JP2010176854A - Vehicle lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vehicle lamp capable of assembling a semiconductor light source on a heat sink member in good accuracy. <P>SOLUTION: The semiconductor light source 10 is pressed down by a holder portion 41 of a power supply member 40 on a shelf portion 23 of a heat sink member 20, and the holder portion 41 is pressed down by a fixing frame 50 to be assembled on the shelf portion 23. The semiconductor light source 10 is pinched and pressed in front and rear direction of the lamp by a stopper portion 31 on the shelf portion 23 and a plate spring member 43 of the holder portion 41 and is positioned. The fixing frame 50 inserts and engages locking holes 54 of a pair of right and left pressing members 52 into locking projections 37 on the shelf portion 23, and inserts and engages the locking hole 53 of the front wall 51 into the locking projection 38 at the front end face on the shelf portion 23, thereby, can be installed on the shelf portion 23 by one-touch. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vehicular lamp used for a rear combination lamp, a fog lamp, and the like including an automobile headlamp.

  Conventionally, as shown in, for example, Patent Document 1 as a vehicle lamp, a semiconductor light source such as a light emitting diode (LED) is used as a light source, and this is assembled to a heat sink member (fixing member) together with a reflector. A heat source is known in which heat generated by a light source is diffused by the heat sink member.

JP 2006-302714 A

  In the conventional vehicular lamp, the semiconductor-type light source is positioned and fixedly disposed on the power supply attachment member, and the semiconductor-type light source is fixed to the heat sink member by inserting and fixing the power supply attachment member to the heat sink member. It is arranged at the site.

  Therefore, the assembly error between the semiconductor light source and the power supply attachment member and the assembly error between the power supply attachment member and the heat sink member are integrated, and the optical positional relationship between the semiconductor light source and the reflector, shade, projection lens, etc. It is undeniable that an error will occur and the light distribution performance will be adversely affected.

  On the other hand, the rear surface of the semiconductor type light source and the light source mounting surface of the heat sink member are provided with a locating pin and a locating hole that are engaged with each other, and the semiconductor type light source is positioned by the engagement between the locating pin and the locating hole, Although it is also directly fixed to the light source mounting surface, it is difficult to manage the processing accuracy of the locating pin and the locating hole, and in this case also, the positional relationship between the semiconductor light source and other optical system members is delicate. It will cause madness.

  Therefore, the present invention provides a vehicular lamp that can accurately assemble a semiconductor-type light source on a light source mounting surface of a heat sink member, and can improve light distribution performance.

  The vehicular lamp of the present invention collects a semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, direct light from the semiconductor-type light source, and reflected light from the reflector. An optical system unit including a projection lens that emits light and irradiates the front of the lamp, and a shelf that protrudes substantially horizontally toward the front of the lamp at an intermediate position in the vertical direction of the vertical wall, on the shelf A heat sink member on which the optical system unit is disposed, and the semiconductor light source is pressed against the semiconductor light source by pressing a peripheral edge of the semiconductor light source in a direction perpendicular to the shelf of the heat sink member. Fixed by a power supply member having a flat plate-shaped holder portion connected to the shelf, and a fixing frame that is fixedly fastened on the shelf portion and presses the peripheral edge of the holder portion in a direction perpendicular to the surface. The semiconductor type light source A stopper portion protruding on the rear side portion of the shelf portion and engaged with the rear end surface of the semiconductor-type light source, and provided integrally with the holder portion so as to face the stopper portion. Positioned in the front-rear direction of the lamp by opposing clamping pressure with a leaf spring member elastically contacting the front end surface of the light source, the fixed frame is attached to the front wall of the shelf and the upper edge of the front wall. A flange edge that is bent toward the rear of the lamp and abuts on the front side of the peripheral edge of the holder part, and extends from the left and right side parts of the flange edge toward the rear of the lamp and extends around the peripheral part of the holder part. A pair of presser pieces abutting on the left right side part, and provided with locking holes in the terminal part and the front wall of the presser piece, respectively, and these locking holes on the shelf part and on the front end surface thereof. Inserted into and fixed to the protruding projections and fixed to the shelf It has been a major feature of the Rukoto.

  The semiconductor-type light source has its lower surface superposed on the shelf of the heat sink member, and the rear end surface of the semiconductor-type light source is brought into surface contact with and locked to a stopper projecting from the shelf. Thus, the arrangement reference position of the semiconductor light source is determined. Then, the holder portion of the power feeding member is placed on the shelf from above the semiconductor light source, and the front end surface of the semiconductor light source is brought to the stopper portion side by a leaf spring member integrally provided on the holder portion. By pressing toward the fixed position, the arrangement position of the semiconductor-type light source is determined, and the peripheral portion of the holder portion is pressed from above with a fixed frame, and the fixed frame is fixedly fixed on the shelf portion. Thus, the semiconductor-type light source is properly assembled on the shelf.

  According to the present invention, the arrangement reference position of the semiconductor light source on the shelf is determined by abutting the rear end surface of the semiconductor light source against the stopper projecting on the shelf of the heat sink member and bringing it into surface contact. Since the arrangement position of the semiconductor light source is determined by the opposing clamping force between the stopper portion and the leaf spring member of the holder portion in the power supply member, the semiconductor light source is previously attached to the conventional power supply attachment. Unlike the case where the power supply attachment is assembled to the heat sink member, the semiconductor light source can be directly placed at a predetermined position of the heat sink member, and the assembly accuracy of the semiconductor light source can be improved.

  In addition, since it is only necessary to provide the accuracy of mutual surface contact between the stopper portion and the semiconductor light source, it is easy to manage the processing accuracy, and the semiconductor light source can be accurately positioned in the front-rear direction, and optically connected to other reflectors, etc. The positional relationship is not distorted, and the light distribution performance can be improved.

