JP2010085380A - Ultrasonic inspection device, ultrasonic inspection method, and ultrasonic inspection program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic inspection device for accurately detecting a specific section in an analyte easily in a short time. <P>SOLUTION: Before no defective section is detected on a boundary surface 15 of the analyte M, a probe 1 is made to scan data acquisition positions P1 to P4 in the X-axis direction at a data acquisition interval SX1. When the defective section C of the boundary surface 15 is detected at a data acquisition position P5, the data acquisition interval of the X-axis direction is changed from the initial SX1 to a small value SX2, and the data acquisition positions P6, P7, etc. are scanned at the data acquisition interval SX2 as long as the defective section C is detected. Then, when the defective section C is no longer detected at a data acquisition position P8, the data acquisition interval in the X-axis direction is returned from SX2 to the initial SX1 again, and scan is performed in a data acquisition position P9 and later. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an ultrasonic inspection apparatus, and in particular, scans a probe with respect to a subject, transmits an ultrasonic signal from the probe at each data acquisition position, and from the subject received by the probe. The present invention relates to an apparatus for detecting a singular part in a subject based on the echo signal.
The present invention also relates to an ultrasonic inspection method for inspecting a singular part in this way, and an ultrasonic inspection program for causing a computer to execute an inspection.

2. Description of the Related Art Conventionally, an ultrasonic inspection apparatus is known as an apparatus for inspecting and analyzing the presence / absence of a defect inside a subject and a bonding state in a nondestructive manner. This ultrasonic inspection apparatus transmits an ultrasonic signal from a probe to a subject and receives an echo signal reflected from the subject by the probe, thereby allowing a peculiar part such as a defect in the subject to be detected. Is to inspect. By transmitting and receiving an ultrasonic signal while scanning the probe at a predetermined interval with respect to the subject, it is possible to detect the position and size of the singular part in the desired scanning region.
As such an ultrasonic inspection apparatus, for example, an ultrasonic image inspection apparatus is proposed in the following Patent Document 1 by the present applicant.

Japanese Patent No. 3869289

  In the apparatus of Patent Document 1, the probe is alternately scanned at a predetermined data acquisition interval in the main scanning direction and the sub-scanning direction, and ultrasonic signals are transmitted and received while being sequentially positioned at a plurality of data acquisition positions. By analyzing the data of the echo signal at the data acquisition position, the image of the scanning area can be displayed.

At this time, in order to detect the position and size of a singular part such as a defect with high accuracy, it is necessary to set the data acquisition interval in the main scanning direction and the sub-scanning direction to a small value. However, since the position of the singular part existing in the subject cannot be determined unless the examination is actually performed, the entire scanning area is scanned at a small data acquisition interval. It takes a lot of time for inspection.
In addition, once the entire scanning area is scanned at a relatively large data acquisition interval at a level where it can be determined whether or not there is a singular part in the subject, the position of the singular part is specified to some extent, and then the singular part Although it is conceivable to scan again around the position at a small data acquisition interval, there is a problem that this requires a lot of labor for the inspection.

  The present invention has been made to solve such problems, and an object thereof is to provide an ultrasonic examination apparatus capable of accurately detecting a specific part in a subject in a short time and easily. .

  An ultrasonic inspection apparatus according to the present invention includes a probe disposed opposite to a subject, scanning means for scanning the probe over a predetermined range with respect to the subject, and from the probe to the subject. Detecting means for transmitting an ultrasonic signal and detecting a specific portion in the subject based on echo signals from the subject received by the probe at a plurality of data acquisition positions set at predetermined data acquisition intervals; When the singular part is not detected by the detection means, the predetermined data acquisition interval is set to a first preset interval, and when the singular part is detected by the detection means, the predetermined data acquisition interval is smaller than the first interval. And a control means for setting the second interval.

  Preferably, the control unit causes the scanning unit to alternately scan the probe in the main scanning direction and the sub-scanning direction, and when the detection unit does not detect the singular part, the predetermined data acquisition interval in the main scanning direction is set to the first data acquisition interval. The main scanning direction interval is set and the predetermined data acquisition interval in the sub-scanning direction is set as the first sub-scanning direction interval, and when the singular part is detected by the detecting means, the predetermined data acquisition in the main scanning direction is acquired. The interval is set to a second main scanning direction interval which is smaller than the first main scanning direction interval, and a predetermined data acquisition interval in the sub scanning direction is set to a second sub scanning direction which is smaller than the first sub scanning direction interval. Set the interval for use.

