JP2010118369A - Columnar component for multilayer printed circuit board, method of manufacturing the same, and electronic component module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component enabling a user to freely design a space between printed circuit boards arranged up and down, and having a function of firmly supporting the boards to each other and electrically connecting them. <P>SOLUTION: The columnar component 10 for a multilayer printed circuit board includes a support 1 made of an insulating resin and one or more through-holes 2 penetrating in a connection direction. The component has two printed circuit boards wherein surfaces with wiring and electronic components are opposite to each other, and the function for electrically connecting the printed circuit boards. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer printed wiring board pillar component and an electronic component module incorporating the component, and more particularly to a multilayer printed wiring having a function of supporting and electrically connecting between printed wiring boards arranged vertically opposite to each other. The present invention relates to a board pillar component, a manufacturing method thereof, and an electronic component module incorporating the multilayer printed wiring board pillar component.

In recent years, with the demand for higher performance and smaller size of electronic devices, a large number of multilayer printed wiring boards on which electronic components such as integrated circuits, resistors, and capacitors are mounted have been produced.
In such a multilayer printed wiring board, a structure for electrically connecting each board is required, and conventionally, an interlayer connection structure such as a through hole or an inner via has been known.

  For example, Patent Document 1 discloses a technique for providing a multilayer substrate by using a circuit board connecting material. A technique for achieving high integration by electrically connecting such circuit board connecting materials by an inner via made of a laminated conductive paste is disclosed.

Patent Document 2 discloses a technology for mounting an electronic component package fixed between substrates as an electronic component mounting body capable of high density and high functionality, and electrically connecting each substrate by an inner via. Yes.
In addition, a technique for connecting each substrate with a connector integrally formed with the substrate is also known.

  However, in order to laminate the multilayer substrate with vias, a high level technique such as a build-up method is required, and there is a problem that the manufacturing cost increases. In addition, the degree of freedom in layout design such as the space for mounting electronic components has been limited.

Further, the connector connection technology has a problem that the connector portion is disconnected during operation due to the difference in thermal expansion coefficient of each material.
JP-A-7-147464 JP 2004-363666 A

An object of the present invention is to provide a component for arranging a printed wiring board so as to be opposed to each other in the vertical direction and increasing the mounting area of the electronic component.
It is another object of the present invention to provide a component that can freely design an interval between printed wiring boards arranged above and below, firmly supports the boards, and has an electrical connection function.
Further, it is an object to produce a pillar component having a pin number and a shape suitable for a mounted product by a simple manufacturing method and at a low cost.

The present invention employs the following configuration in order to solve the above problems.
(1) The present invention provides a multi-layer printed circuit board pillar component which is disposed between two printed circuit boards whose surfaces having wirings are opposed to each other, and which supports and electrically connects the boards. A multilayer printed wiring board pillar component characterized in that the wiring board pillar component comprises a support portion made of an insulating resin and a through hole in which one or more conductors penetrating in the connecting direction are formed.

(2) The multilayer printed wiring board pillar component described in (1) above, wherein convex electrodes are formed at both ends of the through hole in the multilayer printed wiring board pillar component.
(3) A pillar component for a multilayer printed wiring board according to claim 1 or 2, wherein a conductor is formed on the inner peripheral surface of the through hole, and the center of the through hole has a hollow portion in the axial direction. is there.

(4) The pillar component for a multilayer printed wiring board according to (3), wherein the hollow portion is filled with a conductor and a non-conductor paste.
(5) It is described in any one of the above (1) to (4), which has a function of electrically connecting two printed wiring boards whose surfaces having wiring and electronic components face each other and the printed wiring board And a multilayer printed wiring board pillar component.
(6) The two printed wiring boards are formed in the same shape, and the multilayer printed wiring board column parts are arranged at at least four corners of the opposing printed wiring boards. It is the electronic component mounting body described in (1).

(7) After forming two or more through holes in the printed wiring board, covering at least the peripheral surface of each through hole with a conductive material, and then cutting one or more portions formed with the insulating resin A method of manufacturing a pillar component for a multilayer printed wiring board, characterized in that the component is separated into components having a through hole.
(8) The method of manufacturing a pillar component for a multilayer printed wiring board according to (7), wherein the component having the through hole divided into pieces has the same shape.
(9) In the method of manufacturing a pillar component for a multilayer printed wiring board according to (7) or (8), the cutting step is performed after a dicing sheet is attached to one surface of the substrate. is there.