  In addition to the above-mentioned effect on the light distribution performance, the leaf spring member is integrally provided in the holder portion of the power supply member as described above. Therefore, a separate spring member for positioning the semiconductor light source is used as the heat sink member. Unlike what is assembled in the above, the number of parts can be reduced and the number of assembly steps can be reduced. In addition, since the power supply member can be temporarily held and fixed with respect to the heat sink member by using the spring reaction force of the plate spring member of the holder portion, the assembly of the power supply members Adhesiveness can be improved.

  Further, the fixing frame inserts and engages the locking holes of the end portions of the pair of left and right presser pieces with the locking protrusions on the shelf portion of the heat sink member, and the locking holes of the front wall are formed on the front end surface of the shelf portion. By inserting and engaging the locking projection, the peripheral edge of the holder part of the power feeding member can be firmly pressed by these holding pieces and the flange edge of the front wall, and can be attached to the shelf part. As it is unnecessary, it can be assembled with one touch, and the assembly workability can be improved.

The disassembled perspective view which shows the lamp unit in one Embodiment of this invention. Sectional drawing of a lamp unit. The perspective view which shows the positioning state of a semiconductor type light source. The cross-sectional perspective view which shows the arrangement | positioning relationship between a semiconductor type light source and the leaf | plate spring terminal of an electric power feeding member. The perspective view which shows the assembly | attachment state of an electric power feeding member. The perspective view which shows the assembly | attachment state of a fixed frame. The perspective view which shows an electric power feeding member. The perspective view which reverses and shows an electric power feeding member. The enlarged view which shows the small protrusion part formation part of FIG. The expansion perspective view which shows the connector part formation part of an electric power feeding member. The expansion perspective view which shows the formation part of a leaf | plate spring member. The expansion perspective view which shows a fixed frame.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings by taking a vehicle headlamp as an example.
The lamp unit 1 of the headlamp shown in FIGS. 1 and 2 includes an optical system unit 2 and a heat sink member 20 in which the optical system unit 2 is disposed.

  The optical system unit 2 is configured as a projector type, and includes a semiconductor-type light source 10, a reflector 11 having a concave reflecting surface 11 a that reflects a part of light emitted from the semiconductor-type light source 10, and direct irradiation of the semiconductor-type light source 10. A projection lens 12 that collects the light and the reflected light of the reflector 11 and irradiates the light toward the front of the lamp.

  This lamp unit 1 is disposed in a lamp chamber formed by a lamp housing (not shown) and a transparent outer lens to constitute a headlamp.

  The reflection surface 11a of the reflector 11 in the optical system unit 2 is formed of an ellipse or a reflection surface based on an ellipse, for example, a free-form surface based on an ellipsoid or an ellipse. In the vertical cross section of FIG. 2, the reflecting surface 11a of the reflector 11 has, for example, a semi-elliptical shape in which an ellipse is halved along its long axis, and the front end side of the reflecting surface 11a is a semicircular hood portion 11A. It is said that.

  The reflector 11 is formed of, for example, a light-impermeable synthetic resin material, and the reflective surface 11a is formed by performing aluminum vapor deposition or silver coating on the inner surface of the reflector 11.

  The reflecting surface 11a of the reflector 11 includes a first focal point F1 and a second focal point F2, and the light emitting unit 10a of the semiconductor-type light source 10 is disposed at or near the first focal point F1. Thereby, of the light emitted from the semiconductor-type light source 10, the light reflected by the reflecting surface 11 a of the reflector 11 is collected at the second focal point F <b> 2 of the reflector 11 or in the vicinity thereof.

  The semiconductor light source 10 is a light source using luminescence (light emission phenomenon) obtained by applying a voltage to a semiconductor, such as a light emitting diode (LED) or an electroluminescence (EL) including an organic EL and an inorganic EL.

  This semiconductor-type light source 10 has a planar rectangular substrate 10A, and positive and negative terminals constituting the light source side terminal 10b are disposed in a strip shape in the front-rear direction on the left and right upper surfaces of the substrate 10A. A transparent dome-shaped cover 10c is attached to cover the light emitting portion 10a.

  The projection lens 12 is a convex lens having a spherical or substantially spherical shape on at least one side surface. In this embodiment, both side surfaces of the projection lens 12 have a convex substantially spherical shape, and the side surface (front surface) on the front side of the lamp has a smaller radius of curvature than the side surface (rear surface) on the rear side of the lamp. The shape of the projection lens 12 is not limited to this, and may be any convex lens whose thickness in the lens optical axis direction becomes thinner from the center to the outer periphery. For example, a plano-convex lens whose side surface (rear surface) on the rear side of the lamp is a substantially flat surface. It may be.

  The projection lens 12 has a horizontal or substantially horizontal lens optical axis Z1, and the first focal point F1 and the second focal point F2 of the reflector 11 are set on the lens optical axis Z1. As a result, the light focused at or near the second focal point F2 of the reflector 11 is condensed into a light beam parallel or substantially parallel to the lens optical axis Z1 when passing through the projection lens 12, and is projected forward of the lamp. The

  Since the semiconductor-type light source 10 generates less heat than halogen lamps or HID lamps (high-intensity discharge lamps), a synthetic resin lens that is lighter than a glass lens, such as an acrylic lens, is used as the projection lens 12. The

  The periphery of the projection lens 12 is held and fixed to the lens holder 13 and is attached to the heat sink member 20 via the lens holder 13.

