)
(In the above formula, L ₁ represents a sample length (mm) at 100 ° C., L ₂ represents a sample length (mm) at 180 ° C., and ΔT represents 80 (= 180 ° C.-100 ° C.) which is a measurement temperature difference. )
The temperature expansion coefficient is preferably satisfied in at least one of the longitudinal direction of the film and the width direction of the film, and more preferably in both directions.

(Coating layer)
The biaxially oriented polyester film of the present invention may have a coating layer on one side. The coating layer is preferably made of at least one water-soluble or water-dispersible polymer resin selected from polyester resins, urethane resins, acrylic resins, and vinyl resins, and particularly includes both polyester resins and acrylic resins. preferable. The polyester resin of the coating layer has a glass transition point (Tg) of 0 to 100 ° C, more preferably 10 to 90 ° C. The polyester resin is preferably water-soluble or dispersible polyester.

Such a polyester resin is composed of the following polybasic acid or its ester-forming derivative and polyol or its ester-forming derivative.
Polybasic acid components include terephthalic acid, isophthalic acid, phthalic acid, phthalic anhydride, 2,6-naphthalenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, adipic acid, sebacic acid, trimellitic acid, pyromellitic acid, Examples include dimer acid and 5-sodium sulfoisophthalic acid. A copolymer polyester resin is synthesized using two or more of these acid components.

  The polyol component includes ethylene glycol, 1,4-butanediol, diethylene glycol, dipropylene glycol, 1,6-hexanediol, 1,4-cyclohexanedimethanol, xylene glycol, dimethylolpropane, poly (ethylene oxide) glycol, poly (Tetramethylene oxide) glycol, bisphenol A, ethylene oxide or propylene oxide adduct of bisphenol A, and the like. Moreover, although these monomers are mentioned, it is not limited to these.

  The acrylic resin of the coating layer used in the present invention has a glass transition point (Tg) of -50 to 50 ° C, more preferably -50 to 25 ° C. The acrylic resin is preferably water-soluble or dispersible acrylic.

  As a monomer that forms an acrylic resin, an acrylic monomer containing an epoxy group such as alkyl acrylate, alkyl methacrylate, 2-hydroxyalkyl acrylate, 2-hydroxyalkyl methacrylate, glycidyl acrylate or glycidyl methacrylate, carboxy group or a salt thereof is contained. Acrylic monomers, acrylic monomers containing amide groups, acrylic monomers containing acid anhydrides, isocyanates, styrenes, vinyl ethers, vinyltrialkoxysilanes, alkyl maleic acid monoesters, alkyl fumarate monoesters, alkyl itaconic acid mono Examples include monomers such as esters, acrylonitrile, vinylidene chloride, ethylene, propylene, vinyl chloride, vinyl acetate, and butadiene.

  Such a coating layer is preferably used in the form of an aqueous coating solution such as an aqueous solution, aqueous dispersion or emulsion in order to form a coating film. In order to form a coating film, if necessary, other resins than the above composition, for example, a polymer having an oxazoline group, a cross-linking agent such as melamine, epoxy, aziridine, an antistatic agent, a colorant, a surfactant. UV absorbers, lubricants (fillers, waxes) and the like can be added. In particular, the lubricity and blocking resistance can be further improved by adding a lubricant.

  The solid content concentration of the aqueous coating liquid is usually 20% by weight or less, and more preferably 1% by weight or more and 10% by weight or less. If this ratio is less than the lower limit, the coating layer may not be formed uniformly. On the other hand, if the upper limit is exceeded, the stability of the coating and the coating appearance may be deteriorated.

Such a coating layer can be provided in the process of forming a biaxially oriented polyester film as will be described later.
Thereafter, the coating layer surface and the pressure-sensitive adhesive layer surface of the process member are bonded to each other, and a biaxially oriented polyester film is laminated to obtain a laminate.

<Laminated body>
The laminate of the present invention is formed by laminating a process member including a glass plate and an adhesive layer and a biaxially oriented polyester film via an adhesive layer.
The present invention is characterized in that electronic device processing is performed using the laminate, and after the flexible device processing is applied to the biaxially oriented polyester film surface, the process member is peeled off to form the flexible electronic device substrate. To get.

