JP2010144362A - Heat insulating material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fibrous insulation material which makes an environmental load light, and has excellent mildewproof properties, great safety for a human body and excellent durability. <P>SOLUTION: This heat insulating material is characterized in that; a fiber accumulation is formed of matrix fibers and binder fibers; portions among the matrix fibers are partially bonded to each other with the binder fibers; and a mildewproofing agent adheres to 1-10 wt.% of the fiber accumulation. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat insulating material suitable for homes and buildings.

  Conventionally, heat insulating materials have been used for buildings such as houses for the purpose of energy saving.

  The most widespread inorganic fiber heat insulating material is obtained by applying a phenol resin or the like to a cotton-like inorganic fiber (glass fiber or the like) by a spray method or an impregnation method, and hardening it into a mat shape. As a construction method, a method (filling insulation method) is widely used in which this is filled between frames of a house or a building composed of rafters, pillars, studs, beams, large pulls, girders, large pulls, joists, etc. .

However, inorganic fibers such as glass wool can be irritating to the skin when touching human skin or cause skin damage such as allergic symptoms, which may cause health problems for construction workers and residents. It was. In order to solve this problem, there has been proposed a fiber heat insulating material in which a natural fiber such as a synthetic fiber of polyester fiber or wool is used as a matrix fiber instead of glass wool, and the fiber is fixed as a vaninder fiber with a heat-adhesive fiber (for example, , See Patent Document 1)
On the other hand, dew condensation is likely to occur in Japanese houses due to high temperatures and humidity during the summer, and due to temperature differences between the outside and the room during the winter. In particular, since the fiber-based heat insulating material has continuous voids between fibers and contains a large amount of air, moisture accumulates inside and promotes dew condensation. When dew condensation occurs inside the house, the condensed water adheres to the heat insulating material, thereby increasing the weight of the heat insulating material and causing the heat insulating material to sink, resulting in a decrease in the heat insulating performance of the house. When the heat insulation performance deteriorates, a vicious cycle occurs in which more and more condensation occurs. Furthermore, condensation and ticks were generated inside the house due to condensation, causing sick house syndrome and corrosion of the housing, which was a problem.

  Therefore, in order to solve the problem of dew condensation, fiber-based heat insulating materials containing highly hygroscopic fibers (see, for example, Patent Document 2) and fibers having moisture absorption / release properties such as wool and wood fibers have been proposed. However, although the effect of preventing dew condensation can be obtained by the humidity control effect, the problem of wrinkles on the fiber has not been solved because the moisture content of the fiber is increased.

On the other hand, the cellulose fiber heat insulating material which pulverized newspaper into cotton-like (for example, refer patent document 3) prevents dew condensation from the cellulose fiber which comprised the newspaper having moisture absorption / release property. Can do. In addition, it is said that antibacterial properties are high due to boric acid and borate compounds added in large quantities to stabilize the form. However, although boric acid and borate compounds are low in toxicity, they are harmful to the human body, so there is a possibility that health damage may occur and there is a problem.
JP 2002-115159 A JP 2002-228086 A Japanese Patent No. 3982935

  In view of the problems of the prior art, the present invention provides a fiber-based heat insulating material that has excellent antifungal properties, has a low environmental load, is highly safe to the human body, and is excellent in durability. It is in.

In order to solve this problem, the present invention employs the following configuration. That is,
(1) A fiber assembly comprising a matrix fiber and a binder fiber, wherein the matrix fiber is bonded to a part between the fibers by the binder fiber, and the antifungal agent is 1 to 10% by weight of the fiber assembly. Thermal insulation characterized by being adhered within the range.

  (2) The heat insulating material according to (1), wherein at least a part of the matrix fiber is a fiber having moisture absorption / release properties.

  (3) The matrix fiber is a short fiber composed of at least one of a polyester fiber, a polyamide fiber, a polyolefin fiber, or a natural fiber, according to any one of (1) to (2), Insulation material.