In addition, when the singular part is detected by the detection unit based on the echo signal received by the probe scanned at the first interval, the control unit moves the probe to the first interval or the first interval. It is also possible to control the scanning means so that scanning is performed at the second interval after returning the scanning position by a distance shorter than the interval.
The detection means includes a measurement means for obtaining a measurement value at the data acquisition position based on an echo signal from the subject received by the probe, and based on the measurement values at a plurality of data acquisition positions obtained by the measurement means. Display means for displaying an image of the examination surface of the subject. In this case, it is preferable that the display means displays the area scanned by the probe at the first interval and the area scanned at the second interval at the same scale.

  In the ultrasonic inspection method according to the present invention, a probe disposed opposite to a subject is caused to scan a predetermined range with respect to the subject, and an ultrasonic signal is transmitted from the probe to the subject. The singular part in the subject is detected based on the echo signal from the subject received by the probe at a plurality of data acquisition positions set at the data acquisition interval, and predetermined data is acquired when the singular part is not detected. In this method, the interval is set to a preset first interval, and when a singular part is detected, the predetermined data acquisition interval is set to a second interval smaller than the first interval.

  Further, an ultrasonic inspection program according to the present invention includes a step of scanning a predetermined range with respect to a subject with a probe arranged opposite to the subject, and an ultrasonic signal from the probe to the subject. Detecting a singular part in the subject based on an echo signal from the subject that is transmitted and received by the probe at a plurality of data acquisition positions set at predetermined data acquisition intervals, and the singular part detects If not, the computer sets a predetermined data acquisition interval to a first predetermined interval, and sets a predetermined data acquisition interval to a second interval smaller than the first interval when a singular part is detected. To be executed.

  According to this invention, when scanning the probe, the predetermined data acquisition interval is set in advance according to whether or not the singular part is detected, and the second interval is smaller than the first interval. Therefore, an efficient examination can be performed, and a specific part of the subject can be detected with high accuracy in a short time.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1
FIG. 1 shows the configuration of the ultrasonic inspection apparatus according to the first embodiment. A focus type probe 1 is attached to the scanning mechanism 2 and is disposed to face a subject M disposed in a water tank (not shown). An ultrasonic flaw detector 3 is connected to the probe 1, a scanning control device 4 is connected to the scanning mechanism 2, and a main control device 6 is connected to the ultrasonic flaw detector 3 and the scanning control device 4 via an interface 5. It is connected. In addition, an A / D conversion circuit 7 is connected to the ultrasonic flaw detector 3, and this A / D conversion circuit 7 is also connected to the main controller 6.

The main controller 6 includes a microprocessor (MPU) 8 and a memory 10 and an image memory 11 connected to the MPU 8 via a bus 9 respectively. Further, an input device 12 and a display 13 are connected to the bus 9 of the main control device 6.
The scanning mechanism 2 and the scanning control device 4 form the scanning means of the present invention, the ultrasonic flaw detector 3, the A / D conversion circuit 7 and the MPU 8 form the detection means of the present invention, and the MPU 8 forms the control means of the present invention. Yes.

  As shown in FIG. 2, the subject M has a boundary surface 15 such as a joint surface, which becomes an inspection target portion, located at a predetermined depth from the surface 14. It is assumed that the focus of the touch element 1 is arranged with respect to the subject M so as to coincide with the boundary surface 15. This ultrasonic inspection apparatus is for detecting and displaying a defective portion generated on the boundary surface 15 of the subject M as a singular portion.

The probe 1 performs mutual conversion between an electric signal and an ultrasonic signal. The probe 1 converts the electric signal sent from the ultrasonic flaw detector 3 into an ultrasonic signal and emits it to the subject M. The ultrasonic signal (echo signal) reflected from the subject M is converted into an electric signal and sent to the ultrasonic flaw detector 3.
The ultrasonic flaw detector 3 has a built-in pulsar, receiver, etc., and sends a pulse signal to the probe 1 at a predetermined cycle based on an instruction received from the main controller 6 via the interface 5. The probe 1 is driven to emit an ultrasonic signal, and the echo signal from the subject M converted into an electric signal by the probe 1 is amplified, and then the main controller 6 is connected via the A / D conversion circuit 7. To input. That is, a measurement value capable of obtaining a so-called A scope image at the data acquisition position where the probe 1 is located is input to the main controller 6 by the ultrasonic flaw detector 3.
The scanning mechanism 2 incorporates an XYZ moving mechanism, and is driven and controlled by the scanning control device 4 based on an instruction from the main control device 6 via the interface 5, and the probe 1 is moved to the X axis, Y axis, and Z axis. It can be moved in each direction of the axis.

