JP2010114309A - Flux transfer head, and flux transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flux transfer head whose pins can be made compact. <P>SOLUTION: The flux transfer head includes a plurality of pins 11 and a support portion 12 for supporting the respective pins 11, and is configured to transfer flux stuck on tips 11a of the pins 11 to an object of transfer. Each of the pins 11 has its center portion 11c composed of a rod type member formed to elastically buckle, and the support portion 12 includes a tip-side support portion 31 having a tip-side insertion hole 41 into which the side of a tip portion 11a of a pin 11 is inserted and a base-side support portion 32 where the side of a base portion 11b of the pin 11 is fixed, wherein the center portion 11c can support the pin 11 in a state of capable of elastically buckling. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention includes a flux transfer head that includes a plurality of pins and a support portion that supports each pin, and is configured to be able to transfer the flux adhered to the tip portion of the pins to a transfer target, and the flux transfer head. The present invention relates to a flux transfer device.

As this type of flux transfer head, a flux transfer mechanism disclosed in Japanese Patent No. 3960585 is known. This flux transfer mechanism includes a plurality of transfer pins and a housing that supports each transfer pin, and moves the housing relative to the workpiece (transfer target object) in a direction close to the workpiece to bring the transfer pin into contact with the workpiece. Thus, the flux can be transferred to the workpiece. In this case, the transfer pin includes a transfer plunger, a coil spring as a buffer member, and a cylindrical barrel that houses the coil spring. In this flux transfer mechanism, each transfer pin is individually provided with a coil spring as a buffer member. Therefore, even if there are irregularities on the surface of the workpiece or when the workpiece is not arranged in parallel, each transfer pin Each transfer pin can be reliably brought into contact with the workpiece while preventing a part of the pin from being excessively pressed against the workpiece. Therefore, in this flux transfer mechanism, it is possible to transfer the flux to a predetermined position of the workpiece while suppressing damage to the workpiece and the transfer pin.
Japanese Patent No. 3960585 (page 3-5, Fig. 1-2)

  However, the conventional flux transfer mechanism has the following problems. That is, in this flux transfer mechanism, each transfer pin includes a transfer plunger, a coil spring, and a cylindrical barrel. In this case, since the pitch of the conductor pattern of the circuit board as the transfer object is narrow, the transfer pin is configured to be small. For this reason, in order to manufacture a transfer pin having a complicated configuration as described above, a highly accurate processing technique is required. On the other hand, with the recent increase in the density of circuit boards, the pitch of conductor patterns on circuit boards has been reduced. For this reason, the transfer pin in the above-described flux transfer mechanism is also required to be further miniaturized in accordance with the narrow pitch of the conductor pattern. However, since the transfer pin in this flux transfer mechanism has a complicated configuration as described above, there is a limit to downsizing. Therefore, the conventional flux transfer mechanism has a problem that it is difficult to cope with a narrow pitch of the conductor pattern.

  The present invention has been made in view of such a problem to be solved, and a main object of the present invention is to provide a flux transfer head and a flux transfer apparatus capable of realizing downsizing of a pin.

  In order to achieve the above object, the flux transfer head according to claim 1 includes a plurality of pins and a support portion that supports each pin, and can transfer the flux adhered to the tip portion of the pins to a transfer object. The pin is composed of a rod-shaped member whose central part is formed so as to be elastically buckled, and the support part is a tip part side through which the tip part side of the pin is inserted. Provided with a distal end side support portion in which an insertion hole is formed and a proximal end side support portion for fixing the proximal end portion side of the pin, the pin can be supported in a state where the central portion can be elastically buckled. It is configured.

  The flux transfer head according to claim 2 is the flux transfer head according to claim 1, wherein a holding portion for holding the attached flux is formed at the tip portion of the pin. Is constituted by any one of a concave portion, a small diameter portion and a linear portion.

  The flux transfer head according to claim 3 is the flux transfer head according to claim 1 or 2, wherein the base end side support portion is inserted into the base end portion side of the pin. A first support plate formed with an insertion hole, and a second support plate formed with a second base end side insertion hole through which the base end side is inserted, the first support plate and the first support plate Either one of the two support plates includes a first position where the central axes of the first base end side insertion hole and the second base end side insertion hole are in a coaxial state, and the two central axes are misaligned. It is configured to be slidable with respect to either one of the two support plates between the second position that is in a state of being performed.