  The lens holder 13 is made of an appropriate heat-resistant synthetic resin material, and has a rising wall 13a at the rear end of a substantially semi-cylindrical body, and the rising wall 13a is a shelf portion of a vertical wall 21 (to be described later) of the heat sink member 20. A boss portion 26 projecting below 23 is fastened by a screw 18 and attached to the heat sink member 20.

  At the upper end of the rising wall 13a of the lens holder 13, a substantially horizontal flange 13b is extended toward the rear of the lamp. The flange 13b substantially coincides with the lens optical axis Z1 of the projection lens 12, and the front edge constitutes the shade 14.

  The shade 14 is set at the position of the second focal point F2 of the reflector 11 or in the vicinity thereof, and blocks a part of the reflected light emitted from the semiconductor-type light source 10 and reflected by the reflecting surface 11a of the reflector 11. Thus, a predetermined light distribution pattern having a cutoff line is formed by the remaining reflected light, for example, a passing light distribution pattern (low beam).

  Further, the rear flat surface of the shade 14 on the general upper surface of the flange portion 13b is located behind the lamp 14 in the first reflective surface 11a when the reflective surface 11a of the reflector 11 is the first reflective surface. It is formed as a second reflecting surface 15 that reflects the reflected light reflected at the position toward the upper part of the projection lens 12 in an obliquely upward direction.

On the other hand, a part of the light emitted from the semiconductor-type light source 10 is reflected on the upper portion of the front end portion of the hood portion 11A of the reflector 11 toward the position immediately before the shade 14 (front position of the lamp). A reflective surface 16 is formed. Slope The third reflecting surface 16, the front end upper portion of the hood portion 11A, by forming the bulge portions 11A ₁ projecting section inverted triangular shape toward the inside, which is inclined forward of the rear of the inner Formed with.

  Further, a fourth reflection surface 17 that reflects the reflected light reflected by the third reflection surface 16 toward the upper portion of the projection lens 12 is formed immediately before the shade 14 (front position of the lamp). Yes. The fourth reflecting surface 17 is formed as an inclined surface inclined obliquely downward, and the third and fourth reflecting surfaces 16 and 17 are for overhead sign forming a light distribution pattern at a position above the low beam light distribution pattern. This constitutes the reflective surface.

  The second reflecting surface 15 and the fourth reflecting surface 17 on the side of the lens holder 13 are formed by applying aluminum vapor deposition or silver coating similarly to the first reflecting surface 11a and the third reflecting surface 16 of the reflector 11.

  Further, the body of the lens holder 13 is composed of the lower half of the semi-cylindrical shape as described above, and the upper half is opened so that heat does not accumulate in the lens holder 13. Has been.

  The heat sink member 20 is configured as a metal material having high thermal conductivity, for example, aluminum die casting.

  The heat sink member 20 also serves as a base on which the semiconductor light source 10, the reflector 11, and the projection lens 12 constituting the optical system unit 2 are optically concentrated as described above. A plurality of vertical fins 22 for heat dissipation are arranged at equal intervals in the left-right direction at least on the rear surface (also on the front surface in this embodiment) of the vertical wall 21. .

  The vertical wall 21 of the heat sink member 20 is integrally formed with a shelf 23 that protrudes substantially horizontally toward the front of the lamp at an intermediate position in the vertical direction, and the optical system unit 2 is assembled on the shelf 23. ing.

  In the present embodiment, a pair of left and right shelves 23 are provided, and a two-lamp type lamp unit 1 is configured by assembling the optical system unit 2 on each shelf 23.

  The left and right shelves 23 and the vertical walls 21 are formed in different phases in the front-rear direction, that is, shifted in an arbitrary dimension in the front-rear direction. Moreover, the shelf 23 may be formed with different phases in the left and right directions. The difference between the phases of the left and right shelf portions 23 is due to the design reasons of the headlamps determined by the character line of the vehicle body. Of course, the left and right shelf portions 23 may be formed in the same phase.

  One of the optical system units 2 assembled to the left and right shelf portions 23 is configured as a reference optical unit serving as a reference for optical axis adjustment, and the other is configured as an additional optical unit.

  The reference optical unit forms, for example, a light distribution pattern having a cut line that rises obliquely at the upper edge, while the additional optical unit forms a light distribution pattern whose upper edge is a horizontal cut line. These light distribution patterns and the light distribution pattern of the additional optical unit are combined to form a passing light distribution pattern having a predetermined cut-off line at the upper edge.

In order to adjust the optical axis of the lamp unit 1, a predetermined portion of the vertical wall 21 of the heat sink member 20 is provided with connecting portions 24 of a front-rear direction aiming adjustment bolt and a horizontal direction aiming adjustment bolt (not shown) and tilting of the optical axis adjustment. A pivot 25 serving as a fulcrum is provided.
Further, as described above, the boss portion 26 for attaching the lens holder 13 projects from the vertical wall 21 at the lower portion of the shelf portion 23.
On the other hand, on the upper surface of the shelf 23, as shown in FIG. 3, a pedestal 30 for placing the semiconductor-type light source 10 is protruded and formed at a substantially central portion thereof.

  The pedestal portion 30 is formed in a flat rectangular shape, and the width dimension in the left-right direction is substantially the same as or slightly shorter than the width dimension in the left-right direction of the substrate 10A of the semiconductor light source 10.

  A stopper portion 31 extending in the left-right direction is erected on the rear side portion of the pedestal portion 30. The stopper portion 31 is formed in a cross-sectional shape having at least a front surface thereof as a vertical surface, for example, a rectangular cross-sectional shape, and is configured to engage with the rear end surface of the substrate 10A of the semiconductor light source 10 in a plane. .

  An opening 32 is formed in a portion extending from the rear side of the shelf 23, specifically, from the rear side of the pedestal 30 to the vertical wall 21, and the opening 32 is diagonally forward and oblique to the shelf 23. A connector portion 42 of a power supply member 40 described later can be inserted and engaged from above.

