JP2010146877A - Connection device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection device which is thinner than in a case where a through-hole is not formed in a substrate having an electric connection part, and to provide electronic equipment. <P>SOLUTION: Through-holes 56, 58 pass through a photo-electric combined substrate 18, and insertion portions 61, 63 of female connectors 60, 62 are inserted into the through-holes 56, 58 and electrically connected to an electric wiring plate layer 16. Thus, the connection device 10 has a smaller plane area or height than in a case where the connector is connected to the side face of the photo-electric combined substrate 18 or the connector is connected to the upper face of the photo-electric combined substrate 18. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connection device and an electronic apparatus.

  Currently, optical wiring that replaces conventional electrical wiring is being actively developed mainly for portable devices in order to reduce electromagnetic noise, increase data transmission capacity, reduce the number of wirings, and the like. As one form of optical wiring, a configuration is known in which an optical fiber or an optical waveguide is used as a transmission medium, a semiconductor light emitting element such as a semiconductor laser is mounted on the transmission side of the transmission medium, and a semiconductor light receiving element is mounted on the reception side (patent) Literatures 1-4).

  As a connector including a component that performs photoelectric conversion, a card edge type connector (for example, Patent Document 5) and a stack type connector are known.

JP 2000-30951 A

JP 2001-36197 A

JP 2007-536563 A

Special table 2008-502013

JP 2000-250671 A

  An object of the present invention is to obtain a thin connection device and electronic device as compared with a case where a through hole is not formed in a substrate having an electrical connection portion.

  The invention according to claim 1, in the connection device, a substrate having an optical waveguide layer in which an optical waveguide through which light propagates is formed, and an electrical wiring board layer in which electrical wiring is formed and overlaps the optical waveguide layer; A through hole penetrating the substrate; and an electrical connection portion that is inserted into the through hole to be electrically connected to the electrical wiring and electrically connected to the outside.

  According to a second aspect of the present invention, in the connecting device according to the first aspect, the two through holes are provided, the first region having an electric wiring is provided between the two through holes, and the others A second region in which an optical element that emits or receives light is mounted is provided in this portion.

  According to a third aspect of the present invention, in the connection device according to the first or second aspect, the electrical connection portion includes an insertion portion that is inserted into the through hole, and projects outward from the insertion portion and enters the through hole. A recess that fits the flange is formed around the through hole.

  According to a fourth aspect of the present invention, in the electronic device, a plurality of the connection devices according to any one of the first to third aspects are provided, and one of the two connection devices is provided. It has a connection member connected to the electrical connection part and connected to the electrical connection part of the other connection device.

  According to the first aspect of the present invention, the height of the connection device can be reduced as compared with the case where the through hole is not formed in the substrate having the electrical connection portion.

  According to the second aspect of the present invention, in the electrical wiring for an electronic component, it is not necessary to route the optical element so as to avoid the passage hole for the optical element.

  According to the invention described in claim 3, it is possible to prevent the flange portion of the electrical connection portion from protruding from the surface of the substrate.

  According to the invention described in claim 4, in the electronic device, the height of the electronic device can be reduced as compared with the case where the through hole is not formed in the substrate having the electrical connection portion.

  Next, the connection device according to the present embodiment will be described with reference to the drawings. In addition, the same code | symbol is provided to the member which has the substantially the same function and effect | action through all the drawings, and the overlapping description may be abbreviate | omitted.

  FIG. 1 shows a conceptual diagram of the connection device 10. As shown in FIG. 1, the connection device 10 has a substantially rectangular shape, and includes an optical waveguide layer 12 through which light propagates and an electrical wiring board layer 16 on which electronic components such as an optical element 14 are mounted. A photoelectric mixed substrate 18 configured to overlap is provided. Here, the “photoelectric mixed substrate” refers to a substrate on which optical components and electronic components can be mounted.

  Next, the electrical wiring board layer 16 and the optical waveguide layer 12 will be described.

(Electric wiring board layer)

  First, the electrical wiring board layer 16 will be described. As shown in FIG. 1, the electrical wiring board layer 16 is positioned below the photoelectric mixed substrate 18, and the optical elements 14 are mounted on the corners of the electrical wiring board layer 16, respectively.