  According to a fourth aspect of the present invention, there is provided a flux transfer apparatus according to any one of the first to third aspects, a moving mechanism for moving the flux transfer head, and a tip of the pin in the flux transfer head. A control unit that moves the flux transfer head by controlling the moving mechanism to an attachment position for attaching the flux and a transfer position for transferring the flux attached to the tip of the pin to a transfer target body; .

  In the flux transfer head according to claim 1 and the flux transfer apparatus according to claim 4, the pin is composed of a rod-like member whose central portion can be elastically buckled. That is, in the flux transfer head and the flux transfer apparatus, the pins are simply configured without providing a coil spring or the like. Therefore, according to the flux transfer head and the flux transfer device, the pins can be sufficiently miniaturized. As a result, even when the pitch of the transfer portion of the circuit board as the transfer object is narrow, the transfer is possible. The pitch between the pins can be sufficiently narrowed according to the pitch of the part. Further, in the flux transfer head and the flux transfer apparatus, the support portion is configured to be able to support the pin in a state where the central portion can be elastically buckled. For this reason, according to the flux transfer head and the flux transfer device, when the tip of each pin is pressed against the transfer site, each tip moves toward the base end side support portion of the support portion. By buckling the central part of each pin, the tip can be reliably brought into contact with each transfer site by the elastic force resulting from the buckling, so that the flux can be reliably transferred to each transfer site. it can. In addition, according to the flux transfer head and the flux transfer device, when the tip of each pin is pressed against the transfer site by slightly elastically buckling the center of each pin in advance, Since the central portion is elastically buckled smoothly and the amount of buckling (bending amount) is increased, each tip portion of each pin can be smoothly moved to the base end side support portion side.

  Further, according to the flux transfer head according to claim 2 and the flux transfer apparatus according to claim 4, by forming the holding portion constituted by any one of the concave portion, the small diameter portion, and the linear portion at the tip portion of the pin. Thus, a sufficient amount of flux to be transferred to the transfer object can be securely attached to the tip and held.

  Further, in the flux transfer head according to claim 3 and the flux transfer apparatus according to claim 4, any one of the first support plate and the second support plate constituting the support portion includes a first base end side insertion hole and Between the first position where each central axis of the second base end side insertion hole is coaxial and the second position where both central axes are shifted from each other, with respect to either one of the two support plates And is slidable. For this reason, according to the flux transfer head and the flux transfer device, after any one of the support plates is slid to the first position, the pin is inserted into each insertion hole, and then the support plate is moved to the first position. By simply sliding the pin to the position, the central portion of the pin can be elastically buckled in a predetermined direction with certainty and ease.

  Hereinafter, the best mode of a flux transfer head and a flux transfer apparatus according to the present invention will be described with reference to the drawings.

  First, the configuration of the flux transfer apparatus 1 shown in FIG. 1 will be described. The flux transfer device 1 is an example of a flux transfer device according to the present invention. For example, a flux for soldering to a plurality of transfer sites (for example, lands of a conductor pattern) on a circuit board 301 as an example of a transfer object. 302 can be transferred. Specifically, the flux transfer apparatus 1 includes a flux transfer head 2, a moving mechanism 3, and a control unit 4, as shown in FIG.

  As shown in FIG. 2, the flux transfer head 2 includes a plurality of pins 11 and a support portion 12. As shown in FIG. 5, the pin 11 is constituted by a rod-shaped member having a circular cross section with a diameter of about 50 μm, for example. Further, the pin 11 is formed of an elastic material (for example, a metal material such as beryllium copper alloy, SKH (high speed tool steel) and tungsten steel), so that the central portion 11c is elastically buckled (elastically deformed). (See FIG. 3).

