JP2010140845A - Luminescent panel, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a luminescent panel wherein the whole of the panel can be thinned while suppressing characteristic deterioration of a display element resulting from moisture infiltrating into a sealing space between substrates. <P>SOLUTION: This luminescent panel 100 includes a substrate 10 having a pixel array 12 in which a plurality of display elements are arranged, and a sealing substrate 20 having a recessed part 21 in a region corresponding to the pixel array, and the substrate 10 is bonded to the sealing substrate 20 with a prescribed clearance retained by a sealing material 30 containing a spherical spacer 32 abutting on both of the bottom face 21a of the recessed part 21 of the sealing substrate 20 and the substrate 10. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting panel and a method for manufacturing the same, and more particularly, to a panel structure of a light emitting panel in which a plurality of display elements are arranged on a substrate, and a method for manufacturing the light emitting panel.

  In recent years, light-emitting element type light-emitting panels in which self-light-emitting elements such as organic electroluminescence elements (hereinafter abbreviated as “organic EL elements”) and light-emitting diodes (LEDs) are two-dimensionally arranged have become mobile phones, portable music players, It has come to be mounted on various electronic devices such as a television receiver.

  A display device including a light-emitting element type light-emitting panel has characteristics that a display response speed is higher than that of a known liquid crystal display device, viewing angle dependency is small, and a backlight or a light guide plate is not required. is doing. Therefore, it is expected as a next-generation display device. In such a display device, a display region in which a plurality of display elements are arranged is formed on one side of a transparent substrate such as a glass substrate. These display elements are sealed by a sealing substrate facing the substrate, and are protected from the influence of the external environment (particularly moisture intrusion).

  Here, an example of a panel structure including a substrate and a sealing substrate is described in Patent Document 1, for example. In the panel structure described in Patent Document 1, a substrate and a sealing substrate are bonded and fixed via a sealing material in a frame-like region that goes around a display region in which display elements are arranged. That is, the display area in which the display elements are arranged is sealed in a sealing space formed between the substrate and the sealing substrate. And in order to absorb the water | moisture content in this sealing space and to prevent the characteristic deterioration of a display element, the hygroscopic agent and the desiccant are provided in the space inside. In the display device described in Patent Document 1, a recess is formed in a sealing substrate in a region corresponding to the display region, and a desiccant is arranged in a sheet shape in the recess.

JP 2003-228302 A (page 3 to page 4, FIG. 2)

  In the light-emitting panel described in Patent Document 1 described above, a sealing space is provided between the substrate and the sealing substrate, and in particular, a recess for arranging a desiccant on the sealing substrate is provided. In addition, a spacer for defining a separation distance (joining distance) between the substrate and the sealing substrate is generally mixed in the sealing material that joins the substrate and the sealing substrate. Therefore, in such a panel structure, the thickness of the sealing substrate and the sealing material has a problem of hindering the thinning of the entire light emitting panel. In addition, since the separation distance between the substrate and the sealing substrate at the joint is relatively large, the amount of moisture that enters the sealing space from the outside via the sealing material increases, and moisture absorption of the desiccant and moisture absorbent When the capacity reaches the limit earlier than the design value, the deterioration of the characteristics of the display element proceeds to cause the generation of dark spots, resulting in a problem that the life of the display element and the light emitting panel is shortened. The panel structure disclosed in Patent Document 1 will be described in detail in an embodiment of the invention described later.

  In view of the above problems, the present invention provides a light-emitting panel capable of reducing the thickness of the entire panel while suppressing deterioration in the characteristics of the display element due to moisture entering the sealing space between the substrates, and the manufacture thereof. It aims to provide a method.

  The light-emitting panel according to claim 1 is a light-emitting panel in which a first substrate and a second substrate are bonded to face each other, and a plurality of display elements are arranged on one surface side of the first substrate. A concave portion in a region corresponding to the pixel array on a surface side of the second substrate facing the first substrate, and a bottom surface of the concave portion of the second substrate; The first substrate and the second substrate are bonded to each other with a predetermined separation distance by a sealing material including a spacer that is in contact with both the first substrate and the first substrate.