In the memory 10 of the main controller 6, a memory area 10a for storing measurement data at each data acquisition position is set, and a plane scanning program 10b, a defect echo detection program 10c, and a data acquisition interval change program 10d are stored. Stored.
The planar scanning program 10b is a two-dimensional scanning program for performing main scanning of the probe 1 along the surface of the subject M in the X-axis direction and sub-scanning in the Y-axis direction. By executing the plane scanning program 10b, for example, as shown in FIG. 3, the probe 1 is scanned one line in the X axis direction from the scanning start position at a predetermined data acquisition interval SX1, and then moved to the scanning start position. Returning, the operation of sending the predetermined data acquisition interval SY1 in the Y-axis direction and scanning again in the X-axis direction at the data acquisition interval SX1 is repeated to scan the subject M on the XY plane.

  The defect echo detection program 10c is based on the echo signal input from the ultrasonic flaw detector 3 via the A / D conversion circuit 7 to the main controller 6 and the subject M at the data acquisition position where the probe 1 is located. It is a program for detecting a defective part existing in the interior of the computer. As shown in FIG. 4A, an echo signal obtained from the subject M includes an echo waveform W1 from the surface 14 of the subject M and a subject M received after a predetermined time delay from the echo waveform W1. Although the echo waveform W2 from the inner boundary surface 15 is included, when there is no defect on the boundary surface 15, the echo waveform W2 from the boundary surface 15 has a small peak value. On the other hand, when a defect exists in the vicinity of the boundary surface 15, an echo waveform W3 having a large peak value is obtained as shown in FIG.

  Therefore, a gate that is a data acquisition range is set in a time region where an echo waveform from the boundary surface 15 inside the subject M is obtained, and a peak value of the echo waveform that appears in the gate is regarded as measurement data, and measurement data and By comparing with a predetermined threshold value Vth, it is possible to detect the presence of a defective portion when the measurement data is equal to or higher than the threshold value Vth. In this manner, the defect portion is detected at each data acquisition position by executing the defect portion echo detection program 10c.

  The data acquisition interval changing program 10d is a major feature of the present invention. When the probe 1 is scanned, the data acquisition interval SX1 and the data acquisition interval SX1 used in the plane scanning program 10b according to the presence or absence of the detection of a defective portion This is a program for changing SY1. As shown in FIG. 5, the probe 1 is sequentially scanned from the data acquisition position P1 to the data acquisition positions P2, P3, P4... Based on the measurement data acquired at the acquisition position, the defective part is detected by the defective part echo detection program 10c.

  In FIG. 5, since no defective portion is detected on the boundary surface 15 of the subject M from the data acquisition positions P1 to P4, the data acquisition interval in the X-axis direction remains the same as the initial SX1, but the boundary at the data acquisition position P5 When the defective portion C of the surface 15 is detected, the data acquisition interval change program 10d changes the data acquisition interval in the X-axis direction from the initial SX1 to a small value SX2. As long as the defective portion C is detected, scanning is performed at the data acquisition positions P6... P7, P8 and the data acquisition interval SX2. When the defective portion C is no longer detected at the data acquisition position P8, the data acquisition interval changing program 10d returns the data acquisition interval in the X-axis direction from SX2 to the original SX1 again, and scanning after the data acquisition position P9 is performed. Done.

When a defective portion C is detected at at least one data acquisition position in one scanning line in the X-axis direction, the data acquisition interval in the next Y-axis direction is changed from the initial SY1 to a small value SY2, and then When the defective portion C is not detected at all the data acquisition positions of one scanning line in the X-axis direction, the data acquisition interval in the Y-axis direction is returned from SY2 to the original SY1 again.
That is, when the defect portion C is not detected, the data acquisition intervals in the X-axis direction and the Y-axis direction are set to the non-defect portion measurement intervals SX1 and SY1, respectively, and when the defect portion C is detected, the X-axis direction In addition, the data acquisition intervals in the Y-axis direction are set to small SX2 and SY2, which are the defect portion measurement intervals.
In this way, by executing the data acquisition interval change program 10d, the data acquisition intervals in the X-axis direction and the Y-axis direction are changed according to whether or not the defective portion C is detected.

