JP2010214534A - Method of manufacturing disc-shaped substrate and method of carrying the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a disc-shaped substrate hard to damage or break workpieces when the workpieces are pulled out from a shaft after grinding the outer circumferential surfaces of the workpieces. <P>SOLUTION: In the method of manufacturing the disc-shaped substrate, the workpieces 10 whose inner circumferential surfaces are ground are inserted and laminated in the shaft 71, a shaft 76 having a smaller diameter compared with the shaft 71 is coaxially arranged below the shaft 71 after grinding the outer circumferential surfaces of the laminated workpieces 10, and the workpieces 10 are moved to the shaft 76 in a liquid tank 80 to which ultrasonic vibration is applied. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a disk-shaped substrate such as a glass substrate for a magnetic recording medium.

  In recent years, production of information recording media such as magnetic disks has been activated in response to increasing demand for recording media. Here, as a disk-shaped substrate used as a substrate for a magnetic disk, an aluminum substrate and a glass substrate are widely used. This aluminum substrate is characterized by high workability and low cost, and one glass substrate is characterized by excellent strength, surface smoothness and flatness. In particular, recently, the demand for miniaturization and high density of the disk substrate has been remarkably increased, and the degree of attention of the glass substrate capable of achieving high density with small roughness of the surface of the substrate has increased.

  Here, in Patent Document 1, a glass substrate work held by a work shaft is used to grind the outer peripheral end face and the chamfered surface of a bundle of glass substrate work using a cerium oxide abrasive with a peripheral end face polishing machine. Discloses a method for polishing a glass substrate for a magnetic recording medium, which holds a glass substrate workpiece and polishes an inner peripheral end face and a chamfered surface.

JP 2002-123931 A

  In manufacturing such a glass substrate, in order to hold the glass substrate work on the work holder after polishing the outer peripheral end face and the chamfered surface of the glass substrate work, it is necessary to once extract the glass substrate work from the work shaft. At this time, since the work shaft is generally made of a hard material such as metal, there is a problem that the glass substrate work is often damaged or broken.

  The present invention has been made to solve the technical problems as described above, and the object of the present invention is to damage the workpiece when the workpiece is removed from the shaft after polishing the outer peripheral surface of the workpiece. It is an object of the present invention to provide a method for manufacturing a disc-shaped substrate that is difficult to be attached and is not easily damaged.

  In order to achieve such an object, the disk-shaped substrate manufacturing method of the present invention inserts and stacks a disk-shaped substrate whose inner peripheral surface is polished into a first shaft, and the outer peripheral surface of the stacked disk-shaped substrate. After polishing, the second shaft having a diameter smaller than that of the first shaft is coaxially arranged below the first shaft, and the disc-shaped substrate is placed in the liquid tank to which ultrasonic vibration is applied. It is made to move to 2 shafts.

  Here, the movement to the second shaft is preferably performed by bringing the tip of the first shaft and the tip of the second shaft into contact with each other in the water filled in the liquid tank. It is more preferable that at least the surface of the shaft is formed of a resin.

  In addition, according to the method for transporting the disk-shaped substrate of the present invention, the disk-shaped substrate inserted into the first shaft and laminated is immersed in the liquid tank, and the second shaft having a smaller diameter than the first shaft is used as the first shaft. Coaxially arranged with the shaft, moving the disk-shaped substrate from the first shaft to the second shaft while applying ultrasonic vibration in the liquid tank, and holding and transporting the disk-shaped substrate with the second shaft It is characterized by.

  Here, it is preferable that a mounting table is further installed on the second shaft, and the disc-shaped substrate is mounted on the mounting table and conveyed.

  According to the present invention configured as described above, it is possible to provide a method for manufacturing a disk-shaped substrate having a high yield as compared with a case where these configurations are not employed.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIGS. 1-1 (a) to (d) and FIGS. 1-2 (e) to (h) are diagrams showing a manufacturing process of a disk-shaped substrate (disk substrate) to which the present embodiment is applied.

