JP2010169568A - Voltage sensor and clip for electrostatic inductive detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a voltage sensor of an electrostatic inductive detector which is very strong, has a simple structure, deals with a miniaturization, ensures an insulation, is easily assembled, and reduces a manufacturing cost. <P>SOLUTION: In the voltage sensor 11 having the integral structure, a surface conductive layer 131a is formed by applying a copper foil layer on the front layer of a printed wiring board 12. A main surface section for covering a large portion of a plane size other than a peripheral margin in the printed wiring board 12 is connected to a first penetration via 16. A first conductive layer 132a is formed by applying a copper foil layer on the internal layer of the printed wiring board 12 insulated from the surface conductive layer 131a through a surface substrate layer 131b. The main surface section for covering the large portion of the plane size other than the peripheral margin in the printed wiring board 12 is connected to a second penetration via 17. The surface conductive layer 131a functions as a sensor electrode. The first conductive layer 132a functions as a shield electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention simplifies the structure of a sensor electrode that is electrostatically induced from a conductor to be measured and is provided in a clip included in an electrostatic induction detector such as a phase detector or a voltage detector, and corresponds to downsizing of the clip. The present invention relates to a voltage sensor and a clip that can be easily incorporated into an electrostatic induction detector.

  A clip included in an electrostatic induction detector such as a phase detector or a voltage detector is provided with a sensor electrode for detecting electric charge from a measured conductor to be detected by electrostatic induction. This type of clip has a structure in which one side clip part and the other side clip part can be opened and closed in order to hold the conductor to be measured by using a support shaft with a torsion coil spring having a substantially V shape. Yes, the holding portions facing each other in the pair of clip portions are normally closed, and the measured conductor is pinched. In addition, voltage sensors are individually arranged inside each holding portion, and when the conductor to be measured is held, charges can be detected by electrostatic induction (for example, , See Patent Document 1).

  Each of the voltage sensors in the clip of the electrostatic induction detector includes a sensor electrode piece arranged on the side of the conductor to be measured and a sensor electrode piece for shielding disturbance electrostatic induction generated from other close AC circuits. It is formed by combining a shield electrode piece arranged in the vicinity of the outside with an insulating layer coated with an insulating paint and an insulating material such as an insulating film or an insulating tape interposed therebetween. Yes. For the sensor electrode piece and the shield electrode piece, for example, a plate-like conductive metal material such as a copper plate formed by using a molding technique such as pressing or machining is used.

  In addition, in a conventional phase detector, a voltage detection electrode and a current detection electrode are enclosed in an annular molded body, the voltage detection electrode is disposed inside the current detection electrode, and between them. Some have a shielding layer (see, for example, Patent Document 2).

JP 2006-30141 A Japanese Patent Publication No. 1-261510

  However, since the voltage sensor provided in the clip described in Patent Document 1 is formed by combining a sensor electrode piece and a shield electrode piece prepared separately, they are insulated and arranged close to each other. It is difficult to do it, and it is difficult to incorporate it into the clip part on one side and the clip part on the other side. was there.

  In addition, when a voltage sensor is formed on a flexible printed circuit board that is flexible and greatly deformed, it is necessary to dispose the sensor electrode piece and the shield electrode piece separately with a thin insulating sheet. However, it is difficult to integrally form the sensor electrode piece and the shield electrode piece in close contact with each other. Not only does the possibility of disconnection and short-circuiting due to the influence of bending during assembly, but it is also required when creating a new one. There is a problem that the initial cost and the unit price per sensor are very high.

  Furthermore, also in the phase detector described in Patent Document 2, a shielding layer that prevents electrostatic induction from a different phase line is provided separately from the voltage detection electrode. It was something to have.

  In view of the above-mentioned problems found in the prior art, the present invention is not only very durable and can cope with downsizing with a simple structure, but also ensures insulation and is easy to incorporate. It is an object of the present invention to provide a voltage sensor and a clip for an electrostatic induction detector that can be manufactured at a very low cost.

  In order to solve the above problems, a voltage sensor for an electrostatic induction detector according to claim 1 is a printed wiring board having an appropriate planar shape manufactured by a printed circuit board manufacturing technique, and an in-plane of the printed wiring board. So that the insulating layer is held through an insulating substrate and a pair of conductive layers disposed in different layers, each of which is a majority of the surface size of the printed wiring board. The main surface part which covers is connected with the land copper foil part for soldering.

  The invention according to claim 2 is the voltage sensor for an electrostatic induction detector according to claim 1, wherein both of the pair of conductive layers are arranged in an inner layer of a printed wiring board.