  (4) The antifungal agent is quaternary ammonium salt, benzimidazole derivative, pyridine derivative, chlorobenzene derivative, isothiazolone derivative, N-haloalkylthio derivative, nitrile compound, organic iodine compound, chitosan derivative, chitin derivative, isothiocyanic acid Allyl derivative, zeolite, apatite, antibacterial glass, silica alumina magnesium, copper sulfide, glycoxylate derivative, hinokitiol, quinone derivative, catechin, zinc pyrithione, titanium oxide, mugwort extract, aloe extract, perilla leaf extract, dokudami, licorice extract, It consists of at least 1 sort (s) chosen from silver zirconium phosphate, lysozyme, polylysine, amide glycoxide, protamine, propolis, hiba oil, and a natural product extract. Thermal insulation material according to any one.

  (5) The heat insulating material according to any one of (1) to (4), wherein the antifungal agent is attached to the heat insulating material with a binder resin.

  (6) The heat insulating material according to any one of (1) to (5), wherein the antifungal agent is attached to at least a part of the matrix fiber.

  According to the present invention, it is a fiber aggregate composed of matrix fibers and binder fibers, wherein the matrix fibers are bonded to each other between the fibers by the binder fibers, and the antifungal agent is 1 to 10 weight of the fiber aggregate. % Heat insulating material characterized by being adhered within the range, having excellent antifungal properties, low environmental impact, high safety for human body, and excellent durability Furthermore, even if moisture enters the interior of the house and the moisture content of the heat insulating material increases, soot can be prevented over a long period of time.

  Hereinafter, modes for carrying out the present invention will be described.

  The heat insulating material of the present invention is preferably composed of a fiber assembly obtained by producing a card web by opening and mixing matrix fibers and binder fibers and thermoforming them. The fiber aggregate obtained by this manufacturing method can adjust not only the heat insulation performance but also the thickness and elasticity by the combination of the type, fineness and density of the fibers.

  Examples of matrix fibers include polyester fibers (polyethylene terephthalate, polybutylene terephthalate, polylactic acid, etc.), polyamide fibers (nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, nylon 510, etc.), polyphenylene sulfite fibers, Polyolefin fiber (polyethylene, polypropylene, etc.), polyacetal fiber, acrylic fiber, modacrylic fiber, aramid fiber, polyimide fiber, polyether fiber, polystyrene fiber, polycarbonate fiber, polyesteramide fiber, polyvinyl chloride fiber, polyetherester fiber, polyacetic acid Vinyl fiber, polyvinyl butyral fiber, polyvinylidene fluoride fiber, ethylene-vinyl acetate copolymer fiber, fluoroacrylate resin fiber, styrene Synthetic fibers such as kryl copolymer fiber, fluororesin fiber, aramid fiber, carbon fiber, regenerated fiber such as rayon, regenerated cellulose fiber (cupra, tencel, lyocell, etc.), wood pulp, bagasse, wheat straw, reed, papyrus, bamboo Natural fibers such as pulp, cotton, kenaf, roselle, Asa, flax, ramie, jute, hemp, sisal, Manila, palm, banana and wool can be used. These may be used alone or in combination of two or more.

  The thickness of the matrix fiber is preferably one having an average fiber diameter of 1 to 150 μm in view of flexibility, elasticity, strength, and dispersibility (uniformity when formed into a card web). More preferably, it is 2-70 micrometers. One type of fiber may be used, but two or more types of fibers having different thicknesses may be mixed. The average fiber length of the matrix fibers is 5 to 100 mm, more preferably 10 to 90 mm.

  Moreover, it is preferable that the matrix fiber used by this invention has a crimp. By having crimps, the fibers are entangled by opening and carding, and a uniform fiber molding can be obtained. Since fine fibers are uniformly dispersed during the molding process and are closely entangled with each other, fine voids can be formed inside the heat insulating material, so that excellent heat insulating performance can be obtained. In addition, specifically as heat insulation performance, it is preferable that thermal conductivity is 0.050 W / m * K or less. If the thermal conductivity is 0.050 W / m · K or less, it is possible to achieve high energy-saving performance (next-generation energy-saving standards of the Energy-Saving Law) in general-purpose houses in Japan.