(Primary lapping process)
FIG. 1-1 (a) shows the primary lapping process. In this step, first, lapping is performed for the first time by the lapping machine 40, and the surface 11 of the workpiece 10 as a disk-shaped substrate is ground smoothly.
Here, FIG. 2 is a diagram illustrating the structure of the wrapping machine 40.
The wrapping machine 40 shown in FIG. 2 includes a lower surface plate 21a on which the workpiece 10 is placed, and an upper surface plate 21b for applying pressure necessary for holding the workpiece 10 from above and performing lapping.
Here, a tooth portion 42 is provided on the outer peripheral portion of the lower surface plate 21a, and a sun gear 44 is provided on the central portion of the lower surface plate 21a. Further, the lower surface plate 21a has a workpiece 10 when lapping is performed. A disk-shaped carrier 30 is positioned for positioning.
In the wrapping machine 40 shown in FIG. 2, five carriers 30 are installed. A tooth portion 32 is provided on the outer peripheral portion of the carrier 30, and meshes with both the tooth portion 42 and the sun gear 44 of the lower surface plate 21a. Further, the lower surface plate 21a and the upper surface plate 21b are provided with rotation shafts 46a and 46b for rotating them at the center.

In this primary lapping process, the work 10 is first placed on the lower surface plate 21a of the lapping machine 40 using the carrier 30.
FIG. 3 is a diagram illustrating the carrier 30 in more detail. As described above, the carrier 30 shown in FIG. 3 is provided with the tooth portion 32 on the outer peripheral portion. In addition, a plurality of circular holes 34 in which the workpiece 10 is placed when lapping is performed are formed. The diameter of the hole 34 is slightly larger than the diameter of the workpiece 10. By doing in this way, it can suppress that an extra stress is applied to a part of outer periphery end of the workpiece | work 10 at the time of lapping, Therefore The outer periphery end of the workpiece | work 10 becomes difficult to be damaged. In the present embodiment, the diameter of the hole 34 is, for example, about 1 mm larger than the diameter of the workpiece 10. The holes 34 are arranged at substantially equal intervals. In the case of the present embodiment, for example, 35 holes 34 are opened.

  As a material of the carrier 30, for example, an epoxy resin reinforced by mixing aramid fiber or glass fiber can be used. Further, the thickness of the carrier 30 is made thinner than the finished thickness of the workpiece 10 in this step so as to come into contact with the upper surface plate 21b during lapping in this step and not hinder the lapping. For example, when the finished thickness of the workpiece 10 is 1 mm, the thickness of the carrier 30 is 0.2 mm to 0.6 mm thinner than that.

After the workpiece 10 is placed in the hole 34 of the carrier 30, the upper surface plate 21 b is moved until it contacts the workpiece 10, and the lapping machine 40 is operated.
The operation of the wrapping machine 40 at this time will be described with reference to FIG. When the lapping machine 40 is operated, the upper rotating shaft 46b in the drawing is rotated in one direction, and the upper surface plate 21b is rotated in the same one direction. Further, the lower rotating shaft 46a in the figure is rotated in the opposite direction to the rotation of the rotating shaft 46b, and the lower surface plate 21a is rotated in the same direction as the rotating shaft 46a. Thereby, the tooth part 42 of the lower surface plate 21a also rotates in the same direction as the rotating shaft 46a. The sun gear 44 at the center also rotates in the same direction as the rotation shaft 46a.
Thus, by rotating the upper surface plate 21b, the lower surface plate 21, and the sun gear 44, the carrier 30 meshing with these gears performs a so-called planetary motion in which the rotation motion and the revolution motion are combined. Similarly, the workpiece 10 fitted in the carrier 30 also performs planetary motion. By doing so, the workpiece 10 can be wrapped more accurately and quickly.

