JP2010103145A - Process for fabricating semiconductor integrated circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a reticle is susceptible to degassing from a reticle case itself in the conventional operation because the reticle is stored in a reticle stocker in a state where it is held principally in a reticle case and, when adhesion of degassing constituents is coupled with increase in irradiation energy during exposure caused by microfabrication, it becomes clear that haze occurs and although it is effective to apply a bare reticle stocker (bare reticle repository) for storing the reticle in a state not encased in a reticle case, the reticle stocking and delivering capacity of the bare reticle stocker is comparatively low. <P>SOLUTION: In an optical lithography process, a reticle for use in a comparatively rough process is stored while encased in a reticle case, and a reticle for use in a comparatively fine process is stored without encased in a reticle case. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a semiconductor integrated circuit device (or a semiconductor device), and more particularly to a technique effective when applied to reticle storage and automatic transfer techniques in a semiconductor manufacturing process.

  Japanese Patent Application Laid-Open Publication No. 2006-024850 (Patent Document 1) discloses that a reticle is stored in a reticle pod when stored in a reticle pod when stored, or stored in a reticle stocker in a single state, and is used when a reticle is transported. Discloses a manufacturing process (wafer process) technology for a semiconductor integrated circuit device that transports a semiconductor chip in a state where it is accommodated in a reticle pod. In this document, in order to efficiently operate a semiconductor device manufacturing system, a technique for synchronizing the timing of disconnection between a reticle and a reticle pod between the host system and each exposure apparatus is shown. .

JP 2006-024850 A

  With the recent increase in production of miniaturized products, quality maintenance technology has become an issue. Specifically, in a fine process of 90 nm or less, a product that eliminates fine deposits and growing foreign substances such as chemical growth substances on the surface of a reticle / pattern, which has not been considered in the past, that is, measures against reticle haze (reticle haze) It has been found that this is a key parameter that greatly affects quality and yield.

  According to the study by the present inventors, in the conventional operation, the reticle is mainly stored in the reticle stocker while being accommodated in a reticle case (reticle transport container) such as RSP (Reticle SMIF Pod). It has become clear that haze occurs due to the influence of degassing from the reticle case itself and the increase in irradiation energy during exposure due to adhesion of degassing components and miniaturization.

  As a countermeasure against this haze, it may be possible to try out a reticle case using a plastic material with less degassing components, but it is not always easy to develop a material that satisfies other required specifications and has less degassing components. Absent. Although it is conceivable to increase the frequency of reticle inspection and cleaning, this is a substantial cost increase, and there is a fundamental problem that the number of times the reticle can be cleaned is limited.

  On the other hand, since it occurs due to the reticle case, it is effective to apply a bare reticle stocker (bare reticle storage) in which the reticle is stored without being accommodated in the reticle case. However, there is a problem that the reticle entry / exit capability of the bear reticle stocker is relatively low.

  The present invention has been made to solve these problems.

  An object of the present invention is to provide a manufacturing process of a highly reliable semiconductor integrated circuit device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The following is a brief description of an outline of typical inventions disclosed in the present application.

  That is, according to the present invention, a reticle (for example, a KrF excimer laser exposure reticle) used for a relatively rough process in an optical lithography process is stored in a reticle case and used for a relatively fine process. (For example, an ArF excimer laser exposure reticle) is stored without being accommodated in a reticle case.

  The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

  That is, in the photolithography process, a reticle used for a relatively rough process is stored and stored in a reticle case, and a reticle used for a relatively fine process is stored without being stored in a reticle case. The number of reticles under the control of the bear reticle stocker can be kept to a relatively small amount. As a result, the reticle loading / unloading of the bear reticle stocker does not become a bottleneck in the process.

[Outline of Embodiment]
First, an outline of a typical embodiment of the invention disclosed in the present application will be described.

1. A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a first photolithography processing apparatus group having a first minimum processing dimension;
(B) a second group of photolithographic processing apparatuses having a second minimum processing dimension smaller than the first minimum processing dimension;
(C) a first reticle storage for storing each reticle belonging to the first reticle group used in the first photolithography processing apparatus group in a state of being stored in a reticle case;
(D) A second reticle storage for storing the reticles belonging to the second reticle group used in the second photolithography processing apparatus group without being accommodated in the reticle case.

2. In the method of manufacturing a semiconductor integrated circuit device according to the item 1, the photolithography line further includes:
(E) A reticle case stocker for storing an empty reticle case for accommodating and transporting each reticle belonging to the second reticle group.

3. In the method of manufacturing a semiconductor integrated circuit device according to the item 2, the photolithography line further includes:
(F) A reticle between the first photolithography processing apparatus group, the second photolithography processing apparatus group, the first reticle storage, the second reticle storage, and the reticle case stocker. -Reticle case transport mechanism for transporting cases.

