JP2010171078A - Lead frame, substrate, optical coupler, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame or a substrate capable of reducing the price of an optical coupler. <P>SOLUTION: A lead frame 30 has a first lead 31 comprising a conductor, a second lead 32, a third lead 33, a fourth lead 34, and a fifth lead 35. The first lead 31 includes a first lead body 36, a first terminal 7, and a first bonding part 1. The second lead 32 includes a the second lead body 37, a second terminal 8, and a second bonding part 2. The third lead 33 includes a third lead body 38, a third terminal 9, and a third bonding part 3. The fourth lead 34 includes a fourth lead body 41 containing a branch part 39 and a parallel part 40, and a fourth bonding part 4. These of the first lead 31, the second lead 32, the third lead 33, the fourth lead 34, and the fifth lead 35 allow use with both an optical coupler for high potential and an optical coupler for low potential. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, for example, a photo interrupter that detects the presence or absence of an object in a detection region by detecting the presence or absence of transmitted light or reflected light of light emitted from a light emitting element and electrically connecting a primary side and a secondary side. The present invention relates to an optical coupling device such as a photocoupler and the like, and to an electronic device equipped with the optical coupling device.

  Conventionally, as an optical coupling device, there are a photo interrupter, a photo coupler, and the like. The photo interrupter includes a light emitting element that emits light toward the detection area and a light receiving element that receives light from the detection area, and detects the presence or absence of an object in the detection area based on the output of the light receiving element. The photocoupler electrically separates the primary side and the secondary side using a light emitting element and a light receiving element that receives light emitted from the light emitting element.

  For example, Japanese Patent Laid-Open No. 6-140663 (Patent Document 1) discloses a circuit configuration of an optical coupling device including a signal processing IC (Integrated Circuit) 1003 on the light receiving element 1002 side as shown in FIG. ing. Japanese Utility Model Laid-Open No. 5-23555 (Patent Document 2) discloses a circuit configuration of an optical coupling device including a signal processing IC 2003 on the light receiving element 2002 side, as shown in FIG. These optical coupling devices include resistors 1004 and 2004 connected in series to the light emitting elements 1001 and 2001, so that the drive current of the light emitting elements 1001 and 2001 is determined to emit light. On the other hand, in the signal processing ICs 1003 and 2003 on the light receiving elements 1002 and 2002 side, the constant voltage circuits 1005 and 2005 stabilize the potential to stabilize the supply voltage, and detect light incident on the light receiving elements 1002 and 2002.

  Incidentally, the optical coupling device disclosed in Japanese Utility Model Laid-Open No. 5-23555 can be mounted on various electronic devices, but the supply potential to the optical coupling device varies depending on the electronic device.

  That is, when an optical coupling device is mounted on a high-potential type electronic device, the supply potential to the optical coupling device is high, but when an optical coupling device is mounted on a low-potential type electronic device, The supply potential of is low.

  Therefore, a lead frame (substrate) corresponding to each of high-potential type electronic devices and low-potential type electronic devices is prepared, and processing equipment capable of supporting a plurality of lead frames (substrates) is also prepared. Must.

  As a result, both the optical coupling device mounted on the high-potential model electronic device and the optical coupling device mounted on the low-potential model electronic device have a problem that the price is high.

JP-A-6-140663 (FIG. 8) Japanese Utility Model Publication No. 5-23555 (FIG. 7)

  Therefore, an object of the present invention is to provide a lead frame or a substrate that can reduce the price of the optical coupling device.

  Another object of the present invention is to provide an optical coupling device including the lead frame or the substrate and an electronic apparatus including the optical coupling device.

  In order to respond to the demand for cost reduction of the optical coupling device, the present applicant connects the light emitting element 112 in series by connecting the constant current source 114 in series to the light emitting element 112 as shown in FIG. We tried to reduce the price by reducing the number of parts by omitting resistors.

  However, even if the circuit of FIG. 15 is driven at a low potential, the potential drop in the light emitting element 112 causes a shortage of the supply potential in the circuit built-in light receiving element 113 including the constant current source 114, and the circuit cannot be driven.

  As a result, we have prepared lead frames (substrates) that correspond to high-potential model electronic devices and low-potential model electronic devices, as well as processing equipment that can handle multiple lead frames (substrates). Must be prepared.

The lead frame of the present invention is
A first lead having a substantially straight first lead body, a first terminal provided at one end of the first lead body, and a first bonding portion provided at the other end of the first lead body;
A second lead body that is substantially parallel to the first lead body, a second terminal provided at one end of the second lead body, and a second bonding portion provided at the other end of the second lead body A second lead having
A third lead body substantially parallel to the first lead body; a third terminal provided at one end of the third lead body; and a third bonding portion provided at the other end of the third lead body. The third lead,
A fourth lead body having a branch portion that bends and branches from the middle of the third lead body, a parallel portion that extends substantially parallel to the second lead body from the branch portion, and a tip of the fourth lead body. A fourth lead having a fourth bonding portion provided;
A fifth lead having a fifth lead body, a fifth bonding portion provided at one end of the fifth lead body, and a sixth bonding portion provided at the other end of the fifth lead body; It is characterized by.

  According to the lead frame having the above structure, the first lead, the second lead, the third lead, the fourth lead, and the fifth lead are provided, so that the high potential optical coupling device and the low potential optical coupling device are provided. Can be used in both.

  Therefore, the high-potential optical coupling device and the low-potential optical coupling device can be manufactured using a common facility, and the price of these optical coupling devices can be reduced.

  In addition, the first lead, the second lead, the third lead, the fourth lead, and the fifth lead can be arranged in a small region by the configuration as described above, and thus can be reduced in size.

In one embodiment of the lead frame,
The first bonding part is provided to bend at the other end of the first lead body,
The second lead body is bent in a substantially bowl shape from one end side to the other end side,
The third bonding part is provided to bend from the other end of the third lead body toward the second lead body,
The parallel part is bent from the branch part and extends substantially parallel to the second lead body,
The fifth bonding portion bends toward the second lead body;
The fifth lead body is
A U-shaped part covered on three sides with the parallel part and the branch part of the fourth lead body and the third lead body;
After being bent from the U-shaped portion toward the second lead main body, it has an L-shaped portion extending substantially parallel to the second lead main body and having the sixth bonding portion at the tip.