  On the front wall of the opening 32, as shown in FIG. 4, a projecting portion 33 with which a later-described abutting surface 42a of the connector portion 42 abuts extends in the left-right direction and is integrally formed.

  Also, a pair of left and right guide rail portions 34 for slidingly guiding the power supply member 40 when the connector portion 42 of the power supply member 40 is inserted into the opening 32 are formed on the upper surface of the shelf portion 23 in a protruding manner. Has been.

  The guide rail portion 34 is disposed so as to extend in the front-rear direction along both sides of the pedestal portion 30. Further, the front end portion of the guide rail portion 34 is formed to extend forward from the position where the stopper portion 31 is formed, and at least the inner side surfaces of the front end portion are formed vertically, and these guides are formed. The front end portion of the rail portion 34 is engaged with the left and right side end surfaces of the substrate 10A of the semiconductor type light source 10 so as to be in plane, and has a function as a stopper for positioning the semiconductor type light source 10 in the left and right direction. Has been.

  Further, on the upper surface of the shelf portion 23, a holder portion 41, which will be described later, of the power feeding member 40 is mounted on the upper surface of the pair of guide rail portions 34 so as to slightly protrude from the upper surface of the shelf portion 23. A pair of left and right seat surfaces 35 to be placed extend in the front-rear direction and are integrally formed.

  Further, a stepped portion 36 is integrally formed along the corner of the upper surface of the shelf 23 and the front surface of the vertical wall 21, and when the feeding member 40 is inserted into the opening 32, An insertion restricting rib 46 projecting from the rear end of the holder portion 41 is brought into contact with the connector portion 42 so that the insertion of the connector portion 42 can be restricted.

  Locking protrusions 37 and 38 for locking and fixing a fixing frame 50 described later are integrally formed on the upper surface of the stepped portion 36 and the front end surface of the shelf portion 23.

  A pair of left and right engaging projections 37 on the upper surface of the stepped portion 36 are provided with the opening 38 interposed therebetween, and hook claws 37a are formed at the upper ends facing the rear, while the front end surface of the shelf 23 is engaged. The stop protrusion 38 is provided in a horizontally long manner toward the front at the center in the left-right direction of the front end surface of the shelf 23.

  In the present embodiment, the guide rail portion 34, the seat surface 35, and the locking projections 37 and 38 are all formed symmetrically on the left and right lines with respect to the center in the left and right direction of the pedestal portion 30.

  The semiconductor-type light source 10 mounts the substrate 10A on the pedestal portion 30 of the shelf 23, and the rear end surface and the left and right end surfaces of the substrate 10A are connected to the stopper portion 31 and the pair of left and right guide rail portions 34, respectively. An arrangement reference position of the semiconductor-type light source 10 is determined by bringing it into contact with the inner side surface of the front end portion and making contact and locking.

  The semiconductor light source 10 is firmly fixed to the heat sink member 20 by a power supply member 40 and a fixed frame 50 that are sequentially assembled on the shelf 23 from above. At this time, the substrate 10A of the semiconductor-type light source 10 is sandwiched between the stopper portion 31 and a leaf spring member 43, which will be described later, of the power supply member 40 in the front-rear direction of the lamp, and the front-rear direction affects the light distribution performance. Are properly positioned, and the arrangement position of the semiconductor-type light source 10 is determined.

  The power supply member 40 is made of an appropriate heat-resistant synthetic resin material. As shown in FIGS. 7 to 10, the peripheral portion of the semiconductor-type light source 10, specifically, the peripheral portion of the substrate 10A is viewed from above. A holder part 41 to be pressed, and a connector part 42 that protrudes toward the rear of the lamp at the rear end of the holder part 41 and to which a power supply side connector 48 (see FIG. 2) is connected.

  The holder part 41 is formed in a flat plate-like flat plate shape, and has a flange part 41a which is formed in a stepped shape integrally with the peripheral part of the holder part 41 and is abutted and polymerized on the seating surface 35 of the shelf part 23 in the heat sink member 20. I have.

  In the central portion of the holder portion 41, a flat rectangular opening 41b is formed through which the dome-shaped cover 10c of the semiconductor-type light source 10 and the light source side terminal 10b on the upper surface of the substrate 10A can be exposed.

  In addition, a plurality of pairs of leaf spring terminals 41c that can be electrically connected to the light source side terminals 10b provided on the left and right upper surfaces of the substrate 10A of the semiconductor-type light source 10 are provided on the left and right side edge portions of the window portion 41b. Integrated. These leaf spring terminals 41c have a plurality of positive electrode side terminals and negative electrode side terminals in the front-rear direction of the lamp corresponding to the positive electrode side terminals and the negative electrode side terminals that are spaced apart from each other and constitute the light source side terminal 10b. They are arranged in an orderly manner so as to be opposed to the left and right.

  Further, at the center of the front edge portion of the window portion 41b, it faces the stopper portion 31 on the shelf portion 23 of the heat sink member 20, and protrudes toward the center side of the window portion 41b. A plate spring member 43 that elastically contacts the front end face of the ten substrates 10A is integrally provided.

  As shown in FIG. 11, the leaf spring member 43 includes a base portion 43a fixed to the front edge portion of the window portion 41b, and a pair of left and right branches branched from the end of the base portion 43a and bent into a substantially concave shape on the side surface. The leaf spring piece 43b and the pair of leaf spring pieces 43b and 43b are connected to the front end portion of the plate spring piece 43b, and are formed to rise substantially vertically and press the surface of the semiconductor light source 10 on the front end face of the substrate 10A. And a piece 43c.

