JP2010097860A - Inspection apparatus of plasma display panel, connection device, and manufacturing method of plasma display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform an electric conduction inspection just after a flexible wiring board is connected with a plasma display panel without lighting up the plasma display panel to send only passed items to a subsequent process. <P>SOLUTION: After an electrode terminal of a plasma display panel 7 is connected with one terminal of a flexible wiring board 3 with an ACF 23 in-between, a probe 26 is made in contact with the electrode terminal of the plasma display panel 7 and a probe 27 is made in contact with the other terminal of the flexible wiring board 3 and a connection state is directly inspected by an electric conduction inspection unit 5. As a result, the connection state can be checked without lighting up the plasma display panel 7. With this, defective items can be prevented from being sent to the subsequent process. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a device for connecting a flexible wiring board to a plasma display panel and a method for manufacturing the plasma display device.

  In a flat display panel, a flexible wiring board (FPC) is frequently used for connecting the display panel to a drive power source, a drive circuit, and the like. The pitch between the electrode terminals of the display panel and the terminals of the FPC is small, and the number of terminals is large. Therefore, the inspection of the connection between the electrode terminal of the display panel and the FPC is very important.

  “Patent Document 1” describes connection of an FPC in a liquid crystal display device and an inspection method thereof. The technique described in “Patent Document 1” is as follows. That is, as shown in FIG. 11, “Patent Document 1” describes a conductive joining method between electrical circuits that can be accurately conductively connected with a small number of man-hours even in a fine pitch connection terminal in a liquid crystal display panel. ing. This is because the liquid crystal display panel 32 is held at a specified position on the work table 31, and an anisotropic conductive adhesive 42 is disposed in the chip mounting area of the liquid crystal display panel, on which an LSI chip 37 as a drive circuit element is placed. Is placed accurately while aligning, and a thermocompression bonding unit 39 is brought into contact with the LSI chip 37 and is heated and pressed to be thermocompression bonded.

  As a result, the protruding electrode 37a of the LSI chip 37 and the connection terminal 38 of the lead-out wiring 36 and the connection terminal of the input wiring (not shown) are conductively connected with the conductive particles 42a sandwiched therebetween. This conductive connection state is inspected by lowering the connection terminal (hereinafter referred to as a probe) 36 while the liquid crystal display panel 32 is held at a predetermined position on the work table 31 and bringing each probe 36a into conductive contact with the corresponding input wiring. It is.

  When the mounting of the LSI chip 37 is completed, an inspection signal voltage is immediately applied from the cable 40 to each input wiring via each probe 36a, the liquid crystal display panel 32 is turned on, and a test pattern is displayed. The operator visually checks this test pattern and determines whether the LSI chip 37 is in a conductive connection state. When it is determined as “good” in this inspection, the conductive bonding of the LSI chip 37 to the liquid crystal display panel 32 is completed.

  On the other hand, in the plasma display, as a method of performing normal crimping confirmation in the thermocompression bonding process, a mark called an alignment (positioning) mark on the surface of the plasma display panel and an alignment mark on the surface of the flexible wiring board Thus, alignment is performed, and after crimping, the panel on which crimping has been completed is inspected by checking the displacement of the electrode terminal by visual recognition of the operator.

  The technique described in “Patent Document 2” is used to check the continuity of the terminal part in order to check the connection of the terminal part when connecting the circuit board formed on the flexible board and the external wiring board. The structure which forms the connection terminal is described. This method does not directly check the connection state of all terminals.

  In “Patent Document 3”, when the connection member is connected to the circuit board by thermocompression bonding or the like, by providing a measurement terminal, the resistance of the connection portion is monitored, and whether or not the thermocompression bonding conditions are appropriate. A configuration for checking is described. This technology also does not directly check the connection status of all terminals.

  In the plasma display panel, electrode terminal portions are formed on each of the front substrate and the rear substrate. And the electrode terminal part is formed in the lower surface, for example in the front substrate, and the electrode terminal part is formed in the upper surface, for example in the back substrate. In “Patent Document 4” and “Patent Document 5”, a connection method is described in which a plasma display panel can be connected without being inverted for connection, regardless of whether the electrode terminal portion is upward or downward. . However, neither “Patent Document 4” nor “Patent Document 5” describes a configuration for directly inspecting the connection status of all electrode terminals.