  Specifically, the light emitting element 20 is mounted on one end side along the longitudinal direction of one end side in the width direction of the electric wiring board layer 16, and the light receiving element 22 is mounted on the other end side. A light receiving element 24 is mounted on one end side along the longitudinal direction of the other end side in the width direction of the electric wiring board layer 16, and a light emitting element 26 is mounted on the other end side.

  In addition, a driving IC 28 for driving the light emitting element 20 is mounted on the light emitting element 20 on the outer side in the longitudinal direction of the electric wiring board layer 16, and the light receiving element 22 on the outer side in the longitudinal direction of the electric wiring board layer 16. Is mounted with a driving IC 30 for driving the light receiving element 22.

  A driving IC 32 for driving the light emitting element 26 is mounted outside the light emitting element 26 in the longitudinal direction of the electric wiring board layer 16, and the light receiving element 24 outside the longitudinal direction of the electric wiring board layer 16 is mounted. Is mounted with a driving IC 34 for driving the light receiving element 24.

  Further, as shown in FIGS. 2 and 3, through holes 36 and 38 are formed on the side of the electric wiring board layer 16 of the light emitting element 20 and the light receiving element 22, respectively, and the light emitted from the light emitting element 20 is transmitted. Light passing through the passage hole 36 and passing through the passage hole 38 is received by the light receiving element 22 (described later).

  As shown in FIG. 2, passage holes 40 and 42 are respectively formed on the side of the electric wiring board layer 16 of the light emitting element 26 and the light receiving element 24, and the light emitted from the light emitting element 26 is transmitted to the passage hole. The light passing through 40 and passing through the passage hole 42 is received by the light receiving element 24 (described later).

  In addition, electrical wiring is routed on the electrical wiring board layer 16 in order to apply a voltage to these electronic components (described later). Although not shown, electronic components other than the optical element 14 such as an integrated circuit such as an LSI are also mounted, and a voltage is applied to these electronic components other than the optical element 14 on the electrical wiring board layer 16. The electrical wiring is also routed (described later).

(Optical waveguide layer)

  Next, the optical waveguide layer 12 will be described. As shown in FIGS. 1 and 2, the optical waveguide layer 12 is provided on the upper surface of the electrical wiring board layer 16, and has a clad 12A and optical waveguide cores 44 and 46 embedded in the clad 12A. ing. The clad 12 </ b> A is made of a material having a refractive index lower than that of the optical waveguide cores 44 and 46, and is disposed so as to surround the optical waveguide cores 44 and 46.

  The optical waveguide core 44 is positioned on a line connecting the light emitting element 20 and the light receiving element 22 of the electrical wiring board layer 16 in plan view, and the electrical wiring board layer is disposed on both ends of the optical waveguide core 44 in plan view. Reflective surfaces 48 and 50 (inclined surfaces shown in FIG. 3), which serve as an optical path conversion unit for light propagating through the optical waveguide core 44, are formed of metal films at positions corresponding to the 16 through holes 36 and 38.

  The optical waveguide core 46 is located on the line connecting the light emitting element 26 and the light receiving element 24, and the both ends of the optical waveguide core 44 are connected to the passage holes 40, 42 of the electric wiring board layer 16 in a plan view. Reflecting surfaces 52 and 54 (similar to the reflecting surfaces 48 and 50) are formed at corresponding positions as optical path changing portions for light propagating through the optical waveguide core 46.

  As shown in FIG. 3, the reflection surfaces 48 and 50 (the same applies to the reflection surfaces 52 and 54) are formed so as to form an angle of, for example, 45 ° with respect to the longitudinal direction of the optical waveguide core 44. Since the optical path conversion is performed through the metal film as the reflecting surface 48, a deviation that is less than the critical angle of the waveguide functions sufficiently.

