JP2010178491A

JP2010178491A - Electrical junction box

Info

Publication number: JP2010178491A
Application number: JP2009017989A
Authority: JP
Inventors: Noboru Chin; 登陳; Minoru Fukuyama; 穂福山; Shigeki Yamane; 茂樹山根; Hirotoshi Maeda; 広利前田; Takehiro Mizuno; 雄大水野
Original assignee: Sumitomo Wiring Systems Ltd; AutoNetworks Technologies Ltd; Sumitomo Electric Industries Ltd
Current assignee: Sumitomo Wiring Systems Ltd; AutoNetworks Technologies Ltd; Sumitomo Electric Industries Ltd
Priority date: 2009-01-29
Filing date: 2009-01-29
Publication date: 2010-08-12

Abstract

PROBLEM TO BE SOLVED: To provide an electrical junction box that is miniaturized. SOLUTION: The electrical junction box has a structure in which an opening 24 is formed on a circuit board 17, a first conductive member 22 made of a metal plate material and electrically connected to a power supply 60 and a second conductive member 32 stacked on the first conductive member 22 via an insulative first insulation part 33, made of a metal plate material and electrically connected to a load 61 are arranged in the opening 24, the circuit board 17, the first conductive member 22 and the second conductive member 32 are insulated by an insulative second insulating member 23, an input terminal 30 of a semiconductor relay 19 is connected to the first conductive member 22, and an output terminal 34 of the semiconductor relay 19 is connected to the second conductive member 32. COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電気接続箱に関する。 The present invention relates to an electrical junction box.

従来、車載用の電気接続箱として、特許文献１に記載のものが知られている。この電気接続箱は、電源と、ランプ、ホーン等の負荷との間に配されて、負荷のスイッチングを実行する。電気接続箱は、ケースと、ケース内に収容された回路基板と、回路基板に実装されて、負荷のスイッチングを実行するスイッチング素子と、を備える。 Conventionally, the thing of patent document 1 is known as a vehicle-mounted electrical junction box. This electric junction box is arranged between a power source and a load such as a lamp or a horn, and executes switching of the load. The electrical junction box includes a case, a circuit board accommodated in the case, and a switching element that is mounted on the circuit board and performs load switching.

回路基板に形成された銅箔パターンには、電源と電気的に接続可能なバスバーが接続されている。バスバーと接続された銅箔パターンには、スイッチング素子の入力端子が接続されている。また、スイッチング素子の出力端子は、バスバーが接続された銅箔パターンとは異なる銅箔パターンに接続されている。出力端子が接続された銅箔パターンは、回路基板上を配索されて、負荷と電気的に接続可能なコネクタ端子に接続されている。 A bus bar that can be electrically connected to a power source is connected to the copper foil pattern formed on the circuit board. The input terminal of the switching element is connected to the copper foil pattern connected to the bus bar. The output terminal of the switching element is connected to a copper foil pattern different from the copper foil pattern to which the bus bar is connected. The copper foil pattern to which the output terminal is connected is wired on the circuit board and connected to a connector terminal that can be electrically connected to the load.

また、回路基板には、スイッチング素子のオンオフを制御する制御回路が形成されており、この制御回路は、スイッチング素子の制御端子と電気的に接続されている。 In addition, a control circuit for controlling on / off of the switching element is formed on the circuit board, and this control circuit is electrically connected to a control terminal of the switching element.

特開２００８−１２５１９０公報JP 2008-125190 A

上記の構成によると、回路基板の銅箔パターンには、電源からの電流と、負荷への電流とが流れる。これらの電流は比較的に大きな電流なので、銅箔パターンの抵抗を低くして銅箔パターンからの発熱を抑制するためには、銅箔パターンを幅広に形成する必要がある。すると、回路基板において、制御回路を作成するための領域が相対的に狭くなる。このため、必要な制御回路を回路基板に作成しようとすると、回路基板を比較的に大きくしなければならず、電気接続箱を小型化することが難しいという問題があった。 According to said structure, the electric current from a power supply and the electric current to load flow into the copper foil pattern of a circuit board. Since these currents are relatively large, in order to reduce the resistance of the copper foil pattern and suppress heat generation from the copper foil pattern, it is necessary to form the copper foil pattern wide. Then, the area for creating the control circuit in the circuit board becomes relatively narrow. For this reason, when an attempt is made to create a necessary control circuit on a circuit board, the circuit board has to be made relatively large, and there is a problem that it is difficult to downsize the electrical junction box.

本発明は上記のような事情に基づいて完成されたものであって、小型化された電気接続箱を提供することを目的とする。 The present invention has been completed based on the above circumstances, and an object thereof is to provide a miniaturized electrical junction box.

本発明は、電源と負荷との間に配される電気接続箱であって、ケースと、前記ケース内に収容された回路基板と、前記回路基板に実装されて前記負荷に対するスイッチングを実行するスイッチング素子と、を備え、前記回路基板には開口部が形成されており、前記開口部内には、金属板材からなり前記電源に電気的に接続される第１導電部材と、前記第１導電部材に絶縁性の第１絶縁部を介して積層され、且つ、金属板材からなると共に前記負荷に電気的に接続される第２導電部材とが配されており、前記回路基板と、前記第１導電部材及び前記第２導電部材との間は絶縁性の第２絶縁部によって絶縁されており、前記第１導電部材には前記スイッチング素子の入力端子が接続されており、前記第２導電部材には前記スイッチング素子の出力端子が接続されている。 The present invention is an electrical junction box arranged between a power source and a load, and includes a case, a circuit board accommodated in the case, and a switching mounted on the circuit board to perform switching on the load An opening is formed in the circuit board, and a first conductive member made of a metal plate material and electrically connected to the power source is formed in the opening, and the first conductive member A second conductive member that is laminated via an insulating first insulating part and is made of a metal plate and is electrically connected to the load is disposed, and the circuit board and the first conductive member And the second conductive member are insulated by an insulating second insulating portion, the input terminal of the switching element is connected to the first conductive member, and the second conductive member is connected to the second conductive member. Output of switching element The child is connected.

本発明によれば、電源からの電流は第１導電部材を流れ、負荷への電流は第２導電部材を流れる。上記の第１導電部材及び第２導電部材は回路基板に形成された開口部内に配されているので、回路基板上には、比較的に大きな電流を流すための導電路を形成しなくてもよい。これにより、比較的に幅広な導電路を回路基板上に形成しなくてもよいので、回路基板を小型化できる。この結果、電気接続箱を小型化できる。 According to the present invention, the current from the power source flows through the first conductive member, and the current to the load flows through the second conductive member. Since the first conductive member and the second conductive member are disposed in the opening formed in the circuit board, it is not necessary to form a conductive path for flowing a relatively large current on the circuit board. Good. This eliminates the need to form a relatively wide conductive path on the circuit board, thereby reducing the size of the circuit board. As a result, the electrical junction box can be reduced in size.

また、第１導電部材、及び第２導電部材は金属板材からなるので、同じ回路を回路基板上に銅箔パターンで形成する場合に比べて、幅狭に形成できる。このため、回路基板の小型化が可能であり、電気接続箱を小型化できる。 Further, since the first conductive member and the second conductive member are made of a metal plate material, the same circuit can be formed narrower than the case where the same circuit is formed on the circuit board with a copper foil pattern. For this reason, the circuit board can be miniaturized, and the electrical junction box can be miniaturized.

また、第１導電部材と第２導電部材とは積層されているので、第１導電部材と第２導電部材とを並べて配する場合に比べて配線密度を向上させることができる。これにより、電気接続箱を小型化できる Further, since the first conductive member and the second conductive member are laminated, the wiring density can be improved as compared with the case where the first conductive member and the second conductive member are arranged side by side. Thereby, the electrical junction box can be reduced in size.

