JP2010211997A - Electrical connection component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical connection component having excellent versatility, by which space utilization efficiency is largely improved while ensuring high reliability. <P>SOLUTION: The electrical connection component 100 or the like connects electrodes by bringing the end surface 120A of a conductive pattern part 120 exposed from a side surface orthogonal to a laminating direction X into contact with electrodes 604, 614. Then, even if pitches P in electrodes 604, 614 are formed by fine wirings, an electrical connection between the fine wirings is made possible by setting the pitches on the conductive pattern part 120 to be narrow (fine). Moreover, for example, electronic components such as an IC 70 and a passive component 80 are mounted on the side surface of the electrical connection component 100. Furthermore, a fine and complicated circuit is formed in the inside of the electrical connection component 100 or the like. Accordingly, the electrical connection component 100 having excellent versatility is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electrical connection component that electrically connects electrodes.

  When electrically connecting (wiring) between the wirings (electrodes) of two printed circuit boards, as shown in FIG. 21, a mechanical contact type connector 30 is mounted on one printed circuit board 10, and the other The method of inserting the printed circuit board 20 into the connector 30 and electrically connecting the printed circuit board 10 and the printed circuit board 20 is simple and common.

  On the other hand, as in the printed circuit board 12 shown in FIG. 22, fine metal particles (conductive particles) 41 (see FIG. 19) are used to connect the wiring electrodes 11 of L / S to several um to several tens um of ultrafine wiring. An anisotropic conductive film (ACF) 40, an anisotropic conductive paste (ACP) (not shown), or the like can be used.

  As shown in FIG. 23A, ACF 40 (and ACP) is a mixture of thermosetting resin 42 and fine metal particles 41 having conductivity.

  Specifically, as shown in FIG. 22 and FIG. 23B, an ACF 40 (or ACP) is sandwiched between the wiring electrode 11 of one printed circuit board 12 and the wiring electrode 21 of the other printed circuit board 22, and ceramics or the like. When the metal particles 41 dispersed in the ACF 40 come into contact with the portions that come into contact with the wiring electrodes 11 and 21 by applying pressure while uniformly heating with the tool created by the above, a conductive path is formed.

  On the other hand, between the adjacent wiring electrodes 11 and between the adjacent wiring electrodes 21 are insulated, that is, conductive in the vertical direction in which the opposing electrodes exist (the vertical direction in the figure, that is, between the wiring electrodes 11 and 21). Is secured in the lateral direction (the horizontal direction in the figure, that is, the adjacent wiring electrode 11 and the adjacent wiring electrode 21), and even if the wiring is fine, the distance between the adjacent electrodes is appropriate. By ensuring the distance between the conductive particle diameter and appropriate conductive particles, electrical connection can be established without causing a short circuit between adjacent electrodes.

  Further, Patent Document 1 discloses a connection electrode of an electronic component in a state where an extended terminal portion that extends from the wiring pattern of the printed board and protrudes from the edge of the printed board is bent and deformed between the electronic component and the printed board. There has been proposed a connection structure for electronic components connected to the.

Japanese Patent Laid-Open No. 11-329536

  Here, the mechanical contact type connector 30 as shown in FIG. 21 has a configuration in which the printed circuit board 20 is connected vertically to the printed circuit board 10 as shown in FIG. A configuration in which the printed circuit board 20 is connected in parallel to the printed circuit board 10 like a connector 32 shown in FIG. However, as in the connector 34 shown in FIG. 22C, it is possible to connect the printed circuit board 20 to the printed circuit board 10 at an angle (an arbitrary angle). Therefore, since the printed circuit boards 10 and 20 to be connected are hardly subjected to loads such as stress due to bending and bending, highly reliable electrical connection is possible.

  However, such mechanical contact type connectors 30, 32, and 34 are prepared in consideration of various tolerances, manufacturing accuracy, etc., so that they can handle ultra-fine wiring of L / S to several um to several tens of um levels. It is difficult to electrically connect the fine wirings using a mechanical contact type connector. In addition, it is necessary to secure a large mounting space (for example, 5 mm × 15 mm only in the mounting area). When a large mounting space cannot be secured, printed circuit boards cannot be connected to each other using such a mechanical contact connector. .

  On the other hand, an anisotropic conductive film (ACF) 40 and an anisotropic conductive paste (ACP) (not shown) as shown in FIG. 22 can be electrically connected to fine wiring. Also, there are fewer restrictions on the mounting space than the connectors 30, 32, and 34 (see FIG. 21).

  However, the ACF 40 (and ACP) must secure a certain distance between the metal particles 41 in order to prevent a short circuit between adjacent electrodes. Therefore, as shown in FIG. 23C, in order to ensure high connection reliability, it is necessary to secure many connection points in the longitudinal direction (wiring direction). That is, it is necessary to ensure a sufficiently long connection length Q in the longitudinal direction (wiring direction) (see also FIG. 24B).

  Furthermore, as shown in FIG. 24, in order to connect at an arbitrary angle with respect to the printed circuit board 12, for example, 90 °, after connecting the parallel surfaces once using a flexible substrate (FPC) 25 (FIG. 22). As shown by the arrow J, the flexible substrate 25 needs to be bent. However, if the flexible substrate 25 on which the fine wiring is formed in this way is bent, there is a concern that the fine wiring is disconnected, and the reliability of the wiring may be remarkably lowered (in general, there is no fine wiring) If it is a typical flexible substrate, the possibility of disconnection by bending is small.)

  Furthermore, when it is necessary to reduce the curvature radius (bending radius) (for example, radius R = 0.5 mm), the possibility of further disconnection increases.

  Further, when the flexible substrate 25 is bent in this way, as shown in FIG. 24B, in addition to the connection length Q in the wiring direction (see also FIG. 23C), the amount of protrusion T and the radius of curvature R are Necessary. That is, a distance of T + R (+ Q) is required, and the device space is wasted.

  Furthermore, it is difficult for the mechanical connectors 30, 32, and 34 shown in FIG. 21 to mount an IC or a passive component on the upper surface or the side surface. In other words, it is difficult to utilize the area occupied by the connectors 30, 32, and 34 other than electrically connecting the printed boards. Similarly, it is difficult to utilize ACF (FIGS. 22, 23, and 24) in addition to electrical connection between printed circuit boards.

  Thus, the conventional mechanical contact connectors 30, 32, 34 (FIG. 21), ACF (FIGS. 22, 23, 24), and ACP (not shown) bend the wiring boards having ultrafine wiring. Without mounting at any angle. Therefore, there is a demand for an electrical connection component with excellent versatility that can greatly improve the space utilization efficiency while ensuring high reliability with few constraints and wide application range.

  In view of the above, an object of the present invention is to provide an electrical connection component with excellent versatility that can significantly improve space utilization efficiency while ensuring high reliability.

