JP2010167322A - Resin coater - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin coater excellent in work efficiency for use in bonding electronic parts at low installation cost. <P>SOLUTION: The resin coater includes a measurement means for measuring the amount of the warping of a substrate 7 held on a substrate holding table 5a. A contact-type displacement sensor 42 of the measurement means is raised/lowered by a cylinder 43 between its height position for the time of transferring a substrate which position is set for the operation of transferring a substrate, and its stand-by height position set for its standing-by prior to carrying out a measuring operation with respect to the substrate 7. The lowering operation of lowering a probe 42a attached to the displacement sensor 42 from the stand-by height position to a measurement height position whereat the probe 42a contacts the substrate 7 to measure its displacement, is caused to proceed by advancing/retreating a plate cam member 41 relative to a member 47 for pushing down the displacement sensor 42 using a head-moving mechanism, to push down the probe 42a. Thus, a mechanism for raising/lowering the displacement sensor 42 can be made simpler, and the operation time for raising/lowering the displacement sensor 42 can be shortened. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a resin coating apparatus for coating a substrate with a resin for bonding electronic components.

  A component such as a semiconductor chip is taken out from a component supply unit such as a wafer table on which a wafer sheet is mounted and mounted on a substrate such as a lead frame or a resin substrate via a resin adhesive. A component mounting device that performs such component mounting work is used in combination with a resin coating device that applies a resin adhesive to a substrate, and a resin bonding for electronic component bonding is performed at the component mounting position on the substrate prior to component mounting. The agent is applied by a dispenser attached to the resin application device.

In component mounting using such a resin adhesive, it is required to correctly apply a specified amount of resin adhesive in a specified application shape. In resin application with a dispenser, it is important to lower the dispenser application nozzle to an appropriate height with respect to the surface of the substrate. Therefore, the height of the surface of the substrate to be applied is measured to deform the warp of the substrate. The state is detected (see Patent Document 1). In the prior art shown in this patent document example, a non-contact type optical detection means is provided in the vicinity of the resin adhesive application head.
JP-A-3-91998

  However, in the above-described prior art, there is a problem that the equipment cost increases due to the use of the non-contact type optical detection means. That is, as the non-contact type optical detection means, it is necessary to use a high-price displacement measuring instrument such as a laser displacement meter, so it is difficult to realize a low-cost facility. In order to avoid such an increase in equipment costs, when using a contact-type displacement meter, it is necessary to raise and lower the displacement meter every time the height measurement operation is performed on the surface of the substrate. Therefore, the work tact time was delayed.

  Then, an object of this invention is to provide the resin coating apparatus for electronic component adhesion | attachment which was excellent in work efficiency with low equipment cost.

  An electronic component bonding resin coating apparatus according to the present invention is a resin coating device for applying an electronic component bonding resin to a substrate held by a substrate holding unit, and is applied with a coating unit for discharging the resin. A head, a lifting mechanism that moves the coating head up and down, a head moving mechanism that horizontally moves the coating head with respect to the substrate, and a warp measuring unit that measures the amount of warp deformation of the substrate held by the substrate holding unit; The warp measuring means includes a contact-type displacement sensor that measures the amount of displacement by which the measuring element is pushed by bringing the measuring element into contact with the measuring object, and a substrate transport for the substrate holding unit. A sensor that raises and lowers the displacement sensor between a height position during substrate transportation set for operation and a standby height position set for standby before performing a measurement operation on the substrate. Driven by a horizontal movement operation by the head moving mechanism, and the measuring element is moved from the standby height position. A sensor depressing mechanism for depressing the displacement sensor against an upward biasing force of the biasing means to a measurement height position where the displacement is measured by contacting the substrate;