本発明の実施態様としては以下の態様が好ましい。
前記回路基板には前記スイッチング素子のオンオフを制御する制御部が設けられており、前記制御部には前記スイッチング素子の制御端子が電気的に接続されていることが好ましい。 As embodiments of the present invention, the following embodiments are preferable.
Preferably, the circuit board is provided with a control unit that controls on / off of the switching element, and a control terminal of the switching element is electrically connected to the control unit.

上記の態様によれば、１枚の回路基板上に、電源から負荷へと電力を供給する電力回路と、スイッチング素子のオンオフを制御する制御部とが設けられている。これにより、電力回路と制御部とをそれぞれ異なった回路基板に設ける場合に比べて、全体として電気接続箱を小型化できる。 According to said aspect, the power circuit which supplies electric power from a power supply to a load, and the control part which controls on-off of a switching element are provided on the circuit board of 1 sheet. Thereby, compared with the case where a power circuit and a control part are each provided in a different circuit board, an electric junction box can be reduced in size as a whole.

前記入力端子は前記スイッチング素子の裏面に形成されており、前記スイッチング素子の裏面と前記第１導電部材とが接続されていることが好ましい。 Preferably, the input terminal is formed on the back surface of the switching element, and the back surface of the switching element and the first conductive member are connected.

上記の態様によれば、通電時にスイッチング素子で発生した熱は、スイッチング素子の裏面に形成された入力端子から、第１導電部材に速やかに伝達され、第１導電部材に拡散される。これにより、スイッチング素子の近傍に熱がこもり、局所的に高温になることを抑制できる。 According to said aspect, the heat which generate | occur | produced in the switching element at the time of electricity supply is rapidly transmitted to the 1st conductive member from the input terminal formed in the back surface of the switching element, and is spread | diffused to the 1st conductive member. As a result, it is possible to suppress heat from being accumulated in the vicinity of the switching element and locally becoming high temperature.

前記ケースには、前記電源に接続された入力ワイヤーハーネスと接続可能な入力コネクタ部が設けられており、前記入力コネクタ部内には入力コネク端子の一方の端部が配されており、前記入力コネクタ端子の他方の端部は、前記ケース内に導入されて、前記第１導電部材に電気的に接続されていることが好ましい。 The case is provided with an input connector portion connectable to an input wire harness connected to the power source, and one end portion of an input connector terminal is arranged in the input connector portion, and the input connector The other end of the terminal is preferably introduced into the case and electrically connected to the first conductive member.

上記の態様によれば、入力コネクタ部から第１導電部材に至るまでの導電路の配索経路を簡素化できる。 According to said aspect, the wiring path | route of the conductive path from an input connector part to a 1st conductive member can be simplified.

前記ケースには、前記負荷に接続された出力ワイヤーハーネスと接続可能な出力コネクタ部が設けられており、前記出力コネクタ部内には出力コネク端子の一方の端部が配されており、前記出力コネクタ端子の他方の端部は、前記ケース内に導入されて、前記第２導電部材に電気的に接続されていることが好ましい。 The case is provided with an output connector portion connectable to an output wire harness connected to the load, and one end portion of an output connector terminal is arranged in the output connector portion, and the output connector The other end of the terminal is preferably introduced into the case and electrically connected to the second conductive member.

上記の態様によれば、出力コネクタ部から第２導電部材に至るまでの導電路の配索経路を簡素化できる。 According to said aspect, the wiring path | route of the conductive path from an output connector part to a 2nd conductive member can be simplified.

本発明によれば、電気接続箱を小型化できる。 According to the present invention, the electrical junction box can be reduced in size.

本発明の実施形態１に係る電気接続箱を示す全体斜視図1 is an overall perspective view showing an electrical junction box according to Embodiment 1 of the present invention. 電気接続箱を示す分解斜視図Exploded perspective view showing electrical junction box 電気接続箱を示す正面図Front view showing the electrical junction box 図３におけるＩＶ−ＩＶ線断面図IV-IV line sectional view in FIG. 図３におけるＶ−Ｖ線断面図VV line sectional view in FIG. 回路基板に第１導電部材及び第２導電部材を組み付けた状態を示す正面図The front view which shows the state which assembled | attached the 1st conductive member and the 2nd conductive member to the circuit board. 図６におけるＶＩＩ−ＶＩＩ線断面図VII-VII line sectional view in FIG. 図６におけるＶＩＩＩ−ＶＩＩＩ線断面図VIII-VIII sectional view taken on the line in FIG. 図６におけるＩＸ−ＩＸ線断面図IX-IX line sectional view in FIG. 第１導電部材と、第２導電部材との組み付け状態を示す斜視図The perspective view which shows the assembly | attachment state of a 1st conductive member and a 2nd conductive member 回路基板と、第１導電部材及び第２導電部材との組み付け状態を示す斜視図The perspective view which shows the assembly | attachment state of a circuit board, a 1st conductive member, and a 2nd conductive member. 回路基板と、第１導電部材及び第２導電部材とを組み付けた状態を示す斜視図The perspective view which shows the state which assembled | attached the circuit board, the 1st conductive member, and the 2nd conductive member. 下型に第１導電部材を載置する状態を示す断面図Sectional drawing which shows the state which mounts the 1st electroconductive member in a lower mold | type 第１導電部材に第２導電部材を載置する状態を示す断面図Sectional drawing which shows the state which mounts a 2nd conductive member in a 1st conductive member 第１導電部材及び第２導電部材を上型及び下型内に収容した状態を示す断面図Sectional drawing which shows the state which accommodated the 1st conductive member and the 2nd conductive member in the upper mold | type and the lower mold | type. 回路基板と、第１導電部材及び第２導電部材との組み付け状態を示す断面図Sectional drawing which shows the assembly | attachment state of a circuit board, a 1st conductive member, and a 2nd conductive member 回路基板と、第１導電部材及び第２導電部材とを組み付けた状態を示す断面図Sectional drawing which shows the state which assembled | attached the circuit board, the 1st conductive member, and the 2nd conductive member. 本発明の実施形態２に係る電気接続箱を示す断面図Sectional drawing which shows the electrical-connection box which concerns on Embodiment 2 of this invention. 本発明の実施形態３に係る回路構成体において、第１導電部材と第２導電部材を組み付けた状態を示す断面図Sectional drawing which shows the state which assembled | attached the 1st conductive member and the 2nd conductive member in the circuit structure based on Embodiment 3 of this invention.

＜実施形態１＞
本発明の実施形態１を、図１ないし図１７を参照しつつ説明する。本実施形態は、車載用の電気接続箱１０であって、電源６０（図５参照）と、ランプ、ホーン等の負荷６１（図４参照）との間に配設されて、負荷６１のスイッチングを実行する。この電気接続箱１０は、合成樹脂製のケース１１内に回路構成体１２を収容してなる。なお、以下の説明においては、図４における左側を表側とし、右側を裏側として説明する。 <Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 17. The present embodiment is an on-vehicle electrical junction box 10 that is disposed between a power source 60 (see FIG. 5) and a load 61 (see FIG. 4) such as a lamp and a horn, and switches the load 61. Execute. The electrical junction box 10 is configured by housing a circuit component 12 in a case 11 made of synthetic resin. In the following description, the left side in FIG. 4 is described as the front side, and the right side is described as the back side.

（ケース１１）
図４に示すように、ケース１１は、表側（図４に置ける左側）に開口するケース本体１３と、このケース本体１３の開口を表側から塞ぐカバー１４と、を備える。図２に示すように、ケース本体１３は、表裏方向（図２における上下方向）から見て略五角形状をなしている。 (Case 11)
As shown in FIG. 4, the case 11 includes a case main body 13 that opens on the front side (left side in FIG. 4), and a cover 14 that closes the opening of the case main body 13 from the front side. As shown in FIG. 2, the case body 13 has a substantially pentagonal shape when viewed from the front and back directions (vertical direction in FIG. 2).