  In this embodiment mode, lapping can be performed using an abrasive. Although it does not specifically limit as an abrasive, For example, the abrasives which consist of an alumina or a diamond can be used by slurrying. Alternatively, a grindstone in which these abrasives are dispersed and contained in the upper surface plate 21b and the lower surface plate 21 may be used.

(Inner and outer grinding process)
FIG. 1-1 (b) shows the inner and outer peripheral grinding steps. In this step, grinding that is roughing of the inner peripheral surface of the opening 12 of the workpiece 10 and the outer peripheral surface of the outer periphery 13 is performed. In the present embodiment, the inner peripheral surface and the outer peripheral surface are simultaneously ground. Specifically, the opening 12 provided in the center of the workpiece 10 is ground by the inner peripheral grindstone 22, and the outer periphery 13 of the workpiece 10 is ground by the outer peripheral grindstone 23. At this time, the inner peripheral surface 22 and the outer peripheral surface 23 of the workpiece 10 are sandwiched between the inner peripheral grindstone 22 and the outer peripheral grindstone 23 and simultaneously processed. Thereby, it is possible to easily ensure the concentricity between the inner diameter and the outer diameter.
In the present embodiment, the inner peripheral grindstone 22 and the outer peripheral grindstone 23 have a wavy surface. Therefore, not only can the inner peripheral surface of the opening 12 and the outer peripheral surface of the outer periphery 13 of the workpiece 10 be ground, but also the chamfering of the edges of the opening 12 and the outer periphery 13 can be performed.

(Inner circumference polishing process)
FIG. 1-1 (c) shows the inner periphery polishing step. In this step, polishing is performed to further smooth the inner peripheral surface of the opening 12 of the workpiece 10 that has been ground in the inner and outer peripheral grinding step shown in FIG.
Specifically, the workpieces 10 are first stacked and set on a holder (not shown). And the brush 24 is inserted in the center of the opening 12 of the workpiece | work 10 set to this holder. Then, the inner peripheral surface of the workpiece 10 is polished by rotating the brush 24 at a high speed while pouring the polishing liquid into the opening 12 of the workpiece 10. In the present embodiment, since the brush 24 is used for polishing, the inner peripheral surface of the workpiece 10 is polished, and the chamfered portion of the edge of the opening 12 performed in the inner and outer peripheral grinding process described above is similarly performed. Can be polished. As the polishing liquid, for example, a slurry obtained by dispersing cerium oxide abrasive grains in water can be used.

  FIG. 4 is a view showing an example of the brush 24 used in the inner periphery polishing step. The brush 24 includes a brush part 61 formed by arranging hair tips in a spiral shape, and a shaft 62 formed continuously at both ends of the brush part 61 and forming one end and the other end. Yes. For example, when the inner peripheral surface of a small-diameter disk such as 0.85 inch is polished as the opening 12 of the work 10, it is necessary to make the core of the brush 24 thinner. In this case, in this embodiment, for example, a plurality of wires (material: for example, mild steel wire (SWRM), hard steel wire (SWRH), stainless steel wire (SUSW), brass wire (BSW), workability, rigidity, etc. The brush portion 61 is formed by sandwiching the hair of the brush (material: for example, nylon (trade name of DuPont)) and twisting the wire in which the hair is sandwiched. By twisting this wire to form the brush portion 61, the brush bristles formed on the brush portion 61 can be formed in a spiral shape, and the polishing liquid is pivoted in the opening 12 of the inserted workpiece 10. It is possible to flow in the direction. Therefore, the polishing liquid can be transported satisfactorily.

(Secondary lap process)
FIG. 1-1 (d) shows the secondary lapping process. In this step, the surface 11 of the workpiece 10 that has been lapped in the primary lapping step shown in FIG.
As a device for performing lapping in the secondary lapping process, a lapping machine 40 shown in FIG. 1-1 (a) can be used. The wrapping method, conditions, and the like can be performed in the same manner as described with reference to FIG.