  4). In the method of manufacturing a semiconductor integrated circuit device according to the item 3, the second reticle storage and the reticle case stocker are arranged close to each other on the reticle case transport mechanism.

  5. 5. In the method of manufacturing a semiconductor integrated circuit device according to any one of items 1 to 4, a reticle case that houses and conveys each reticle belonging to the first reticle group, and each reticle belonging to the second reticle group. It is different from a reticle case that accommodates and transports.

  6). 6. The method of manufacturing a semiconductor integrated circuit device according to any one of items 3 to 5, wherein the reticle case transport mechanism includes at least one of OHT, OHS, RGV, and AGV.

  7). 6. In the method of manufacturing a semiconductor integrated circuit device according to any one of items 3 to 5, the reticle / case transport mechanism also serves as a wafer transport mechanism.

8). A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a first photolithography processing apparatus group having a first minimum processing dimension;
(B) a second group of photolithographic processing apparatuses having a second minimum processing dimension smaller than the first minimum processing dimension;
(C) a ceiling transport mechanism for storing the reticles belonging to the first reticle group used in the first photolithography processing apparatus group in a state of being accommodated in a reticle case;
(D) A bare reticle storage for storing each reticle belonging to the second reticle group used in the second photolithography processing apparatus group without being accommodated in the reticle case.

  9. 9. The manufacturing method of a semiconductor integrated circuit device according to item 8, wherein the ceiling transport mechanism also stores an empty reticle case that accommodates and transports each reticle belonging to the second reticle group.

  10. 10. The manufacturing method of a semiconductor integrated circuit device according to 8 or 9, wherein the ceiling transport mechanism is a ceiling conveyor or OHB.

  11. 11. In the method of manufacturing a semiconductor integrated circuit device according to any one of items 8 to 10, a reticle case that accommodates and conveys each reticle belonging to the first reticle group, and each reticle belonging to the second reticle group. It is different from a reticle case that accommodates and transports.

12 A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a photolithographic processing apparatus group;
(B) a bare reticle storage for storing each reticle belonging to a reticle group used in the optical lithography processing apparatus group without being accommodated in a reticle case;
(C) Reticle case stocker installed in the vicinity of the bare reticle storage;
(D) A reticle case transfer mechanism for transferring a reticle case between the bare reticle storage and the reticle case stocker.

13. 13. The method for manufacturing a semiconductor integrated circuit device according to the item 12, wherein the photolithography line further includes:
(E) A reticle case transport mechanism for transporting a reticle case between the optical lithography processing apparatus group, the bare reticle storage, and the reticle case stocker.

  14 14. The method for manufacturing a semiconductor integrated circuit device according to the item 13, wherein the reticle case transport mechanism includes at least one of OHT, OHS, RGV, and AGV.

  15. 14. In the method of manufacturing a semiconductor integrated circuit device according to the item 13, the reticle / case transport mechanism also serves as a wafer transport mechanism.

  16. 16. The method of manufacturing a semiconductor integrated circuit device according to any one of items 12 to 15, wherein the reticle case transfer mechanism replaces an empty reticle case on a port of the bare reticle storage with the reticle case stocker. Move over the port.

  17. 17. The method of manufacturing a semiconductor integrated circuit device according to any one of items 12 to 16, wherein the reticle case transfer mechanism uses an empty reticle case on a port of the reticle case stocker in the bare reticle storage case. Move over the port.

18. A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a photolithographic processing apparatus group;
(B) a bare reticle storage for storing each reticle belonging to a reticle group used in the optical lithography processing apparatus group without being accommodated in a reticle case;
(C) A ceiling transport mechanism for storing an empty reticle case for storing and transporting each reticle belonging to the reticle group.

  19. In the method for manufacturing a semiconductor integrated circuit device according to the item 18, the ceiling transport mechanism includes at least one of OHT, OHS, and OHB.

  20. In the method for manufacturing a semiconductor integrated circuit device according to the item 18, the ceiling transfer mechanism also serves as a wafer transfer mechanism.

[Description format, basic terms, usage in this application]
1. In the present application, the description of the embodiment may be divided into a plurality of sections for convenience, if necessary, but these are not independent from each other unless otherwise specified. Each part of a single example, one part is the other part of the details, or part or all of the modifications. Moreover, as a general rule, the same part is not repeated. In addition, each component in the embodiment is not indispensable unless specifically stated otherwise, unless it is theoretically limited to the number, and obviously not in context.

  2. Similarly, in the description of the embodiment, etc., regarding the material, composition, etc., “X consisting of A” etc. is an element other than A unless specifically stated otherwise and clearly not in context. It is not excluded that one of the main components. For example, as for the component, it means “X containing A as a main component”. For example, “silicon member” is not limited to pure silicon, but also includes SiGe alloys, other multi-component alloys containing silicon as a main component, and members containing other additives. Needless to say.