図４に示すように、カバー１４には、図４における上端部寄りの位置に、図４における下方に開口すると共に、図示しない相手側コネクタが嵌合可能なコネクタ部１５が形成されている。コネクタ部１５にはコネクタ端子１６がコネクタ部１５と一体にモールド成形されている。図２に示すように、カバー１４には、複数のコネクタ部１５がカバー１４と一体に形成されている。 As shown in FIG. 4, the cover 14 is formed with a connector portion 15 that opens downward in FIG. 4 and can be fitted with a mating connector (not shown) at a position near the upper end portion in FIG. Connector terminals 16 are molded integrally with the connector portion 15 in the connector portion 15. As shown in FIG. 2, the cover 14 has a plurality of connector portions 15 formed integrally with the cover 14.

図４に示すように、ケース本体１３の側壁の端縁と、カバー１４の側壁の端縁とは、互いに当接された状態で超音波溶着によって接合されている。これにより、ケース本体１３とカバー１４とは一体に組み付けられる。 As shown in FIG. 4, the end edge of the side wall of the case body 13 and the end edge of the side wall of the cover 14 are joined by ultrasonic welding while being in contact with each other. Thereby, the case main body 13 and the cover 14 are assembled | attached integrally.

（回路構成体１２）
図２に示すように、回路構成体１２は、回路基板１７と、回路基板１７の表面１８に実装された半導体リレー１９（特許請求の範囲に記載のスイッチング素子に相当）と、を有する。回路基板１７の表面１８には、プリント配線技術により導電路（図示せず）が形成されている。回路基板１７は、表裏方向（図２における上下方向）から見て、略矩形状をなしている。 (Circuit structure 12)
As illustrated in FIG. 2, the circuit configuration body 12 includes a circuit board 17 and a semiconductor relay 19 (corresponding to a switching element described in claims) mounted on a surface 18 of the circuit board 17. A conductive path (not shown) is formed on the surface 18 of the circuit board 17 by a printed wiring technique. The circuit board 17 has a substantially rectangular shape when viewed from the front and back direction (vertical direction in FIG. 2).

図４に示すように、回路基板１７の導電路には、半導体リレー１９の側縁から外方（本実施形態では図４における下方）に突出する制御端子２０が、半田付け等の公知の手法により電気的に接続されている。 As shown in FIG. 4, a control terminal 20 that protrudes outward (downward in FIG. 4 in this embodiment) from the side edge of the semiconductor relay 19 is provided in the conductive path of the circuit board 17 in a known method such as soldering. Are electrically connected.

（第１導電部材２２）
図４に示すように、回路基板１７の裏面２１（図４における右側面）には、金属板材からなる第１導電部材２２が積層されている。第１導電部材２２は、銅、銅合金等の金属板材に鍛造、鋳造、プレス加工、切削加工、圧延加工等を実行することにより所定の形状に形成される。回路基板１７と第１導電部材２２との間には、絶縁性の合成樹脂からなる第２絶縁部２３が介されている。第２絶縁部２３は、第１導電部材２２と回路基板１７とをモールド成形することにより形成される。 (First conductive member 22)
As shown in FIG. 4, a first conductive member 22 made of a metal plate material is laminated on the back surface 21 (the right side surface in FIG. 4) of the circuit board 17. The first conductive member 22 is formed in a predetermined shape by performing forging, casting, pressing, cutting, rolling, or the like on a metal plate material such as copper or a copper alloy. A second insulating part 23 made of an insulating synthetic resin is interposed between the circuit board 17 and the first conductive member 22. The second insulating portion 23 is formed by molding the first conductive member 22 and the circuit board 17.

図４に示すように、第１導電部材２２は、回路基板１７のうち図４における上端部寄りの位置に配設されている。回路基板１７のうち図４における上端部寄りの位置には開口部２４が回路基板１７を貫通して形成されている。第１導電部材２２は、開口部２４を裏側（図４における右側）から塞ぐように配設されており、開口部２４内には第１導電部材２２の少なくとも一部が配されている。 As shown in FIG. 4, the first conductive member 22 is disposed at a position near the upper end portion in FIG. 4 of the circuit board 17. An opening 24 is formed through the circuit board 17 at a position near the upper end in FIG. The first conductive member 22 is disposed so as to close the opening 24 from the back side (the right side in FIG. 4), and at least a part of the first conductive member 22 is disposed in the opening 24.

図６に示すように、回路基板１７には、開口部２４の周囲に、回路基板１７を貫通する基板側樹脂充填孔２５が形成されている。また、図６に示すように、第１導電部材２２には、回路基板１７の正規位置に第１導電部材２２を組み付けた状態で、回路基板１７の基板側樹脂充填孔２５に対応する位置に、導電部材側樹脂充填孔２６が形成されている。図６に示すように、基板側樹脂充填孔２５、及び導電部材側樹脂充填孔２６の双方には、モールド成形により第２絶縁部２３を構成する合成樹脂材が充填されている。これにより、回路基板１７と第１導電部材２２とが剥離することが抑制されるようになっている。 As shown in FIG. 6, the circuit board 17 has a substrate-side resin filling hole 25 penetrating the circuit board 17 around the opening 24. In addition, as shown in FIG. 6, the first conductive member 22 is positioned at a position corresponding to the board-side resin filling hole 25 of the circuit board 17 in a state where the first conductive member 22 is assembled at a normal position of the circuit board 17. The conductive member side resin filling hole 26 is formed. As shown in FIG. 6, both the substrate side resin filling hole 25 and the conductive member side resin filling hole 26 are filled with a synthetic resin material constituting the second insulating portion 23 by molding. As a result, the circuit board 17 and the first conductive member 22 are prevented from peeling off.

図４に示すように、回路基板１７の開口部２４に対応する位置には、表側（図４における左側）に突出する凸部２７が形成されている。凸部２７のうち、第１導電部材２２の板面から立ち上がる側面２８は、第１導電部材２２の板面から実質的に垂直に突出している。実質的に垂直とは、凸部２７の側面２８と第１導電部材２２の板面とが垂直である場合を含むと共に、垂直でなくとも、略垂直であると認められる場合を含む。 As shown in FIG. 4, a convex portion 27 protruding to the front side (left side in FIG. 4) is formed at a position corresponding to the opening 24 of the circuit board 17. Of the convex portion 27, the side surface 28 rising from the plate surface of the first conductive member 22 protrudes substantially vertically from the plate surface of the first conductive member 22. The term “substantially vertical” includes the case where the side surface 28 of the convex portion 27 and the plate surface of the first conductive member 22 are vertical, and includes the case where it is recognized that the side surface 28 is substantially vertical.

図６に示すように、凸部２７は、図６における左右方向に細長く延びて形成されている。開口部２４の口縁は、凸部２７の端縁に倣った形状に形成されている。凸部２７と回路基板１７の開口部２４との間には、第２絶縁部２３を構成する合成樹脂材が充填されている。 As shown in FIG. 6, the convex portion 27 is formed to be elongated in the left-right direction in FIG. The lip of the opening 24 is formed in a shape that follows the end edge of the convex portion 27. A synthetic resin material constituting the second insulating portion 23 is filled between the convex portion 27 and the opening 24 of the circuit board 17.