According to the present invention, in the warp measuring means for measuring the warp deformation amount of the substrate held by the substrate holding part, the contact-type displacement sensor is set to the height position and the substrate at the time of substrate transport set for the substrate transport operation. Measurement height at which the probe touches the substrate from the standby height position and measures displacement by moving it up and down by the sensor lifting mechanism to the standby height position set to wait before performing the target measurement operation The mechanism for moving the displacement sensor up and down is simplified and the mechanism for raising and lowering the displacement sensor is simplified by using a sensor push-down mechanism driven by a horizontal movement operation by the head moving mechanism. By shortening the time, it is possible to realize a resin coating apparatus for adhering electronic components that is excellent in work efficiency at a low equipment cost.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a component mounting according to an embodiment of the present invention. FIG. 4 is a diagram illustrating the configuration of a warp measuring unit used in the coating head of the component mounting apparatus according to the embodiment of the present invention. FIG. 5 is a diagram illustrating the configuration of the coating head for resin coating mounted on the apparatus. FIG. 6 is a diagram illustrating the operation of a method for measuring warpage of a substrate in the component mounting apparatus according to the embodiment of the present invention.

  First, the entire configuration of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 has a function of mounting a component such as a semiconductor chip on a substrate by bonding. In FIG. 1, a component supply stage 3 (component supply unit), a unit assembly stage 4 and a substrate holding stage 5 (substrate holding unit) are arranged in the Y direction on a base 2. The wafer holding table 3a provided in the component supply stage 3 holds a semiconductor wafer 6 on which a plurality of semiconductor chips 6a, which are components to be mounted, are arranged. The substrate holding stage 5 is configured to horizontally drive a substrate holding table 5 a that holds the substrate 7 by an XY table mechanism 34 (see FIG. 2), and a semiconductor chip 6 a is mounted on the substrate 7.

  The unit assembly stage 4 includes a tool stocker 15, a relay stage 16, a component collection box 17, and a component recognition camera, which will be described later, on a moving table 4a that reciprocates in the X direction by a linear motion mechanism (X-axis moving mechanism 30 shown in FIG. 2). In this configuration, functional units such as 18 are collectively arranged. In the tool stocker 15, a plurality of work tools, such as a component holding tool 19a to be mounted on the mounting unit 19, that are exchanged according to the component type are stored for each component type. The component collection box 17 has a function of discarding and collecting components that are determined to be unsuitable for mounting on the substrate 7 such as defective components or mixed different components after being taken out from the component supply stage 3.

  Above the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the Y-axis frame 8 is positioned at the end of the base 2 in the X direction, and both ends are supported by the support posts 8a in the Y direction. It is built in. On the front surface of the Y-axis frame 8 is incorporated a Y-axis guide mechanism 9 that guides and drives a first head 11 and a second head 12 described below in the Y direction by linear motor driving. A mounting unit 19 having a function of holding the semiconductor chip 6 a and mounting it on the substrate 7 is mounted on the first head 11. The second head 12 is subjected to warping deformation of the coating unit 20 having a function of applying an adhesive for bonding electronic components to the substrate 7, the X-axis drive mechanism 22 for moving the coating unit 20 in the X direction, and the substrate 7. A warpage measurement unit 21 for measurement is attached.

Above the component supply stage 3, the relay stage 16, and the substrate holding stage 5, a first camera 23, a second camera 24, and a third camera 25 are disposed for position recognition. The first camera 23 images the semiconductor chip 6a to be taken out in the component supply stage 3. The second camera 24 images the semiconductor chip 6a taken out from the component supply stage 3 and temporarily placed on the relay stage 16 for position correction. The third camera 25 recognizes the position of the component mounting point by taking an image of the board 7 held on the board holding stage 5. The component recognition camera 18 disposed on the unit assembly stage 4 images the semiconductor chip 6a taken out from the component supply stage 3 from below.

  As shown in FIG. 2, the component supply stage 3 includes an XY table mechanism 26, and a plurality of support members 28 are erected on a horizontal moving plate 27 mounted on the upper surface of the XY table mechanism 26. . The support member 28 supports the wafer holding table 3a on which the semiconductor wafer 6 is mounted and held on the upper surface. The semiconductor wafer 6 has a configuration in which a plurality of semiconductor chips 6a are adhered to a wafer sheet 6b in a predetermined arrangement, and the semiconductor chip 6a is divided into pieces in a face-up posture with the active surface facing upward on the wafer sheet 6b. It is stuck and held in a state.