  According to a third aspect of the present invention, in the voltage sensor for an electrostatic induction detector according to the first or second aspect, the conductive layer disposed in the inner layer of the printed wiring board is connected to the main surface portion. A copper foil portion for soldering is formed by through vias.

  In addition, the clip for electrostatic induction detector according to claim 4 is provided in such a manner that each printed wiring board holding part side that is opened and closed to hold the conductor to be measured is urged in the normally closed direction and is integrally supported. It comprises a side clip part and an other side clip part, and the voltage sensor for an electrostatic induction detector according to any one of claims 1 to 3 comprises the one side clip part and the other side clip part. It is characterized by being provided inside each printed wiring board holding part.

  According to the voltage sensor for the electrostatic induction detector according to claim 1, the printed circuit board having an appropriate planar shape manufactured by the printed circuit board manufacturing technique, and the insulating substrate so as to fit within the plane of the printed circuit board The main surface portion that covers most of the surface size of the printed wiring board is soldered to each of the conductive layers. A pair of conductive layers can be completely insulated from each other, and one conductive layer can be used as a sensor electrode and the other conductive layer can be used as a shield electrode. be able to.

  According to the voltage sensor for electrostatic induction detectors according to claim 2, since both of the pair of conductive layers are arranged in the inner layer of the printed wiring board, both the conductive layers are completely insulated from the outside. In addition, it is possible to protect the conductive layer from external impacts, etc., and in the structure of the printed wiring board, between the adjacent layers of the multilayer printed wiring board, each conductive layer is more Since the interval can be easily reduced, as a result, it is possible to make it less susceptible to the influence of noise from the outside.

  According to the voltage sensor for an electrostatic induction detector according to claim 3, the conductive layer disposed in the inner layer of the printed wiring board has a copper foil portion for soldering by a through via connected to the main surface portion. Since it is formed, the conductive layer provided in the inner layer can be easily connected to a wire or the like. Moreover, even when an external force is applied to the wire connected to the printed wiring board, the land on the printed wiring board is difficult to peel off.

  According to the clip for the electrostatic induction detector according to claim 4, each printed wiring board holding part side that is opened and closed to hold the conductor to be measured is urged in the normally closed direction and is integrally pivotally supported. It comprises a side clip part and an other side clip part, and the voltage sensor for an electrostatic induction detector according to any one of claims 1 to 3 comprises the one side clip part and the other side clip part. Therefore, not only can the clip itself be downsized, but also its assembling work can be simplified.

(A) is a schematic top view of the voltage sensor which concerns on 1st Embodiment, (b) is a schematic bottom view of the voltage sensor which concerns on 1st Embodiment, (c) is CC line arrow view in Fig.1 (a). Sectional drawing and (d) are DD sectional view taken on the line in Fig.1 (a). (A) is a schematic top view of the voltage sensor which concerns on 2nd Embodiment, (b) is a schematic bottom view of the voltage sensor which concerns on 2nd Embodiment, (c) is CC arrow view in Fig.2 (a). Sectional drawing and (d) are DD DD sectional views taken on the line in FIG. (A) is a schematic top view of the voltage sensor which concerns on 3rd Embodiment, (b) is a schematic bottom view of the voltage sensor which concerns on 3rd Embodiment, (c) is CC line arrow view in Fig.3 (a). Sectional drawing and (d) are DD sectional view taken on the line in Fig.3 (a). It is a schematic structure explanatory drawing of the clip concerning the present invention.

  Next, an embodiment of a voltage sensor according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows a first embodiment of a voltage sensor according to the present invention. FIG. 1 (a) shows a plane of the voltage sensor 11 (surface disposed on the measured conductor side), and FIG. 1 shows the bottom surface (back surface), FIG. 1C shows a cross-section in the direction of the arrows CC in FIG. 1A, and FIG. 1D shows the DD line in FIG. A cross section in the direction of the arrow is shown.

  The voltage sensor 11 according to the first embodiment is separately disposed on the surface conductive layer 131a and the first conductive layer 132a, which are different laminated surfaces, so as to be within the plane of the printed wiring board 12, and the surface conductive layer 131a is formed by the solder resist 15 so as to be insulated from the outside.

  Among these, the printed wiring board 12 is composed of, for example, a paper phenol board, a paper epoxy board, a glass composite board, a glass epoxy board, a Teflon (registered trademark) board, an alumina board, a composite board, and the like. It is formed with a structure such as an up substrate.

  The surface conductive layer 131a formed by adhering a copper foil layer to the surface layer of the printed wiring board 12 has a main surface portion that covers most of the surface size with a margin around the printed wiring board 12, and the first through via 16 is connected.