The present invention has an effect of providing a component for arranging a printed wiring board so as to be opposed to each other in the vertical direction and increasing a mounting area of the electronic component.
Moreover, the space | interval between the printed wiring boards arrange | positioned up and down can be designed freely, and there exists an effect of providing the components which have a function which supports a board | substrate firmly and is connected electrically.
Furthermore, it is possible to produce a pillar component having a pin number and a shape suitable for a mounted product by a simple manufacturing method and at a low cost.

Hereinafter, an example of an embodiment according to the present invention will be described with reference to the drawings.
FIG. 1 is an example of a pillar component for a multilayer printed wiring board according to the present embodiment. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along the line BB.

As shown in FIG. 1, a multilayer printed wiring board column component 10 according to this embodiment includes a support portion 1 made of an insulating resin and a through hole 2 in which one or more conductors penetrating in the connecting direction are formed. Has been.
Here, the through hole 2 is formed by a method such as laser via, photo via, or punching. Laser vias are preferred for manufacturing small hole diameters.

The diameter of the through hole is preferably 10 to 1000 μm. More preferably 50 to 500
μm is preferred. This is because by setting the diameter of the through hole within such a range, sufficient reliability can be obtained in the electrical connection between the printed circuit boards facing each other.
Here, examples of the insulating resin forming the support 1 include epoxy resin, paper, phenol, polyimide, ceramic, glass, and silicon. This is because the support portion can be manufactured with such an insulating resin at low cost and the processing is easy.

Next, the conductor 5 formed on the inner peripheral surface of the through hole 2 includes copper.
Such a conductor may be formed only on the inner peripheral surface of the through hole 2 or may be filled in the entire through hole. Alternatively, a conductor may be formed only on the inner peripheral surface of the through hole 2, and the remaining cavity 2 may be filled with another member such as a conductive paste or a non-conductive paste.

The peripheral surfaces of the openings in the through holes forming the through holes 2 at both ends of the through holes 2 are preferably covered with a conductive material such as a copper foil laminate.
Further, convex electrodes 3 may be formed at both ends of the through hole in the multilayer printed wiring board column part.

  The convex electrode 3 preferably has a top height from the end face of the column part of 10 to 100 μm, a diameter of 100 to 2000 μm, and a pitch of 150 to 2540 μm. This is because a sufficient electrical connection can be obtained within such a range, and the number of pins suitable for the mounted product can be ensured. The material of the convex electrode 3 is preferably a metal, and preferably has a solder layer on the surface of the metal.

FIG. 2 is a front conceptual view showing the electronic component mounting body according to the present embodiment.
As shown in FIG. 2, in the electronic component mounting body 20 according to this embodiment, two printed wiring boards 12 and 12 on which wiring and the electronic component 11 are mounted face each other on the surface on which the electronic component 11 and the like are mounted. It is formed as follows.

Here, the electronic component mounting body 20 is a structure in which one or more electronic components are connected on a substrate by wiring. The electronic component 11 refers to an active element such as a semiconductor element or a crystal resonator, or a passive element such as a resistor, a capacitor, or a coil.
The printed wiring boards 12 and 12 are supported by multilayer printed wiring board column parts 14 and 14. Such multilayer printed wiring board column parts 14 and 14 can firmly support the printed wiring boards 12 and 12 and also have a function of electrically connecting circuits on the board. .
The electronic component mounting body according to the present embodiment may be used only for one or a part of the multilayer printed wiring board. Further, the electronic component mounting body according to the present embodiment may be laminated.

Here, examples of the printed wiring board 12 include a rigid board, a flexible board, and a rigid flexible board.
Examples of the rigid substrate include a paper phenol substrate, a paper epoxy substrate, a glass epoxy substrate, a Teflon (registered trademark) substrate, a composite substrate, an alumina substrate, and the like. A paper phenol substrate is preferable from the viewpoint of production cost and processability.

In the manufacturing process of the printed wiring board, a mounting technique such as an etching resist or a solder resist can be used.
The wiring pattern may be formed only on one side of the printed wiring board or on both sides. Such a pattern can employ a subtractive method, an additive method, or the like. The subtractive method is a method in which an unnecessary portion is removed from a copper foil substrate applied on the entire surface to leave a circuit. In this method, a portion left as wiring is masked with a corrosion-resistant film by silk screen printing or the like, and a pattern is formed by etching. At this time, a substrate coated with a photoresist may be used instead of masking.

