JP2010223686A - Probe card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card including a vertical contactor having a simple structure, and a method for manufacturing the probe card. <P>SOLUTION: This probe card 1 includes a contactor 3 having a spring part 3a erected from a wiring board 2 and formed in a bow shape bent in a horizontal direction. The contactor 3 is formed by plating with a spring metal, a seed film having a spherical shell shape formed by making into a sputtering shape, a resist ball formed on the wiring board 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card and a manufacturing method thereof, and more particularly to a probe card that can be suitably used as a probe card having contacts (probes) arranged in an array and a manufacturing method thereof.

  Generally, in an integrated circuit manufacturing process, a probe card is used to perform a wafer test before separating a wafer into individual chips. In the probe card, a terminal used for electrical connection with the wafer is a contact called a probe.

  The structure of the contact provided on the conventional probe card is roughly divided into a cantilever structure composed of an elongated cantilever plate arranged horizontally or inclined, and a vertically extendable structure that stands upright in the vertical direction (height direction). There are two structures called vertical types consisting of needles and springs. Here, it is said that the vertical contact is more advantageous than the cantilever contact in that the contact layout has a higher degree of freedom and can be arranged in an array.

JP 2004-340794 A

  However, the conventional vertical contact is formed so that it can be vertically expanded and contracted by a coil spring that expands and contracts in the vertical direction (height direction) urging the needle as a contact portion in the vertical direction (height direction). Therefore, there is a problem that the structure becomes complicated. When the structure of the contact is complicated, it becomes difficult to arrange the contacts at high density, so that the advantage of array arrangement cannot be fully utilized.

  Therefore, the present invention has been made in view of these points, and an object of the present invention is to provide a probe card having a vertical contact having a simple structure and a manufacturing method thereof.

  In order to achieve the above-described object, the probe card of the present invention includes, as a first aspect thereof, a contact having a spring portion that is formed in a bow shape that stands up from a wiring board and curves in the horizontal direction. It is characterized by being.

  According to the probe card of the first aspect of the present invention, the elastic force in the vertical direction can be exerted on the contact by bending the bow-shaped spring portion.

  The probe card according to the second aspect of the present invention is the probe card according to the first aspect, wherein the spring portion of the contact is formed so that its width decreases from the midway portion of the spring portion toward the top portion thereof. It is characterized by that.

  According to the probe card of the second aspect of the present invention, the spring portion can be formed with a tip that is easily bent and a midway portion is less likely to be bent, similar to the shape effect of the fishing rod.

  The probe card according to the third aspect of the present invention is the probe card according to the first or second aspect, wherein the spring portion of the contact is formed such that its width decreases from the midway portion of the spring portion toward the bottom thereof. It is characterized by being.

  According to the probe card of the third aspect of the present invention, the spring portion can be easily bent, and the spring portion can be easily bent as in the shape effect of the fishing rod. Further, when the width of the tip and the bottom is small and the width of the midway is narrow, when the contact is pressed, the tip of the spring portion can be slid in the vertical direction without moving in the horizontal direction.

  The probe card according to a fourth aspect of the present invention is the probe card according to any one of the first to third aspects, wherein the spring portion of the contactor has an electrode pad as a contact portion with the surface of the top portion of the spring portion as a contact portion. It is characterized by being formed in a shape that is parallel to the shape.

  According to the probe card of the fourth aspect of the present invention, the contact surface with the electrode pad can be increased.

  The probe card according to the fifth aspect of the present invention is the probe card according to any one of the first to third aspects, wherein the spring portion of the contactor has the tip of the top of the spring portion or the ridgeline of the tip periphery as the contact portion. The contact portion is formed in a shape that comes into contact with the electrode pad.

  According to the probe card of the fifth aspect of the present invention, since the contact portion is sharp, the oxide film formed on the surface of the electrode pad can be cut to ensure good conductivity.

  The probe card according to the sixth aspect of the present invention is the probe card according to any one of the first to fifth aspects, wherein the spring portion of the contact is parallel to the central axis while passing through the spherical shell near the pole. It is characterized in that it is formed in the same shape as an arcuate piece smaller than the hemispherical shell obtained by cutting a plurality of pieces.

