JP2010128676A5 - Touch panel and method for manufacturing touch panel - Google Patents

Touch panel and method for manufacturing touch panel Download PDF

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JP2010128676A5
JP2010128676A5 JP2008301050A JP2008301050A JP2010128676A5 JP 2010128676 A5 JP2010128676 A5 JP 2010128676A5 JP 2008301050 A JP2008301050 A JP 2008301050A JP 2008301050 A JP2008301050 A JP 2008301050A JP 2010128676 A5 JP2010128676 A5 JP 2010128676A5
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electrode
touch panel
transparent conductive
conductive layer
peripheral wiring
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JP5133222B2 (en
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本実施例のタッチパネル400の金属膜成膜時の概略図を図10、図11に示す。
スパッタ法を用いてガラス基板上全面に、第1のITO膜を15nm成膜する。次に、ITO付ガラス基板5に、厚さ0.1mm程度のステンレス板60を、表面に接触しないように重ねる。図11に示すように、このステンレス板60には、タッチパネル周辺の配線6を形成する部分に対応した開口61があいており、金属膜成膜時のスパッタマスクとして機能する。スパッタマスクとして機能するステンレス板60越しに、銀合金を200nm成膜する。
これにより、図10に示すように、銀合金の成膜終了後、前記ガラス基板表面には全面のITO膜14の上に配線形成領域のみに銀合金膜15を成膜した状態となる。
次に、本実施例のタッチパネル400の製造方法を図12から図20を用いて説明する。
始めに、図12、図13を用いて第1の工程を説明する。図12に示すように、ガラス基板5上に、ITO膜を15nm成膜する。続いて、スパッタマスクとして機能するステンレス板60を用い、図13に示すように、配線形成予定の部分のみに銀合金膜15を200nm成膜する。
Schematic diagrams at the time of forming a metal film of the touch panel 400 of this embodiment are shown in FIGS.
A first ITO film having a thickness of 15 nm is formed on the entire surface of the glass substrate by sputtering. Next, a stainless steel plate 60 having a thickness of about 0.1 mm is stacked on the glass substrate 5 with ITO so as not to contact the surface. As shown in FIG. 11, the stainless steel plate 60 has an opening 61 corresponding to a portion where the wiring 6 around the touch panel is formed, and functions as a sputter mask at the time of forming the metal film. A silver alloy film is formed to a thickness of 200 nm over the stainless steel plate 60 functioning as a sputtering mask.
As a result, as shown in FIG. 10, after completion of the film formation of the silver alloy, the silver alloy film 15 is formed only on the wiring formation region on the ITO film 14 on the entire surface of the glass substrate.
Next, a method for manufacturing the touch panel 400 of this embodiment will be described with reference to FIGS.
First, a 1st process is demonstrated using FIG. 12, FIG. As shown in FIG. 12, an ITO film having a thickness of 15 nm is formed on the glass substrate 5. Subsequently, using a stainless plate 60 functioning as a sputtering mask, as shown in FIG. 13, a silver alloy film 15 is formed in a thickness of 200 nm only on a portion where wiring is to be formed.

Claims (13)