  However, when the fiber diameter of the matrix fiber is less than 1 μm, the fiber diameter is thin and the rigidity and strength are not sufficient, so that the fiber aggregate is deformed by its own weight, and the form as a heat insulating material cannot be maintained. In addition, when the fiber diameter exceeds 150 μm, the fiber diameter is too thick, so that it cannot be uniformly dispersed with other fibers and binder fibers in the matrix fiber during the fiber assembly molding process, and sufficient heat insulation performance is obtained. It becomes difficult to make fine voids. Moreover, when the fiber length is less than 5 mm or more than 100 mm, it is difficult to uniformly disperse with other fibers or binder fibers in the matrix fiber, which is not preferable.

  The binder fiber of the present invention is preferably composed of a fiber having a component having a melting point lower than that of the matrix fiber. A web in which matrix fibers and binder fibers are mixed is heat-treated to melt the low melting point component, and the matrix fibers can be bonded and bonded together by fusing to obtain a fiber aggregate. The low melting point component is preferably a low melting point component that is lower by 30 ° C. or more than the melting point of the matrix fiber. If the difference between the melting points of the matrix fiber and the binder fiber is less than 30 ° C., at least part of the matrix fiber may be softened or melted by heat during processing, and the fiber aggregate is deformed during processing. It becomes easy and it becomes difficult to process the dimensions uniformly.

  The binder fiber may be composed of only a component having a melting point lower than that of a matrix fiber selected from aliphatic polyester resins such as polylactic acid and polyolefin resins such as polyethylene. However, a side-by-side structure or core with a high melting point component may be used. A sheath structure and a blended fiber are preferable. Of these, the core-sheath composite fiber in which the high melting point component is the core and the low melting point component is disposed in the sheath is optimal. The core-sheath composite fiber maintains the structure of the fiber without melting the core part even if the sheath part melts due to heat during molding. In addition, it is possible to obtain a fiber molded body that is not easily deformed at the time of manufacture or after manufacture and has excellent shape stability. Examples of the core-sheath composite yarn include polyester and homopolyester, polyolefin and polyester, and polyethylene and polypropylene.

  The binder fiber preferably has an average fiber diameter of 1 to 150 μm in view of flexibility, elasticity, strength, and dispersibility. More preferably, the average fiber length is 2 to 70 μm, and the average fiber length is 5 to 100 mm, more preferably 10 to 90 mm.

  Moreover, it is preferable that the binder fiber used by this invention has a crimp like a matrix fiber.

  The binder fiber used in the present invention is preferably 5% by weight or more and 90% by weight or less of the total weight of the fiber aggregate from the viewpoint of workability.

The density of the fiber assembly of the present invention is 10 to 300 kg / m ³ , more preferably 20 to 100 kg / m ³ . If the density of the fiber aggregate is less than 10 kg / m ³ , the fiber density is low, so that fine internal voids cannot be formed, and sufficient heat insulation performance cannot be obtained. On the other hand, if it exceeds 300 kg / m ³ , the density of the fibers is too high, so that there are no internal voids and heat insulation performance cannot be obtained.

  The thickness of the heat insulating material of the present invention can be set to a required thickness with respect to the required heat insulating performance (thermal resistance) of the house.

  It is preferable that at least a part of the matrix fiber of the heat insulating material of the present invention is a fiber having hygroscopic property. By having moisture absorption / release properties, it is possible to suppress an increase in humidity inside the house by absorbing moisture that has entered the inside of the house, and to prevent dew condensation. Moreover, when the inside of a house dries, by releasing the absorbed moisture, it is possible to prevent condensation repeatedly in the long term.