According to a second aspect of the present invention, in the light emitting panel according to the first aspect, the spacer of the sealing material is in the concave portion of the second substrate and on a peripheral portion of the second substrate. It is provided in an adjacent region.
According to a third aspect of the present invention, in the light emitting panel according to the second aspect, the sealing material includes a sealing resin and the spacer, and the peripheral portion of the second substrate is only the sealing resin. It is characterized by being bonded to the first substrate via

According to a fourth aspect of the present invention, in the light emitting panel according to any one of the first to third aspects, a thin film is formed in a region corresponding to the pixel array of the first substrate in the concave portion of the second substrate. It is characterized in that a hygroscopic agent is provided.
According to a fifth aspect of the present invention, in the light-emitting panel according to any one of the first to fourth aspects, the display element is an organic electroluminescence element.

  According to a sixth aspect of the present invention, there is provided a method for manufacturing a light emitting panel, wherein the first substrate and the second substrate are bonded to face each other, and the pixel array in which a plurality of display elements are arranged. In the concave portion of the second substrate having a concave portion in a region corresponding to the pixel array on the surface facing the first substrate, and on the peripheral portion of the second substrate. Applying a sealing material including a spacer in contact with both the bottom surface of the concave portion of the second substrate and the first substrate to an adjacent region; and the pixel array of the first substrate A step of bonding the second substrate so as to be included in the recess of the second substrate.

  According to a seventh aspect of the present invention, in the method for manufacturing a light-emitting panel according to the sixth aspect, prior to the step of bonding the first substrate and the second substrate, the concave portion of the second substrate is The method further includes the step of forming a thin-film hygroscopic agent in a region corresponding to the pixel array of the first substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the thickness of the whole panel can be made thin, suppressing the characteristic deterioration of the display element resulting from the water | moisture content permeating in the sealing space formed between the board | substrates of a light emission panel.

Hereinafter, a light emitting panel and a manufacturing method thereof according to the present invention will be described in detail with reference to embodiments.
(Light-emitting panel)
First, a light emitting panel according to the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram showing an embodiment of a light emitting panel according to the present invention. FIG. 1A is a plan view of the light emitting panel according to the present embodiment. In addition, FIG. 1B is an illustration of the light-emitting panel shown in FIG. 1A (for convenience, as a symbol corresponding to the Roman numeral “1” shown in FIG. 1). FIG. 6 is a diagram showing a cross-sectional structure along a line I) ”. FIG.1 (c) is principal part detail drawing which shows the junction part (A section shown in FIG.1 (b)) of the board | substrate and sealing substrate in the light emission panel which concerns on this embodiment. In addition, in the plan view shown in FIG. 1A, for the sake of convenience, hatching is shown for the sake of clarity of the frame-shaped protrusion and the vicinity region of the sealing substrate.

  FIG. 2 is a schematic view showing a substrate and a sealing substrate of the light emitting panel according to this embodiment. FIG. 2A is a plan view of the substrate according to the present embodiment. Moreover, FIG.2 (b) is the top view which looked at the sealing substrate which concerns on this embodiment from the board | substrate (joining surface) side. 2A and 2B, the pixel array on the substrate side, the vicinity region on the sealing substrate side, and the thin film hygroscopic agent are shown with hatching for the sake of convenience. .

  As shown in FIGS. 1A and 1B, a light emitting panel 100 according to the present embodiment has a transparent substrate (first substrate) 10 and a sealing substrate (second substrate) 20 facing each other. It is joined. The substrate 10 is made of a light-transmitting substrate material such as a glass substrate or an acrylic substrate. As shown in FIG. 2A, a display area 11 and a connection area 14 are provided on one surface side (front side of the paper) of the substrate 10. In the display area 11, a pixel array 12 in which a plurality of display elements (not shown) are two-dimensionally arranged is formed. As the display element, for example, an organic EL element is applied. An electrode for driving each display element is provided on the substrate 10 as a wiring layer 13 so as to extend outside the display region 11, and is connected to a connection terminal 15 disposed in a connection region 14 adjacent to the display region 11. ing. The connection terminal 15 electrically connects the light emitting panel 100 to a driver (drive circuit) not shown.

