JP2010129875A - Method of manufacturing power conversion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus that improves productivity, is ideal for mass production, and is ideal for miniaturization and thinning. <P>SOLUTION: A method of manufacturing the power conversion apparatus 1 includes: a step of forming cores 21, 22; a step of forming a resin material 3 for covering the surfaces of the cores 21, 22; a step of forming through hole conductors 413, 423 penetrating the resin material 3 along the surfaces in a partial region on the surfaces of the cores 21, 22; and a step of forming conductors 411, 412, 421, 422 that are formed on the resin material 3 at another partial region on the surfaces of the cores 21, 22, and are electrically connected to the connection hole conductors 413, 423 for forming winding 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a power converter, and more particularly to a method for manufacturing a power converter having a core and a winding (coil).

  The downsizing and thinning of power supply modules (power supply units) is an important factor in promoting downsizing and thinning of electronic devices. For example, not only the semiconductor switching device but also electronic components such as a transformer, an inductor, a capacitor, and a heat radiation fin are incorporated in the power supply module, and it is necessary to downsize these electronic components themselves. The transformer includes a core and a winding (coil) wound around the core. The core is made of a magnetic material such as ferrite. In the conventional processing technology, there is a limit to the fine processing of the magnetic material, so that it is difficult to reduce the size and thickness of the transformer.

Patent Document 1 below discloses an ultra-compact power conversion device suitable for reducing the size and thickness of a transformer. In this ultra-small power converter, coil conductors are respectively formed on opposing main surfaces of a ferrite substrate (core), a through-hole penetrating from one main surface of the ferrite substrate to the other main surface is formed, A connection conductor is formed to connect the coil conductors on both main surfaces. A coil is formed by continuously connecting each of the coil conductor, the connection conductor, and the coil conductor. An electrode for supplying current to the coil is formed on the main surface of the ferrite substrate and connected to the coil conductor.
JP 2008-147297 A

  However, in the ultra-small power converter disclosed in Patent Document 1, the following points have not been considered.

  1stly, in a micro power converter, the through-hole for forming the connection conductor which connects between coil conductors to a ferrite substrate is required. This through hole is formed for each ferrite substrate using a processing technique such as sand blasting or laser processing. For this reason, in manufacture of a micro power converter, productivity is bad and it is unsuitable for mass production.

  Secondly, if the ultra-small power converter is reduced in size and thickness, the inductance is naturally reduced. In order to obtain a large inductance, it is necessary to increase the number of turns (turns) of the coil on the ferrite substrate. This means that the length of the ferrite substrate is increased in the core length direction, and the ferrite substrate size (core size) increases. That is, there is a limit to miniaturization and thinning of the ultra-small power converter.

  Further, since the electrode connected to the coil conductor is formed on the main surface of the ferrite substrate of the micro power converter, the size of the ferrite substrate increases including the area occupied by the electrode. Further, when a current is supplied to the coil, a current also flows through the electrode, and the magnetic flux generated in the ferrite substrate under the electrode and the magnetic flux generated in the ferrite substrate by the coil cause magnetic interference. For this reason, since the separation dimension which does not produce a magnetic interference between a coil and an electrode is needed, the ferrite substrate size further increases. That is, there is a limit in this point as well to reduce the size and thickness of the ultra-small power converter.

  The present invention has been made to solve the above problems. Therefore, the present invention provides a method for manufacturing a power conversion device that can improve productivity and is suitable for mass production.

  In order to solve the above-described problem, the first feature according to the embodiment of the present invention is that, in the method for manufacturing a power converter, a step of forming a core, a step of forming a resin body covering the surface of the core, Forming a through-hole conductor that penetrates the resin body along this surface in a part of the region on the surface of the core, and forming a connection on the resin body in another part of the surface of the core Forming a conductor electrically connected to the hole conductor to form a winding.

  According to a second feature of the embodiment, in the method for manufacturing the power conversion device, the first core in which the second surface facing the first surface is pasted on the first substrate, and the first core Forming a second core spaced apart from the core; forming a first resin body on the first surface of the first core and the second core; and removing the first substrate. And forming a third resin body on the side surface between the first surface and the second surface of the first core and the second core, and the second of the first core and the second core Forming a second resin body on the surface of the first core, and penetrating the first resin body, the second resin body, and the third resin body along the side surfaces of the first core and the second core, respectively. Forming a through-hole conductor to be electrically connected to one end of the through-hole conductor on the first resin body on the first surfaces of the first core and the second core. Electrically connecting the other end of the through-hole conductor on the second resin body on the second surface of the first core and the second core, Forming a second conductor connected to the first conductor, and forming a winding with the first conductor, the second conductor, and the through-hole conductor.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the first core and the second core includes an elongated plate shape in which the extension dimension is set larger and the thickness dimension is set smaller than the width dimension. It is preferable to be a step of forming a first core and a second core having

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the first resin body includes a step of providing the first resin body on a glass mask having an exposure pattern in a formation region of the through-hole conductor. It is preferable to include a step of forming the second substrate and a step of transferring the first resin body of the second substrate onto the first surface of the first core and the second core.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the through-hole conductor includes the first resin body, the second resin body, and the second resin body using the exposure pattern of the glass mask of the second substrate. It is preferable to include a step of forming a through hole in the resin body 3 and a step of forming a through hole conductor in the through hole.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the through hole conductor is a step of forming the through hole conductor in the through hole by plating, and the step of forming the first conductor is It is a step of forming the first conductor by plating on the first resin body, and the step of forming the second conductor is a step of forming the second conductor on the second resin body. Is preferred.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the third resin body includes a step of applying a resin covering the first core and the second surface of the second core, It is preferable that the top surface of the applied resin is flattened to a level equivalent to the second surface of the first core and the second core to form a third resin body.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the second resin body and the step of forming the third resin body are performed on the second surface of the first core and the second core. Applying a resin covering the surface, and flattening the applied resin on the second surface leaving a certain film thickness to form a third resin body on the side surfaces of the first core and the second core And a step of forming a second resin body on the second surface of the first core and the second core.

  In the method of manufacturing the power conversion device according to the second feature, the step of forming the first resin body includes the step of forming the second substrate including the first resin body, and the first of the second substrate. Forming the resin body on the first surface of the first core and the second core, and the step of forming the second resin body and the step of forming the third resin body include: A step of applying a resin covering the second surface of the first core and the front second core, and planarizing the applied resin on the second surface leaving a certain film thickness; And forming a third resin body on a side surface of the second core and forming a second resin body on the second surface of the first core and the second core, and a through hole Using a glass mask having an exposure pattern in a region where the conductor is formed, the exposure pattern is at least a first resin body and a second resin body. Transferring to any one of them, forming a through hole in the first resin body, the second resin body, and the third resin body by the transferred exposure pattern, and forming a through hole conductor in the through hole A process.