  Although it does not specifically limit as a fiber which has moisture absorption / release property, For example, not only the natural fiber and the regenerated cellulose fiber which are generally said to have moisture absorption / release property, but the polyester said to have no moisture absorption / release property The fiber or polyethylene fiber may be a fiber that has been provided with moisture absorption / release properties by coating the surface of the fiber or polyethylene fiber with a moisture absorption / release resin such as silica gel, or by surface modification by plasma treatment or graphing and polymerization.

  The moisture absorption / release rate of the heat insulating material of the present invention is preferably 1.5% by weight or more and 150% by weight or less. If the moisture absorption and desorption rate is 1.5% by weight or more, it is considered that the condensation inside the house can be prevented from the amount of use and the amount of condensation in the heat insulation material of general Japanese houses. However, if the moisture absorption and desorption rate exceeds 150% by weight, the weight of the heat insulating material when it absorbs moisture becomes too heavy, which is not preferable because the heat insulating material is deformed.

  Antifungal agents used in the present invention are quaternary ammonium salts, benzimidazole derivatives, pyridine derivatives, chlorobenzene derivatives, isothiazolone derivatives, N-haloalkylthio derivatives, nitriles, regardless of whether they are organic, inorganic or natural product extracts. Compound, organic iodine compound, chitosan derivative, chitin derivative, allyl isothiocyanate derivative, zeolite, apatite, antibacterial glass, silica alumina magnesium, copper sulfide, glycoxylate derivative, hinokitiol, quinone derivative, catechin, zinc pyrithione, titanium oxide, mugwort extract , Less selected from aloe extract, perilla leaf extract, dokudami, licorice extract, silver zirconium phosphate, lysozyme, polylysine, amidoglycoxide, protamine, propolis, hiba oil and other natural product extracts It is preferably also made of one kind of antifungal agents. Although it does not specifically limit as a quaternary ammonium salt, N, N-dimethyl-N '-(fluoro dichloromethylthio) -N'-phenylsulfamide, tetramethyl thiuram disulfide, etc. can be used preferably. The benzimidazole derivative is not particularly limited, but 2- (4-thiazoyl) -benzimidazole, methyl-benzimidazole carbide and the like can be preferably used. The N-haloalkylthio derivative is not particularly limited, but N- (trichloromethylthio) -4-cyclohexyne, 1,2-dicarboximide, N- (fluorodichloromethylthio) -phthalimide and the like can be preferably used. The pyridine derivative is not particularly limited, but 2,3,5,6-tetrachloro-4- (methylsulfonyl) pyridine and the like can be preferably used. Moreover, although it does not specifically limit as a chlorobenzene derivative, Chloroxylenol, 2,4,4,4'-trichloro-2'-hydroxydiphenyl ether etc. can be used preferably. The isothiazolone derivatives are not particularly limited, but 5-chloro-2-methyl-4-isothiazolone-3-one, 2-methyl-4-isothiazolone-3-one, 2-octyl-4-isothiazolone-3-one Etc. can be preferably used. Further, the nitrile derivative is not particularly limited, but 2,4,5,6-tetrachloroisophthalnitrile and the like can be preferably used. The organic iodine compound is not particularly limited, but diiodomethyl-para-trisulfone, 3-iodo-2-propargyl butyl carbamate, propargyl iodide derivatives, and the like can be preferably used. Moreover, although it does not specifically limit as a zeolite, Silver zeolite, copper zeolite, zinc zeolite, etc. can be used preferably.

  Considering the following processing method, the form of such an antifungal agent is 0.01 to 5 μm, more preferably 0.01 to 2 μm, in a colloidal state, considering dispersibility in water and the like. It is preferable that they are granulated.

  The amount of the antifungal agent attached to the heat insulating material of the present invention is 1 to 10% by weight, preferably 2 to 3% by weight with respect to the fiber assembly, in consideration of safety to the human body. is important. If it is less than 1% by weight, a sufficient effect cannot be obtained, and if it exceeds 10% by weight, there is a concern about the influence on the environment and the human body, and it is already sufficient as an antifungal effect and is only excessively adhered. There is no need.