  As shown in FIGS. 1B and 2B, the sealing substrate 20 is provided with a recess 21 on the surface facing the substrate 10, and a thin film moisture absorbent 22 is provided therein. Here, the concave portion 21 is provided at a substantially central portion of the sealing substrate 20, and a frame-shaped protrusion 23 for bonding to the substrate 10 is provided at the peripheral portion of the sealing substrate 20. That is, the sealing substrate 20 is formed thin in the formation region of the recess 21 and thick in the formation region (peripheral portion) of the frame-like protrusion 23. As shown in FIG. 2B, the thin film moisture absorbent 22 is provided in the recess 21 of the sealing substrate 20 and in a region excluding the vicinity region 24 adjacent to the frame-shaped protrusion 23. The thin film moisture absorbent 22 is formed, for example, by applying a commercially available transparent thin film water rehydrating agent in a thin film shape. In addition, the region where the recess 21 is formed, more specifically, the region excluding the formation region of the frame-like protrusion 23 on the peripheral portion of the sealing substrate 20 and the vicinity region 24 thereof corresponds to the display region 11 provided on the substrate 10. In addition, the display area 11 (pixel array 12) is set to have a spread. That is, in a state where the substrate 10 and the sealing substrate 20 are joined, the display region 11 of the substrate 10 is included in the recess 21, more specifically, in the sealing space 25 formed by the sealing substrate 20. 20 is coated.

  In the light-emitting panel according to the present embodiment, as shown in FIG. 1C, the substrate 10 and the sealing substrate 20 are formed in a region where the frame-shaped protrusion 23 on the peripheral edge of the sealing substrate 20 is formed, and The frame-like protrusion 23 is joined via a sealing material (sealing material) 30 in a neighboring region 24 adjacent to the concave portion 21 side. In the sealing material 30, for example, a commercially available sealing resin 31 is mixed with an insulating spherical spacer 32. Specifically, as shown in FIG. 1C, in the vicinity region 24 adjacent to the frame-shaped protrusion 23 of the sealing substrate 20, the spherical spacer 32 mixed in the sealing resin 31 is formed in the recess 21. It is in contact with both the bottom surface 21a and the substrate 10 (or the wiring layer 13). Here, the spherical spacer 32 has a particle size equal to or larger than the depth of the concave portion 21 defined by the frame-shaped protrusion 23, for example. Thereby, the separation distance between the substrate 10 and the sealing substrate 20 is defined by the particle size of the spherical spacer 32. Further, the substrate 10 and the sealing substrate 20 are joined by the sealing resin 31 mixed with the spherical spacer 32. At this time, a minute gap corresponding to the difference between the particle size of the spherical spacer 32 and the depth of the recess 21 is formed between the bonding surface of the frame-shaped protrusion 23 and the substrate 10. This gap is set to about several μm, for example.

  On the other hand, in the region where the frame-shaped protrusion 23 of the sealing substrate 20 is formed, the frame-shaped protrusion of the sealing substrate 20 is interposed only through the sealing resin 31 of the sealing material 30 as shown in FIG. 23 and the substrate 10 are joined. Here, although described in detail in a method for manufacturing a light-emitting panel, which will be described later, a frame-shaped protrusion of the sealing substrate 20 is formed in the gap formed between the frame-shaped protrusion 23 of the sealing substrate 20 and the substrate 10. Of the sealing material 30 applied to the adjacent region 24 adjacent to the portion 23, the spherical spacer 32 having a particle diameter larger than the gap does not enter, and only the sealing resin 31 permeates by capillary action. Thereby, the frame-shaped protrusion 23 of the sealing substrate 20 and the substrate 10 are bonded via the sealing resin 31.

  According to the light emitting panel according to the present embodiment, the separation distance between the substrate 10 and the sealing substrate 20 is defined by the spherical spacer 32 that contacts both the bottom surface 21 a of the recess 21 of the sealing substrate 20 and the substrate 10. The frame-shaped protrusion 23 of the substrate 20 and the substrate 10 are joined only through the sealing resin 31 of the sealing material 30. That is, since the spherical spacer is not interposed between the frame-shaped protrusion 23 and the substrate 10, the substrate 10 and the sealing substrate 20 can be bonded sufficiently close to each other. Further, since the thin film moisture absorbent 22 provided in the recess 21 of the sealing substrate 20 can be formed thin, the depth of the recess 21 formed in the sealing substrate 20 can be reduced. Thereby, in the light emitting panel which concerns on this embodiment, while the plate | board thickness of the sealing substrate 20 can be made thin, the separation distance (joining distance) of the board | substrate 10 and the sealing substrate 20 can be narrowed.