  3. Similarly, suitable examples of graphics, positions, attributes, and the like are given, but it is needless to say that the present invention is not strictly limited to those cases unless explicitly stated otherwise, and unless otherwise apparent from the context.

  4). In addition, when a specific number or quantity is mentioned, a numerical value exceeding that specific number will be used unless specifically stated otherwise, unless theoretically limited to that number, or unless otherwise clearly indicated by the context. There may be a numerical value less than the specific numerical value.

  5. “Wafer” usually refers to a single crystal silicon wafer on which a semiconductor integrated circuit device (same as a semiconductor device and an electronic device) is formed, but an insulating substrate such as an epitaxial wafer, an SOI substrate, an LCD glass substrate and the like. Needless to say, a composite wafer such as a semiconductor layer is also included.

  6). In the present application, when referring to “group”, the number of elements is a natural number including “1”.

  7). Although the same applies to the following embodiments, a wafer or reticle transfer system generally used in a semiconductor manufacturing line moves between a floor transfer system (floor-based translation system) that moves near the floor surface and a ceiling surface. It is roughly classified into two types, an overhead transport system (Supported or Ceiling-Supported transport System). Main examples of the floor transport system include RGV (Rail Guided Vehicle), AGV (Automatic Guided Vehicle), and the like. On the other hand, main examples of the ceiling transport system (ceiling transport mechanism) include OHV (Overhead Hoist Vehicle), OHT (Overhead Hoist Transport), OHS (Overhead Hoist Roller), and overhead conveyor (Overhead Powered Roller). Further, in the ceiling transport system, there is an OHB (Overhead Hoist Buffer) that also serves as a simple stocker.

  8). A typical example of a wafer transfer container generally used in a semiconductor manufacturing line (also in the following embodiments) is a hoop (Front Opening Unified Pod). A typical example of the reticle container is RSP (Reticle SMIF Pod). For the reticle container, “different” means “substantially the same shape (allowing for different shapes) and the same material, but at least different as an individual”, that is, the fine process and the rough process are mixed with each other. It shows that it uses properly so that there is no. Of course, it goes without saying that all or part of the material may be optimized, not the same material.

[Details of the embodiment]
The embodiment will be further described in detail. In the drawings, the same or similar parts are denoted by the same or similar symbols or reference numerals, and description thereof will not be repeated in principle.

  In the following, the overall configuration of the optical lithography line 23 (see FIG. 1), the proper use of the reticle case (see FIG. 5), the mutual transfer (common use) of the wafer reticle transport system, etc. are also described in sections 2 to 4. Although it can be applied almost as it is, it will be described mainly in section 1, and in principle the same description will not be repeated in other sections. That is, except for section 1, in principle, only the parts different from section 1 will be described.

  The state in which the reticle is in the reticle pod is shown on the drawing as if the reticle was mounted on the reticle pod. This indicates that the reticle pod has the reticle inside. That is, it indicates that the reticle pod is not empty.

1. Description of the semiconductor integrated circuit device manufacturing method according to the first embodiment of the present invention (mainly FIGS. 1 to 6)
FIG. 1 is a schematic plan view of a clean room showing an outline of an optical lithography line in the method of manufacturing a semiconductor integrated circuit device according to the first embodiment of the present invention. 2 is a schematic cross-sectional view of the apparatus for explaining the reticle delivery between the reticle receiving apparatus in general (lithography apparatus, reticle and reticle pod stocker, etc.) and the reticle transport system (reticle / case transport mechanism) in FIG. It is. FIG. 3 is a schematic perspective view of a clean room in which a portion related to the rough dimension processing reticle (reticle belonging to the first reticle group) in FIG. 1 is cut out. FIG. 4 is a schematic perspective layout view of a clean room in which a portion related to the fine dimension processing reticle (reticle belonging to the second reticle group) in FIG. 1 is cut out. FIG. 5 is a perspective view of a reticle pod group showing the proper use of the reticle pod (reticle container) in FIG. FIG. 6 is a perspective view of the transfer system for explaining the shared relationship between the wafer transfer system and the reticle transfer system (reticle / case transfer mechanism) in FIG. Based on these, a method for manufacturing the semiconductor integrated circuit device according to the first embodiment of the present invention will be described.

  First, the outline of the configuration of the optical lithography line 23 in the wafer line used in the method for manufacturing the semiconductor integrated circuit device according to the first embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, in the optical lithography line 23, a wafer transport system 5 for transporting the wafer 1 accommodated in the hoop 3 and reticles 2, 2a, 2 accommodated in the reticle pods 4, 4a, 4b. A reticle transport system 6 (reticle / case transport mechanism) for transporting 2b is stretched around like a mesh. The wafer transfer system 5 is provided with a plurality of wafer transfer vehicles 7, and the reticle transfer system 6 is provided with a plurality of reticle transfer vehicles 8. The wafer transfer system 5 and the reticle transfer system 6 may be able to enter each other at the mutual entry part 9 (connecting part) (the effect of improving the degree of freedom in conveyance, etc.).