  According to the lead frame of the above embodiment, since the first bonding portion, the second lead body, the third bonding portion, the parallel portion, the fifth bonding portion, and the fifth lead body are provided, it is suitable for a transmissive photo interrupter, for example. Can be used.

The optical coupling device of the present invention is
A lead frame of the present invention;
A light emitting element and a light receiving element;
A first mold part comprising at least a part of translucent resin;
A second mold part comprising at least a part of a translucent resin,
One of the light emitting element and the light receiving element is electrically connected to at least the first bonding portion, the second bonding portion, and the sixth bonding portion of the lead frame, and at least a part thereof is made of a translucent resin. Molded in the first mold part,
The other of the light emitting element and the light receiving element is electrically connected to the fourth bonding part and the fifth bonding part of the lead frame, and at least a part thereof is molded by a second mold part made of a translucent resin. It is characterized by being.

  According to the optical coupling device having the above configuration, one of the light emitting element and the light receiving element is electrically connected to at least the first bonding part, the second bonding part, and the sixth bonding part of the lead frame, and the light emitting element and Since the other of the light receiving elements is electrically connected to the fourth bonding portion and the fifth bonding portion of the lead frame, the light emitting element can emit light reliably, and the light emitted from the light emitting element can be emitted by the light receiving element. It can be detected reliably.

The substrate of the present invention is
A first wiring having a substantially straight first wiring body, a first terminal provided at one end of the first wiring body, and a first bonding portion provided at the other end of the first wiring body;
A second wiring body that is substantially parallel to the first wiring body; a second terminal provided at one end of the second wiring body; and a second bonding portion provided at the other end of the second wiring body. A second wiring having
A third wiring main body substantially parallel to the first wiring, a third terminal provided at one end of the third wiring main body, and a third bonding portion provided at the other end of the third wiring main body. 3 wirings,
A branch portion that bends and branches from the middle of the third wiring body; a fourth wiring body that has a parallel portion extending substantially parallel to the second wiring body from the branch portion; and a tip of the fourth wiring body. A fourth wiring having a fourth bonding portion provided;
A fifth wiring body, and a fifth wiring having a fifth bonding portion provided at one end of the fifth wiring body and a sixth bonding portion provided at the other end of the fifth wiring body. It is characterized by.

  According to the substrate having the above-described configuration, the first wiring, the second wiring, the third wiring, the fourth wiring, and the fifth wiring are provided, whereby the high-potential optical coupling device and the low-potential optical coupling device are connected. Can be used in both.

  Therefore, the high-potential optical coupling device and the low-potential optical coupling device can be manufactured using a common facility, and the price of these optical coupling devices can be reduced.

  In addition, since the first wiring, the second wiring, the third wiring, the fourth wiring, and the fifth wiring can be arranged in a small region with the above-described configuration, the size can be reduced. .

In one embodiment of the substrate:
The first bonding part is provided to bend at the other end of the first wiring body,
The second wiring body is bent in a substantially bowl shape from one end side to the other end side,
The third bonding portion is provided by being bent from the other end of the third wiring body toward the second wiring body,
The parallel part is bent from the branch part and extends substantially parallel to the second wiring body,
The fifth bonding portion is bent toward the second wiring body;
The fifth wiring body is
A U-shaped part covered on three sides with the parallel part and the branch part of the fourth wiring body and the third wiring body;
After being bent from the U-shaped portion toward the second wiring main body, the L-shaped portion extends substantially parallel to the second wiring main body and has the sixth bonding portion at the tip.

  According to the substrate of the above embodiment, since the first bonding unit, the second wiring body, the third bonding unit, the parallel part, the fifth bonding unit, and the fifth wiring body are provided, it is suitably used for, for example, a transmissive photo interrupter. be able to.

The optical coupling device of the present invention is
A substrate according to the invention;
A light emitting element and a light receiving element;
A first mold part comprising at least a part of translucent resin;
A second mold part comprising at least a part of a translucent resin,
One of the light emitting element and the light receiving element is electrically connected to at least the first bonding portion, the second bonding portion, and the sixth bonding portion of the substrate, and the at least part of the light emitting element and the light receiving element is made of a translucent resin. Molded in one mold part,
The other of the light emitting element and the light receiving element is electrically connected to the fourth bonding part and the fifth bonding part of the substrate, and at least a part of the light emitting element and the light receiving element are molded by a second mold part made of a translucent resin. It is characterized by having.

  According to the optical coupling device configured as described above, one of the light emitting element and the light receiving element is electrically connected to at least the first bonding part, the second bonding part, and the sixth bonding part of the substrate, and the light emitting element and the light receiving element are connected. Since the other of the elements is electrically connected to the fourth bonding part and the fifth bonding part of the substrate, the light emitting element can emit light reliably and the light emitted from the light emitting element can be emitted by the light receiving element. It can be detected reliably.

In one embodiment of the optical coupling device,
The light receiving element is a light receiving element with a built-in circuit having a photodiode and a signal processing circuit on the same chip,
The signal processing circuit includes at least a constant voltage source, a constant current source, an amplifier, a comparator, and an output transistor,
The light receiving element with a built-in circuit is molded by the first mold part,
The light emitting element is molded by the second mold part,
The first terminal is one of a GND terminal and an output terminal,
The second terminal is the other of the GND (ground) terminal and the output terminal,
The third terminal is a Vcc terminal (power supply).

  According to the optical coupling device of the above embodiment, the light receiving element with a built-in circuit is molded by the first mold part, the light emitting element is molded by the second mold part, and the first to third terminals are connected as described above. Therefore, the light receiving element with a built-in circuit can be reliably driven.