図４に示すように、凸部２７の突出端面２９（図４における左端面）は、回路基板１７の表面１８と実質的に同じ高さ位置に配されている。また、回路基板１７の開口縁と、第１導電部材２２との間に充填されている第２絶縁部２３のうち回路基板１７の表面１８側に露出している部分についても、回路基板１７の表面１８と実質的に同じ高さ位置に配されている。なお、実質的に同じ高さとは、凸部２７の突出端面２９及び第２絶縁部２３の表面と、回路基板１７の表面１８とが、同じ高さである場合を含むと共に、同じ高さでなくとも、略同じと認められる程度である場合も含む。 As shown in FIG. 4, the protruding end surface 29 (left end surface in FIG. 4) of the convex portion 27 is disposed at the substantially same height as the surface 18 of the circuit board 17. Further, the portion of the second insulating portion 23 that is filled between the opening edge of the circuit board 17 and the first conductive member 22 is exposed to the surface 18 side of the circuit board 17. It is disposed at substantially the same height as the surface 18. The substantially same height includes the case where the protruding end surface 29 of the convex portion 27 and the surface of the second insulating portion 23 and the surface 18 of the circuit board 17 have the same height, and the same height. In some cases, it is included in the case where it is recognized as substantially the same.

図４に示すように、凸部２７の突出端面２９には、半導体リレー１９の裏面（図４における右側面）に形成された入力端子３０が半田付け等の公知の手法により電気的に接続されている。 As shown in FIG. 4, an input terminal 30 formed on the back surface (right side surface in FIG. 4) of the semiconductor relay 19 is electrically connected to the projecting end surface 29 of the convex portion 27 by a known method such as soldering. ing.

なお、図１５に示すように、第１導電部材２２には、後述する第２導電部材３２とのモールド成形時に金型が挿通される金型挿通孔３１が、第１導電部材２２を貫通して形成されている。 As shown in FIG. 15, the first conductive member 22 has a mold insertion hole 31 through which the mold is inserted when molding with the second conductive member 32 described later. Is formed.

（第２導電部材３２）
図４に示すように、第１導電部材２２のうち回路基板１７の開口部２４に対応する位置には、第１導電部部材の表面（回路基板１７側の面であって、図４における左側面）に、金属板材からなる第２導電部材３２が積層されている。第２導電部材３２は、銅、銅合金等の金属板材に鍛造、鋳造、プレス加工、切削加工、圧延加工等を実行することにより所定の形状に形成される。第１導電部材２２と第２導電部材３２との間には、絶縁性の合成樹脂材からなる第１絶縁部３３が介されている。第１絶縁部３３は、第１導電部材２２と第２導電部材３２とをモールド成形することにより形成される。 (Second conductive member 32)
As shown in FIG. 4, a position corresponding to the opening 24 of the circuit board 17 in the first conductive member 22 is located on the surface of the first conductive member (the surface on the circuit board 17 side, the left side in FIG. 4). The second conductive member 32 made of a metal plate is laminated on the surface). The second conductive member 32 is formed into a predetermined shape by performing forging, casting, pressing, cutting, rolling, or the like on a metal plate material such as copper or copper alloy. A first insulating part 33 made of an insulating synthetic resin material is interposed between the first conductive member 22 and the second conductive member 32. The first insulating portion 33 is formed by molding the first conductive member 22 and the second conductive member 32.

図６に示すように、１つの第１導電部材２２に、複数（本実施形態においては５つ）の第２導電部材３２が積層されている。各第２導電部材３２は図６における左右方向に間隔を空けて並んで配されている。各第２導電部材３２の隙間には、第１絶縁部３３を構成する合成樹脂材が充填されている。また、回路基板１７に形成された開口部２４の口縁は、第２導電部材３２の端縁に倣った形状に形成されている。 As shown in FIG. 6, a plurality of (in the present embodiment, five) second conductive members 32 are stacked on one first conductive member 22. The second conductive members 32 are arranged side by side in the left-right direction in FIG. A gap between each second conductive member 32 is filled with a synthetic resin material constituting the first insulating portion 33. Further, the edge of the opening 24 formed in the circuit board 17 is formed in a shape following the edge of the second conductive member 32.

図４に示すように、第２導電部材３２の表面（図４における左側面）には、半導体リレー１９の側縁から外方（本実施形態では図４における上方）に突出する出力端子３４が、半田付け等の公知の手法により電気的に接続されている。第２導電部材３２の表面は、出力端子３４が接続される接続面３５とされる。この接続面３５は、回路基板１７の表面１８（図４における右側面）と、実質的に同じ高さに配されている。また、隣り合う第２導電部材３２の隙間に充填された第１絶縁部３３の表面（図４における右側面）も、回路基板１７の表面１８と実質的に同じ高さに配されている。さらに、第２導電部材３２のうち図４における上端部と、開口部２４の口縁との隙間には第２絶縁部２３を構成する合成樹脂材が充填されている。この第２絶縁部２３の表面も、回路基板１７の表面１８と実質的に同じ高さに配されている。なお、実質的に同じ高さとは、第２導電部材３２の接続面３５、第２絶縁部２３の表面、および第１絶縁部３３材の表面と、回路基板１７の表面１８とが、同じ高さである場合を含むと共に、同じ高さでななくとも、略同じと認められる程度である場合を含む。 As shown in FIG. 4, an output terminal 34 that protrudes outward (upward in FIG. 4 in this embodiment) from the side edge of the semiconductor relay 19 is formed on the surface (left side surface in FIG. 4) of the second conductive member 32. They are electrically connected by a known method such as soldering. The surface of the second conductive member 32 is a connection surface 35 to which the output terminal 34 is connected. The connection surface 35 is disposed at substantially the same height as the surface 18 of the circuit board 17 (the right side surface in FIG. 4). Further, the surface of the first insulating portion 33 (the right side surface in FIG. 4) filled in the gap between the adjacent second conductive members 32 is also disposed at substantially the same height as the surface 18 of the circuit board 17. Further, a gap between the upper end portion in FIG. 4 of the second conductive member 32 and the lip of the opening 24 is filled with a synthetic resin material constituting the second insulating portion 23. The surface of the second insulating portion 23 is also disposed at substantially the same height as the surface 18 of the circuit board 17. The substantially the same height means that the connection surface 35 of the second conductive member 32, the surface of the second insulating portion 23, the surface of the first insulating portion 33 material, and the surface 18 of the circuit board 17 are the same height. In addition to the case where the height is approximately the same even if the height is not the same.

図８及び図９には、回路基板１７、第１導電部材２２、第２導電部材３２、第２絶縁部２３、及び第１絶縁部３３が積層された積層体の断面図を示す。本実施形態においては、回路基板１７の表面１８、第２絶縁部２３の表面、第１導電部材２２に形成された凸部２７の突出端面２９、第１絶縁部３３の表面、及び第１絶縁部３３の接続面３５は、実質的に面一に配されている。 8 and 9 are cross-sectional views of a stacked body in which the circuit board 17, the first conductive member 22, the second conductive member 32, the second insulating portion 23, and the first insulating portion 33 are stacked. In the present embodiment, the surface 18 of the circuit board 17, the surface of the second insulating portion 23, the protruding end surface 29 of the convex portion 27 formed on the first conductive member 22, the surface of the first insulating portion 33, and the first insulation The connection surface 35 of the portion 33 is substantially flush.

（マイコン）
図２に示すように、回路基板１７の表面１８には、回路基板１７の下端部寄りの位置(図２における左手前側の位置）に、半導体リレー１９のオンオフを制御するマイコン６４（特許請求の範囲に記載の制御部に相当）が実装されている。マイコン６４のリード端子は、回路基板１７の導電路に接続されて、半導体リレー１９の制御端子２０と電気的に接続されている。 (Microcomputer)
As shown in FIG. 2, a microcomputer 64 that controls on / off of the semiconductor relay 19 is placed on the surface 18 of the circuit board 17 at a position near the lower end of the circuit board 17 (position on the left front side in FIG. 2). Equivalent to the control unit described in the range) is implemented. The lead terminal of the microcomputer 64 is connected to the conductive path of the circuit board 17 and is electrically connected to the control terminal 20 of the semiconductor relay 19.