  In the method for manufacturing the power conversion device according to the first feature or the second feature, a step of forming a protective film covering the surface of the winding is further provided after the step of forming the winding.

  In the method for manufacturing the power conversion device according to the second feature, the step of forming the winding includes electrically connecting each of the first conductor, the through-hole conductor, and the second conductor continuously, A primary winding wound around each of the first core and the second core and having a spiral shape along the magnetic path, and between adjacent ones along the magnetic path of the primary winding The first conductor, the through-hole conductor, and the second conductor are electrically connected to each other in parallel with the primary winding, and the first core and the second core. It is preferable to be a step of forming a secondary winding having a spiral shape along the magnetic path.

  According to the present invention, productivity can be improved and a method for manufacturing a power converter suitable for mass production can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and different from the actual ones. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the following embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is to arrange the components and the like as follows. Not specific. The technical idea of the present invention can be variously modified within the scope of the claims.

(First embodiment)
The 1st Embodiment of this invention demonstrates the example of a transformer as a power converter device.

[Configuration of power converter]
As shown in FIGS. 1, 2, and 3, the power conversion device 1 according to the first embodiment is a transformer. The power conversion device 1 is separated from the first core 21 in a first direction extending in a first direction X and in a second direction Y that intersects the first direction X, and the first direction A second core 22 extending in parallel with the first core 21 around X, and spirally wound around the first core 21 and the second core 22 in the first direction X; The first core 21 generates the magnetic flux m1 in the first direction X, the second core 22 generates the magnetic flux m2 in the direction opposite to the first direction X, and the first end of the first core 21 Magnetic coupling between 21 a and the second end 22 a of the second core 22 and between the first other end 21 b of the first core 21 and the second other end 22 b of the second core 22 Windings (mc1 and mc2).

  Here, the first direction X coincides with the X-axis direction of the three-dimensional coordinates, and the second direction Y coincides with the Y-axis direction. In the first embodiment, The direction Y is a right angle. The third direction Z coincides with the Z-axis direction and is perpendicular to each of the first direction X and the second direction Y. The first direction X, the second direction Y, and the third direction Z do not have to be perpendicular to the other directions, and may be acute or obtuse with respect to the other directions. Good.

  The first core 21 has an elongated plate shape in which the extension dimension L1 in the first direction X is set larger and the thickness dimension t1 is set smaller than the width dimension W1 in the second direction Y. Specifically, the first core 21 is substantially formed in a rectangular parallelepiped or strip shape. Although not necessarily limited to this value, in the first embodiment, for example, the width dimension W1 of the first core 21 is set to 0.1 mm-5.0 mm, and the extension dimension L1 is 1 mm-50 mm. The thickness dimension t1 is set to 0.1 mm-4.0 mm. The inductance value can be easily adjusted by adjusting the extension dimension L1. The first core 21 is made of, for example, a ferrite magnetic material obtained by sintering a metal oxide ferromagnet as a ceramic. Alternatively, the first core 21 may be formed of an amorphous magnetic material.

  Similar to the first core 21, the second core 22 is elongated in which the extension dimension L2 in the first direction X is larger and the thickness dimension t2 is smaller than the width dimension W2 in the second direction Y. It is comprised by plate shape. The size of the second core 22 is set to be the same as the size of the first core 21. The material of the second core 22 is the same as the material of the first core 21. The separation dimension between the first core 21 and the second core 22 is set to 50 μm−5 mm, for example.

  The entire periphery of the first core 21 and the second core 22 is covered with the resin body 3. When used as a part of the structure of the power conversion device 1 and considering its manufacturing process, the resin body 3 preferably has a high withstand voltage, a high aspect ratio, and a high heat resistance. For example, the resin body 3 having an withstand voltage of 10 V / μm or more, an aspect ratio of, for example, 5: 1 or more, and a heat-resistant temperature of 150 ° C. or more is optimal. For the resin body 3 having such physical properties, for example, an epoxy resin-based photoresist can be practically used.

  In the first embodiment, the resin body 3 has a three-layer structure including a first resin body 31, a second resin body 32, and a third resin body 33. The first resin body 31 is disposed on the first surface 2A (the lower surface in FIG. 1, one surface) of the first core 21 and on the first surface 2A of the second core 22. Has been. The second resin body 32 is on the second surface 2B (upper surface in FIG. 1, the other surface) facing the first surface 2A of the first core 21 and the first of the second core 22. Is disposed on the second surface 2B facing the surface 2A. Both the first resin body 31 and the second resin body 32 are set to a film thickness of 5 μm to 500 μm, for example. The third resin body 33 includes a space between the first core 21 and the second core 22, and on the side surface 2 </ b> C between the first surface 2 </ b> A and the second surface 2 </ b> B of the first core 21. It is arranged. The film thickness of the third resin body 33 is set to be the same as the film thickness of each of the first core 21 and the second core 22.

  The winding 4 includes a primary side winding 41 and a secondary side winding 42. The primary winding 41 includes a first conductor 411 disposed on the first surface 2A of each of the first core 21 and the second core 22 via a first resin body 31, and a first conductor 411. A second conductor 412 disposed on a second surface 2B of each of the first core 21 and the second core 22 via a second resin body 32; the first core 21; the second core 21; And a through-hole conductor 413 disposed in the third resin body 33 on each side surface 2C of the core 22, and these are electrically connected so as to continuously draw a spiral shape. . The through-hole conductor 413 is mainly disposed in the through-hole 35 penetrating the third resin body 33, specifically, the first resin body 31, the third resin body 33, and the second resin body 32. ing.

  In the first embodiment, the primary winding 41 starts to be wound from the first other end 21b of the first core 21 and goes to the first end 21a that is 180 degrees opposite to the first direction X. The second end 22a of the second core 22 is transferred from the first end 21a to the second end 22a in the first direction X from the first end 21a. It is wound in the counterclockwise direction toward 22b and the first roll is finished. The primary winding 41 at the end of the first winding is in the first direction X of the position of the winding start from the second other end 22b of the second core 22 to the first other end 21b side of the first core 21. It moves to the adjacent position in the opposite direction, and is connected to the primary winding 41 of the second winding start. The second primary winding 41 is the same as the first primary winding 41 in a state shifted by one pitch in the direction opposite to the first direction X with respect to the first primary winding 41. Is wound in parallel with the first primary winding 41 in the winding method. The third primary side winding 41 is connected to the second primary side winding 41, and is similarly wound around the second primary side winding 41. In the first embodiment, the primary side winding 41, which is a set of three wires, is fixed by interposing the secondary side winding 42 in the direction opposite to the first direction X in the first core 21. In addition to being wound at intervals, the second core 22 is wound at regular intervals with the secondary winding 42 interposed in the first direction X. The number of primary windings 41 and the number of turns are not limited to the above example, but can be variously changed according to the induced electromotive force, the turn ratio, and the like required in the power conversion device 1.

