JP2010210678A - Method for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device, the method improving manufacturing yield by preventing defective packaging of an integrated circuit. <P>SOLUTION: The method for manufacturing a display device includes: a first substrate production step of forming a first substrate 3 having a first display area 6A; a second substrate production step of forming a second substrate 4 having a second display area 6B; a sealing step of fixing the first substrate 3 and the second substrate 4 with a fixed gap, such that the first display area 6A and the second display area 6B face each other; a first thermocompression bonding step of mounting a first component 11 onto a first connection part CN1 in an extension 3A of the first substrate 3 extending from an end 4E of the second substrate 4; and a second thermocompression bonding step of mounting a second component FPC onto a second connection part CN2 in the extension 3A of the first substrate 3. In the second thermocompression bonding step, the first connection part CN1 is heated at the same time as the second connection part CN2 is heated. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device, and more particularly to a method for manufacturing an active matrix display device.

  In recent years, there is a growing need for lighter and thinner display devices in the market. As a display device that can be thinned, for example, a liquid crystal display device can be given.

  The liquid crystal display device includes an effective display unit that includes an array substrate and a counter substrate facing each other and includes matrix display pixels. The effective display section includes various wirings such as a plurality of scanning lines extending along the row direction of the display pixels and a plurality of signal lines extending along the column direction of the display pixels. Each of these scanning lines and each signal line is drawn out to the outer peripheral part of the effective display part.

A plurality of electrodes to which various wirings such as scanning lines and signal lines are connected are arranged on the outer periphery of the effective display portion. A drive signal source such as a drive IC or a flexible wiring board for supplying a drive signal to the effective display unit is mounted on the plurality of electrodes. The flexible wiring board is mounted by thermocompression mounting in which the connection portion is heated after mounting the driving IC (for example, see Patent Document 1).
JP-A-5-183247

  As the liquid crystal display panel and components become lighter and thinner, the thickness of components such as the substrate of the liquid crystal display panel and the integrated circuit also decreases, and the rigidity of the substrate and components decreases.

  Therefore, when a flexible wiring board is mounted by thermocompression bonding in the mounting process of the flexible wiring board after mounting an integrated circuit, a temperature difference occurs in the substrate surface direction due to local heating of a part of the board, and the flexible wiring becomes high temperature. Heat is transferred from the connection portion of the substrate to the connection portion of the integrated circuit at a low temperature, and the integrated circuit is stretched, the anisotropic conductive film (ACF) is softened, and the substrate is warped due to internal stress in the array substrate. There was a thing. Furthermore, the occurrence of these may cause a mounting failure of the integrated circuit.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a display device that prevents a mounting failure of an integrated circuit and improves a manufacturing yield.

  A method for manufacturing a display device according to a first aspect of the present invention includes a step of forming a first substrate having a first display region, a step of forming a second substrate having a second display region, and the first substrate. A sealing step of fixing the second substrate with a certain gap so that the first display region and the second display region face each other; and extending from an end portion of the second substrate of the first substrate. A first thermocompression bonding step in which the first component is mounted on the first connection portion in the existing extension portion; and a second heat in which the second component is mounted on the second connection portion in the extension portion of the first substrate. A pressure bonding step, and the second thermocompression bonding step includes a thermocompression bonding step of heating the first connection portion simultaneously with heating the second connection portion.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the display apparatus which prevents the mounting defect of an integrated circuit and improves a manufacturing yield can be provided.

  Hereinafter, a method for manufacturing a display device according to an embodiment of the present invention will be described with reference to the drawings. A method for manufacturing a display device according to an embodiment of the present invention is a method for manufacturing a liquid crystal display device including a liquid crystal display panel 1 having a substantially rectangular flat plate shape as shown in FIG.

  As shown in FIG. 2, the liquid crystal display panel 1 includes a pair of substrates arranged opposite to each other, that is, an array substrate 3 and a counter substrate 4, and a liquid crystal layer 5 held as a light modulation layer between the pair of substrates. And is composed of.

  The liquid crystal display panel 1 includes a substantially rectangular display unit 6 that displays an image. The display unit 6 includes a plurality of display pixels PX arranged in a matrix.