  Further, as shown in FIGS. 4 and 5, a concave portion 21 as an example of a holding portion in the present invention is formed on the end surface of the tip portion 11 a of the pin 11. In this case, the recess 21 has a function of holding a sufficient amount of flux 302 attached to the tip 11 a of the pin 11. Further, as shown in FIG. 5, a large-diameter portion 11d is formed by coating a coating material, for example, on a portion located on the base end portion 11b side from the tip end portion 11a of the pin 11 by a predetermined length. Yes. In this case, the large-diameter portion 11d serves as a stopper that restricts the movement of the pin 11 to the distal end side support portion 31 (see the same figure) of the support portion 12 in a state where the pin 11 is held by the support portion 12. Function.

  As shown in FIG. 2, the support portion 12 includes a distal end portion side support portion 31, a proximal end portion side support portion 32, and a connecting portion 33, and the pin 11 can be elastically buckled at the center portion 11 c. Support. The tip end side support portion 31 is formed in a plate shape. Further, as shown in FIG. 3, the tip end side support portion 31 can be inserted with a tip end portion 11 a of each pin 11 and has a plurality of tip end side insertion holes 41 having a smaller diameter than the large diameter portion 11 d of the pin 11. (Hereinafter, also simply referred to as “insertion hole 41”) is formed.

  As shown in FIG. 3, the base end side support portion 32 includes a first support plate 51, a second support plate 52, and a fixing plate 53, and fixes the base end portion 11 b side of the pin 11. The first support plate 51 is formed in a plate shape. Further, the first support plate 51 is disposed so as to be parallel (substantially parallel) to the tip end side support portion 31 and connected to the tip end side support portion 31 by a connecting portion 33 as shown in FIG. Has been. Further, as shown in FIG. 3, the first support plate 51 can be inserted with the base end portion 11 b of each pin 11 and has a plurality of first base end portions having a diameter larger than that of the large diameter portion 11 d of the pin 11. Side insertion holes 61 (hereinafter also simply referred to as “insertion holes 61”) are formed.

  Further, as shown in FIG. 3, insertion holes 72 a and 73 a into which the fixing pins 71 can be inserted are formed in the first support plate 51. In this case, as shown in FIG. 5, the insertion hole 72 a is inserted into the insertion holes 41, 61 and a second base end side insertion hole 62 (hereinafter simply referred to as “insertion hole 62”) when assembling the flux transfer head 2. The first support plate 51 and the second support plate 52 are aligned with a position A1 (first position) where the central axes of the insertion holes 61 and 62 are coaxial with each other. Used when. Further, as shown in FIG. 6, the insertion hole 73a has the first support plate 51 and the second support at a position A2 (second position) where the center axes of the insertion holes 61 and 62 are shifted from each other. It is used when the plate 52 is positioned and the central portion 11c of the pin 11 inserted through the insertion holes 41, 61, 62 is slightly bent (elastically buckled).

  As shown in FIG. 3, the second support plate 52 is formed in a plate shape and is slidable with respect to the first support plate 51 between the position A1 and the position A2 described above. (Upper side in the figure). Further, as shown in the figure, the second support plate 52 is capable of inserting the base end portion 11b of each pin 11 and has a plurality of second base end portions having a larger diameter than the large diameter portion 11d of the pin 11. A side insertion hole 62 is formed. Furthermore, as shown in the figure, the second support plate 52 is formed with insertion holes 72b and 73b into which the fixing pins 71 can be inserted. In this case, as shown in FIG. 5, the insertion hole 72b is inserted into the center axis and the insertion hole 72a in the first support plate 51 in a state where the second support plate 52 is positioned (slid) at the position A1 described above. The formation position is defined so that the central axis of the lens is coaxial. Further, as shown in FIG. 6, the insertion hole 73b is coaxial with the central axis of the insertion hole 73a in the first support plate 51 in a state where the second support plate 52 is positioned at the position A2. The formation position is defined so as to be in a state.

  The fixing plate 53 is formed in a plate shape as shown in FIG. In this case, the fixed plate 53 is disposed outside the second support plate 52 (upper side in the figure) and is fixed to the second support plate 52, thereby moving the pin 11 toward the fixed plate 53 side. regulate.

