JP2010155259A - Method of forming groove - Google Patents

Method of forming groove Download PDF

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Publication number
JP2010155259A
JP2010155259A JP2008334168A JP2008334168A JP2010155259A JP 2010155259 A JP2010155259 A JP 2010155259A JP 2008334168 A JP2008334168 A JP 2008334168A JP 2008334168 A JP2008334168 A JP 2008334168A JP 2010155259 A JP2010155259 A JP 2010155259A
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Japan
Prior art keywords
workpiece
formed
groove
laser beam
portion
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JP2008334168A
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Japanese (ja)
Inventor
Yutaka Yamazaki
豊 山▲崎▼
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Seiko Epson Corp
セイコーエプソン株式会社
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Priority to JP2008334168A priority Critical patent/JP2010155259A/en
Publication of JP2010155259A publication Critical patent/JP2010155259A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a finer groove in a workpiece. <P>SOLUTION: First, a modified area 20 is formed by condensing a laser beam 13 within a workpiece 1 of a transparent material, and by formation of the modified area 20, a first crack 19a extended to an optical axis direction of the laser beam 13 is formed in a predetermined portion 18 to form a groove 2 by an internal stress generated in a portion of the modified area 20. Next, an internal surface of the formed first crack 19a is etched, and the groove 2 is formed in a portion in which the first crack 19a is formed by the etching. Therefore, width of the groove 2 formed in the workpiece 1 is equivalent to width of the first crack 19a. Consequently, the finer groove 2 is formed in the workpiece 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a groove forming method for forming a groove in a workpiece.

Conventionally, as this type of technology, for example, there is a technology described in Patent Document 1.
In the technique described in Patent Document 1, first, a laser beam is irradiated along a portion where a groove is to be formed in a workpiece made of a transparent material, the laser beam is condensed, and a modified region is formed inside the workpiece. Form. Next, a portion of the workpiece where the modified region is formed is etched, and a groove is formed in the portion where the modified region is formed by the etching.
JP 2004-136358 A

However, in the technique described in Patent Document 1, a portion of the workpiece where the modified region is formed is etched, and a groove is formed in the workpiece by the etching. Therefore, the width of the groove formed in the workpiece is inevitably larger than the width of the modified region. For this reason, it has been difficult to form a narrow groove in the workpiece.
Therefore, the technical problem of the present invention is to form a narrow groove on the workpiece.

In order to solve the above technical problem, each aspect of the present invention has the following configuration.
The first aspect of the present invention is:
A groove forming method for forming a groove in a transparent workpiece,
Irradiating a laser beam along a portion where the groove is to be formed inside the workpiece, condensing the laser beam to form a modified region inside the workpiece, and forming the modified region The first step of forming a crack extending in the optical axis direction of the laser beam in a portion where the groove is to be formed in the workpiece due to internal stress generated in the modified region portion, and the workpiece Etching a portion of the article where the modified region is formed and an inner surface of the crack, forming a cavity in the portion where the modified region is formed by the etching, and forming a groove in the portion where the crack is formed A second step, a third step of polishing the workpiece, removing a portion where the cavity is formed from the workpiece by the polishing, and exposing the groove;
It is characterized by having.
According to such a technique, a portion where a crack is formed can be etched, and a groove can be formed in the portion by etching. Therefore, the width of the groove formed in the workpiece can be made equal to the width of the crack.
Therefore, it is possible to form a narrow groove by the workpiece.

In addition, the second aspect is
A groove forming method for forming a groove in a transparent workpiece, irradiating a laser beam along a portion where the groove is to be formed inside the workpiece, condensing the laser beam, and collecting the laser beam. A modified region is formed inside the workpiece, and the formation of the modified region causes the laser beam to be formed on a portion of the workpiece to be formed with the groove due to internal stress generated in the modified region. A first step of forming a crack extending in an optical axis direction; and polishing the workpiece, removing a portion where the modified region is formed from the workpiece by the polishing, and exposing the crack. And a third step of etching the inner surface of the crack and forming a groove in the portion where the crack is formed by the etching.
According to such a technique, a portion where a crack is formed can be etched, and a groove can be formed in the portion by etching. Therefore, the width of the groove formed in the workpiece can be made equal to the width of the crack.
Therefore, it is possible to form a narrow groove by the workpiece.