The additive method is a method of later forming a wiring pattern on an insulating substrate. A wiring pattern can be formed by forming a resist in a portion where a wiring pattern is not desired to be formed, and performing electrolytic or electroless plating on a portion without the resist.
In addition, since the multilayer printed wiring board column parts 14 and 14 can be appropriately disposed on the printed wiring boards 12 and 12, the mounting area of the electronic parts can be designed to be enlarged.
Next, an embodiment of a method for manufacturing a multilayer printed wiring board column part according to the present invention will be described.

  FIG. 3 is a plan view showing two types of examples of the method for manufacturing a multilayer printed wiring board column part according to the present embodiment. FIG. 3A is a diagram showing a method for manufacturing a terminal 2 × 2 PIN type multilayer printed wiring board pillar component, and FIG. 3B is a diagram showing a method for manufacturing a terminal 3 × 3 PIN type multilayer printed wiring board pillar component. It is.

First, after the insulating resin is formed on the substrate 30, 100 through holes 31, 31. . . To drill. The through hole 31 can be appropriately designed according to a desired column part.
Thereafter, at least the peripheral surface of each through hole is covered with the conductive material 32. And the part shape | molded with the said insulating resin is cut | disconnected as shown by the dotted line of FIG.

In FIG. 3 (a), in order to obtain a 2 × 2 PIN type multilayer printed wiring board pillar component, cutting lines are inserted at two locations and separated into 2 × 2 PINs. In FIG. 3B, in order to obtain a 3 × 3 PIN type multilayer printed wiring board pillar component, cutting lines are made at every three positions. The cut portion can be put into a desired number of pins and shape. For example, the separated multilayer printed wiring board column parts may have the same shape or different shapes.
The cutting line may be cut by NC drill or V-cut between the substrates and separated and separated into individual pieces after completion.

In addition, a dicing sheet may be attached to one surface of the substrate before entering the cutting line. Before the singulation process, a dicing sheet is attached to one side of the board, and a cutting line is put on the opposite side to which the dicing sheet is attached, thereby dispersing the scattered pillar components for the multilayer printed wiring board. Can be deterred.
By adopting such a manufacturing method, it is possible to produce a pillar component having a pin number and a shape suitable for a mounted product by a simple manufacturing method and at a low cost.

After preparing a substrate molded with epoxy resin, a number of through holes are drilled in the substrate surface as shown in FIG. Thereafter, at least the peripheral surface of each through hole was coated with copper plating, and then the periphery of the opening of each through hole was coated with a copper foil laminate.
Thereafter, the substrate was cut as shown in FIG. 3A to obtain individual terminal 2 × 2 PIN type pillar parts for a multilayer printed wiring board.

Next, as shown in FIG. 2, a multilayer printed wiring board module was prepared in which the multilayer printed wiring board pillar components were arranged at predetermined positions on the opposing printed wiring boards.
Four types (A to D) of multilayer printed wiring board modules shown in FIG. 4A are changed while changing the arrangement position of the multilayer printed wiring board pillar parts (hereinafter referred to as “pillar parts”) on the printed wiring board. Manufactured.

That is, as shown in FIG. 4B, in the multilayer printed wiring board module A, the pillar parts A1, A2, A3, A4 are arranged at the four corners of the board. In module B, pillar parts B1, B2, B3, and B4 are arranged in the center of the substrate. In the module C, pillar components C1, C2, C3, and C4 are disposed at the four corners of the substrate, and pillar components C5, C6, C7, and C8 are disposed at the center of the substrate. In the module D, D1 to D16 are arranged at regular intervals on the outer periphery of the substrate. FIG. 4A is a perspective view showing the arrangement of the multilayer printed wiring board modules A to D. FIG.
The multilayer printed wiring board modules A to D manufactured as described above were manufactured in the same manner to prepare four sets of W, X, Y, and Z substrates.

  As shown in FIG. 5, the substrates W, X, Y, and Z were fixed to the surface of the shaker 50 (908-FN) with screws (total of four corners and the center). The substrates W and X are tests that mainly measure vibration in the Z direction, and the substrates Y and Z are tests that mainly measure vibration in the X direction. In this state, the vibration tester (F1000-AM-E04) was used to vibrate the shaker 50 up and down to measure the strength of the column parts. The conditions of the vibration test are shown below.