(Connecting device)

  Next, the connection device 10 according to the present embodiment will be described. As shown in FIG. 1, rectangular through holes 56 and 58 penetrating the electric wiring board layer 16 and the optical waveguide layer 12 are formed in the central portion of both ends in the longitudinal direction of the photoelectric mixed substrate 18. Insertion portions 61 and 63 of rectangular female connectors (electrical connection portions) 60 and 62 that perform transmission and reception can be fitted respectively.

  Rectangular insertion ports 61A and 63A are provided at the center of the insertion portions 61 and 63, and male connectors 78 and 80 (see FIG. 5) can be inserted. In addition, flange portions 64 and 66 wider than the insertion portions 61 and 63 are provided at one end portions of the female connectors 60 and 62.

  The female connectors 60 and 62 can be inserted so that the flange portions 64 and 66 are on the electric wiring board layer 16 side (see FIG. 4), and the flange portions 64 and 66 are interposed via electrode portions 68 and 70 described later. The female connectors 60 and 62 are positioned with respect to the opto-electric hybrid board 18 with 66 in contact with the peripheral edges of the through holes 56 and 58 of the electrical wiring board layer 16 (see FIG. 5).

  Here, from the stepped surfaces 64A and 66A in the longitudinal direction of the flange portions 64 and 66, a pair of electrode portions 68 and an electrode portion 70 electrically connected to the female connectors 60 and 62 are connected to the width of the flange portions 64 and 66. Overhang from both sides of the direction. On the other hand, the electrical wiring board layer 16 is provided with a pair of electrode portions 72 and 74 that are electrically connected to the electrical wiring board layer 16, respectively. ) Is applied.

  With the female connectors 60 and 62 inserted into the through holes 56 and 58, the electrode portions 68 and 70 of the female connectors 60 and 62 and the electrode portions 72 and 74 of the electrical wiring board layer 16 face each other. Yes. By putting the photoelectric mixed substrate 18 into the flow layer or the like, the solder is melted, and the electrode portions 68 and 70 are fixed to the electrode portions 72 and 74 through the solder.

  As shown in FIG. 5, a male connector 78 provided on a board (circuit board) 75 as a connecting member can be connected to the female connector 60, and a board (circuit board) 76 is connected to the female connector 62. The male connector 80 provided in the can be connected. Then, electrical signals are transmitted and received between the electronic components mounted on the electric wiring board layer 16 of the photoelectric mixed substrate 18 and the electronic components mounted on the substrates 75 and 76. Here, the substrates 75 and 76 need only be electrically connectable to the opto-electric hybrid board 18 and therefore do not necessarily have to be substrates, and may be electrical wiring to which a male connector is connected.

  By the way, in this embodiment, as shown in FIG. 2, the optical element 14 is provided at the corner portion of the photoelectric hybrid substrate 18, and the optical waveguide cores 44 and 46 are provided at both ends in the width direction of the optical waveguide layer 12.

  Then, the electrical wiring for the optical element for driving the optical element 14 is routed outside the through holes 56 and 58 located on both ends in the longitudinal direction of the photoelectric hybrid substrate 18, and the central side in the longitudinal direction of the photoelectric hybrid substrate 18. In order to drive the electronic components other than the electronic components for the optical elements such as the light emitting elements 20 and 26 and the light receiving elements 22 and 24 and the driving ICs 28, 30, 32, and 34 inside the through hole 56 and the through hole 58, which are located in FIG. The electrical wiring for electronic parts is routed.

  That is, the optical element electrical wiring and the other electronic component electrical wiring are separated, and the inside of the through holes 56 and 58 (the central side in the longitudinal direction of the photoelectric mixed substrate 18) is defined as the electronic component electrical wiring region B. Portions other than those (both ends in the longitudinal direction of the photoelectric mixed substrate 18) are used as the optical element electrical wiring region A.

  The both ends of the through holes 56 and 58 in the width direction are the optical element electrical wiring region A and the electronic component electrical wiring region B, but the optical element electrical wiring region A or the electronic component electrical wiring region B. It is also good.

  Next, the operation of the connection device according to this embodiment will be described.