In one embodiment of the optical coupling device,
The circuit built-in light receiving element has a GND (ground) pad, a Vout (output voltage) pad, a Vcc (power supply voltage) pad, and an Is (input current) pad.
The first bonding part is electrically connected to the GND pad,
The second bonding part is electrically connected to the Vout pad,
The third bonding portion is electrically connected to the Vcc pad,
The fourth bonding part is electrically connected to the anode of the light emitting element,
The fifth bonding part is electrically connected to the cathode of the light emitting element,
The sixth bonding portion is electrically connected to the Is pad.

  According to the optical coupling device of the above embodiment, the input / output terminals of the light receiving element with a built-in circuit have a GND pad, a Vout pad, a Vcc pad, and an Is pad, and the first bonding portion is electrically connected to the GND pad. The second bonding part is electrically connected to the Vout pad, the third bonding part is electrically connected to the Vcc pad, the fourth bonding part is electrically connected to the anode of the light emitting element, and the fifth bonding part emits light. Since it is electrically connected to the cathode of the element and the sixth bonding part is electrically connected to the Is pad, even if the light receiving element with a built-in circuit is a low potential driving IC, the light receiving element with a built-in circuit is reliably driven. be able to.

In one embodiment of the optical coupling device,
The third bonding unit is electrically connected to the constant voltage source through a power line,
A pull-up resistor is provided between the power supply line and the output transistor.

  According to the optical coupling device of the above embodiment, since the pull-up resistor is provided between the power supply line and the output transistor, the pull-up resistor can be molded by the first mold part.

  Therefore, it is not necessary to mount a pull-up resistor on, for example, an electronic device on which the optical coupling device is mounted, and the usability for the manufacturer of the electronic device can be improved.

In one embodiment of the optical coupling device,
The constant current source is a resistor.

  According to the optical coupling device of the above embodiment, the circuit of the light receiving element with built-in circuit can be simplified by forming the constant current source with a resistor in the chip, and there is a price merit of reducing the chip size.

  Further, by using a resistor having a negative temperature coefficient such as a polysilicon resistor as the resistor, the driving current of the light emitting element can be kept constant even when the ambient temperature varies, and light emission from the light emitting element is possible. The amount can be made constant, and as a result, stable operation can be achieved.

In one embodiment of the optical coupling device,
The circuit built-in light receiving element has a GND (ground) pad, a Vout (output voltage) pad, and an Is (input current) pad.
The first bonding part is electrically connected to the GND pad,
The second bonding part is electrically connected to the Vout pad,
The fourth bonding part is electrically connected to the anode of the light emitting element,
The fifth bonding part is electrically connected to the cathode of the light emitting element,
The sixth bonding portion is electrically connected to the Is pad.

  According to the optical coupling device of the above embodiment, the light receiving element with a built-in circuit has a GND pad, a Vout pad and an I pad, the first bonding part is electrically connected to the GND pad, and the second bonding part is Vout. The fourth bonding part is electrically connected to the anode of the light emitting element, the fifth bonding part is electrically connected to the cathode of the light emitting element, and the sixth bonding part is electrically connected to the Is pad. Therefore, it can be driven at a high potential, and the chip size of the light receiving element with a built-in circuit can be reduced to reduce the price.

In one embodiment of the optical coupling device,
The light receiving element is a photodiode or a phototransistor,
The photodiode or phototransistor is molded in the first mold part,
The light emitting element is molded by the second mold part,
The first bonding portion and the second bonding portion are electrically connected to the photodiode or phototransistor,
The fourth bonding part and the fifth bonding part are electrically connected to the light emitting element,
The line connecting the fifth bonding part and the sixth bonding part is electrically connected to the line connecting the first bonding part and the second bonding part,
The first terminal is one of a GND terminal and an output terminal;
The second terminal is the other of the GND terminal and the output terminal,
The third terminal is an anode terminal.

  According to the optical coupling device of the above embodiment, since the light receiving element is a photodiode or a phototransistor, it can be an analog output type without changing to another member or manufacturing equipment.

In one embodiment of the optical coupling device,
The light receiving element is a photodiode or a phototransistor,
The light emitting element is molded by the first mold part,
The photodiode or phototransistor is molded in the second mold part,
The first bonding part and the second bonding part are electrically connected to the light emitting element,
The fourth bonding portion and the fifth bonding portion are electrically connected to the photodiode or phototransistor,
The line connecting the fifth bonding portion and the sixth bonding portion is electrically connected to the line connecting the second bonding portion and the second terminal,
The first terminal is an anode terminal;
The second terminal is an output terminal,
The third terminal is a GND (ground) terminal.

  According to the optical coupling device of the above embodiment, the electronic device manufacturing using the optical coupling device by molding the light emitting element in the first mold part and molding the photodiode or the phototransistor in the second mold part. Since the number of options for the external connection terminals that can be selected by the user increases, the usability can be improved.

The electronic device of the present invention is
The optical coupling device of the present invention is mounted.

  According to the electronic equipment having the above configuration, since an inexpensive optical coupling device is mounted regardless of the supply voltage, a power supply device equipped with a photocoupler and a photocopier equipped with a photo interrupter can be manufactured at low cost. Can be made cheaper.

  According to the lead frame of the present invention, by providing the first lead, the second lead, the third lead, the fourth lead, and the fifth lead, a high potential optical coupling device and a low potential optical coupling device are provided. Can be used in both.

  Therefore, the high-potential optical coupling device and the low-potential optical coupling device can be manufactured using a common facility, and the price of these optical coupling devices can be reduced.

  Further, since the first lead, the second lead, the third lead, the fourth lead, and the fifth lead can be arranged in a small region, the size can be reduced.

  According to the optical coupling device of the present invention, one of the light emitting element and the light receiving element is electrically connected to at least the first bonding part, the second bonding part, and the sixth bonding part of the lead frame, and the light emitting element and the light receiving element are connected. Since the other of the elements is electrically connected to the fourth bonding part and the fifth bonding part of the lead frame, the light emitting element can emit light reliably, and the light emitted from the light emitting element can be reliably received by the light receiving element. Can be detected.

  According to the substrate of the present invention, by providing the first wiring, the second wiring, the third wiring, the fourth wiring, and the fifth wiring, the high-potential optical coupling device and the low-potential optical coupling device Can be used in both.