  In the component supply stage 3, a pick-up work position [P1] for picking up the semiconductor chip 6a from the semiconductor wafer 6 is set. The position of the first camera 23 corresponds to the pickup work position [P1], and the position of the semiconductor chip 6a to be picked up is detected by recognizing the imaging result obtained by imaging the semiconductor wafer 6 by the first camera 23. The An ejector mechanism 29 is disposed at a position corresponding to the pickup work position [P1] inside the wafer holding table 3a. The ejector mechanism 29 has a function of promoting the peeling of the semiconductor chip 6a from the wafer sheet 6b by pushing up the semiconductor chip 6a with a pin from the lower surface side of the wafer sheet 6b. When the semiconductor chip 6a is taken out, the ejector mechanism 29 is moved up and down and brought into contact with the lower surface of the wafer sheet 6b, whereby the semiconductor chip 6a can be easily taken out from the wafer sheet 6b by the pickup head 14 described later.

  In the component take-out operation, by driving the XY table mechanism 26 and horizontally moving the wafer sheet 6b in the XY direction, a desired semiconductor to be taken out of the plurality of semiconductor chips 6a attached to the wafer sheet 6b is obtained. The chip 6a is positioned at the pickup work position [P1]. Here, an example is shown in which a wafer table of a system for supplying wafer-state components attached to the wafer sheet 6b is used as the component supply stage 3, but a component tray that supplies a plurality of components in a predetermined planar arrangement. May be arranged on the component supply stage 3 so as to be exchangeable with the wafer table.

  Above the component supply stage 3, a pickup head 14 having a pickup nozzle 14a for adsorbing and holding the semiconductor chip 6a is disposed. The pickup head 14 is held by a pickup arm 13a. The pickup arm 13a extends from the pickup head moving mechanism 13 suspended from the lower surface of the Y-axis frame 8 and extends above the component supply stage 3. It has been. By driving the pickup head moving mechanism 13, the pickup arm 13a moves in the XYZ directions and rotates around the axis in the X direction.

  As a result, the pickup head 14 moves in the Y direction between the upper part of the component supply stage 3 and the upper part of the unit assembly stage 4 and moves up and down in the Z direction. Accordingly, the pickup head 14 performs an operation of picking up the semiconductor chip 6 a from the component supply stage 3 and transferring it to the relay stage 16 provided in the unit assembly stage 4. Further, when necessary, the pickup head 14 can be retracted in the X direction from above the pickup operation position [P1], and the pickup head 14 is reversed by rotating the pickup arm 13a, thereby picking up the pickup nozzle 14a. It is possible to reverse the orientation of the semiconductor chip 6a held on the front and back.

As shown in FIG. 2, the unit assembly stage 4 and the substrate holding stage 5 are provided on the upper surface of the base plate 33, and the base plate 33 is supported from below by a plurality of support posts 32 erected on the upper surface of the base 2. Has been. The X-axis moving mechanism 30 for moving the moving table 4a in the X direction is configured by arranging a feed screw linear motion mechanism 30a and a linear motion guide mechanism 30b using a motor as a drive source on a base portion 31.

  A semiconductor chip 6a taken out from the component supply stage 3 by the pickup head 14 is placed on the relay stage 16 for position correction (arrow a). A relay position [P2] is set in the relay stage 16, and the second camera 24 is arranged corresponding to the relay position [P2]. By moving the relay stage 16 by the X-axis moving mechanism 30, the semiconductor chip 6a placed on the relay stage 16 can be positioned at the relay position [P2] and can be imaged by the second camera 24. The position of the semiconductor chip 6a placed on the stage 16 is detected. The component recognition camera 18 is disposed adjacent to the relay stage 16 and similarly moves the component recognition position [P3] by driving the X-axis moving mechanism 30.