  The pair of left and right leaf spring pieces 43b are formed in an approximately eight-plane shape in which a spacing interval increases from the end of the base portion 43a to the tip, and the pressing piece 43c is configured to be wider than the base portion 43a. Yes.

  Further, as shown in FIG. 8, the lower surface of the holder portion 41, specifically the lower surface of the rear side of the flange portion 41a, is in sliding contact with the outer surfaces of the pair of left and right guide rail portions 34, 34. A groove 44 is formed.

  As shown in FIG. 9, the lower surface side of the front and rear edge portions of the open window portion 41b is stepped and formed higher than the light source side terminal 10b on the upper surface of the substrate 10A of the semiconductor-type light source 10. For example, a plurality of small protrusions 45 are formed to abut on the four corner surfaces of the substrate 10A in a spot manner and press the substrate 10A.

  In addition, at the rear end of the holder portion 41, the insertion base of the connector portion 42 to the opening 32 is restricted by contacting the molding base of the shelf portion 23 of the heat sink member 20, that is, the front surface of the stepped portion 36. A plurality of insertion restricting ribs 46 projecting in the vertical direction.

  On the other hand, the connector part 42 is projected in a straight shape from the rear end of the holder part 41 in the left-right direction toward the rear of the lamp, so that the power feeding member 40 is connected to the leaf spring terminal 41c, The holder portion 41 having the spring member 43 and the like and the connector portion 42 are formed symmetrically on the left and right lines.

  As shown in FIG. 10, the connector portion 42 is formed in a rectangular tube shape whose upper surface is flush with the upper surface of the holder portion 41, and projects downward from the holder portion 41. The front end of the connector portion 42 protruding downward from the holder portion 41 is formed as a substantially vertical abutting surface 42 a that abuts the projection 33 provided on the front wall of the opening 32 of the heat sink member 20. Has been.

  The connector part 42 is provided with a connector terminal 42b, and the positive terminal and the negative terminal of the connector terminal 42b are electrically connected to the positive terminal and the negative terminal of the leaf spring terminal 41c of the holder part 41. is doing.

  The leaf spring terminal 41c, the leaf spring member 43, and the connector terminal 42b extend from the four peripheries of the opening portion 41b of the holder portion 41 to the connector portion 42 as shown in FIGS. The power supply member 40 is connected to a single metal plate 47 that is insert-molded on the synthetic resin base material.

  A portion of the metal plate 47 where the positive terminal and the negative terminal of the connector terminal 42 b are connected is punched and divided by press working after insert molding of the metal plate 47. Further, the connecting portion between the positive terminal of the leaf spring terminal 41c and the leaf spring member 43 in the metal plate 47 and the connecting portion between the negative terminal of the leaf spring terminal 41c and the leaf spring member 43 are the same. The metal plate 47 is cut and punched after insert molding.

  As a result, the positive terminals and the negative terminals of the connector terminal 42b and the leaf spring terminal 41c are electrically connected to each other, and the leaf spring member 43 is not electrically connected to the connector terminal 42b and the leaf spring terminal 41c. It is said that.

  In order to facilitate punching and cutting of the metal plate 47, a plate exposure hole 40a in which the metal plate 47 is partially exposed in the vertical direction is formed at a required portion of the synthetic resin base material of the power supply member 40. The metal plate 47 is partially punched and cut by a press machine (not shown) at the exposed hole 40a.

  The fixed frame 50 is formed of a metal plate material having a required rigidity. As shown in FIGS. 6 and 12, the fixed frame 50 is formed by bending a front wall 51 that contacts the front edge of the shelf 23 of the heat sink member 20 and an upper edge of the front wall 51 toward the rear of the lamp. In addition, a flange edge 51 a that abuts on the front side portion of the peripheral edge portion of the power supply member 40, that is, the upper surface of the front side edge of the flange portion 41 a of the holder portion 41 is provided. On the left and right sides of the flange edge 51a, there are provided a pair of pressing pieces 52 that extend toward the rear of the lamp and abut against the upper surfaces of the left and right sides of the flange portion 41a of the holder portion 41.

  The center portion in the left-right direction of the front wall 51 of the fixed frame 50 and the rear end portion of the pair of left and right presser pieces 52 are provided with horizontally long locking holes 53 and 54, respectively.

  Therefore, the fixed frame 50 inserts and engages the engaging holes 54 of the pair of presser pieces 52 above the shelf 23 to the engaging projections 37 on the corresponding shelf 23 from above and at the front wall 51. The engaging hole 53 is inserted into and engaged with the engaging protrusion 38 on the front end surface of the shelf 23, so that it is mounted on the flange portion 41 a of the power supply member 40. In order to surely engage the locking projections 37 and 38 with the locking holes 53 and 54, the center portion of each presser piece 52 is curved to be convex toward the holder portion 41 side. A spring portion 55 is formed, and the spring portion 55 is elastically contacted with the surface of the flange portion 41a of the power supply member 40 to bend and deform, whereby the engagement protrusions 37 and 38 and the engagement holes 53 and 54 are engaged in the engagement direction. The urging force is obtained. As a result, the power supply member 40 and the semiconductor-type light source 10 are permanently fixed onto the shelf 23.

  The semiconductor light source 10 is assembled to the heat sink member 20 as follows.

  First, the semiconductor-type light source 10 is placed on the pedestal portion 30 of the shelf portion 23 of the heat sink member 20 with the light emitting portion 10a facing upward, and the substrate 10A is slid on the pedestal portion 30 so that the substrate 10A. The rear end surface and the left and right side end surfaces are set in contact with the stopper portion 31 and the front end side surface of the guide rail portion 34 by surface contact, respectively (see FIG. 3).