  Therefore, the high-potential optical coupling device and the low-potential optical coupling device can be manufactured using a common facility, and the price of these optical coupling devices can be reduced.

  Further, since the first wiring, the second wiring, the third wiring, the fourth wiring, and the fifth wiring can be arranged in a small region, the size can be reduced.

  According to the optical coupling device of the present invention, one of the light emitting element and the light receiving element is electrically connected to at least the first bonding part, the second bonding part, and the sixth bonding part of the substrate, and the light emitting element and the light receiving element. The other is electrically connected to the fourth bonding portion and the fifth bonding portion of the substrate, so that the light emitting element can emit light reliably and the light emitted from the light emitting element can be reliably received by the light receiving element. Can be detected.

  According to the electronic apparatus of the present invention, since an inexpensive optical coupling device is mounted regardless of the supply voltage, a copying machine or printer mounted with a photo interrupter is inexpensive, and a power supply device mounted with a photo coupler Can be made cheaper.

FIG. 1 is a schematic configuration diagram of an optical coupling device according to a first embodiment of the present invention. FIG. 2 is a schematic diagram in which the optical coupling device of the first embodiment is two-dimensionally patterned. FIG. 3 is a schematic plan view of the lead frame of the first embodiment. FIG. 4 is a schematic cross-sectional view of a reflective photosensor as an application example of the first embodiment. FIG. 5 is a schematic cross-sectional view of a transmissive photo interrupter as an application example of the first embodiment. FIG. 6 is a schematic cross-sectional view of a photocoupler as an application example of the first embodiment. FIG. 7 is a schematic configuration diagram of an optical coupling device according to a modification of the first embodiment. FIG. 8 is a schematic configuration diagram of an optical coupling device according to a modification of the first embodiment. FIG. 9 is a schematic configuration diagram of an optical coupling device according to a second embodiment of the present invention. FIG. 10 is a schematic diagram in which the optical coupling device of the second embodiment is two-dimensionally patterned. FIG. 11 is a schematic configuration diagram of an optical coupling device according to a third embodiment of the present invention. FIG. 12 is a schematic diagram in which the optical coupling device of the third embodiment is two-dimensionally patterned. FIG. 13 is a schematic configuration diagram of a modified example of the optical coupling device of the third embodiment. FIG. 14 is a schematic plan view of a printed circuit board according to an embodiment of the present invention. FIG. 15 is a schematic configuration diagram of an optical coupling device of a comparative example of the present invention. FIG. 16 is a circuit diagram of a conventional optical coupling device. FIG. 17 is a circuit diagram of another conventional optical coupling device.

  The optical coupling device of the present invention will be described in detail below with reference to the illustrated embodiments.

[First Embodiment]
FIG. 1 is a schematic configuration diagram of an optical coupling device according to a first embodiment of the present invention. FIG. 2 is a schematic diagram in which the optical coupling device is two-dimensionally patterned.

  As shown in FIGS. 1 and 2, the optical coupling device includes a first terminal 7, a second terminal 8, a third terminal 9, and a first bonding unit 1 to a sixth bonding unit 6. The first terminal 7, the second terminal 8, and the third terminal 9 are input / output terminals of the optical coupling device, and are used for electrical connection with an external electronic device.

  On the first bonding part 1, the second bonding part 2, the third bonding part 3 and the sixth bonding part 6, a first mold part 10 made of a translucent resin is mounted. The circuit-embedded light receiving element 13 is sealed by the first mold part 10. The circuit built-in light receiving element 13 is an example of a light receiving element.

  The circuit built-in light receiving element 13 includes a constant current source 14, a constant voltage source 15, an amplifier 16, a comparator 17, an output transistor 18, and a photodiode 19.

  On the 4th bonding part 4 and the 5th bonding part 5, the 2nd mold part 11 which consists of translucent resin is mounted. The light emitting element 12 is sealed by the second mold part 11.

  The first terminal 7 is electrically connected to the first bonding unit 1. The first bonding unit 1 is electrically connected to the GND pad 24 by wire bonding. The GND pad 24 is directly connected to the emitter of the output transistor 18 in the light receiving element 13 with a built-in circuit.

  The second terminal 8 is electrically connected to the second bonding part 2. The second bonding portion 2 is electrically connected to the Vout pad 25 by wire bonding.

  The third terminal 9 is electrically connected to the third bonding portion 3 and the fourth bonding portion 4. The third bonding portion 3 is electrically connected to the Vcc pad 27 by wire bonding. The fourth bonding portion 4 is electrically connected to the anode pad of the light emitting element 12 by a back electrode made of wire bonding or silver paste.

  The fifth bonding part 5 is electrically connected to the sixth bonding part 6. The fifth bonding portion 5 is electrically connected to the cathode pad of the light emitting element 12 by wire bonding or a back electrode made of silver paste. The sixth bonding portion 6 is electrically connected to the Is pad 26 by wire bonding. The Is pad 26 is directly connected to the input terminal of the constant current source 14 in the light receiving element 13 with a built-in circuit.

  FIG. 3 is a schematic plan view of the lead frame 30 provided in the optical coupling device.

  The lead frame 30 includes a first lead 31, a second lead 32, a third lead 33, a fourth lead 34, and a fifth lead 35 made of a conductor.

  The first lead 31 is provided so as to be bent at a substantially straight first lead body 36, a first terminal 7 provided at one end of the first lead body 36, and the other end of the first lead body 36. The first bonding part 1 is provided.

  The second lead 32 is mostly parallel to the first lead body 36 and bent in a substantially bowl shape from one end side to the other end side, and one end of the second lead body 37. And a second bonding portion 2 provided at the other end of the second lead body 37.

  The third lead 33 includes a third lead body 38 substantially parallel to the first lead body 36, a third terminal 9 provided at one end of the third lead body 38, and the other end of the third lead body 38. And a third bonding portion 3 that is bent toward the second lead main body 37 side.

  The fourth lead 34 has a fourth lead body 41 and a fourth bonding portion 4 provided at the tip of the fourth lead body 41.

  The fourth lead body 41 includes a branch portion 39 that is bent from the middle of the third lead body 38 and a parallel portion 40 that is bent from the branch portion 39 and extends substantially parallel to the second lead 32 portion body. Have.