  The substrate holding stage 5 has a configuration in which a substrate holding table 5 a for holding the substrate 7 is provided on the XY table mechanism 34. A mounting work position [P4] for mounting the semiconductor chip 6a on the substrate 7 held on the substrate holding table 5a is set on the substrate holding stage 5, and the third camera 25 is set at the mounting work position [P4]. Correspondingly arranged. By imaging the board 7 with the third camera 25, the position of the component mounting point 7 a set on the board 7 is detected. By driving the XY table mechanism 34, the board holding table 5a moves horizontally in the XY direction together with the board 7, and an arbitrary component mounting point 7a set on the board 7 can be positioned at the mounting work position [P4]. it can.

  Next, the first head 11 and the second head 12 will be described. In FIG. 2, two guide rails 9a for guiding the first head 11 and the second head 12 in the Y direction are provided on the front surface of the Y-axis guide mechanism 9 provided on the Y-axis frame 8. Between these guide rails 9a, a stator 9b constituting a linear motor for driving the first head 11 and the second head 12 described below in the Y direction is disposed. A slider (not shown) is fitted to the guide rail 9a so as to be slidable in the Y direction, and the slider is fixed to the back of the vertical moving plates 11a and 12a.

  On the back surface of the movable plates 11a and 12a, a mover (not shown) constituting a linear motor is disposed facing the stator 9b. By driving these linear motors, the first head 11 and the second head 12 are guided by the guide rail 9a and each move in the Y direction (arrow b). Elevating mechanisms 11b and 12b are disposed on the front surfaces of the movable plates 11a and 12a, respectively. Elevating plates 11c and 12c are vertically disposed on the front surfaces of the elevating mechanisms 11b and 12b by a slide guide mechanism (not shown). It is slidably arranged. Driving the elevating mechanisms 11b and 12b raises and lowers the elevating plates 11c and 12c (arrow c). A mounting unit 19 having a component holding tool 19a at the bottom is detachably mounted on the lifting plate 11c. An X-axis drive mechanism 22 is mounted on the elevating plate 12c. The X-axis drive mechanism 22 holds the warp measurement unit 21 at a fixed position and moves the two coating units 20 in the X direction.

The mounting unit 19 has a function of holding the semiconductor chip 6a that is a component to be mounted by the component holding tool 19a. The mounting unit 19 is mounted by moving the first head 11 horizontally in the Y direction and moving the lifting plate 11c up and down. The unit 19 mounts the semiconductor chip 6a supplied from the component supply stage 3 on the substrate 7 held by the substrate holding stage 5 (arrow d). Here, as a mounting form by the first head 11 to which the mounting unit 19 is mounted, the semiconductor chip 6 a taken out from the component supply stage 3 by the pickup head 14 and placed on the relay stage 16 is held by the mounting unit 19. A pre-center mounting form to be mounted on the substrate 7, a direct mounting form in which the semiconductor chip 6a of the component supply stage 3 is directly held by the mounting unit 19 and mounted on the substrate 7, and a pick-up head 14 taken out from the component supply stage 3 and turned upside down The face-down mounting configuration in which the semiconductor chip 6a held in the pickup head 14 in the state is held by the mounting unit 19 and mounted on the substrate 7 can be selectively executed. That is, the first head 11 on which the mounting unit 19 is mounted is a mounting head that sucks and holds the semiconductor chip 6 a supplied by the component supply stage 3 and mounts it on the substrate 7 held on the substrate holding stage 5. .

  Next, the configuration of the second head 12 will be described with reference to FIG. In FIG. 3, an X-axis drive mechanism 22 is coupled to the elevating plate 12c. By driving the X-axis drive mechanism 22, the moving plate 22a provided on the side surface of the X-axis drive mechanism 22 reciprocates in the X direction (arrow f direction). An application head 40 including two application units 20 is mounted on the moving plate 22a via a coupling member 40a. By driving the Y-axis guide mechanism 9 and the X-axis drive mechanism 22, the coating head 40 moves horizontally in the XY direction with respect to the substrate 7 held on the substrate holding table 5a, and by driving the lifting mechanism 12b, these coating heads The application unit 20 moves up and down. Therefore, the Y-axis guide mechanism 9 and the X-axis drive mechanism 22 are head moving mechanisms that horizontally move the coating head 40 with respect to the substrate 7, and the lifting mechanism 12 b is a lifting mechanism that lifts and lowers the coating head 40. Yes.