  The method of adhering such an antifungal agent to a heat insulating material includes a spray method, an exhaust method, a pad method, a coating method, a polymer binder method, a method for applying a cyclodextrin drug inclusion, and a poorly soluble phosphate drug inclusion A method such as an applying method using a microcapsule, a method using a microcapsule, or a high-temperature / high-pressure steam treatment may be employed. Furthermore, when the anti-mold durability is required, an application method using a binder resin is preferable. For example, an application method in which a dispersion of an antifungal agent and a dispersion of a binder resin are mixed and adhered to a fiber assembly is preferable. The binder resin is not particularly limited, but in consideration of durability, it is preferable to use a polymer binder resin such as acrylic, polyurethane, silicone, fluorine, melamine, or glyoxal.

  Since such an antifungal agent can obtain an antifungal effect as long as it adheres to a part of the fibers forming the heat insulating material of the present invention, the method for applying an antifungal agent of the present invention uses a fiber assembly. Not only the method of giving to the whole heat insulating material after shaping | molding but the method of providing only to a matrix fiber may be sufficient. For example, an antifungal agent can be applied to all or part of the matrix fiber before opening using the above method or binder.

  Hereinafter, although an example is given and the present invention is explained, the present invention is not necessarily limited to this. The measurement methods for various characteristics used in this example and the criteria for comprehensive evaluation were as follows.

[Measurement method of characteristics]
Among the following measurement methods, unless otherwise specified, sample preparation and measurement were performed in the standard state of JIS L 0150 (20 ± 2 ° C., relative humidity 65 ± 4%).

(1) Average fiber diameter It measured according to JIS A 9504: 2001 6.7.
The fiber diameter is about 20g from each of the three heat insulating materials, and 20 fibers are taken from each, and the outer diameter (diameter of circumscribed circle) is measured with a magnifying glass using a scanning electron microscope. Take a value (n = 60). The fiber diameter is measured with an accuracy of 0.1 μm.

(2) Average fiber length It measured according to JIS A 1015: 1999 8.4.1.

  Weigh 800 mg of sample, create a staple diagram, divide the illustrated staple diagram into 50 fiber length groups, measure the boundary of each segment and the fiber length at both ends, and find 49 boundaries on the average of fiber lengths at both ends The fiber length was added and divided by 50, the average fiber length (mm) was calculated, and the average value was taken twice.

(3) Density The density was measured according to JIS A 9504: 2001 6.4.2.3.

Density is obtained by the following equation by determining the mass and volume of the sample. The density was determined by calculating the average value of the number of tests 3 times, and the volume and mass were similarly measured and calculated 3 times.
p = m / V
Here, p: density (kg / m ³ )
m: mass (kg)
V: Volume (m ³ )
The volume can be obtained from the following equation.
V = t × w × L
Where t: thickness (mm)
w: Width (mm)
L: Length (mm).

  The thickness at the time of density measurement is measured by the following method. First, a 450 × 450 mm test piece is placed on a hard flat plate, and a rigid load plate with a mass of 100 g and 150 × 150 mm is used inside 100 mm or more from the end of the test piece, and through a hole formed in the center of the load plate. Insert a needle-like object and measure after 1 minute or more has passed and the load plate has stopped sinking. Insert the needle-shaped one after placing the load plate. In the case of a compressed package, the sample is held on both sides in the width direction by hand, shaken well so as to wave in the horizontal direction, placed on a hard plate, and measured after 4 hours by the above method.

  The mass was measured to an accuracy of 0.1 g with an electronic balance after leaving the test sample used for thickness measurement in a standard state of a temperature of 20 ° C. and a humidity of 65% RH for 24 hours.

(4) Thickness Measured according to JIS L 1913.

Using a compression elasticity tester (manufactured by Nakayama Electronics Co., Ltd.), pressurize 0.5 kPa (5 gf / cm ² ) and wait about 10 seconds for the thickness to settle, The thickness was measured, and the average value of 5 locations was calculated.