  In this case, as described above, the pin 11 of the flux transfer head 2 is composed of a rod-shaped member. That is, the pin 11 is simply configured without a coil spring or the like. For this reason, in the flux transfer head 2, the pin 11 can be easily downsized. Therefore, even when the pitch of the transfer portion of the circuit board 301 is narrow, the distance between the pins 11 is adjusted according to the pitch of the transfer portion. It is possible to sufficiently narrow the pitch. In the flux transfer head 2, as described above, the central portion 11 c of the pin 11 is configured to be elastically buckled, and the support portion 12 supports the pin 11 in a state in which the central portion 11 c can be elastically buckled. ing. For this reason, when the front end portion 11a of each pin 11 is pressed against the transfer site, the central portion of each pin 11 is moved along with the movement of each front end portion 11a toward the base end side support portion 32 side of the support portion 12. By buckling 11c, it is possible to make sure that the tip 11a is in contact with each transfer site by the elastic force resulting from the buckling.

  The moving mechanism 3 moves the flux transfer head 2 under the control of the control unit 4. The control unit 4 controls the moving mechanism 3 to arrange the arrangement position (attachment position in the present invention) of the tray 303 (see FIG. 1) in which the flux 302 is accommodated and the arrangement position of the circuit board 301 (transfer in the present invention). The flux transfer head 2 is moved to (position).

  Next, a method for assembling the flux transfer head 2 will be described with reference to the drawings.

  First, as shown in FIG. 5, in a state where the fixed plate 53 is removed, the position A1 where the central axes of the insertion hole 61 of the first support plate 51 and the insertion hole 62 of the second support plate 52 are coaxial with each other. The second support plate 52 is slid. At this time, the central axis of the insertion hole 72a in the first support plate 51 and the central axis of the insertion hole 72b in the second support plate 52 are in a coaxial state. Next, the fixing pin 71 is inserted into the insertion holes 72a and 72b. Thereby, the 1st support plate 51 and the 2nd support plate 52 are maintained in the state aligned with position A1.

  Subsequently, as shown in FIG. 5, the distal end portion 11 a of the pin 11 is inserted from the insertion hole 62 of the second support plate 52, and the insertion hole 62, the insertion hole 61 of the first support plate 51, and the distal end side support portion. The pin 11 is inserted into the insertion hole 41 of 31. Next, the pin 11 is inserted until the large diameter portion 11d contacts the edge of the insertion hole 41 in the distal end side support portion 31, and the distal end portion 11a side is positioned outside the distal end portion support portion 31 (the lower side in the figure). ).

  Subsequently, after the insertion (insertion) of the pins 11 into all the insertion holes 41, 61, 62 is completed, the fixing pin 71 is pulled out from the insertion holes 72a, 72b. Next, as shown in FIG. 6, the second support plate 52 is slid to a position A <b> 2 where the central axes of the insertion holes 61 and 62 are slightly displaced. At this time, as a result of the sliding of the second support plate 52, the base end portion 11b of each pin 11 is slightly pushed down (tilted) in the sliding direction of the second support plate 52, as shown in FIG. Slightly elastic buckling (curving). Further, the slide of the second support plate 52 to the position A2 brings the central axes of the insertion holes 73a of the first support plate 51 and the insertion holes 73b of the second support plate 52 into a coaxial state. Subsequently, the fixing pin 71 is inserted into the insertion holes 73a and 73b. Thereby, the 2nd support plate 52 is fixed with respect to the 1st support plate 51, and the center part 11c of the pin 11 is maintained in the state elastically buckled a little.

  Next, the fixing plate 53 is brought into contact with the outside of the second support plate 52 to fix the fixing plate 53 to the second support plate 52. Thus, the assembly of the flux transfer head 2 is completed.

  Next, a method for transferring the flux 302 to a plurality of transfer sites on the circuit board 301 using the flux transfer device 1 will be described with reference to the drawings.

  In this flux transfer apparatus 1, when a start operation is performed, the control unit 4 controls the moving mechanism 3 to move the flux transfer head 2 to a position above the tray 303 in which the flux 302 is accommodated. . Subsequently, the control unit 14 lowers the flux transfer head 2 so as to be close to the flux 302 in the tray 303. At this time, the flux 302 adheres to the tip 11 a of the pin 11 in the flux transfer head 2. In this case, since the concave portion 21 is formed on the end face of the distal end portion 11 a, a sufficient amount of flux 302 to be transferred is held in the concave portion 21.