  Various devices are arranged between them. Examples of various devices include the following. The wafer stocker 11 is a place for storing the hoop 3 containing the wafer 1. The integrated rough dimension optical lithography apparatus group 21 is an apparatus group including an integrated rough dimension optical lithography apparatus 18a (for example, for KrF excimer laser exposure) relating to a process layer having a relatively large processing dimension. The fine dimension optical lithography integrated device group 22 is a device group including a fine dimension optical lithography integrated device 19a relating to a process layer having a relatively small processing dimension (for example, relating to ArF excimer laser exposure). Reticle pod storage reticle storage 12 (first reticle storage) is a place for storing rough dimension processing reticle 2a in a state of being stored in rough dimension processing reticle pod 4a (reticle container). is there. The bare reticle storage 14 (second reticle storage) is a place where the fine dimension processing reticle 2b (reticle belonging to the second reticle group) is stored without being accommodated in the fine dimension processing reticle pod 4b. is there. The empty reticle / pod storage 15 is a place where the fine dimension processing reticle / pod 4b for storing the fine dimension processing reticle 2b is stored in an empty state. In each of these apparatuses, a common wafer port 16, a common reticle or reticle pod port 17, and an interface with a wafer transfer system 5 or a reticle transfer system 6 (reticle / case transfer mechanism), if necessary, Ports such as a dedicated transfer port 17a are provided.

  Next, the operation of the port 17 in the reticle receiving device 24 (lithographic apparatus, reticle, reticle pod stocker, etc.) will be described with reference to FIG. As shown in FIG. 2, the reticle pod 4 transported by the reticle transport system 6 is installed on the reticle port 17. Accordingly, the bottom surface (bottom lid) of the reticle pod 4 is pulled into the body of the port 17 together with the reticle 2 and taken into the apparatus 24 by the reticle transport robot 25 inside the apparatus 24. Thereafter, the bottom surface of the reticle pod 4 rises to close the reticle pod 4. The reticle transport system 6 takes away the empty reticle pod 4.

  When ejected from the apparatus 24, the reverse side of the empty reticle pod 4 is drawn into the body of the port 17, and in this state, the reticle transport robot 25 puts the reticle 2 on the bottom surface of the reticle pod 4. Install. Thereafter, the bottom surface of the reticle pod 4 rises together with the reticle 2 to close the reticle pod 4. The reticle transport system 6 carries away the reticle pod 4 containing the reticle 2.

  Next, the flow of the rough dimension processing reticle group 10a (first reticle group) in the process will be described with reference to FIG. As shown in FIG. 3, the rough dimension processing reticle 2a (the reticle 10a belonging to the first reticle group) is accommodated in the rough dimension processing reticle pod 4a, and stored in the reticle / pod reticle storage 12. It is stored in (first reticle storage). When necessary, it is carried on the reticle transport vehicle 8 of the reticle transport system 6 (reticle / case transport mechanism) and transported to, for example, the rough dimension photolithography integrated apparatus 18a (first photolithography processing apparatus). Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port of the rough dimension optical lithography integrated apparatus 18 a.

  On the other hand, the flow of the fine dimension processing reticle group 10b (second reticle group) in the process is as follows. That is, as shown in FIG. 4, the reticle 2b (second reticle belonging to the second reticle group) for fine dimension processing is not accommodated in the reticle pod 4b for fine dimension processing. (Reticle storage). The fine dimension processing reticle pod 4b is stored in the empty reticle / pod storage 15 in an empty state. When necessary, it is carried on a reticle transport vehicle 8 of a reticle transport system 6 (reticle / case transport mechanism) and transported to, for example, a micro-dimensional integrated photolithographic apparatus 19a (second optical lithography processing apparatus). Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port of the integrated microlithographic apparatus 19 a. As described above, since the reticle management method is changed depending on the fineness of processing or the like, there is an advantage that the reticle management efficiency of the entire line can be improved. In addition, since management using the bare reticle storage 14 directly handles a fine mask, it is difficult to increase the handling speed. Therefore, the mixed management method as described here has an advantage that the management method using the bare reticle storage 14 can be limited to a part of the line.

  At this time, as shown in FIG. 5, the rough dimension processing reticle used in the rough dimension processing reticle 2a (reticle belonging to the first reticle group) belonging to the rough dimension processing reticle group 10a (first reticle group). The micro dimensional processing reticle pod 4b used for the pod 4a and the micro dimensional processing reticle 2b (reticle belonging to the second reticle group) belonging to the micro dimensional processing reticle group 10b (second reticle group) are mutually connected. Do not mix. Thus, since the reticle pods of both groups do not intermingle, the material of the reticle pods of each group can be optimized for that group. For example, it is possible to take measures such as using only the reticle pod 4b for fine dimension processing with a material with less degassing.