  The coating unit 20 constituting the coating head 40 includes a syringe 20a that contains a paste, which is a resin adhesive for component bonding, and a coating nozzle 20b that discharges the paste. The coating head 40 is moved above the substrate 7 held by the substrate holding stage 5 to perform the coating operation by the coating unit 20 (arrow e), whereby the paste discharged from the coating nozzle 20b is mounted on the component of the substrate 7 Apply to point 7a. At this time, by driving the Y-axis guide mechanism 9 and the X-axis drive mechanism 22, the coating nozzle 20 b can be moved horizontally with an arbitrary drawing pattern with respect to the substrate 7 to draw and apply the resin for bonding electronic components. it can. That is, the configuration in which the coating head 40 is mounted on the second head 12 in the component mounting apparatus 1 corresponds to a resin coating apparatus that applies a resin for bonding electronic components to the substrate 7 held on the substrate holding stage 5.

  A warpage measurement unit 21 is disposed on a side surface of the X-axis drive mechanism 22. The warpage measurement unit 21 has a function of measuring the amount of warpage deformation of the substrate 7 held on the substrate holding stage 5 and incorporates a contact-type displacement sensor 42. The displacement sensor 42 has a function of measuring the amount of displacement by which the probe 42a is pushed and displaced by bringing the probe 42a as a measuring element into contact with the measurement object. That is, the displacement sensor 42 is lowered to a specified height with respect to the substrate 7 to be measured, the probe 42a is brought into contact with the upper surface of the substrate 7, and the amount of displacement at which the probe 42a is pushed at this time is measured, thereby measuring the upper surface of the substrate 7. The height position is measured, and the warp deformation of the substrate 7 is obtained from the measurement result.

  In the present embodiment, a mechanism that lowers the displacement sensor 42 to a specified height during a measurement operation is adopted using horizontal movement in the X direction by the X-axis drive mechanism 22 as a drive source. As shown by arrows AA in FIG. 3, a plate cam member 41 is coupled to the moving plate 22a, and the plate cam member 41 is driven in the X direction (arrow g direction) by driving the X-axis drive mechanism 22. By moving, the displacement sensor 42 built in the warp measurement unit 21 is pushed down.

Hereinafter, the structure of the warp measurement unit 21 will be described with reference to FIG. The warp measurement unit 21 is fixedly disposed on the frame portion of the X-axis drive mechanism 22, and an elevating member 44 is disposed on a rod 43 a of the cylinder 43 that is vertically disposed with the drive direction downward in FIG. 4. Are combined. The elevating member 44 is guided in the vertical direction by a guide mechanism including a guide rail 46 and a slider 45 arranged vertically, and a sensor push-down portion 47 is fixed to one end 44 a of the elevating member 44. A displacement sensor 42 is held by the sensor push-down portion 47 in a posture with the probe 42a facing downward, and the cylinder 43 is driven to drive the rod 4
By projecting 3 a, the elevating member 44 moves down from the solid line position to the chain line position together with the sensor push-down portion 47. The solid line position shown in FIG. 4 corresponds to the height position during substrate transfer set for the substrate transfer operation for the substrate holding stage 5, and the chain line position is measured by the displacement sensor 42 for the substrate 7. This corresponds to the standby height position set for waiting before the operation is executed. The cylinder 43, the slider 45, and the guide rail 46 constitute a sensor raising / lowering mechanism that raises and lowers the displacement sensor 42 between the substrate transport height position and the standby height position.