(5) Melting point Using a Shimadzu differential scanning calorimeter DSC-60, manufactured by Shimadzu Corporation, a 2.0 mg sample was measured at a rate of temperature increase of 20 ° C / min, and the melting point was set to a temperature giving the extreme value of the obtained melting endotherm curve. (° C). The number of tests was 5, and the average value was calculated.

(6) Thermal conductivity It measured according to JIS A 1412-2: 1999 6.2.

  The thermal conductivity was measured using a thermal conductivity measuring device HC-074 manufactured by Eihiro Seiki Co., Ltd. A sample is prepared with a heat insulating material having a width of 200 mm, a length of 200 mm, and a thickness of 50 mm. As the standard sample, expanded polystyrene was used. The sample is allowed to stand for 24 hours in a standard condition of a temperature of 20 ° C. and a humidity of 65% RH, and then the sample is put into a measuring machine, and the temperature difference of the plate is 24 ° C. and the average temperature is 25 ° C. Was measured under the condition of 13 ° C.), and the thermal conductivity (W / m · K) was calculated from the average value of three test times.

(7) Moisture absorption / release rate Measured according to JIS A 9523: 2001 6.2.

Hygroscopicity, heat insulation material with a mass of 100 g is put in a mesh sieve with a nominal opening 180 (inner diameter 200 mm, depth 100 mm) specified in JIS Z 8801-1: 2002, and dried at a temperature of 50 ° C. ± 2 ° C. for 6 hours. Next, humidity is adjusted at a temperature of 50 ° C. ± 2 ° C. and a relative humidity of 50 ± 5 ° C. for 24 hours, and the mass at that time is measured with an accuracy of 0.01 g (W0). In addition, it leaves still so that it can also absorb moisture from the lower surface of a heat insulating material. Next, the temperature is increased to 90 ± 5% with the temperature kept at 50 ± 2 ° C., and the mass after 24 hours is measured (W1). The moisture absorption rate is obtained by the following formula. The number of test samples was 3, and the average value was obtained. Moreover, determination was performed as follows.
H = {(W1-W0) / W0} × 100
Where H: moisture absorption / release rate (wt%)
W0: initial mass (g)
W1: Mass after 24 hours (g)
(8) Amount of antifungal agent attached When attaching an antifungal agent to the fiber aggregate The basis weight (mass per unit area) of the fiber aggregate before and after applying the antifungal agent was measured, and the adhesion amount (%) was determined by the following equation.
mb = (ms2-ms1) / ms1
Here, mb: adhesion amount of antifungal agent (%)
ms1: Mass per unit area (g / m ² ) of the fiber aggregate before attaching the antifungal agent
Ss2: Mass per unit area (g / m ² ) of the fiber aggregate after the antifungal agent is adhered
Here, the basis weight of the fiber aggregate is measured by the method described in JIS L 1913: 1998 6.2.

Three test pieces of 300 mm × 300 mm were collected from the sample using a steel ruler and a razor blade. The mass of the test piece in the standard state was measured, the mass per unit area was determined by the following formula, and the average value was calculated.
ms = m / S
Where ms: mass per unit area (g / m ² )
m: Mass of the test piece (g)
S: Area of the test piece (m ² )
B. In the case where the antifungal agent is adhered only to the matrix fiber The weight of the matrix fiber before and after the antifungal agent was adhered was measured, and the adhesion amount (%) was determined by the following formula.
mc = (mf2-mf1) / ms1
Where mc is the amount of the antifungal agent attached (%)
mf1: Mass of the matrix fiber (g) before attaching the antifungal agent
Sf2: Mass (g) of the matrix fiber after the antifungal agent is attached
(9) Wrinkle resistance test The test method was based on the test method of JIS Z-2911.

  The test method was carried out by applying the mixed cells of the following test strains to a potato-glucose-agar medium (petri dish 9 cm × 9 cm), pasting each sample (30 mm × 30 mm), and culturing at 28 ° C. for 28 days.

  The types of straw used are as follows.

