JP2010146149A - Electronic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problems of being unable to obtain an accurate roll condition because of the volume (thickness) of an IC chip and being unable to perform print operations easily and smoothly when a noncontact IC tag is mounted on a security tag, a barcode seal or the like. <P>SOLUTION: This electronic tag includes a noncontact IC tag comprising an IC chip and a sending and receiving antenna on one side of a base. The base includes a circuit pattern with a hollow portion formed by die cutting a metallic material. At least the IC chip of the noncontact IC tag is positioned to correspond to the hollow portion. The circuit pattern of the base is formed by printing the circuit pattern on the metallic material and then etching it. At least the IC chip of the noncontact IC tag is positioned to correspond to a recessed portion where a portion of the electronic tag is removed by melting. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention uses an electronic tag, particularly a non-contact IC tag (RFID) using an IC chip, and can manage the entire life cycle of a product along the distribution. The present invention relates to an electronic tag that can be combined with a security tag using a magnet or the like to have a function of preventing shoplifting and illegal take-out.

  In general, a non-contact IC tag has an antenna electrically connected to an IC chip in which individual information of each product is input in advance, and this non-contact IC tag is fixed to a base such as a tape-like paper, It is used by being affixed or embedded in the product in that state, and is made contactless by radio using mainly UHF waves including microwaves, enabling a communication distance of several meters, and from manufacturing It is used in all business categories such as logistics, sales, and recycling. In addition to logistics management of large quantities of products, history management and security management are also performed.

  On the other hand, the above-mentioned non-contact type IC tag is added to, for example, a security tag for preventing a thief using a magnet, a bar code seal, or the like, and product management and security are used together in one tag. These security tags and bar code seals are continuously produced in a state of being lined up by a long adhesive means in a production line, rolled, and cut into a single piece at the time of use and attached to a product.

Here, when a non-contact type IC tag is mounted on a security tag or the like continuously connected by an adhesive means, when it is wound around a roll, it has a volume (thickness) even though the IC chip is thin. Therefore, the roll state rises due to the presence of the IC chip and does not become bulky and dense, and the volume (thickness) of this IC chip is also obstructive when printing on the tag. It will be difficult to perform difficult work.
Regarding the invention of the present application, the applicant investigated prior technical documents, but could not find any documents that seemed to be related to the invention of the present application and to be similar.

  The problem to be solved by the present invention is that when a non-contact IC tag is conventionally mounted on a security tag, a bar code seal or the like, a precise roll state cannot be obtained depending on the volume (thickness) of the IC chip. In addition, printing cannot be performed easily and smoothly.

  In order to solve the above-described problems, an electronic tag according to the present invention includes a contactless IC tag including an IC chip and a transmission / reception antenna on one surface of a base material. The base material is made of a metal material. A circuit pattern having a hollow portion formed by die cutting is used, and at least an IC chip of the non-contact type IC tag described above is arranged corresponding to the hollow portion.

  The electronic tag according to the present invention is an electronic tag comprising a non-contact IC tag composed of an IC chip and a transmission / reception antenna on one surface of the base material. The base material is etched after a circuit pattern is printed on a metal material. In this case, at least the IC chip of the non-contact type IC tag is arranged corresponding to the recessed portion removed by melting.

Further, the above-described IC chip of the electronic tag according to the present invention is a rectangular parallelepiped whose individual identification information has only a ROM function, has a size of 0.5 mm ² or less and a thickness of 60 μm or less. The non-contact type IC tag having the above-mentioned characteristics is characterized in that the operating frequency is 400 MHz or more, and the metal material of the base material described above is aluminum.

  The electronic tag according to the present invention is configured as described above. Therefore, even if the thickness of the IC chip assumed in the practice of the present invention is 60 μm or less, it corresponds to a hollow part that is punched and formed by die cutting or a recess that is melted and formed by etching. In other words, the IC chip is not obstructed at the time of the entire roll or printing, and high-precision production and processing are performed.

  This was realized by configuring as illustrated in the drawings and described in the examples.

  Next, a preferred first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an electronic tag according to a first embodiment of the present invention, FIG. 2 is a sectional view of the main part, and FIG. 3 is a view showing a production line state.

  In these drawings, reference numeral 1 denotes a circuit pattern by die cutting in which aluminum, in particular, aluminum foil is punched by using a blade mold, and this circuit pattern 1 functions as a security tag by a radio wave system. Reference numeral 2 denotes a window hole punched by the above-described blade mold, that is, a hollow portion.

  In the figure, 3 indicates a non-contact type IC tag, 4 indicates an IC chip, and 5 indicates an antenna connected to the IC chip 4.

  This non-contact type IC tag 3 is arranged so that the end of the antenna 5 is placed over the circuit pattern 1 and the IC chip 4 is present in the window hole 2 portion, and the top surface of the IC chip 4 is flush with the circuit pattern 1. Since it is in a state, the IC chip 4 does not protrude from the overall configuration.

  The circuit patterns (security tags) 1, 1... Are produced as a series of continuous structures by means of adhesive means (adhesive tape) 6 as shown in FIG. This prevents the volume (thickness) of the sheet from interfering with the dense state and prevents the IC chip 4 from being adversely affected when printing, so that a smooth and accurate printing operation can be performed. it can.