JP 2006-86328 A JP 2005-69945 A JP-A-6-350247 JP 2006-106802 A JP-A-11-65473

  The inspection technique described in “Patent Document 1” is to inspect the connection of terminal portions by lighting a liquid crystal display panel. However, even if a defect occurs in a specific pixel of the liquid crystal display panel, it may not be immediately possible to determine whether it is due to the connection between the terminal of the liquid crystal display panel and the flexible wiring board.

  In addition, the technique described in “Patent Document 1” is effective for a liquid crystal panel, but it may not always be efficient for application to a plasma display panel. For example, in a liquid crystal panel, by applying a reference potential to a reference electrode formed on a counter substrate, the panel can be turned on by an applied voltage from one probe after completion of crimping. However, in the plasma display panel, lighting is not displayed even when a voltage is simply applied, and a predetermined driving operation is required. Therefore, it is difficult to confirm whether or not the crimping is performed by lighting display in an intermediate process.

  Also, the techniques described in “Patent Document 2” to “Patent Document 5” do not directly connect the electrode terminal portions to all electrode terminals.

  In a plasma display panel, a large number of flexible wiring boards are connected to a front substrate and a rear substrate. It is not efficient to turn on and inspect the plasma display panel for each connection of each flexible wiring board. On the other hand, when all of the flexible wiring boards are connected and then a lighting inspection is performed in a later process, it is necessary to identify the flexible wiring board having a problem portion. In this case, a defective connection product is passed to a subsequent process.

  An object of the present invention is to directly determine whether or not all electrode terminals are connected, without lighting the plasma display panel after connecting the flexible wiring board to the plasma display panel. In this way, it is possible to prevent a defective connection product from flowing into a subsequent process and to immediately take a necessary repair process.

  With respect to the above-described problems, in the present invention, screening is performed by actually installing a product and without turning on the plasma display panel by installing a crimping inspection apparatus. Two sets of probes that can hold the electrode terminals of the plasma display panel and the electrode terminals of the flexible wiring board are adopted for the crimping inspection apparatus. Two sets of probes hold the respective terminals and perform a continuity test in the crimping apparatus. Specific means are as follows.

  (1) Plasma having a plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region are formed at the end of the substrate, and a flexible wiring substrate for connecting the plasma display panel to a drive circuit In the display device, an inspection device for inspecting a connection state between the electrode terminal of the plasma display panel and the first terminal of the flexible wiring substrate, the inspection device comprising: a first of the flexible wiring substrate of the electrode terminal; The first probe is brought into contact with a portion closer to the display area than the portion to which the first terminal is connected, and the second probe is brought into contact with the second terminal for connecting the drive circuit of the flexible wiring board. Inspection device characterized by inspecting continuity.

  (2) The inspection apparatus according to (1), wherein the first probe is arranged inline.

  (3) The inspection apparatus according to (1), wherein the first probe has a staggered arrangement.

  (4) A plasma display having a plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region are formed at the end of the substrate, and a flexible wiring board on which a driver for driving the plasma display panel is mounted. An inspection apparatus for inspecting a connection between an electrode terminal of the plasma display panel and a first terminal of the flexible wiring board, wherein the inspection apparatus includes a first of the flexible wiring board of the electrode terminal. The first probe is brought into contact with the display region side of the portion to which the terminal is connected, and the second probe is brought into contact with the second terminal on the flexible wiring board on the side where the driver is mounted. The inspection apparatus characterized by inputting the signal of and inspecting continuity.

  (5) The inspection apparatus according to (4), wherein the first probe is arranged inline.

  (6) The inspection apparatus according to (4), wherein the first probe has a staggered arrangement.

  (7) A plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region are formed at an end of the substrate, and a first flexible wiring substrate for connecting the plasma display panel to a drive circuit A thermocompression bonding head for connecting the electrode terminal of the plasma display panel and the first terminal of the flexible wiring board by thermocompression bonding through an anisotropic conductive film. Then, after connecting the electrode terminal and the flexible wiring board, the probe that is in contact with the electrode terminal and the probe that is in contact with the second terminal of the flexible wiring board while holding the plasma display panel in the same position. A connecting device for inspecting the connection between the flexible wiring board and the electrode terminal.