  In the present embodiment, as shown in FIG. 2, when light is emitted from the light emitting element 20 mounted on the electrical wiring board layer 16, this light passes through the passage hole 36 and reaches one end of the optical waveguide core 44. The light is reflected by the reflecting surface 48 positioned and propagates in the optical waveguide core 44. The light propagating through the optical waveguide core 44 is reflected by the reflecting surface 50 located at the other end of the optical waveguide core 44, passes through the passage hole 38, and is received by the light receiving element 22 (so-called transmission use). Optical waveguide).

  Further, when light is emitted from the light emitting element 26 mounted on the electric wiring board layer 16, this light passes through the passage hole 40 and is reflected by the reflecting surface 52 located at one end of the optical waveguide core 46. Propagates through the optical waveguide core 46. The light propagated through the optical waveguide core 46 is reflected by the reflection surface 54 located at the other end of the optical waveguide core 46, passes through the passage hole 42, and is received by the light receiving element 24 (so-called reception use). Optical waveguide).

  Then, along with this optical transmission / reception, electrical processing such as power supply, transmission / reception of electric signals, and grounding is also performed through the electric wiring board layer 16 provided in the optical waveguide layer 12.

  Here, an optical waveguide for transmitting an optical signal from the light emitting element 20 is a transmitting optical waveguide, and an optical waveguide for receiving an optical signal by the light receiving element 24 is a receiving optical waveguide. In this case, it goes without saying that the transmission optical waveguide and the reception optical waveguide are reversed.

  In the present embodiment, the through-holes 56 and 58 are passed through the photoelectric mixed substrate 18, and the female connectors 60 and 62 are inserted into the through-holes 56 and 58 to be electrically connected to the electrical wiring board layer 16. Yes. For this reason, compared with the case where a connector is connected to the side surface of the photoelectric hybrid substrate 18 or a connector is connected to the upper surface of the photoelectric hybrid substrate 18, the plane area of the connection device 10 is small or the height of the connection device 10 is high. Becomes lower.

  Further, in the present embodiment, the female connectors 60 and 62 are attached to the photoelectric mixed substrate 18 on which the optical element 14 is previously mounted. Generally, positioning of the optical element 14 with respect to the optical waveguide layer 12 is difficult, and light may not be propagated due to a slight misalignment.

  That is, as in the present embodiment, the optical device 14 is provided with the member in which the optical waveguide cores 44 and 46 are formed by previously positioning the optical device 14 with respect to the optical waveguide layer 12 as the connection device 10. Compared with the case where the members are separately provided and connected to each other, the quality is improved.

  On the other hand, in order to allow light emitted from the light emitting elements 20 and 26 or received by the light receiving elements 22 and 24 to pass through the optical waveguide layer 12, the photoelectric hybrid substrate 18 on which the light emitting elements 20 and 26 and the light receiving elements 22 and 24 are mounted. Passing holes 36, 38, 40, and 42 are required to allow light to pass through, but at least electrical wiring cannot be routed through the passing holes 36, 38, 40, and 42.

  The electrical wiring of the opto-electric hybrid board 18 includes an electrical wiring for optical elements and an electrical wiring for electronic parts other than the optical elements, and the electrical wiring for electronic parts requires a larger area than the electrical wiring for optical elements.

  For this reason, the electrical wiring for electronic components is routed inside the through holes 56, 58, and the electrical wiring for optical devices is routed to the other portions, so that the electrical wiring area A for optical devices and the electronic components are simply constructed. In addition to narrowing the photoelectric mixed substrate 18 obtained by dividing the electric wiring area B, an area for avoiding the through holes 36, 38, 40, and 42 is secured in the electric wiring area B for electronic components. Since it becomes unnecessary, the width of the photoelectric mixed substrate 18 can be reduced accordingly.

  Further, by separating the optical element electrical wiring area A and the electronic component electrical wiring area B, crosstalk of electrical signals between the optical element electrical wiring and the electronic component electrical wiring is reduced.