Furthermore, the third aspect is
In the first step, the laser beam is condensed by a condenser lens, and when the laser beam is condensed, the condensing region of the laser beam is expanded in the optical axis direction of the laser beam. Further, the aberration of the condenser lens is adjusted.
According to such a method, the degree of stress concentration at both ends of the laser beam in the optical axis direction becomes stronger in the modified region. And the crack which extends in parallel with the optical axis direction of a laser beam can be formed when the degree of stress concentration becomes stronger.

Furthermore, the fourth aspect is
In the first step, after a modified region is formed inside the workpiece, a laser beam is irradiated along a portion where the groove is to be formed inside the workpiece, and the laser beam is modified. It is characterized in that the internal stress generated in the modified region portion is increased by the focused laser beam focused on the quality region portion.
According to such a method, the internal stress generated in the modified region increases, and a deep crack can be formed in a portion of the workpiece to be formed with a groove. Therefore, a deep groove can be formed in a portion where a crack is formed by etching.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
In the groove forming method of the present embodiment, first, a modified region is formed by condensing laser light inside a transparent workpiece, and the modified region is formed, and is generated in the modified region. A crack extending in the optical axis direction of the laser beam is formed in a portion where the groove is to be formed due to internal stress.
Next, the inner surface of the formed crack is etched, and a groove is formed in the portion where the crack is formed by the etching.
And the said surface of a workpiece is grind | polished and the said groove | channel is exposed.

(Embodiment 1)
(Workpiece configuration)
First, the workpiece 1 obtained by the groove forming method of the present embodiment and having the opening of the groove 2 formed on the upper surface 1c will be described.
FIG. 1 is a perspective view of a workpiece 1.
As shown in FIG. 1, the workpiece 1 is made of a transparent material formed in a rectangular shape. As the transparent material, for example, quartz or borosilicate glass can be used.
Further, the workpiece 1 has an x-axis direction, a y-axis direction, and a z-axis direction defined on the basis of a case where the workpiece 1 is directly facing the workpiece 1 as shown in FIG. The x-axis direction is a normal direction of the left surface 1a of the workpiece 1 in FIG. Similarly, the y-axis direction is the normal direction of the back surface 1 b of the workpiece 1, and the z-axis direction is the normal direction of the upper surface 1 c of the workpiece 1.
The opening of the groove 2 is formed in the upper surface 1c of the workpiece 1 along the y-axis direction.

(Configuration of laser processing equipment)
Next, the laser processing apparatus 3 used in the groove forming method of this embodiment will be described.
FIG. 2 is a schematic diagram showing the configuration of the laser processing apparatus 3.
As shown in FIG. 2, the laser processing apparatus 3 includes an irradiation mechanism unit 4 and a control unit 5.
The irradiation mechanism unit 4 includes a mounting table 6, an X-axis moving unit 7, a Y-axis moving unit 8, a Z-axis moving unit 9, a laser light source 10, a condenser lens 11, and an aberration correction lens group 12.
The mounting table 6 is a table on which a plane on which the workpiece 1 can be mounted is formed. Further, the mounting table 6 defines an X-axis direction, a Y-axis direction, and a Z-axis direction. The X-axis direction is one direction set in the plane above the mounting table 6. Similarly, the Y-axis direction is in the plane above the mounting table 6 and is orthogonal to the X-axis direction (more specifically, when the mounting table 6 is viewed from above, the X-axis direction is rotated 90 ° clockwise. The Z-axis direction is the normal direction of the plane.