  When a current flows through the primary winding 41 from the winding start side to the winding end side, the primary winding 41 is counterclockwise in the first core 21 in the direction opposite to the first direction X. Since it is wound, a magnetic flux m1 in the first direction X is generated in the first core 21. In the second core 22, the primary winding 41 is wound in the counterclockwise direction toward the first direction X, and thus a magnetic flux m <b> 2 that is opposite to the first direction X is generated. Furthermore, since the direction of the magnetic flux m2 generated in the second core 22 is opposite to the direction of the magnetic flux m1 generated in the first core 21, the first end 21a of the first core 21 and the second A magnetic coupling mc1 occurs between the second end 22a of the core 22 and the second other end 22b of the second core 22 between the first other end 21b of the first core 21 and the second end 22b of the second core 22. Magnetic coupling mc2 occurs. Between the first end 21a of the first core 21 and the second end 22a of the second core 22, and the second other of the first other end 21b of the first core 21 and the second core 22 It functions as an air gap between the end 22b. As a result, the first core 21 and the second core 22 form a pseudo closed magnetic circuit through the magnetic flux m1, the magnetic coupling mc1, the magnetic flux m2, and the magnetic coupling mc2, while being separated from each other.

  The first conductor 411 and the second conductor 412 of the primary winding 41 are both formed of a conductive material having at least excellent conductivity such as copper (Cu), Cu alloy, gold (Au), or the like. ing. Further, each of the first conductor 411 and the second conductor 412 is not limited to a single-layer conductive material, and may be, for example, a composite layer in which a Cu plating layer or an Au plating layer is stacked on the surface of the Cu layer. It may be formed. The through-hole conductor 413 is formed of, for example, the same conductive material as each of the first conductor 411 and the second conductor 412. Although not necessarily limited to this value, the winding width of the primary side winding 41 is set to, for example, 10 μm-1 mm, and the winding thickness (thickness from the surface of the resin body 3) is, for example, 10 μm-1 mm. Is set to

  An electrode pad 41P is electrically connected to one end of the first winding start and the other end of the third winding end of the primary winding 41, respectively. The electrode pad 41P is formed of the same conductive material in the same conductive layer as the second conductor 412, and in the first embodiment, the outer side of the first core 21 opposite to the second core 22 side, The second core 22 is disposed on the outer side opposite to the first core 21 side and is disposed on the second resin body 32. That is, the electrode pad 41P and each of the first core 21 and the second core 22 are electrically and magnetically separated through at least the second resin body 32.

  The secondary winding 42 includes a first conductor 421 disposed on the first surface 2A of each of the first core 21 and the second core 22 via the first resin body 31; The second conductor 422 disposed on the second surface 2B of each of the first core 21 and the second core 22 via the second resin body 32, the first core 21, and the second core And through-hole conductors 423 disposed on the third resin bodies 33 on the side surfaces 2C of the cores 22 of the core 22, and these are electrically connected so as to continuously draw a spiral shape. Yes. Similar to the through-hole conductor 413, the through-hole conductor 423 is disposed in the through-hole 35 that passes through the first resin body 31, the third resin body 33, and the second resin body 32.

  In the first embodiment, the secondary winding 42 starts winding from the first other end 21b of the first core 21 in the same manner as the primary winding 41, and is 180 degrees from the first direction X. Winding in the counterclockwise direction toward the first end 21a in the reverse direction, the first end 21a moves to the second end 22a of the second core 22, and the second end 22a 1 is wound in the counterclockwise direction toward the second other end 22b in the direction X, and the winding is finished. The secondary winding 42 is disposed between the primary winding 41 of the set of three and the primary winding 41 of the other three adjacent to each other in the first direction X or in the opposite direction. It is wound around the primary winding 41 in a set of three. In the first embodiment, one secondary winding 42 winds the first core 21 at regular intervals with the primary winding 41 interposed in the direction opposite to the first direction X. At the same time, the second core 22 is wound in the first direction X at regular intervals with the primary winding 41 interposed.

  In the first embodiment, the secondary winding 42 has a first winding with respect to three primary windings 41 that repeatedly wind the first core 21 and the second core 22 three times. The core 21 and the second core 22 are configured to be wound only once, and have a larger cross-sectional area than the cross-sectional area of the primary winding 41 by further increasing the winding width. Here, for example, the sectional area of the secondary winding 42 is set to about 3 to 4 times the sectional area of the primary winding 41. This is because when a current is supplied to the primary side winding 41, a current is generated in the secondary side winding 42 by the induced electromotive force. However, the current amount of the secondary side winding 42 is large, the current density is increased, and the heat generation amount is increased. This is because the amount of generated heat is reduced. Note that the number and number of turns of the secondary winding 42 are not limited to the above example, and can be variously changed according to the induced electromotive force and the turn ratio required in the power conversion device 1. .

  In the first embodiment, the separation distance between the primary side winding 41 and the secondary side winding 42 is set to, for example, 500 μm or less, and the primary side winding 41 and the secondary side winding 42 The withstand voltage between is set to, for example, a safety standard of 3000 V or higher.

  The first conductor 421, the second conductor 422, and the through-hole conductor 423 of the secondary winding 42 are all the first conductor 411, the second conductor 412 of the primary winding 41, It is formed of the same conductive material as each of the through-hole conductors 423. Although not necessarily limited to this value, the winding width of the secondary winding 42 is set to, for example, 10 μm-5 mm, and the winding thickness (thickness from the surface of the resin body 3) is, for example, 10 μm— It is set to 1 mm.

  Electrode pads 42P are electrically connected to one end of the winding start of the secondary winding 42 and the other end of the winding, respectively. The electrode pad 42P is formed of the same conductive material in the same conductive layer as the second conductor 422. In the first embodiment, the outer side of the first core 21 opposite to the second core 22 side, The second core 22 is disposed on the outer side opposite to the first core 21 side and is disposed on the second resin body 32. That is, the electrode pad 42 </ b> P and each of the first core 21 and the second core 22 are electrically and magnetically separated through at least the second resin body 32.