  According to the probe card of the sixth aspect of the present invention, since the single arm pantograph-shaped spring portion whose tip and bottom are easily bent is formed, the stroke amount in the vertical direction can be increased without increasing the width of the contact. Large contacts can be formed.

  In order to achieve the above-described object, the probe card manufacturing method according to the present invention includes, as a first aspect, thermosetting a resist pillar formed using a resist material on the surface of a wiring board used in the probe card. A resist sphere forming step for forming a substantially spherical resist sphere that approximates a sphere, an elliptical sphere, and other spheres; a seed film forming step for forming a seed film by sputtering the entire surface of the resist sphere; and a seed A resist removal hole forming step for forming a resist removal hole in the film, a resist ball removal step for removing the resist sphere from the resist removal hole, and a seed film viewed from the vertical direction of the wiring board either before or after the resist removal hole formation step. After the milling film forming process for forming a part of the milling film, the resist ball removing process, and the milling film forming process, the seed film is formed. Then, a seed film part removing process for removing a part other than a part of the seed film on which the milling film is formed by milling from the vertical direction, and a milling film removing process for removing an unnecessary milling film after the seed film part removing process And a spring part that forms a spring part of a contact member in which a metal elastic film is laminated on a part of the seed film by plating a part of the seed film remaining after the milling film removing step with a metal elastic member And a forming step.

  According to the probe card manufacturing method of the first aspect of the present invention, since the spring portion is formed in a bow shape, it is possible to form a contact on the probe card that exerts a vertical elastic force with a simple structure. it can.

  The probe card manufacturing method according to the second aspect of the present invention is the same as the probe card manufacturing method according to the first aspect, where the resist pillar has a diameter R and a height H, H / R≈ It is characterized by being formed in a size satisfying 2.

  According to the probe card manufacturing method of the second aspect of the present invention, a spherical resist sphere close to a true sphere can be formed when the above conditions are satisfied.

  The probe card manufacturing method according to the third aspect of the present invention is the probe card manufacturing method according to the first or second aspect, wherein the contact portion has a contact portion with the surface of the top of the spring portion as the contact portion. It is characterized by being formed in a shape parallel to the electrode pad.

  According to the probe card manufacturing method of the third aspect of the present invention, the contact surface with the electrode pad can be increased.

  The probe card manufacturing method according to the fourth aspect of the present invention is the probe card manufacturing method according to the first or second aspect, wherein the spring portion of the contactor contacts the tip of the top of the spring portion or the ridgeline of the tip periphery. As a part, the contact part is formed in a shape in contact with the electrode pad.

  According to the probe card manufacturing method of the fourth aspect of the present invention, since the contact portion is sharp, the oxide film formed on the surface of the electrode pad can be cut to ensure good conductivity. it can.

  The probe card manufacturing method according to the fifth aspect of the present invention is the probe card manufacturing method according to any one of the first to fourth aspects, wherein the spring portion of the contact passes through the spherical shell near the pole. However, it is characterized by being formed in the same shape as an arcuate piece smaller than a hemispherical shell obtained by cutting a plurality of pieces in parallel with the central axis.

  According to the probe card manufacturing method of the fifth aspect of the present invention, the single-arm pantograph-like spring portion whose tip and bottom are easily bent is formed, so that the width of the contact can be increased without increasing the width of the contact. A contact with a large stroke can be formed.

  According to the probe card of the present invention, since the contact exerts an elastic force when the bow-shaped spring portion bends, the structure of the contact provided on the probe card can be simplified.

  Further, according to the probe card manufacturing method of the present invention, since the spring portion is formed by using the surface of the substantially spherical resist ball as a plating mold, it is easy to form a probe card contactor having an arcuate spring portion. can do. Thereby, the effect that the probe card provided with the contactor of the simple structure which has a bow-shaped spring part can be manufactured easily is produced.

