JP2010092921A - Apparatus and method for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for processing capable of securely supplying a processing liquid heated at predetermined temperature to a substrate. <P>SOLUTION: The apparatus for processing includes a liquid reservoir tank 32 in which the processing liquid is reserved, a supply pump 34 for supplying the processing liquid reserved in the liquid reservoir tank 32 to an upper nozzle body 31 for injection to the substrate through a liquid feed duct 33, a first heating heater 37 provided to the liquid feed duct and heating the processing liquid supplied to the upper nozzle body at the predetermined temperature, a temperature sensor 43 for measuring the temperature of the processing liquid injected from the upper nozzle body by the supply pump when the upper nozzle body is at a stand-by position off an upper surface of the substrate, and a controller for moving the upper nozzle body to above the substrate based on a detection when the temperature sensor detects the measured temperature of the processing liquid being above the predetermined temperature and making the upper nozzle body inject the processing liquid. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate processing apparatus and a processing method for processing a substrate with a heated processing liquid.

  For example, in a manufacturing process of a liquid crystal display device or a semiconductor device, a resist is applied to a substrate such as a glass substrate or a semiconductor wafer, which is an object, and a development process is performed before an etching process. A circuit pattern is precisely formed. When the circuit pattern is formed on the substrate, a cleaning process is performed to remove organic substances such as a resist film and a resist residue remaining on the surface of the substrate.

When the resist film is removed by washing, a treatment liquid in which sulfuric acid (H ₂ SO ₄ ) and hydrogen peroxide water (H ₂ O ₂ ) are mixed is used as the treatment liquid. The treatment liquid in which sulfuric acid and hydrogen peroxide solution are mixed rises to about 100 ° C. due to reaction heat. When the temperature of the treatment liquid is increased by the reaction heat, the resist stripping rate can be increased accordingly.

  On the other hand, in order to further increase the resist stripping rate, it has been studied to perform the resist stripping process by heating the treatment liquid to a temperature of 100 ° C. or higher, for example, about 200 to 250 ° C., which is a temperature increase due to reaction heat. Yes.

  By the way, a liquid storage tank for storing the processing liquid, a pipe for supplying the nozzle body that injects the liquid from the liquid storage tank toward the substrate, a valve for controlling the supply, etc. are provided with chemical resistance. Synthetic resins such as fluororesin and vinyl chloride are often used.

  However, since these synthetic resins have a low softening temperature of about 60 to 120 ° C., it is impossible to use the processing liquid at a temperature of 200 to 250 ° C. in order to sufficiently increase the resist peeling rate. was there.

  In Patent Document 1, when pure water and nitrogen gas as a processing liquid are jetted from a two-fluid nozzle toward a substrate to remove a resist, the pure water and nitrogen gas supply source are downstream, It is shown that a heater is provided on the upstream side where pure water and nitrogen gas flow into the two-fluid nozzle, and the pure water and nitrogen gas are heated by the heater and injected from the two-fluid nozzle toward the substrate. .

According to such a configuration, it is not necessary to store heated pure water or nitrogen gas in a tank or to control supply by a valve, and there is also a conduit through which heated pure water or nitrogen gas flows. Since it can be shortened, it becomes possible to form most parts of a tank, a valve, or piping with the synthetic resin mentioned above.
JP 2007-13489 A

  However, pure water and nitrogen gas remaining in the pipe line between the heater and the two-fluid nozzle ejected from the two-fluid nozzle toward the substrate at the start of the supply of the processing liquid are sufficiently heated by the heater. Therefore, the temperature is inevitably lower than the temperature heated by the heater.

  Therefore, since the processing liquid that is not heated to the target temperature by the heater is supplied to the substrate at the start of the supply of the processing liquid, the resist is removed from the portion of the substrate to which the processing liquid having a temperature lower than the predetermined temperature is supplied. It may not be peeled off reliably.

  The present invention is directed to a substrate processing apparatus and a processing which can reliably supply a processing liquid heated to a predetermined temperature to a substrate when the processing liquid heated from the supply nozzle is supplied to the substrate. It is to provide a method.