  Based on an instruction from the input device 12, the MPU 8 of the main control device 6 executes the plane scanning program 10b, the defective portion echo detection program 10c, and the data acquisition interval change program 10d to scan the probe 1 while scanning the probe 1. In addition to detecting C, image data of the boundary surface 15 of the subject M to be examined is created from the measurement data acquired at each data acquisition position and stored in the image memory 11, and the boundary surface 15 is displayed on the display 13. The image of is displayed.

Next, the operation of the ultrasonic inspection apparatus having such a configuration will be described with reference to the flowchart (Pad diagram) of FIG.
When the MPU 8 of the main control device 6 receives an instruction to start inspection from the input device 12, first, in step S1, the preset defect detection flag is turned off, and in the subsequent step S2, the scanning control device 4 performs the scanning mechanism. 2 is driven, and the probe 1 is moved to the scanning start position in the Y-axis direction which is the sub-scanning axis direction. In step S3, it is determined whether or not the scanning end position in the sub-scanning axis direction has been reached, and the following steps S4 to S17 are repeated until the scanning end position is reached.

  In step S4, the MPU 8 sets the data acquisition interval in the X-axis direction, which is the main scanning axis direction, to SX1, which is the non-defective portion measurement interval, and in step S5, the scanning control device 4 drives the scanning mechanism 2. Then, the probe 1 is moved to the scanning start position in the main scanning axis direction. In step S6, it is determined whether or not the scanning end position in the main scanning axis direction has been reached, and the following steps S7 to S12 are repeated until the scanning end position is reached.

  That is, in step S7, the MPU 8 drives the ultrasonic flaw detector 3 to acquire measurement data at the current data acquisition position, and stores the data acquisition position and the measurement data in the memory area 10a of the memory 10 in association with each other. The peak value of the echo signal in the gate is detected from the measurement data. Next, in step S8, the peak value detected in step S7 is compared with a preset threshold value Vth, and if the peak value is less than the threshold value Vth, there is no defective portion. In step S9, the data acquisition interval in the main scanning axis direction is set to SX1, which is a non-defect portion measurement interval. If the data acquisition interval in the main scanning axis direction remains unchanged at SX1 in step S4, this step S9 means that the data acquisition interval SX1 is maintained as it is.

  On the other hand, if the peak value is greater than or equal to the threshold value Vth in step S8, the MPU 8 determines that a defective portion exists at the current data acquisition position, and sets the data acquisition interval in the main scanning axis direction in step S10. After setting to SX2 which is the defect measurement interval, the defect detection flag is turned ON in step S11.

  Thereafter, in step S12, the MPU 8 drives the scanning mechanism 2 by the scanning control device 4, and scans the probe 1 by the data acquisition interval in the main scanning axis direction. At this time, either SX1 which is a non-defective portion measurement interval or small SX2 which is a defective portion measurement interval is set as a data acquisition interval in step S9 or S10 depending on the presence or absence of a defective portion. If it is determined in S8 that there is no defective portion, only SX1 is scanned, but if it is determined that there is a defective portion, only SX2 smaller than SX1 is scanned and a fine scanning operation is performed. It will be.

  Even if it is determined that there is a defective portion and the data acquisition interval is once set to SX2 which is the interval for measuring the defective portion, if it is determined that there is no defective portion at the subsequent data acquisition position, in step S9, Again, the data acquisition interval is set to a relatively large SX1 that is the non-defective portion measurement interval.

  In this way, when the measurement on one main scanning line is completed and it is determined in step S6 that the scanning end position in the main scanning axis direction has been reached, the process proceeds to step S13, and the state of the defect detection flag is confirmed. The Here, after the defect detection flag is set to OFF in step S1 in the initial stage of the inspection start, it is turned ON in step S11 only when it is determined in step S8 that a defect portion exists. That is, in step S13, the defect detection flag in the OFF state means that no defective portion has been detected in all data acquisition positions on the main scanning line for which measurement has been completed immediately before, while the defect detection in the ON state is detected. The flag means that a defective portion has been detected at least at one of the data acquisition positions on the main scanning line for which measurement has been completed immediately before.