(Outer periphery polishing process)
FIG. 1-2 (e) shows the outer periphery polishing step. In this step, polishing is performed to further smooth the outer peripheral surface of the outer periphery 13 of the workpiece 10 that has been subjected to grinding that is roughing in the inner and outer peripheral grinding step shown in FIG.
Specifically, the workpiece 10 is first laminated on the opening 12 of the workpiece 10 through the jig 25, and the workpiece 10 is set on the jig 25. And while pouring polishing liquid into the location of the outer periphery 13 of the workpiece | work 10, it contacts the workpiece | work 10 which laminated | stacked the brush 26, and rotates it at high speed. Thereby, the outer peripheral surface of the workpiece | work 10 can be grind | polished. In the present embodiment, since the brush 26 is used for polishing, the outer peripheral surface of the workpiece 10 is polished, and the chamfered portion of the edge of the outer periphery 13 performed in the inner and outer peripheral grinding process described above is also polished in the same manner. be able to. As the polishing liquid, as in the case of the inner peripheral polishing step, for example, a slurry obtained by dispersing cerium oxide abrasive grains in water can be used.

(Primary polishing process)
FIG. 1-2 (f) shows the primary polishing process. In this step, in the secondary lapping step shown in FIG. 1-1 (d), the surface 11 of the lapped workpiece 10 is further polished by polishing using a polishing machine 50, and further smoothness is improved. I will raise it. The polishing machine 50 has substantially the same configuration as the lapping machine 40 described above, but the materials used for polishing are partially different as shown below.
In the present embodiment, when polishing is performed, for example, a hard polishing cloth formed of urethane and a slurry obtained by dispersing cerium oxide abrasive grains in water and slurrying can be used as an abrasive.

(Secondary polishing process)
FIG. 1-2 (g) shows the secondary polishing step. In this step, the surface 11 of the workpiece 10 polished in the primary polishing step shown in FIG. 1-2 (f) is further polished by performing precise polishing, and the surface 11 is finally finished. .
In this embodiment, when performing this polishing, for example, a suede-like soft polishing cloth can be used as a polishing material by dispersing cerium oxide abrasive grains or colloidal silica in a solvent such as water to form a slurry. .

(Final cleaning / inspection process)
FIG. 1-2 (h) shows the final cleaning / inspection process. In the final cleaning, dirt such as the used abrasive is removed in the series of steps described above. For the cleaning, a method such as chemical cleaning with a detergent (chemical) using ultrasonic waves can be used.
In the inspection process, for example, the surface of the workpiece 10 is inspected for scratches or distortions by an optical inspection device using a laser.

  Here, when shifting from the outer periphery polishing process to the primary polishing process, it is necessary to once extract the workpiece 10 stacked and set on the jig 25. Then, the extracted workpiece 10 is placed again on the carrier 30 provided in the wrapping machine 40.

Here, FIGS. 5A to 5B are diagrams illustrating the jig 25.
As shown in FIG. 5A, the jig 25 is arranged on one end of the metal shaft 71 on which the workpiece 10 is stacked and set, and the workpiece 10 is turned into the metal shaft 71 in the outer periphery polishing step. A protective cap 72 for preventing scratches on the inner peripheral surface of the workpiece 10 when set, and the workpiece 10 placed on the other end of the metal shaft 71 when the workpiece 10 is set on the metal shaft 71. It comprises a mounting table 73. Then, both ends of the metal shaft 71, the connecting portion of the protective cap 72 with the metal shaft 71, and the connecting portion of the mounting shaft 73 with the metal shaft 71 are threaded, as shown in FIG. By joining the threaded portions to each other, the metal shaft 71, the protective cap 72, and the mounting table 73 are coupled to each other to form the jig 25.