The present invention is a processing apparatus for processing a substrate with a heated processing liquid,
A liquid storage tank in which the treatment liquid is stored;
Liquid supply means for supplying the processing liquid stored in the liquid storage tank to the nozzle body for spraying the substrate through a liquid supply line;
A first heating means for heating the treatment liquid supplied to the nozzle body provided in the liquid supply pipe line to a predetermined temperature;
Temperature measuring means for measuring the temperature of the processing liquid sprayed from the nozzle body by the liquid supply means when the nozzle body is in a standby position off the upper surface of the substrate;
Control means for ejecting the processing liquid by moving the nozzle body above the substrate based on the detection when detecting that the temperature of the processing liquid measured by the temperature measuring means is the predetermined temperature; A substrate processing apparatus characterized by comprising:

The substrate is held and rotated by a rotary table, and the nozzle body is provided at the tip of an arm body driven by a drive source,
When the temperature measuring means detects that the temperature of the processing liquid is the predetermined temperature, the control means operates the drive source based on the detection to move the nozzle body above the substrate. Is preferred.

  When the nozzle body is in a standby position off the upper surface of the substrate, the nozzle body has a receiving portion for receiving the processing liquid sprayed from the nozzle body by the liquid supply means, and the receiving portion and the liquid storage tank are It is preferable that a cooling means connected to the recovery pipe is provided in the middle of the recovery pipe to cool the processing liquid received by the receiving portion.

Second heating means for heating the treatment liquid in the liquid storage tank is provided, and the treatment liquid heated by the second heating means is further heated to the predetermined temperature by the first heating means. preferable.

The present invention is a processing method of processing a substrate with a heated processing liquid,
Supplying the processing liquid stored in the liquid storage tank to the nozzle body for ejecting the processing liquid to the substrate;
Heating the treatment liquid supplied to the nozzle body to a predetermined temperature;
Measuring the temperature of the processing liquid ejected from the nozzle body when the nozzle body is in a standby position off the upper surface of the substrate;
And a step of ejecting the processing liquid by moving the nozzle body above the substrate based on the detection when detecting that the temperature of the processing liquid is the predetermined temperature. It is in the processing method of a board | substrate.

  According to the present invention, when the nozzle body is at the standby position deviated from the upper surface of the substrate, the processing liquid is sprayed from the nozzle body to measure the temperature, and when the temperature reaches a predetermined temperature, the nozzle body is moved to the substrate. The processing liquid is sprayed onto the substrate by moving the substrate upward.

  Therefore, when the processing liquid is sprayed and supplied from the nozzle body to the substrate, it is possible to prevent the processing liquid below a preset temperature from being sprayed, so that the processing of the substrate with the processing liquid can be made uniform. Become.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 3 show a liquid according to a first embodiment of the present invention, and the spin processing apparatus shown in FIG. A plurality of discharge pipes 2 are connected to the bottom of the cup body 1 at a predetermined interval in the circumferential direction. Each discharge pipe 2 communicates with an exhaust pump (not shown).

  The cup body 1 has a lower cup 1a and an upper cup 1b, and the upper cup 1b can be driven in the vertical direction by a driving mechanism such as a cylinder (not shown).

  A rotating table 3 as a holding portion is provided in the cup body 1. A plurality of support members 4 are rotatably provided at predetermined intervals in the circumferential direction on the periphery of the upper surface of the turntable 3. On the upper end surface of each support member 4, a locking pin 5 is provided at a position eccentric from the rotation center of the support member 4, and a support pin 6 is provided at the rotation center.

  A substrate W such as a semiconductor wafer is supplied to the turntable 3. That is, the substrate W is supplied so that the lower surface of the peripheral edge portion is supported by the support pins 6. When the support member 4 rotates in this state, the locking pin 5 rotates eccentrically, so that the outer peripheral surface of the substrate W is held by the locking pin 5.

  The rotary table 3 is rotationally driven by a control motor 11. In the control motor 11, a cylindrical rotor 13 is also rotatably inserted into a cylindrical stator 12, and the rotary table 3 is connected to the rotor 13 via a power transmission member 13a. Yes.

  The rotation of the control motor 11 is controlled by the control device 14. Thereby, the rotary table 3 can be rotated at a predetermined rotational speed by the control device 14.

  A cylindrical fixed shaft 15 is inserted into the rotor 13. A nozzle head 16 positioned on the upper surface side of the rotary table 3 is provided at the upper end of the fixed shaft 15. That is, the nozzle head 16 is provided in a state not interlocked with the rotation of the rotary table 3. The nozzle head 16 is provided with lower nozzle bodies 17 and 18 for injecting processing liquid and gas.