  Therefore, according to the light emitting panel which concerns on this embodiment, the whole light emitting panel can be reduced in thickness. In addition, according to the light emitting panel according to the present embodiment, the sealing space is externally provided via the joint portion between the substrate 10 and the sealing substrate 20 (that is, the region where the frame-shaped protrusion 23 is formed and the vicinity region 24 thereof). Moisture entering the inside 25 can be greatly suppressed. Therefore, the characteristic deterioration of the organic EL element can be suppressed, the generation of dark spots can be prevented, and the life of the display element and the light emitting panel can be extended.

(Production method)
Next, the manufacturing method of the light emission panel which has the panel structure mentioned above is demonstrated.
FIG. 3 is a schematic view showing a method for manufacturing the light-emitting panel according to this embodiment. 3A to 3D are process cross-sectional views illustrating the manufacturing process of the light-emitting panel according to this embodiment. FIG. 3E is a detail view of a main part showing a bonding portion (B portion shown in FIG. 3D) between the substrate and the sealing substrate. Here, description will be made with reference to the schematic configuration of the light-emitting panel shown in FIGS.

  First, as shown in FIGS. 2A and 3A, the method for manufacturing a light emitting panel according to this embodiment is performed on one side of a substrate 10 made of a glass substrate, an acrylic substrate, or the like (see FIG. 3A). A display element such as an organic EL element and a wiring layer 13 to be an electrode of the display element are formed in the display region 11 on the upper surface side. In addition, a connection terminal connected to the end of the wiring layer 13 extending from the display region 11 is formed in a connection region adjacent to the display region 11.

  In a step different from the step of forming the pixel array 12 and the connection terminal 15 on the substrate 10, as shown in FIGS. 2B and 3B, one surface side of the sealing substrate 20 (FIG. 3B ) On the upper surface side), and a thin film hygroscopic agent 22 is applied to the bottom surface 21a. Specifically, for example, a groove is formed on one surface side of an alkali-free glass substrate having a thickness of 0.5 mm so as to leave a peripheral portion to be the frame-like protrusion 23 with a width of about 0.5 to 1 mm. A 50 μm recess 21 is formed. The sealing substrate 20 is cleaned with pure water, heated and dried, and then the surface of the sealing substrate is cleaned by UV ozone cleaning or the like.

  Next, in a glove box filled with nitrogen and having a moisture content of less than 1 ppm, a liquid hygroscopic agent is applied to a predetermined region in the recess 21 corresponding to the display region 11 (pixel array 12) of the substrate 10 with an inkjet dispenser. Then, a thin film is formed. Here, the application region of the hygroscopic agent is set on the bottom surface 21a of the recess 21 on the inner side of the vicinity region 24 adjacent to the frame-shaped protrusion 23 on the peripheral edge of the sealing substrate 20, as shown in FIG. Is done. As the hygroscopic agent, for example, OleDry (registered trademark), a transparent thin film water repellent for organic EL manufactured by Futaba Electronics Co., Ltd., can be favorably applied. Thereafter, the sealing substrate 20 is heated at 180 ° C. for 10 minutes to remove the solvent contained in the hygroscopic agent and activate the hygroscopic function to form the thin film hygroscopic agent 22 having a thickness of 20 to 40 μm. Here, the film thickness of the thin film moisture absorbent 22 is preferably set to be smaller than the depth of the concave portion 21 described above, more specifically, 10 μm or thinner.

  Next, as illustrated in FIG. 3C, a sealant 30 is applied to the vicinity region 24 adjacent to the frame-shaped protrusion 23 of the sealing substrate 20 using a dispenser. That is, the thin film moisture absorbent 22 formed in the recess 21 of the sealing substrate 20 (more specifically, the formation area of the pixel array 12 formed on the substrate 10 facing the thin film moisture absorbent 22; the display area 11). The sealing material 30 is applied in a frame shape so as to surround the frame. Here, as the sealing material 30, for example, a spherical spacer 32 made of plastic beads having a particle diameter of 50 μm is added to about 0.5 wt% on an uncured sealing resin 31 made of an ultraviolet curable epoxy resin having a viscosity of about 10 Pa · s. Use a mixture. In addition, as a plastic bead used as the spherical spacer 32, for example, highly functional fine particles “Hi-Pureshka” (registered trademark) manufactured by Ube Nitto Kasei Co., Ltd. can be favorably applied.