  (8) A plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region is formed at an end of the substrate and a flexible wiring substrate for connecting the plasma display panel to a drive circuit are connected A method for manufacturing a plasma display device, wherein the electrode terminal of the plasma display panel and the first terminal of the flexible wiring substrate are connected by thermocompression bonding using a thermocompression bonding head through an anisotropic conductive film. Then, after connecting the electrode terminal of the plasma display panel and the flexible wiring board, the probe abutting on the electrode terminal of the plasma display panel and the flexible wiring board while holding the plasma display panel in the same position Using the probe abutting on the second terminal of the flexible terminal Method of manufacturing a plasma display apparatus for inspecting the Le wiring board to connect the electrode terminals of the plasma display panel.

  According to the present invention, the connection state between the electrode terminal of the plasma display panel and the flexible wiring board can be directly inspected for each terminal without lighting the plasma display panel. Therefore, it is possible to prevent defective products from flowing into the subsequent process. In addition, necessary repair processing can be quickly performed.

  Furthermore, in the past, since a lighting check was required, the connection inspection was performed by sampling. By using the present invention, 100% inspection can be performed immediately after connecting the electrode terminals of the plasma display panel and the flexible wiring board.

  Before describing specific embodiments of the present invention, the configuration of a plasma display device to which the present invention is applied will be described. In the present specification, a panel in which the front substrate and the rear substrate are combined is referred to as a plasma display panel 7, and a plasma display device in which a flexible wiring substrate 3 or a drive circuit is connected to the plasma display panel, Or it is called a plasma display module.

  FIG. 2 is an exploded perspective view showing a display area of the plasma display panel (PDP) 7. The PDP 7 is roughly composed of a front substrate 1 and a back substrate 2. On the front substrate 1, X electrodes 8 and Y electrodes 9 that repeatedly discharge during the display period are alternately arranged in parallel.

  The X electrode 8 is formed of a wide transparent electrode 81 serving as a discharge electrode formed of ITO, and a narrow metal electrode serving as a bus electrode formed of Cr—Cu—Cr. The Y electrode 9 is similarly formed from a transparent electrode 91 and a metal electrode. This electrode group is covered with a dielectric layer 10, and its surface is further covered with a protective layer 11 such as MgO.

  Similar to the front substrate 1, the back substrate 2 made of glass has address electrodes 12 arranged substantially perpendicular to the X electrodes 8 and Y electrodes 9, and the address electrodes 12 are covered with a dielectric layer 10. . Partitions 13 are arranged on both sides of the address electrode 12 to partition cells in the column direction. Further, a phosphor 14 which is excited by ultraviolet rays and generates visible light is applied to the side surfaces of the dielectric layer 10 and the partition wall 13 on the address electrode 12. The front substrate 1 and the back substrate 2 are bonded together so that the protective layer 11 and the partition wall 13 are in contact with each other, and the periphery of the display area of the front substrate 1 and the back substrate 2 is sealed with a sealing member 4, and gas is injected. To form PDP7.

  FIG. 3 is a plan view showing a structure of a general PDP 7 module, that is, a plasma display device. The chassis 15 provided on the back surface of the back substrate 2 of the PDP 7 has an X drive circuit 16 for applying a sustain voltage to the X electrode 8, and a Y drive circuit for selectively applying either the sustain voltage or the scan voltage to the Y electrode 9. 17, a driver module (ADM 29) equipped with an address driver IC, an address drive circuit 18 for applying an address voltage, a power supply circuit 20 for the drive circuit, and a control circuit 21 for controlling them.

  FIG. 4 is a side view of the PDP module. A sealing member 4 is provided between the front substrate 1 and the rear substrate 2 to seal the periphery of both substrates. Further, the back substrate 2 is attached to the chassis 15 with an adhesive material 22. To connect the X electrode 8 and Y electrode 9 of the front substrate 1 to the X drive circuit 16 and Y drive circuit 17, an ACF (anisotropic conductive film) 23 (not shown) is pasted on an FPC (flexible wiring substrate) 3, and the front surface It is crimped to the substrate 1 and is conductively connected.