  The array substrate 3 has a first display area 6 </ b> A that constitutes a part of the display unit 6. The first display region 6A is arranged along wirings, for example, a plurality of scanning lines Y (1, 2, 3,..., M) extending along the row direction of the display pixels PX, and the column direction of the display pixels PX. A plurality of extending signal lines X (1, 2, 3,..., N) are provided.

  In addition, in the first display area 6A, the array substrate 3 has a switching element 7 and a switching element 7 arranged for each display pixel PX in the vicinity of the intersection of the scanning line Y and the signal line X in addition to these various wirings. The pixel electrode 8 etc. connected to are provided.

  The gate electrode 7G of the switching element 7 is electrically connected to the corresponding scanning line Y (or formed integrally with the scanning line). The source electrode 7S of the switching element 7 is electrically connected to the corresponding signal line X (or formed integrally with the signal line). The drain electrode 7D of the switching element 7 is electrically connected to the pixel electrode 8 of the corresponding display pixel PX. The surface of the pixel electrode 8 is covered with an alignment film 16A.

  The array substrate 3 includes a drive IC chip 11 that is disposed outside the first display area 6 </ b> A and supplies a drive signal to the display unit 6. In the example shown in FIG. 1, the driving IC chip 11 is disposed on the extending portion 3 </ b> A of the array substrate 3 that extends outward from the end portion 4 </ b> E of the counter substrate 4.

  In addition, the array substrate 3 is connected to a flexible wiring substrate FPC that supplies drive signals and power signals to the drive IC chip 11 and the display unit 6. In the example shown in FIG. 1, the flexible wiring board FPC is formed on the extending portion 3 </ b> A similarly to the driving IC chip 11.

  A wiring extending to the display unit 6 is connected to the driving IC chip 11. These wirings correspond to a part of the common wiring for supplying a common potential in addition to the signal line X and the scanning line Y.

  The counter substrate 4 has a second display region 6 </ b> B that constitutes a part of the display unit 6. The second display region 6B includes a counter electrode 9 common to all display pixels PX. The counter electrode 9 is formed of a light-transmitting conductive member such as indium tin oxide (ITO). The surface of the counter electrode 9 is covered with an alignment film 16B.

  The array substrate 3 and the counter substrate 4 are arranged in a state where the alignment film 16A on the pixel electrode 8 and the alignment film 16B on the counter electrode 9 are opposed to each other, and the seal member 15 is interposed between them with the liquid crystal layer 5 interposed therebetween. Are pasted together. The liquid crystal layer 5 is formed of a liquid crystal composition sealed in the space between the array substrate 3 and the counter substrate 4.

  A polarizing plate 14 is attached to the main surface of the first display area 6 </ b> A of the array substrate 3 and the second display area 6 </ b> B of the counter substrate 4 opposite to the liquid crystal layer 5.

  The liquid crystal display panel 1 of the color display type liquid crystal display device has a plurality of types of display pixels, for example, a red pixel that displays red, a green pixel that displays green, and a blue pixel that displays blue. That is, the red pixel includes a red color filter CFR that transmits light having a red main wavelength. The green pixel includes a green color filter CFG that transmits light having a green dominant wavelength. The blue pixel includes a blue color filter CFB that transmits light having a blue main wavelength. The color filter layer CF composed of these color filters CFR, CFG, and CFB is disposed on the main surface of the second display region 6B on the liquid crystal layer 5 side.

  A light shielding layer 13 is formed between the color filters CFR, CFG, and CFB (that is, between display pixels) and around the second display region 6B. The light shielding layer 13 formed between the color filters CFR, CFG, and CFB is disposed so as to face the signal lines X and the scanning lines Y on the array substrate 3. For example, the light shielding layer 13 is formed of a colored resin colored black.

  Next, a method for manufacturing the liquid crystal display panel 1 will be described. First, the array substrate 3 is manufactured. First, a transparent insulating substrate for forming the array substrate 3 is prepared. After forming a metal film such as molybdenum on the insulating substrate, the metal film is patterned.