  Such a laminate needs to have a maximum dimensional change rate of 0.0% or more and 0.1% or less after the heat treatment at 200 ° C. for 30 minutes. Here, the maximum dimensional change rate refers to the heat shrinkage rate after heat treatment at 200 ° C. for 30 minutes in each of the longitudinal direction and the width direction of the laminate, and the larger one is the maximum dimensional change rate. The upper limit value of the maximum dimensional change rate is preferably 0.08%. When the maximum dimensional change rate is less than the lower limit value, the laminate is thermally expanded at the time of processing the flexible device, pattern misalignment occurs, and it is difficult to form a highly precise pattern. Further, when the maximum dimensional change rate exceeds the upper limit value, pattern misalignment occurs due to thermal contraction of the laminate during processing of the flexible device, and it is difficult to form a highly precise pattern.

  This maximum dimensional change rate characteristic is obtained by laminating a biaxially oriented polyester film having a certain thermal shrinkage rate characteristic on the glass plate via the adhesive layer, and the heat resistant dimensional stability of the glass plate via the adhesive layer. By following the polyester film, high-definition fine pitch processing can be performed on the polyester film.

<Flexible electronics device substrate>
The flexible electronic device substrate of the present invention is obtained by peeling a process member after performing electronic device processing using a laminate, and as a flexible substrate when used as a circuit substrate although it is rigid during device processing. Used. The flexible electronic device substrate is subjected to the device processing on a biaxially oriented polyester film. In addition, since this substrate has a small dimensional change due to heat at the time of device processing and very little pattern misalignment, it can be subjected to fine pitch processing and can be suitably used as a flexible electronic device substrate for high-definition displays. .

  Examples of flexible electronic devices include flexible organic EL displays, electronic paper, solar cells, reflective liquid crystals, organic TFTs, flexible printed circuits, etc. Among these, the group consisting of flexible organic EL displays, electronic paper, and solar cells, among others. At least one selected from the group is preferably exemplified.

<Method for forming polyester film>
The biaxially oriented polyester film of the present invention can be produced by the following method.
The biaxially oriented polyester film is obtained by, for example, melt-extruding the above polyester into a film shape and cooling and solidifying it with a casting drum to form an unstretched film. This unstretched film is 2 in the longitudinal and lateral directions from Tg to (Tg + 60) ° C. A desired film can be obtained by stretching in a biaxial direction at a stretching ratio of 0.5 to 4.0 times and heat-setting at a temperature of (Tm-100) to (Tm-5) ° C. for 1 to 100 seconds. . Here, Tg represents the glass transition temperature of the polyester, and Tm represents the melting point of the polyester.

  Stretching can be performed by a generally used method, for example, a method using a roll or a method using a stenter. The stretching may be performed simultaneously in the longitudinal direction and the transverse direction, or may be sequentially performed in the longitudinal direction and the transverse direction.

Furthermore, when performing a relaxation | loosening process, heat processing can be performed in the temperature of (X-80)-X degreeC of a film. Here, X represents a heat setting temperature.
As a method for the relaxation treatment, it is preferable to use a method in which both edges are held by a tenter, and the clip interval is narrowed in the longitudinal direction in the oven and the rail width is narrowed in the width direction to perform the relaxation treatment. By using this method, the heat-resistant dimensional stability in the width direction can be easily controlled.

When providing a coating layer, it can coat with the following method.
In the case of sequential stretching, the coating layer can be provided by a method in which an aqueous coating liquid is applied to a uniaxially oriented film stretched in one direction, stretched in another direction as it is, and heat-set.
As the coating method, any known coating method can be applied. For example, a roll coating method, a gravure coating method, a roll brush method, a spray coating method, an air knife coating method, an impregnation method, and a curtain coating method can be used alone or in combination. The coating amount is preferably 0.5 to 20 g, more preferably 1 to 10 g per 1 m ² of the running film. The aqueous liquid is preferably used as an aqueous dispersion or emulsion.

<Method for producing laminate>
A laminated body can be manufactured by manufacturing a process member and a biaxially oriented polyester film separately, and laminating them by another process. When laminating both layers, a laminate can be obtained by laminating via an adhesive layer and using a method such as thermocompression bonding, thermosetting or photocuring according to the type of adhesive.
Moreover, when laminating the biaxially oriented polyester film having the coating layer and the process member, the coating layer and the adhesive layer are laminated to face each other and can be thermocompression bonded with, for example, a laminator heated to 200 ° C.

