JP2010091449A - Probe card, and apparatus and method of inspecting semiconductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of efficient inspection of a semiconductor integrated device, and an apparatus and a method of inspecting a semiconductor. <P>SOLUTION: Probe pins P<SB>OUT</SB>1 and P<SB>OUT</SB>2 are provided, which are in contact with each other terminal of a plurality of output terminals placed corresponding to each of a plurality of semiconductor integrated devices arranged side by side on a substrate and owned by each semiconductor integrated device. The probe pin P<SB>OUT</SB>1 is in contact with even-numbered (or odd-numbered) output terminals of one of adjacent semiconductor integrated devices, and the probe pin P<SB>OUT</SB>2 is in contact with odd-numbered (or even-numbered) output terminals of the other adjacent semiconductor integrated device. With such a constitution, all of the IC devices 1 of a semiconductor wafer to be inspected can be inspected without need of replacing a probe card. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a probe card for inspecting a semiconductor integrated device, a semiconductor inspection apparatus using the probe card, and a semiconductor inspection method.

Conventionally, in a manufacturing process of a semiconductor integrated device, a plurality of semiconductor integrated devices are arranged in parallel on a semiconductor wafer or a film substrate (hereinafter also referred to as a substrate), etc. In addition, a function test to check whether the circuit operates correctly, whether or not the terminals are correctly conducted, and a characteristic test to measure a resistance value, a capacitance value, and the like) are performed. Each of the semiconductor integrated devices often includes input terminals or output terminals arranged at a predetermined interval.
When testing such a semiconductor integrated device, a probe pin is brought into contact with a terminal of the semiconductor integrated device to be measured among a plurality of semiconductor integrated devices arranged side by side on the substrate etc. The test pattern is applied or the output signal is detected. Further, such inspection is sequentially performed on a plurality of semiconductor integrated devices on the substrate.

Here, in recent semiconductor integrated devices, with the rapid progress of high density integration, narrowing of the pitch of input / output terminals has become remarkable. In particular, the tendency is remarkable in a driver circuit used for a liquid crystal display (LCD: Liquid Crystal Display) and the like, which are remarkably progressing in the increase in pixels and the screen. As the terminals of the semiconductor integrated device are narrowed, it is necessary to reduce the arrangement interval of the probe pins. However, the arrangement interval of the probe pins should be reduced in accordance with the terminal arrangement of the semiconductor integrated device. Is becoming difficult.

Under such circumstances, an array structure in which every other probe pin is in contact with the terminals arranged on the semiconductor integrated device, and the probe pin is brought into contact with the even-numbered terminals for the first inspection. After that, a method of inspecting a semiconductor integrated device is performed by bringing a probe pin into contact with an odd-numbered terminal and performing a second inspection. When such a method is used, a separate probe card for contacting probe pins to even-numbered terminals and a separate probe card for contacting probe pins to odd-numbered terminals are prepared for exclusive use. Is done.
Patent Document 1 describes a probing test method for the purpose of improving the productivity of a semiconductor integrated circuit and suppressing the production cost. In the technique described in Patent Document 1, a plurality of semiconductor integrated devices are prepared as probe pin groups for inspecting one semiconductor integrated device, and a plurality of semiconductor integrated devices arranged in parallel on a semiconductor wafer are provided. On the other hand, individual inspections will be performed at the same time.
JP 2001-77162 A

However, a probe card for contacting probe pins to even-numbered terminals,
In the case of the above-described inspection method using the probe card for bringing the probe pin into contact with the odd-numbered terminals, since two inspections are performed by replacing two kinds of probe cards, the inspection man-hours increase and the inspection time also increases. Will increase.
In the technique described in Patent Document 1, it is possible to shorten the inspection time by preparing probe pins for a plurality of semiconductor integrated devices and simultaneously inspecting a plurality of semiconductor integrated devices. Narrowing the arrangement interval of the probe pins is becoming a limit, and it has not been a means to solve it.
As described above, under the circumstance where the pitch of the input / output terminals in the semiconductor integrated device is becoming narrower, it is difficult to efficiently inspect the semiconductor integrated device in the conventional technique.
An object of the present invention is to efficiently inspect a semiconductor integrated device.

In order to solve the above technical problem, the first invention provides electrical characteristics of a semiconductor integrated device having a plurality of terminals (for example, the output terminal 1b in FIG. 1B) arranged in a predetermined row. A plurality of semiconductor integrated devices (for example, IC devices 1 in FIGS. 1A and 1B) arranged in parallel on a substrate,
A plurality of probe pin groups (for example, each of the probe pins P _OUT 1 and P _OUT 2 in FIGS. 2A and 2B) that are in contact with a predetermined number of terminals among the plurality of terminals included in each semiconductor integrated device.
Each of the probe pin groups is in contact with terminals at different arrangement positions in the row on the semiconductor integrated device.
According to the first invention, since it is possible to configure the probe card capable of performing the functional inspection on the entire semiconductor integrated device as the inspection object without requiring the replacement of the probe card, the inspection man-hours and the inspection can be performed. Semiconductor inspection can be performed with high efficiency without increasing the time. That is, according to the present invention, it is possible to efficiently inspect a semiconductor integrated device.