  Next, the substrate 10 and the sealing substrate 20 described above are set in the substrate bonding apparatus, evacuation is started, and after reaching the set vacuum degree (atmospheric pressure), the two substrates are opposed to each other and bonded together, and FIG. ), The pressure is applied until the distance between the substrate 10 and the bonding surface of the frame-shaped protrusion 23 of the sealing substrate 20 reaches, for example, several μm. When the distance between the substrate 10 and the sealing substrate 20 reaches several μm, the inside of the bonding apparatus is returned to atmospheric pressure, and the bonded substrate is taken out. Here, the distance between the substrate 10 and the bottom surface 21 a of the recess 21 of the sealing substrate 20 is defined as 50 μm by the particle size of the spherical spacer 32 made of plastic beads, and the frame-like protrusion between the substrate 10 and the sealing substrate 20. The distance from the bonding surface of the portion 23 is defined to be about several μm based on the particle size of the spherical spacer 32 and the depth of the recess 21. Therefore, as shown in FIG. 3E, only the sealing resin 31 made of an ultraviolet curable epoxy resin among the sealing material 30 applied to the adjacent region 24 adjacent to the frame-shaped protrusion 23 of the sealing substrate 20. However, as shown by the arrows in the figure, it penetrates into a minute gap between the substrate 10 and the joint surface of the frame-shaped protrusion 23 of the sealing substrate 20 by capillary action.

  Thereafter, the frame-shaped sealing material 30 (sealing resin 31) formed between the substrate 10 and the sealing substrate 20 is irradiated with ultraviolet rays and cured. As a result, as shown in FIGS. 1A and 1B, the substrate 10 and the sealing substrate 20 are separated from each other by the sealing material 30 in the frame-shaped protrusion 23 on the peripheral edge of the sealing substrate 20 and the vicinity region 24 thereof. A display panel 11 in which the pixel array 12 is formed and the thin film moisture absorbent 22 are sealed in the sealed space 25 is completed.

(Comparison)
Next, the effect of the light-emitting panel and the manufacturing method thereof according to the above-described embodiment of the present invention will be specifically described with reference to a comparative example.

  FIG. 4 is a schematic configuration diagram illustrating Comparative Example 1 of the light-emitting panel. 4A is a plan view of the light-emitting panel according to Comparative Example 1, and FIG. 4B is a cross-sectional view taken along line IV-IV of the light-emitting panel shown in FIG. It is a figure which shows the cross-section in (IV is used for convenience as a symbol corresponding to the Roman numeral "4" shown in the inside). Here, about the structure corresponding to embodiment mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted or simplified. In addition, in the plan view shown in FIG. 4A, for the sake of convenience, hatching is given for the purpose of clarifying the application region of the sealing material.

  As shown in FIGS. 4A and 4B, the light emitting panel according to Comparative Example 1 includes a plurality of display elements (not shown) such as organic EL elements in the display region 111 on one surface side of the glass substrate 110. An arrayed pixel array 112 is provided. Then, the sealing glass substrate 120 is bonded to the one surface side of the glass substrate 110 through a sealing material 130 provided in a frame shape so as to surround the periphery of the display region 111 (pixel array 112). Yes. A recess 121 is formed in the sealing glass substrate 120 so that a sealing space 125 including at least the display region 111 (pixel array 112) is formed. In the recess 121, for example, a commercially available dry sheet 122 is attached to a region facing the display region 111 (pixel array 112). Further, in order to define and equalize the separation distance between the glass substrate 110 and the sealing glass substrate 120, a material in which a spherical spacer 132 having a particle size of, for example, several μm is mixed in the sealing material 130 is applied, or the above-described patent. As described in Document 1, a support portion having a predetermined height is provided.