  The invention of claim 1 is a laminated structure having a layer composed of a conductive pattern portion made of a conductor and an insulating portion made of an insulator, and an end surface of the conductive pattern portion intersects with the lamination direction. One or a plurality of exposed side surfaces are exposed, and the exposed end surfaces of the conductive pattern portions are in contact with the electrodes of the plurality of connecting portions.

  According to the first aspect of the present invention, the plurality of connection portions are electrically connected by bringing the end face of the conductive pattern portion exposed from the side surface intersecting the stacking direction into contact with the electrode of the connection portion.

  And even if the pitch of the electrode of the connection part is a fine wiring, the fine wiring can be electrically connected by setting the pitch in the stacking direction of the conductive pattern part to be narrow (fine). Therefore, it can respond to various electrode pitches. Further, for example, electronic components such as ICs and passive components can be mounted on the side surfaces. Therefore, the three-dimensional space utilization efficiency can be increased.

  Therefore, it is set as the electrical connection component excellent in the versatility which can improve space utilization efficiency significantly, ensuring high reliability.

  The “pitch” refers to the interval between the center positions of the electrodes in the direction of arrangement of the electrodes.

  The invention according to claim 2 is the electrical connection part according to claim 1, wherein the conductive pattern portion is formed in two continuous layers, and the conductive pattern portion is in contact between the two continuous layers.

  According to the second aspect of the present invention, by forming a conduction path in the stacking direction, a fine and complicated circuit of the electrical connection component can be formed. Therefore, it is possible to deal with various arrangements of connection portions, and further, it is an electric connection component having excellent versatility.

  According to a third aspect of the present invention, there is provided the electrical connection component according to the first or second aspect, wherein the electrode of the connection portion is in contact with end surfaces of the conductive pattern portions on the plurality of side surfaces intersecting the stacking direction.

  In the invention of claim 3, a plurality of connecting portions are electrically connected between different side surfaces of the electrical connecting component.

  Therefore, for example, when the other connection portion is disposed obliquely with respect to one connection portion (necessary to be disposed obliquely), the shape of the electrical connection component is the one where the electrode of one connection portion contacts By making the other side surface with which the electrode of the other connection part contacts diagonally with respect to this side surface, the connection parts can be easily electrically connected.

  Alternatively, it is possible to easily connect a plurality of connection portions by electrically connecting the connection portions to different side surfaces of the electrical connection component (the electrical connection portions can function as wiring terminals). ).

  In addition, for example, when the distance between one connection part and the other connection part is wide, the shape of the electrical connection component can be easily made by making the shape of one side and the other side greatly separated. The connection portions can be electrically connected to each other.

  Therefore, it is set as the electrical connection component excellent in the versatility which can respond | correspond to various arrangement | positioning relationships between connection parts.

  In addition, an electrical connection can be obtained at an arbitrary angle without bending or deforming a substrate or the like provided with a connection portion. That is, since a load such as stress due to bending or bending is hardly applied to the substrate or the like, highly reliable electrical connection is possible. Therefore, even if the wiring is fine, the electrical connection is highly reliable.

  Invention of Claim 4 is provided with the bump which protrudes from the end surface of the said conductive pattern part exposed from the said side surface which cross | intersects a lamination direction, The said bump contacts any one of the said electrode. Electrical connection parts as described in the paragraph.

  In the invention of claim 4, since the bump protruding from the end face of the conductive pattern portion exposed from the side surface of the electrical connection component contacts the electrode, the reliability of electrical connection between the electrical connection component and the electrode is improved.

  According to a fifth aspect of the present invention, the plating electrode is brought into contact with an end surface of the conductive pattern portion exposed from any one of the plurality of side surfaces intersecting from each other in the stacking direction, and is exposed from the other side surface. The electrical connection component according to claim 4, wherein plating is formed on an end surface of the conductive pattern portion, and the formed plating is used as the bump.

  In invention of Claim 5, by making a plating electrode contact the end surface of the conductive pattern portion exposed from any one side surface, and forming plating on the end surface of the conductive pattern portion exposed from the other side surface, it is used as a bump. Bumps are easily formed.

  In the invention of claim 6, among the plurality of connecting portions, the electrode width of the connecting portion having the narrowest electrode width is Ls, the electrode gap of the connecting portion having the narrowest electrode gap is Ss, and Ls> ti and Ss> te, where te is the layer thickness of the conductive pattern portion at the portion where the end surface of the conductive pattern portion and the end surface of the insulating portion are alternately exposed, and ti is the layer thickness of the insulating portion. The electrical connection component according to claim 1, wherein the electrical connection component is set to a relationship of

  According to the sixth aspect of the present invention, if the positions of the connecting portions are aligned so that the center positions in the width (arrangement) direction of the electrodes coincide with each other, the position of the electrical connection component in the arrangement direction (stacking direction) is the same. However, the end face of the conductive pattern portion of the electrical connection component and the electrode are in contact with each other without short-circuiting (short-circuiting) with the adjacent electrode.

  That is, it is not necessary to align the electrical connection components in the stacking direction (electrode arrangement direction) when electrically connecting the connection portions. Therefore, working efficiency is improved.

  According to a seventh aspect of the present invention, the side surface is provided with a pad that electrically connects end surfaces of the plurality of conductive pattern portions.

  In the invention of claim 7, for example, an electronic component such as an IC or a passive component can be easily mounted using a pad electrically connected between the end faces of the plurality of conductive pattern portions provided on the side surface. .

  According to the first aspect of the present invention, it is possible to obtain a highly versatile electrical connecting component capable of significantly improving space utilization efficiency while ensuring high reliability.

  According to the invention described in claim 2, since a plurality of connecting portions can be electrically connected also in the stacking direction, it is possible to cope with arrangement (position) relationships between various connecting portions (electrodes). An electrical connection component having excellent versatility can be obtained.

  According to the third aspect of the present invention, it is possible to obtain an electrical connection component having excellent versatility that can correspond to an arrangement (position) relationship between various connection portions (electrodes).

  According to the fourth aspect of the present invention, the reliability of electrical connection is improved as compared with a configuration in which no bump is provided.

  According to invention of Claim 5, the bump comprised by plating can be easily formed in the end surface of the conductive pattern part exposed from the side surface.

  According to the sixth aspect of the present invention, it is possible to eliminate the need for alignment in the stacking direction (electrode arrangement direction) of the electrical connection components.

  According to the invention described in claim 7, it is possible to easily mount an IC, a passive component or the like on the side surface.