（コネクタ端子１６の接続構造）
上述したように、コネクタ部１５にはコネクタ端子１６がコネクタ部１５と一体にモールド成形されており、コネクタ端子１６の一方の端部はコネクタ部１５内に位置して配されている。図４に示すように、コネクタ端子１６の他方の端部は、裏側（図４における右側）に向けて曲げ形成されると共に裏側に向けてコネクタ部１５から突出している。 (Connector terminal 16 connection structure)
As described above, the connector terminal 16 is molded integrally with the connector part 15 in the connector part 15, and one end part of the connector terminal 16 is disposed in the connector part 15. As shown in FIG. 4, the other end portion of the connector terminal 16 is bent toward the back side (right side in FIG. 4) and protrudes from the connector portion 15 toward the back side.

コネクタ部１５は、電源６０に接続された入力ワイヤーハーネス６２が接続可能な入力コネクタ部１５Ａと、負荷６１に接続された出力ワイヤーハーネスが接続可能な出力コネクタ部１５Ｂと、図示しない信号線が接続可能な信号用コネクタ部１５Ｃと、を備える。 The connector unit 15 is connected to an input connector unit 15A to which an input wire harness 62 connected to a power source 60 can be connected, an output connector unit 15B to which an output wire harness connected to a load 61 can be connected, and a signal line (not shown). And a possible signal connector portion 15C.

図１に示すように、信号用コネクタ部１５Ｃはカバー１４のうち、図１における左奥側の位置に形成されており、入力コネクタ部１５Ａはカバー１４のうち図１における右手前側の位置に形成されており、出力コネクタ部１５Ｂは、上述した信号用コネクタ部１５Ｃと入力コネクタ部１５Ａの間に形成されている。 As shown in FIG. 1, the signal connector portion 15 C is formed at a position on the back left side in FIG. 1 of the cover 14, and the input connector portion 15 A is formed at a position on the right front side in FIG. The output connector portion 15B is formed between the signal connector portion 15C and the input connector portion 15A described above.

図４に示すように、出力コネクタ部１５Ｂには出力コネクタ端子１６Ｂが配設されており、出力コネクタ端子１６Ｂの一方の端部は出力コネクタ部１５Ｂの内部に配設されて、出力ワイヤーハーネスと接続可能になっている。出力コネクタ端子１６Ｂの他方の端部に対応する位置には、第２導電部材３２が配されている。この第２導電部材３２には、出力コネクタ端子１６Ｂの他方の端部に対応する位置に、出力コネクタ端子１６Ｂの他方の端部が挿通される第２端子接続孔３６が、第２導電部材３２を貫通して形成されている。出力コネクタ端子１６Ｂの他方の端部は、第２端子接続孔３６内に挿通されて、半田付け等の公知の手法により、第２導電部材３２と電気的に接続されている。 As shown in FIG. 4, an output connector terminal 16B is disposed in the output connector portion 15B, and one end of the output connector terminal 16B is disposed in the output connector portion 15B, and the output wire harness and Connection is possible. A second conductive member 32 is disposed at a position corresponding to the other end of the output connector terminal 16B. The second conductive member 32 has a second terminal connection hole 36 through which the other end of the output connector terminal 16B is inserted at a position corresponding to the other end of the output connector terminal 16B. Is formed. The other end of the output connector terminal 16B is inserted into the second terminal connection hole 36 and is electrically connected to the second conductive member 32 by a known method such as soldering.

また、図５に示すように、入力コネクタ部１５Ａには、入力コネクタ端子１６Ａが配設されており、入力コネクタ端子１６Ａの一方の端部は入力コネクタ部１５Ａの内部に配設されて、入力ワイヤーハーネスと接続可能になっている。入力コネクタ端子１６Ａの他方の端部に対応する位置には、回路基板１７が位置している。この回路基板１７には、入力コネクタ端子１６Ａの他方の端部に対応する位置に、入力コネクタ端子１６Ａの他方の端部が挿通される端子挿通孔３７が形成されている。さらに、入力コネクタ端子１６Ａの他方の端部に対応する位置には、第１導電部材２２が配されている。この第１導電部材２２には、入力コネクタ端子１６Ａの他方の端部に対応する位置に、第１端子接続孔３８が、第１導電部材２２を貫通して形成されている。入力コネクタ端子１６Ａの他方の端部は、端子挿通孔３７及び第１端子接続孔３８内に挿通されて、半田付け等の公知の手法により、第１導電部材２２と電気的に接続されている。 Further, as shown in FIG. 5, the input connector terminal 15A is provided with an input connector terminal 16A, and one end of the input connector terminal 16A is provided inside the input connector part 15A, and the input connector terminal 16A is provided with an input connector terminal 16A. It can be connected to a wire harness. The circuit board 17 is located at a position corresponding to the other end of the input connector terminal 16A. A terminal insertion hole 37 through which the other end of the input connector terminal 16A is inserted is formed in the circuit board 17 at a position corresponding to the other end of the input connector terminal 16A. Further, the first conductive member 22 is disposed at a position corresponding to the other end of the input connector terminal 16A. A first terminal connection hole 38 is formed in the first conductive member 22 so as to penetrate the first conductive member 22 at a position corresponding to the other end of the input connector terminal 16A. The other end of the input connector terminal 16A is inserted into the terminal insertion hole 37 and the first terminal connection hole 38, and is electrically connected to the first conductive member 22 by a known method such as soldering. .

また、図６に示すように、開口部２４は、回路基板１７のうち図６における上端部寄りの位置であって、且つ図６における左右方向について略右半分の位置に、形成されている。また、回路基板１７のうち、開口部２４の左方の位置には、複数の基板側端子接続孔３９が回路基板１７を貫通して形成されている。この基板側端子接続孔３９には、詳細には図示しないが、信号用コネクタ端子１６の他方の端部が挿通されて、半田付け等の公知の手法により、回路基板１７に形成された導電路と、電気的に接続される。 Further, as shown in FIG. 6, the opening 24 is formed at a position near the upper end portion in FIG. 6 of the circuit board 17 and at a substantially right half position in the left-right direction in FIG. 6. A plurality of board-side terminal connection holes 39 are formed through the circuit board 17 at a position on the left side of the opening 24 in the circuit board 17. Although not shown in detail in this board side terminal connection hole 39, the other end of the signal connector terminal 16 is inserted, and a conductive path formed in the circuit board 17 by a known method such as soldering. And electrically connected.

（製造工程）
続いて、本実施形態の製造工程の一例について説明する。まず、金属板材を鍛造、鋳造、プレス加工等、任意の手法により加工して、第１導電部材２２を形成する（図１０参照）。次いで、図１３に示すように、図１３の下側に位置する金型４０（以下、下型４０と記載する。）の上面（図１３における上面）に、第１導電部材２２を載置する。下型４０の上面には、第１導電部材２２を収容するためのキャビティ４１が形成されている。また、キャビティ４１の底面には、上方（図１３における上方）に突出する突出台４２が形成されている。この突出台４２の上面には、上方に突出する位置決め突起４３が形成されている。 (Manufacturing process)
Then, an example of the manufacturing process of this embodiment is demonstrated. First, the metal plate material is processed by an arbitrary method such as forging, casting, or pressing to form the first conductive member 22 (see FIG. 10). Next, as shown in FIG. 13, the first conductive member 22 is placed on the upper surface (the upper surface in FIG. 13) of the mold 40 (hereinafter referred to as the lower mold 40) located on the lower side of FIG. 13. . A cavity 41 for accommodating the first conductive member 22 is formed on the upper surface of the lower mold 40. Further, a projecting base 42 that projects upward (upward in FIG. 13) is formed on the bottom surface of the cavity 41. On the upper surface of the protruding base 42, a positioning protrusion 43 protruding upward is formed.

