JP2010128676A5 - Touch panel and method for manufacturing touch panel - Google Patents

Description

Schematic diagrams at the time of forming a metal film of the touch panel 400 of this embodiment are shown in FIGS.
A first ITO film having a thickness of 15 nm is formed on the entire surface of the glass substrate by sputtering. Next, a stainless steel plate 60 having a thickness of about 0.1 mm is stacked on the glass substrate 5 with ITO so as not to contact the surface. As shown in FIG. 11, the stainless steel plate 60 has an opening 61 corresponding to a portion where the wiring 6 around the touch panel is formed, and functions as a sputter mask at the time of forming the metal film. A silver alloy film is formed to a thickness of 200 nm over the stainless steel plate 60 functioning as a sputtering mask.
As a result, as shown in FIG. 10, after completion of the film formation of the silver alloy, the silver alloy film 15 is formed only on the wiring formation region on the ITO film 14 on the entire surface of the glass substrate.
Next, a method for manufacturing the touch panel 400 of this embodiment will be described with reference to FIGS.
First, a 1st process is demonstrated using FIG. 12, FIG. As shown in FIG. 12, an ITO film having a thickness of 15 nm is formed on the glass substrate 5. Subsequently, using a stainless plate 60 functioning as a sputtering mask, as shown in FIG. 13, a silver alloy film 15 is formed in a thickness of 200 nm only on a portion where wiring is to be formed.

Claims (13)

It has a capacitively coupled touch panel ,
The capacitively coupled touch panel includes a plurality of X electrodes,
A plurality of Y electrodes crossing the X electrode;
Peripheral wiring for supplying signals from both ends of the X electrode and both ends of the Y electrode;
The X electrode and the Y electrode have an intersecting portion overlapping each other and an electrode portion formed between the two intersecting portions,
The peripheral wiring is formed around the input area of the touch panel ,
The peripheral wiring includes a transparent conductive layer,
Formed with a metal layer formed on the transparent conductive layer,
The touch panel according to claim 1, wherein when the width of the transparent conductive layer of the peripheral wiring is W1 and the width of the metal layer is W2, W1 is W2 or less. The capacitively coupled touch panel has a back electrode formed on the back surface,
A flexible substrate connected to the peripheral wiring and a connection portion;
Forming a back surface connection terminal adjacent to the connection portion on the front surface of the capacitive coupling type touch panel, and outside the peripheral wiring;
The touch panel according to claim 1, wherein the back surface connection terminal and the back surface electrode are connected by a conductive member. The touch panel according to claim 2, wherein the conductive member connected to the back electrode is formed of a conductive tape. The touch panel according to claim 2, wherein the conductive member and the back surface connection terminal are connected by an anisotropic conductive film. The touch panel according to claim 2, wherein the back electrode is formed of a transparent conductive film. The area of the electrode part of the Y electrode is smaller than the area of the electrode part of the X electrode, and a dummy electrode is formed in the vicinity of the electrode part of the X electrode or the Y electrode. Touch panel . The touch panel according to claim 1, wherein the electrode part of the X electrode and the electrode part of the Y electrode are formed in the same layer. The touch panel according to claim 1, further comprising a front panel disposed on the capacitively coupled touch panel . The touch panel of claim 8, wherein the front panel to form a recess, characterized in that for accommodating the touch panel of the capacitive coupling type in the recess. The touch panel has a long side and a short side,
The Y electrode is formed along the long side,
The touch panel as set forth in claim 1, wherein the X electrode is formed along the short side. It has a capacitively coupled touch panel,
The capacitively coupled touch panel includes a plurality of X electrodes,
A plurality of Y electrodes crossing the X electrode;
Peripheral wiring for supplying signals from both ends of the X electrode and both ends of the Y electrode;
The peripheral wiring is formed around the input area of the touch panel,
The peripheral wiring includes a transparent conductive layer,
It is a manufacturing method of a touch panel formed with a metal layer formed on the transparent conductive layer,
Step 1 of forming a transparent conductive layer over the entire surface of the first main surface of the board,
Step 2 of selectively forming a metal film on the transparent conductive layer;
Forming a photoresist film in a pattern of the peripheral wiring, the X electrode and the Y electrode on the transparent conductive layer in a portion where the metal film and the metal film are not formed; and
Etching the metal film using the photoresist film as a mask; and
Subsequent to the step 4, the step 5 of etching the transparent conductive layer using the photoresist film as a mask includes a touch panel manufacturing method. The transparent conductive layer is ITO,
The method for manufacturing a touch panel according to claim 11, wherein the metal film is a silver alloy film. The capacitively coupled touch panel has a back electrode formed on the back surface,
12. The touch panel according to claim 11, further comprising a step of forming a back conductive film made of a transparent conductive layer on the entire surface on the second main surface on the opposite side of the first main surface of the substrate after the step 5. Manufacturing method.