Aspergillus niger, Aspergillus tereus, Aureobasidium pullulans, Penicillium funiculosum, Ketomium globosum, Penicillium cyttrium, Milotesium percaria The antifungal performance was determined based on the following resistance test results.
0: No cocoon growth 1: Kite growth is less than 25% of the sample surface 2: Kite growth is 25% or more and less than 50% of the sample surface 3: Kite growth is 50% or more and less than 75% of the sample surface 4: The growth of cocoons is 75% or more of the sample surface [Example 1]
As a matrix fiber, a short polyethylene terephthalate fiber having an average fiber diameter of 25 μm (fineness: 6.6 dtex) and an average fiber length of 51 mm, and as a binder fiber, a short polyethylene terephthalate having an average fiber length of 51 mm and an average fiber diameter of 16 μm (fineness: 2.2 dtex). A core-sheath composite fiber (sheath component: low melting point polyethylene terephthalate (melting point 110 ° C.), core component: homopolyethylene terephthalate (melting point 255 ° C.)) was prepared.

First, matrix fibers (weight ratio 80%) and binder fibers (weight ratio 20%) were mixed and opened, and a uniform web having a width of 50 cm and a length of 150 cm was formed by a card machine. Next, using a dispersion of 2- (4-thiazoyl) -benzimidazole as an antifungal agent on the web, the dispersion was added to the web so that the amount of the antifungal agent after drying was 2% by weight. Then, the binder fiber was melted by a hot air dryer (set temperature: 150 ° C.) and molded to a density of 20 kg / m ³ and a thickness of 50 mm to obtain a fiber aggregate.

  The obtained heat insulating material had high flaw prevention properties because no wrinkles were observed even after 28 days in the fouling resistance test.

[Example 2]
As a matrix fiber, a short polyethylene terephthalate fiber having an average fiber diameter of 25 μm (fineness: 6.6 dtex) and an average fiber length of 51 mm, and as a binder fiber, a short polyethylene terephthalate having an average fiber length of 51 mm and an average fiber diameter of 16 μm (fineness: 2.2 dtex). A core-sheath composite fiber (sheath component: low melting point polyethylene terephthalate (melting point 110 ° C.), core component: homopolyethylene terephthalate (melting point 255 ° C.)) was prepared.

First, a dispersion of 2- (4-thiazoyl) -benzimidazole was sprayed on the matrix fiber as an antifungal agent so that the adhesion amount was 5% by weight, and then dried at 130 ° C. for 1 minute. . Next, the matrix fiber (weight ratio 80%) and the binder fiber (weight ratio 20%) to which the antifungal agent is adhered are mixed and opened, and a uniform 50 cm wide and 150 cm long web is formed by a card machine. . Next, the binder fiber was melted by a hot air dryer (set temperature: 150 ° C.) and molded to a density of 20 kg / m ³ and a thickness of 50 mm to obtain a fiber assembly.

  The obtained heat insulating material had high flaw prevention properties because no wrinkles were observed even after 28 days in the fouling resistance test.

[Example 3]
As a matrix fiber, a kenaf bast fiber having an average fiber diameter of 60 μm (measured after opening) and an average fiber length of 75 mm is used, and a polyethylene terephthalate short having an average fiber length of 51 mm and an average fiber diameter of 16 μm (fineness of 2.2 dtex) is used as a binder fiber. A core-sheath composite fiber (sheath component: low melting point polyethylene terephthalate (melting point 110 ° C.), core component: homopolyethylene terephthalate (melting point 255 ° C.)) was prepared.

First, matrix fibers (weight ratio 80%) and binder fibers (weight ratio 20%) were mixed and opened, and a uniform web having a width of 50 cm and a length of 150 cm was formed by a card machine. Next, using a dispersion of 2- (4-thiazoyl) -benzimidazole as an antifungal agent on the web, the web was sprayed so that the amount of adhesion was 2% by weight, and then a hot air dryer (set temperature) 150 ° C.), the binder fiber was melted and molded to a density of 20 kg / m ³ and a thickness of 50 mm to obtain a fiber assembly.