  Further, it is formed by attaching a copper foil layer to an inner layer of the printed wiring board 12 (an inner layer insulated from the surface conductive layer 131a via the surface substrate layer 131b) different from the surface conductive layer 131a of the printed wiring board 12. The first conductive layer 132 a is formed in a state where a main surface portion that covers most of the surface size with a margin around the printed wiring board 12 is connected to the second through via 17.

  When the conductive layer is formed on the surface of the printed wiring board 12 like the surface conductive layer 131a, it is insulated by the solder resist 15, whereby the first and second through vias 16 and 17 for soldering are formed. The entire surface conductive layer 131a of the printed wiring board 12 excluding the surface area located is covered.

  That is, the voltage sensor 11 for an electrostatic induction detector according to the present embodiment holds a pair of conductive layers (surface conductive layers) while maintaining insulation by a printed wiring board 12 having an appropriate planar shape manufactured by a printed circuit board manufacturing technique. 131a and the first conductive layer 132a) form a sensor structure in which the conductive layer for the sensor electrode and the conductive layer for the shield electrode are integrated (the front side of the voltage sensor 11 is the sensor surface 13 and the rear side is shielded) The structure of the surface 14) can be realized, is very strong, and not only can cope with miniaturization well with a simple structure, but also ensures insulation and is easy to incorporate. Can also be very inexpensive.

  The layer for forming the conductive layer for shielding against the surface conductive layer 131a for charge detection is not limited to the first conductive layer 132a, but may be the second conductive layer 133a via the first substrate layer 132b. Further, the third conductive layer 134a may be formed through the second substrate layer 133b. Further, the planar shape of the printed wiring board 12 and the planar shapes of the surface conductive layer 131a and the first conductive layer 132a are not particularly limited, and may be appropriately modified. Further, when it is not particularly necessary to improve the withstand voltage characteristics or avoid the influence of condensation, the surface conductive layer 131a may not be covered with the solder resist 15 or the like.

  Further, the voltage sensor 11 is coated with an adhesive in advance on one of the surfaces, so that the surface having the adhesive is used as the sensor electrode side and the surface not having the adhesive is used as the shield electrode side. be able to. In addition, it is possible to add an identification number and a mark that can be used for positioning at the time of attachment by applying silk screen printing or the like on the surface of the printed wiring board 12, and this voltage sensor 11 is incorporated into a clip. Can be performed more efficiently.

  FIG. 2 shows a second embodiment of the voltage sensor according to the present invention. FIG. 2 (a) shows the plane of the voltage sensor 11 '(surface disposed on the conductor to be measured), and FIG. ) Shows the bottom surface (back surface), FIG. 2 (c) shows a cross section in the direction of arrow CC in FIG. 2 (a), and FIG. 2 (d) shows DD in FIG. 2 (a). The cross section in the direction of a line arrow is shown.

  In the voltage sensor 11 'according to the second embodiment, the insulation is maintained through the first conductive layer 132a' and the first substrate layer 132b 'which are different laminated surfaces so as to be accommodated in the plane of the printed wiring board 12'. The second conductive layer 133a ′ is disposed separately, and all the conductive layers are disposed in the inner layer of the printed wiring board 12 ′. The printed wiring board 12 'is composed of, for example, a paper phenol board, a paper epoxy board, a glass composite board, a glass epoxy board, a Teflon (registered trademark) board, an alumina board, a composite board, and the like. It is formed with a structure such as an up substrate.

  The first conductive layer 132a ′ formed by adhering a copper foil layer to the inner layer of the printed wiring board 12 ′ has a main surface portion that covers most of the surface size with a margin around the printed wiring board 12 ′. It is formed in a state of being connected to the first through via 16 '.

  Further, the second conductive layer 133a ′ formed by adhering a copper foil layer to the inner layer of the printed wiring board 12 ′, which is different from the first conductive layer 132a ′ of the printed wiring board 12 ′, is formed on the printed wiring board 12 ′. A main surface portion that covers most of the surface size with a margin left in the periphery thereof is formed in a state of being connected to the second through via 17 ′.