  The fifth lead 35 includes a fifth lead body 42, a fifth bonding portion 5 provided at one end of the fifth lead body 42, bent toward the second lead body 37, and the fifth lead body 42. And a sixth bonding portion 6 provided at the other end.

  The fifth lead main body 42 includes a U-shaped portion 43 covered in three directions by the parallel portion 40 and the branching portion 39 of the fourth lead main body 41 and the third lead main body 38, and a second portion from the U-shaped portion 43. After bending toward the lead main body 37 side, an L-shaped portion 44 extending substantially parallel to the second lead main body 37 and having the sixth bonding portion 6 at the tip is provided.

  According to the optical coupling device having the above configuration, the first terminal 7 can be a GND terminal, the second terminal 8 can be an output terminal, the third terminal 9 can be a power supply (Vcc) terminal, and the supply voltage is directly a constant voltage circuit. Since it is input to the unit 15, a stable potential can be supplied to the amplifier 16 and the comparator 17. Furthermore, Vcc is input to the anode of the light emitting element 12 of the second mold part 11, and there is a potential drop by a forward voltage of the light emitting element 12 (about 1.3V in the case of a general LED). A sufficient potential can be supplied to operate the constant current source 14 for 3V driving, which is a typical value of low voltage driving.

  Therefore, the above-described optical coupling device can be driven without any problem as long as the light receiving element with built-in circuit can cope with the high potential as well as the low voltage (3 V) drive.

  That is, when the first mold part 10 and the second mold part 11 are formed on the lead frame 30, and the light emitting element 12 and the circuit built-in light receiving element 13 are electrically connected to each other by the predetermined wire bonding described above, An optical coupling device capable of high voltage driving and low voltage driving can be configured.

  As a result, the lead frame 30 can be used in both the high potential optical coupling device and the low potential optical coupling device, and the high potential optical coupling device and the low potential optical coupling device Can be manufactured with a common facility, and the price of these optical coupling devices can be reduced.

  On the other hand, in the configuration shown in FIG. 15, the voltage drops by the forward potential of the light emitting element 112 and is input to the constant voltage circuit. Therefore, when the supply voltage Vcc is low (3 V), the amplifier 116 is short of the supply potential. Thus, the comparator 117 and the constant voltage source 115 cannot be stably driven.

  Therefore, a lead frame (substrate) corresponding to each of the high potential optical coupling device and the low potential optical coupling device is prepared, and processing equipment capable of accommodating a plurality of lead frames (substrates) is also prepared. Must.

  FIG. 4 is a schematic cross-sectional view of an example in which the optical coupling device of the first embodiment is applied to a reflection type optical sensor (such as an optical switch). As shown in FIG. 4, the light emitted from the light emitting element 12 is reflected by the measured object 20 and enters the photodiode 19 to detect the presence or absence of the object.

  FIG. 5 is a schematic cross-sectional view of an example in which the optical coupling device according to the first embodiment is applied to a transmissive photo interrupter. In the example shown in FIG. 5, the light emitting element 12 and the photodiode 19 are opposed to each other, and the presence / absence of an object is detected based on whether or not the object to be measured 20 enters so as to block the optical axis therebetween.

  5 is manufactured, the first bonding portion 1 side portion of the first lead body 36, the second bonding portion 2 side portion of the second lead body 37, and the L-shaped portion 44 are formed. Erecting the part on the sixth bonding part 6 side, the part on the third bonding part 3 side of the third lead body 38, the part on the fifth bonding part 5 side of the U-shaped part 43, and the parallel part 40 Thus, the photodiode 19 can be easily opposed to the light emitting element 12.

  FIG. 6 is a schematic cross-sectional view of an example in which the optical coupling device of the first embodiment is applied to a photocoupler. As shown in FIG. 6, the optical axis connecting the light receiving and emitting elements is closed by the case body 21, and the primary side (input side) and the secondary side (light receiving side) are connected by light and are electrically connected. Therefore, the electrical noise on the first side is not transmitted to the secondary side.

  By the way, the output of the optical coupling device is connected to a pull-up resistor between Vout and Vcc, and is generally provided by using an external resistor on the electronic device side where the optical coupling device is mounted.

  On the other hand, in the optical coupling device according to the modification of the first embodiment, as shown in FIG. 7, a pull-up resistor 22 is provided in the chip between the Vcc pad and the Vout pad in the built-in light receiving element 13. When using this optical coupling device, it is not necessary to prepare a pull-up resistor as an external resistor, so that the optical coupling device of the present invention can be made easier to use. In addition, 45 of FIG. 7 is a power supply line.

  In the first embodiment, a constant current resistor 23 shown in FIG. 8 may be used instead of the constant current source 14. The circuit built-in light receiving element 213 having the constant current resistor 23 is generally made of silicon, and the constant current resistor 23 is easily formed by diffusion resistance or polysilicon resistance formed by ion implantation into silicon. Can be formed.

  The diffusion resistance has a positive temperature coefficient that increases as the temperature rises. Conversely, the polysilicon resistance has a negative temperature coefficient that decreases as the temperature rises. Semiconductor light emitting devices such as LEDs (light emitting diodes) and LDs (laser diodes) generally have a tendency that the amount of light emission decreases with the same drive current as the temperature rises. When the above diffused resistors are used, the resistance value is a positive temperature coefficient. Therefore, when Vcc is constant, the driving current tends to be reduced, and the light emission amount is further reduced. On the other hand, since the resistance value of the polysilicon resistor has a negative temperature coefficient, the drive current tends to increase as the temperature rises. Can be supplemented. However, whether or not the polysilicon resistor is mounted depends on the semiconductor process of the light receiving element with a built-in circuit to be used. Which resistance is used as the constant current source resistor 23 depends on the temperature characteristics and price required by the electronic equipment equipped with the present optical coupling device (the price increase of the light receiving element with built-in circuit by using the polysilicon resistor). It is decided by.