Partial perspective view which shows an example of the probe card of this embodiment Partial perspective view which shows an example of the probe card of this embodiment Partial perspective view which shows an example of the probe card of this embodiment The partial front view which shows an example of the probe card of this embodiment The partial front view which shows an example of the probe card of this embodiment Partial perspective view which shows an example of the probe card of this embodiment The partial front view which shows an example of the probe card of this embodiment The fragmentary sectional view which shows an example of the manufacturing method of the probe card of this embodiment in order from A to H The top view which shows an example of the part which remained by the milling in the seed film | membrane of this embodiment The top view which shows an example of the part which remained by the milling in the seed film | membrane of this embodiment The top view which shows an example of the part which remained by the milling in the seed film | membrane of this embodiment The graph which shows the relationship between the cylinder radius of the resist pillar of this embodiment, and the radius of a resist sphere The side view which shows notionally the relationship of the change of the resist pillar and resist ball of this embodiment

  Hereinafter, the probe card and the manufacturing method thereof according to the present invention will be described with reference to an embodiment thereof.

  First, the probe card 1 of this embodiment will be described.

  As shown in FIG. 1, the probe card 1 of the present embodiment includes a wiring board 2 and contacts 3 arranged in an array. In FIG. 1, only one contact 3 is shown.

  As the wiring board 2, a general wiring board 2 used for the probe card 1 is used.

  The contact 3 has a spring portion 3a, a contact portion 3b, and a bottom portion 3c, and is formed using a material excellent in elasticity and conductivity. Examples of the material excellent in elasticity and conductivity include a laminated material obtained by laminating Cu, Au or the like on Ni—P or Ni—P, or other metal materials.

  The spring portion 3 a of the contact 3 is formed in a bow shape that curves in the horizontal direction, and stands up from the wiring board 2 while being electrically connected to the connection terminal 2 a of the wiring board 2. Various shapes can be cited as the bow shape that is curved in the horizontal direction, such as a C-shape. For example, as shown in FIG. 1 or FIG. 2, there is an arch shape in which the width of the spring portion 3a is smoothly changed in the vertical direction, or an arch shape in which the width of the spring portion 3a is constant as shown in FIG. Can be mentioned. As the spring portion 3a of the present embodiment, it is preferable to adopt a bow shape in which the width of the spring portion 3a is changed.

  The bow shape in which the width of the spring portion 3a shown in FIG. 1 is changed will be described in detail as follows. The spring portion 3a of the contactor 3 has a width that decreases from the midway portion 3d of the spring portion 3a toward the top portion, and decreases in width from the midway portion 3d of the spring portion 3a toward the bottom portion 3c. Preferably it is formed.

  The contact portion 3b of the spring portion 3a is formed at the top of the spring portion 3a. Various shapes are mentioned as this contact part 3b. For example, as shown in FIG. 4, the contact portion 3b is formed in a shape parallel to the electrode pad 11 formed on the chip 10 to be wafer-tested with the surface of the spring portion 3a as the contact portion 3b. Also good.

  Further, as shown in FIG. 5, the contact portion 3 b may be formed in a shape such that the tip of the top of the spring portion 3 a is a contact portion 3 b and is in contact with the electrode pad 11 in a scratched manner. Further, as shown in FIG. 6, the contact portion 3b is formed in such a shape as to contact the electrode pad 11 with the ridgeline 4 at the top edge of the top of the spring portion 3a as the contact portion 3b. May be.

  1 is different from the contact 3 of FIG. 2 in that the top of the spring portion 3a is pointed or angular, and the width of the bottom 3c of FIG. 1 is narrow. The difference is that the bottom 3 in FIG. 2 has not changed. Of course, as shown in FIG. 7, a protrusion may be formed on the top of the spring portion 3a, which may be used as the contact portion 3b.

  Next, the manufacturing method of the probe card 1 of this embodiment is demonstrated.

  As shown in FIG. 8, the method for manufacturing the probe card 1 according to the present embodiment includes a resist sphere formation step, a seed film formation step, a resist removal hole formation step, a resist sphere removal step, a milling film formation step, and a seed film partial removal step. And a milling film removing step and a spring portion forming step.