(Other embodiments)

  In the present embodiment, as shown in FIG. 1, an electrical wiring board layer 16 is provided below the photoelectric hybrid substrate 18, an optical waveguide layer 12 is provided above the electrical wiring board layer 16, and the optical waveguide layer 12 side is viewed. Although the male connectors 78 and 80 (see FIG. 5) can be inserted, the female connectors 60 and 62 that pass through the through holes 56 and 58 and are electrically connected to the electric wiring board layer 16 pass through the photoelectric mixed substrate 18. The embodiment is not limited to this as long as it can be inserted into the holes 56 and 58.

  For example, as shown in FIG. 6, female connectors 86 and 88 having insertion ports 82 </ b> A and 84 </ b> A on the flanges 82 and 84 side may be fixed to the photoelectric mixed substrate 18. In this case, the optical waveguide layer 12 is provided below the photoelectric hybrid substrate 18, and the electrical wiring board layer 16 is provided above the optical waveguide layer 12.

  As shown in FIG. 1, when the electrical wiring board layer 16 is provided below the photoelectric mixed substrate 18, the insertion portions 61 and 63 of the female connectors 60 and 62 are inserted into the through holes 56 and 58 from below the photoelectric mixed substrate 18. Then, the female connectors 60 and 62 are fixed to the opto-electric hybrid board 18, but when the electrical wiring board layer 16 is provided on the upper part of the opto-electric hybrid board 18, as shown in FIG. The insertion portions 83 and 85 of the connectors 86 and 88 can be inserted into the through holes 56 and 58, and the female connectors 86 and 88 can be fixed to the photoelectric hybrid substrate 18.

  In addition to this, as shown in FIG. 7, recesses 94 and 96 larger than the through holes 56 and 58 provided in the electric wiring board layer 92 are formed in the optical waveguide layer 90, and the optical waveguide layer 90 is By using the photoelectric mixed substrate 98, the female connectors 86 and 88 may be fixed to the photoelectric mixed substrate 98.

  The recesses 94 and 96 are sized to accommodate the flange portions 82 and 84 of the female connectors 86 and 88 and the electrode portions 68 and 70, and the female connector 86 is disposed on the optical waveguide layer 90 side of the electrical wiring board layer 92. , 88 are provided with electrode portions 100 and 102 electrically connected to the electrode portions 68 and 70.

  Then, as shown in FIG. 8, when the insertion portions 83 and 85 of the female connectors 86 and 88 are inserted into the through holes 56 and 58 from above the photoelectric mixed substrate 98, the female connectors 86 and 88 are inserted as shown in FIG. The collar portions 82 and 84 are accommodated in the recesses 94 and 96.

  Here, by setting the height of the flange portions 82 and 84 of the female connectors 86 and 88 to be equal to or less than the thickness of the optical waveguide layer 90, the flange portions 82 and 84 of the female connectors 86 and 88 are formed from the upper surface of the optical waveguide layer 90. There is no exposure. That is, the exposure amount of the female connectors 86 and 88 exposed from the optical waveguide layer 90 is further reduced as compared with the embodiment shown in FIG.

  The connection device 10 including the photoelectric mixed substrate 18 described above can also be applied to an electronic device such as a mobile phone. For example, as shown in FIG. 10, for example, as shown in FIG. 10, a board 75 (see FIG. 5) on which components such as a control circuit and a memory circuit made of electronic components such as ICs are mounted is arranged on the transmitter 106 of the mobile phone 104. In addition, a board 76 on which electronic parts for electric circuits such as a display unit are mounted is disposed in the receiver 108 of the mobile phone 104.

  Then, the female connector 60 of the photoelectric hybrid substrate 18 shown in FIG. 5 is fitted to the male connector 78 (see FIG. 5) of the substrate 75, and the female connector 62 of the photoelectric hybrid substrate 18 is mated with the male connector 80 of the substrate 76 (see FIG. 5). ), Optical signals and electrical signals are transmitted and received between the substrate 75 and the substrate 76 by the optical waveguide layer 12 and the electrical wiring board layer 16 of the photoelectric hybrid substrate 18.

  Although two substrates 75 and 76 are provided here, the substrates 75 and 76 are not limited to two because it is sufficient that the substrates 75 and 76 can be connected to each other by the connecting device 10.