The second invention is the probe card of the first invention, wherein the plurality of probe pin groups are:
Among the plurality of semiconductor integrated devices arranged side by side on the substrate, the first semiconductor integrated device (for example, IC device 1 (1, 1) in FIG. 1B) is installed corresponding to the plurality of semiconductor integrated devices. Of the terminals, a first group of probe pins that contact every other terminal (for example, FIG.
b) corresponding to the probe pin P _OUT 1) and the second semiconductor integrated device (for example, the IC device 1 (1, 2) in FIG. 1B) among the plurality of semiconductor integrated devices. A second probe pin group (for example, the probe pin P _OUT 2 in FIGS. 2A and 2B) that is installed and contacts every other terminal among the plurality of terminals, and The first probe pin group contacts a terminal at an odd-numbered arrangement position in the column in the first semiconductor integrated device, and the second probe pin group is in the column in the second semiconductor integrated device. It contacts the terminals at even-numbered array positions.
According to a third invention, in the probe card of the second invention, the first semiconductor integrated device that comes into contact with the first probe pin group, and the second that comes into contact with the second probe pin group.
These semiconductor integrated devices are characterized by being adjacent in a plan view.

A fourth invention is a semiconductor inspection apparatus for inspecting electrical characteristics of a semiconductor integrated device having a plurality of terminals arranged so as to form a predetermined row, and the plurality of semiconductors arranged in parallel on a substrate A plurality of probe pin groups that are installed corresponding to each integrated device and are in contact with a predetermined number of terminals among the plurality of terminals included in each semiconductor integrated device, and each of the probe pin groups includes the semiconductor integrated device A probe card (for example, the probe card 1 in FIGS. 2A and 2B) that contacts terminals at different arrangement positions in the row on the device.
0) and the probe card and the substrate are moved relative to each other to simultaneously contact the probe card with a plurality of the semiconductor integrated devices (for example, the control units 14 and 2 in FIG. 3).
1) and a test unit (for example, the test unit 13 in FIG. 3) for obtaining the inspection results of the plurality of semiconductor integrated devices via the probe pin group.

According to the fourth aspect of the present invention, the function inspection can be performed without requiring replacement of the probe card by moving the semiconductor integrated device and the probe card relative to all of the semiconductor integrated devices as inspection objects. Therefore, the semiconductor inspection can be performed with high efficiency without increasing the inspection man-hours and the inspection time. That is, according to the present invention, it is possible to efficiently inspect a semiconductor integrated device.

According to a fifth aspect of the invention, in the semiconductor inspection apparatus of the fourth aspect, the test unit can acquire the inspection result of one of the semiconductor integrated devices using a part of the probe pin group in the probe card. It is characterized by being.
According to the fifth invention, even when inspecting the semiconductor integrated device at the end position of the semiconductor integrated devices arranged side by side, the function inspection can be performed without requiring replacement of the probe card. Semiconductor inspection can be performed with high efficiency without increasing the inspection time. That is, according to the present invention, it is possible to efficiently inspect a semiconductor integrated device.

According to a sixth invention, in the semiconductor inspection apparatus of the fourth or fifth invention, the inspection results relating to the same semiconductor integrated device acquired by the test unit are integrated, and based on the integrated inspection results, Determination means for determining the quality of a semiconductor integrated device (for example,
The data server 16) of FIG. 3 is provided. According to the sixth invention, it is possible to easily grasp the function test result of each semiconductor integrated device.

A seventh invention is a semiconductor inspection method for inspecting electrical characteristics of a semiconductor integrated device having a plurality of terminals arranged in a predetermined row, wherein the plurality of semiconductors are arranged in parallel on a substrate. Corresponding to each of the integrated devices, a plurality of probe pin groups that contact a predetermined number of terminals among the plurality of terminals of each semiconductor integrated device are installed, and each of the probe pin groups is placed on the semiconductor integrated device. In the above-described arrangement, terminals at different arrangement positions in the row are brought into contact with each other.
According to the seventh aspect, since the functional inspection can be performed on the entire semiconductor integrated device as the inspection object without requiring the replacement of the probe card, the inspection man-hour and the inspection time are not increased. It becomes possible to perform semiconductor inspection with high efficiency. That is, according to the present invention, it is possible to efficiently inspect a semiconductor integrated device.

Hereinafter, embodiments of a probe card, a semiconductor inspection apparatus, and a semiconductor inspection method using the same according to the present invention will be described with reference to the drawings.
[Constitution]
First, the configuration will be described.
FIG. 1 is a plan view showing a schematic configuration of an inspection object according to an embodiment of the present invention and an enlarged plan view thereof. Here, as an inspection object (DUT: Device Under Test), as shown in FIG. 1A, a plurality of IC devices 1 (1, 1), 1 (1, 2),... 1 (
A semiconductor wafer 50 before so-called dicing, in which m, n) are arranged in parallel at predetermined intervals, is shown as an example.
In addition, about the code | symbol which shows each IC device 1, the combination of the integer in the parenthesis following 1 is as follows.
The formation position (that is, coordinates) of the IC device 1 on the semiconductor wafer 50 is shown. For example, I
IC device 1 (1, 2) is provided adjacent to the right side of C device 1 (1, 1),
The IC device 1 (1, 3) is provided adjacent to the right side of the IC device 1 (1, 2).