  Therefore, if the defect detection flag is OFF in step S13, the MPU 8 proceeds to step S14 and sets the data acquisition interval in the sub-scanning axis direction to SY1, which is the non-defect portion measurement interval. When the defect detection flag is in the ON state, the process proceeds to step S15, and the data acquisition interval in the sub-scanning axis direction is set to a small SY2 that is the defect portion measurement interval.

  Thereafter, in step S16, the MPU 8 drives the scanning mechanism 2 by the scanning control device 4, and scans the probe 1 in the sub-scanning axis direction by the data acquisition interval. At this time, either SY1 which is the non-defective portion measurement interval or small SY2 which is the defective portion measurement interval is set as the data acquisition interval in the sub-scanning axis direction in step S14 or S15 according to the state of the defect detection flag. Therefore, if it is determined in step S13 that the defect detection flag is OFF, only a relatively large SY1 is scanned, but if the defect detection flag is determined to be ON, it is smaller than SY1. Only SY2 is scanned, and a fine scanning operation is performed in the sub-scanning axis direction.

In step S17, the defect detection flag is reset to the OFF state, and the process returns to step S4 to start measurement on the next main scanning line.
In this way, Steps S4 to S17 are repeated, and if it is determined in Step S3 that the scanning end position in the sub-scanning axis direction has been reached, it is determined that the measurement at all the data acquisition positions has been completed, and a series of The process ends.

  Thereafter, the MPU 8 performs a display process for creating image data of the boundary surface 15 of the subject M to be the examination target portion based on the measurement data at each data acquisition position stored in the memory area 10a of the memory 10. The image data for display is stored in the image memory 11 and the image of the boundary surface 15 is displayed on the display 13.

As described above, when a defective portion is detected, the measurement is performed by setting the data acquisition intervals in the main scanning axis direction and the sub-scanning axis direction to small SX2 and SY2, which are defective portion measurement intervals, respectively. It is possible to accurately detect the position and size of the.
This will be specifically described with reference to the defect portion C shown in FIG. In FIG. 7, only the outline of the defect portion C is shown, but it is assumed that a defect has occurred in the entire area surrounded by the outline. In this example, the defect measurement intervals SX2 and SY2 are set to ½ of the non-defect measurement intervals SX1 and SY1, respectively.

Measurement is started from the data acquisition position Q1, and the measurement is continued at the data acquisition positions Q2, Q3,... While scanning the probe 1 at the data acquisition interval SX1 along the first main scanning line L1. Since the defect portion C does not exist on the first main scanning line L1, the probe 1 is scanned at the data acquisition interval SX1 until the scanning end position of the first main scanning line L1.
Since the defective portion C is not detected on the first main scanning line L1, the data acquisition interval in the Y-axis direction, which is the sub-scanning axis, is set to a relatively large SY1, and the first main scanning line L1 extends to the Y-axis direction. Measurement is performed while scanning the probe 1 at the data acquisition interval SX1 from the data acquisition position Q4 along the second main scanning line L2 sent by SY1.

  And it enters into the field of defective part C for the first time in data acquisition position Q5 on the 2nd main scanning line L2, and defective part C is detected as a result of measurement. Therefore, the data acquisition interval in the X-axis direction, which is the main scanning axis, is changed from SX1 to a small SX2, and the next measurement is performed at the data acquisition position Q6 scanned from the data acquisition position Q5 by SX2. Since the data acquisition position Q6 is still located within the area of the defect portion C, the defect portion C is detected and the small data acquisition interval SX2 is maintained. Next, the measurement is performed at the data acquisition position Q7 that is further scanned by SX2 from the data acquisition position Q6. Since the data acquisition position Q7 is located outside the area of the defective portion C, the defective portion C is detected. As a result, the data acquisition interval in the X-axis direction is returned from SX2 to the original SX1.