図１４に示すように、第１導電部材２２を、凸部２７を上方（図１４における上方）に向けた姿勢で、且つ金型挿通孔３１内に突出台４２が挿通された状態で、下型４０のキャビティ４１内に収容する。第１導電部材２２と、下型４０とは、第１導電部材２２の外縁と、キャビティ４１の内面とが当接することにより位置決めされてもよいし、また、下型４０に設けた位置決めピンと、第１導電部材２２に設けた位置決め孔の内周面とが当接することにより位置決めされてもよい。 As shown in FIG. 14, the first conductive member 22 is placed with the projection 27 facing upward (upward in FIG. 14) and with the protruding base 42 inserted into the mold insertion hole 31. It is accommodated in the cavity 41 of the mold 40. The first conductive member 22 and the lower mold 40 may be positioned by abutting the outer edge of the first conductive member 22 and the inner surface of the cavity 41, or positioning pins provided on the lower mold 40, The first conductive member 22 may be positioned by contacting an inner peripheral surface of a positioning hole provided in the first conductive member 22.

その後、第２導電部材３２を、図１４の矢線で示す方向から第１導電部材２２の上面に積層する。図１０には、第１導電部材２２と第２導電部材３２の積層状態を斜視図で示す。このとき、第２導電部材３２の第２端子接続孔３６内に、下型４０の位置決め突起４３を挿通する。これにより、第１導電部材２２と、第２導電部材３２との相対的な位置決めを行う。 Thereafter, the second conductive member 32 is laminated on the upper surface of the first conductive member 22 from the direction indicated by the arrow in FIG. FIG. 10 is a perspective view showing a stacked state of the first conductive member 22 and the second conductive member 32. At this time, the positioning protrusion 43 of the lower mold 40 is inserted into the second terminal connection hole 36 of the second conductive member 32. As a result, the first conductive member 22 and the second conductive member 32 are relatively positioned.

図１５に示すように、第２導電部材３２の上方（図１５における上方）から、上側に位置する金型４４（以下、上型４４と記載する。）を重ねる。これにより、下型４０と、上型４４との間に、第１導電部材２２及び第２導電部材３２が位置決めされた状態で挟まれる。その後、キャビティ４１内に絶縁性の合成樹脂材を充填してモールド成形を行う。これにより、第１導電部材２２と、第２導電部材３２とが、第１絶縁部３３を介して積層される。 As shown in FIG. 15, a mold 44 (hereinafter referred to as an upper mold 44) located on the upper side is stacked from above the second conductive member 32 (upper in FIG. 15). Thus, the first conductive member 22 and the second conductive member 32 are sandwiched between the lower mold 40 and the upper mold 44. Thereafter, the cavity 41 is filled with an insulating synthetic resin material and molded. As a result, the first conductive member 22 and the second conductive member 32 are stacked via the first insulating portion 33.

図１１及び図１６に示すように、回路基板１７の裏面２１側から（図１１及び図１６において矢線で示す方向）、回路基板１７の開口部２４を塞ぐようにして、第１導電部材２２と第２導電部材３２とを積層したものを重ねる。その後、図示しない一対の金型内に収容して、絶縁性の合成樹脂材でモールド成形を行う。これにより、図１７に示すように、第１導電部材２２と第２導電部材３２とを積層したものと、回路基板１７とが、第２絶縁部２３を介して積層される。 As shown in FIGS. 11 and 16, from the back surface 21 side of the circuit board 17 (in the direction indicated by the arrow in FIGS. 11 and 16), the first conductive member 22 is closed so as to close the opening 24 of the circuit board 17. And the second conductive member 32 are stacked. After that, it is housed in a pair of molds (not shown) and molded with an insulating synthetic resin material. Accordingly, as shown in FIG. 17, the first conductive member 22 and the second conductive member 32 are stacked and the circuit board 17 is stacked via the second insulating portion 23.

その後、回路基板１７の表面１８に半導体リレー１９等を載置して、公知のリフロー半田付けを実行する。これにより、半導体リレー１９が回路基板１７に実装されて、回路構成体１２が完成する。 Thereafter, a semiconductor relay 19 or the like is placed on the surface 18 of the circuit board 17 and known reflow soldering is performed. Thereby, the semiconductor relay 19 is mounted on the circuit board 17, and the circuit structure 12 is completed.

一方、コネクタ端子１６を所定の形状に曲げ形成した後、合成樹脂材でモールド成形することにより、カバー１４を製造する。その後、カバー１４の裏面から回路構成体１２を積層し、コネクタ端子１６の端部を、それぞれ、基板側端子接続孔３９、第１端子接続孔３８、及び第２端子接続孔３６内に挿通する。ついで、公知のフロー半田付けにより、コネクタ端子１６と、回路基板１７、第１導電部材２２、及び第２導電部材３２とを電気的に接続する。 On the other hand, the cover 14 is manufactured by bending the connector terminal 16 into a predetermined shape and then molding the connector terminal 16 with a synthetic resin material. Thereafter, the circuit components 12 are stacked from the back surface of the cover 14, and the end portions of the connector terminals 16 are inserted into the board-side terminal connection holes 39, the first terminal connection holes 38, and the second terminal connection holes 36, respectively. . Next, the connector terminal 16 is electrically connected to the circuit board 17, the first conductive member 22, and the second conductive member 32 by known flow soldering.

その後、ケース本体１３の開口内に回路構成体１２を収容すると共に、ケース本体１３の側壁の端縁と、カバー１４の側壁の端縁とを、互いに当接された状態で超音波溶着によって接合する。これにより、ケース本体１３とカバー１４とは一体に組み付けられる。以上により、電気接続箱１０が完成する。 Thereafter, the circuit structural body 12 is accommodated in the opening of the case body 13 and the edge of the side wall of the case body 13 and the edge of the side wall of the cover 14 are joined by ultrasonic welding in a state of being in contact with each other. To do. Thereby, the case main body 13 and the cover 14 are assembled | attached integrally. Thus, the electrical junction box 10 is completed.

（作用、効果）
続いて、本実施形態の作用、効果について説明する。本実施形態によれば、電源６０からの電流は、入力ワイヤーハーネス６２を通った後、入力コネクタ部１５Ａから入力コネクタ端子１６Ａを通って、電気接続箱１０内に入力される。その後、電流は、入力コネクタ端子１６Ａの他方の端部から第１導電部材２２へと流れ、入力端子３０から半導体リレー１９へと達する。 (Function, effect)
Then, the effect | action and effect of this embodiment are demonstrated. According to the present embodiment, the current from the power source 60 passes through the input wire harness 62 and then is input from the input connector portion 15 A through the input connector terminal 16 A into the electrical connection box 10. Thereafter, the current flows from the other end of the input connector terminal 16 A to the first conductive member 22 and reaches the semiconductor relay 19 from the input terminal 30.

また、半導体リレー１９の出力端子３４から流れ出た電流は、第２導電部材３２を流れ、出力コネクタ端子１６Ｂを通って電気接続箱１０の外部へ出力される。その後、電流は、出力コネクタ端子１６Ｂから出力コネクタ部１５Ｂに嵌合された出力ワイヤーハーネス６３へと流れ、負荷６１へと達する。 The current flowing out from the output terminal 34 of the semiconductor relay 19 flows through the second conductive member 32 and is output to the outside of the electrical connection box 10 through the output connector terminal 16B. Thereafter, the current flows from the output connector terminal 16B to the output wire harness 63 fitted to the output connector portion 15B, and reaches the load 61.