  Here, the diameter of the metal shaft 71 in the jig 25 is only slightly smaller than the diameter of the inner periphery of the workpiece 10. The metal shaft 71 is made of a metal such as stainless steel and is hard. Therefore, when the operator pulls out the workpiece 10 from the metal shaft 71 of the jig 25, a large friction or a large impact due to contact occurs between the inner peripheral surface of the workpiece 10 and the metal shaft 71. Therefore, it becomes easy to damage or break the inner peripheral surface of the workpiece 10.

Next, an operation of moving the workpiece 10 from the metal shaft 71 to the shaft 76, which is a characteristic configuration of the present embodiment, will be described below.
Here, FIGS. 6A to 6D are diagrams illustrating a pretreatment stage for moving the workpiece 10 from the metal shaft 71 of the jig 25 to the shaft 76 of the jig 83 while the workpieces 10 are stacked. FIG. 7 is a diagram illustrating a stage in which the workpiece 10 is actually moved from the metal shaft 71 of the jig 25 to the shaft 76 of the jig 83.

  First, FIG. 6A shows the state of the jig 25 and the workpiece 10 at the time when the outer periphery polishing process is completed. The workpieces 10 are inserted into the metal shaft 71 of the jig 25 through the inner periphery 12 of the workpiece 10, and are stacked on the mounting table 73 of the jig 25, for example, 150 sheets. A fixing nut 75 is attached on the workpiece 10. The fixing nut 75 is a fixing member for pressing and fixing the workpiece 10 in the outer periphery polishing process, and is attached instead of the protective cap 72 (see FIG. 5) before performing the outer periphery polishing process. It is. From this state, the mounting table 73 is removed as shown in FIG. At this time, the workpiece 10 can be removed from the lower side where the mounting table 73 is located.

  Next, as shown in FIG. 7, the workpiece 10 is moved together in a state of being stacked on a jig 83 having a shaft 76 as a second shaft having a smaller diameter than the jig 25. This movement is performed in the liquid layer to which ultrasonic vibration is applied. That is, the workpiece 10 with the inner peripheral surface polished is inserted into the metal shaft 71 and laminated, and after the outer peripheral surface of the laminated workpiece 10 is polished, the shaft 76 having a smaller diameter than the metal shaft 71 is replaced with the metal shaft 71. The workpiece 10 is moved to the shaft 76 in the liquid tank to which the ultrasonic vibration is applied.

This operation will be described in more detail below.
First, the jig 25 in a state in which the fixing nut 75 shown in FIG. 6B is attached and the mounting table 73 is removed is immersed in the liquid tank 80. The liquid tank 80 is provided with an ultrasonic generator 81 for generating ultrasonic waves at the lower part of the liquid tank 80, and the liquid tank 80 is filled with water 82. Therefore, ultrasonic waves generated from the ultrasonic generator 81 propagate in the water 82, and ultrasonic vibrations are generated in the liquid tank 80. A jig 83 is set in the liquid tank 80 in advance. The jig 83 includes a shaft 76 having a diameter smaller than that of the metal shaft 71 and a mounting table 77 on which the work 10 is placed.

  Then, the operator performs alignment so that the metal shaft 71 and the shaft 76 of the jig 83 are in a coaxial position in the liquid tank 80, and the tip of the metal shaft 71 and the tip of the shaft 76 are brought into contact with each other. Let Then, by the action of ultrasonic vibration already generated in the liquid tank 80, the workpiece 10 stacked in the state inserted in the metal shaft 71 moves smoothly to the shaft 76 side of the jig 83, and the shaft The shape is inserted into 76. At this time, since the workpiece 10 is moved by its own weight while being stacked, the movement is performed quickly. And if it does in this way, a damage | wound or damage to the internal peripheral surface of the workpiece | work 10 can be suppressed.