  Next, the connector portion 42 of the power supply member 40 is inserted into the opening 32 on the rear side portion of the shelf portion 23 while being inclined obliquely from above and forward, and the posture of the power supply member 40 is lowered to a horizontal state so that the holder portion 41 is moved. The dome-shaped cover 10c is passed over the peripheral edge of the substrate 10A of the semiconductor-type light source 10 from above and passes through the open window 41b, and the pressing piece 43c of the leaf spring member 43 of the holder 41 is moved to the substrate 10A. The front end face is slidably engaged from above. As a result, the pressing piece 43c of the leaf spring member 43 is brought into elastic contact with the front end surface of the substrate 10A, and the substrate 10A is sandwiched between the stopper portion 31 and the leaf spring member 43 in the front-rear direction, thereby The mounting position in the front-rear direction is defined, and the mounting position in the left-right direction is defined by the front end portions of the left and right guide rail portions 34 (see FIG. 5).

  At this time, the power feeding member 40 is positioned in the left-right direction by the groove 44 on the lower surface of the holder portion 41 being engaged with the guide rail portion 34, while the connector portion is caused by the spring reaction force of the leaf spring member 43. The abutting surface 42a of 42 is elastically abuttingly engaged with the protrusion 33 on the front wall of the opening 32 to perform positioning in the front-rear direction. Accordingly, the leaf spring terminal 41c of the holder portion 41 is elastically contacted with the light source side terminal 10b of the substrate 10A so that the power supply member 40 and the semiconductor-type light source 10 are electrically connected, and the substrate 10A is placed on the pedestal portion 30. The semiconductor light source 10 and the power supply member 40 are temporarily fixed (see FIG. 4).

  Therefore, as described above, the locking frame 54 of the pair of left and right presser pieces 52, 52 is passed through the hook claw 37a of the locking projection 37 on the shelf 23 as described above. While engaging with the projection 37, the lower end side of the front wall 51 is slightly bent forward using the elasticity, and the engagement hole 53 is inserted and engaged with the engagement projection 38 on the front end surface of the shelf 23, By mounting the presser piece 52 and the flange edge 51a of the front wall 51 on the flange portion 41a of the power supply member 40, the semiconductor light source 10 and the power supply member 40 are permanently fixed, thereby attaching the semiconductor light source 10 to the shelf 23. The assembly with respect to the heat sink member 20 is completed in a state where the positioning is accurately performed (see FIG. 6).

  After the semiconductor light source 10 is assembled to the heat sink member 20 as described above, the reflector 11 is fixedly fastened or fastened to a fixed position by a positioning means (not shown) on the shelf 23 and projected similarly. The lens 12 is assembled to the heat sink member 20 with the screw 18 fixed to the end of the boss portion 26 of the heat sink member 20 through the lens holder 13 as described above.

  According to the headlamp of the present embodiment configured as described above, the rear end surface of the semiconductor-type light source 10 is brought into contact with the stopper portion 31 projecting on the shelf portion 23 of the heat sink member 20 and brought into surface contact with the stopper portion 31. An arrangement reference position of the semiconductor-type light source 10 on the portion 23 is determined, and the semiconductor-type light source 10 is formed by the opposing clamping force between the stopper portion 31 and the leaf spring member 43 of the holder portion 41 of the power supply member 40 in the front-rear direction. Unlike the case where the semiconductor light source is assembled in advance in the conventional power supply attachment and the power supply attachment is assembled in the heat sink member, the semiconductor light source 10 is directly attached to the predetermined position of the heat sink member 20. The assembly accuracy of the semiconductor light source 10 can be increased.

  In addition, since the surface contact accuracy between the stopper portion 31 and the semiconductor light source 10 only has to be obtained, the processing accuracy can be easily managed, the semiconductor light source 10 can be accurately positioned in the front-rear direction, and the other reflector 11 Thus, the optical positional relationship with respect to the optical position does not get out of order, thereby improving the light distribution performance.

  In addition to the above-described effects on the light distribution performance, the leaf spring member 43 is integrally provided on the holder portion 41 of the power supply member 40 as described above. Unlike what is assembled to the heat sink member, the number of parts can be reduced and the number of assembling steps can be reduced.

  In addition, since the power supply member 40 can be temporarily held and fixed with respect to the heat sink member 20 by using the spring reaction force of the plate spring member 43 of the holder portion 41, The assembling property of the power supply member 40 can be improved.

  An opening 32 is formed in a corner portion extending from the rear side portion of the shelf portion 23 of the heat sink member 20 to the vertical wall 21, and the power supply member 40 is formed in a rectangular tube shape projecting from the rear end of the holder portion 41. The connector portion 42 is inserted into the opening portion 32 from the front and obliquely above the shelf portion 23, and the abutting surface 42 a at the front end of the connector portion 42 is placed on the protrusion portion 33 on the front wall of the opening portion 32. The spring force of the member 43 is brought into contact with the surface in the front-rear direction and is elastically engaged. For this reason, the rectangular cylindrical connector portion 42 itself is inserted into and engaged with the opening 32, and the abutting surface 42a and the protruding portion 33 are brought into abutment engagement with each other, thereby supplying the power supply member. Positioning in the lamp front-rear direction with respect to the 40 heat sink members 20 and temporary holding and fixing can be appropriately performed.

  In addition, since the abutting surface 42a is elastically abuttingly engaged with the protrusion 33, the power feeding member 40 can be prevented from rattling due to vehicle body vibration or the like, and the power connector 48 is connected to the connector 42. When the lamp is inserted from the rear of the lamp, the insertion restriction can be performed to prevent the power feeding member 40 from being displaced. In addition, since the connector part 42 projects rearward from the rear end of the holder part 41, the power connector 48 can be easily attached / detached from the rear of the lamp, thereby improving workability. It is possible to avoid dropping off the own weight due to vibration of the vehicle body or the like.