The X-axis moving unit 7 moves the mounting table 6 along the X-axis direction in response to a signal from the control unit 5. As the X-axis moving unit 7, for example, a unit composed of a slider that performs translational motion along the X-axis direction and a servo motor that drives the slider can be used. Similarly, the Y-axis moving unit 8 moves the mounting table 6 along the Y-axis direction in response to a signal from the control unit 5. The Z-axis moving unit 9 moves the mounting table 6 along the Z-axis direction in response to a signal from the control unit 5.
The laser light source 10 is disposed above the mounting table 6. The laser light source 10 emits the laser light 13 toward the upper surface of the mounting table 6 (that is, the direction opposite to the Z-axis direction) in accordance with a signal from the control unit. As the laser light source 10, for example, titanium sapphire that is a solid light source and emits femtosecond laser light generated by titanium sapphire can be used.
The condenser lens 11 is disposed between the laser light source 10 and the mounting table 6. The condensing lens 11 condenses the laser light 13 emitted from the laser light source 10.

The aberration correction lens group 12 adjusts the aberration of the condenser lens 11 in accordance with a signal from the control unit 5. The aberration correction lens group 12 controls the length of the condensing region of the laser beam 13 in the direction of the laser beam 13 optical axis 14. As the aberration correction lens group 12, for example, a lens that is accommodated in a lens barrel of the condenser lens 11 and includes a plurality of lenses can be used.
The control unit 5 includes an input unit 15, a display unit 16, and a calculation unit 17.
The input unit 15 uses data of signals output to the X-axis moving unit 7, the Y-axis moving unit 8, the Z-axis moving unit 9, the laser light source 10, and the aberration correction lens group 12 to be used for laser processing. Let them enter. As the input unit 15, for example, a keyboard or a mouse can be used.

The display unit 16 displays various information at the time of laser processing. For example, a liquid crystal display or a CRT (cathode ray tube) display can be used as the display unit 16.
The arithmetic unit 17 performs arithmetic processing on the data input from the input unit 15, and based on the processing result, the X-axis moving unit 7, the Y-axis moving unit 8, the Z-axis moving unit 9, the laser light source 10, and the aberration. A signal is output to the correction lens group 12. As the arithmetic unit 17, for example, a computer configured from an A / D conversion circuit, a D / A conversion circuit, a central processing unit, a memory, and the like can be used.

(Description of groove forming method)
Next, a groove forming method for forming the groove 2 in the workpiece 1 using the laser processing apparatus 3 described above will be described.
The groove forming method includes the following first to third steps.
(First step)
The first step is a step of forming the first crack 19 a in the planned formation portion 18 of the groove 2 of the workpiece 1 using the laser processing device 3.
FIG. 3 is a schematic diagram for explaining the first step.
Here, as described later, the upper surface 1c of the workpiece 1 is polished in the third step. Therefore, as the workpiece 1 in the first step, as shown in FIG. 3, the workpiece 1 in FIG. 1, that is, the workpiece 1 obtained through the first to third steps is z. Use one with a large axial thickness. Further, the portion 18 to be formed of the groove 2 is set inside the workpiece 1.

In the first step, first, the workpiece 1 is mounted on the mounting table 6 with the z-axis direction of the workpiece 1 facing the Z-axis direction of the irradiation mechanism unit 4. Further, the workpiece 1 is positioned so that the y-axis direction of the workpiece 1, that is, the direction along the planned formation portion 18 of the groove 2 is directed to the Y-axis direction of the irradiation mechanism section 4.
Next, the X-axis moving unit 7 and the Y-axis moving unit 8 are controlled by the calculation unit 17 so that the laser beam 13 is focused on the y-axis direction end of the portion 18 where the groove 2 of the workpiece 1 is to be formed. The mounting table 6 is moved so that Further, the Z-axis moving unit 9 is controlled by the calculating unit 17 so that the condensing region of the laser beam 13 is placed between the upper surface 1c of the workpiece 1 and the portion 18 where the groove 2 is to be formed. Move. Then, the calculation unit 17 controls the laser light source 10 to start emission of the laser light 13. As a result, the laser beam 13 is condensed between the upper surface 1 c of the workpiece 1 and the formation planned portion 18 of the groove 2. Then, the modified region 20 by multiphoton absorption is formed in a portion where the energy density capable of forming the modified region 20 is obtained by condensing the laser beam 13.