  In the resist ball forming step, as shown in FIG. 8A, a resist pillar (not shown) is formed on the surface of the wiring board 2 used in the probe card 1, and the resist pillar 20 is thermally cured to thereby form a resist ball 20 Form.

  The resist pillar that forms the basis of the formation of the resist sphere 20 is formed by forming a resist film on the surface of the wiring board 2 using a resist material, and performing exposure and development so that a cylinder is formed on the resist film. It is formed. When the diameter of the resist pillar is R and the height is H, the resist pillar is formed to have a size satisfying H / R≈2, for example, R = 50 μm and H = 100 μm. preferable.

  The spherical shape of the resist sphere 20 is a substantially spherical shape that approximates a sphere, an elliptical sphere, or another sphere. However, in order to secure a contact area with the wiring board 2, it is precisely in the shape of a substantially spherical shape in which a lower part such as a sphere, an elliptical sphere or other similar sphere is buried in the wiring board 2 is missing. . As thermosetting conditions for the resist sphere 20, for example, the curing temperature is set to 100 ° C. to 130 ° C., the processing time is set to 5 to 20 minutes, and the number of times of processing is set to one time or a plurality of times. The thermosetting conditions depend on the size of the resist column and the shape of the resist sphere 20.

  In the seed film formation step, as shown in FIG. 8B, the entire surface of the resist sphere 20 is sputtered to form the seed film 21. It is preferable to select Cu or Ti / Cu as the material of the seed film. When Ti / Cu is selected, a technique such as plating the plating material in the spring portion forming process only on the Cu layer side may be used together. The thickness of the seed film 21 is about 1 μm to 3 μm.

  Due to the structure of the sputtering apparatus, the seed film 21 is easily formed on the upper part of the resist sphere 20, and the seed film 21 is hardly formed on the lower part of the resist sphere 20. Therefore, the seed film 21 is formed on the entire surface of the resist sphere 20 by changing the sputtering direction and sputtering conditions every moment. However, since the seed film 21 is a conductive film for performing plating in the subsequent spring portion forming step, even if the thickness of the seed film 21 is different between the upper part and the lower part of the resist sphere 20, the seed that can be conducted. There is no problem if the film 21 is formed on the entire surface of the resist sphere 20. Further, when it is difficult to increase the thickness of the seed film 21, the seed film 21 may be subjected to further Cu plating.

  In the resist removal hole forming step, a resist removal hole 21a is formed in the seed film 21, as shown in FIG. 8C. The resist removal holes 21a are through holes provided in the spherical shell seed film 21, and the number and size thereof are not limited.

  In the resist sphere removing step, as shown in FIG. 8D, the resist sphere 20 is removed from the resist removing hole 21a. Specifically, the resist sphere 20 is removed by introducing a resist remover from the resist removal hole 21a and extracting the resist solution generated by dissolving the resist sphere 20 from the resist removal hole 21a.

  In the milling film forming step, the milling film 22 is formed on a part of the seed film 21 viewed from the vertical direction of the wiring board 2 as shown in FIGS. 8E (a) and 8E (b). The material of the milling film 22 is preferably a resist material (negative resist is more preferable), a material having a smaller milling amount than Cu for ion milling, such as Ni or Ni-P. Further, even if the milling film 22 is a Cu film, it can be used as the milling film 22 when the film thickness of the milling film 22 is larger than the film thickness of the seed film 21. The viewing direction is limited to the vertical direction because the milling direction of the seed film 21 is parallel to the vertical direction. The part of the seed film 21 on which the milling film 22 is formed is a part to be plated in a later process, and constitutes one layer of the spring part 3 a of the contact 3. Since the forming process of the milling film 22 does not hinder the resist removal hole forming process and the resist ball removing process, the formation time of the milling film 22 may be before or after the resist removal hole forming process.

  In the seed film partial removal process, as shown in FIGS. 8F (a) and 8F (b), milling is performed on the seed film 21 from the vertical direction after the resist ball removing process and the milling film forming process are completed. Since the milling direction is parallel to the vertical direction, a part of the seed film 21 positioned below the milling film 22 is not milled, and the remaining seed film 21 is milled. Thereby, parts other than a part of the seed film 21 on which the milling film 22 is formed are removed.