(A) is a disassembled perspective view for demonstrating the structure of the square pole-shaped electrical connection component which concerns on embodiment of this invention shown to (B), (B) is a square pole which concerns on embodiment of this invention. It is a perspective view of a shape electrical connection component, and (C) is a perspective view showing a triangular prism-shaped electrical connection component according to an embodiment of the present invention. It is sectional drawing along the lamination direction of the square pole-shaped electrical connection component which concerns on embodiment of this invention. (A) is sectional drawing corresponding to FIG. 2 which shows the electrical connection components from which a lamination pattern part differs, (B) is sectional drawing corresponding to FIG. 2 which shows the electrical connection components from which a lamination pattern part differs from (A). It is. It is explanatory drawing explaining the outline | summary of the manufacturing method of the electrical connection component of the structure by which the insulation part is not formed in order from (A) to (B), (C) is the electricity of the structure by which the insulation part is not formed It is explanatory drawing which shows the deformation | transformation of a connection component. (A) is a side view schematically showing an electrical connection component (component main body) before forming a bump, and (B) is an end face of a conductive pattern portion exposed from a side surface of the electrical connection component (component main body). It is explanatory drawing which illustrates a mode that plating (bump) is formed in this. It is process drawing which shows the process of forming plating (bump) in the end surface of the conductive pattern part of an electrical connection component (component main body) from (A) to (E) in order. (A) is an electrical connection component in the shape of a square pillar according to an embodiment of the present invention, in which one printed circuit board and the other printed circuit board arranged perpendicular to the one printed circuit board are electrically connected. It is the perspective view connected to, and (B) is a sectional view which met the BB line of (A). It is a figure which shows typically the component mounting apparatus which adhere | attaches a square pillar-shaped electrical connection component on the wiring part of a printed circuit board, and the wiring part of a printed circuit board. (A) is a figure which shows typically the component mounting apparatus which adheres a triangular prism-shaped electrical connection component to the wiring part of a printed circuit board, and the wiring part of a printed circuit board, (B) is a triangular prism-shaped electrical connection component It is a perspective view which shows the state which adhere | attached (C), (C) is a perspective view which shows a mode that IC is mounted. It is a figure which shows the outline | summary of a component mounting apparatus, and shows the connection process of a printed circuit board from (A) to (B). (A) is a perspective view which shows the state which connected four printed circuit boards to the electrical connection component typically, (B) is the state which connected the printed circuit board by arrangement different from (A) typically. It is a perspective view shown. (A) is a perspective view which shows the state which mounted the some electronic component on the printed circuit board, (B) mounted the several electronic component on the small printed circuit board using the electrical connection component which concerns on embodiment of this invention. It is a perspective view which shows a state. It is a figure which illustrates typically the electrical connection between printed circuit boards when a printed circuit board is separated by a big level difference, (A) is a perspective view electrically connected by the conventional wire bonding, (B ) Is a perspective view in which electrical connection is performed using a square pole-shaped electrical connection component according to the embodiment of the present invention, and (C) is an electrical connection component having an L-shaped cross section according to the embodiment of the present invention. FIG. It is a schematic diagram which shows the state which electrically connected the printed circuit boards which have the same electrode width, electrode gap | interval, and pitch of an electrode by electrical connection components. It is a schematic diagram which shows the state which electrically connected the printed circuit board from which the electrode width and electrode gap of an electrode differ, but the pitch is the same with an electrical connection component. (A) is explanatory drawing for demonstrating the electrical connection component in which the layer thickness ti of an insulation part is narrower than the electrode width L, and the layer thickness te of the electroconductive pattern part is narrower than the electrode gap S, (B) is (A). ) Is a schematic diagram showing a state in which printed circuit boards having the same electrode width, electrode gap, and pitch are electrically connected by the electrical connection component. (A) is an electrical connection component using printed wiring boards having the same electrode width, electrode gap, and pitch between electrodes using an electrical connection component in which the layer thickness ti of the insulating portion and the layer thickness te of the conductive pattern portion are narrow. It is a schematic diagram which shows the state connected electrically, (B) is explanatory drawing for demonstrating the electroconductive pattern part which has contributed to conduction | electrical_connection. It is a schematic diagram which shows the state which electrically connected the printed circuit board from which the electrode width of an electrode and an electrode gap differ, but the pitch is the same using the electrical connection component shown in FIG. It is the figure which formed the pad in the side surface of an electronic connection component. It is process drawing which shows the manufacturing process of the electrical connection component which concerns on embodiment of this invention in order from (A) to (L). It is a perspective view for demonstrating the method of electrically connecting one printed circuit board and the other printed circuit board with the conventional connector, Comprising: (A) is the other printed circuit board perpendicular | vertical with respect to one printed circuit board. (B) is a perspective view when the other printed circuit board is connected in parallel to one printed circuit board, and (C) is a perspective view when the other printed circuit board is connected to one printed circuit board. It is a perspective view when connecting obliquely to the printed circuit board, It is a perspective view explaining the method of connecting fine wiring with an anisotropic conductive film. (A) It is a schematic diagram which shows typically an anisotropic conductive film, (B) is a front view which shows the state electrically connected with the anisotropic conductive film typically, (C) FIG. 3 is a perspective view schematically showing a state where they are electrically connected with an anisotropic conductive film. (A) It is a perspective view which shows typically the state which connected the printed circuit board and the flexible substrate with the anisotropic conductive film, (B) is a side view.

  The electrical connection component according to the embodiment of the present invention will be described with reference to FIGS.

  First, the structure of the electrical connection component (connector) 100 will be described with reference to FIGS. 1, 2, and 3. FIG. 1A is an exploded perspective view (descriptive view) for explaining the structure of the square pole-shaped electrical connection component 100 shown in FIG. 1B, and FIG. It is a perspective view, (C) is a perspective view which shows the electrical connection component 101 of a triangular prism shape. FIG. 2 is a cross-sectional view along the stacking direction (the DD line in FIG. 1B). 3A is a cross-sectional view corresponding to FIG. 2 showing the electrical connection component 105 having a different laminated pattern portion, and FIG. 3B is a view showing the electrical connection component 107 having a different laminated pattern portion in both FIG. FIG.

  As shown in FIG. 1A and FIG. 1B, the electrical connection component 100 has a laminated structure in which thin film layers 110 on which conductive pattern portions 120 are formed are laminated. In other words, each layer 110 is formed by the conductive pattern portion 120 and the insulating portion 125 that constitutes a portion other than the conductive pattern portion 120. As shown in FIG. 1B, the stacked electrical connection component 100 is a quadrangular prism whose axial direction is the stacking direction X (the thickness of each layer 110 is equal).

  The end surface 120 </ b> A of the conductive pattern part 120 is exposed from the side surface that intersects (orthogonally) the stacking direction X of the electrical connection component 100.