Further, as shown in FIG. 1B, each of the IC devices 1 has a plurality of input / output terminals. Specifically, the IC device 1 has a longitudinal direction (vertical direction in FIG. 1B). And a plurality of input terminals (pads) 1a and output terminals 1b. This I
The C device 1 is a driver element for LCD, for example. In the semiconductor wafer 50,
Such an IC device 1 has a direction perpendicular to the arrangement direction of the input / output terminals in plan view (hereinafter,
Also referred to as the left-right direction. ) And a horizontal direction (hereinafter also referred to as a vertical direction), a plurality of them are arranged in parallel at predetermined intervals.

(Configuration of probe card)
2A and 2B are a plan view and a cross-sectional view showing a schematic configuration of the probe card 10 according to the embodiment of the present invention. The probe card 10 performs functional inspection on two adjacent IC devices 1 among the IC devices 1 on the semiconductor wafer described above (in the following description, the output terminal 1b of each IC device 1 is connected to the probe card 10). Are 0, in order from the top.
It is assumed that serial numbers 1, 2, 3,. ).
Specifically, the probe card 10 is connected to all the input terminal probe pins P _IN 1 that contact all the input terminals 1a of the IC device 1 (1,1) and all the input terminals 1a of the IC device 1 (1,2). Input terminal probe pin P _IN 2 that contacts, output terminal probe pin P _OUT 1 that contacts even-numbered output terminal 1 b in IC device 1 (1, 1), and IC device 1 (1
, 2) is provided with an output terminal probe pin P _OUT 2 in contact with the odd-numbered output terminal 1b.

When such a probe card 10 is used, an input is input to each input terminal 1a of both the adjacent IC devices 1 (1, 1) and 1 (1, 2) during a function test (that is, an electrical characteristic test). The terminal probe pins P _IN 1 and P _IN 2 are in contact with each other, and the output terminal 1b of the IC device 1 (1, 1) has an even-numbered output pin 1 _OUT and the IC device 1 (1 , 2) the odd-numbered output terminals 1b are in contact with the odd-numbered output terminal probe pins P _OUT 2 respectively.
Then, a test signal is sent to each of the input terminal probe pins P _IN 1 and P _IN 2, and I
Even pin test data output from probe pin P _OUT 1 for even output terminal of C device 1 (1, 1), odd number output from probe pin P _OUT 2 for odd output terminal of IC device 1 (1, 2) Get pin test data at the same time.

Further, following the above process, the inspection target IC device 1 is transferred to, for example, the left side of FIG. 1, and the IC device 1 (1, 2) and the IC device 1 (1, 3) located on the right side thereof are When the same inspection is performed, the result of the function inspection can be acquired for all the output terminals 1b in the IC device 1 (1, 2). That is, the function of the IC device 1 can be determined efficiently by repeating the above steps in sequence.
Accordingly, since the probe card 10 does not require replacement of the probe card in the even-numbered and odd-numbered inspections of the output terminal 1b, the probe card 10 can contribute to the reduction of the inspection man-hours and the inspection time, and perform the functional inspection with high efficiency. Make it possible. When the inspection of the IC devices 1 arranged side by side is performed, the arrangement of each output terminal even probe pin P _OUT 1 and each output terminal odd probe pin P _OUT 2 is opposite to the above description. You may make it a structure.

(Configuration of semiconductor inspection equipment)
FIG. 3 is a block diagram showing a schematic configuration of a semiconductor inspection apparatus using the probe card 10 described above. This semiconductor inspection apparatus includes a wafer prober 11 capable of mounting and supporting and fixing a semiconductor wafer on a table (not shown), a data storage unit 15, and a control unit that controls the operation of the test unit 13. 14 and the data server 16 connected to the control unit 14 and its data storage unit 15 via the network NW.
And comprising.

Among these, the probe card 10 is fixed to the wafer prober 11, and the probe card 1
A table (not shown) moves in the horizontal direction and the vertical direction with respect to zero. Control of the position of the table with respect to the probe card 10 is performed by the control unit 21 provided in the wafer prober 10. That is, the control unit 21 controls each input in the probe card 10 with respect to each input terminal 1a in the adjacent IC device 1 as position control of the table (in other words, a semiconductor wafer supported and fixed to the table) with respect to the probe card 10. The terminal probe pins P _IN 1 and P _IN 2 are brought into contact with each other, and each output terminal probe pin P _OUT 1 and P _OUT 2 in the probe card 10 is brought into contact with each output terminal 1 b in the adjacent IC device 1. Have.