<Substrate manufacturing method>
The flexible electronic device substrate can be obtained by peeling the process member after performing electronic device processing using the obtained laminate.
As a flexible device processing method, for example, a positive photosensitive resin composition is spin-coated on a polyester film with a spin coater, pre-baked with a hot plate to form a coating film, and a pattern is formed on the coating film by exposure, Thereafter, development with an alkaline developer and rinsing with pure water are performed, followed by post-baking at 180 ° C. to form a positive pattern.

After the device processing, the process member is peeled off, and specific peeling methods include a method of mechanically peeling the process member from the polyester film, a method of peeling by weakening the adhesive force of the pressure-sensitive adhesive layer, and the like.
By such a method, a flexible electronic device substrate is obtained.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited only to these Examples. Each characteristic value was measured by the following method. Moreover, unless otherwise indicated, the part and% in an Example mean a weight part and weight%, respectively.

(1) Film thickness Film thickness was measured at 30 g of needle pressure using an electronic micrometer (trade name “K-312A type” manufactured by Anritsu Corporation).

(2) Heat shrinkage rate Film samples were marked at intervals of 30 cm, heat-treated in an oven set at 200 ° C. for 30 minutes without applying a load, the distance between the marks after heat treatment was measured, and film was continuously formed. In each of the direction (MD direction) and the direction perpendicular to the film forming direction (TD direction), the thermal contraction rate was calculated by the following formula (1), and the average value thereof was obtained.
Thermal shrinkage rate (%) = {(distance between the pre-heat treatment gauge points−distance between the heat treatment gauge points) / distance between the heat treatment gauge points} × 100 (1)

(3) Maximum dimensional change rate For the laminate, the thermal contraction rate is obtained by the same method as (2) thermal contraction rate, and the larger one of the obtained MD or TD direction thermal contraction rate is the maximum change rate. It was.

(4) Evaluation of patterning characteristics A positive photosensitive resin composition was spin-coated on a polyester film of a laminate using a spin coater (Dinspin 636, manufactured by Dainippon Screen Mfg. Co., Ltd.), and prebaked on a hot plate at 130 ° C. for 180 seconds. And a coating film having a film thickness of 8.0 μm was formed. The film thickness was measured with a film thickness measuring device (Lambda Ace, manufactured by Dainippon Screen Mfg. Co., Ltd.). This coating film was exposed through a reticle having a line test pattern with a width of 100 μm using a stepper having an exposure wavelength of i-line (365 nm) (Nikon Corporation, NSR2005i8A) while changing the exposure amount stepwise. Using an alkali developer (manufactured by Clariant Japan, AZ300MIF developer, 2.38 mass% tetramethylammonium hydroxide aqueous solution), the development time was adjusted so that the film thickness after development was 6.6 μm under the condition of 23 ° C. After adjusting and developing, rinsing with pure water was performed, followed by post-baking at 180 ° C. for 30 minutes to form a positive relief pattern. The deviation of the completed test pattern was judged according to the following criteria.
○: Pattern misalignment is 0.1% or less Good patterning characteristics ×: Pattern misalignment exceeds 0.1% Poor patterning characteristics

(5) Removability The laminate sample was used, and the polyester film was peeled off from the glass at an angle of 180 °, and judged according to the following criteria.
○: No curling is observed on the film after peeling.
X: The film breaks during peeling or the film after peeling curls.

[Example 1]
Polyethylene-2,6-naphthalenedicarboxylate containing no particles (obtained with 0 intrinsic viscosity) obtained by conducting polycondensation reaction after transesterification using dimethyl naphthalene-2,6-dicarboxylate and ethylene glycol as monomer raw materials .61 dl / g) was used as the polyester. Manganese acetate tetrahydrate was used as the transesterification catalyst, and antimony trioxide was used as the polycondensation catalyst.