  Further, when the holder portion 41 of the power supply member 40 is inserted into the opening 32 from the front of the lamp, a plurality of insertion restriction vertical ribs 46 at the rear end of the holder portion 41 are formed on the base portion of the shelf portion 23. Because of the abutment engagement with the front surface of the step portion 36, the leaf spring member 43 is pressed when the power feeding member 40 is excessively pushed rearward of the lamp and when the power source connector 48 is detached. It is possible to eliminate the pressing load and prevent the leaf spring member 43 from becoming loose.

  Further, on the shelf 23 of the heat sink member 20, a pair of guide rail portions 34, 34 extending in the front-rear direction is formed by bulging, and the connector portion 42 of the power supply member 40 is connected to the opening 32. At the time of insertion, the groove portion 44 formed on the lower surface of the rear end portion of the holder portion 41 of the power supply member 40 engages with the guide rail portions 34, 34, so that the insertion operation of the connector portion 42 into the opening portion 32 is smooth. In addition, the horizontal displacement of the holder portion 41, that is, the lateral displacement of the power supply member 40 can be eliminated, and the semiconductor light source 10 can be properly pressed by the power supply member 40.

  In addition, the front end portions of the guide rail portions 34 and 34 extend forward from the stopper portion 31 and are engaged with the left and right end surfaces of the substrate 10A of the semiconductor light source 10 so as to be positioned in the left-right direction. In order to function as a stopper to be performed, the position accuracy in the front-rear direction of the semiconductor light source 10 that influences the light distribution performance is enhanced by the stopper portion 31 and the leaf spring member 43, and the position accuracy in the left-right direction is also enhanced. Thus, the optical positional relationship between the shade 14, the semiconductor light source 10 and the reflector 11 can be performed as designed, and the light distribution performance can be further improved.

  Further, the shelf 23 of the heat sink member 20 is provided with locking projections 37 and 38 on the rear side and the front end surface of the upper surface thereof, and the fixed frame 50 is provided on the locking projections 37 and 38 on the front and rear sides. Since the fixing is performed across the belt, the fixing frame 50 can be attached with one touch unlike the fastening and fixing by screws or the like, and the mounting workability can be improved. Moreover, since the hook claw 37a is formed at the front end of the locking projection 37 on the upper surface side of the shelf portion 23, the rear end portion of the fixed frame 50 is hooked on the hook claw 37a obliquely from above. Then, it is only necessary to rotate the front end portion of the fixed frame 50 downward with the engaging portion as a fulcrum and engage with the locking projection 38 on the front end surface of the shelf portion 23. Thus, the mounting frame 50 is not detached from the locking projection 37, and the mounting workability can be more easily performed.

  The power feeding member 40 is provided with the connector part 42 projecting rearward from the rear end of the holder part 41 and the leaf spring member 43 at the center in the left-right direction of the flat rectangular holder part 41, Since the power feeding member 40 is formed symmetrically on the left and right lines, when the optical system unit 2 is configured as a pair of left and right on the heat sink member 20 as in this embodiment, there is no specification division and can be diverted to the left and right optical system units. Assembling work can be simplified without inducing misassembly.

  The holder portion 41 is integrally provided with a leaf spring terminal 41c that elastically contacts the light source side terminal 10b provided on the left and right side edges of the substrate 10A of the semiconductor-type light source 10. By arranging 41c in the center part of the holder part 41 symmetrically to the left and right lines, unification of the power feeding member 40 can be facilitated.

  The leaf spring member 43 provided integrally with the holder portion 41 of the power supply member 40 has a pair of left and right leaf spring pieces 43b, 43b branched from the end of the base 43a at the base thereof, and is bent into a substantially concave shape on the side. The pressing pieces 43c that are provided between the tip portions and rise substantially vertically are configured so as to abut on the front end surface of the substrate 10A of the semiconductor-type light source 10 in a plane. By setting 43b and 43b, the leaf spring member 43 can be easily designed to a predetermined low spring load value. Thereby, metal fatigue of the metal plate 47 constituting the leaf spring member 43 can be eliminated, and the elastic clamping pressure holding in the front-rear direction of the semiconductor light source 10 can be appropriately performed.

  Further, the leaf spring pieces 43b, 43b are formed in an approximately eight-plane shape in which the separation interval increases from the end of the base portion 43a to the tip, and the pressing piece 43c is formed wider than the base portion 43a. The holding area of the semiconductor light source 10 can be sufficiently secured without forming the entire plate spring member 43 wide, and the size of the plate spring member 43 can be reduced. Forty designs can be made easily without difficulty in structure.

  As described above, the holder portion 41 is integrally provided with a leaf spring terminal 41c that elastically contacts the light source side terminal 10b on the substrate 10A of the semiconductor-type light source 10, and the light source side terminal 10b and the leaf spring terminal 41c are connected to each other. Since the power supply member 40 and the semiconductor light source 10 are electrically connected to each other by contact, the spring action of the leaf spring terminal 41c can eliminate the movement of the semiconductor light source 10 and hold it appropriately. .

  Further, on the lower surface of the holder portion 41, a plurality of small protrusions 45 are formed on the substrate 10A of the semiconductor light source 10 so as to come into spot contact with the four corners removed from the light source side terminal 10b. By concentrating the spring force of the leaf spring terminal 41c on the contact portion of the substrate 10A with these small protrusions 45, the required holding force of the semiconductor light source 10 can be secured and the pressing load of the leaf spring terminal 41c can be reduced. It can be reduced to prevent settling.