For example, the control unit 21 may connect each output terminal even probe pin P _OU in the probe card 10 to the even terminal of each output terminal 1b in the IC device 1 (1, 1).
_The output terminal odd probe pin P _OUT 2 of the probe card 10 can be brought into contact with the odd number of the output terminals 1b of the IC device 1 (1, 2) by contacting _T1 .
The control unit 14 controls the operation of the test unit 13 in such a contact state, and acquires a function test result over the entire output terminal 1b as even-numbered pin test data and odd-numbered pin test data (hereinafter referred to as “pin data acquisition”). Process ”). That is, the test unit 13
Sends test signals to the probe pins P _IN 1 and P _IN 2 for input terminals in the probe card 10 and outputs even-numbered pin test data output via the probe pins P _OUT 1 for output terminals, The odd pin test data output via the output terminal odd probe pin P _OUT 2 is acquired.

The control unit 21 controls each IC device 1 in a direction perpendicular to the input / output terminal arrangement direction (that is, the left-right direction) or a horizontal direction (ie, the up-down direction) as the table position control with respect to the probe card 10. It also has a movement control function for moving the table by the parallel pitch.
The control unit 14 cooperates with the control unit 21 that performs such position control, and the IC to be inspected.
The pin data acquisition process can be repeated while shifting the device 1 to the adjacent IC device 1 (hereinafter, the process of repeating the pin data acquisition process is referred to as “pin data acquisition repetition process”). And the control part 14 can each acquire the even-numbered pin test data and the odd-numbered pin test data about each of each input terminal 1a and each output terminal 1b in each IC device 1 by pin data acquisition iterative processing.

In the semiconductor inspection apparatus shown in FIG. 3, when performing pin data acquisition repetitive processing, for example, the control unit 14 selects an IC device 1 to be inspected from a plurality of IC devices 1 formed on the semiconductor wafer. Specify (for example, specify the coordinate position of the IC device 1 to be inspected). Then, the movement control function of the control unit 21 aligns the probe pins P _IN 1, P _IN 2, P _OUT 1, P _OUT 2 of the probe card 10 with the designated coordinate positions. That is, the actual alignment is performed not by the control unit 14 but by the control unit 21.

Alternatively, in the semiconductor inspection apparatus shown in FIG. 3, the control unit 21 may perform both the designation of the coordinate position and the actual alignment. In that case, the control unit 14 does not specify the coordinate position, but a signal for specifying the coordinate position (for example, the acquisition of the pin test data for the IC device 1 that has been inspected so far has been completed). It is sufficient to send a signal indicating that) to the control unit 21. Upon receiving such a signal, the control unit 21 designates the next coordinate position, and the probe pins P _IN 1, P _IN 2, P _OU of the probe card 10 are designated at the designated coordinate position.
Align _T1 , _POUT2 .
As described above, according to the control units 14 and 21, the input terminal probe pins P _IN 1 and P _IN 2 are brought into contact with the input terminals 1a required for the function test, and the IC device 1 (1, 1) is connected. Each output terminal even probe pin P _OUT 1 is brought into contact with the even one of each output terminal 1b,
Each odd-numbered output terminal 1b of the IC device 1 (1, 2) can be brought into contact with each odd-numbered output terminal probe pin P _OUT 2.

In addition, each output terminal 1b of the IC device 1 (1, 1) is controlled by the operation control to the test unit 13.
The even-numbered pin test data in the even-numbered ones and the odd-numbered pin test data in the odd-numbered ones of the output terminals 1b of the IC device 1 (1, 2) are simultaneously acquired, and each output terminal 1 is obtained.
After obtaining the function test result over the whole of b, by moving the IC device 1 to the adjacent group that is moved one by one by the movement control function, by repeating the pin data acquisition process, the function characteristics of each IC device 1 Data processing determination for determining good or bad can be performed, and functional inspection can be performed efficiently.

Here, one of the two IC devices 1 to be inspected may be located at the terminal end. That is, for both ends of the IC devices 1 arranged side by side on the semiconductor wafer, when performing the functional inspection using the probe card 10 described above, for example, the IC devices 1 are arranged in the left-right direction, and each output terminal is even. When the probe pin P _OUT 1 is arranged on the left side and each probe pin P _OUT 2 for odd number output terminals is arranged on the right side, only the even pin test data is obtained from the IC device 1 at the left end, and the right end in the opposite direction. Only the odd-numbered pin test data can be obtained from the IC device 1.

In such a case, the control unit 21 moves the table on which the semiconductor wafer is placed in the direction perpendicular to the arrangement direction of the input / output terminals by the arrangement pitch of the IC devices 1, thereby moving the probe pins P _IN 1 for the input terminals. , P _IN 2, each output terminal even probe pin P _OUT 1 and each output terminal odd probe pin P _OUT 2 are brought into contact with each other (untested side). And
Movement control for acquiring even-numbered pin test data or odd-numbered pin test data alone from the terminal portion may be performed.
When such movement control is performed, in the above-described example, in the IC device 1 at the left end portion, each input terminal probe pin P _IN 1 and each output terminal even probe located in the left half of the probe card 10 are used. The pin P _OUT 1 is in an empty (unused) state protruding outward, and each input terminal probe pin P _IN 2 and each output terminal odd probe pin P _OUT located in the right half
2 are used for inspection, and odd-numbered pin test data is obtained independently.