  Next, the calculation unit 17 controls the Y-axis movement unit 8 to move the mounting table 6 in the Y-axis direction of the irradiation mechanism unit 4 by a predetermined pitch with respect to the condenser lens 11, while the workpiece 1 The condensing of the laser beam 13 between the upper surface 1c and the portion 18 where the groove 2 is to be formed is repeated in the same manner. The movement of the mounting table 6 is terminated when the condensing region of the laser beam 13 reaches the end of the workpiece 1 in the direction opposite to the y-axis direction. As a result, a modified region 20 is formed between one end side of the workpiece 1 and the other end side along the planned formation portion 18 of the groove 2 between the upper surface 1 c of the workpiece 1 and the planned formation portion 18 of the groove 2. It is formed.

FIG. 4 is an explanatory diagram for explaining the first crack 19a. In FIG. 4A, the workpiece 1 is represented by a plan view, and in FIG. 4B, the workpiece 1 is represented by a cross-sectional view cut along the xz plane.
Here, the portion where the modified region 20 is formed expands. Therefore, internal stress is generated in the modified region 20 due to the formation of the modified region 20. In addition, this internal stress causes stress concentration at locations where the external shape changes greatly. Therefore, in the modified region 20, the internal stress increases at both ends of the laser beam 13 in the direction of the optical axis 14. When the increased internal stress becomes larger than the intermolecular bonding force of the workpiece 1, the laser beam enters the workpiece 1 from the lower surface 1d side end of the modified region 20 in the direction opposite to the z-axis direction, that is, the laser. A second crack 19a extending in the direction of the optical axis 14 of the light 13 is formed. The lower surface 1d is a surface opposite to the upper surface 1c of the workpiece 1. Thereby, as shown in FIG. 4, the 2nd crack 19a is formed in the formation scheduled part 18 of the groove | channel 2 of the to-be-processed object 1. As shown in FIG. Similarly, when the increased internal stress becomes larger than the bonding force of the workpiece 1, the z axis direction from the end of the modified region 20 on the upper surface 1 c side, that is, the optical axis of the laser beam 13, enters the workpiece 1. A second crack 19b extending in the direction opposite to the 14 direction is formed.

Note that the first crack 19a and the second crack 19b in FIG. 4 are formed by positioning the mounting table 6 so that the laser beam 13 is focused on the upper surface 1c of the workpiece 1, and then moving the mounting table 6 to the Z-axis. After moving 140 μm in the direction, the laser beam 13 was condensed inside the workpiece 1 and formed.
FIG. 5 is an explanatory diagram for explaining a first comparative example. In FIG. 5A, the workpiece 1 is represented by a plan view, and in FIG. 5B, the workpiece 1 is represented by a cross-sectional view cut along the xz plane.
Incidentally, as shown in FIG. 5, when the laser beam 13 is condensed in the vicinity of the upper surface 1c of the workpiece 1, only a short first crack 19a is generated.
Note that the first crack 19a in FIG. 5 is obtained by positioning the mounting table 6 so that the laser beam 13 is focused on the upper surface 1c of the workpiece 1, and then moving the mounting table 6 in the Z-axis direction by 50 μm. Then, the laser beam 13 was condensed and formed inside the workpiece 1.

FIG. 6 is an explanatory diagram for explaining a second comparative example. In FIG. 6A, the workpiece 1 is represented by a plan view, and in FIG. 6B, the workpiece 1 is represented by a cross-sectional view cut along the xz plane.
In addition, as shown in FIG. 6, even when the laser beam 13 is focused inside the workpiece 1 so that the modified region 20 covers the upper surface 1 c of the workpiece 1, the second crack 19 b Does not occur, and only the first short crack 19a is generated.
The first crack 19a in FIG. 6 is obtained by positioning the mounting table 6 so that the laser beam 13 is focused on the upper surface 1c of the workpiece 1, and then moving the mounting table 6 by 80 μm in the Z-axis direction. Then, the laser beam 13 was condensed and formed inside the workpiece 1.