  The leaf spring terminal 41c, the leaf spring member 43, and the connector terminal 42b are insert-molded into the synthetic resin base material of the power supply member 40 from the four peripheries of the opening portion 41b of the holder portion 41 to the connector portion 42. The metal plate 47 is integrally connected to the metal plate 47, the connection portion of the positive terminal and the negative terminal of the connector terminal 42b on the metal plate 47, the positive terminal of the leaf spring terminal 41c, and The negative electrode side terminal and the continuous portion of the leaf spring member 43 are cut and cut after insert molding of the metal plate 47, respectively, so that the positive electrode side terminals of the connector terminal 42b and the leaf spring terminal 41c are electrically connected to each other. The leaf spring member 43 is configured to be electrically non-conductive with the connector terminal 42b and the leaf spring terminal 41c. Connector terminal 42b, the plate spring terminals 41c, and a leaf spring member 43 when the integrally formed by insert molding, it is possible that in can reduce the molding steps moldability is improved, which greatly contributes to cost reduction.

  Further, as described above, the connector terminal 42b, the leaf spring terminal 41c, and the leaf spring member 43 are integrally connected to the single metal plate 47 in advance, so that the connector terminal 42b, the leaf spring terminal 41c, There is no deviation in the arrangement position of the spring member 43, and the quality of the power supply member 40 can be improved.

  In addition, in the metal plate 47, the leaf spring member 43 and the positive and negative terminals of the leaf spring terminal 41c and the connector terminal 42b are symmetrical with respect to the center line in the left-right direction of the power supply member 40. Thus, the unification of the parts having the left-right line symmetrical configuration of the power feeding member 40 described above can be realized without hindrance.

  On the other hand, the fixed frame 50 inserts and engages the engaging holes 54 of the end portions of the pair of left and right presser pieces 52 and 52 to the engaging projections 37 on the shelf portion 23 of the heat sink member 20, and By inserting and engaging the locking hole 53 with the locking projection 38 on the front end surface of the shelf 23, the peripheral edge portion of the holder portion 41 of the power supply member 40 is formed by the pressing pieces 52 and 52 and the flange edge 51 a of the front wall 51. Can be attached to the shelf portion 23, the fastening member or the like is not required and can be assembled with one touch, and the assembling workability can be improved.

  In addition, the curved spring portion 55 formed in the pressing pieces 52 and 52 can strengthen the engaging and holding force between the locking holes 53 and 54 and the locking projections 37 and 38, and press the holder portion 41. Can be strengthened, so that there is no backlash and a more robust assembly can be performed.

  Then, as in the above-described embodiment, the assembly of the semiconductor light source 10, the power supply member 40, and the fixed frame 50 onto the shelf 23 of the heat sink member 20 is sequentially placed, inserted, or engaged from above. Since the fastening member is unnecessary, the assembly work can be simplified to improve workability, and there is an advantage that the assembly by the robot can be easily automated.

  In the above-described embodiment, the structure in which the two optical system units 2 are arranged is illustrated. However, it is needless to say that a multi-lamp type or a single lamp type structure including three or more optical system units 2 may be used. It is.

  The optical system unit 2 can also be applied to lamp configurations other than the projector type in the above embodiment.

DESCRIPTION OF SYMBOLS 1 ... Lamp unit 2 ... Optical system unit 10 ... Semiconductor type light source 11 ... Reflector 12 ... Projection lens 20 ... Heat sink member 21 ... Vertical wall 23 ... Shelf part 31 ... Stopper part 37 ... Locking protrusion on shelf upper surface 38 ... Shelf part Lock projection 40 on the front end surface 40 ... Power feeding member 41 ... Holder portion 43 ... Plate spring member 50 ... Fixed frame 51 ... Front wall 51a ... Flange edge 52 ... Presser piece 53 ... Lock hole 54 on the front wall ... Locking of the presser piece Hole 55 ... Spring part

Claims (2)

A semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, and direct light from the semiconductor-type light source and reflected light from the reflector are condensed and directed toward the front of the lamp An optical system unit including a projection lens for irradiating;
A heat sink member having a shelf that protrudes substantially horizontally toward the front of the lamp at an intermediate position in the vertical direction of the vertical wall, and the optical system unit disposed on the shelf.
The semiconductor-type light source is provided with a plate-like holder portion that is electrically connected to the semiconductor-type light source by pressing the peripheral portion of the semiconductor-type light source in a direction perpendicular to the shelf of the heat sink member. It is a structure that is fixed by a member and a fixing frame that is anchored and fixed on the shelf part and presses the peripheral part of the holder part in a direction perpendicular to the surface,
The semiconductor-type light source is provided integrally with the holder portion so as to protrude from the rear side portion of the shelf and engage with the rear end surface of the semiconductor-type light source, and to face the stopper portion. Are positioned in the front-rear direction of the lamp by the opposing clamping pressure with the leaf spring member elastically contacting the front end surface of the semiconductor-type light source,
The fixed frame includes a front wall that contacts the front edge of the shelf, and a flange edge that is bent toward the rear of the lamp on the upper edge of the front wall and contacts the front side of the peripheral edge of the holder. A pair of pressing pieces extending from the left and right side portions of the flange edge toward the rear of the lamp and abutting on the left and right side portions of the peripheral edge portion of the holder portion, and a terminal portion of the pressing piece; Each of the front walls is provided with a locking hole, and the locking holes are inserted into and engaged with locking protrusions protruding on the shelf and on the front end surface thereof, and fixed to the shelf. Vehicle lamps.   2. The vehicular lamp according to claim 1, wherein the pair of presser pieces of the fixed frame is formed with a curved spring portion that is convex toward the holder portion side.

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