このように、本実施形態によれば、電気接続箱１０内において、電源６０からの電流は第１導電部材２２を流れ、負荷６１への電流は第２導電部材３２を流れる。上記の第１導電部材２２及び第２導電部材３２は、回路基板１７に形成された開口部２４内に配されているので、回路基板１７上には、比較的に大きな電流を流すための導電路を形成しなくてもよい。これにより、比較的に幅広な導電路を回路基板１７上に形成しなくてもよいので、回路基板１７を小型化できる。この結果、電気接続箱１０を小型化できる。 Thus, according to the present embodiment, in the electrical junction box 10, the current from the power source 60 flows through the first conductive member 22, and the current to the load 61 flows through the second conductive member 32. Since the first conductive member 22 and the second conductive member 32 are arranged in the opening 24 formed in the circuit board 17, the conductive material for allowing a relatively large current to flow on the circuit board 17. It is not necessary to form a path. Thereby, since it is not necessary to form a relatively wide conductive path on the circuit board 17, the circuit board 17 can be reduced in size. As a result, the electrical junction box 10 can be reduced in size.

また、第１導電部材２２、及び第２導電部材３２は金属板材からなるので、同じ回路を回路基板１７上に銅箔パターンで形成する場合に比べて、幅狭に形成できる。このため、回路基板１７の小型化が可能であり、電気接続箱１０を小型化できる。 Moreover, since the 1st conductive member 22 and the 2nd conductive member 32 consist of a metal plate material, compared with the case where the same circuit is formed on the circuit board 17 with a copper foil pattern, it can form narrowly. For this reason, the circuit board 17 can be miniaturized, and the electrical junction box 10 can be miniaturized.

また、第１導電部材２２と第２導電部材３２とは積層されているので、第１導電部材２２と第２導電部材３２とを並べて配する場合に比べて配線密度を向上させることができる。これにより、電気接続箱を小型化できる Further, since the first conductive member 22 and the second conductive member 32 are laminated, the wiring density can be improved as compared with the case where the first conductive member 22 and the second conductive member 32 are arranged side by side. Thereby, the electrical junction box can be reduced in size.

また、本実施形態によれば、回路基板１７には半導体リレー１９のオンオフを制御するマイコン６４が実装されている。このマイコン６４のリード端子は回路基板１７に形成された導電路に接続されており、半導体リレー１９の制御端子２０と電気的に接続されている。このように本実施形態においては、１枚の回路基板１７上に、電源６０から負荷６１へと電力を供給する電力回路と、半導体リレー１９のオンオフを制御するマイコン６４とが設けられている。これにより、電力回路と制御部とをそれぞれ異なった回路基板１７に設ける場合に比べて、全体として電気接続箱１０を小型化できる。 Further, according to the present embodiment, the circuit board 17 is mounted with the microcomputer 64 that controls on / off of the semiconductor relay 19. The lead terminal of the microcomputer 64 is connected to a conductive path formed on the circuit board 17 and is electrically connected to the control terminal 20 of the semiconductor relay 19. As described above, in this embodiment, the power circuit that supplies power from the power source 60 to the load 61 and the microcomputer 64 that controls the on / off of the semiconductor relay 19 are provided on one circuit board 17. Thereby, compared with the case where a power circuit and a control part are provided in the respectively different circuit boards 17, the electrical junction box 10 can be reduced in size as a whole.

また、半導体リレー１９の入力端子３０は半導体リレー１９の裏面に形成されており、この半導体リレー１９の裏面と第１導電部材２２とが接続されている。これにより、通電時に半導体リレー１９で発生した熱は、半導体リレー１９の裏面に形成された入力端子３０から、第１導電部材２２に速やかに伝達され、第１導電部材２２に拡散される。これにより、半導体リレー１９の近傍に熱がこもり、局所的に高温になることを抑制できる。 The input terminal 30 of the semiconductor relay 19 is formed on the back surface of the semiconductor relay 19, and the back surface of the semiconductor relay 19 and the first conductive member 22 are connected. Thereby, the heat generated in the semiconductor relay 19 during energization is quickly transmitted from the input terminal 30 formed on the back surface of the semiconductor relay 19 to the first conductive member 22 and diffused to the first conductive member 22. Thereby, it is possible to suppress heat from being accumulated in the vicinity of the semiconductor relay 19 and locally becoming high temperature.

さらに、本実施形態によれば、カバー１４には、電源６０に接続された入力ワイヤーハーネス６２と接続可能な入力コネクタ部１５Ａが設けられており、入力コネクタ部１５Ａ内には入力コネク端子１６Ａの一方の端部が配されており、入力コネクタ端子１６Ａの他方の端部は、ケース１１内に導入されて、第１導電部材２２に電気的に接続されている。これにより、入力コネクタ部１５Ａから第１導電部材２２に至るまでの導電路の配索経路を簡素化できる。 Further, according to the present embodiment, the cover 14 is provided with the input connector portion 15A that can be connected to the input wire harness 62 connected to the power source 60, and the input connector terminal 16A is provided in the input connector portion 15A. One end portion is disposed, and the other end portion of the input connector terminal 16 A is introduced into the case 11 and is electrically connected to the first conductive member 22. Thereby, the routing route of the conductive path from the input connector portion 15A to the first conductive member 22 can be simplified.

また、カバー１４には、負荷６１に接続された出力ワイヤーハーネス６３と接続可能な出力コネクタ部１５Ｂが設けられており、出力コネクタ部１５Ｂ内には出力コネク端子１６Ｂの一方の端部が配されており、出力コネクタ端子１６Ｂの他方の端部は、ケース１１内に導入されて、第２導電部材３２に電気的に接続されている。これにより、出力コネクタ部１５Ｂから第２導電部材３２に至るまでの導電路の配索経路を簡素化できる。 The cover 14 is provided with an output connector portion 15B that can be connected to the output wire harness 63 connected to the load 61, and one end portion of the output connector terminal 16B is disposed in the output connector portion 15B. The other end of the output connector terminal 16B is introduced into the case 11 and is electrically connected to the second conductive member 32. Thereby, the wiring path | route of the conductive path from the output connector part 15B to the 2nd conductive member 32 can be simplified.

＜実施形態２＞
次に、本発明の実施形態２を、図１８を参照しつつ説明する。本実施形態においては、回路基板１７と第１導電部材２２とは、図示しない絶縁性の接着層（特許請求の範囲に記載の第２絶縁部２３に相当）を介して積層されている。接着層としては、接着剤を用いてもよいし、接着シートを用いてもよい。また、開口部２４の口縁と、第１導電部材２２の凸部２７とは隙間なく接触している。 <Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. In the present embodiment, the circuit board 17 and the first conductive member 22 are laminated via an insulating adhesive layer (not shown) (corresponding to the second insulating portion 23 described in the claims). As the adhesive layer, an adhesive or an adhesive sheet may be used. Further, the lip of the opening 24 and the convex portion 27 of the first conductive member 22 are in contact with each other without a gap.

上記以外の構成については、実施形態１と略同様なので、同一部材については同一符号を付し、重複する説明を省略する。 Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.

本実施形態によれば、第１導電部材２２と回路基板１７とを近接して配することができる。これにより、回路構成体１２を一層小型化することができる。 According to the present embodiment, the first conductive member 22 and the circuit board 17 can be arranged close to each other. Thereby, the circuit structure 12 can be further reduced in size.

また、通電時に第１導電部材２２で発生した熱は、回路基板１７に伝達され、回路基板１７によって均熱化される。これにより、ケース１１内部が局所的に高温になることを抑制できる。この結果、回路基板１７に実装された電子部品に、例えば半田クラック等、熱に起因する不具合が発生することを抑制できる。 Further, the heat generated in the first conductive member 22 during energization is transmitted to the circuit board 17 and is soaked by the circuit board 17. Thereby, it can suppress that the inside of case 11 becomes high temperature locally. As a result, it is possible to suppress the occurrence of defects due to heat, such as solder cracks, in the electronic component mounted on the circuit board 17.