  That is, the voltage sensor 11 ′ for the electrostatic induction detector according to the present embodiment has a pair of conductive layers while maintaining insulation on the inner layer of the printed wiring board 12 ′ having an appropriate planar shape manufactured by the printed circuit board manufacturing technology. By forming the layers (first conductive layer 132a ′ and second conductive layer 133a ′), a sensor structure in which the conductive layer for the sensor electrode and the conductive layer for the shield electrode are integrated (the surface side of the voltage sensor 11 ′) The sensor surface 13 'and the back surface of the shield surface 14' can be realized, and it is extremely durable and can easily cope with downsizing with a simple structure, as well as ensuring insulation. Therefore, it can be easily incorporated, and the manufacturing cost can be very low. In addition, since the pair of conductive layers are all provided in the inner layer of the printed wiring board 12 ', insulation is maintained by providing the solder resist 15 on the outer surface of the surface conductive layer 131a as in the voltage sensor 11 of the first embodiment described above. There is also an advantage that there is no need to do.

  Note that the layer for forming the conductive layer for shielding with respect to the first conductive layer 132a ′ for charge detection is not limited to the second conductive layer 132a ′, and the third layer is further interposed via the second substrate layer 132b ′. The conductive layer 134a 'may be used. Further, the planar shape of the printed wiring board 12 ′ and the planar shapes of the first conductive layer 132a ′ and the second conductive layer 133a ′ are not particularly limited, and may be appropriately modified.

  In addition, the voltage sensor 11 ′ is preliminarily coated with an adhesive on one of the surfaces, so that the surface having the adhesive is used as the sensor electrode side, and the surface having no adhesive is used as the shield electrode side. Can be used. In addition, it is possible to add an identification number and a mark which can be used for positioning at the time of mounting by applying silk screen printing or the like on the surface of the printed wiring board 12 '. Can be incorporated more efficiently.

  FIG. 3 shows a third embodiment of the voltage sensor according to the present invention. FIG. 3 (a) shows the plane of the voltage sensor 31 (surface disposed on the conductor to be measured), and FIG. 3 (b). Indicates the bottom surface (back surface), FIG. 3 (c) shows a cross-section in the direction of the arrows CC in FIG. 3 (a), and FIG. 3 (d) shows the line DD in FIG. 3 (a). A cross section in the direction of the arrow is shown.

  The voltage sensor 31 according to the third embodiment is separately disposed on the surface conductive layer 331a and the back surface conductive layer 335, which are different laminated surfaces, so as to be within the plane of the printed wiring board 32, and the surface conductive layer 331a. The back conductive layer 335 is formed so that it can be insulated by the solder resist 35. The printed wiring board 32 is composed of, for example, a paper phenol board, a paper epoxy board, a glass composite board, a glass epoxy board, a Teflon (registered trademark) board, an alumina board, a composite board, and the like. It is formed with a structure such as a build-up substrate.

  The surface conductive layer 331a formed by adhering a copper foil layer to the outer surface of the surface substrate layer 331b, which is the surface layer of the printed wiring board 32, mainly covers most of the surface size, leaving a margin around it. The surface portion is formed in a state of being connected to the first land 36.

  Further, the back conductive layer 335 formed by attaching a copper foil layer to the outer surface of the back substrate layer 334b, which is the back layer of the printed wiring board 32, is different from the surface conductive layer 331a of the printed wiring board 32. A main surface portion that substantially covers most of the surface size, leaving a margin around it, is formed in a state of being connected to the second land 37.

  That is, the voltage sensor 31 for the electrostatic induction detector according to the present embodiment has a conductive layer (surface conductive layer) on the surface layer and the back layer of the printed wiring board 32 having an appropriate planar shape manufactured by the printed circuit board manufacturing technology. 331a and the back surface conductive layer 335) are formed so that the sensor electrode conductive layer and the shield electrode conductive layer are integrally integrated (the surface side of the voltage sensor 31 is the sensor surface 33, and the back surface side is the shield surface. 34), which is very strong and can cope with downsizing with a simple structure, and it is easy to incorporate and ensure insulation. It can be very inexpensive.

  Since the first land 36 and the second land 37 can be formed as a region where the solder resist 35 is not applied, like the voltage sensors 11 and 11 ′ according to the first and second embodiments described above, the first through via The copper foil part for soldering can be formed with a simpler structure than the provision of the 16, 16 'and the second through vias 17, 17'.

  Further, the voltage sensor 31 is coated with an adhesive in advance on one of the surfaces, so that the surface having the adhesive is used as the sensor electrode side, and the surface having no adhesive is used as the shield electrode side. be able to. In addition, it is possible to add an identification number and a mark that can be used for positioning at the time of mounting by applying silk screen printing or the like on the surface of the printed wiring board 32. Can be performed more efficiently.

  Next, the clip 40 according to the present invention will be described with reference to FIG. The clip 40 may be provided with any of the voltage sensors 11, 11 ′ and 31 of the first to third embodiments described above, but in the following description, the voltage sensor 11 is used.