  In the first embodiment, the first bonding portion 1 is provided so as to bend at the other end of the first lead body 36. For example, the first bonding portion 1 is not bent at the other end of the first lead body 36. 3 may be provided adjacent to the second bonding portion 2 in the left-right direction.

  In the first embodiment, the second lead body 37 is bent in a substantially bowl shape from one end side to the other end side. For example, the second lead body 37 extends linearly from one end side to the other end side. It may be.

  In the first embodiment, the third bonding portion 3 is provided by being bent from the other end of the third lead body 38 toward the second lead body 37 side. Instead of bending from the other end toward the second lead body 37 side, it may be provided adjacent to the sixth bonding portion 6 in the left-right direction in FIG.

  In the first embodiment, the parallel portion 40 is bent from the branch portion 39 and extends substantially parallel to the second lead body 37. However, for example, the parallel portion 40 is bent from the branch portion 39 and substantially the same as the second lead body 37. You may make it extend in parallel.

  In the first embodiment, the fifth bonding portion 5 is bent toward the second lead body 37 side. For example, the fifth bonding portion 5 is not bent toward the second lead body 37 side. You may make it provide so that it may adjoin to the 4th bonding part 4 in the left-right direction.

  In the first embodiment, the fifth lead main body 42 has the U-shaped portion 43 and the L-shaped portion 44. For example, the fifth lead main body 42 should not have the U-shaped portion 43 and the L-shaped portion 44. Alternatively, it may be composed of only a linear portion.

[Second Embodiment]
FIG. 9 is a schematic configuration diagram of an optical coupling device according to a second embodiment of the present invention. 9, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals as those of the components in FIG.

  In the optical coupling device of the second embodiment, the input sides of the constant voltage source 15 and the constant current source 14 are short-circuited in the light receiving element 213 with built-in circuit, and the sixth bonding unit 6 is passed through the Is pad 26 (see FIG. 2). The second embodiment is different from the first embodiment in that it is connected to the third bonding portion 3 and the third bonding portion 3 is open without being connected to anything. 15 differs from the circuit of FIG. 15 in the presence or absence of the third bonding portion 3. The circuit built-in light receiving element 213 is sealed by a mold part 210 made of a translucent resin.

  The second embodiment is used when a supply voltage is sufficiently high, for example, when 5 V is supplied. The light emitting element 12 and the constant voltage source 15 are connected in series, and there is a potential drop of a forward voltage (about 1.2 to 1.5 V) at the light emitting element 12, but the circuit built-in light receiving element 213 has about 3.5 V. Thus, the amplifier 16 and the comparator 17 can be stably operated.

  Further, the circuit built-in light receiving element 213 according to the second embodiment is provided with three pads for wire bonding, and therefore the chip size can be reduced, so that it can be provided at a lower price.

  Further, as shown in FIG. 10, since the same lead frame 30 as in the first embodiment can be used, it is not necessary to prepare a member (lead frame) specially, and both forms of the optical coupling device In the process of manufacturing, the production equipment can be shared in each process such as the molding process and the cutting process, so that it is possible to provide both the low potential driving type and the high potential driving type optical coupling device at low cost.

[Third Embodiment]
FIG. 11 is a schematic configuration diagram of an optical coupling device according to a third embodiment of the present invention. 9, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals as those of the components in FIG.

  The optical coupling device of the third embodiment is different from the first embodiment in that a phototransistor 28 is used as an example of a light receiving element. The phototransistor 28 is sealed by a mold part 310 made of a translucent resin. The collector pad of the phototransistor 28 is electrically connected to the first bonding unit 1, and the emitter (GND) pad of the phototransistor 28 is electrically connected to the second bonding unit 2. Further, the sixth bonding part 6 is electrically connected to the second bonding part 2 by a short wire 29. By connecting in this way, another type of optical coupling device whose output is analog can be provided.

  Further, as shown in the two-dimensional pattern diagram of FIG. 12, the third embodiment can be manufactured using the same lead frame 30 as the first and second embodiments, and a new member is prepared. Since it is not necessary and production equipment for each process can be supplied, it is possible to provide each type of optical coupling device at low cost.

  In the third embodiment, as shown in FIG. 13, the light emitting element and the light receiving element can be interchanged to form the light emitting element 412 in the first mold part 410 and the phototransistor 428 in the second mold part 411. is there. What is necessary is just to select the more convenient one when installing with respect to the electronic device with the restriction | limiting of the light emission direction.

  By the way, the optical coupling device in the first to third embodiments is very effective when used as a paper detection device such as a printer or a copying machine. Electronic devices such as printers and copiers have a paper feed function. By installing each optical coupling device in each paper feed mechanism, it is possible to know to which paper feed mechanism the paper has passed and processed. The electronic device can be processed smoothly. Also, when a paper jam or the like occurs, the user can be notified of which paper feed mechanism is jammed, and the effect is very great.

  In the first to third embodiments, a printed circuit board 530 shown in FIG. 14 may be used instead of the lead frame 30. The printed board 530 is an example of a board.

  The printed circuit board 530 is formed on the surface of the substrate body 550 made of an insulator, and the first wiring 531, the second wiring 532, the third wiring 533, the fourth wiring 534, and the second wiring formed of a conductor. 5 wirings 535 are provided.

  The first wiring 531 is provided so as to be bent to a substantially linear first wiring body 536, a first terminal 507 provided at one end of the first wiring body 536, and the other end of the first wiring body 536. The first bonding unit 501 is provided.

  The second wiring 532 is substantially parallel to the first wiring body 536, and is bent in a substantially bowl shape from one end side to the other end side, and one end of the second wiring body 537. A second terminal 508 provided on the second wiring body 537 and a second bonding portion 502 provided on the other end of the second wiring body 537.

  The third wiring 533 includes a third wiring body 538 substantially parallel to the first wiring body 536, a third terminal 509 provided at one end of the third wiring body 538, and the other end of the third wiring body 538. And a third bonding portion 503 that is bent toward the second wiring body 537 side.

  The fourth wiring 534 includes a fourth wiring main body 541 and a fourth bonding portion 504 provided at the tip of the fourth wiring main body 541.