静電容量結合方式のタッチパネルを備え
前記静電容量結合方式のタッチパネルは、複数のX電極と、
前記X電極と交差する複数のY電極と、
前記X電極の両端と前記Y電極の両端から信号を供給する周辺配線とを有し、
前記X電極とY電極とは、互いに重なり合う交差部と、2つの交差部間に形成された電極部とを有し、
前記周辺配線は、前記タッチパネルの入力領域の周囲に形成され、
前記周辺配線は、透明導電層と、
前記透明導電層上に形成される金属層とで形成され、
前記周辺配線の前記透明導電層の幅をW1、前記金属層の幅をW2とするとき、W1はW2以下であることを特徴とするタッチパネル
It has a capacitively coupled touch panel ,
The capacitively coupled touch panel includes a plurality of X electrodes,
A plurality of Y electrodes crossing the X electrode;
Peripheral wiring for supplying signals from both ends of the X electrode and both ends of the Y electrode;
The X electrode and the Y electrode have an intersecting portion overlapping each other and an electrode portion formed between the two intersecting portions,
The peripheral wiring is formed around the input area of the touch panel ,
The peripheral wiring includes a transparent conductive layer,
Formed with a metal layer formed on the transparent conductive layer,
The touch panel according to claim 1, wherein when the width of the transparent conductive layer of the peripheral wiring is W1 and the width of the metal layer is W2, W1 is W2 or less.
前記静電容量結合方式のタッチパネルは、裏面に形成された裏面電極と、
前記周辺配線と接続部で接続されるフレキシブル基板とを有し、
前記静電容量結合方式のタッチパネルの前面で前記接続部に隣接し、かつ周辺配線の外側に裏面接続用端子を形成し、
前記裏面接続用端子と前記裏面電極とを導電部材で接続したことを特徴とする請求項1に記載のタッチパネル
The capacitively coupled touch panel has a back electrode formed on the back surface,
A flexible substrate connected to the peripheral wiring and a connection portion;
Forming a back surface connection terminal adjacent to the connection portion on the front surface of the capacitive coupling type touch panel, and outside the peripheral wiring;
The touch panel according to claim 1, wherein the back surface connection terminal and the back surface electrode are connected by a conductive member.
前記裏面電極に接続される導電部材を導電テープで形成したことを特徴とする請求項2に記載のタッチパネルThe touch panel according to claim 2, wherein the conductive member connected to the back electrode is formed of a conductive tape. 前記導電部材と前記裏面接続用端子とは異方性導電膜で接続されることを特徴とする請求項2に記載のタッチパネルThe touch panel according to claim 2, wherein the conductive member and the back surface connection terminal are connected by an anisotropic conductive film. 前記裏面電極を透明導電膜で形成することを特徴とする請求項2に記載のタッチパネルThe touch panel according to claim 2, wherein the back electrode is formed of a transparent conductive film. 前記Y電極の電極部の面積は前記X電極の電極部の面積よりも小さく、前記X電極またはY電極の電極部に近接してダミー電極が形成されたことを特徴とする請求項1に記載のタッチパネルThe area of the electrode part of the Y electrode is smaller than the area of the electrode part of the X electrode, and a dummy electrode is formed in the vicinity of the electrode part of the X electrode or the Y electrode. Touch panel . 前記X電極の電極部と、前記Y電極の電極部とは、同層に形成されることを特徴とする請求項1に記載のタッチパネルThe touch panel according to claim 1, wherein the electrode part of the X electrode and the electrode part of the Y electrode are formed in the same layer. 前記静電容量結合方式のタッチパネルに重ねて配置された前面パネルを備えることを特徴とする請求項1に記載のタッチパネルThe touch panel according to claim 1, further comprising a front panel disposed on the capacitively coupled touch panel . 前記前面パネルに凹部を形成して、前記凹部に前記静電容量結合方式のタッチパネルを収納することを特徴とする請求項8に記載のタッチパネル The touch panel of claim 8, wherein the front panel to form a recess, characterized in that for accommodating the touch panel of the capacitive coupling type in the recess. 前記タッチパネルは、長辺と短辺とを有し、
前記Y電極は、前記長辺に沿って形成され、
前記X電極は前記短辺に沿って形成されることを特徴とする請求項1に記載のタッチパネル
The touch panel has a long side and a short side,
The Y electrode is formed along the long side,
The touch panel as set forth in claim 1, wherein the X electrode is formed along the short side.
静電容量結合方式のタッチパネルを備え、
前記静電容量結合方式のタッチパネルは、複数のX電極と、
前記X電極と交差する複数のY電極と、
前記X電極の両端と前記Y電極の両端から信号を供給する周辺配線とを有し、
前記周辺配線は、前記タッチパネルの入力領域の周囲に形成され、
前記周辺配線は、透明導電層と、
前記透明導電層上に形成される金属層とで形成されるタッチパネルの製造方法であって、
板の第1主面上の全面に透明導電層を形成する工程1と、
前記透明導電層上に選択的に金属膜を形成する工程2と、
前記金属膜と前記金属膜が形成されていない部分の前記透明導電層上に、前記周辺配線、前記X電極および前記Y電極のパターン状にホトレジスト膜を形成する工程3と、
前記ホトレジスト膜をマスクにして前記金属膜をエッチングする工程4と、
前記工程4に続いて、前記ホトレジスト膜をマスクにして前記透明導電層をエッチングする工程5とを有することを特徴とするタッチパネルの製造方法。
It has a capacitively coupled touch panel,
The capacitively coupled touch panel includes a plurality of X electrodes,
A plurality of Y electrodes crossing the X electrode;
Peripheral wiring for supplying signals from both ends of the X electrode and both ends of the Y electrode;
The peripheral wiring is formed around the input area of the touch panel,
The peripheral wiring includes a transparent conductive layer,
It is a manufacturing method of a touch panel formed with a metal layer formed on the transparent conductive layer,
Step 1 of forming a transparent conductive layer over the entire surface of the first main surface of the board,
Step 2 of selectively forming a metal film on the transparent conductive layer;
Forming a photoresist film in a pattern of the peripheral wiring, the X electrode and the Y electrode on the transparent conductive layer in a portion where the metal film and the metal film are not formed; and
Etching the metal film using the photoresist film as a mask; and
Subsequent to the step 4, the step 5 of etching the transparent conductive layer using the photoresist film as a mask includes a touch panel manufacturing method.
前記透明導電層は、ITOであり、
前記金属膜は、銀合金膜であることを特徴とする請求項11に記載のタッチパネルの製造方法。
The transparent conductive layer is ITO,
The method for manufacturing a touch panel according to claim 11, wherein the metal film is a silver alloy film.
前記静電容量結合方式のタッチパネルは、裏面に形成された裏面電極を有し、
前記工程5の後に、基板の第1主面と反対側に第2主面上の全面に透明導電層から成る裏面導電膜を形成する工程を有することを特徴とする請求項11に記載のタッチパネルの製造方法。
The capacitively coupled touch panel has a back electrode formed on the back surface,
12. The touch panel according to claim 11, further comprising a step of forming a back conductive film made of a transparent conductive layer on the entire surface on the second main surface on the opposite side of the first main surface of the substrate after the step 5. Manufacturing method.
JP2008301050A 2008-11-26 2008-11-26 Manufacturing method of touch panel Active JP5133222B2 (en)

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