  FIG. 4 shows a state in which the clip 40 is divided in half. The one-side clip portion 41 and the other-side clip portion 42 are provided with a support shaft 44 with a torsion coil spring 43 having a substantially V-shape interposed therebetween. Thus, the holding parts 45 and 46 of the claws that are opened and closed to hold the conductor to be measured are normally closed and are pivotally supported integrally to form the entire clip 40.

  Note that the shape and structure of the clip 40 itself are not particularly limited, and it is only necessary to have a structure in which the voltage sensor 11 can be incorporated into each of the pair of holding portions sandwiching the conductor to be measured. That is, the voltage sensors 11 are separately provided inside the claw-shaped holding portions 45 and 46, and charges can be detected by electrostatic induction when the conductor to be measured is held.

  For example, on the inner side of the claw-shaped holding portion 46 of the one-side clip portion 41, the side on which the sensor surface 13 of the voltage sensor 11 faces and the first and second through vias 16 and 17 are formed is on the support shaft 44 side. The voltage sensor 11 is fixed in position by being bonded and fixed so as to be in contact with the inner surface of the claw-shaped holding portion 46.

  Further, the other side clip portion 42 has the same structure as the one side clip portion 41, and the sensor surface 13 of the voltage sensor 11 faces the inside of the claw-shaped holding portion 45, and the first and second through vias The position where the side where the pins 16 and 17 are formed faces the support shaft 44 side, and the voltage sensor 11 is fixed in position by being bonded and fixed so as to be in contact with the inner surface of the claw-shaped holding portion 45.

  For this reason, the pair of voltage sensors 11 disposed in the clip 40 includes a surface conductive layer 131a on the one side clip portion 41 side and a surface conductive layer 131a on the other side clip portion 42 side on the measured conductor side. Thus, it can function as a sensor electrode.

  In addition, the pair of voltage sensors 11 disposed in the clip 40 includes a three-phase AC circuit or a bundled AC circuit in which the shield surface 14 on the one-side clip part 41 side and the shield surface 14 on the other-side clip part 42 side are bundled. Therefore, it can be made to function as a shield electrode that shields disturbance electrostatic induction generated from these.

  In addition, since the pair of voltage sensors 11 are formed as a single unit, the clip 40 is formed by simply fitting it into the one side clip part 41 side and the other side clip part 42 side. be able to. In addition, since the sensor surface 13 and the shield surface 14 of the voltage sensor 11 are reliably insulated by the solder resist 15 and each substrate layer, even if there is a short circuit factor such as condensation, the mutual resistance is not easily lowered. Therefore, the charge can be detected stably.

  Although the embodiments of the voltage sensor and the clip according to the present invention have been described above based on the accompanying drawings, the inclusion range of the present invention is not limited to these embodiments, and a known existing technique is appropriately converted. It may be realized by doing.

11, 31 Voltage sensor 12, 32 Printed wiring board 13, 33 Conductive layer 15, 35 Solder resist 16, 17 Through-via 36, 37 Land 131a, 331a Surface conductive layer 131b, 331b Surface substrate layer 132a, 332a First conductive layer 132b , 332b First substrate layer 133a, 333a Second conductive layer 133b, 333b Second substrate layer 134a, 334a Third conductive layer 134b, 334b Back substrate layer 335 Back conductive layer 40 Clip 41 One side clip portion 42 Other side clip portion 43 Coil spring 44 Support shaft 45, 46 Claw-shaped holding part

Claims (4)

A printed wiring board having an appropriate planar shape manufactured by a printed circuit board manufacturing technique;
It is composed of a pair of conductive layers arranged separately in different layers while retaining insulation via an insulating substrate so as to fit in the plane of the printed wiring board,
Each of the conductive layers is a voltage sensor for an electrostatic induction detector, wherein a main surface portion covering most of the surface size of the printed wiring board is connected to a land copper foil portion for soldering.   2. The voltage sensor for electrostatic induction detector according to claim 1, wherein each of the pair of conductive layers is disposed in an inner layer of a printed wiring board.   The electrostatic layer according to claim 1 or 2, wherein the conductive layer disposed in the inner layer of the printed wiring board is formed with a copper foil portion for soldering by a through via connected to the main surface portion. Voltage sensor for induction detector. Each printed wiring board holding part side that is opened and closed to hold the conductor to be measured is composed of one side clip part and the other side clip part that are urged in a normally closed direction and are pivotally supported integrally.
The voltage sensor for an electrostatic induction detector according to any one of claims 1 to 3 is provided inside each printed wiring board holding portion of the one side clip portion and the other side clip portion. A clip for electrostatic induction detectors.

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