  A protective film 51 is disposed on the first resin body 31 of the resin body 3 and on the first conductors 411 and 421, and on the second resin body 32 and on the second conductors 412 and 422. A protective film 52 is provided. For the protective films 51 and 52, for example, a resin film such as an epoxy resin film or a polyimide resin film can be used. When the power conversion device 1 is directly mounted on a mounting substrate or the like, an epoxy resin film is optimal for the protective films 51 and 52.

  In the power conversion device 1 according to the first embodiment shown in FIGS. 1 to 3, the first core 21, the second core 22, and the winding 4 wound around them have one basic structure. This basic structure becomes the basic unit of the repeated arrangement pattern. A plurality of basic units can be arranged densely by arranging a plurality of basic units in the second direction Y and interposing a resin body 3 excellent in withstand voltage between adjacent basic units. If the plurality of basic unit windings 4 and other basic unit windings 4 are electrically connected in series, the number of turns of the winding 4 can be dramatically increased, and a very large inductance can be obtained. Can be obtained. Since the basic unit includes the two cores of the first core 21 and the second core 22, the number of cores increases by an even number by repeatedly arranging the basic units.

[Operational principle of power converter]
In the power conversion device 1 shown in FIGS. 1 to 3 described above, first, a current is supplied to the primary winding 41. By supplying this current, the magnetic flux m1 is generated in the first core 21 in the first direction X, and the magnetic flux m2 in the opposite direction to the first direction X is generated in the second core 22 in the opposite direction by 180 degrees. .

  Since the magnetic flux m1 generated in the first core 21 goes toward the second core 22, it is between the first other end 21b of the first core 21 and the second other end 22b of the second core 22. Magnetic coupling mc2 occurs in On the other hand, since the magnetic flux m2 generated in the second core 22 goes toward the first core 21, it is between the first end 21a of the first core 21 and the second end 22a of the second core 22. The magnetic coupling mc1 is generated. As a result, the magnetic flux m1, the magnetic coupling mc2, the magnetic flux m2, and the magnetic coupling are provided by including the first core 21 and the second core 22 and further including the primary winding 41 having the spiral shape described above. A closed magnetic circuit in which mc1 is coupled to each other is constructed.

  Since the secondary winding 42 is wound in parallel with the primary winding 41 in the first core 21 and the second core 22, the magnetic fluxes m1 and m2 are converted into electric power in the secondary winding 42. Is done.

[Manufacturing method of power converter]
The method for manufacturing the power conversion device 1 according to the first embodiment described above is as described below.

  First, a long and narrow plate-shaped first core 21 and second core 22 are formed (see FIG. 4). The first core 21 and the second core 22 are formed, for example, by cutting a wafer state or bulk state ferrite by cutting.

  The first substrate 6 is prepared, the first core 21 and the second surface 2B of the second core 22 are attached to the surface of the first substrate 6, and the first core is attached to the first substrate 6. 21 and the second core 22 are mounted (see FIG. 4). The first substrate 6 is used as a bonded substrate or a sacrificial substrate, and for example, a silicon (Si) substrate, a glass substrate, or the like can be used as the first substrate 6.

  As shown in FIG. 4, the first resin body 31 </ b> A is formed on the first surface 2 </ b> A of the first core 21 and the second core 22 that are attached to the first substrate 6. The first resin body 31 </ b> A is formed on the surface of the second substrate 7, and the first resin body 31 </ b> A on the surface of the second substrate 7 is replaced with the first core 21 and the second core 22. By pressing the surface 2A, the first resin body 31A is attached to the first surface 2A. As described above, for example, an epoxy resin-based photoresist is used for the first resin body 31A. At this stage, the first resin body 31A is in a state before exposure.

  In the first embodiment, the second substrate 7 includes a glass mask 71 having an exposure pattern 72 in a formation region of the through hole 35 (see FIG. 1 and FIG. 8 described later), and an exposure pattern 72 of the glass mask 71. And an adhesive 73 formed on the side surface. The first resin body 31 </ b> A is formed on the surface of the glass mask 71 through the adhesive 73. The adhesive 73 is also used as a release agent that bonds the first resin body 31 </ b> A to the glass mask 71 and peels the first resin body 31 from the glass mask 71. For example, a transparent glass substrate is used for the glass mask 71, and for example, a chromium (Cr) film is used for the exposure pattern 72.

  Here, the glass mask 71 of the second substrate 7 is excellent in flatness, and the flatness of the first resin body 31A formed on the surface of the glass mask 71 can be improved. Further, the glass mask 71 improves the overall flatness of the structure constructed by the first resin body 31A and the first core 21 and the second core 22 formed on the surface of the first resin body 31A. Adhesion with the resin body 31A can be improved. The flatness and adhesion of the first resin body 31 </ b> A determine the exposure accuracy in the exposure process, and affect the transfer accuracy of the first resin body 3 </ b> A of the exposure pattern 72 of the glass mask 71. In order to form the through hole 35 in the resin body 3 with high accuracy, the glass mask 71 is effective.

  As shown in FIG. 5, on the second substrate 7, the third resin layer 31A covers the first resin body 31A, the second surface 2B of the first core 21 and the second core 22, and further covers the side surface 2C. The resin body 33A is formed. The third resin body 33A is applied by, for example, a coating method, and for example, an epoxy resin-based photoresist is used for the third resin body 33A as described above. At this stage, the third resin body 33A is in a state before exposure.

  As shown in FIG. 6, using the hot plate 8, the third resin body 33 </ b> A is pressed from the back surface side of the second substrate 7 to the hot plate 8 while being heated, so that the surface of the third resin body 33 </ b> A is flat. It becomes. In the first embodiment, the surface of the third resin body 33A is flattened to the same level as the second surface 2B of the first core 21 and the second core 22.

  As shown in FIG. 7, an exposure process is performed, and the exposure pattern 72 is transferred to the first resin body 31A and the third resin body 33A using the second substrate 7, that is, the glass mask 71. The first resin body 31 </ b> A and the third resin body 33 </ b> A other than the exposure pattern 72 are exposed and formed as the first resin body 31 and the third resin body 33.

  Next, a development process is performed, and the third resin body 33A and the first resin body 31A to which the exposure pattern 72 is transferred are removed, and the through holes 35 are formed in the third resin body 33 and the first resin body 31. Is formed (see FIG. 8). Thereafter, as shown in FIG. 8, the second substrate 7 is removed, and the first resin body 31 </ b> A on the surface of the second substrate 7 becomes the first core 21 and the first core 22. It is transferred to the surface 2A.