When the laser beam 13 is condensed between the upper surface 1c of the workpiece 1 and the portion 18 where the groove 2 is to be formed, the calculation unit 17 controls the aberration correction lens group 12 to collect the laser beam 13. The aberration of the condensing lens 11 is appropriately adjusted so that a region having an energy density capable of forming the modified region 20 by light expands in the direction of the optical axis 14 of the laser beam 13. Thereby, as shown in FIG.4 (b), the length of the optical axis 14 direction of the laser beam 13 of the modification area | region 20 formed increases. Therefore, both ends of the laser beam 13 in the direction of the optical axis 14 become thin and sharp in the modified region 20, and a stronger stress concentration degree is generated at both ends. Then, due to the stress concentration, a first crack 19a extending parallel to the direction of the optical axis 14 of the laser beam 13 is formed.
Note that the first crack 19a in FIG. 4B is collected after the mounting table 6 is positioned so that the laser beam 13 is focused at a depth of 1 mm from the upper surface 1c of the workpiece 1. The aberration was adjusted so that the optical property was the best, and the laser beam 13 was condensed inside the workpiece 1 to be formed.

FIG. 7 is an explanatory diagram for explaining a third comparative example. In FIG. 7, the workpiece 1 is represented by a cross-sectional view cut along the xz plane.
Incidentally, as shown in FIG. 7, when the aberration correction of the condenser lens 11 is not performed, a first crack 19a extending in a direction inclined from the direction of the optical axis 14 of the laser light 13 is formed.
Next, when the irradiation of the laser beam 13 to the end of the workpiece 1 in the direction opposite to the y-axis direction is completed, the arithmetic unit 17 controls the Y-axis moving unit 8 to control the condenser lens 11. While moving the mounting table 6 by a predetermined pitch in the direction opposite to the Y-axis direction of the irradiation mechanism unit 4, the laser beam 13 is condensed between the upper surface 1 c of the workpiece 1 and the portion 18 where the groove 2 is to be formed. Repeat in the same way. The movement of the mounting table 6 is finished when the condensing region of the laser beam 13 reaches the end of the workpiece 1 in the y-axis direction. Thereby, the laser beam 13 is condensed again on the modified region 20 that has already been formed.

FIG. 8 is an explanatory diagram for explaining the progress of the first crack 19a. FIG. 8A shows a case where the laser beam 13 is irradiated twice, and FIG. 8B shows a case where the laser beam 13 is irradiated three times. 8A and 8B, the workpiece 1 is represented by a cross-sectional view.
Here, the modified region 20 further expands when the laser beam 13 is collected. Therefore, the internal stress in the modified region 20 increases due to the condensing of the laser beam 13 again. Then, the second crack 19a is developed by the increased internal stress. As a result, as shown in FIG. 8A, a deeper second crack 19a is formed in the portion 18 of the workpiece 1 where the groove 2 is to be formed. Similarly, when the increased internal stress acts, the second crack 19b is developed. As a result, the second crack 19 a reaches the upper surface 1 c of the workpiece 1.

Next, when the irradiation of the laser beam 13 to the end portion in the y-axis direction of the workpiece 1 is completed, the calculation unit 17 controls the Y-axis moving unit 8 to place it again on the condenser lens 11. While moving the mounting table 6 by a predetermined pitch in the Y-axis direction of the irradiation mechanism unit 4, the condensing of the laser beam 13 between the upper surface 1 c of the workpiece 1 and the planned formation portion 18 of the groove 2 is repeated in the same manner. As a result, the laser beam 13 is condensed again on the modified region 20. Then, as shown in FIG. 8 (b), a deeper second crack 19 a is formed in the portion 18 of the workpiece 1 where the groove 2 is to be formed.
FIG. 9 is an explanatory diagram for explaining a fourth comparative example. 9A shows the case where the laser beam 13 is irradiated twice without correcting the aberration of the condenser lens 11, and FIG. 9B shows the case where the laser beam 13 is irradiated three times. 9A and 9B, the workpiece 1 is represented by a cross-sectional view.
Incidentally, as shown in FIGS. 9A and 9B, when the aberration correction of the condenser lens 11 is not performed, the inclination of the first crack 19a increases as the number of times of irradiation with the laser beam 13 increases.