  Thereby, the gate electrode 7G of the switching element 7 and the scanning line Y are formed in the first display region 6A, and various wirings extending from the first display region 6A to the extending portion 3A are formed as necessary. In this patterning step, for example, an etching process such as a chemical wet method such as phosphoric acid / nitric acid / acetic acid mixed solution is applied.

  Subsequently, after an insulating material such as silicon nitride or silicon oxide is formed on the metal film, the insulating material is patterned to form contact holes or the like as necessary. Thereafter, after a metal film such as aluminum is formed on the insulating material, the metal film is patterned.

  Thereby, the source electrode 7S, the drain electrode 7D, the signal line X, and the like of the switching element 7 are formed in the first display region 6A. In this patterning step, for example, a dry etching process is applied.

  Subsequently, after an insulating material such as silicon nitride or silicon oxide is formed on the metal film, the insulating material is patterned to form contact holes or the like as necessary. Then, after depositing a metal film such as ITO on the insulating material, the metal film is patterned. Thereby, the pixel electrode 8 is formed in the first display area 6A, and the connection portion CN2 of the flexible wiring board FPC and the connection portion CN1 of the drive IC chip 11 are formed in the extending portion 3A.

  Subsequently, the counter substrate 4 is manufactured. That is, a transparent insulating substrate is prepared. After that, the colored resin film formation and patterning are repeated on the insulating substrate to form the light shielding layer 13 and the color filter layer CF in the second display region 6B. Further, the second display region 6B including the counter electrode 9, the alignment film 16B, and the like is formed on the color filter layer CF by repeatedly forming and patterning a metal film or an insulating film.

  Subsequently, the array substrate 3 and the counter substrate 4 are arranged so that the first display region 6A of the array substrate 3 and the second display region 6B of the counter substrate 4 face each other, and the first display region 6A and the second display region are arranged. These are pasted together by the sealing member 15 in a state where a space for enclosing the liquid crystal layer 5 is formed between the sealing member 15 and the liquid crystal layer 5. In this state, the array substrate 3 and the counter substrate 4 are etched by chemical polishing or the like as necessary to thin the insulating substrate. A liquid crystal layer is injected into the space between the first display area 6A and the second display area 6B, and the injection port is closed.

  Next, the drive IC chip 11 is mounted. First, an anisotropic conductive film (ACF) BD is arranged on the array substrate 3 connection portion CN1. Subsequently, the drive IC chip 11 is aligned on the connection portion CN1 via the anisotropic conductive film BD, and the first connection portion CN1 is heated and pressed from the drive IC chip 11 using the COG heating tool TL1. The driving IC chip 11 is fixed to the connection part CN1.

  Subsequently, the flexible wiring board FPC is mounted. First, the anisotropic conductive film BD is disposed on the connection portion CN2 of the array substrate 3. Subsequently, the connection region of the flexible wiring board FPC is aligned on the connection part CN2 via the anisotropic conductive film BF.

  Subsequently, as shown in FIG. 3, the FIC heating tool TL2 is used to heat and pressurize the second connection portion CN2 from the connection area of the flexible printed circuit board FPC, and at the same time, the COG heating tool TL1 is used to drive the IC chip. 11, the first connection part CN1 is heated and pressed from above to mount the flexible wiring board FPC, and the liquid crystal display panel 1 is manufactured.

  The thickness of the insulating substrate of the array substrate 3 of the liquid crystal display panel 1 formed as described above (width in the direction orthogonal to the substrate surface) is approximately 0.2 mm, and the insulating substrate of the counter substrate 4 The thickness of the driving IC chip is about 0.2 mm.

  When the liquid crystal display device is manufactured as described above, only the connection part CN2 and its periphery are not locally heated when the flexible wiring board FPC is mounted. That is, by heating the mounting location of the driving IC chip 11 when the flexible wiring board FPC is mounted, the temperature difference between the mounting location of the flexible wiring board FPC and the mounting location of the driving IC chip 11 is reduced.