  Next, the control unit 4 controls the moving mechanism 3 to move the flux transfer head 2 above the position where the circuit board 301 is disposed. Subsequently, the control unit 4 moves the flux transfer head 2 in a direction approaching the circuit board 301. Next, the control unit 4 further moves the flux transfer head 2 by a predetermined distance from the position where the tip 11 a of each pin 11 in the flux transfer head 2 contacts each transfer site of the circuit board 301. At this time, the tip 11a of each pin 11 presses the transfer site. Further, the distal end portion 11a of each pin 11 is moved to the proximal end side support portion 32 side of the support portion 12 by the reaction force of the pressing force pressing the transfer site. In this case, in this flux transfer head 2, the central portion 11c of each pin 11 is slightly elastically buckled (curved) in advance. For this reason, the amount of buckling (bending amount) of the central portion 11c of each pin 11 increases with the movement of the flux transfer head 2 in the direction approaching the circuit board 301, so that the movement of each tip portion 11a. Is done smoothly. Further, the distal end portion 11a reliably contacts each transfer portion of the circuit board 301 by the elastic force resulting from the increase in the buckling amount of each central portion 11c. Therefore, the flux 302 attached (held) to the tip 11a of the pin 11 is reliably transferred to each transfer site.

  Subsequently, the control unit 4 controls the moving mechanism 3 to move the flux transfer head 2 in a direction away from the circuit board 301. At this time, the pressing of the transfer portion by the tip portion 11a of each pin 11 is released, and accordingly, the buckling amount of the central portion 11c returns to the initial state. Next, the control unit 4 controls the moving mechanism 3 to move the flux transfer head 2 to the initial position. Thus, the transfer of the flux to each transfer site of the circuit board 301 is completed. Subsequently, when transferring the flux to each transfer site of the other circuit board 301, the same procedure as described above is executed.

  As described above, in the flux transfer head 2 and the flux transfer apparatus 1, the pin 11 is formed of a rod-like member whose central portion 11c can be elastically buckled. That is, in the flux transfer head 2 and the flux transfer apparatus 1, the pin 11 is simply configured without a coil spring or the like. Therefore, according to the flux transfer head 2 and the flux transfer device 1, the pins 11 can be sufficiently miniaturized. As a result, even when the pitch of the transfer portion of the circuit board 301 is narrow, the transfer is possible. The pitch between the pins 11 can be sufficiently narrowed according to the pitch of the part. Further, in the flux transfer head 2 and the flux transfer apparatus 1, the support portion 12 is configured to be able to support the pin 11 in a state where the central portion 11c can be elastically buckled. For this reason, according to the flux transfer head 2 and the flux transfer device 1, when the tip portion 11a of each pin 11 is pressed against the transfer site, each of the support portion 12 toward the base end portion side support portion 32 side. As a result of buckling the central portion 11c of each pin 11 with the movement of the tip portion 11a, the tip portion 11a can be reliably brought into contact with each transfer site by the elastic force resulting from the buckling. Can be reliably transferred to each transcription site.

  Further, according to the flux transfer head 2 and the flux transfer apparatus 1, the recess 21 is formed in the tip portion 11a of the pin 11, so that a sufficient amount of the flux 302 is transferred to the transfer portion of the circuit board 301. It can be reliably attached and held on the portion 11a.

  Further, in the flux transfer head 2 and the flux transfer apparatus 1, the gap between the position A1 where the central axes of the insertion holes 61 and 62 are coaxial and the position A2 where the central axes are offset from each other is provided. Since the second support plate 52 is configured to be slidable with respect to the first support plate 51, the pin 11 is inserted into the insertion holes 41, 61, 62 in a state where the second support plate 52 is slid to the position A1. After the insertion (insertion), the central portion 11c of the pin 11 can be elastically buckled (curved) in a predetermined direction reliably and easily only by sliding the second support plate 52 to the position A2.