  Further, in the above embodiment, the optical transmission / reception apparatus that performs bidirectional optical communication between the optical transmission / reception units on which both the light emitting element and the light receiving element are mounted has been described. It is good also as an optical transmitter-receiver which performs one-way optical communication with the optical receiver provided with. Further, although the light emitting element and the light receiving element are used as the optical elements, a photo sensor may be used.

  As described above, this embodiment is merely an example, and it is needless to say that the embodiment can be appropriately changed without departing from the gist of the present invention.

It is a disassembled perspective view which shows the connection apparatus which concerns on this embodiment. It is a top view which shows the connection apparatus which concerns on this embodiment. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 1 and shows a state before the female connector is fixed to the photoelectric hybrid substrate. FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. It is sectional drawing corresponding to FIG. 4 which shows the state which fixed the female connector to the photoelectric hybrid board | substrate. It is a perspective view which shows the 1st modification of the connection apparatus which concerns on this embodiment, (A) shows the state before fixing a female connector to a photoelectric hybrid board | substrate, (B) is a photoelectric hybrid board | substrate. The state fixed to is shown. It is a perspective view which shows the 2nd modification of the connection apparatus which concerns on this embodiment, (A) shows the state before fixing a female connector to a photoelectric hybrid board | substrate, (B) is a photoelectric hybrid board | substrate. The state fixed to is shown. It is sectional drawing corresponding to FIG. 4 which shows the state before fixing a female connector to a photoelectric hybrid board | substrate. It is sectional drawing corresponding to FIG. 5 which shows the state which fixed the female connector to the photoelectric hybrid board | substrate. It is explanatory drawing which shows the structure of the electronic device which concerns on this embodiment.

Explanation of symbols

10 connection device 12 optical waveguide layer (photoelectric mixed substrate)
14 Optical element 16 Electric wiring board layer (Photoelectric hybrid board)
18 Optoelectronic mixed substrate 20 Light emitting element (optical element, optoelectronic component)
22 Light receiving element (optical element, optoelectronic component)
24 Light receiving element (optical element, optoelectronic component)
26 Light emitting elements (optical elements, optoelectronic components)
28 Drive IC (optoelectronic component)
30 Drive IC (optoelectronic component)
32 Drive IC (optoelectronic component)
34 Drive IC (optoelectronic component)
56 Through hole 58 Through hole 60 Female connector (electrical connection)
61 Insertion part (electrical connection part)
62 Female connector (electrical connection)
63 Insertion part (electrical connection part)
64 buttock (electrical connection)
66 collar (electrical connection)
75 Substrate (connection device)
76 Substrate (connection device)
82 buttock (electrical connection)
83 Insertion part (electrical connection part)
84 Buttocks (electrical connection)
85 Insertion part (electrical connection part)
86 Female connector 88 Female connector 90 Optical waveguide layer (photoelectric mixed substrate)
92 Electric wiring board layer (photoelectric hybrid board)
94 Concave portion 98 Opto-electric hybrid board 104 Mobile phone (electronic device)
A Electrical wiring area for optical elements (second area)
B Electrical wiring area for electronic components (first area)

Claims (4)

A substrate having an optical waveguide layer in which an optical waveguide through which light propagates is formed, and an electrical wiring board layer in which electrical wiring is formed and overlaps the optical waveguide layer;
A through hole penetrating the substrate;
An electrical connection part inserted into the through hole and electrically connected to the electrical wiring, and electrically connected to the outside;
A connecting device having: Two through holes are provided,
The said 1st area | region which has an electrical wiring is provided between the two said through-holes, The 2nd area | region in which the optical element which light-emits or receives light is mounted in the other part is provided. Connected device. The electrical connection portion includes an insertion portion that is inserted into the through hole, and a flange portion that projects outward from the insertion portion and does not enter the through hole.
The connection device according to claim 1, wherein a concave portion into which the flange portion is fitted is formed around the through hole.   A plurality of the connection devices according to any one of claims 1 to 3, wherein the connection device is connected to an electrical connection portion of one of the plurality of connection devices and the other connection device. The electronic device which has a connection member connected to the electrical connection part.

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