  The ADM 29 shown in FIG. 3 is pressure-bonded to the address electrode 12 of the rear substrate 2 via the ACF (anisotropic conductive film) 23 as with the FPC 3, and the other end of the ADM 29 is controlled via the address drive circuit 18. The circuit 21 is conducted.

  Since the process of thermocompression bonding the FPC 3 to the X electrode 8 and the Y electrode 9 of the front substrate 1 and the process of crimping the ADM 29 to the address electrode 12 of the back substrate 2 are the same, the present invention inspects in both the crimping processes. Things are possible.

  FIG. 1 is a schematic diagram showing a first embodiment of the present invention. The continuity inspection device 5 according to the present invention is attached to the plasma display panel 7 to which the FPC 3 is pressure-bonded by an ordinary thermocompression bonding apparatus for confirmation of the pressure bonding of the FPC 3, and the continuity inspection is performed. The continuity testing device 5 includes a connection terminal (hereinafter referred to as a probe) 26 that can be pressed one by one with respect to the electrode terminal (X electrode 8 or Y electrode 9) of the PDP 7, and the other side of the FPC 3 that is in contact with the panel. A probe 27 that can hold one electrode terminal at a time is installed.

  FIG. 5 is a schematic cross-sectional view showing the arrangement of the probe 26 and the electrode terminal. The probes are arranged in-line from the probe support portion 261 corresponding to the electrode terminals 8 and 9. That is, the probe 26 has a structure in which needle electrodes are arranged in a straight line, and after positioning by the alignment mark, the electrode terminals can be pressed together. The pitch p of the probes 26 in FIG. 5 is the same as the electrode terminal pitch p shown in FIG. FIG. 5 shows the state of the probe 26 on the front substrate 1 side, but the configuration of the probe 17 at the other end of the FPC 3 is also the same. In FIG. 5, the tip of the probe 27 is thin so that it does not contact the adjacent terminal.

  FIG. 6 is a plan view of the electrode terminal. FIG. 6 is a plan view of the PDP 7 viewed from the back side. At the end of the front substrate 1, the electrode terminals of the X electrode 8 or the Y electrode 9 extending from the display area are arranged. An FPC 3 indicated by a dotted line is connected to the tip of each electrode terminal.

  Wirings (not shown) are formed in the FPC 3 at the same pitch corresponding to the electrode terminals of the X electrode 8 or the Y electrode 9 of the front substrate 1. The wiring of the FPC 3 is generally formed of a copper wiring. The FPC 3 and the electrode terminal of the X electrode 8 or Y electrode 9 formed on the front substrate 1 are connected via an ACF (anisotropic conductive film) 23 (not shown).

  In FIG. 6, the probe 26 comes into contact with the portion where the electrode terminal of the X electrode 8 or the Y electrode 9 formed on the front substrate 1 between the FPC 3 and the rear substrate 2 is exposed, and the continuity is inspected. In FIG. 6, the width w of the electrode terminal of the X electrode 8 or the Y electrode 9 is, for example, 100 μm, and the pitch p between the electrode terminals is 200 μm. Note that the pitch between the X electrode 8 and the Y electrode 9 in the display region is larger than 200 μm.

  The diameter of the probe 26 is formed so as not to come into contact with an adjacent electrode terminal when it comes into contact with the electrode terminal of the X electrode 8 or the Y electrode 9 of the front substrate 1. The diameter φ of the probe 26 is, for example, about 30 μm. The material of the probe is made of stainless steel, for example.