  Moreover, although the ultrasonic generator 81 shown in FIG. 7 was provided in the exterior of the liquid tank 80 and generate | occur | produced the ultrasonic wave, it is not restricted to this. For example, an ultrasonic probe or the like that generates ultrasonic waves may be inserted into the water 82 in the liquid tank 80 as the ultrasonic generator 81 to generate ultrasonic waves to generate ultrasonic vibrations.

Thereafter, the operator takes out the jig 83 from the liquid tank 80, holds the workpiece 10 by the shaft 76, and conveys it to a place where the lapping machine 40 is located.
Therefore, in the present embodiment, the workpiece 10 inserted and stacked in the metal shaft 71 is immersed in the liquid tank 80, and the shaft 76 having a diameter smaller than that of the metal shaft 71 is disposed coaxially with the metal shaft 71. The workpiece 10 is moved from the metal shaft 71 to the shaft 76 while applying ultrasonic vibration in the shaft 80, and the workpiece 10 can be grasped as a conveying method of holding and conveying the workpiece 10 by the shaft 76.

  Then, the operator removes the workpiece 10 from the shaft 76 of the jig 83 and places the workpiece 10 on the carrier 30 provided in the wrapping machine 40. In this way, since the shaft 76 of the jig 83 is smaller in diameter than the metal shaft 71 of the jig 25, the operator can easily remove the workpiece 10 from the shaft 76.

  The shaft 76 is preferably formed of a soft material such as a resin material, but at least the surface is preferably formed of a resin. Thereby, even when the workpiece 10 and the shaft 76 come into contact with each other when the workpiece 10 is conveyed, the impact generated at that time can be reduced. Therefore, it can suppress that the internal peripheral surface of the workpiece | work 10 is damaged or damaged.

(A)-(d) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. (E)-(h) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. It is a figure explaining the structure of the wrapping machine. It is the figure explaining the carrier in more detail. It is the figure which showed an example of the brush used in an inner periphery grinding | polishing process. (A)-(b) is the figure explaining the jig | tool. (A)-(d) is the figure explaining the pre-processing stage for moving to a 2nd shaft from a 1st shaft, with a workpiece | work laminated | stacked. It is a figure explaining the step which moves a work from the 1st shaft to the 2nd shaft.

DESCRIPTION OF SYMBOLS 10 ... Work, 11 ... Surface, 12 ... Opening, 13 ... Outer periphery, 30 ... Carrier, 40 ... Lapping machine, 50 ... Polishing machine, 71 ... Metal shaft, 76 ... Shaft, 73, 77 ... Mounting stand, 80 ... Liquid Tank, 81 ... ultrasonic generator

Claims (5)

A method of manufacturing a disk-shaped substrate,
The disk-shaped substrate whose inner peripheral surface is polished is inserted into a first shaft and stacked, and after the outer peripheral surface of the stacked disk-shaped substrate is polished, a first smaller diameter than the first shaft is obtained. A disc-shaped substrate, wherein the second shaft is coaxially disposed below the first shaft, and the disc-shaped substrate is moved to the second shaft in a liquid tank to which ultrasonic vibration is applied. A method for manufacturing a substrate.   The movement to the second shaft is performed by bringing the tip of the first shaft into contact with the tip of the second shaft in the water filled in the liquid tank. 2. A method for producing a disk-shaped substrate according to 1.   The disk-shaped substrate manufacturing method according to claim 1, wherein at least a surface of the second shaft is formed of a resin. A method for transporting a disk-shaped substrate,
Immerse the disc-shaped substrate inserted and stacked in the first shaft into the liquid tank,
A second shaft having a smaller diameter than the first shaft is disposed coaxially with the first shaft;
Moving the disk-shaped substrate from the first shaft to the second shaft while applying ultrasonic vibration in the liquid tank;
A method for transporting a disc-shaped substrate, wherein the disc-shaped substrate is transported while being held by the second shaft.   The disk-shaped substrate transfer method according to claim 4, wherein a mounting table is further installed on the second shaft, and the disk-shaped substrate is mounted on the mounting table and transferred.

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