  Further, as shown in FIG. 2, a part of the conductive pattern portion 120 is formed so as to be in contact with a continuous layer 110. Therefore, a part of the conductive pattern portion 120 is also conducted in the stacking direction X. That is, by forming a conduction path in the stacking direction, a fine and complicated circuit is formed inside the electrical connection component 100.

  Note that the layers at both ends in the stacking direction X are not the layers 110 where the conductive pattern portion 120 is formed, for example, the insulating layer 108 or the conductive layer (only the conductive pattern is entirely formed of the insulating portion 125 where the conductive pattern portion 120 is not formed). (One end may be a conductive layer and one end may be an insulating layer, or the layer 110 in which the conductive pattern portion 120 is formed). Note that the insulating layer 108 may be provided between the layers 110.

  Further, the layers 110 and the insulating layers 108 may be alternately arranged as in the electrical connection component 105 illustrated in FIG. Alternatively, there may be a portion where the layers 110 and the insulating layers 108 are alternately arranged (a configuration in which only a part is alternately arranged).

  Further, a layer 109 in which an insulating portion 125 is formed may be stacked over the conductive pattern portion 120 as in the electrical connection component 107 illustrated in FIG.

  Further, although not illustrated, the layer 109, the layer 110, and the insulating layer 108 may be stacked.

  Further, as shown in FIG. 5B, bumps 122 may be formed on an end face 120A orthogonal to (intersect) the stacking direction of the conductive pattern portion 120 (details will be described later).

  Further, it may be a polygonal column (a cross section perpendicular to the stacking direction is a polygon) other than the quadrangular column. For example, a triangular prism may be used like the electrical connection component 101 shown in FIG. Alternatively, it may be a pentagonal column shape or a hexagonal column shape (not shown). Further, as shown in FIG. 13C, a polygon having a partially recessed shape (FIG. 13C is a columnar shape having an L-shaped cross section orthogonal to the stacking direction X) may be used.

  Further, the corner may be C-chamfered or R-chamfered. Also, some of the side surfaces (sides) may have an arc shape (for example, a fan shape or a semicircular shape). However, in view of securing a contact area between the end surface 120A of the conductive pattern portion 120 and the electrode, it is preferable that at least one plane is formed on the side surface orthogonal to the stacking direction X.

  In the present embodiment, the layer thickness of each layer 110 is about 1 μm. In the mask screen technology such as the most advanced ceramic capacitor technology, the dielectric layer thickness and the conductive pattern portion (conductive pattern portion) layer thickness of 1 μm or less are realized. Therefore, also in the electrical connection components 100 and 101 of the present embodiment, the layer thickness of each layer 110 (conductive pattern portion 120) can be sufficiently set to about 1 μm with the current technology.

  It can also be realized by using inkjet technology. A specific manufacturing method using this ink jet technology will be described later.

  As a material of the insulating layer 108 and the insulating portion 125, a material such as an insulating resin such as polyimide, which is an insulating resin, a ceramic, an oxide ceramic slurry such as alumina, titania, or the like, which has an insulating property and can be thinned. Good.

  As a material for the conductor constituting the conductive pattern portion 120, any material other than metals such as gold, silver, palladium, copper, nickel, and aluminum can be used as long as it is conductive and can be thinned.

  4 (A) and 4 (B) are explanatory views for explaining an outline of a method for manufacturing an electrical connection component having a configuration in which the insulating portion 125 is not formed in order from (A) to (B). (C) is explanatory drawing which shows the deformation | transformation of the electrical-connection component of the structure by which the insulation part 125 is not formed.

  As shown in FIGS. 4A and 4B, in the case where the insulating layer 108 in which only the conductive pattern portion 120 is formed is stacked and the insulating portion 125 is not formed, multiple stacking (for example, 1000 layers) ), The thickness is different between the portion where the conductive pattern portion 120 is present and the portion where the conductive pattern portion 120 is not present, which may be greatly deformed as shown in FIG.

  Therefore, as shown in FIG. 2 and FIG. 3A, the insulating portion 125 having the same height as the conductive pattern portion 120 and the insulating portion 125 higher than the conductive pattern portion 120 as shown in FIG. Thus, the layer thickness becomes constant, and deformation as shown in FIG. 4C is prevented.

  Next, a method for manufacturing the electrical connection components 100, 105, and 107 will be described with the connection component 100 as a representative. In addition, you may manufacture with manufacturing methods other than the manufacturing method demonstrated here.

  In the electrical connection component 100, the conductive pattern portion 120 is formed directly on the initial substrate (the insulating layer 108 or the conductive layer) with a conductive liquid (conductive ink) by ink jet or screen printing, and the portions other than the conductive pattern portion 120 are insulated. It can be created by filling with liquid (insulating ink).

  Therefore, a method for manufacturing the electrical connection component 100 using the ink jet technology will be described with reference to FIG.

  FIG. 20 is a process diagram illustrating the manufacturing process of the manufacturing method using the inkjet technique in order from (A) to (L). Moreover, the right figure of (A)-(H) is a fragmentary sectional view, and the left figure of (A)-(E) is the perspective view seen from the upper direction. This left figure is omitted in (F) to (H). Further, the case where the insulating layer 108 is selected as the initial substrate is shown.

  As shown in FIG. 20 (A), a thin-film insulating sheet (film) 209 made of PET, PI, PEN or the like, which becomes the insulating layer 108 (see FIG. 1) at both ends, is shown in FIG. 20 (B). As shown in FIG. 20, a conductive pattern portion is formed by discharging a conductive liquid (conductive ink) while scanning a droplet discharge head (inkjet recording head) (not shown) and drying it as shown in FIG. 120 is formed.

  Next, as shown in FIG. 20D, an insulating liquid (insulating ink) F is ejected so as to fill a portion other than the conductive pattern portion 120 and dried as shown in FIG. An insulating part 125 is formed.

  Then, FIGS. 20A to 20D are repeated to create a stacked body 505 (see FIGS. 20K-1 and 20K-2).

  At this time, when the conductive pattern portion 120 is made conductive in each layer 110 (see FIG. 1) (see FIG. 2), as shown in FIGS. 20 (G) and 20 (H), the conductive pattern portions 120 overlap each other. To form. Note that a Z portion in FIG. 20H is a portion where the conductive pattern portions 120 overlap each other.

  In the case of forming a layer where the conductive pattern portion 120 is not formed, the insulating layer 209 in FIG. 20A may be attached or the entire surface may be applied with the insulating liquid F to form the insulating layer.

  The layer thicknesses of the conductive pattern portion 120 and the insulating portion 125 can be controlled by adjusting the amount of droplets to be discharged, the scanning speed of the droplet discharge head (inkjet recording head), and the like.

  Then, as shown in FIG. 20 (K) -1, by cutting using a circular rotary blade (dicing blade) 230, it is cut into a desired shape (in the case of the electrical connection component 100, a quadrangular prism shape). As shown in FIG. 2, a rectangular columnar electrical connection component 100 (“component main body 99” in the drawing will be described later) is created.