  Next, a second resin body 32 is formed on the second surface 2B of the first core 21 and the second core 22 (see FIG. 9). Similar to the method of forming the first resin body 31, the second resin body 32 is first formed on the surface of the third substrate 9, and the second resin body 32 on the surface of the third substrate 9 is formed. By pressing against the second surface 2B of the first core 21 and the second core 22, the second resin body 32 is attached to the second surface 2B. As described above, for example, an epoxy resin-based photoresist is used for the second resin body 32. At this stage, the second resin body 32 is in a state before exposure.

  Subsequently, an exposure process is performed, and the pattern of the through-hole 35 is transferred to the second resin body 32 using a part of the through-hole 35 previously formed in the first resin body 31 and the third resin body 33 as a mask. Is done. The second resin body 32 other than the pattern of the through holes 35 is exposed. By forming the second resin body 32, the structure of the resin body 3 including the first resin body 31, the third resin body 33, and the second resin body 32 is almost completed.

  Subsequently, a development process is performed, and the portion where the pattern of the second resin body 32 is transferred is removed, and another part of the through hole 35 is formed in the second resin body 32. Thereby, the through-hole 35 which penetrates each of the 1st resin body 31, the 3rd resin body 33, and the 2nd resin body 32 is completed.

  The third substrate 9 includes a base substrate 91 and a plating seed 92 formed on the surface of the base substrate 91 on the second resin body 32 side. For example, a Si substrate can be used as the base substrate 91. For the plating seed 92, for example, a metal thin film such as Au, Cr, or Cu can be used.

  The other part of the through hole 35 formed in the second resin body 32 and the part of the through hole 35 formed in each of the first resin body 31 and the third resin body 33 are the first In the embodiment, the exposure process and the development process are used to form a so-called photolithography technique, but a part of the through hole 35 or the other part is formed by a processing technique such as dry etching or plasma ashing. Also good. The through holes 35 may be formed through the exposure process and the development process after the first resin body 31A, the third resin body 33A, and the second resin body 32 are formed.

  As shown in FIG. 9, through-hole conductors 413 and 423 are formed so as to be embedded in the through-hole 35. As described above, for example, Cu or the like is used for the through-hole conductors 413 and 423, and this Cu is formed by, for example, a plating method.

  Next, the plating seed 10 is formed on the surface of the first resin body 31, and the first core 21 and the first core 2 on the first surface 2 </ b> A of the second core 22 are respectively connected to the through-hole conductors 413 and 423. A resist 11 having an opening reaching the region is formed on the plating seed 10 (see FIG. 10). For the plating seed 10, a metal thin film similar to the plating seed 92 of the third substrate 9 described above can be used.

  As shown in FIG. 10, the resist 11 is used as a mask on the plating seed 10 extending from the first surface 2A of the first core 21 and the second core 22 to each of the through-hole conductors 413 and 423. Each of the conductors 411 and 421 is formed. The plating seed 10 under each of the first conductors 411 and 421 is used as a part of each of the first conductors 411 and 421. As shown in FIG. 11, the resist 11 and unnecessary plating seeds 10 thereunder are removed using each of the first conductors 411 and 421 as a mask.

  Next, the base substrate 91 of the third substrate 9 is removed. Similar to the method of forming each of the first conductors 411 and 421, first, the first core 21 and the second core 22 are formed on the plating seed 92 (or newly formed plating seed) remaining on the base substrate 91. A resist (not shown) in which regions extending from the second surface 2B to the through-hole conductors 413 and 423 are opened is formed. Using this resist as a mask, the second conductors 412 and 422 are formed on the plating seed 92 extending from the second surface 2B of the first core 21 and the second core 22 to the through-hole conductors 413 and 423, respectively. Each is formed. The plating seed 92 below each of the second conductors 412, 422 is used as part of each of the second conductors 412, 422. As shown in FIG. 12, the resist and unnecessary plating seed 92 thereunder are removed using each of the second conductors 412 and 422 as a mask. By forming the second conductors 412, 422, the primary winding 41 including the first conductor 411, the through-hole conductor 413, and the second conductor 412 is completed, and the first conductor 412, 422 is completed. The secondary winding 42 including the conductor 421, the through-hole conductor 423, and the second conductor 422 is completed. Furthermore, electrode pads 41P and 42P are formed in the same manufacturing process as the process of forming the second conductors 412 and 422.

  Next, as shown in FIG. 1 described above, a protective film 51 covering the first surface 2A of the first core 21 and the second core 22 is formed, and the first core 21 and the second core 22 are formed. A protective film 52 is formed to cover the second surface 2B.

  When these series of manufacturing steps are completed, the power conversion device 1 according to the first embodiment is completed.

[Characteristics of power converter]
Since the power conversion device 1 according to the first embodiment described above includes the first core 21 and the second core 22 having an elongated plate shape, the winding 4 is wound in the extending length direction thereof. The number can be increased and the inductance can be increased. Furthermore, in the power conversion device 1 according to the first embodiment, a plurality of basic structures are arranged in the second direction Y with the first core 21, the second core 22, and the winding 4 as basic structures. By electrically connecting each of the windings 4 in series, the number of turns of the winding 4 can be dramatically increased, so that the inductance can be further increased. As a result, the first core 21 and the second core 22 can be formed in an elongated plate shape and the inductance characteristics can be improved, so that the power conversion device 1 can be reduced in size and thickness.

  Further, in the power conversion device 1 according to the first embodiment, the first core 21 and the second core 22 are different regions and are connected to the primary winding 41 on the resin body 3. Since the electrode pad 41P and the electrode pad 42P connected to the secondary winding 42 are disposed, the size of the first core 21 and the size of the second core 22 do not include the electrode pads 41P and 42P. . As a result, the power converter 1 can be downsized.

  Further, in the power conversion device 1 according to the first embodiment, the first core 21 and the second core 22 are different regions and are connected to the primary winding 41 on the resin body 3. An electrode pad 41P and an electrode pad 42P connected to the secondary winding 42 are disposed, and the resin body 3 is interposed between the first core 21 and the second core 22 and the electrode pad 41P and the electrode pad 42P. Therefore, magnetic interference between the magnetic flux m1 generated in the first core 21 and the magnetic flux m2 generated in the second core 22 due to the current flowing in the electrode pads 41P and 42P can be reduced. . As a result, the distance between the first core 21 and the second core 22 and the electrode pads 41P and 42P can be shortened, so that the power converter 1 can be downsized as a result. .