Further, in the IC device 1 at the right end portion, each input terminal probe pin P _IN 2 and each output terminal odd-number probe pin P _OUT 2 located in the right half of the probe card 10 protrudes outward. The input terminal probe pins P _IN 1 and the output terminal even probe pins P _OUT 1 located in the left half are used for inspection, and even pin test data is obtained independently. That is, even if each IC device 1 on the semiconductor wafer is positioned at the end portion, not only one of even-numbered pin test data and odd-numbered pin test data but also the remaining other that has not been acquired is accurately determined. Can be obtained.

Even number test data and odd number pin test data stored in the data storage unit 15 of the control unit 14 obtained after the pin data acquisition repetitive processing are transmitted to the data server 16 via the network NW. The data server 16 integrates (that is, merges) even-numbered pin test data and odd-numbered pin test data related to the same IC device 1 and performs semiconductor inspection by data processing determination that determines whether the functional characteristics are good or bad. That is, the data server 16 identifies each IC device 1 and integrates the even pin test data and the odd pin test data with respect to the transmitted even pin test data and odd pin test data of the adjacent IC device 1 and transmits the functional characteristics. Therefore, the semiconductor inspection can be performed with high efficiency and accuracy with a simple configuration. Therefore, it is possible to provide a semiconductor inspection apparatus capable of realizing semiconductor inspection with high efficiency with such a simple configuration.

Further, the function test result of the IC device can be easily grasped from the determination result of the data server 16.
Although the case where the probe card 10 is fixed to the wafer prober 11 has been described here, the present invention is not limited to this. For example, the probe card 10 is
It may be fixed to an arm (not shown). Further, this arm may be movable in the horizontal direction and the vertical direction with respect to the table by the movement control function of the control unit 21. With such a configuration, an IC device that inspects the probe pins P _IN 1, P _IN 2, P _OUT 1, P _OUT 2 of the probe card 10 by moving the arm by the movement control function of the control unit 21. 1 and can be brought into contact with the terminals 1a, 1b.

[Operation]
Next, the operation will be described.
FIG. 4 is a schematic diagram of an inspection object (semiconductor wafer) shown in order to briefly explain the state of semiconductor inspection by this semiconductor inspection apparatus.
The semiconductor wafer here includes a plurality of IC devices 1 (1, 1), 1 (1, 2), 1 (1,
3) When 1 (1, 4),..., 1 (m, n) are juxtaposed (in FIG. 4, IC device 1
(1, 1) to 1 (1, 4) only are shown).

In the semiconductor inspection using the probe card 10, first, the adjacent IC devices 1 (1, 1)
1 (1, 2) as a test 1 for each input terminal 1a, probe card 1
The input terminal probe pins P _IN 1 and P _IN 2 at 0 are brought into contact with each other. Further, each output terminal even probe pin P _OUT 1 in the probe card 10 is brought into contact with the even-numbered one in the arrangement direction of each output terminal 1b in one adjacent IC device 1 (1, 1), and adjacent to each other. In contrast to the odd-numbered ones in the arrangement direction of the output terminals 1b in the other IC device 1 (1, 2), the probe pins P _OUT 2 for odd-numbered output terminals in the probe card 10
And a pin data acquisition process for acquiring a continuity test result by using even-numbered pin test data and odd-numbered pin test data by performing a function test over the entire input terminals 1a and output terminals 1b. In test 1, even pin test data is obtained from IC device 1 (1, 1), and odd pin test data is obtained from IC device 1 (1, 2).

Next, for example, the inspection target is shifted to another set of adjacent IC devices 1 (1, 2), 1 (1, 3) by the coordinate designation by the control unit 14 and the movement control function by the control unit 21. The same pin data acquisition processing is performed as test 2 for them. In test 2, IC
Even pin test data is obtained from device 1 (1, 2), and IC device 1 (1, 3).
Provides odd-numbered pin test data. That is, for IC device 1 (1, 2),
After odd-numbered pin test data is obtained in test 1, even-numbered pin test data is obtained in test 2.

Further, the inspection object is transferred to another set of adjacent IC devices 1 (1, 3), 1 (1, 4), and a similar pin data acquisition process is performed as a test 3 targeting them. In test 3, even pin test data is obtained from IC device 1 (1, 3), and IC device 1 (
1, 4) provides odd pin test data. That is, for the IC device 1 (1, 3), after odd-numbered pin test data is obtained in test 2, even-numbered pin test data is obtained in test 3. Pin data acquisition repetitive processing is sequentially repeated until the test n reaching 1 (1,1), 1 (1, n) is performed, and even numbers for all the input terminals 1a and all the output terminals 1b in each IC device 1 are performed. Get pin test data and odd pin test data.