  In the milling film removing step, as shown in FIG. 8G, after the seed film 21 is partially removed, the unnecessary milling film 22 is removed as the spring portion 3a. The milling film 22 includes a necessary part as the spring part 3a and an unnecessary part. For example, if the material to be plated in the spring portion forming process is Ni-P, the Ni-P milling film 22 can be used as it is in the subsequent plating process, and thus can be said to be the milling film 22 necessary as the spring portion 3a. Since the Cu milling film 22 can be used as it is as the seed film 21, it can be said to be a milling film 22 necessary for the spring portion 3a. On the other hand, if the milling film 22 other than Ni-P or Cu such as a resist material cannot be used as the spring part 3a, it becomes an unnecessary milling film 22 as the spring part 3a. Such unnecessary milling coating 22 is removed in this step.

  In the spring portion forming step, as shown in FIG. 8H, after the milling film 22 is removed, a plating film 23 is formed on a part of the remaining seed film 21 using a metal elastic member. As the metal elastic member, a metal material suitable for a spring material such as Ni or Ni-P may be selected. By this plating, the spring portion 3a of the contact 3 in which the plating film 23 is laminated on a part of the seed film 21 is formed.

  Here, the top part of the spring part 3 a of the contact 3 formed in the spring part forming step becomes the contact part 3 b of the contact 3. The shape of the contact portion 3b depends on the shape and forming position of the milling film 22. Therefore, as shown in FIG. 9, when the shape of the milling film 22 is a fan shape in a plan view, and the size and arrangement are set such that the pole 21 c of the spherical shell seed film 21 is located inside the fan-shaped milling film 22. The contact portion 3b is formed in a shape parallel to the electrode pad 11.

  On the other hand, as shown in FIG. 10 or FIG. 11, when the size and arrangement are set such that the pole 21c of the seed film 21 of the spherical shell is located outside the milling film 22 formed in the fan shape, the spring portion The contact portion 3b is formed in a shape that comes into contact with the electrode pad 11 with the tip 4 of the top of 3a or the ridgeline 4 at the periphery of the tip as the contact portion 3b.

  In addition, although it is not an essential process, when forming a protrusion as shown in FIG. 7 as the contact part 3b of the spring part 3a, the protrusion may be formed by plating after the spring part forming process.

  At present, a suitable shape of the spring portion 3a of the contactor 3 is obtained by cutting a spherical shell through a plurality of pieces parallel to the central axis while passing through the vicinity of the pole 21c as shown in FIGS. The shape is considered to be similar to a bow-shaped piece smaller than the hemispherical shell.

  Next, the operation of the probe card 1 of the present embodiment will be described.

  In the probe card 1 of the present embodiment, for example, as shown in FIGS. 1 to 3, a contact 3 having an arcuate spring portion 3a is formed. When the contact 3 comes into contact with the electrode pad 11 of the chip 10 to be subjected to the wafer test, the bow-shaped spring portion 3a bends in the vertical direction, so that the contact 3 can exert a vertical elastic force.

  The mode of elastic deformation of the contact 3 greatly depends on the shape of the spring portion 3a. As described above, as shown in FIG. 1 or FIG. 2, when the spring portion 3a is formed so that its width decreases from the midway portion 3d of the spring portion 3a toward the top portion thereof, the tip of the spring portion 3a is similar to the shape effect of the fishing rod. The spring part 3a which is easy to bend and the middle part 3d is difficult to bend can be formed. Similarly, when the spring portion 3a is formed so that the width decreases from the midway portion 3d of the spring portion 3a toward the bottom portion 3c, the bottom portion 3c is easily bent and the midway portion 3d is not easily bent. Can do.