  As a result, the processing liquid and the gas can be selectively ejected from the lower nozzle bodies 17 and 18 toward the central portion of the lower surface of the substrate W held on the rotary table 3. In other words, the lower surface of the substrate W can be cleaned and dried.

  The upper surface side of the rotary table 3 is covered with a turbulent flow prevention cover 19. The turbulent flow prevention cover 19 prevents the turbulent flow from occurring on the lower surface side of the substrate W held on the rotary table 3. A through hole 20 is formed in the lower surface of the substrate so as to be able to inject a processing liquid or gas.

  A drive mechanism 23 is provided on the side of the cup body 1. The drive mechanism 23 includes a swinging shaft portion 24 provided with the vertical axis, and an arm body 25 provided with a base end connected to the upper end of the swinging shaft portion 24 and provided horizontally. The lower end of the oscillating shaft portion 24 is connected to a rotary motor 26 as a drive source. The rotation motor 26 is configured to rotate the arm body 25 at a predetermined angle.

  The rotary motor 26 is attached to a movable plate 27 that is slidable in the vertical direction by a linear guide (not shown). The movable plate 27 is driven in the vertical direction by the vertical drive cylinder 28.

  At the tip of the arm body 25, an upper nozzle body 31 for supplying a processing liquid to the upper surface of the substrate W is provided. As shown in FIG. 2, the upper nozzle body 31 is supplied with a stripping liquid made of sulfuric acid as a processing liquid stored in a liquid storage tank 32 through a liquid supply pipe 33.

  A supply pump 34 serving as a supply means for supplying the stripping liquid in the liquid storage tank 32 under pressure to the liquid supply pipe 33, and a flow meter 35 for measuring the flow rate of the stripping liquid flowing through the liquid supply pipe 33 by the supply pump 34. A first heater 37 is sequentially provided as a first heating means for heating the stripping solution supplied to the upper nozzle body 31 by the opening / closing valve 36 and the supply pump 34 to a predetermined temperature, for example, 200 to 250 ° C. ing.

  The liquid storage tank 32 is provided with a circulation line 39 having one end and the other end connected to different portions of the liquid storage tank 32, for example, the bottom surface and the side surface. The circulation line 39 is provided with a circulation pump 41 and a second heater 42.

  When the circulation pump 41 is operated, the stripping liquid in the liquid storage tank 32 flows through the circulation pipe 39 and is heated by the second heater 42. The second heater 42 heats the stripping solution to about 100 ° C. Accordingly, the first heater 37 heats the stripping solution heated to 100 ° C. by the second heater 42 to 200 to 250 ° C.

  As described above, since the stripping solution is heated to 200 to 250 ° C. by the first heater 37, most of the liquid storage tank 32, the supply pump 34, the flow meter 35, the on-off valve 36, and the supply pipeline 33 are used. This portion can be formed of a synthetic resin material having heat resistance that does not soften at a temperature up to 100 ° C. and chemical resistance to sulfuric acid, such as a fluororesin.

  The position where the upper nozzle body 31 deviates from the upper surface of the substrate W held on the turntable 3, that is, as shown in FIG. 3, before the supply of the stripping liquid to the substrate W is started or after the supply is finished. When waiting, the upper nozzle body 31 faces the receiving portion 44 at the lower end surface. That is, the receiving portion 44 is fixedly provided at the standby position. The receiving portion 44 is adapted to receive the peeling liquid sprayed from the upper nozzle body 31.

  In addition, if the upper nozzle body 31 is lowered by the vertical drive cylinder 28 and the separation liquid is sprayed to the receiving part 44 by reducing the distance from the receiving part 44, the peeling liquid is prevented from being scattered around. Can do.

  When the stripping liquid is ejected from the upper nozzle body 31, the temperature of the stripping liquid is detected by a temperature sensor 43 such as a thermocouple or an infrared sensor as temperature measuring means. A detection signal from the temperature sensor 43 is output to the control device 14. Upon receiving the detection signal, the control device 14 compares the detection signal with a set temperature set in a comparison unit (not shown). The set temperature is set to a temperature of 200 to 250 ° C., for example, 230 ° C., at which the stripping solution is heated by the first heater 37.

  When the temperature of the stripping liquid sprayed from the upper nozzle body 31 waiting at the standby position reaches a set temperature, the control device 14 operates the rotary motor 26 to provide the arm body provided with the upper nozzle body 31. 25 is driven, and the upper nozzle body 31 is swung along the radial direction across the substrate W above the substrate W.