  In such a panel structure, a recess 121 for attaching a commercially available dry sheet 122 is provided on the sealing glass substrate 120 side. Here, since the commercially available dry sheet 122 has a thickness of about 0.1 to 0.2 mm, the depth of the recess 121 formed in the sealing glass substrate 120 needs to be increased to, for example, about 0.3 mm. is there. In addition, in order to cover and protect the display element in the sealing space 125, the sealing glass substrate 120 needs to have a certain withstand voltage. For this reason, the thickness of the sealing glass substrate 120 needs to be, for example, about 0.7 mm, and there is a restriction in reducing the thickness of the entire light emitting panel.

  On the other hand, in the light emitting panel according to the present embodiment, as a member for absorbing moisture in the sealed space 25, a thin film coated with the above-described transparent thin film water replenisher instead of a commercially available dry sheet. Since the hygroscopic agent 22 is applied, the film thickness can be significantly reduced to about 20 to 40 μm. Therefore, since the depth of the recess 21 formed in the sealing substrate 20 for providing the thin film moisture absorbent 22 can be significantly reduced to about 50 μm, the thickness of the sealing substrate 20 is set to 0.4 to 0. 0, for example. The thickness can be reduced to about 5 mm, and the thinning of the entire light emitting panel can be promoted.

  FIG. 5 is a schematic configuration diagram illustrating Comparative Example 2 of the light-emitting panel. 5A is a plan view of the light-emitting panel according to Comparative Example 1, and FIG. 5B is a VV line of the light-emitting panel shown in FIG. 5A (FIG. 5 in this specification). It is a figure which shows the cross-sectional structure in ("V" is used for convenience as the symbol corresponding to the Roman numeral "5" shown in the inside). Here, about the structure corresponding to embodiment mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted or simplified. Further, in the plan view shown in FIG. 5A, for the sake of clarity, hatching is given for the sake of clarity.

  In Comparative Example 1 described above, since the thickness of the dry sheet 122 attached to the sealing glass substrate 120 side is relatively thick, it is necessary to increase the depth of the recess 121 formed in the sealing glass substrate 120. Therefore, it is necessary to increase the thickness of the sealing glass substrate 120, and there is a limitation in reducing the thickness of the entire light emitting panel. Therefore, as in Comparative Example 2 described below, a panel structure in which a flat (thin) thin glass substrate is applied as the sealing glass substrate and a thin film moisture absorbent is applied instead of the dry sheet is conceivable.

  That is, the light emitting panel according to Comparative Example 2 has a frame shape on one surface side of the glass substrate 210 so as to surround the display area 211 (pixel array 212) as shown in FIGS. The sealing glass substrate 220 made of flat glass is bonded through the provided sealing material 230 so as to face each other. A thin film moisture absorbent 222 is formed on the sealing glass substrate 220 in a region facing the display region 211 (pixel array 212) provided on the glass substrate 210. Further, a sealing space 225 including at least the display region 211 (pixel array 212) is formed between the glass substrate 210 and the sealing glass substrate 220. Therefore, in order to define and equalize the separation distance between the glass substrate 210 and the sealing glass substrate 220, a sealing material 230 in which a spherical spacer 232 having a predetermined particle size is mixed is applied.

  In such a panel structure, a hygroscopic agent is formed in a thin film on a sealing glass substrate 220 made of flat glass. Therefore, the spherical spacer 232 having a particle diameter larger than the thickness of the thin film moisture absorbent 222 is provided on the seal material 230 provided in a frame shape around the display area 211 so that the thin film moisture absorbent 222 does not contact the display element of the display area 211. It is necessary to mix. Here, when the thin film moisture absorbent 222 is formed with a film thickness of about 20 to 40 μm, the spherical spacer 232 mixed in the sealing material 230 needs to have a particle diameter of about 50 μm, for example.

  As described above, in the light emitting panel according to Comparative Example 2, the separation distance at the joint portion between the glass substrate 210 and the sealing glass substrate 220 is increased to the order of several tens of μm. Thus, the amount of moisture that enters the sealed space 225 from the outside of the light emitting panel increases. Therefore, the moisture absorption capacity of the thin film moisture absorbent 222 provided in the sealed space 225 reaches the limit earlier than the design value, and there is a problem that the life of the display element and the light emitting panel is shortened.