  In FIG. 1, the mutual entry portion 9 (connecting portion) is provided, as shown in FIG. 6, so that both the wafer transfer vehicle 7 and the reticle transfer vehicle 8 can travel on both tracks 5 and 6. This is because it is advantageous in terms of the degree of freedom of conveyance or the time required for conveyance.

2. Description of the semiconductor integrated circuit device manufacturing method according to the second embodiment of the present invention (mainly FIGS. 7 and 8)
This example basically uses the optical lithography line 23 (optical lithography processing unit in the wafer line) shown in FIG. 1 (including FIGS. 2 to 6), but in addition to or in place of it. Thus, a ceiling transport mechanism such as a ceiling conveyor is used to store a reticle pod containing the reticle 2 and an empty reticle pod.

  FIG. 7 is a view showing a clean-cut portion in which a portion relating to a rough dimension processing reticle (reticle belonging to the first reticle group) is cut out from the optical lithography line in the method of manufacturing a semiconductor integrated circuit device according to the second embodiment of the present invention. It is a room model perspective layout figure. FIG. 8 is a view showing a clean-cut-out part of an optical lithography line in the manufacturing method of a semiconductor integrated circuit device according to the second embodiment of the present invention, which is related to a fine dimension processing reticle (reticle belonging to the second reticle group). It is a room model perspective layout figure. Based on these, a method of manufacturing a semiconductor integrated circuit device according to the second embodiment of the present invention will be described.

  As shown in FIG. 7, when not used, the rough dimension processing reticle 2a housed in the rough dimension processing reticle pod 4a (reticle belonging to the first reticle group) is transferred to the ceiling transport mechanism 26 (buffer or 26). (Also serves as a stocker). When necessary, it is carried on the reticle transport vehicle 8 of the reticle transport system 6 (reticle / case transport mechanism) and transported to, for example, the rough dimension photolithography integrated apparatus 18a (first photolithography processing apparatus). Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port of the rough dimension optical lithography integrated apparatus 18 a. Here, as an example of the ceiling transport mechanism 26, a ceiling conveyor or OHB having both a transport function and a buffer function (simple stocker function) is preferable. In this way, by storing the reticle 2 and the empty reticle case 4 in the case on the ceiling transport mechanism 26, the reticle pod storage reticle 12 and the empty reticle pod storage 15 are all stored. Or there is a merit that can be partially unnecessary.

  On the other hand, as shown in FIG. 8, the reticle 2b (second reticle belonging to the second reticle group) for fine dimension processing is not accommodated in the reticle pod 4b for fine dimension processing, and is stored in the bare reticle storage 14 (second reticle). (Reticle storage). The fine dimension processing reticle pod 4b is stored in an empty state on the ceiling transport mechanism 26 (similar to section 1, the empty reticle / pod storage 15 may be stored). Yes. When necessary, it is carried on a reticle transport vehicle 8 of a reticle transport system 6 (reticle / case transport mechanism) and transported to, for example, a micro-dimensional integrated photolithographic apparatus 19a (second optical lithography processing apparatus). Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port of the integrated microlithographic apparatus 19 a.

  The other parts (for example, the description regarding FIG. 1, FIG. 5, and FIG. 6) are the same as those in section 1, and the description will not be repeated (the same applies to the following sections).

3. Description of the semiconductor integrated circuit device manufacturing method according to the third embodiment of the present invention (mainly FIGS. 9 to 12)
In this example, bare reticle storage is basically performed using all or part of the optical lithography line 23 (optical lithography processing unit in the wafer line) shown in FIG. 1 (including FIGS. 2 to 6). The efficiency of use of the storage 14 is improved.

  FIG. 9 is a schematic perspective view of a clean room showing an outline of an optical lithography line in the method of manufacturing a semiconductor integrated circuit device according to the third embodiment of the present invention. FIG. 10 is a schematic plan view of a clean room showing details of the vicinity of the bear reticle storage and empty reticle pod storage in FIG. FIG. 11 is a schematic diagram of a clean room showing a specific flow (transfer of empty reticle pod from the port of the bear reticle storage) between the bear reticle storage and the empty reticle pod storage in FIG. FIG. FIG. 12 is a clean room showing a specific flow (transfer of empty reticle pod from port of empty reticle pod storage) between bear reticle storage and empty reticle pod storage in FIG. It is a model plane layout figure. Based on these, a method of manufacturing a semiconductor integrated circuit device according to the third embodiment of the present invention will be described.

  The flow in the process of the reticle group 10 is substantially the same as the flow in the process of the reticle group 10b (second reticle group) for fine dimension processing in section 1. That is, as shown in FIG. 9, the reticle 2 is stored in the bare reticle storage 14 in a state where it is not accommodated in the reticle pod 4 (reticle container). The reticle pod 4 is stored in an empty reticle pod storage 15 in an empty state. When necessary, it is carried on the reticle transport vehicle 8 of the reticle transport system 6 (reticle / case transport mechanism) and transported to, for example, the integrated optical lithography apparatus 20. Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port 17 of the integrated optical lithography apparatus 20.