  For example, when the temperature of the connection part CN1, the connection part CN2, and the array substrate 3 in the vicinity thereof before heating and pressurizing the connection area of the flexible wiring board FPC is approximately 25 degrees, the connection area of the flexible wiring board FPC Immediately after the drive IC chip 11 is heated and pressurized, the temperature of the connection portion CN1, the connection portion CN2, and the array substrate 3 in the vicinity thereof becomes approximately 200 degrees.

  After a certain period of time has elapsed after heating for mounting the flexible wiring board FPC, the temperature of the connection portion CN1, the connection portion CN2, and the array substrate 3 in the vicinity thereof becomes approximately 100 degrees, and the connection portion CN2 and the vicinity thereof are There is no local high temperature.

  Accordingly, heat is transferred from the high-temperature region in the connection portion CN2 and the vicinity thereof to the low-temperature region in the connection portion CN1 and the vicinity thereof, and the drive IC chip 11 is stretched and the anisotropic conductive film BD is softened. Disappears.

  As a result, it is possible to reduce the occurrence of internal stress due to thermal contraction of the anisotropic conductive film BD, the driving IC chip 11 and the insulating substrate, and warpage due to heat, etc. during cooling after heating for mounting the flexible wiring board FPC. This makes it possible to prevent mounting defects such as mounting peeling of the driving IC chip 11 at the connection portion CN1 of the driving IC chip 11, and improve the manufacturing yield.

  That is, according to the method for manufacturing a display device according to the present embodiment, it is possible to provide a method for manufacturing a display device that can prevent defective mounting of an integrated circuit and improve the manufacturing yield.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. For example, in the method of manufacturing the display device according to the above embodiment, when the flexible wiring board FPC is thermocompression bonded to the array substrate 3, the driving IC chip 11 that has already been thermocompression bonded is simultaneously heated and pressurized. If there is a circuit or the like that has already been thermocompression bonded other than the drive IC chip 11, mounting failure can be avoided by simultaneously heating and pressurizing the circuit or the like at the time of thermocompression bonding of the flexible wiring board FPC.

  Further, when the driving IC chip 11 is mounted after the flexible wiring board FPC is mounted, the connection area of the flexible wiring board FPC and the driving IC chip 11 are simultaneously heated and pressurized when the driving IC chip 11 is mounted. As a result, mounting failure of the flexible wiring board FPC can be avoided.

  In the above-described embodiment, the method for manufacturing the liquid crystal display device has been described. However, even if it is a method for manufacturing another display device, it may be a method for manufacturing a display device having a plurality of steps for mounting components by thermocompression bonding. By applying the present invention, it is possible to obtain the same effects as those of the display device manufacturing method according to the above-described embodiment.

  Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

1 is a plan view schematically showing a liquid crystal display panel of a liquid crystal display device according to a first embodiment of the present invention. The figure which shows an example of the cross section which cut | disconnected the liquid crystal display panel shown in FIG. 1 along AA. The figure for demonstrating an example of the manufacturing method of the liquid crystal display panel shown in FIG.

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display panel, 3 ... Array substrate, 3A ... Extension part, 4 ... Counter substrate, 4E ... End part, 6 ... Display part, 6A ... 1st display area, 6B ... 2nd display part, 11 ... Drive IC Chip, FPC ... Flexible wiring board

Claims (3)

A first substrate manufacturing step of forming a first substrate having a first display area;
A second substrate manufacturing step of forming a second substrate having a second display area;
A sealing step of fixing the first substrate and the second substrate with a certain gap so that the first display region and the second display region face each other;
A first thermocompression bonding step of mounting the first component on the first connecting portion in an extending portion extending from an end portion of the second substrate of the first substrate;
A second thermocompression bonding step of mounting the second component on the second connection portion in the extended portion of the first substrate,
The method for manufacturing a display device, wherein the second thermocompression bonding step includes a thermocompression bonding step of heating the first connection portion simultaneously with heating the second connection portion.   The method for manufacturing a display device according to claim 1, wherein the first component is an integrated circuit that supplies a drive signal to the first display area, and the second component is a flexible wiring board.   3. The display device manufacturing method according to claim 1, further comprising a sealing step of sealing a liquid crystal material in a gap between the first substrate and the second substrate after the sealing step.

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