  FIG. 7 is a cross-sectional view showing the electrode terminal of the X electrode 8 at the end (electrode terminal part) of the front substrate 1. The electrode terminal of the X electrode 8 is formed by leading a metal electrode 82 of the X electrode in the display area to the end of the substrate. As shown in FIG. 7, the electrode terminal of the X electrode 8 has a three-layer structure of the base metal 51, the copper 52, and the protective metal 53 as described above. For the base metal 51, Cr having a strong adhesive force with glass is used, Cu is formed thereon, and Cr is formed on the Cu to protect Cu. The film thickness of Cr as the base metal 51 is 200 nm, the copper 52 is 3 μm, and the Cr as the protective metal 53 is 100 nm. Thus, Cu52 plays a role as conduction. Cr as the protective metal 53 has a role of preventing Cu from being oxidized. Since Cr as the base metal 51 is close to black, it also serves as a black matrix that darkens the non-display lines in the display area. The base metal 51 may have a laminated structure of CrO and Cr. This is because CrO is black and the role as a black matrix is superior to CrO. The X electrode 8 or Y electrode 9 is formed by depositing Cr, Cu, CrO or the like by sputtering and patterning it by a photolithography process.

As shown in FIG. 7, in the PDP, even if both the electrode terminals of the X electrode 8 and the Y electrode 9 are outside the sealing member 4, they are made of an inorganic protective film such as SiO ₂ or SiN or an organic film. It is not covered by a protective film. The copper wiring 52 is protected only by the Cr film 53. This is because the copper wiring 52 is as thick as 3 μm and is strong against the environment. Since the metal electrode is exposed at the substrate end (electrode terminal portion) in this way, the connection between the X electrode 8 of the back substrate and the FPC 3 is inspected using the electrode terminal of the back substrate 2 as in the present invention. In doing so, it is not necessary to change the terminal structure of the PDP 7 in particular. The X electrode 8 has been described above, but the same applies to the Y electrode 9.

  Returning to FIG. 1, the continuity test apparatus 5 is operated in this state, and the continuity between the electrode terminal on the X electrode 8 side in contact with the probe 26 and the probe 27 in contact with the wiring on the FPC 3 side corresponding to the electrode terminal is established. By confirming, it can be confirmed that the X electrode 8 and the FPC 3 are correctly crimped via the ACF 23.

  In addition, by detecting continuity between the electrode terminal on the X electrode 8 side in contact with the probe 26 and the probe 27 in contact with the wiring on the FPC 3 side that does not correspond to the electrode terminal, a defect due to a short circuit between the electrode terminals due to foreign matter is detected. be able to. In this way, it is possible to confirm the quality of the pressure-bonded state between the PDP 7 and the FPC 3. In the above description, the example of confirming the pressure bonding between the X electrode 8 and the FPC 3 has been described, but the pressure bonding between the Y electrode 9 and the FPC 3 can be confirmed in the same manner.

  Further, the same applies to the case where the address electrode 12 and the ADM 29 of the rear substrate 2 are pressure-bonded via an ACF (anisotropic conductive film) 23 instead of the X electrode 8 and the FPC 3. In the ADM 29, an address driver is mounted on a flexible wiring board. Therefore, in this case, a preset signal pattern or power supply voltage for ADM operation inspection is applied between the probes 26 and 27 from the continuity inspection device 5, and the actual operation output of the ADM 29 correctly matches a predetermined output. By checking this, it is confirmed that the address electrode 12 and the ADM 29 are correctly crimped via the ACF 23. In the inspection in this case, it is not necessary to operate the PDP 7 as in the case of the X electrode 8 and the Y electrode 9.

  In FIG. 1, only the line of the probe 26 is shown from the continuity inspection device 5, but this is a schematic diagram. Since the probe is thin and cannot be routed for a long distance, the probe actually protrudes from the probe support portion 261 or the like. In FIG. 1, the probe support portion 271 also serves to hold down the flexible wiring board 3, supports the flexible wiring board so that it does not hang down from the panel surface, and can have a structure that can be held and connected by air suction. Is possible.

  In the example of FIG. 1, the FPC 3 connection check has been described as the connection check with the X electrode 8 or the Y electrode 9 formed on the front substrate 1. However, in this embodiment, the address formed on the back substrate 2 is described. The present invention can also be applied to the connection between the electrode 12 and the address driver module (ADM 29). The pitch of the address electrodes 12 formed on the back substrate 2 is smaller than the pitch between the X electrodes 8 and the Y electrodes 9 formed on the front substrate. The same tendency is observed in the terminal portion of the address electrode led out to the end portion of the substrate. Therefore, it is more difficult to connect the electrode terminal of the X electrode 8 or the Y electrode 9 and the FPC 3 on the front substrate 1, and the effect of the present invention can be exhibited more.