(Second process)
The second step is a step of etching the inner surface of the first crack 19 a formed in the first step using the etching solution tank 21.
FIG. 10 is a schematic diagram for explaining the second process.
As shown in FIG. 10, the etching solution tank 21 is a tank that contains the etching solution 22 therein. The etching liquid 22 is a liquid that reacts with the workpiece 1 and etches the workpiece 1. As the etchant 22, for example, a hydrofluoric acid solution HF 5 vol% can be used.
In the second step, the workpiece 1 is accommodated in the etching solution tank 21. Then, the workpiece 1 is immersed in the etching solution 22. Thereby, the surface of the workpiece 1 is etched.

Here, as described above, the second crack 19 b reaches the upper surface 1 c of the workpiece 1. Therefore, when the workpiece 1 is immersed in the etching solution 22, the etching solution 22 enters the inside of the second crack 19b from the upper surface 1c side end portion of the second crack 19b. Then, when the etching solution 22 enters the inside, the inner surface of the second crack 19b is etched, and the etching solution 22 touches the modified region 20 portion. Here, the etching rate of the modified region 20 is faster than the other parts of the workpiece 1. Therefore, the cavity 23 is formed in the modified region 20 due to the difference in the etching rate.
Further, when the portion of the modified region 20 is etched, the etching solution 22 enters the first crack 19a from the end portion on the upper surface 1c side of the first crack 19a. When the etching solution 22 enters the inside, the inner surface of the first crack 19a is etched. And the inner surface of the 1st crack 19a becomes smooth, and the front-end | tip part of the 1st crack 19a becomes round. As a result, the groove 2 is formed in the portion where the first crack 19a is formed.

(Third step)
The third step is a step of polishing the upper surface 1c of the workpiece 1 using the polishing apparatus 24 and removing the cavity 23 formed in the second step.
FIG. 11 is a schematic diagram for explaining the third step.
As shown in FIG. 11, the polishing apparatus 24 is an apparatus that rotates the polishing pad 25. As the polishing pad 25, for example, one made of hard polyurethane can be used.
In the third step, a polishing pad 25 containing an abrasive is pressed against the upper surface 1 c of the workpiece 1. And the upper surface 1c of the workpiece 1 is grind | polished, the part which formed the cavity 23 from the workpiece 1 is removed, and the upper surface 1c side edge part of the groove | channel 2 is exposed. Thereby, as shown in FIG. 1 mentioned above, the workpiece 1 in which the opening part of the groove | channel 2 was formed in the upper surface 1c is obtained.

(Effect of this embodiment)
Thus, in this embodiment, the part in which the first crack 19a is formed is etched, and the groove 2 is formed in the part by etching.
Therefore, the width of the groove 2 formed in the workpiece 1 can be made equal to the width of the first crack 19a.
Accordingly, it is possible to form the narrow groove 2 by the workpiece 1.
In the present embodiment, an example in which one groove 2 is formed in the workpiece 1 has been shown. However, the groove forming method of the present embodiment can also be used when a plurality of grooves 2 are formed. it can.

  For example, it can be used when a plurality of grooves 2 are formed in parallel at an arbitrary interval to form a cavity of an ink jet head. Similarly, a plurality of grooves 2 can be formed in parallel at arbitrary intervals to form an optical waveguide structure that can be used as a substitute for a TFT (Thin Film Transistor) MLA (Micro Lens Array). An optical waveguide structure is an optical element having a wedge-shaped recess in an inter-pixel region of a liquid crystal display. This optical element is provided on one side of the pair of substrates facing the liquid crystal display, and functions to improve the light utilization efficiency by reflecting light passing through the inter-pixel region into the pixel portion by the concave portion. .