  As shown in FIG. 20 (K) -2, the electrical connection component 100 may be created by cutting into a desired shape by knife cutting using a cutter 232.

  In addition to the above, the electrical connection component 100 may be created using, for example, a screen printing technique.

  As described above, the material of the insulating part 125 and the material of the conductive pattern part 120 are not particularly limited, but there are cases where the combination of the material of the insulating part 125 and the conductive pattern part 120 should be considered. For example, in the case of ceramics, since the conductive pattern portion 120 and the insulating portion 125 are pre-fired, for example, when silver is used as the conductive material, glass-based LTCC low-temperature firing that can be fired at a melting point of 910 ° C. or lower of silver. It is necessary to select the insulating material of the mold.

  In the case of creating with a droplet discharge head (inkjet recording head), it is necessary that the liquid (ink) has characteristics and physical properties (such as viscosity) that can be discharged by the droplet recording head (inkjet recording head).

  Furthermore, as shown in FIG. 19, pads 121, 123, and 127 may be formed on the side surface of the electrical connection component 100 with a conductive liquid (conductive ink) so as to cover the end surfaces 120 </ b> A of the plurality of conductive pattern portions 120. The pads 121, 123, and 127 can be used for realizing a complicated wiring structure or when mounting an electronic component such as the IC 70 or the passive component 80 (see FIG. 7).

  Now, as shown in FIG. 5A, the electrical connection component 100 cut out in a desired shape is a flat surface with no irregularities on the side surface 100A perpendicular to the stacking direction X. However, when mounting, higher connection reliability can be ensured by providing bumps (projections) on the end surface 120A of the conductive pattern portion 120 (details of mounting will be described later). Note that the bump 122 may not be formed.

  Therefore, a manufacturing method in which bumps (projections) are provided on the end surface 120A of the conductive pattern portion 120 exposed from the side surface 100A of the electrical connection component 100 by electrolytic plating will be described with reference to FIGS. The bump forming method (manufacturing method) described below is an example, and other methods may be used. In addition, the electrical connection component 100 in which no bump is formed is referred to as a “component body 99” for convenience.

  FIG. 5A is a side view schematically showing the component main body 99 before the bumps 122 are formed on the electrical connection component 100. FIG. 5B is an explanatory diagram schematically illustrating the state in which plating (bumps 122) is formed on the end surface 120A of the conductive pattern portion 120 exposed from the side surface 100A of the electrical connection component 100 (component main body 99). FIG. 6 is a process diagram showing, in order from (A) to (E), the process of forming the plating (bump 122) on the end surface 120A of the conductive pattern portion 120 of the component main body 99. Note that the bump 122 is omitted in the drawings other than FIG. 5B and FIG. 7B described later. Further, the conductive pattern portion 120 is described in a layered form for easy understanding.

  As shown in FIG. 5A, the plating electrode 400 is brought into contact with the side surface 100B of the component main body 99 as shown in FIG. 5B to the component main body 99 cut out by dicing or knife cutting. Instead of forming on the exposed end face of the insulating part 125, only the end face 120A of the conductive pattern part 120 is subjected to electrolytic plating and grown, thereby forming a protruding part protruding from the end face 120A, that is, a bump 122.

  Note that the electrode surface 402 of the plating electrode 400 to be attached when forming the bump (plating) 122 has a surface roughness smaller than the stacking pitch of the insulating portion 125 and the conductive pattern portion 120, so that the conductive pattern portion 120 can be surely formed. Contact. Further, it is desirable that the surface is relatively rough (uneven) as compared with a flat surface because it can more reliably contact the end surface 120A of the conductive pattern portion 120 and ensure a contact pressure.

  6A, the component main body 99 before bump formation is fixed to the electrode surface 402 of the plating electrode 400 with an adhesive 420. As shown in FIG. The adhesive 420 is made of a waterproof silicone that can be repaired. Further, as shown in FIG. 6B, a plurality of component bodies 99 are arranged and fixed on the plating electrode 400 at predetermined (predetermined) intervals.

  As shown in FIG. 6C, the plating electrode 400 to which the component main body 99 is fixed is immersed in the plating solution 520 of the plating tank 500. Then, electricity is applied between the cathode 512 and the anode 510. Since electrode plating is not formed on the end surface of the insulating portion 125, electrolytic plating grows only on the end surface 120A of the conductive pattern portion 120, and bumps 122 protruding from the end surface 120A are formed (see FIG. 5B).

  As shown in FIG. 6 (D), it is taken out from the plating tank 500, and the electrical connection component 100 is removed together with the adhesive 420 from the plating electrode 400, and washed with a cleaning agent such as acetone as shown in FIG. 6 (E). Then, the adhesive 420 is removed, and the electrical connection component 100 on which the bump (plating) 122 (see FIG. 5B) is formed is completed (see FIG. 1B).

  Next, a method of electrically connecting the wirings of a plurality of substrates using the electrical connection component 100 will be described with reference to FIGS.

  In FIG. 7A, one printed circuit board 600 and a printed circuit board 610 arranged perpendicularly to the one printed circuit board 600 are electrically connected by the electrical connection component 100 and are connected to the side surface. It is a perspective view in the state where electronic parts, such as IC70 and passive parts (resistor, capacitor, coil, oscillator, etc.) 80, were mounted. FIG. 7B is a cross-sectional view taken along line BB in FIG. FIG. 14 is a schematic diagram showing a state in which the printed boards are electrically connected by the electrical connection component 100.

  As shown in FIG. 7A, one printed circuit board 600 has a wiring portion 602 in which a plurality of electrodes 604 are arranged. Similarly, a wiring portion 612 in which a plurality of electrodes 604 are arranged is formed on the other printed circuit board 610. The arrangement direction and the stacking direction X are the same direction.

  As shown in FIG. 7B, the electrode width L, which is the width in the arrangement direction of the electrodes 604 of the printed circuit board 600, is L1, and the electrode gap S, which is the gap between the adjacent electrodes 604, is S1. . The center position in the width direction (arrangement direction) of the electrodes 604 is G, and the interval between the center positions G is P1 (see also FIG. 14).

  Note that the wiring portion 612 of the printed circuit board 610 also has the same electrode width L = L1, electrode gap S = S1, and pitch P = P1 (see FIG. 14).

  Further, the layer thickness (width in the stacking direction) ti of the insulating part 125 of the electrical connection component 100 is ti1, and the layer thickness (width in the stacking direction) te = te1 of the conductive pattern unit 120. In this embodiment, since the layer thickness of each layer 110 is equal, the layer thickness (width in the stacking direction) ti1 of the insulating portion 125 and the layer thickness (width in the stacking direction) te1 of the conductive pattern portion are equal (ti = te ). L1 = te1 (L = te) and S1 = ti1 (S = ti1). That is, L1 = te1 = S1 = ti1.