Here, if the IC device 1 (1, 1) and the IC device 1 (1, n) are terminations, only even pin test data can be obtained in the test 1 for the IC device 1 (1, 1). Therefore, prior to the test 1, it is sufficient to obtain the odd-numbered pin test data independently in the right half of the probe card 10, and the odd-numbered pin test data for the IC device 1 (1, n) is similarly tested. Therefore, it is only necessary to obtain even-numbered pin test data independently in the left half of the probe card 10 after the test n.

In addition, after the functional inspection of the IC devices is finished with respect to the arrangement in the horizontal direction, for example, the table on which the semiconductor wafer is placed is moved by the arrangement pitch of each IC device 1 in the vertical direction shown in FIG. Then, the pin data acquisition repetitive processing may be performed for the IC devices 1 (2, 1) to 1 (2, n) by relatively moving the table in the left-right direction by the same method as described above. By such a method, all the IC devices 1 (1, 1,
Even-numbered pin test data and odd-numbered pin test data can be acquired for 1) to 1 (m, n).

(Operation of IC tester)
FIG. 5 is a flowchart showing an operation process on the IC tester 12 side provided in the semiconductor inspection apparatus.
In the operation processing on the IC tester 12 side, the above-described pin data acquisition processing and pin data acquisition repetition processing are performed by the test start (step S1) processing, and thereafter, all IC devices (hereinafter also referred to as chips) are completed. It is determined whether or not (step S2).
As a result, if all the chips have not been completed, the process moves to the next chip (step S3) and returns to the test before the test start (step S1) to perform the test (pin data acquisition process, pin data acquisition iterative process). To repeat.
On the other hand, if all the chips have been completed, the processing of wafer data transmission (step S4) is performed and the even pin test data and the odd pin test for all of the IC devices 1 (1,1) to 1 (1, n). Data is transmitted to the data server 16 via the network NW.

(Data server operation)
FIG. 6 is a flowchart showing an operation process on the data server 16 side provided in the semiconductor inspection apparatus.
In the operation processing on the data server 16 side, when the even pin test data and the odd pin test data stored in the data storage unit 15 are received via the network NW by performing the wafer data reception (step S1) processing, Processing for integrating even-numbered and odd-numbered pin test results on the same chip for even-numbered pin test data and odd-numbered pin test data (step S2) (each IC device 1 (1, 1) to 1 (1, n) on the semiconductor wafer) After the processing corresponding to the data is integrated, the semiconductor inspection is performed by the data processing determination for determining whether the functional characteristics are good or defective, and defective ink data creation (step S3) is performed.

That is, the data server 16 uses the IC device 1 (for the even pin test data and the odd pin test data of the adjacent IC devices 1 (1, 1) to 1 (1, n) obtained by using the probe card 10. 1,1) to 1 (1, n) are identified, and even-numbered pin test data and odd-numbered pin test data corresponding to each are integrated to perform data processing determination of functional characteristics. It can be performed efficiently and accurately.
FIG. 7 is a schematic view illustrating a semiconductor inspection result by the semiconductor inspection apparatus. Here, as test data obtained by the above-described operation processing on the IC tester 12 side,
For C device 1 (1, 1), 1 (1, 1) with an identifier as even pin test data
) Characteristic data of even-numbered No pin test results, and for IC device 1 (1,2), a state where characteristic data of 1 (1,2) odd-numbered No pin test results with an identifier is obtained as odd-numbered pin test data is shown. Yes.

Similarly, in the test 2, for the IC device 1 (1,2), the characteristic data of the 1 (1,2) even No pin test result with the identifier as the even pin test data, the IC device 1 (1
, 3), the characteristic data of the 1 (1,3) odd No pin test result with the identifier is obtained as the odd pin test data.
Similarly, in the test 3, for the IC device 1 (1, 3), the characteristic data of the 1 (1, 3) even No pin test result with the identifier as the even pin test data, the IC device 1 (1, 4) 1 (1,4) odd N with identifier as odd pin test data
This shows how characteristic data of the o-pin test result is obtained.

On the other hand, in the integration process by the operation process on the data server 16 side, for example, the characteristic data of the 1 (1,2) odd No pin test result obtained in the test 1 and the 1 (1,2) even No. obtained in the test 2 are used. 1 (1,2) test result with identifier by integrating characteristic data of pin test result (
IC device 1 (1, 2) test result) characteristic data is obtained and 1 obtained in test 2
The characteristic data of the (1, 3) odd No pin test result and the characteristic data of the 1 (1, 3) even No pin test result obtained in the test 3 are integrated, and the 1 (1, 3) test result with an identifier ( I
The characteristic data of the C device 1 (1, 3) test result) is shown.