(First embodiment)
Next, an example in which the groove forming method of the first embodiment is performed will be described.
FIG. 12 is an explanatory diagram for explaining the first embodiment. In FIG. 12, the workpiece 1 is represented by a cross-sectional view cut along the xz plane. FIG. 12B is an enlarged view of FIG.
In the first step of the first embodiment, a laser light source 10 that emits a laser beam 13 having a pulse width of 8 ps and an energy of 100 μJ was used. Further, the interval between the condensing regions of the laser beam 13 was set to 10 μm, and the lens NA of the condensing lens 11 was set to 0.8.
In the second step, 25 wt% HF was used as the etchant 22. The time for immersing the workpiece 1 in the etching solution 22 was set to 60 minutes.
Under these conditions, the workpiece 1 was irradiated with the laser beam 13 only once along the portion to be formed 18 of the groove 2 to form the groove 2. As a result, as shown in FIG. 12, the formed groove 2 had a width of 6 μm, a depth of 110 μm, and an aspect ratio of 18.3.

(Second embodiment)
FIG. 13 is an explanatory diagram for explaining the second embodiment. In FIG. 13, the workpiece 1 is represented by a cross-sectional view cut along the xz plane. FIG. 13B is an enlarged view of FIG.
In this second example, the groove 2 was formed by irradiating the workpiece 1 twice with the laser beam 13 along the portion 18 to be formed of the groove 2 under the above conditions. As a result, as shown in FIG. 13, the formed groove 2 had a width of 3 μm, a depth of 230 μm, and an aspect ratio of 76.7.

(Comparative example)
FIG. 14 is an explanatory diagram for explaining a fifth comparative example. 14A shows a state before the workpiece 1 is etched after the modified region 20 is formed in the portion 18 where the groove 2 is to be formed, and FIG. This represents the state after etching. 14A and 14B, the workpiece 1 is represented by a cross-sectional view.
Incidentally, as shown in FIGS. 14A and 14B, when the modified region 20 is formed in the portion 18 where the groove 2 is to be formed and the groove 2 is formed in the portion where the modified region 20 is formed by etching, The groove 2 has a width of 20 μm, a depth of 136 μm, and an aspect ratio of 6.8.

(Second Embodiment)
Next, a second embodiment according to the present invention will be described with reference to the drawings.
Note that the same components as those in the first embodiment will be described with the same reference numerals.
This embodiment is different from the first embodiment in that after the first step, the upper surface 1c of the workpiece 1 is polished and the inner surface of the first crack 19a formed in the first step is etched. .
Specifically, the second and third steps are different.

(Second step)
The second step is a step of polishing the upper surface 1c of the workpiece 1 using the polishing apparatus 24 and removing the modified region 20 formed in the first step.
FIG. 15 is a schematic diagram for explaining the second step.
As shown in FIG. 15, in the second step, the polishing pad 24 containing an abrasive is pressed against the upper surface 1 c of the workpiece 1 by the polishing processing device 24. Then, the upper surface 1c of the workpiece 1 is polished. Thereby, the part which formed the modification | reformation area | region 20 from the to-be-processed object 1 is removed, and the upper surface 1c side edge part of the 1st crack 19a is exposed. Thereby, the to-be-processed object 1 in which the opening part of the 1st crack 19a was formed in the upper surface 1c is obtained.

(Third process)
The third step is a step of etching the inner surface of the first crack 19 a formed in the first step using the etching solution tank 21.
FIG. 16 is a schematic diagram for explaining the third step.
As shown in FIG. 16, in the third step, the workpiece 1 is stored in the etching solution tank 21. Then, the workpiece 1 is immersed in the etching solution 22. Thereby, the surface of the workpiece 1 and the inner surface of the first crack 19 a are etched with the etching liquid 22. And the inner surface of the 1st crack 19a becomes smooth, and the front-end | tip part of the 1st crack 19a becomes round. As a result, the groove 2 is formed in the portion where the first crack 19a is formed. Thereby, as shown in FIG. 1 mentioned above, the workpiece 1 in which the opening part of the groove | channel 2 was formed in the upper surface 1c is obtained.