  The address electrodes 12 formed on the back substrate 2 are different from the X electrodes 8 or Y electrodes 9 formed on the front substrate 1. For example, a silver paste is applied by printing, and this is sintered to form a conductor. Used. The address electrodes 12 are exposed outside the sealing member 4 without being covered with the protective film. Therefore, the connection between the ADM 29 and the address electrode 12 can be performed in the same manner as the connection between the electrode terminal of the X electrode 8 formed on the front substrate 1 and the FPC 3. The check of continuity with the ADM 29 by the probe 26 requires the input of a predetermined signal, but the basic operation of performing the necessary inspection using the probe 26 and the probe 27 is the same as described in the case of the X electrode or the like. It is.

  In the first embodiment, the probes 26 and 27 have a structure in which needle electrodes are arranged in a straight line and can be pressed together after positioning by an alignment mark. As shown in FIG. 5 of the first embodiment, the pitch p of the probes 26 is the same as the pitch p between the electrode terminals, for example, 0.2 mm. It may be mechanically difficult to place the probes at such a pitch.

  In the second embodiment, as shown in FIG. 8, the probes 26 are arranged in two rows, and the positions where the probes 26 contact the electrode terminals of the X electrode 8 or the Y electrode 9 are staggered. If it does so, the pitch between the probes 26 will become large and the design tolerance of the probe 26 can be raised significantly. FIG. 9 is a schematic cross-sectional view showing a state of connection between the probe 26 and the electrode terminal of the X electrode or the Y electrode. In FIG. 9, the hatched probe is, for example, a probe 26 that contacts an odd-numbered electrode terminal of the X electrode group, and a white probe 26 is a probe that contacts an odd-numbered electrode terminal of the X electrode group. The pitch in the horizontal direction of each probe is twice that in the first embodiment, for example, 0.4 mm.

  Returning to FIG. 8, in the front substrate 1, the electrode terminals of the X electrode 8 and the Y electrode 9 extend from the display region and are led out to the end of the substrate, as in FIG. 6. In FIG. 8, the odd-numbered electrode terminals of the X electrode group 8 are in contact with the probes 26 on the display area side, and the even-numbered electrode terminals are in contact with the probes 26 on the FPC3 side. If the distance p in the direction in which the electrodes extend of the terminals arranged in a staggered manner is 0.346 mm, for example, the distance q of the probe in the oblique direction is 0.4 mm.

  In the above example, the connection check of the FPC 3 has been described as the connection check with the X electrode 8 or the Y electrode 9 formed on the front substrate. However, in this embodiment, the address electrode 12 formed on the rear substrate 2 is used. And the address driver module (ADM 29) can be applied. The pitch of the address electrodes 12 formed on the back substrate 2 is smaller than the pitch between the X electrodes 8 and the Y electrodes 9 formed on the front substrate 1. Therefore, it is more difficult to connect the electrodes on the front substrate 1 and the FPC 3, and the effects of the present invention can be further exhibited.

  As described above, according to the present embodiment, since the distance between the probes 26 can be increased, the tolerance of the apparatus can be increased and measurement errors can be reduced.

  FIG. 10 is a schematic diagram showing a third embodiment of the present invention. In FIG. 10, the thermocompression bonding apparatus 28 includes the continuity inspection apparatus 5, probes 26 and 27, and the like. In the present embodiment, after the FPC 3 and the front substrate 1 are connected by thermocompression bonding, the continuity check can be performed.

  In FIG. 10, the PDP 7 is turned over and installed in the crimping apparatus. That is, it is placed on the panel support jig 25 with the front substrate 1 facing down and the back substrate 2 facing up. That is, FIG. 10 is a diagram in which the FPC 3 is connected to the X electrode 8 and the Y electrode 9 of the front substrate 1. The probe support portion 271 also has a function of placing the FPC 3 at the same time.