  Furthermore, as shown in FIG. 1, when the tip and bottom 3c are narrow and the midway 3d is wide, the tip of the spring 3a is not moved in the horizontal direction when the contact 3 is pressed. Can slide in the direction. For example, the spring portion 3a of the contact 3 is formed in the same shape as an arcuate piece smaller than a hemispherical shell obtained by cutting a spherical shell in parallel with its central axis while passing through the vicinity of the pole 21c. In this case, a single arm pantograph-like spring portion 3a having a flexible tip and bottom portion 3c is formed. Therefore, the contact 3 having a large amount of stroke in the vertical direction is formed without increasing the width of the contact 3. be able to.

  Various effects can be expected by changing the shape of the contact portion 3b of the contact 3 as well. When the surface of the top part of the spring part 3a is the contact part 3b, it is preferable that the contact part 3b is formed in a shape parallel to the electrode pad 11 as shown in FIG. By doing so, the contact surface with the electrode pad 11 can be enlarged. On the other hand, as shown in FIG. 5 or FIG. 6, when the ridgeline 4 at the top or peripheral edge of the top of the spring portion 3 a is used as the contact portion 3 b, the contact portion 3 b is formed in a shape that contacts the electrode pad 11. It is preferable. According to this, since the contact part 3b becomes sharp, the oxide film formed on the surface of the electrode pad 11 by the contact between the contact part 3b and the contact pad is cut, so that good conductivity can be ensured. .

  Next, the effect | action of the manufacturing method of the probe card 1 of this embodiment is demonstrated.

  In the method for manufacturing the probe card 1 of the present embodiment, as shown in FIG. 8, the contact 3 is formed on the wiring board 2 of the probe card 1 through a plurality of steps. Here, as shown in FIGS. 8E (a) and 8 (b), since the milling film 22 is formed on a part of the spherical shell-shaped seed film 21 in plan view, the seed film 21 forming the spring portion 3a is formed. Is formed from a spherical shell shape to a bow shape. As a result, as shown in FIG. 8H, the spring portion 3a is formed in a bow shape by plating a part of the seed film 21, so that the contactor 3 that exerts a vertical elastic force with a simple structure can be obtained. It can be formed on the probe card 1.

  Also, the substantially spherical resist sphere 20 that is a mold for forming the substantially spherical shell seed film 21 is formed by thermally curing the resist pillar. The resist pillar is preferably formed to have a dimension satisfying H / R≈2, where R is the diameter and H is the height. When the above conditions are satisfied, a spherical resist sphere 20 close to a true sphere can be formed.

The above results are shown in FIG. FIG. 13 shows the shape of the resist sphere 20 obtained by making the height of the resist pillar 30 constant and changing the diameter R thereof. In FIG. 12, the X axis indicates the cylindrical radius R / 2 of the resist pillar 30, and the Y axis indicates the radius r of the resist sphere 20. Since the volume of the resist pillar 30 is theoretically the same before and after thermal curing, the formula of the volume of the cylinder and the formula of the volume of the sphere are connected by equals, and the theoretical radius r of the resist sphere 20 is obtained, “r ₃ = 3R ₂ h / 16 ”(Note that when the resist column 30 is thermally cured, the specific components of the resist are volatilized and the remaining components are combined with each other, so that the resist column 30 contracts. Although their volumes differ before and after thermal curing, there is no problem in assuming that there is no volume change in the calculation for obtaining a spherical resist ball 20 close to a true sphere. Since the size of the bottom portion of the resist plate 30 does not change so much, the resist column 30 after thermosetting has a substantially spherical shape with a part cut off on the wiring board side. There is no point contact with 2 but there is no problem in this calculation. When the intersection between the theoretical radius r and the measured radius of the resist sphere 20 is obtained, R / 2≈25 and r≈35, and thus a resist resist 30 having a spherical shape close to a true sphere from the resist pillar 30 satisfying H / R≈2. It is clear that 20 can be formed. The same can be said from the shape of the resist sphere 30 shown in FIG.

  In addition, in the manufacturing method of the probe card 1 of this embodiment, the effect of the contact part 3b when the surface of the top part of the spring part 3a is made into the contact part 3b, the ridgeline 4 of the top part of the top part of a spring part 3a, or a front-end | tip periphery. The action and effect when the contact portion 3b is used and the action and effect of the spring portion 3a according to the arcuate piece shape obtained by cutting the spherical shell are as described above.