  Then, as shown in FIGS. 7A and 7B, a non-conductive resin (NCP [Non conductive Paste]) 480 (see FIG. 7B) is connected to the wiring portion 602 of the printed circuit board 600. The side surface 100A of the electrical connection component 100 is bonded, and the side surface 100C of the electrical connection component 100 is bonded to the wiring portion 612 of the printed board 610 as shown in FIG.

  At this time, the center position G of the electrode 604 of the wiring part 602 of the printed circuit board 600, the center position G of the electrode 614 of the wiring part 612 of the printed circuit board 610, and the center position G of the conductive pattern part 120 of the electrical connection component 100 are matched. By positioning and bonding in this manner, the wiring part 602 (electrode 604) of the printed circuit board 600 and the wiring part 612 (electrode 614) of the printed circuit board 610 are electrically connected by the electrical connection component 100 (also in FIG. 14). reference).

  When the printed circuit board 610 is arranged obliquely, for example, at 60 ° with respect to the printed circuit board 600, it can be easily handled by setting the angle between the side surface 100A and the side surface 100C of the electrical connection component 100 to 60 °.

  Further, the IC 70 is mounted on the side surface 100D of the electrical connection component 100, and the passive component 80 is mounted on the side surface 100B.

  Note that a substrate other than the printed circuit boards 600 and 610, for example, a flexible cable (flexible substrate) can be electrically connected using the electrical connection component 100.

  Moreover, when the electrical connection component 100 does not need to support the printed circuit board 610, the side surfaces 100A and 100C (bonding area) of the electrical connection component 100 can be narrowed. In other words, the mounting space is small.

  Conversely, by widening the side surfaces 100A and 100C (bonding area) of the electrical connection component 100, the printed circuit board 610 may be supported by the electrical connection component 100 or may be one of the structural members that support the printed circuit board 610. it can.

  Next, an example of a method for bonding the electrical connection component 100 to the wiring portion 602 of the printed board 600 and the wiring portion 612 of the printed board 610 will be described with reference to FIG. FIG. 8 is a diagram schematically showing a component mounting apparatus 460 for bonding the electrical connection component 100 to the wiring 602 of the printed board 600 and the wiring portion 612 of the printed board 610.

  First, an outline of the component mounting apparatus 460 will be described.

  As shown in FIG. 8, the component mounting apparatus 460 includes a bottom plate 490 including a V-shaped groove 492 whose upper side is an opening side and a jig 470.

  The head portion 471 at the tip of the jig 470 has a (reverse) V-shaped groove 472 having an opening on the lower side. A suction chamber 474 is formed inside the head portion 471. A plurality of through holes 476 communicating with the suction chamber 474 are formed on the side surface of the V-shaped groove 472. The suction chamber 474 is connected to a suction pump (suction means) not shown. Therefore, the electrical connection component 100 can be adsorbed and held in the V-shaped groove 472. Further, the head portion 471 is configured to be heated by heating means such as a ceramic heater (not shown).

  Next, a method of bonding the electrical connection component 100 to the wiring 602 of the printed board 600 and the wiring portion 612 of the printed board 610 using the component mounting apparatus 460 will be described.

  First, the printed circuit board 600 and the printed circuit board 610 are set in the V-shaped groove 472 of the bottom board 490 of the component mounting apparatus 460.

  Next, a non-conductive resin (NCP [Non conductive Paste]) 480 is applied to a connection portion (wirings 602, 612) between the printed board 600 and the printed board 610.

  The electrical connection component 100 is sucked and held in the V-shaped groove 472 of the head portion 471 at the tip of the jig 470. Then, the head portion 471 is lowered, and the head portion 471 is pressed against the connection portion between the printed circuit board 600 and the printed circuit board 610 while being heated.

  Thus, the electrical connection component 100 is bonded to the wiring portion 602 of the printed board 600 and the wiring portion 612 of the printed board 610 with the non-conductive resin 480 (see FIG. 7B).

  Note that the non-conductive resin 480 is also applied to the electrodes 604 and 614, but when pressed, between the electrodes 604 and 614 and the end face 120 </ b> A (or the bump 122) of the conductive pattern portion 120 of the electrical connection component 100. The non-conductive resin 480 is extruded from above. Therefore, contact failure does not occur between the electrodes 604 and 614 and the end face 120A of the conductive pattern portion 120 of the electrical connection component 100.

  Note that the angle of the V-shaped groove 492 of the bottom board 490 may be changed in accordance with the arrangement angle between the printed circuit board 600 and the printed circuit board 610.

  Thereafter, the IC 70 is mounted on the side surface 100D of the electrical connection component 100, and the passive component 80 is mounted on the side surface 100B. The IC 70 and the passive component 80 can be mounted on the electrical connection component 100 by using a reflow or flip chip bonding technique.

  Moreover, what is necessary is just to comprise the head part of the front-end | tip of a jig | tool according to the shape of electrical connection components. For example, in the case of the electrical connection component 101 having a triangular prism shape as shown in FIG. 1C, as shown in FIGS. 9A and 9B, the head portion 479 of the jig 475 of the component mounting apparatus 461 is used. As described above, the tip surface 477 may be a flat surface, and the electrical connection component 101 may be sucked to the tip surface 477.

  In this case, as shown in FIG. 9C, the IC 70 or the like can be mounted on the side surface with the printed circuit board 600 and the printed circuit board 610 connected and mounted.

  As described above, after connecting the printed circuit board 600 and the printed circuit board 610 with the electrical connection component 100, the IC 70 and the passive component 80 are mounted on the electrical connection component 100. However, the present invention is not limited to this. After mounting the IC 70 and the passive component 80 on the electrical connection component 100 first, the printed circuit board 600 and the printed circuit board 610 may be connected. Therefore, an example of a method for connecting the printed circuit board 600 and the printed circuit board 610 after mounting the IC 70 and the passive component 80 on the electrical connection component 100 will be described.

  First, an outline of the component mounting apparatus 560 will be described with reference to FIG. FIG. 10 is a diagram showing an outline of the component mounting apparatus 560 and a printed circuit board connection process from (A) to (B).

  As shown in FIG. 10, the component mounting apparatus 560 includes a bottom plate 590 and a jig 570 (see FIG. 10B).

  A mountain-shaped (inverted V-shaped) portion 593 having side surfaces 594 and 596 is formed on the upper side of the bottom plate 590, and a V-shaped groove 592 whose upper side is the open side is formed at the upper end of the mountain-shaped portion 593. Has been. Further, holes 595 and 596 of a size that can accommodate the IC 70 and the passive component 80 are formed in the side wall of the V groove 592 of the bottom plate 590.