  Here, as shown in FIG. 10, the reticle 2 that has been used in the integrated optical lithography apparatus 20 is again accommodated in the reticle pod 4, and the reticle transport vehicle of the reticle transport system 6 (reticle / case transport mechanism). Ride 8 and return to the reticle port 17 of the bear reticle storage 14. Since the precise handling of the reticle 2 cannot be performed at high speed, the reticle port 17 of the bare reticle storage 14 is congested, and the reticle 2 conveyed one after another cannot be transferred into the bear reticle storage 14 and is transported. There are problems such as traffic jams on the road. For this reason, in this example, the bare reticle storage 14 and the empty reticle pod storage 15 are brought close to each other, and the reticle / pod transfer robot 27 (reticle / case transfer mechanism) is installed therebetween. In addition to the common reticle or reticle pod port 17, the empty reticle / pod storage 15 is provided with a transfer port 17 a, which is connected to the reticle port 17 of the bear reticle storage 14. When applied to delivery, it is effective for avoiding congestion of the reticle transport system 6 (reticle / case transport mechanism).

  A transfer operation centered on the reticle / pod transfer robot 27 (reticle / case transfer mechanism) will be described with reference to FIGS. As shown in FIG. 10, the reticle / pod transfer robot 27 is movable on the reticle / pod transfer robot track 28. For example, as shown in FIG. 11, when the reticle transport vehicle 8 has transported the reticle 2 and the reticle port 17 of the bare reticle storage 14 is occupied, the reticle case transfer mechanism 27 is used. The empty reticle pod 4 on the reticle port 17 of the bare reticle storage 14 is quickly transferred to the empty port 17a (dedicated port) of the empty reticle pod storage 15. Thereafter, the reticle pod 4 containing the reticle 2 is landed on the reticle port 17 of the vacant bear reticle storage 14. When the reticle 2 is transported, as shown in FIG. 12, the reticle / pod transfer robot 27 is provided with an empty reticle / pod 4 in the empty reticle / pod storage 15 via the transfer dedicated port 17a. Are transferred onto the reticle port 17 of the bear reticle storage 14. Thereafter, the reticle 2 in the bare reticle storage 14 is accommodated in the empty reticle pod 4, and is transported to the integrated optical lithography device 18 (optical lithography processing device) by the reticle transport vehicle 8.

  In the mixed type reticle management system as in section 1, the rough dimension processing reticle may be stored in the empty reticle / pod storage 15 while being accommodated in the reticle / pod. However, it is necessary to pay attention to mutual interference between the reticle pod 4a for rough dimension processing and the reticle pod 4b for fine dimension processing.

4). Description of the semiconductor integrated circuit device manufacturing method according to the fourth embodiment of the present invention (mainly FIGS. 13 and 14)
This example basically uses an empty reticle pod while using all or part of the optical lithography line 23 (optical lithography processing section in the wafer line) shown in FIG. 1 (including FIGS. 2 to 6). The whole or a part of the storage 15 is replaced with a reticle transport system 6 (reticle / case transport mechanism).

  FIG. 13 is a schematic perspective view of a clean room showing an outline of an optical lithography line in the method for manufacturing a semiconductor integrated circuit device according to the fourth embodiment of the present invention. FIG. 14 is a schematic perspective layout view of a clean room for explaining the relationship between the port of each device and the reticle pod in FIG. Based on these, a method for manufacturing a semiconductor integrated circuit device according to the fourth embodiment of the present invention will be described.

  The flow in the process of the reticle group 10 is substantially the same as the flow in the process of the reticle group 10b (second reticle group) for fine dimension processing in section 1. That is, as shown in FIG. 13, the reticle 2 is stored in the bare reticle storage 14 in a state where it is not accommodated in the reticle pod 4 (reticle container). The reticle pod 4 is held by the reticle carrier 8 in an empty state. When necessary, it is transported onto the reticle transport vehicle 8 and transported to, for example, the integrated optical lithography apparatus 20. Therefore, as described with reference to FIG. 2, it is taken into the apparatus through the reticle port 17 of the integrated optical lithography apparatus 20.

  In this system, as shown in FIG. 14, the number of transport vehicles 8 required as a storage is equal to the total number of reticle ports 17 of the integrated optical lithography apparatus 18 to which this storage method is applied, and the number of bear reticle storages 14. This is the sum of the total number of reticle ports 17.

  As described above, since the empty reticle case is stored on the transport system, there is an advantage that the empty reticle / pod storage 15 and the equipment related thereto are not required. In the mixed reticle management system as in section 1, a transfer system can be used as a substitute for the reticle / pod-accommodating reticle storage 12 (FIG. 1).