  A plate cam member 41 shown in FIG. 3 is located on the side of the stop position in a state where the sensor push-down portion 47 is lowered. The plate cam member 41 is provided with a taper cam surface 41 b in an obliquely downward direction at a tip portion 41 a on the side close to the sensor push-down portion 47. By driving the X-axis drive mechanism 22, the plate cam member 41 advances and retreats from the side with respect to the sensor push-down portion 47 lowered to the chain line position (arrow h).

  Next, the configuration and function of the sensor push-down unit 47 will be described with reference to FIG. In FIG. 5A, a guide rail 48 is provided in the base portion 47a in the vertical direction, and a displacement sensor 42 is held in a slider 49 that is slidably fitted in the guide rail 48 in the vertical direction. A sensor holder 50 is coupled. The displacement sensor 42 is urged upward by the tension spring member 51 via the sensor holder 50 (arrow i), and the displacement sensor 42 is in a position raised together with the sensor holder 50 by this urging force in normal times. The tension spring member 51 provided in the sensor push-down portion 47 is an urging means that urges the displacement sensor 42 upward by moving up and down by the sensor lifting mechanism having the above-described configuration.

  A cam follower 52 is disposed at the end 50 a of the sensor holder 50. As shown in FIG. 5 (b), when the elevating member 44 is lowered to the chain line position shown in FIG. 4 and the displacement sensor 42 is lowered to the standby height position described above, the sensor push-down portion 47 is moved to the plate cam member 41. Located on the side. In this state, when the X-axis drive mechanism 22 is driven to advance the plate cam member 41 (arrow j), the taper cam surface 41b of the plate cam member 41 comes into contact with the cam follower 52, and the sensor holder 50 together with the displacement sensor 42 It is pushed downward against the urging force of the tension spring member 51 (arrow k).

  As a result, the displacement sensor 42 is lowered, the probe 42a comes into contact with the component mounting point 7a of the substrate 7 held on the substrate holding table 5a, and is pushed in by a displacement amount corresponding to the height state of the upper surface 7b. Thereby, the displacement sensor 42 outputs a measurement signal corresponding to the amount of displacement to the measurement unit 53, and the measurement unit 53 performs a predetermined calculation based on the measurement signal, whereby the upper surface 7b of the substrate 7 to be measured. Can be obtained. Then, by comparing this height position Z with the original height position of the upper surface 7b of the substrate 7, the amount of warp deformation of the substrate 7 is measured. That is, the position where the displacement sensor 42 is pressed down corresponds to the measurement height position where the probe 42a contacts the substrate 7 and measures the displacement. When the plate cam member 41 is retracted in the opposite direction, the displacement sensor 42 is lifted together with the sensor holder 50 by the urging force of the tension spring member 51, and returns from the measurement height position to the standby height position.

  Therefore, the plate cam member 41 and the sensor push-down portion 47 are driven by a horizontal movement operation by the X-axis drive mechanism 22 constituting the head movement mechanism, and the probe 42a contacts the substrate 7 from the standby height position to measure the displacement. The sensor push-down mechanism pushes down the displacement sensor 42 against the upward biasing force of the tension spring member 51 to the measurement height position. The displacement sensor 42, the sensor raising / lowering mechanism, the sensor push-down mechanism, and the biasing means configured as described above constitute a warp measuring means that measures the amount of warp deformation of the substrate 7 held on the substrate holding stage 5. As described above, by adopting a configuration in which the displacement sensor 42 is pushed down by the horizontal movement operation by the X-axis drive mechanism 22, it is possible to reduce the equipment cost compared to a case where a separate drive mechanism is provided. Yes.

  Next, with reference to FIG. 6, a warp measurement method for measuring the warp deformation amount of the substrate 7 held on the substrate holding table 5a by the warp measurement unit 21 will be described. FIG. 6A shows a state in which the rod 43a of the cylinder 43 is immersed and the displacement sensor 42 is at the substrate transfer height position set for the substrate transfer operation. In this state, a sufficient clearance is secured between the displacement sensor 42 and the substrate holding table 5a, so that the loading / unloading operation of the substrate 7 on the substrate holding table 5a can be performed without being hindered. .