  In the power conversion device 1 according to the first embodiment, it is possible to promote downsizing as described above, and in the manufacturing method, the first core 21 and the second core 22 having an elongated plate shape. Since the winding 4 is formed using the thin film deposition technique using the above, further downsizing and thinning can be realized. For example, in the power conversion device 1 according to the first embodiment, the third direction Z (thickness direction) can be reduced to 8 mm or less, and further to 1 mm or less. The power conversion device 1 configured as described above can be mounted in one package together with, for example, a semiconductor switching device, an inductor, and a control IC, and a power supply module can be constructed, and the power supply module can be reduced in size and thickness. Can do.

  Furthermore, in the power conversion device 1 according to the first embodiment, the first core 21 and the second core 22 are formed in an elongated plate shape, and the ground contact area can be increased, improving heat dissipation. Therefore, it is possible to suppress the heat generation at the center of the core and improve the power conversion efficiency.

  Furthermore, in the power conversion device 1 according to the first embodiment, since the entire first core 21 and the second core 22 are covered with the resin body 3, the mountability and reliability are improved. Can do.

  In addition, in the method for manufacturing the power conversion device 1 according to the first embodiment, a plurality of first cores 21 and second cores 22 can be collectively formed by cutting, and a semiconductor manufacturing process As a result, a plurality of windings 4 can be formed at a time, so that productivity can be improved.

  Furthermore, in the method for manufacturing the power conversion device 1 according to the first embodiment, the first resin body 3A is formed on the glass mask 71 of the second substrate 7 and flattened at the initial stage of the manufacturing process. The first resin body 31A is brought into close contact with the exposure pattern 72 of the glass mask 71 while improving the properties, and then the exposure pattern 72 is transferred to the first resin body 31A and the like, and the resin body 3 is based on the transferred pattern. Since the through hole 35 is formed in the hole, the processing accuracy of the through hole 35 can be improved. Improvement of the processing accuracy of the through hole 35 can promote the miniaturization of the processing size of the through hole 35, and as a result, the power conversion device 1 can be reduced in size and thickness.

(Second Embodiment)
2nd Embodiment of this invention demonstrates the example which simplified the manufacturing method of the power converter device 1 which concerns on 1st Embodiment.

[Manufacturing method of power converter]
The manufacturing method of the power converter device 1 according to the second embodiment is as described below.

  First, in the same manner as in the method for manufacturing the power conversion device 1 according to the first embodiment, the first core 21 and the second core 22 having an elongated plate shape are formed (see FIG. 13). The core 21 and the second core 22 are attached to the first substrate 6.

  As shown in FIG. 13, the first resin body 31 </ b> A is formed on the first surface 2 </ b> A of the first core 21 and the second core 22 that are attached to the first substrate 6. The first resin body 31 </ b> A is formed on the surface of the third substrate 9, and the first resin body 31 </ b> A on the surface of the third substrate 9 is replaced by the first core 21 and the second core 22. By pressing the surface 2A, the first resin body 31A is attached to the first surface 2A.

  In the second embodiment, the third substrate 9 includes a base substrate 91 and a first resin of the base substrate 91, as in the method for manufacturing the power conversion device 1 according to the first embodiment described above. And a plating seed 92 formed on the surface of the body 31A.

  As shown in FIG. 14, the third substrate 9 covers the first resin body 31 </ b> A, the second surface 2 </ b> B of the first core 21 and the second core 22, and further covers the side surface 2 </ b> C. The resin body 33A is formed. The third resin body 33A is applied by, for example, a coating method.

  As shown in FIG. 15, using the hot plate 8, the third resin body 33 </ b> A is pressed against the hot plate 8 while being heated from the back surface side of the third substrate 9, so that the surface of the third resin body 33 </ b> A is flat. It becomes. In the second embodiment, the surface of the third resin body 33A is planarized on the second surface 2B of the first core 21 and the second core 22 leaving a certain film thickness, Side portions 2C of the first core 21 and the second core 22 of the resin body 33A are used as they are as the third resin body 33A, and the first core 21 and the second core 22 of the third resin body 33A are used. The portion left on the second surface 2B with a constant film thickness is used as the second resin body 32A. In other words, in the second embodiment, the third resin body 33A is formed and the planarization process is performed, so that the second resin body 32A is formed using a part of the third resin body 33A. It is formed.

  Next, the second substrate 7 is mounted on the surface of the second resin body 32A (see FIG. 16). In the second embodiment, the second substrate 7 is a glass mask 71 having an exposure pattern 72. As shown in FIG. 16, the exposure process is performed, and the exposure pattern 72 is formed using the second substrate 7, that is, the glass mask 71, so that the second resin body 32A, the third resin body 33A, and the first resin body 31A. Is transcribed. The second resin body 32A, the third resin body 33A, and the first resin body 31A other than the exposure pattern 72 are exposed to light, and the second resin body 32, the third resin body 33, and the first resin body 31 are exposed. Formed as.

  As shown in FIG. 17, a development process is performed, and the second resin body 32, the third resin body 33, and the portion to which the pattern of the first resin body 31 is transferred (second resin body 32A, third resin The resin body 33 </ b> A and the first resin body 31 </ b> A) are removed, and a through hole 35 is formed in the second resin body 32, the third resin body 33, and the first resin body 31. Unlike the method for manufacturing the power conversion device 1 according to the first embodiment, the through hole 35 is completed at one time.

  Thereafter, by performing the step of forming the through-hole conductors 413 and 423 shown in FIG. 9 and the subsequent steps of the method for manufacturing the power conversion device 1 according to the first embodiment described above, the steps shown in FIG. The power converter device 1 according to the second embodiment as shown in FIG. 3 can be completed.

[Characteristics of power converter]
In the manufacturing method of the power converter device 1 which concerns on 2nd Embodiment, it is the same as the process of forming the 3rd resin body 33 of the resin body 3 with respect to the manufacturing method which concerns on the above-mentioned 1st Embodiment. The second resin body 32 can be formed by the process, and the through holes 35 can be formed at a time, so that the number of manufacturing steps can be reduced and simplified. Therefore, the productivity of the power conversion device 1 can be improved.

  Moreover, the manufacturing method of the power converter device 1 which concerns on 2nd Embodiment is applicable to the manufacturing method of the power converter device 1 which concerns on the above-mentioned 1st Embodiment. That is, the step of forming the third resin body 33 and the second resin body 32 of the method for manufacturing the power conversion device 1 according to the first embodiment is the same as that of the power conversion device 1 according to the second embodiment. Similarly to the step of forming the third resin body 33 and the second resin body 32 in the manufacturing method, the second core 22 and the second core 22 are second when the third resin body 33A is flattened. The third resin body 33A having a constant film thickness is left on the surface 2B of the substrate, and this is used as the second resin body 32, whereby the third resin body 33 and the second resin body 32 are formed in the same process. can do.