  The obtained polyethylene-2,6-naphthalenedicarboxylate pellets were dried at 170 ° C. for 6 hours, then fed to an extruder hopper, melted at a melting temperature of 305 ° C., and a stainless steel fine wire filter having an average opening of 17 μm. The solution was filtered, extruded through a 3 mm slit die on a rotary cooling drum having a surface temperature of 60 ° C., and rapidly cooled to obtain an unstretched film. The unstretched film thus obtained was preheated at 120 ° C., and further heated by a 900 ° C. IR heater 15 mm above between low-speed and high-speed rolls and stretched 3.1 times in the longitudinal direction. Subsequently, it was supplied to a tenter and stretched 3.3 times in the transverse direction at 145 ° C. The obtained biaxially oriented polyester film was heat-fixed at a temperature of 230 ° C. for 40 seconds to obtain a biaxially oriented polyester film having a thickness of 125 μm.

Subsequently, in a tenter type oven that can hold both edges of the biaxially oriented polyester film with clips, the processing temperature is 200 ° C., the longitudinal direction (MD direction) relaxation rate is 1.0 while holding both edges of the obtained film. %, Relaxation treatment was carried out at a relaxation rate of 1.0% in the width direction (TD direction).
Subsequently, the film was cut out in a 300 mm square, and a pressure sensitive adhesive (manufactured by Soken Chemical Co., Ltd., main agent “SK Dyne 1499M”, curing agent “D-90”) was applied to a 3 mm thick glass plate, fixed and laminated. Created the body.
The characteristics of the obtained biaxially oriented polyester film and laminate are shown in Table 1. The laminate of this example was excellent in dimensional stability at 200 ° C., and the pattern deviation was small.

[Examples 2 to 4, Comparative Example 1]
The same procedure as in Example 1 was conducted except that the polyester type, film thickness, and stretching conditions were changed as shown in Table 1. The properties of the obtained polyester film are shown in Table 1.

[Comparative Example 2]
Evaluation was performed according to Example 1 using a polyethersulfone (PES) film manufactured by Sumitomo Bakelite Co., Ltd. having a film thickness of 200 μm as the base film. The properties of the obtained film are shown in Table 1.

[Comparative Example 3]
The laminate evaluation was performed in the same manner as in Example 1 except that the biaxially oriented polyester film alone was evaluated without using the process member.

[Comparative Example 4]
Evaluation of the laminated body was carried out by fixing a biaxially oriented polyester film alone using two 200 mm square stainless steel frames (three on each side, with fixing screw holes) without using process members. The same procedure as in Example 1 was performed except that.

  The flexible electronic device substrate of the present invention is a highly delicate device in which a dimensional change during processing is suppressed by attaching a polyester film having a certain heat-resistant dimensional stability to a process material including a glass plate and performing flexible device processing. Since it can be processed and then can be used as a flexible substrate by peeling off the process material including the glass plate, a flexible electronic device substrate suitable for a high-definition display can be provided.

Claims (6)

  It consists of a process member having an adhesive layer on one side of a glass plate and a laminate in which a biaxially oriented polyester film is laminated on the adhesive layer surface. A flexible electronic device substrate obtained by performing flexible electronics device processing using the laminate, and peeling off a process member after the processing.   2. The flexible electronic device substrate according to claim 1, wherein the biaxially oriented polyester film constituting the laminate has a heat shrinkage ratio of from 0.1% to 1.0% after heat treatment at 200 ° C. for 30 minutes.   The flexible electronic device substrate according to claim 1 or 2, wherein the polyester constituting the biaxially oriented polyester film is polyethylene naphthalene dicarboxylate.   The flexible electronic device substrate according to any one of claims 1 to 3, wherein the flexible electronic device is at least one selected from the group consisting of a flexible organic EL display, electronic paper, and a solar cell.   A process member having an adhesive layer on one side of a glass plate and a laminate in which a biaxially oriented polyester film is laminated on the adhesive layer surface, and the maximum dimensional change rate of the laminate after heat-treating the laminate for 30 minutes at 200 ° C Is 0.0% or more and 0.1% or less.   It consists of a process member having an adhesive layer on one side of a glass plate and a laminate in which a biaxially oriented polyester film is laminated on the adhesive layer surface, and the maximum dimensional change rate of the laminate after heat-treating the laminate for 30 minutes at 200 ° C. Flexible electronics device substrate characterized in that it is 0.0% or more and 0.1% or less, and the laminate is used to perform flexible electronics device processing, and after the processing, the biaxially oriented polyester film is peeled from the process member. Manufacturing method.