On the other hand, in the data judgment of the semiconductor inspection on the data server 16 side, if the even pin result is good and the odd pin result is bad, it is judged that the chip is bad. Similarly, the even pin result is bad and the odd pin result is good. If there is, it is determined that the chip is defective, and it is determined that the chip is good only when both the even-numbered pin result and the odd-numbered pin result are good.
A semiconductor inspection apparatus using such a probe card 10 (including the case where the arrangement of the probe pins P _OUT 1 for even output terminals and the probe pins P _OUT 2 for odd output terminals described above is reversed) is used. According to the semiconductor inspection, since it is possible to inspect all the IC devices 1 of the semiconductor wafer that is the inspection object without changing the probe card, it is possible to increase the number of test steps without increasing the number of test steps. Semiconductor inspection can be performed efficiently.

The technical points of the probe card 10 described above and the semiconductor inspection apparatus using the probe card 10 can be restated as a semiconductor inspection method.
That is, in the semiconductor inspection method of the present invention, IC devices 1 having a plurality of terminals arranged in a predetermined direction are arranged in parallel at predetermined intervals, and every other (or plural) IC terminals 1 in each IC device 1 are arranged. Contact the probe pin. At this time, the IC devices 1 arranged side by side
The probe pins are brought into contact with terminals at different arrangement positions.
In the semiconductor inspection method of the present invention, the functional inspection is performed for every other terminal in the IC devices 1 arranged in parallel, and then the IC device 1 is moved by one to contact the probe pin. 1 was replaced with 1 and the function test was performed last time
For the C device 1, the probe pin is brought into contact with a terminal different from the previous one.

By sequentially repeating such steps for the IC devices 1 arranged in parallel, it is possible to perform a function test on all the IC devices 1.
Of the IC devices 1 arranged in parallel, those located at both ends are individually inspected once, and a function inspection is performed on uninspected terminals.
According to the method having such steps, the input terminal probe pins P _IN 1 and P _IN 2 are brought into contact with the input terminals 1a of the adjacent IC devices 1, and the output terminals 1b of one IC device 1 are contacted. Contact of each even-numbered output terminal even probe pin P _OUT 1 is performed, and each odd-numbered output terminal 1 b of the other IC device 1 is contacted by each odd-numbered output terminal probe pin P _OUT 2.

Then, the even pin test data in the even ones of the output terminals 1b of one IC device 1 and the odd pin test data in the odd ones of the output terminals 1b of the other IC device 1 are simultaneously acquired, After obtaining the function test result over the entire arrangement direction of the input terminal 1a and each output terminal 1b, the process shifts to another set of adjacent ones of the IC devices 1 and repeats the pin data acquisition process.
Furthermore, since the acquired test data is used for data processing determination for determining whether each IC device 1 has good or bad functional characteristics, it is possible to quickly replace the probe card in one test man-hour without requiring replacement of the probe card. Semiconductor inspection can be performed efficiently.

[Modification]
Next, a modified example will be described.
In the above embodiment, the probe card 10 or the table has been described as being controlled to move in the direction in which the IC devices 1 are juxtaposed. However, the arrangement direction of the input / output terminals in the IC devices 1 (the juxtaposition of the IC devices 1) It is also possible to control the movement in a direction perpendicular to the generated direction.
That is, for the movement control function in the control unit 21, each input terminal probe pin P _IN 1,
The number of P _IN 2 is the same as the number of each input terminal 1a, and the number of each output terminal even probe pin P _OUT 1 and each output terminal odd probe pin P _OUT 2 is half that of each output terminal 1b. The number of input / output terminals in the arrangement direction (one direction) is not necessary.

On the other hand, in general, the number of probe pins P _IN 1 and P _IN 2 for each input terminal is less than the number of each input terminal 1a and is a fraction to a fraction of that, and each output terminal even probe. Similarly, the number of the pins P _OUT 1 and the odd-numbered probe pins P _OUT 2 for each output terminal may be less than half of the number of each output terminal 1 b and may be set to one-several to several tenths. It may be necessary to move the input / output terminals in the arrangement direction.
Therefore, in such a case, as the movement control function of the control unit 21, the table on which the semiconductor wafer is placed is moved in the arrangement direction of the input / output terminals, and the function inspection is sequentially performed on the entire input terminals 1a and the entire output terminals 1b. And moving control for acquiring even-numbered pin test data and odd-numbered pin test data may be performed.

Thereby, even if the range of the probe pins P _OUT 1 and P _OUT 2 covers a part of the arrangement of the plurality of output terminals 1 b in the IC device 1, the adjacent IC devices are controlled by the movement control function of the control unit 21. Even-numbered pin test data and odd-numbered pin test data can be accurately acquired from the entire output terminal 1b of one single unit.
Further, in the above-described embodiment, a case has been described in which adjacent IC devices 1 among a plurality of IC devices 1 arranged in parallel on the wafer 50 are inspected simultaneously. For example, as shown in FIG. 4, in the test 1, the case where the IC devices 1 (1, 1) and 1 (1, 2) are inspected simultaneously has been described. However, the present invention is not limited to this, and the IC devices 1 that are not adjacent to each other may be simultaneously inspected using a single probe card. For example, in the test 1 shown in FIG. 4, the IC device 1 (1, 1) and the IC device 1 (1, 3) may be simultaneously inspected using one probe card 10.