Further, here, the IC chip 4 has individual information only for the ROM function, has a size of 0.5 mm ² or less, specifically 40 μm in length and width, and 60 μm in thickness, and has 128-bit read-only data. It is recorded and shipped in advance at the manufacturing stage. That is, the non-contact type IC tag 3 has only a wireless communication function and a ROM function by attaching the antenna 5, and has only a function of notifying its own ID number in appearance.

  The IC chip 4 in this embodiment is assumed to use a muchip (trade name) developed by Hitachi, Ltd., and this mu chip (trade name) has the functions described above. Therefore, the ID number of the IC chip 4 and other specific data are stored in association with each other on the server, and when the ID number of the IC chip 4 is read by the reader of the terminal, the other number is transmitted via the server. The data will be confirmed. The contents can be sequentially confirmed in each situation such as product production, distribution, sales, and recycling.

  Further, the antenna 5 of the non-contact type IC tag 3 in this embodiment is made of aluminum, copper or an alloy thereof. In this embodiment, the use of aluminum foil is also considered. Aluminum and copper are suitable as a material for the antenna 5 because the material cost is low, processability such as etching and die cutting is good, and good characteristics are obtained.

  Furthermore, the non-contact type IC tag 3 used in this embodiment is a wireless system using a microwave of 400 MHz or higher, particularly a microwave of 2.45 GHz, and a non-contact type IC tag using a microwave of 400 MHz or higher. 3 uses a dipole antenna having a rod-like shape as the antenna 5 to obtain good communication characteristics, and the overall shape of the non-contact IC tag 3 can be reduced.

  Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a plan view showing an electronic tag as a second embodiment of the present invention, FIG. 5 is a cross-sectional view of the main part, and FIG. 6 is a view showing a production line.

  In these drawings, reference numeral 7 denotes a security tag by etching in which an unnecessary portion is melted after a circuit pattern 8 is printed on aluminum, particularly aluminum foil, and a recessed portion 9 is formed in the melted portion of the aluminum. Will be. In the second embodiment, the antenna 5 of the non-contact type IC tag 3 described above is hung on the raised circuit pattern 8 and the IC chip 4 is arranged in the recessed portion. The surface of the circuit pattern 8 is flush with the surface.

  As shown in FIG. 6, the security tag 7 by this etching is produced in a series of 25 μm-thick PE film 10 as an adhesive means, but the IC chip 4 is housed in the recess 9 to roll it. Therefore, it does not get in the way, and even if it is printed, it can perform a smooth and sophisticated work.

  Further, in both the second embodiment and the first embodiment, the surface of the non-contact IC tag 3 can be covered with a cover tape in order to prevent the positional deviation.

  The electronic tag according to the present invention is configured as described above. In addition to those shown as examples, a security tag using a magnet such as EM or AM, a security tag using a self-sound type, a bar code seal, etc. It is possible to apply and implement the above. In addition, the electronic tag described in the embodiment, or even a non-contact IC tag, can be attached not only to a product but also to the back or side of an existing tag or label. A through hole can be formed and suspended. Furthermore, it is also possible to incorporate amorphous, particularly non-contact IC tags, at least IC chips into wires used in EM and AM tags, labels, and magnet type security tags.

  In addition to books, CDs, DVDs, etc., the electronic tag according to the present invention can be managed individually in various fields such as apparel, medicines, cosmetics, foods, etc., and serial numbers such as livestock, seafood, stock certificates, passports, etc. It can be used widely for management.

It is a top view which shows the electronic tag which concerns on the 1st Example which implemented this invention. It is principal part sectional drawing. It is a figure which shows a production line state. It is a top view which shows the electronic tag as 2nd Example of this invention. It is principal part sectional drawing. It is a figure which shows a production line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit pattern 2 Window part 3 Non-contact type IC tag 4 IC chip 5 Antenna 6 Adhering means 7 Security tag by etching 8 Circuit pattern 9 Recessed part 10 PE film

Claims (4)

  In an electronic tag including a non-contact IC tag including an IC chip and a transmission / reception antenna on one surface of the base material, the base material is a circuit pattern having a hollow portion formed by die-cutting a metal material. An electronic tag, wherein at least an IC chip of a non-contact type IC tag is arranged corresponding to the hollow portion.   In an electronic tag having a non-contact IC tag composed of an IC chip and a transmission / reception antenna on one surface of the base material, the base material is a circuit pattern formed by printing a circuit pattern on a metal material and then etching it, An electronic tag, wherein at least the IC chip of the non-contact type IC tag is disposed corresponding to the recessed portion removed by melting. The above-mentioned IC chip is a rectangular parallelepiped whose individual identification information has only a ROM function, a size of 0.5 mm ² or less, and a thickness of 60 μm or less. Operation of a non-contact IC tag having this IC chip The electronic tag according to claim 1 or 2, wherein the frequency is 400 MHz or more.   The electronic tag according to claim 1, wherein the metal material of the base material is aluminum.

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