(1) Condition 1
・ Frequency range: 20-2000Hz
・ 20-80Hz: Displacement control Amplitude 1.5mm
・ 80-2000Hz: Acceleration control Acceleration 20G
・ Time: Repeated 4 times while sweeping 20Hz-2000Hz-20Hz in 4 minutes
Return (16 minutes total).

(2) Condition 2
・ Frequency range: 10 to 1000 Hz
・ 10-70Hz: Displacement control Amplitude 1.0mm
70-1000Hz: acceleration control acceleration 10G
・ Time: Repeated 4 times while sweeping 10Hz-1000Hz-10Hz in 4 minutes
Return (16 minutes total).

(3) Condition 3
・ Frequency range: 20-2000Hz
・ 20-80Hz: Displacement control Amplitude 2.0mm
・ 80-2000Hz: Acceleration control Acceleration 40G
・ Time: Repeated 4 times while sweeping 20Hz-2000Hz-20Hz in 4 minutes
Return (16 minutes total).
The results of a vibration test under the above conditions are shown in the following table. In the test, two types of weights (1 g, 3.75 g) were attached to the upper substrate side in order to assume component mounting.
Locations where mounting defects occurred after the test are indicated by x. In the table, “upper” of the substrate indicates a junction between the upper substrate and the column component, and “lower” indicates a junction between the lower substrate and the column component.

As shown in Table 1 above, under Condition 1, poor conduction was observed because the lower substrate and the column part were separated from each other in C2 of FIG.
As shown in Table 2 above, in Condition 2, poor conduction was observed because the lower substrate and the column part were separated from each other in C3 of FIG.
As shown in Table 3 above, under condition 3, dropout was observed in the multilayer printed wiring board module A of FIG. 4, and conduction failure was observed in C4.

It is an example of the pillar component for multilayer printed wiring boards which concerns on this embodiment. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along the line BB. It is a front conceptual diagram which shows the electronic component mounting body which concerns on this embodiment. It is the top view which showed two types of illustrations of the manufacturing method of the multilayer printed wiring board pillar component which concerns on this embodiment. It is a figure which shows arrangement | positioning of the electronic component module used by the vibration test in an Example. 4A is a perspective view, and FIG. 4B is a plan view. It is a perspective view which shows the state mounted in the vibration exciter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support part 2 Through-hole 3 Convex electrode 5 Conductor 10,14 Pillar part for multilayer printed wiring boards 11 Electronic component 12 Printed wiring board 20 Electronic component mounting body

Claims (9)

A multilayer printed wiring board pillar component that is disposed between two printed wiring boards facing each other and that supports and electrically connects the boards, and the multilayer printed wiring board pillar component is insulated. A pillar part for a multilayer printed wiring board, comprising: a support portion made of a conductive resin; and one or more through holes penetrating in a connecting direction. 2. The multilayer printed wiring board pillar component according to claim 1, wherein convex electrodes are formed at both ends of the through hole in the multilayer printed wiring board pillar component. 3. The multilayer printed wiring board pillar component according to claim 1, wherein a conductor is formed on an inner peripheral surface of the through hole, and a center of the through hole has a hollow portion in an axial direction. The pillar part for a multilayer printed wiring board according to claim 3, wherein the hollow portion is filled with a conductor and a non-conductor paste. 5. The multilayer printed wiring board according to claim 1, which has a function of electrically connecting two printed wiring boards whose surfaces having wiring and electronic components face each other and the printed wiring board. An electronic component module comprising a pillar component. The two printed wiring boards are formed in the same shape, and the multilayer printed wiring board column parts are arranged in at least four corners of the opposing printed wiring boards. Electronic component module. After drilling two or more through holes in the printed circuit board, coating at least the peripheral surface of each through hole with a conductive material, and then cutting one or more through holes by cutting the portion formed with the insulating resin A method of manufacturing a pillar component for a multilayer printed wiring board, wherein the component is divided into individual parts. The method of manufacturing a multilayer printed wiring board column part according to claim 7, wherein the parts having the separated through holes have the same shape. The method for manufacturing a pillar component for a multilayer printed wiring board according to claim 7 or 8, wherein, in the cutting step, cutting is performed after a dicing sheet is attached to one surface of the substrate.