  The fourth wiring body 541 includes a branch portion 39 that is bent from the middle of the third wiring body 538 and a parallel portion 40 that is bent from the branch portion 39 and extends substantially parallel to the second wiring 532 portion body. Have.

  The fifth wiring 535 includes a fifth wiring body 542, a fifth bonding portion 505 provided at one end of the fifth wiring body 542, bent toward the second wiring body 537, and the fifth wiring body 542. And a sixth bonding portion 506 provided at the other end.

  The fifth wiring main body 542 includes a U-shaped portion 543 covered in three directions by the parallel portion 40 and the branching portion 39 of the fourth wiring main body 541 and the third wiring main body 538, and the second U-shaped portion 543 to the second After being bent toward the wiring body 537 side, an L-shaped portion 544 extending substantially parallel to the second wiring body 537 and having a sixth bonding portion 506 at the tip is provided.

  Even if such a printed circuit board 530 is used, the same effect as the first to third embodiments can be obtained.

  Further, the lead frame 30 and the printed circuit board 530 can contribute to downsizing of the optical coupling device.

  In the printed circuit board 530, the first bonding part 501 is provided to bend to the other end of the first wiring body 536. For example, the first bonding part 501 is not bent to the other end of the first wiring body 536, as shown in FIG. You may make it provide so that it may adjoin to the 2nd bonding part 502 in the horizontal direction inside.

  In the printed circuit board 530, the second wiring body 537 is bent in a substantially bowl shape from one end side to the other end side. For example, the second wiring body 537 extends linearly from one end side to the other end side. May be.

  In the printed circuit board 530, the third bonding portion 503 is bent from the other end of the third wiring body 538 toward the second wiring body 537 side. Instead of being bent toward the second wiring body 537 from the end, it may be provided adjacent to the sixth bonding portion 506 in the left-right direction in FIG.

  In the printed circuit board 530, the parallel portion 540 is bent from the branch portion 539 and extends substantially parallel to the second wiring body 537. For example, the parallel portion 540 is bent from the branch portion 539 and substantially parallel to the second wiring body 537. You may make it extend to.

  In the printed circuit board 530, the fifth bonding portion 5 is bent toward the second wiring body 537 side. For example, the fifth bonding portion 5 is not bent toward the second wiring body 537 side. It may be provided so as to be adjacent to the fourth bonding portion 504 in the direction.

  In the printed circuit board 530, the fifth wiring main body 542 has the U-shaped portion 543 and the L-shaped portion 544. For example, the fifth wiring main body 542 does not have the U-shaped portion 543 and the L-shaped portion 544. You may make it consist only of a linear part.

  A flexible substrate may be created with the configuration of the printed circuit board 530. This flexible substrate can be suitably used for the transmissive photointerrupter of FIG.

  As described above, specific embodiments and modifications of the present invention have been described. However, the present invention is not limited to the first to third embodiments and these modifications, and is within the scope of the present invention. Various modifications can be made.

DESCRIPTION OF SYMBOLS 1 ... 1st bonding part 2 ... 2nd bonding part 3 ... 3rd bonding part 4 ... 4th bonding part 5 ... 5th bonding part 6 ... 6th bonding part 7 ... 1st terminal 8 ... 2nd terminal 9 ... 3rd Terminals 10, 210 ... 1st mold part 11 ... 2nd mold part 12, 412 ... Light emitting element 13, 213 ... Light receiving element with built-in circuit 14 ... Constant current source 15 ... Constant voltage source 16 ... Amplifier 17 ... Comparator 18 ... Output transistor DESCRIPTION OF SYMBOLS 19 ... Photodiode 20 ... Detected object 21 ... Case 22 ... Pull-up resistor 23 ... Constant current source resistor 24 ... GND pad 25 ... Vout pad 26 ... Is pad 27 ... Vcc pad 28,428 ... Phototransistor 29 ... Short wire 30 ... Lead frame 31 ... First lead 32 ... Second lead 33 ... Third lead 34 ... Fourth lead 35 ... Fifth lead 36 ... First Lead main body 37 ... second lead main body 38 ... third lead main body 39 ... branching section 40 ... parallel section 41 ... fourth lead main body 42 ... fifth lead main body 43 ... U-shaped section 44 ... L-shaped section 44 ... power line 530 ... Printed circuit board 531 ... First wiring 532 ... Second wiring 533 ... Third wiring 534 ... Fourth wiring 535 ... Fifth wiring 536 ... First lead body 537 ... Second wiring body 538 ... Third wiring body 539 ... Branch Part 540 ... Parallel part 541 ... Fourth wiring body 542 ... Fifth wiring body 543 ... U-shaped part 544 ... L-shaped part

Claims (14)