  A head portion 571 at the tip of the jig 570 is formed with a (reverse) V-shaped groove 572 whose lower side is the opening side. Further, the head portion 571 is configured to be heated by heating means such as a ceramic heater (not shown).

  As shown in FIG. 10A, an IC 70 and a passive component 80 are mounted on the electrical connection component 100 using a reflow or flip chip bonding technique.

  The electrical connection component 100 is mounted in the V-shaped groove 592 so that the IC 70 and the passive component 80 are accommodated in the holes 595 and 593 formed in the side wall of the V-shaped groove 592 of the bottom plate 590.

  As shown in FIG. 10B, after the non-conductive resin (NCP [Non Conductive Paste]) omitted in this drawing is applied to the electrical connection component 100, the printed circuit board 600 and the printed circuit board 610 are placed at predetermined positions. The printed circuit boards 600 and 610 are heated and bonded using the head portion 571 of the jig 570 from above.

  Note that the component mounting apparatuses 460, 461, and 560 illustrated in FIGS. 8 to 10 described above are merely examples, and the electrical connection component and the printed board may be bonded by another apparatus or method.

  In addition, until now, the printed circuit board 600 and the two printed circuit boards 610 are electrically connected by the electrical connection component 100, but three or more printed circuit boards are connected by the single electrical connection component 100. Is also possible. In other words, the electrical connection component 100 can be used as a connection terminal (the electrical connection component 100 can function as a connection terminal).

  Further, for example, as shown in FIG. 11A, even when the printed circuit board 702 and the printed circuit board 704 are connected to the side surface 100A of the electrical connection component 100, and the printed circuit board 706 and the printed circuit board 708 are connected to the side surface 100B. Good.

  Alternatively, as shown in FIG. 11B, the printed circuit board 702 and the printed circuit board 704 are connected to the side surface 100A of the electrical connection component 100, the printed circuit board 706 is connected to the side surface 100C, and the printed circuit board 708 is connected to the side surface 100B. You may let them.

  Further, as shown in FIG. 12A, when a plurality of electronic components 760, 762, 764, 766, and 768 are mounted on a printed board 750, a large area is required.

  On the other hand, as shown in FIG. 12B, the electrical connection component 105 has a complicated circuit configuration in which the conductive pattern portion 120 can be mounted on the electronic components 760, 762, 764, 766, and 768. In the electrical connection component 107, conductive pattern portions 120 are formed on both side surfaces in the stacking direction X. Then, by mounting the electrical connection component 105 (for example, like a hybrid IC) on which the electronic components 760, 762, 764, 766, and 768 are mounted on the small printed circuit board 752, the board area can be reduced ( (See FIG. 12A and FIG. 12B for comparison).

  13A, when the printed circuit board 800 and the printed circuit board 810 are separated by a large step, the electrode 804 of the connection portion 802 of the printed circuit board 800 and the electrode 814 of the connection portion 812 of the printed circuit board 810 are used. Are generally connected by wire-bonding 820 or the like.

  On the other hand, when the electrical connection component 100 to which the present invention is applied is used, the electrode 814 of the connection portion 812 is provided on the lower surface of the upper printed board 811 as shown in FIG. By inserting the electrical connection component 100 between the connection portion 802 of 800 and the connection portion 812 of the printed circuit board 811, highly reliable electrical connection can be performed. That is, the degree of freedom of design is greatly expanded.

  Further, as shown in FIG. 13C, the electrical connection component 107 having an L-shaped cross section orthogonal to the stacking direction X is used, so that the connection portion 802 is formed on the upper surface of the printed circuit board 800 as shown in FIG. Even if the electrode 804 is provided, it can be electrically connected.

  Here, in the above, at the portion where the end face 120A of the conductive pattern portion 120 and the end face 125A of the insulating portion 125 are alternately exposed, as shown in FIGS. 7B and 14, the printed board 600 and the printed board 610 The electrode width L, the electrode gap S, and the pitch P are the same. Further, the layer thickness ti of the insulating part 125 (layer 110) of the electrical connection component 100 and the electrode gap S are the same, and the layer thickness te of the conductive pattern part 120 and the electrode gap S are the same. However, it is not limited to this.

  Therefore, an example of a configuration in which these do not match will be described next. In this embodiment, since the layer thickness of each layer 110 is equal, the layer thickness (width in the stacking direction) ti of the insulating portion 125 and the layer thickness (width in the stacking direction) te of the conductive pattern portion 125 are equal (ti = te).

  In FIG. 15, the electrode width L that is the width in the arrangement direction of the electrodes 613 of the wiring portion 603 of the printed circuit board 601 is L2, and the electrode gap S that is the gap between the adjacent electrodes 613 is S2. And L2> L1, S2> S1, but the pitch P is the same at P1.

  As shown in FIG. 15, even with such a configuration, the electrode 613 of the wiring part 603 of the printed board 601 and the electrode 614 of the wiring part 612 of the printed board 610 can be connected by the electrical connection component 100.

  As shown in FIG. 16A, the electrical connection component 200 is set to have a relationship of S1> te2 and L1> ti2 (various tolerances are taken into consideration for this setting). When the electrical connection component 200 set in this way is used, if the electrode pitches of the printed circuit board 600 and the printed circuit board 610 coincide with each other and the center positions G of the electrodes coincide with each other, FIG. ), The printed circuit board 600 and the printed circuit board 610 are short-circuited between the adjacent electrodes 604 and the electrodes 614 regardless of the position in the stacking direction (arrangement direction) X of the electrical connection components 200. Without being electrically connected. That is, positioning in the stacking direction (array direction) X of the electrical connection components 200 is not necessary.

  However, when S1 and te2 and L1 and ti2 are close to each other, the connection widths are greatly different as shown by 120m and 120n shown in FIG. 16B. As a result, the connection resistance varies. There is a possibility.

  Therefore, as in the electrical connection component 210 shown in FIG. 17, when te2 is made much smaller than S1 (becomes narrower) and ti2 is made much smaller than L1 (becomes narrower), the connection is made. Variation in width is suppressed, and as a result, variation in connection resistance is suppressed. In FIG. 17B, the conductive pattern portion 120 contributing to the connection is shown with halftone dots (the conductive pattern portion 120 not contributing to the connection is outlined, and the insulating portion 125 is hatched).