5). Summary The invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited thereto, and it goes without saying that various changes can be made without departing from the scope of the invention.

  For example, in the above-described embodiment, the section 1 is used as a base and the description is divided into a plurality of sections centering on the characteristic portions of the examples. However, as described above, the examples are not independent from each other, and contradict each other. Needless to say, they can be used in combination as long as they are not.

  Further, although a specific description has been given by taking a 300φ wafer line as an example, the present invention can be applied almost as it is to a 450φ or 200φ wafer line.

2 is a schematic plan view of a clean room showing an outline of an optical lithography line in the method for manufacturing a semiconductor integrated circuit device according to the first embodiment of the present invention; FIG. FIG. 2 is a schematic cross-sectional view of the apparatus for explaining reticle delivery between the reticle receiving apparatus in general (lithography apparatus, reticle, reticle pod stocker, etc.) and reticle transport system (reticle / case transport mechanism) in FIG. FIG. 2 is a schematic perspective view of a clean room in which a portion related to a rough dimension processing reticle (reticle belonging to a first reticle group) in FIG. 1 is cut out. FIG. 2 is a schematic perspective view of a clean room in which a portion related to a fine dimension processing reticle (reticle belonging to a second reticle group) in FIG. 1 is cut out. FIG. 2 is a perspective view of a reticle pod group showing proper use of reticle pods (reticle containers) in FIG. 1. FIG. 2 is a perspective view of a transfer system for explaining a shared relationship between a wafer transfer system and a reticle transfer system (reticle / case transfer mechanism) in FIG. 1. A clean room schematic perspective view in which a portion relating to a rough dimension processing reticle (a reticle belonging to the first reticle group) is cut out from the optical lithography line in the method of manufacturing a semiconductor integrated circuit device according to the second embodiment of the present invention. FIG. A clean room schematic perspective view in which a portion related to a fine dimension processing reticle (reticle belonging to the second reticle group) is cut out from the optical lithography line in the method of manufacturing a semiconductor integrated circuit device according to the second embodiment of the present invention. FIG. It is a clean room schematic perspective layout figure which shows the outline | summary of the optical lithography line in the manufacturing method of the semiconductor integrated circuit device of the 3rd Embodiment of this invention. FIG. 10 is a schematic plan view of a clean room showing details of the vicinity of a bear reticle storage and an empty reticle pod storage in FIG. 9. FIG. 9 is a schematic plan view of a clean room showing a specific flow (transfer of empty reticle pod from the port of the bear reticle storage) between the bare reticle storage and the empty reticle pod storage in FIG. It is. Clean room schematic plan layout showing specific flow (transfer of empty reticle pod from port of empty reticle pod storage) between bear reticle storage and empty reticle pod storage in FIG. FIG. It is a clean room schematic perspective layout figure which shows the outline | summary of the optical lithography line in the manufacturing method of the semiconductor integrated circuit device of the 4th Embodiment of this invention. FIG. 14 is a schematic perspective layout view of a clean room for explaining a relationship between a port and a reticle pod of each device in FIG. 13.

Explanation of symbols

1 Wafer 2 Reticle (Mask)
2a Rough dimensional processing reticle (reticle belonging to the first reticle group)
2b Reticle for fine dimension processing (reticle belonging to the second reticle group)
3 Hoop (wafer transfer container)
4 Reticle pod (reticle container)
4a reticle pod for rough dimension processing 4b reticle pod for micro dimension processing 5 wafer transfer system 6 reticle transfer system (reticle / case transfer mechanism)
7 Wafer transfer vehicle 8 Reticle transfer vehicle 9 Mutual entry portion 10 Reticle group 10a Rough dimension processing reticle group (first reticle group)
10b Reticle group for fine dimension processing (second reticle group)
11 Wafer lot storage (wafer stocker)
12 Reticle pod storage reticle (first reticle storage)
14 Bear reticle storage (second reticle storage)
DESCRIPTION OF SYMBOLS 15 Empty reticle pod storage 16 Common wafer port 17 Common reticle or reticle pod port 17a Transfer exclusive port 18 Optical lithography integrated apparatus (optical lithography processing apparatus)
18a, 18b Rough dimension photolithographic integrated device (first photolithographic processing device)
19a, 19b Micro-dimensional photolithography integrated device (second photolithography processing device)
20 Integrated optical lithography equipment group (Optical lithography processing equipment group)
21 Rough dimension optical lithography integrated device group (first optical lithography processing device group)
22 Fine dimension integrated optical lithography equipment group (second optical lithography processing equipment group)
23 Optical Lithography Line (Optical Lithography Processing Section in Wafer Line)
24 Reticle receiving apparatus (lithographic apparatus, reticle and reticle pod stocker, etc.)
25 Reticle transfer robot (robot that transfers the reticle between the port and the inside of the device)
26 Ceiling transport mechanism 27 Reticle / pod transfer robot (reticle / case transfer mechanism)
28 Trajectory for Reticle Pod Transfer Robot