  In FIG. 10, the FPC 3 is connected to the electrode terminal of the front substrate through the ACF 23. This connection is performed using the crimping head 24. The crimping head 24 can move freely in the horizontal and vertical directions. The thermocompression bonding head 24 incorporates a heater (not shown) inside, thereby heating the pressure bonding surface to a desired temperature for pressure bonding.

  The pressure-bonding head 24 is composed of an upper head that actually pressurizes and heats the ACF 23 and a lower head that receives pressure from the upper head from below. There is a space between the tip of the crimping head 24 and the end of the back substrate 2, and the continuity check by the probe 26 can be performed.

  The planar shape of the electrode terminal portion of the front substrate 1 after the pressure bonding is the same as that in FIG. 6 in the first embodiment or FIG. 8 in the second embodiment. That is, the crimping head pressurizes and heats only the portion of the FPC 3 in FIG. 6, for example. There is no pressure bonding head between the FPC 3 and the back substrate, and the probe 26 is in contact with this portion. When the crimping by the crimping head is finished, the probes 26 arranged in an in-line or zigzag manner descend and come into contact with the electrode terminals of the X electrode 8 or the Y electrode 9.

  At the same time, the probe 27 also contacts the other terminal of the FPC 3 to check the continuity between the electrode terminal of the X electrode 8 or the Y electrode 9 and the other terminal of the FPC 3. A camera is installed in the vicinity of the thermocompression bonding head 24, and the connection operation by thermocompression bonding and the state in which the probe 26 contacts the electrode terminal of the X electrode 8 or the Y electrode 9 can be monitored by the monitor 6.

  By the way, a large number of FPCs 3 connected to the PDP 7 are connected to one side of the PDP, but this operation is repeated every time one PFC 3 is connected. For this reason, the thermocompression bonding head 24 is movable in the horizontal direction.

  As described above, according to this embodiment, it is possible to immediately check the connection failure after connecting the FPC 3 to the front substrate 1 by thermocompression bonding. Therefore, the defective product is not sent to the subsequent process. In addition, if a defective connection occurs, a regeneration process can be performed as necessary.

  Furthermore, in the present invention, the connection of the electrode terminal portion can be directly inspected without lighting the plasma display panel. In the case of inspection by lighting, even if an abnormality is found in a specific pixel, it is not always clear whether the electrode terminal portion of the front substrate or the rear substrate is connected to the flexible wiring substrate. On the other hand, the present invention has a feature that the continuity of the electrode terminal portion can be directly inspected.

  In the above example, the FPC 3 is connected to the electrode terminal of the X electrode 8 or the Y electrode 9 of the front substrate 1 and the connection between the FPC 3 and the electrode terminal is checked. However, the address electrode 12 formed on the rear substrate 2 is described. This can also be applied to the connection between the electrode terminal and the FPC 3. The address electrode 12 is different from the X electrode 8 or the Y electrode 9 formed on the front substrate 1 and is formed by applying a silver paste by printing and sintering. However, the FPC 3 is thermocompression-bonded via the ACF 23. Connecting is similar. Further, since the number of address electrodes 12 is larger than that of the X electrodes 8 or Y electrodes 9, the effect of increasing the efficiency of connection and inspection of the FPC 3 according to this embodiment is particularly great.