  FIG. 6B shows a stand-by height set for projecting the rod 43a of the cylinder 43 and lowering the sensor push-down portion 47 (arrow l), and waiting before the measurement operation for the substrate 7 is performed. A state in which the displacement sensor 42 is positioned at the position is shown. As a result, the probe 42a is positioned immediately above the substrate 7 held by the substrate holding table 5a.

  Next, FIG. 6C shows a measurement state. That is, the X-axis drive mechanism 22 is driven to advance the plate cam member 41 relative to the sensor push-down portion 47 (arrow m). As a result, the cam follower 52 is pushed down by a predetermined depression amount, and the displacement sensor 42 is lowered to the measurement height position (arrow n). As a result, the probe 42a comes into contact with the substrate 7 and the amount of warp deformation of the substrate 7 is measured. At this time, since the probe 42a is located in the immediate vicinity above the substrate 7 in advance, the up / down stroke at the time of measurement is short, and the measurement can be performed quickly and efficiently in a short operation time.

  As described above, according to the present invention, in the warp measuring means for measuring the warp deformation amount of the substrate 7 held on the substrate holding stage 5, the contact-type displacement sensor 42 is set for substrate transport operation. The probe 42a is moved up and down by the sensor elevating mechanism between the time height position and the standby height position set for standby before the measurement operation for the substrate 7 is performed. The lowering operation to the measurement height position for measuring the displacement in contact with the sensor is performed by a sensor push-down mechanism driven by a horizontal movement operation by the X-axis movement mechanism 22.

  As a result, the mechanism for raising and lowering the displacement sensor 42 is simplified, the operation time for raising and lowering is shortened, and a resin coating apparatus for adhering electronic components with excellent work efficiency is realized at low equipment cost. Can do.

  The resin coating apparatus for bonding electronic parts according to the present invention has the effect of being excellent in work efficiency at a low equipment cost, and can be used in the field of performing resin coating for bonding parts to a lead frame, a resin substrate, and the like. .

1 is an overall perspective view of a component mounting apparatus according to an embodiment of the present invention. The front view of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the application head for resin application with which the component mounting device of one embodiment of the present invention was equipped Structure explanatory drawing of the curvature measurement unit used for the coating head of the component mounting apparatus of one embodiment of this invention Configuration explanatory diagram of a sensor push-down mechanism used in the component mounting apparatus of one embodiment of the present invention Explanatory drawing of operation | movement of the curvature measurement method of the board | substrate in the component mounting apparatus of one embodiment of this invention

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply stage 4 Unit assembly stage 5 Substrate holding stage 6 Semiconductor wafer 6a Semiconductor chip 7 Substrate 9 Y axis guide mechanism 11 1st head 12 2nd head 19 Mounting unit 20 Coating unit 21 Warp measurement unit 22 X axis Drive mechanism 41 Plate cam member 42 Displacement sensor 42a Probe 47 Sensor push-down part

Claims (1)

A resin coating apparatus that applies a resin for bonding electronic components to a substrate held by a substrate holding unit,
A coating head mounted with a coating unit for discharging the resin, a lifting mechanism for lifting and lowering the coating head, a head moving mechanism for horizontally moving the coating head with respect to the substrate, and held by the substrate holder A warp measuring means for measuring a warp deformation amount of the substrate,
The warp measuring means is a contact-type displacement sensor that measures a displacement amount by which the measuring element is pushed and displaced by bringing the measuring element into contact with the measuring object, and a substrate transfer operation for the substrate holding unit. A sensor raising / lowering mechanism for raising and lowering the displacement sensor between a height position at the time of substrate transfer set to a standby height position set to wait before performing a measurement operation on the substrate, and A biasing means that lifts and lowers the displacement sensor by a sensor lifting mechanism;
The displacement sensor is driven by a horizontal movement operation by the head moving mechanism, and the displacement sensor is moved from the standby height position to a measurement height position where the probe contacts the substrate and measures the displacement. A resin coating apparatus comprising a sensor push-down mechanism that pushes down against an upward biasing force.

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