In such a case, each input terminal probe pin P _IN 1 in the probe card 10 is brought into contact with each input terminal 1a in the IC device 1 (1, 1). Further, each input terminal probe pin P _IN 2 in the probe card 10 is brought into contact with each input terminal 1a in the IC device 1 (1, 3). Then, the probe pins P _OUT 1 for the output terminals in the probe card 10 are brought into contact with the even-numbered ones in the arrangement direction of the output terminals 1b in the IC device 1 (1, 1), and the IC device 1 (1 , 3) the odd-numbered ones of the output terminals 1b in the arrangement direction of the output terminals 1b are brought into contact with the odd-numbered probe pins P _OUT 2 of the output card 10 in the probe card 10.

Thereby, in the test 1, even pin test data is obtained from the IC device 1 (1, 1), and odd pin test data is obtained from the IC device 1 (1, 3). Thereafter, all the ICs arranged in parallel on the semiconductor wafer 50 are performed by following the same procedure as in the above embodiment.
For the devices 1 (1, 1) to 1 (m, n), even pin test data and odd pin test data can be acquired.

The figure which shows schematic structure of the test target object which concerns on embodiment. The figure which shows schematic structure of the probe card 10 which concerns on embodiment. 1 is a block diagram showing a schematic configuration of a semiconductor inspection apparatus according to an embodiment. The figure which shows the order of the test target object and test which concern on embodiment. The flowchart which shows the operation | movement process by the side of the IC tester 12 which concerns on embodiment. The flowchart which shows the operation | movement process by the side of the data server 16 which concerns on embodiment. The figure which illustrated the semiconductor inspection result concerning an embodiment.

Explanation of symbols

1 (1, 1) to 1 (m, n) IC device (chip), 1a input terminal, 1b output terminal, 10 probe card, 11 wafer prober, 12 IC tester, 13 test unit, 14, 21 control unit, 15 Data storage unit, 16 data server, F frame, P _IN 1 and P _IN 2 input terminal probe pin, P _OUT 1 output terminal even probe pin,
Probe pin for odd number of P _OUT 2 output terminals

Claims (7)

A probe card for inspecting electrical characteristics of a semiconductor integrated device having a plurality of terminals arranged in a predetermined row,
A plurality of probe pin groups that are installed corresponding to each of the plurality of semiconductor integrated devices arranged side by side on the substrate, and that contact a predetermined number of terminals among the plurality of terminals that each semiconductor integrated device has, Each of the probe pin groups is in contact with terminals at different arrangement positions in the row on the semiconductor integrated device. The plurality of probe pin groups are:
A first probe pin group that is installed corresponding to a first semiconductor integrated device among the plurality of semiconductor integrated devices arranged in parallel on the substrate, and that contacts every other terminal among the plurality of terminals. When,
A second probe pin group installed corresponding to the second semiconductor integrated device of the plurality of semiconductor integrated devices and contacting every other terminal of the plurality of terminals;
Have
The first probe pin group contacts a terminal at an odd-numbered array position in the column in the first semiconductor integrated device;
2. The probe card according to claim 1, wherein the second probe pin group contacts a terminal at an even-numbered array position in the row in the second semiconductor integrated device. The first semiconductor integrated device in contact with the first probe pin group and the second semiconductor integrated device in contact with the second probe pin group are adjacent in a plan view. The probe card according to claim 2. A semiconductor inspection apparatus for inspecting electrical characteristics of a semiconductor integrated device having a plurality of terminals arranged in a predetermined row,
A plurality of probe pin groups that are installed corresponding to each of the plurality of semiconductor integrated devices arranged side by side on the substrate, and that contact a predetermined number of terminals among the plurality of terminals that each semiconductor integrated device has, Each of the probe pin groups is a probe card that contacts terminals at different arrangement positions in the row on the semiconductor integrated device;
Control means for moving the probe card and the substrate relative to each other to simultaneously contact the probe card with a plurality of the semiconductor integrated devices;
And a test unit that acquires test results of the plurality of semiconductor integrated devices via the probe pin group. 5. The semiconductor inspection apparatus according to claim 4, wherein the test unit can acquire the inspection result of one of the semiconductor integrated devices by using a part of the probe pin group in the probe card. The determination unit according to claim 1, further comprising: a determination unit configured to integrate the inspection results regarding the same semiconductor integrated device acquired by the test unit and determine whether each semiconductor integrated device is acceptable based on the integrated inspection result. The semiconductor inspection apparatus according to claim 4 or 5. A semiconductor inspection method for inspecting electrical characteristics of a semiconductor integrated device having a plurality of terminals arranged in a predetermined row,
Corresponding to each of the plurality of semiconductor integrated devices arranged side by side on a substrate, a plurality of probe pin groups that contact a predetermined number of terminals among the plurality of terminals of each semiconductor integrated device are installed, and the probe Each of the pin groups is brought into contact with terminals at different arrangement positions in the row on the semiconductor integrated device.

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