  The obtained heat insulating material had high flaw prevention properties because no wrinkles were observed even after 28 days in the fouling resistance test.

[Example 4]
As a matrix fiber, a kenaf bast fiber having an average fiber diameter of 60 μm (measured after opening) and an average fiber length of 75 mm is used, and a polyethylene terephthalate short having an average fiber length of 51 mm and an average fiber diameter of 16 μm (fineness of 2.2 dtex) is used as a binder fiber. A core-sheath composite fiber (sheath component: low melting point polyethylene terephthalate (melting point 110 ° C.), core component: homopolyethylene terephthalate (melting point 255 ° C.)) was prepared.

First, a dispersion of 2- (4-thiazoyl) -benzimidazole was sprayed on the matrix fiber as an antifungal agent so that the adhesion amount was 5% by weight, and then dried at 130 ° C. for 1 minute. . Next, the matrix fiber (weight ratio 80%) and the binder fiber (weight ratio 20%) to which the antifungal agent is adhered are mixed and opened, and a uniform 50 cm wide and 150 cm long web is formed by a card machine. . Next, the binder fiber was melted by a hot air dryer (set temperature: 150 ° C.) and molded to a density of 20 kg / m ³ and a thickness of 50 mm to obtain a fiber assembly.

  The obtained heat insulating material had high flaw prevention properties because no wrinkles were observed even after 28 days in the fouling resistance test.

[Comparative Examples 1 and 3]
A fiber assembly was obtained in the same manner as in Example 1. However, the antifungal agent was adhered to the fiber assembly so that the adhesion amount was 0.5% by weight.

  The obtained heat insulating material was wrinkled within 14 days in the antifungal resistance test and did not have sufficient antifungal properties.

[Comparative Examples 2 and 4]
A fiber assembly was obtained in the same manner as in Example 1. However, the antifungal agent was adhered to the matrix fiber so that the adhesion amount was 0.5% by weight.

  The obtained heat insulating material was wrinkled within 7 days in the antifungal resistance test and did not have sufficient antifungal properties.

  The results of Examples 1 to 4 and Comparative Examples 1 to 4 are summarized in Table 1.

  The heat insulating material of the present invention has excellent heat insulating properties, is easy to construct, has excellent fouling resistance even in long-term use, has a low environmental load, and is highly safe for the human body. It is useful as a heat insulating material for buildings.

Claims (6)

  A fiber assembly comprising a matrix fiber and a binder fiber, wherein the matrix fiber is bonded to a part of the fiber by the binder fiber, and the antifungal agent is within a range of 1 to 10% by weight of the fiber assembly. A heat insulating material characterized by being attached.   The heat insulating material according to claim 1, wherein at least a part of the matrix fiber is a fiber having moisture absorption / release properties.   The heat insulating material according to claim 1, wherein the matrix fiber is a short fiber made of at least one of a polyester fiber, a polyamide fiber, a polyolefin fiber, or a natural fiber.   The antifungal agent is quaternary ammonium salt, benzimidazole derivative, pyridine derivative, chlorobenzene derivative, isothiazolone derivative, N-haloalkylthio derivative, nitrile compound, organic iodine compound, chitosan derivative, chitin derivative, allyl isothiocyanate derivative, Zeolite, apatite, antibacterial glass, silica alumina magnesium, copper sulfide, glycoxylate derivative, hinokitiol, quinone derivative, catechin, zinc pyrithione, titanium oxide, mugwort extract, aloe extract, perilla leaf extract, dokudami, licorice extract, zirconium phosphate Any one of Claims 1-3 characterized by consisting of at least 1 sort (s) chosen from silver, a lysozyme, polylysine, an amide glycoxoxide, a protamine, a propolis, a hiba oil, and a natural product extract. Heat insulating material of the crab described.   The heat-insulating material according to any one of claims 1 to 4, wherein the anti-mold agent is attached on the heat-insulating material with a binder resin.   6. The heat insulating material according to claim 1, wherein the antifungal agent is attached to at least a part of the matrix fiber.