Thus, in this embodiment, the part in which the first crack 19a is formed is etched, and the groove 2 is formed in the part by etching.
Therefore, the width of the groove 2 formed in the workpiece 1 can be made equal to the width of the first crack 19a.
Accordingly, it is possible to form a narrower groove 2 in the workpiece 1.

1 is a perspective view of a workpiece 1. FIG. 2 is a schematic diagram showing a configuration of a laser processing apparatus 3. FIG. It is a schematic diagram for demonstrating a 1st process. It is explanatory drawing for demonstrating the 1st crack 19a. It is explanatory drawing for demonstrating a 1st comparative example. It is explanatory drawing for demonstrating the 2nd comparative example. It is explanatory drawing for demonstrating the 3rd comparative example. It is explanatory drawing for demonstrating progress of the 1st crack 19a. It is explanatory drawing for demonstrating the 4th comparative example. It is a schematic diagram for demonstrating the 2nd process. It is a schematic diagram for demonstrating a 3rd process. It is explanatory drawing for demonstrating a 1st Example. It is explanatory drawing for demonstrating a 2nd Example. It is explanatory drawing for demonstrating the 5th comparative example. It is a schematic diagram for demonstrating the 2nd process of 2nd Embodiment. It is a schematic diagram for demonstrating a 3rd process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 is a workpiece, 2 is a groove, 3 is a laser processing apparatus, 4 is an irradiation mechanism part, 5 is a control part, 6 is a mounting base, 7 is an X-axis moving part, 8 is a Y-axis moving part, 9 is an axial movement , 10 is a laser light source, 11 is a condenser lens, 12 is an aberration correction lens group, 13 is a laser beam, 14 is an optical axis, 15 is an input unit, 16 is a display unit, 17 is a calculation unit, and 18 is a portion to be formed , 19a is a first crack, 19b is a second crack, 20 is a modified region, 21 is an etching solution tank, 22 is an etching solution, 23 is a cavity, 24 is a polishing apparatus, and 25 is a polishing pad.

Claims (4)

  1. A groove forming method for forming a groove in a transparent workpiece,
    Irradiating a laser beam along a portion where the groove is to be formed inside the workpiece, condensing the laser beam to form a modified region inside the workpiece, and forming the modified region A first step of forming a crack extending in the optical axis direction of the laser beam in a portion where the groove is to be formed in the workpiece due to internal stress generated in the portion of the modified region;
    A portion of the workpiece in which the modified region is formed and an inner surface of the crack are etched, a cavity is formed in the portion in which the modified region is formed by the etching, and a groove is formed in the portion in which the crack is formed. A second step of forming
    A third step of polishing the workpiece, removing a portion where the cavity is formed from the workpiece by the polishing, and exposing the groove;
    A groove forming method characterized by comprising:
  2. A groove forming method for forming a groove in a transparent workpiece,
    Irradiating a laser beam along a portion where the groove is to be formed inside the workpiece, condensing the laser beam to form a modified region inside the workpiece, and forming the modified region A first step of forming a crack extending in the optical axis direction of the laser beam in a portion where the groove is to be formed in the workpiece due to internal stress generated in the portion of the modified region;
    A second step of polishing the workpiece, removing a portion where the modified region is formed from the workpiece by the polishing, and exposing the crack;
    A third step of etching the inner surface of the crack and forming a groove in the portion where the crack is formed by the etching;
    A groove forming method characterized by comprising:
  3.   In the first step, the laser beam is condensed by a condenser lens, and when the laser beam is condensed, the condensing region of the laser beam is expanded in the optical axis direction of the laser beam. The groove forming method according to claim 1, wherein an aberration of the condenser lens is adjusted.
  4.   In the first step, after a modified region is formed inside the workpiece, a laser beam is irradiated along a portion where the groove is to be formed inside the workpiece, and the laser beam is modified. 4. The groove according to claim 1, wherein the groove is focused on the quality region portion, and the internal stress generated in the modified region portion is increased by the focused laser beam. 5. Forming method.
JP2008334168A 2008-12-26 2008-12-26 Method of forming groove Pending JP2010155259A (en)

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