  In addition, this invention is not limited to said structure. For example, the configuration example in which the large-diameter portion 11d is formed by coating a coating material has been described above, but a configuration in which a separate member is attached to form the large-diameter portion 11d may be employed. Moreover, the structure which forms the large diameter part 11d at the time of manufacture of the pin 11 (at the time of a cutting process and forging) is also employable. In addition, the example in which the pin 11 is configured by a rod-shaped member formed of a metal material has been described above. However, the material of the pin 11 (bar-shaped member) is not limited to a metal material, and the central portion 11c is elastically buckled (elastically deformed). Various possible materials can be used. In this case, for example, by using a resin material, the pin 11 can be manufactured at low cost by injection molding.

  Furthermore, although the first support plate 51, the second support plate 52, and the fixing plate 53 are described above for the example in which the base end side support portion 32 is configured, the configuration of the base end portion side support portion 32 is not limited thereto, Various configurations that can fix the base end portion 11b of the pin 11 can be employed. Moreover, although it mentioned above about the example which formed the recessed part 21 as a holding part in the front-end | tip part 11a in the pin 11, the structure of a holding part is not limited to this. For example, as shown in FIG. 7, it is also possible to employ a pin 111 configured such that a small-diameter portion 121 as a holding portion is provided at the tip end portion 111 a and the flux 302 is held in the small-diameter portion 121. Further, as shown in FIG. 8, a wire 211 (uneven portion) 221 as a holding portion is provided at the tip 211 a and a pin 211 configured to hold the flux 302 in the wire 221 is employed. You can also.

  Further, the example in which the flux adhered in one adhesion process is transferred to one circuit board 301 (that is, an example in which one adhesion process is performed on one circuit board 301) has been described above. It is also possible to transfer the flux adhered in the adhesion process of a single time onto a plurality of circuit boards 301.

1 is a configuration diagram showing a configuration of a flux transfer device 1. FIG. 2 is a configuration diagram showing a configuration of a flux transfer head 2. FIG. 2 is a cross-sectional view of a flux transfer head 2. FIG. 3 is a perspective view showing a configuration of a tip portion 11a of a pin 11. FIG. FIG. 5 is a first explanatory view for explaining an assembly method of the flux transfer head 2. It is the 2nd explanatory view for explaining the assembly method of flux transfer head 2. 3 is a perspective view showing a configuration of a pin 111. FIG. 3 is a perspective view showing a configuration of a pin 211. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flux transfer apparatus 2 Flux transfer head 3 Movement mechanism 4 Control part 11,111,211 Pin 11a, 111a, 211a Tip part 11b Base end part 11c Center part 12 Support part 21 Concave part 31 Tip part side support part 32 Base end part side Support portion 41 Front end side insertion hole 51 First support plate 52 Second support plate 61 First base end portion insertion hole 62 Second base end portion insertion hole 121 Small diameter portion 221 Line portion 301 Circuit board 302 Flux 303 Tray A1, A2 position

Claims (4)

A flux transfer head that includes a plurality of pins and a support portion that supports each pin, and is configured to be able to transfer the flux adhered to the tip portion of the pins to a transfer object,
The pin is composed of a rod-shaped member whose central portion is formed so as to be capable of elastic buckling,
The support portion includes a distal end side support portion in which a distal end side insertion hole for inserting the distal end portion side of the pin is formed, and a proximal end side support portion that fixes the proximal end side of the pin. A flux transfer head configured to be able to support the pin in a state where the central portion can be elastically buckled. A holding portion for holding the attached flux is formed at the tip portion of the pin,
The flux transfer head according to claim 1, wherein the holding portion is configured by any one of a concave portion, a small diameter portion, and a linear portion. The base end side support portion includes a first support plate having a first base end side insertion hole through which the base end side of the pin is inserted and a second base end portion through which the base end side is inserted. A second support plate formed with a side insertion hole,
One of the first support plate and the second support plate is a first position where the central axes of the first base end side insertion hole and the second base end side insertion hole are coaxial. 3. The flux transfer head according to claim 1, wherein the flux transfer head is configured to be slidable with respect to either one of the two support plates between the first center position and the second position where the center axes are shifted from each other.   The flux transfer head according to any one of claims 1 to 3, a moving mechanism for moving the flux transfer head, an attachment position for attaching the flux to a tip portion of the pin in the flux transfer head, and the pin A flux transfer apparatus comprising: a control unit that controls the moving mechanism to move the flux transfer head to a transfer position where the flux adhered to the tip is transferred to a transfer object.

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