  At the standby position, the stripping liquid received by the receiving portion 44 from the upper nozzle body 31 is returned to the liquid storage tank 32 by a recovery pipe 45. The recovery pipe line 45 is provided with a cooler 46 as a cooling means for cooling the stripping liquid heated to 230 ° C., which is a predetermined temperature, ejected from the upper nozzle body 31 to 100 ° C. This prevents the processing liquid above the heat-resistant temperature of the liquid storage tank 32 from returning to the liquid storage tank 32.

  The liquid storage tank 32 is provided with a first liquid supply pipe 47 for supplying the stripping liquid and a second liquid supply pipe 48 for supplying pure water for cleaning the liquid storage tank 32, respectively. Connected through.

Next, an operation for removing the resist remaining on the upper surface of the substrate W by the processing apparatus having the above-described configuration will be described.
Before the processing of the substrate W is started, the upper nozzle body 31 is positioned so as to face the standby position, that is, the receiving portion 44. In this state, when the unprocessed substrate W is supplied to the turntable 3 and the resist device attached to the substrate W is started to be removed by the control device 14, the supply pump 34 is operated first. The stripping solution heated by the heater 37 is sprayed from the upper nozzle body 31. When the stripping liquid is ejected from the upper nozzle body 31, the temperature of the stripping liquid is detected by the temperature sensor 43.

  Until the stripping liquid remaining in the liquid supply conduit 33 between the first heater 37 and the top nozzle body 31 is completely ejected from the upper nozzle body 31, the temperature of the stripping liquid detected by the temperature sensor 43 is controlled by the control device. It does not reach 230 ° C., which is the set temperature set to 14.

  When the stripping liquid remaining in the liquid supply pipe 33 is completely ejected and the temperature of the stripping liquid detected by the temperature sensor 43 reaches the set temperature set in the control device 14, the detection signal is output to the control device 14. Is done.

  When the detection signal is output to the control device 14, the control device 14 operates the rotation motor 26 to swing the arm body 25, so that the upper nozzle body 31 is held by the rotary table 3 and the rotating substrate W is rotated. Above, it is driven to swing in the direction across the substrate W while spraying the stripping liquid toward the upper surface of the substrate W.

  As a result, the stripping solution heated to 230 ° C. is uniformly supplied to the upper surface of the substrate W, so that the resist remaining on the upper surface of the substrate W can be stripped and removed. That is, since the processing liquid that has not risen to the predetermined temperature of 230 ° C. is not sprayed onto the substrate W, the processing of the substrate W by the processing liquid can be performed reliably and rapidly.

  Until the upper nozzle body 31 swings upward from the standby position above the substrate W, the on-off valve 36 is closed, and the stripping liquid is prevented from being unnecessarily ejected from the upper nozzle body 31. Since the time for closing the on-off valve 36 is short, the temperature of the stripping solution staying in the common pipe 33 is not affected.

  The stripping liquid sprayed to the receiving portion 44 by the upper nozzle body 31 at the standby position is collected in the liquid storage tank 32 through the recovery pipe 45, so that the stripping liquid sprayed from the upper nozzle body 31 at the standby position is useless. Never become.

  At the standby position, the stripping liquid sprayed to the receiving portion 44 is cooled to about 100 ° C. by the cooler 46 and returned to the liquid storage tank 32. For this reason, since the high temperature stripping liquid sprayed from the upper nozzle body 31 does not return directly to the liquid storage tank 32, the liquid storage tank 32 can be made of a synthetic resin having a relatively low softening temperature. .

  In the above embodiment, sulfuric acid as a stripping solution is heated to 100 ° C. by the second heater and then heated to 200 to 250 ° C. by the first heater. Hydrogen peroxide water may be supplied, and the temperature of sulfuric acid may be raised to about 100 ° C. by these reaction heats, and then heated to a predetermined temperature by the first heater.

  Further, the processing liquid is not limited to a stripping solution such as sulfuric acid for stripping the resist from the substrate, and the present invention can be applied if the processing liquid is heated to a high temperature to process the substrate.

  FIG. 4 shows a second embodiment of the present invention. In this embodiment, the receiving portion 44A that receives the processing liquid sprayed from the upper nozzle body 31 is disposed at a position outside the swing range of the upper nozzle body 31 that is swung by the arm body 25 as shown by the solid line. Has been.