＜実施形態３＞
続いて、本発明の実施形態を、図１９を参照しつつ説明する。本実施形態においては、回路基板１７には基板側ピン貫通孔５０が形成されている。基板側ピン貫通孔５０の表側（図１９における左側）の開口部はやや径大に形成されている。また、第１導電部材２２には、基板側ピン貫通孔５０に整合する位置に、導電部材側ピン貫通孔５１が形成されている。導電部材側ピン貫通孔５１の裏側（図１９における右側）の開口部はやや径大に形成されている。 <Embodiment 3>
Next, an embodiment of the present invention will be described with reference to FIG. In the present embodiment, a board-side pin through hole 50 is formed in the circuit board 17. The opening on the front side (left side in FIG. 19) of the substrate side pin through hole 50 is formed with a slightly larger diameter. Further, the first conductive member 22 is formed with a conductive member side pin through hole 51 at a position aligned with the substrate side pin through hole 50. The opening on the back side (right side in FIG. 19) of the conductive member side pin through hole 51 is formed to have a slightly larger diameter.

基板側ピン貫通孔５０及び導電部材側ピン貫通孔５１内には、合成樹脂製の樹脂ピン５２が貫通されている。そして、樹脂ピン５２の両端部は、加熱、加圧されることで圧潰されている。これにより、回路基板１７と、第１導電部材２２とは、隙間を有して積層された状態に保持されている。なお、回路基板１７と、第１導電部材２２とは、樹脂ピン５２に限られず、任意の手段により、隙間を有して積層される。 In the board side pin through hole 50 and the conductive member side pin through hole 51, resin pins 52 made of synthetic resin are penetrated. The both ends of the resin pin 52 are crushed by being heated and pressurized. Thereby, the circuit board 17 and the first conductive member 22 are held in a stacked state with a gap. The circuit board 17 and the first conductive member 22 are not limited to the resin pins 52 and are laminated with a gap by any means.

本実施形態によれば、回路基板１７と第２導電部材３２とは隙間を有して積層されている。この結果、回路基板１７と第２導電部材３２との間には空気層５３が存在する。本実施形態においては、この空気層５３が第１絶縁部３３とされる。 According to the present embodiment, the circuit board 17 and the second conductive member 32 are stacked with a gap. As a result, an air layer 53 exists between the circuit board 17 and the second conductive member 32. In the present embodiment, the air layer 53 serves as the first insulating portion 33.

上記の構成によれば、通電時に第２導電部材３２で発生した熱は、比較的に熱伝導率の低い空気層５３によって遮断されて、回路基板１７に伝達することが抑制される。これより、回路基板１７に実装された電子部品が熱により不具合を生じることが抑制される。 According to the above configuration, the heat generated in the second conductive member 32 during energization is blocked by the air layer 53 having a relatively low thermal conductivity and transmitted to the circuit board 17. As a result, the electronic component mounted on the circuit board 17 is prevented from being defective due to heat.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
（１）本実施形態においては、スイッチング素子として半導体リレー１９を用いたが、これに限られず、機械式リレー等、必要に応じて任意の素子を用いることができる。
（２）第１絶縁部３３としては、絶縁性の接着剤、絶縁性の接着シート、絶縁性の粘着シート等、必要に応じて任意の絶縁性の材料を用いることができる。
（３）第２絶縁部２３としては、絶縁性の接着剤、絶縁性の接着シート、絶縁性の粘着シート等、必要に応じて任意の絶縁性の材料を用いることができる。
（４）本実施形態においては、第１導電部材２２に形成された第１端子接続孔３８は、回路基板１７に形成された端子挿通孔３７と整合する位置に配される構成としたが、これに限られず、第１端子接続孔３８は、回路基板１７の開口部２４内に位置して配された第１導電部材２２に形成されてもよい。
（５）本実施形態においては、制御部としてマイコン６４を用いたが、これに限られず、制御回路により半導体リレー１９のオンオフを制御する構成としてもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In this embodiment, the semiconductor relay 19 is used as a switching element. However, the present invention is not limited to this, and any element such as a mechanical relay can be used as necessary.
(2) As the 1st insulating part 33, arbitrary insulating materials, such as an insulating adhesive agent, an insulating adhesive sheet, and an insulating adhesive sheet, can be used as needed.
(3) As the 2nd insulating part 23, arbitrary insulating materials, such as an insulating adhesive agent, an insulating adhesive sheet, an insulating adhesive sheet, can be used as needed.
(4) In the present embodiment, the first terminal connection hole 38 formed in the first conductive member 22 is arranged at a position aligned with the terminal insertion hole 37 formed in the circuit board 17. However, the first terminal connection hole 38 may be formed in the first conductive member 22 disposed in the opening 24 of the circuit board 17.
(5) In the present embodiment, the microcomputer 64 is used as the control unit. However, the present invention is not limited thereto, and the control circuit may control the on / off of the semiconductor relay 19.

１０…電気接続箱
１１…ケース
１２…回路構成体
１５Ａ…入力コネクタ部
１５Ｂ…出力コネクタ部
１６Ａ…入力コネクタ端子
１６Ｂ…出力コネクタ端子
１７…回路基板
１９…半導体リレー（スイッチング素子）
２２…第１導電部材
２３…第２絶縁部
２４…開口部
３０…入力端子
３２…第２導電部材
３３…第１絶縁部
３４…出力端子
６０…電源
６１…負荷
６２…入力ワイヤーハーネス
６３…出力ワイヤーハーネス
６４…マイコン（制御部） DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 11 ... Case 12 ... Circuit structure 15A ... Input connector part 15B ... Output connector part 16A ... Input connector terminal 16B ... Output connector terminal 17 ... Circuit board 19 ... Semiconductor relay (switching element)
DESCRIPTION OF SYMBOLS 22 ... 1st electrically-conductive member 23 ... 2nd insulation part 24 ... Opening part 30 ... Input terminal 32 ... 2nd electrically-conductive member 33 ... 1st insulation part 34 ... Output terminal 60 ... Power supply 61 ... Load 62 ... Input wire harness 63 ... Output Wire harness 64 ... Microcomputer (control unit)

Claims

An electrical junction box arranged between a power source and a load,
A case, a circuit board housed in the case, and a switching element mounted on the circuit board to perform switching on the load,
An opening is formed in the circuit board, and a first conductive member made of a metal plate material and electrically connected to the power source is formed in the opening, and the first conductive member is insulative to the first conductive member. And a second conductive member made of a metal plate material and electrically connected to the load, the circuit board, the first conductive member, and the second conductive member Between the first conductive member and the input terminal of the switching element is connected to the first conductive member, and the output terminal of the switching element is connected to the second conductive member. Connected electrical junction box.

The electrical connection box according to claim 1, wherein the circuit board is provided with a control unit that controls on / off of the switching element, and a control terminal of the switching element is electrically connected to the control unit.

The electrical connection box according to claim 1, wherein the input terminal is formed on a back surface of the switching element, and the back surface of the switching element is connected to the first conductive member.

The case is provided with an input connector portion connectable to an input wire harness connected to the power source, and one end portion of an input connector terminal is arranged in the input connector portion, and the input connector 4. The electrical connection box according to claim 1, wherein the other end of the terminal is introduced into the case and electrically connected to the first conductive member. 5.

The case is provided with an output connector portion connectable to an output wire harness connected to the load, and one end portion of an output connector terminal is arranged in the output connector portion, and the output connector 5. The electrical connection box according to claim 1, wherein the other end of the terminal is introduced into the case and electrically connected to the second conductive member. 6.