  That is, according to the probe card 1 of the present embodiment, the contact 3 exerts an elastic force when the bow-shaped spring portion 3a is bent, so that the structure of the contact 3 provided on the probe card 1 can be simplified. There is an effect that can be.

  Further, according to the method for manufacturing the probe card 1 of the present embodiment, since the spring portion 3a is formed using the surface of the substantially spherical resist ball 20 as a plating mold, the probe card 1 having the bow-shaped spring portion 3a is formed. The contact 3 can be easily formed. Thereby, there exists an effect that the probe card 1 provided with the contactor 3 of the simple structure which has the bow-shaped spring part 3a can be manufactured easily.

  In addition, this invention is not limited to embodiment mentioned above etc., A various change is possible as needed.

DESCRIPTION OF SYMBOLS 1 Probe card 2 Wiring board 2a Wiring terminal 3 Contact 3a Spring part 3b Contact part 3c Bottom part 3d Midway part 4 Ridge line 10 Chip 11 Electrode pad

Claims (11)

A probe card comprising a contactor having a spring portion which is formed in a bow shape standing up from a wiring board and curved in a horizontal direction. 2. The probe card according to claim 1, wherein the spring portion of the contact is formed so that a width thereof decreases from a midway portion of the spring portion toward a top portion thereof. The probe card according to claim 1 or 2, wherein the spring portion of the contact is formed so that the width thereof decreases from a midway portion of the spring portion toward a bottom portion thereof. The spring part of the contactor is formed in a shape such that the contact part is parallel to the electrode pad with the surface of the top part of the spring part as the contact part. The probe card according to any one of the above. The spring part of the contactor is formed in a shape such that the contact part comes into contact with the electrode pad with the tip of the top part of the spring part or the ridgeline of the peripheral edge of the tip as the contact part. The probe card according to any one of claims 1 to 3. The spring part of the contactor is formed in a shape similar to an arcuate piece smaller than a hemispherical shell obtained by cutting a spherical shell in parallel with its central axis while passing through the vicinity of the pole. The probe card according to any one of claims 1 to 5, characterized in that: Resist sphere formation step of forming a substantially spherical resist sphere that approximates a sphere, an elliptical sphere, or other spheres by thermosetting a resist pillar formed using a resist material on the surface of a wiring board used for a probe card When,
A seed film forming step of forming a seed film by sputtering the entire surface of the resist sphere;
A resist removal hole forming step of forming a resist removal hole in the seed film;
A resist sphere removing step of removing the resist sphere from the resist removal hole;
A milling film forming step of forming a milling film on a part of the seed film viewed from the vertical direction of the wiring board either before or after the resist removal hole forming step;
A seed film that removes portions other than a part of the seed film on which the milling film is formed by milling the seed film from the vertical direction after the resist ball removing process and the milling film forming process are completed. A partial removal step;
A milling film removing step for removing the unnecessary milling film after the seed film part removing step;
A spring that forms a spring portion of a contact member in which a metal elastic film is laminated on a part of the seed film by plating a part of the seed film left after the milling film removing step with a metal elastic member A probe card manufacturing method comprising: a part forming step. 8. The method of manufacturing a probe card according to claim 7, wherein the resist pillar is formed to have a size satisfying H / R≈2, where R is a diameter and H is a height. The spring portion of the contactor is formed in a shape such that the contact portion is parallel to the electrode pad with the surface of the top portion of the spring portion as the contact portion. A method for manufacturing the probe card according to claim 1. The spring part of the contactor is formed in a shape such that the contact part comes into contact with the electrode pad with the tip of the top part of the spring part or the ridgeline of the peripheral edge of the tip as the contact part. A method for manufacturing a probe card according to claim 7 or claim 8. The spring part of the contactor is formed in a shape similar to an arcuate piece smaller than a hemispherical shell obtained by cutting a spherical shell in parallel with its central axis while passing through the vicinity of the pole. The method for manufacturing a probe card according to any one of claims 7 to 10, characterized in that:

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