1 is a schematic diagram illustrating a pressure bonding inspection apparatus of Example 1. FIG. It is a disassembled perspective view which shows the structure of PDP. It is a rear view which shows the structure of the module of PDP. It is a side view which shows the structure of the module of PDP. FIG. 3 is a schematic diagram showing the arrangement of probes in Example 1. It is a top view which shows the relationship between the probe of Example 1, X electrode, and Y electrode. It is sectional drawing in the terminal part of X electrode. It is a top view which shows the relationship between the probe of Example 2, X electrode, and Y electrode. FIG. 6 is a schematic diagram showing the arrangement of probes in Example 2. 6 is a schematic diagram illustrating a pressure bonding inspection apparatus of Example 3. FIG. It is a schematic diagram which shows the prior art example of the connection test | inspection of a liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Front substrate 2 ... Back substrate 3 ... FPC (flexible wiring board)
4 ... Sealing member 5 ... Continuity inspection device 6 ... Monitor 7 ... PDP
8 ... X electrode 9 ... Y electrode 10 ... Dielectric layer 11 ... Protective layer 12 ... Address electrode 13 ... Partition 14 ... Phosphor layer 15 ... Chassis 16 ..X drive circuit,
17 ... Y drive circuit,
18: Address drive circuit,
20 ... Power supply circuit,
21 ... Control circuit 22 ... Adhesive material 23 ... ACF (anisotropic conductive film)
24 ... thermocompression bonding head,
25 ... Panel support jig 26 ... Probe (for panel electrode)
27 ... Probe (for flexible wiring board electrodes)
28 ... Thermocompression bonding equipment 29 ... Address driver module (ADM)
31 ... Workbench 32 ... Liquid crystal display panel 33 ... Glass substrate 34 ... Glass substrate 2
35 ... Drive unit 36 ... Probe unit 37 ... LSI chip 38 ... Connection terminal 39 ... Thermocompression bonding unit 40 ... Cable 41 ... Arm 42 ... Anisotropic conductive bonding Material 51: Underlying metal 52 ... Copper wiring 53 ... Protective metal 81 ... X transparent electrode 82 ... Y transparent electrode 261, 271 ... Probe support.

Claims (8)

In a plasma display device having a plasma display panel in which a plurality of electrode terminals corresponding to each electrode of an electrode group in a display region are formed at an end of the substrate, and a flexible wiring substrate for connecting the plasma display panel to a drive circuit , An inspection device for inspecting a connection state between the electrode terminal of the plasma display panel and the first terminal of the flexible wiring board,
The inspection apparatus contacts the first probe at a portion of the electrode terminal closer to the display area than a portion of the flexible wiring board to which the first terminal is connected, and connects the driving circuit of the flexible wiring board. An inspection apparatus for inspecting continuity by bringing a second probe into contact with a second terminal for performing the inspection.   The inspection apparatus according to claim 1, wherein the first probe is arranged inline.   The inspection apparatus according to claim 1, wherein the first probe has a staggered arrangement. In a plasma display device having a plasma display panel in which a plurality of electrode terminals corresponding to each electrode of an electrode group in a display region is formed at an end of the substrate, and a flexible wiring board on which a driver for driving the plasma display panel is mounted, An inspection apparatus for inspecting a connection between an electrode terminal of the plasma display panel and a first terminal of the flexible wiring board,
The inspection apparatus is configured to bring the first probe into contact with a portion of the electrode terminal closer to the display area than a portion to which the first terminal of the flexible wiring board is connected, and mount the driver of the flexible wiring board An inspection apparatus, wherein a second probe is brought into contact with a second terminal on the side to be inspected, and a predetermined signal is input to inspect continuity.   The inspection apparatus according to claim 4, wherein the first probe is arranged inline.   The inspection apparatus according to claim 4, wherein the first probe has a staggered arrangement. A plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region are formed at an end of the substrate;
A connection device for connecting a first terminal of a flexible wiring board for connecting the plasma display panel to a drive circuit,
A thermocompression bonding head for connecting the electrode terminal of the plasma display panel and the first terminal of the flexible wiring board by thermocompression bonding through an anisotropic conductive film;
After connecting the electrode terminal and the flexible wiring board, using the probe that is in contact with the electrode terminal and the probe that is in contact with the second terminal of the flexible wiring board while holding the plasma display panel in the same position A connection device for inspecting a connection between the flexible wiring board and the electrode terminal. A plasma display panel in which a plurality of electrode terminals corresponding to each electrode of the electrode group in the display region are formed at an end of the substrate;
A method of manufacturing a plasma display device connected to a flexible wiring substrate for connecting the plasma display panel to a drive circuit,
The electrode terminal of the plasma display panel and the first terminal of the flexible wiring board are connected by thermocompression bonding using a thermocompression bonding head through an anisotropic conductive film,
After connecting the electrode terminal of the plasma display panel and the flexible wiring board, the probe that is in contact with the electrode terminal of the plasma display panel and the flexible wiring board are held while holding the plasma display panel in the same position. A method for manufacturing a plasma display device, wherein a connection between the flexible wiring board and the electrode terminal of the plasma display panel is inspected using a probe that is in contact with two terminals.

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