  On the other hand, in the light emitting panel according to this embodiment, the substrate 10 and the sealing substrate 20 are separated by the spherical spacer 32 that contacts both the bottom surface 21 a of the recess 21 formed in the sealing substrate 20 and the substrate 10. Since the distance is defined, the bonding surface of the frame-like protrusion 23 of the sealing substrate 20 and the substrate 10 can be set as close as possible. Accordingly, since the separation distance at the joint between the substrate 10 and the sealing substrate 20 can be reduced to about several μm, the light enters the sealing space 25 from the outside of the light emitting panel 100 through the sealing material 30 at the joint. The amount of moisture can be greatly reduced.

  As described above, according to the light-emitting panel and the method for manufacturing the same according to the present invention, the amount of moisture entering the sealed space through the joint between the substrate and the sealing substrate while reducing the thickness of the entire panel. It is possible to suppress deterioration of the characteristics of the display element.

In the above-described embodiment, the case where a glass substrate is applied as the sealing substrate has been described. However, the present invention is not limited to this, and a sealing substrate made of another substrate material such as metal is applied. You may do. In the present embodiment, the case where a spherical spacer made of plastic beads is applied as a spacer for defining the separation distance between the substrate and the sealing substrate has been described. However, the present invention is not limited to this. Alternatively, a spacer made of another material or shape may be applied.
Further, the present invention is not limited to these embodiments. For example, the light emitting panel according to the present invention may be applied to a printer head or an optical address element.

It is a schematic block diagram which shows one Embodiment of the light emission panel which concerns on this invention. It is the schematic which shows the board | substrate and sealing substrate of the light emission panel which concern on this embodiment. It is the schematic which shows the manufacturing method of the light emission panel which concerns on this embodiment. It is a schematic block diagram which shows the comparative example 1 of a light emission panel. It is a schematic block diagram which shows the comparative example 2 of a light emission panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 11 Display area 12 Pixel array 13 Wiring layer 14 Connection area 15 Connection terminal 20 Sealing substrate 21 Recess 21a Bottom surface 22 Thin film hygroscopic agent 23 Frame-like protrusion 24 Near area 25 Sealing space 30 Sealing material 31 Sealing resin 32 Spherical shape Spacer 100 Light emitting panel

Claims (7)

In the light-emitting panel in which the first substrate and the second substrate are bonded to face each other,
A pixel array in which a plurality of display elements are arranged on one side of the first substrate;
The second substrate has a recess in a region corresponding to the pixel array on the surface facing the first substrate;
The first substrate and the second substrate have a predetermined separation distance by a sealing material including a spacer that contacts both the bottom surface of the concave portion of the second substrate and the first substrate. A light-emitting panel which is bonded. The said spacer of the said sealing material is provided in the area | region which is in the said recessed part of the said 2nd board | substrate, and is adjacent to the peripheral part of the said 2nd board | substrate. Luminous panel. The sealing material has a sealing resin and the spacer,
The light emitting panel according to claim 2, wherein the peripheral portion of the second substrate is bonded to the first substrate through only the sealing resin. 4. The thin-film moisture absorbent is provided in a region corresponding to the pixel array of the first substrate in the concave portion of the second substrate. 5. The light emitting panel as described. The light emitting panel according to claim 1, wherein the display element is an organic electroluminescence element. In the method for manufacturing a light-emitting panel in which the first substrate and the second substrate are bonded to face each other,
In the concave portion of the second substrate having a concave portion in a region corresponding to the pixel array on the surface facing the first substrate having a pixel array in which a plurality of display elements are arranged, and Applying a sealing material including a spacer in contact with both the bottom surface of the concave portion of the second substrate and the first substrate to a region adjacent to the peripheral portion of the second substrate;
Bonding the second substrate such that the pixel array of the first substrate is included in the recess of the second substrate;
A method for manufacturing a light-emitting panel, comprising: Prior to the step of bonding the first substrate and the second substrate, a thin-film moisture absorbent is applied to a region corresponding to the pixel array of the first substrate in the recess of the second substrate. The method for manufacturing a light-emitting panel according to claim 6, further comprising a step of forming.

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