(Third embodiment)
3rd Embodiment of this invention demonstrates the example which changed the shape of the 1st core 21 and the 2nd core 22 of the power converter device 1 which concerns on 1st Embodiment.

  In the power conversion device 1 according to the third embodiment, as shown in FIG. 18A, the first surface 21 </ b> B of the first core 21 is viewed from the normal direction when the second surface 2 </ b> B is viewed from the normal direction. And chamfering R1 which draws a circular arc in the corner | angular part of the 1st other end 21b is made. The corners of the second end 22a and the second other end 22b of the second core 22 are also chamfered R1 that draws an arc. The chamfer R1 is a round chamfer. By providing the chamfer R1, the generation of leakage magnetic flux from the corners of the first core 21 and the second core 22 can be reduced, and the power conversion efficiency can be improved.

  Moreover, in the power converter device 1 according to the third embodiment, as shown in FIG. 18B, the first surface of the first core 21 is viewed from the second surface 2 </ b> B in the normal direction. A curved surface R2 is provided on the end surfaces of the one end 21a and the first other end 21b so as to draw an arc and project outward. A curved surface R <b> 2 is also provided on the end surfaces of the second end 22 a and the second other end 22 b of the second core 22 so as to project an arc and project outward. By providing the curved surface R <b> 2, the generation of leakage magnetic flux from the corners of the first core 21 and the second core 22 can be reduced, and the power conversion efficiency can be improved.

  In the power conversion device 1 according to the third embodiment, as shown in FIG. 19A, when the side surface 2C is viewed from the normal direction, the first end 21a of the first core 21 and the first end A chamfer R3 for drawing an arc is formed at the corner of the other end 21b. The corners of the second end 22a and the second other end 22b of the second core 22 are also chamfered R3 that draws an arc. The chamfer R3 is a round chamfer. By providing the chamfer R3, the generation of leakage magnetic flux from the corner of the first core 21 and the corner of the second core 22 can be reduced, and the power conversion efficiency can be improved.

  Moreover, in the power converter device 1 which concerns on 3rd Embodiment, as shown in FIG.19 (B), seeing the side surface 2C from the normal line direction, 1st one end 21a of the 1st core 21, and A curved surface R4 is provided on the end surface of the first other end 21b so as to draw an arc and project outward. A curved surface R4 is also provided on the end surfaces of the second end 22a and the second other end 22b of the second core 22 so as to project an arc and project outward. By providing the curved surface R4, generation of leakage magnetic flux from the corners of the first core 21 and the corners of the second core 22 can be reduced, and the power conversion efficiency can be improved.

  In addition, although not shown, the power conversion device 1 according to the third embodiment further includes a spherical surface projecting outward on the end surfaces of the first end 21a and the first other end 21b of the first core 21. Similarly, a spherical surface projecting outward may be disposed on the end surfaces of the second end 22a and the second other end 22b of the second core 22 as well. By providing a spherical surface, the generation of leakage magnetic flux from the corners of the first core 21 and the corners of the second core 22 can be reduced, and the power conversion efficiency can be improved.

  As described above, in the power conversion device 1 according to the third embodiment, the generation of leakage magnetic flux from the first core 21 and the second core 22 can be reduced. The sizes of the core 21 and the second core 22 can be reduced, and as a result, the size and thickness can be reduced.

(Fourth embodiment)
4th Embodiment of this invention demonstrates the example using the core which makes the closed magnetic circuit generally used in the power converter device 1 which concerns on 1st Embodiment or 2nd Embodiment. Is.

[First configuration of power conversion device (configuration of transformer)]
The power conversion device 1 according to the fourth embodiment is a transformer as shown in FIG. This power converter 1 includes a core 23 that forms a closed magnetic circuit, a primary winding 41 that is spirally wound around a part of the periphery of the core 23 along the closed magnetic path, and another one around the core 23. And a secondary winding 42 spirally wound along the closed magnetic path. Furthermore, the power converter 1 electrically connects the resin body 3 covering the core 23, the electrode pad 41 </ b> P and the secondary side winding 42 which are electrically connected to the primary side winding 41 and disposed on the resin body 3. And electrode pads 42 </ b> P disposed on the resin body 3.

  Similar to the first core 21 and the second core 22 of the power conversion device 1 according to the first embodiment described above, the core 23 is formed by cutting, for example, ferrite as shown in FIG. It is formed. The central portion of the core 23 is cut out using laser processing or sand blast processing.

  The primary winding 41 and the secondary winding 42 are not labeled on the surface of the core 23 via the resin body 3, but are attached to the first conductor and the other surface facing the surface. The second conductor is disposed through the resin body 3 and the through-hole conductor disposed in the resin body 3 along the side surface between the surface and the other surface.

  In the power conversion device 1 according to the fourth embodiment, in addition to the effects obtained by the power conversion device 1 according to the first embodiment described above, the core 23 that forms a closed magnetic circuit is used. Since the magnetic flux is connected along the closed magnetic path, the power conversion efficiency can be improved.

[Second configuration of power conversion device (configuration of transformer)]
The power conversion device 1 according to the fourth embodiment is a transformer as shown in FIG. The power conversion device 1 includes a core 23 forming a closed magnetic circuit, a primary winding 41 wound in a spiral shape around the core 23 along the closed magnetic circuit, and a spiral wound around the core 23 along the closed magnetic circuit. And a secondary side winding 42 disposed between adjacent primary side windings 41 along a closed magnetic path.

  The other configuration is the same as that of the power conversion device 1 according to the fourth embodiment shown in FIG.

[Third Configuration of Power Converter (Configuration of Inductor)]
The power conversion device 1 according to the fourth embodiment is an inductor as shown in FIG. The power conversion device 1 includes a core 23 that forms a closed magnetic circuit, and a winding 4 that is wound around the core 23 in a spiral shape along the closed magnetic circuit. One end and the other end of the winding 4 are connected to the electrode pad 40P.

  The other configuration is the same as that of the power conversion device 1 according to the fourth embodiment shown in FIG.

(Other embodiments)
As described above, the present invention has been described according to the first to fourth embodiments. However, the description and the drawings constituting a part of this disclosure do not limit the present invention. The present invention can be applied to various alternative embodiments, examples, and operational technologies.