  Then, the receiving portion 44A is disposed within the range of oscillation of the upper nozzle body 31 indicated by a chain line from outside the range of oscillation of the upper nozzle body 31 indicated by a solid line by a drive source 51 such as a cylinder or a linear motor. It is provided so as to be able to be driven at a part off the upper surface of W.

  As a result, the receiving portion 44A is positioned at a position corresponding to the swing trajectory of the upper nozzle body 31 and off the upper surface of the substrate W only when receiving the processing liquid from the upper nozzle body 31.

44 A of said receiving parts are formed in the container shape by which the opening part 52 which opposes the front-end | tip part of the said upper nozzle body 31 was formed in the upper surface. Accordingly, when the processing liquid is ejected from the upper nozzle body 31 to the receiving portion 44A, the upper nozzle body 31 is lowered and its tip is brought close to the opening 52 to eject the processing liquid. It is possible to prevent the processing liquid from scattering around the receiving portion 44A.
The receiving portion 44A shown in the second embodiment may be applied to the first embodiment.

  In the first and second embodiments, the case where the upper nozzle body is swung in the radial direction above the substrate by the arm body has been described as an example. However, the upper nozzle body is disposed above the substrate, You may make it process linearly along a radial direction and process with a process liquid.

The schematic block diagram of the processing apparatus which shows 1st Embodiment of this invention. The piping system figure which shows the flow path which collect | recovers to the said liquid storage tank, after supplying a process liquid from the liquid storage tank to the upper nozzle body of a standby position. The schematic diagram which shows the state which an upper nozzle body opposes and waits for the receiving part arrange | positioned in a standby position. The schematic diagram which shows the arrangement | positioning relationship between the receiving part and upper nozzle body which show 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 3 ... Rotary table, 14 ... Control apparatus, 25 ... Arm body, 26 ... Rotation motor (oscillation drive source), 31 ... Upper nords body, 32 ... Liquid storage tank, 33 ... Liquid supply line, 34 ... Supply pump ( (Liquid supply means), 37 ... first heater (first heating means), 42 ... second heater (second heating means), 43 ... temperature sensor (temperature measuring means), 46 ... cooler ( Cooling means).

Claims (5)

A processing apparatus for processing a substrate with a heated processing liquid,
A liquid storage tank in which the treatment liquid is stored;
Liquid supply means for supplying the processing liquid stored in the liquid storage tank to the nozzle body for spraying the substrate through a liquid supply line;
A first heating means for heating the treatment liquid supplied to the nozzle body provided in the liquid supply pipe line to a predetermined temperature;
Temperature measuring means for measuring the temperature of the processing liquid sprayed from the nozzle body by the liquid supply means when the nozzle body is at a standby position off the upper surface of the substrate;
Control means for ejecting the processing liquid by moving the nozzle body above the substrate based on the detection when detecting that the temperature of the processing liquid measured by the temperature measuring means is the predetermined temperature; An apparatus for processing a substrate, comprising: The substrate is held and rotated by a rotary table, and the nozzle body is provided at the tip of an arm body driven by a drive source,
When the temperature measuring means detects that the temperature of the processing liquid is the predetermined temperature, the control means operates the drive source based on the detection to move the nozzle body above the substrate. The substrate processing apparatus according to claim 1.   When the nozzle body is at a standby position deviated from the upper surface of the substrate, the nozzle body has a receiving portion for receiving the processing liquid ejected from the nozzle body by the liquid supply means, and the receiving portion and the liquid storage tank are recovered. 2. The substrate processing apparatus according to claim 1, wherein the substrate is connected by a tube, and a cooling means for cooling the processing liquid received by the receiving portion is provided in the middle portion of the recovery tube. Second heating means for heating the processing liquid in the liquid storage tank is provided, and the processing liquid heated by the second heating means is further heated to the predetermined temperature by the first heating means. The substrate processing apparatus according to claim 1. A processing method for processing a substrate with a heated processing liquid,
Supplying the processing liquid stored in the liquid storage tank to the nozzle body for ejecting the processing liquid to the substrate;
Heating the treatment liquid supplied to the nozzle body to a predetermined temperature;
Measuring the temperature of the processing liquid ejected from the nozzle body when the nozzle body is in a standby position off the upper surface of the substrate;
And a step of ejecting the processing liquid by moving the nozzle body above the substrate based on the detection when detecting that the temperature of the processing liquid is the predetermined temperature. Substrate processing method.

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