  As shown in FIG. 18, even in the combination of the printed circuit board 601 and the printed circuit board 610, the electrode width Ls of the smaller one of the electrode widths L of the printed circuit board 601 and the printed circuit board 610, In this case, the width of the layer thickness ti2 of the insulating portion 125 (layer 110) is narrower than Ls = L1 (Ls> ti), and the electrode of the electrode gap S between the printed circuit board 601 and the printed circuit board 610, whichever is smaller. The gap Ss, in the case of this embodiment, the layer thickness te2 of the conductive pattern portion 120 is narrower than Ss = S2 (Ss> te), so that the stacking direction (array direction) S of the electrical connection components 200 is increased. , The printed circuit board 601 and the printed circuit board 610 are not short-circuited with each other between the adjacent electrodes 613 and the electrodes 614, and the printed circuit board 601 and the printed circuit board 610 are pre-connected. And Doo substrate 610 are electrically connected. That is, positioning in the stacking direction (arrangement direction) S of the electrical connection components 210 is not necessary.

When connecting three or more printed circuit boards, the electrode width of the printed circuit board having the wiring part having the narrowest electrode width is Ls, and the printed circuit board having the wiring part having the narrowest electrode gap (adjacent electrode and gap) is used. When the electrode gap is Ss, the layer thickness of the conductive pattern portion in the stacking direction of the electrical connection parts is te, and the layer thickness of the insulating portion is ti,
Ls> ti and Ss> te
(Various tolerances are taken into account for this setting).

  Next, the operation and effect of this embodiment will be described.

  As described above, the electrical connection components 100, 101, 200, 210, and the like according to the embodiments of the present invention use the end surface 120A of the conductive pattern portion 120 exposed from the side surface orthogonal to (intersect) the stacking direction X as the electrode. The electrodes 604, 613, and 614 are contacted to electrically connect the electrodes.

  Even if the pitch P of the electrodes 604, 613, and 614 is a fine wiring, the fine wiring can be electrically connected by setting the pitch of the conductive pattern portion 120 narrow (fine).

  In addition, electronic components such as the IC 70 and the passive component 80 can be mounted on the side surfaces of the electrical connection component 100 and the like. Therefore, the three-dimensional space utilization efficiency can be increased.

  Furthermore, a fine and complicated circuit can be formed inside the electrical connection component 100 or the like.

  Therefore, it is set as the electrical connection component excellent in versatility.

  Further, for example, when the other printed circuit board 610 is arranged at an angle with respect to one printed circuit board 600, in the above embodiment, when the printed circuit board 610 is disposed at 90 ° as shown in FIG. By setting the angle between the side surfaces of the components 100, 101, 200, and 210 to 90 °, the connection portions can be easily electrically connected.

  Furthermore, as shown in FIG. 11, printed circuit boards 702, 704, 706, and 708 can be electrically connected to different side surfaces of the electrical connection component 100 (can function as connection terminals).

  In addition, as shown in FIG. 12, the electrical connection component 107 is mounted on the printed circuit board 750, and the electronic components 760, 762, 764, 766, and 768 are mounted on the different side surfaces of the electrical connection component 107. The area of 750 can be reduced.

  Further, as shown in FIG. 13, even when the printed circuit boards 810 and 811 are separated from the printed circuit board 800 by a large step, the quadrangular prism-shaped electrical connection component 100 and the L-shaped cross section are formed. The electrical connection component 107 can be used for electrical connection.

  Thus, electrical connection can be obtained at an arbitrary angle without bending or deforming the printed circuit board. That is, since a load such as stress due to bending or bending is hardly applied to the substrate or the like, highly reliable electrical connection is possible. Therefore, even if the wiring is fine, the electrical connection is highly reliable.

  Further, in a portion where the end face 120A of the conductive pattern portion 120 and the end face 125A of the insulating portion 125 are alternately exposed, the narrowest electrode width is Ls, the narrowest electrode gap is Ss, and the layer thickness of the conductive pattern portion 120 is te, Assuming that the thickness of the insulating portion 125 (layer 110) is ti, the printed circuit board is set so that the center positions G in the width (array) direction of the electrodes coincide with each other by setting the relationship Ss> te and Ls> ti. If the positions of the electrical connection parts 200 and 210 are matched, the electrical connection components 200 and 210 can be electrically connected without being short-circuited (short-circuited) with the adjacent electrodes regardless of the position in the arrangement direction (stacking direction) X. it can. That is, alignment in the arrangement direction (stacking direction) X of the electrical connection components 200 and 210 is not necessary. Therefore, working efficiency is improved (see FIGS. 16, 17, and 18).

99 Component body 100 Electrical connection component 101 Electrical connection component 100A Side surface 100B Side surface 100C Side surface 100D Side surface 107 Electrical connection component 110 Layer 120 Conductive pattern portion 120A End surface of conductive pattern portion 121 Pad 122 Bump 123 Pad 125 Insulation portion 127 Pad 200 Electrical connection component 210 Electrical connection parts 602 Wiring part (connection part)
603 Wiring part (connection part)
604 Electrode 612 Wiring part (connection part)
613 electrode 614 electrode 802 connection part 804 electrode 812 connection part 814 electrode
P pitch
X Stack direction

Claims (7)

A laminated structure having a layer composed of a conductive pattern portion made of a conductor and an insulating portion made of an insulator;
The end surface of the conductive pattern portion is exposed at one or more locations on the side surface intersecting the stacking direction,
An electrical connection component in which the exposed end surface of the conductive pattern portion is in contact with electrodes of a plurality of connection portions.   The electrical connection component according to claim 1, wherein the conductive pattern part is formed in two continuous layers, and the conductive pattern part is in contact between the two continuous layers.   The electrical connection component according to claim 1, wherein the electrode of the connection portion is in contact with end surfaces of the conductive pattern portions on the plurality of side surfaces intersecting the stacking direction.   The electrical connection component according to any one of claims 1 to 3, wherein a bump protruding from an end surface of the conductive pattern portion exposed from the side surface intersecting with the stacking direction is provided, and the bump contacts the electrode. .   A plating electrode is brought into contact with an end surface of the conductive pattern portion exposed from any one of the plurality of side surfaces intersecting from the stacking direction, and plating is performed on an end surface of the conductive pattern portion exposed from the other side surface. The electrical connection component according to claim 4, wherein the bump is formed by forming the plating. In a portion where the end face of the conductive pattern portion and the end face of the insulating portion are alternately exposed, the electrode width of the connecting portion having the narrowest electrode width among the plurality of connecting portions is Ls, and the narrowest electrode gap is provided. Let Ss be the electrode gap of the connection part,
When the layer thickness of the conductive pattern portion in the portion where the end surface of the conductive pattern portion and the end surface of the insulating portion are alternately exposed in the stacking direction is te, and the layer thickness of the insulating portion is ti,
Ls> ti and Ss> te
The electrical connection component according to claim 1, wherein the electrical connection component is set to a relationship of   The electrical connection component according to any one of claims 1 to 6, wherein a pad that electrically connects end surfaces of the plurality of conductive pattern portions is provided on the side surface.

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