It is a principal part expanded sectional view of the power converter device which concerns on the 1st Embodiment of this invention. It is a top view of the power converter device concerning a 1st embodiment. It is a side view of the power converter device concerning a 1st embodiment. It is 1st process sectional drawing explaining the manufacturing method of the power converter device which concerns on 1st Embodiment. It is 2nd process sectional drawing. It is 3rd process sectional drawing. It is a 4th process sectional view. FIG. 10 is a fifth process cross-sectional view. It is 6th process sectional drawing. It is 7th process sectional drawing. It is 8th process sectional drawing. It is 9th process sectional drawing. It is 1st process sectional drawing explaining the manufacturing method of the power converter device which concerns on the 2nd Embodiment of this invention. It is 2nd process sectional drawing. It is 3rd process sectional drawing. It is a 4th process sectional view. FIG. 10 is a fifth process cross-sectional view. (A) is a principal part top view of the core of the power converter device which concerns on the 3rd Embodiment of this invention, (B) is a principal part top view of the core of the power converter device which concerns on a 1st modification. (A) is a principal part top view of the core of the power converter device which concerns on the 2nd modification of 3rd Embodiment, (B) is a principal part top view of the core of the power converter device which concerns on a 4th modification. It is. It is a schematic plan view of the power converter device (transformer) which concerns on the 4th Embodiment of this invention. It is a schematic plan view of the core of the power converter device which concerns on 4th Embodiment. It is a schematic plan view of the power converter device (transformer) which concerns on the 1st modification of the 4th Embodiment of this invention. It is a schematic plan view of the power converter device (inductor) which concerns on the 2nd modification of the 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Power converter 2A ... 1st surface 2B ... 2nd surface 2C ... Side surface 21 ... 1st core 21a ... 1st end 21b ... 1st other end 22 ... 2nd core 22a ... 2nd One end 22b ... second other end 23 ... core 3 ... resin body 31 ... first resin body 32 ... second resin body 33 ... third resin body 35 ... through hole 4 ... winding 41 ... primary side winding 42 ... secondary windings 411, 421 ... first conductors 412, 422 ... second conductors 413, 423 ... through-hole conductors 40P, 41P, 42P ... electrode pads 6 ... first substrate 7 ... first 2 substrate 71... Glass mask 72... Exposure pattern 9 3rd substrate 51, 52.

Claims (11)

Forming a core;
Forming a resin body covering the surface of the core;
Forming a through-hole conductor that penetrates the resin body along the surface in a partial region on the surface of the core;
Forming a conductor that is formed on the resin body and is electrically connected to the connection hole conductor to form a winding in another region of the surface of the core;
The manufacturing method of the power converter device characterized by the above-mentioned. Forming a first core on which a second surface opposite to the first surface is attached on a first substrate and a second core spaced apart from the first core;
Forming a first resin body on the first surface of the first core and the second core;
Removing the first substrate;
Forming a third resin body on a side surface between the first surface and the second surface of the first core and the second core;
Forming a second resin body on the second surface of the first core and the second core;
Forming a through-hole conductor that passes through the first resin body, the second resin body, and the third resin body along the side surfaces of the first core and the second core, respectively; When,
A first conductor electrically connected to one end of the through-hole conductor is formed on the first resin body on the first surface of the first core and the second core. Process,
A second conductor electrically connected to the other end of the through-hole conductor is formed on the second resin body on the second surface of the first core and the second core. Forming a winding with the first conductor, the second conductor, and the through-hole conductor;
The manufacturing method of the power converter device characterized by the above-mentioned.   The step of forming the first core and the second core includes the first core and the second core having an elongated plate shape in which an extension dimension is set larger and a thickness dimension is set smaller than a width dimension. The method for manufacturing a power conversion device according to claim 2, wherein the method is a step of forming a core. The step of forming the first resin body includes:
Forming a second substrate including the first resin body on a glass mask having an exposure pattern in a formation region of the through-hole conductor;
Transferring the first resin body of the second substrate onto the first surface of the first core and the second core;
The manufacturing method of the power converter device of Claim 2 or Claim 3 characterized by the above-mentioned. The step of forming the through hole conductor includes
Forming a through hole in the first resin body, the second resin body, and the third resin body using an exposure pattern of the glass mask of the second substrate;
Forming the through-hole conductor in the through-hole;
The manufacturing method of the power converter device of Claim 4 characterized by the above-mentioned.   The step of forming the through hole conductor is a step of forming the through hole conductor in the through hole by plating, and the step of forming the first conductor is performed by plating on the first resin body. The step of forming the first conductor, and the step of forming the second conductor is a step of forming the second conductor on the second resin body. Item 6. A method for manufacturing the power converter according to Item 5. The step of forming the third resin body includes:
Applying a resin covering the second surface of the first core and the second core;
Flattening the top surface of the applied resin to a level equivalent to the second surface to form the third resin body;
The manufacturing method of the power converter device in any one of Claims 2 thru | or 6 characterized by the above-mentioned. The step of forming the second resin body and the step of forming the third resin body include:
Applying a resin covering the second surface of the first core and the second core;
The applied resin is flattened on the second surface leaving a certain thickness, and the third resin body is formed on the side surfaces of the first core and the second core. Forming the second resin body on the second surface of the first core and the second core;
The manufacturing method of the power converter device of Claim 2 or Claim 3 characterized by the above-mentioned. The step of forming the first resin body includes:
Forming a second substrate comprising the first resin body;
Forming the first resin body of the second substrate on the first surface of the first core and the second core, and
The step of forming the second resin body and the step of forming the third resin body include:
Applying a resin covering the second surface of the first core and the second core;
The applied resin is flattened on the second surface leaving a certain thickness, and the third resin body is formed on the side surfaces of the first core and the second core. Forming the second resin body on the second surface of the first core and the second core, and
The exposure pattern is transferred to either the first resin body or the second resin body using a glass mask having an exposure pattern in the formation region of the through-hole conductor, and the transferred exposure pattern causes the Forming a through hole in the first resin body, the second resin body, and the third resin body;
Forming the through-hole conductor in the through-hole;
The manufacturing method of the power converter device of Claim 2 or Claim 3 characterized by the above-mentioned.   The power conversion device according to any one of claims 1 to 9, further comprising a step of forming a protective film that covers a surface of the winding after the step of forming the winding. Production method. The step of forming the winding comprises:
Each of the first conductor, the through-hole conductor, and the second conductor is electrically connected continuously, and is wound around the first core and the second core, respectively. A primary winding having a spiral shape along its magnetic path;
Between the adjacent primary windings along the magnetic path, the primary windings run side by side, and the first conductor, the through-hole conductor, and the second conductor are continuously connected. Electrically connecting to each other and forming a secondary winding wound around each of the first core and the second core and having a spiral shape along the magnetic path. The method for manufacturing a power conversion device according to any one of claims 2 to 10, wherein:

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