A first lead having a substantially straight first lead body, a first terminal provided at one end of the first lead body, and a first bonding portion provided at the other end of the first lead body;
A second lead body that is substantially parallel to the first lead body, a second terminal provided at one end of the second lead body, and a second bonding portion provided at the other end of the second lead body A second lead having
A third lead body substantially parallel to the first lead body; a third terminal provided at one end of the third lead body; and a third bonding portion provided at the other end of the third lead body. The third lead,
A fourth lead body having a branch portion that bends and branches from the middle of the third lead body, a parallel portion that extends substantially parallel to the second lead body from the branch portion, and a tip of the fourth lead body. A fourth lead having a fourth bonding portion provided;
A fifth lead having a fifth lead body, a fifth bonding portion provided at one end of the fifth lead body, and a sixth bonding portion provided at the other end of the fifth lead body; Lead frame characterized by. The lead frame according to claim 1,
The first bonding part is provided to bend at the other end of the first lead body,
The second lead body is bent in a substantially bowl shape from one end side to the other end side,
The third bonding part is provided to bend from the other end of the third lead body toward the second lead body,
The parallel part is bent from the branch part and extends substantially parallel to the second lead body,
The fifth bonding portion bends toward the second lead body;
The fifth lead body is
A U-shaped part covered on three sides with the parallel part and the branch part of the fourth lead body and the third lead body;
After bending from the U-shaped portion toward the second lead main body, the L-shaped portion extends substantially parallel to the second lead main body and has the sixth bonding portion at the tip. Lead frame. The lead frame according to claim 1 or 2,
A light emitting element and a light receiving element;
A first mold part comprising at least a part of translucent resin;
A second mold part comprising at least a part of a translucent resin,
One of the light emitting element and the light receiving element is electrically connected to at least the first bonding portion, the second bonding portion, and the sixth bonding portion of the lead frame, and at least a part thereof is made of a translucent resin. Molded in the first mold part,
The other of the light emitting element and the light receiving element is electrically connected to the fourth bonding part and the fifth bonding part of the lead frame, and at least a part thereof is molded by a second mold part made of a translucent resin. An optical coupling device characterized by that. A first wiring having a substantially straight first wiring body, a first terminal provided at one end of the first wiring body, and a first bonding portion provided at the other end of the first wiring body;
A second wiring body that is substantially parallel to the first wiring body; a second terminal provided at one end of the second wiring body; and a second bonding portion provided at the other end of the second wiring body. A second wiring having
A third wiring main body substantially parallel to the first wiring, a third terminal provided at one end of the third wiring main body, and a third bonding portion provided at the other end of the third wiring main body. 3 wirings,
A branch portion that bends and branches from the middle of the third wiring body; a fourth wiring body that has a parallel portion extending substantially parallel to the second wiring body from the branch portion; and a tip of the fourth wiring body. A fourth wiring having a fourth bonding portion provided;
A fifth wiring body, and a fifth wiring having a fifth bonding portion provided at one end of the fifth wiring body and a sixth bonding portion provided at the other end of the fifth wiring body. A substrate characterized by. The substrate according to claim 4, wherein
The first bonding part is provided to bend at the other end of the first wiring body,
The second wiring body is bent in a substantially bowl shape from one end side to the other end side,
The third bonding portion is provided by being bent from the other end of the third wiring body toward the second wiring body,
The parallel part is bent from the branch part and extends substantially parallel to the second wiring body,
The fifth bonding portion is bent toward the second wiring body;
The fifth wiring body is
A U-shaped part covered on three sides with the parallel part and the branch part of the fourth wiring body and the third wiring body;
After being bent from the U-shaped portion toward the second wiring main body, the L-shaped portion extends substantially parallel to the second wiring main body and has the sixth bonding portion at the tip. Board to be. A substrate according to claim 4 or 5, and
A light emitting element and a light receiving element;
A first mold part comprising at least a part of translucent resin;
A second mold part comprising at least a part of a translucent resin,
One of the light emitting element and the light receiving element is electrically connected to at least the first bonding portion, the second bonding portion, and the sixth bonding portion of the substrate, and the at least part of the light emitting element and the light receiving element is made of a translucent resin. Molded in one mold part,
The other of the light emitting element and the light receiving element is electrically connected to the fourth bonding part and the fifth bonding part of the substrate, and at least a part of the light emitting element and the light receiving element are molded by a second mold part made of a translucent resin. An optical coupling device. The optical coupling device according to claim 3 or 6,
The light receiving element is a light receiving element with a built-in circuit having a photodiode and a signal processing circuit on the same chip,
The signal processing circuit includes at least a constant voltage source, a constant current source, an amplifier, a comparator, and an output transistor,
The light receiving element with a built-in circuit is molded by the first mold part,
The light emitting element is molded by the second mold part,
The first terminal is one of a GND terminal and an output terminal,
The second terminal is the other of the GND terminal and the output terminal;
The optical coupling device, wherein the third terminal is a Vcc terminal. The optical coupling device according to claim 7,
The circuit built-in light receiving element has a GND pad, a Vout pad, a Vcc pad, and an Is pad,
The first bonding part is electrically connected to the GND pad,
The second bonding part is electrically connected to the Vout pad,
The third bonding portion is electrically connected to the Vcc pad,
The fourth bonding part is electrically connected to the anode of the light emitting element,
The fifth bonding part is electrically connected to the cathode of the light emitting element,
The optical coupling device, wherein the sixth bonding portion is electrically connected to the Is pad. The optical coupling device according to claim 8,
The third bonding unit is electrically connected to the constant voltage source through a power line,
An optical coupling device, wherein a pull-up resistor is provided between the power supply line and the output transistor. The optical coupling device according to any one of claims 7 to 9,
The optical coupling device, wherein the constant current source is a resistor. The optical coupling device according to claim 7,
The circuit built-in light receiving element has a GND pad, a Vout pad, and an Is pad,
The first bonding part is electrically connected to the GND pad,
The second bonding part is electrically connected to the Vout pad,
The fourth bonding part is electrically connected to the anode of the light emitting element,
The fifth bonding part is electrically connected to the cathode of the light emitting element,
The optical coupling device, wherein the sixth bonding portion is electrically connected to the Is pad. The optical coupling device according to claim 3 or 6,
The light receiving element is a photodiode or a phototransistor,
The photodiode or phototransistor is molded in the first mold part,
The light emitting element is molded by the second mold part,
The first bonding portion and the second bonding portion are electrically connected to the photodiode or phototransistor,
The fourth bonding part and the fifth bonding part are electrically connected to the light emitting element,
The line connecting the fifth bonding part and the sixth bonding part is electrically connected to the line connecting the first bonding part and the second bonding part,
The first terminal is one of a GND terminal and an output terminal;
The second terminal is the other of the GND terminal and the output terminal,
The optical coupling device, wherein the third terminal is an anode terminal. The optical coupling device according to claim 3 or 6,
The light receiving element is a photodiode or a phototransistor,
The light emitting element is molded by the first mold part,
The photodiode or phototransistor is molded in the second mold part,
The first bonding part and the second bonding part are electrically connected to the light emitting element,
The fourth bonding portion and the fifth bonding portion are electrically connected to the photodiode or phototransistor,
The line connecting the fifth bonding portion and the sixth bonding portion is electrically connected to the line connecting the second bonding portion and the second terminal,
The first terminal is an anode terminal;
The second terminal is an output terminal,
The optical coupling device, wherein the third terminal is a GND terminal.   An electronic apparatus comprising the optical coupling device according to any one of claims 3 and 6 to 13.

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