Claims (20)

A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a first photolithography processing apparatus group having a first minimum processing dimension;
(B) a second group of photolithographic processing apparatuses having a second minimum processing dimension smaller than the first minimum processing dimension;
(C) a first reticle storage for storing each reticle belonging to the first reticle group used in the first photolithography processing apparatus group in a state of being stored in a reticle case;
(D) A second reticle storage for storing the reticles belonging to the second reticle group used in the second photolithography processing apparatus group without being accommodated in the reticle case. In the method of manufacturing a semiconductor integrated circuit device according to the item 1, the photolithography line further includes:
(E) A reticle case stocker for storing an empty reticle case for accommodating and transporting each reticle belonging to the second reticle group. In the method of manufacturing a semiconductor integrated circuit device according to the item 2, the photolithography line further includes:
(F) A reticle between the first photolithography processing apparatus group, the second photolithography processing apparatus group, the first reticle storage, the second reticle storage, and the reticle case stocker. -Reticle case transport mechanism for transporting cases.     In the method of manufacturing a semiconductor integrated circuit device according to the item 3, the second reticle storage and the reticle case stocker are arranged close to each other on the reticle case transport mechanism.     In the method of manufacturing a semiconductor integrated circuit device according to the item 1, a reticle case that accommodates and transports each reticle belonging to the first reticle group, and each reticle that belongs to the second reticle group is accommodated and transported. Different from the reticle case.     In the method of manufacturing a semiconductor integrated circuit device according to the item 3, the reticle case transport mechanism includes at least one of OHT, OHS, RGV, and AGV.     In the method for manufacturing a semiconductor integrated circuit device according to the item 3, the reticle / case transfer mechanism also serves as a wafer transfer mechanism. A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a first photolithography processing apparatus group having a first minimum processing dimension;
(B) a second group of photolithographic processing apparatuses having a second minimum processing dimension smaller than the first minimum processing dimension;
(C) a ceiling transport mechanism for storing the reticles belonging to the first reticle group used in the first photolithography processing apparatus group in a state of being accommodated in a reticle case;
(D) A bare reticle storage for storing each reticle belonging to the second reticle group used in the second photolithography processing apparatus group without being accommodated in the reticle case.     9. The manufacturing method of a semiconductor integrated circuit device according to item 8, wherein the ceiling transport mechanism also stores an empty reticle case that accommodates and transports each reticle belonging to the second reticle group.     In the method for manufacturing a semiconductor integrated circuit device according to the item 8, the ceiling transport mechanism is a ceiling conveyor or OHB.     9. In the method of manufacturing a semiconductor integrated circuit device according to item 8, a reticle case that accommodates and transports each reticle belonging to the first reticle group and each reticle that belongs to the second reticle group is accommodated and transported. Different from the reticle case. A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a photolithographic processing apparatus group;
(B) a bare reticle storage for storing each reticle belonging to a reticle group used in the optical lithography processing apparatus group without being accommodated in a reticle case;
(C) Reticle case stocker installed in the vicinity of the bare reticle storage;
(D) A reticle case transfer mechanism for transferring a reticle case between the bare reticle storage and the reticle case stocker. 13. The method for manufacturing a semiconductor integrated circuit device according to the item 12, wherein the photolithography line further includes:
(E) A reticle case transport mechanism for transporting a reticle case between the optical lithography processing apparatus group, the bare reticle storage, and the reticle case stocker.     14. The method for manufacturing a semiconductor integrated circuit device according to the item 13, wherein the reticle case transport mechanism includes at least one of OHT, OHS, RGV, and AGV.     14. In the method of manufacturing a semiconductor integrated circuit device according to the item 13, the reticle / case transport mechanism also serves as a wafer transport mechanism.     In the method of manufacturing a semiconductor integrated circuit device according to the item 12, the reticle case transfer mechanism transfers an empty reticle case on the port of the bare reticle storage to the port of the reticle case stocker.     In the method of manufacturing a semiconductor integrated circuit device according to the item 12, the reticle case transfer mechanism transfers an empty reticle case on the port of the reticle case stocker onto a port of the bare reticle storage. A method of manufacturing a semiconductor integrated circuit device using the following optical lithography line, wherein the optical lithography line includes:
(A) a photolithographic processing apparatus group;
(B) a bare reticle storage for storing each reticle belonging to a reticle group used in the optical lithography processing apparatus group without being accommodated in a reticle case;
(C) A ceiling transport mechanism for storing an empty reticle case for storing and transporting each reticle belonging to the reticle group.     In the method for manufacturing a semiconductor integrated circuit device according to the item 18, the ceiling transport mechanism includes at least one of OHT, OHS, and OHB.     In the method for manufacturing a semiconductor integrated circuit device according to the item 18, the ceiling transfer mechanism also serves as a wafer transfer mechanism.

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