When the probe 1 is scanned to the scanning end position of the second main scanning line L2, since the defective portion C is detected on the second main scanning line L2, the data acquisition interval in the Y-axis direction is small from SY1. The probe 1 is scanned at the data acquisition interval SX1 from the data acquisition position Q8 along the third main scan line L3 which is changed to SY2 and sent by SY2 in the Y-axis direction from the second main scan line L2. Measurements are made.
In this way, the detection of the defective portion C continues from the second main scanning line L2 to the fifth main scanning line L5, and when the sixth main scanning line L6 is reached with the small data acquisition interval SY2, the sixth Since no defective portion C is detected at any data acquisition position on the main scanning line L6, the data acquisition interval in the Y-axis direction is returned from SY2 to the initial SY1. Therefore, the seventh main scanning line L7 is a position that is sent from the sixth main scanning line L6 by SY1 in the Y-axis direction.

  As described above, measurement is performed over the entire scanning region. Here, at each data acquisition position corresponding to the defect portion C, the data acquisition intervals in the X-axis direction and the Y-axis direction are set to SX2 and SY2, respectively, so that the defect portion C is SX2 in the X-axis direction and Y-axis direction, respectively. And it will be detected with the accuracy of SY2. Therefore, as indicated by the hatched portion in FIG. 7, the defect portion C in which the area A <b> 1 composed of a collection of rectangular figures having a size of SX2 × SY2 with the respective data acquisition positions corresponding to the defect portion C as the center is detected. Obtained as a shape.

  For comparison, the inspection result when the defective portion C is detected while the data acquisition intervals in the X-axis direction and the Y-axis direction are set to SX1 and SY1, respectively, without changing the data acquisition interval according to the presence or absence of the defective portion C. Is shown in FIG. The defective portion C in FIG. 8 is the same as the defective portion C shown in FIG. In this case, the detection accuracy of the defective portion C is SX1 and SY1 in the X-axis direction and the Y-axis direction, respectively, so that each data acquisition position corresponding to the defective portion C is centered as shown by the hatched portion in FIG. Is obtained as the shape of the defect portion C in which the area A2 made up of an assembly of rectangular figures having a size of SX1 × SY1 is detected.

Comparing FIG. 7 and FIG. 8, by setting the data acquisition interval at each data acquisition position corresponding to the defective portion C to small SX2 and SY2 as in the first embodiment, the position, shape, and It can be seen that the size is detected with higher accuracy.
Note that the black circles in FIG. 7 indicate the data acquisition positions added in the first embodiment when the inspection is performed without changing the data acquisition interval as shown in FIG.

Embodiment 2
In the first embodiment, when the probe 1 is scanned at large data acquisition intervals SX1 and SY1 in the X-axis direction and the Y-axis direction, respectively, and a defective portion is detected, the data acquisition intervals SX2 and SY2 are changed to small data acquisition intervals SX2 and SY2, respectively. However, there is a case where the defective portion is generated between the data acquisition position where the defective portion is detected for the first time and the previous data acquisition position.
Therefore, in the second embodiment, when a defective portion is detected by the probe 1 scanned at the large data acquisition intervals SX1 and SY1, the probe 1 is returned to the front by the data acquisition intervals SX1 and SY1. Scanning is performed at small data acquisition intervals SX2 and SY2.

  As shown in FIG. 9, the probe 1 is sequentially scanned from the data acquisition position P1 to the data acquisition positions P2, P3, P4,... When the defect portion is detected based on the acquired measurement data and the defect portion C on the boundary surface 15 is detected for the first time at the data acquisition position P5, the probe 1 is just before the data acquisition interval SX1, that is, the data acquisition position P4. Here, the data acquisition interval is changed from the original SX1 to a small SX2. As long as the measurement data is acquired at the data acquisition position P6 scanned in the X-axis direction from the data acquisition position P4 by the data acquisition interval SX2, the defect portion C is detected, and as long as the defect portion C is detected, the data Scanning is performed at the data acquisition interval SX2 up to the acquisition position P8. When the defective portion C is no longer detected at the data acquisition position P8, the data acquisition interval in the X-axis direction is returned again from SX2 to the original SX1, and scanning after the data acquisition position P9 is performed.

  When a defective portion C is detected at at least one data acquisition position in one scanning line in the X-axis direction, the probe 1 is returned to the front by the data acquisition interval SY1 in the Y-axis direction. Is changed from the initial SY1 to a small SY2, and thereafter the defective portion C is not detected at all the data acquisition positions of one scan line in the X-axis direction, the data acquisition interval in the Y-axis direction is changed from SY2 to the initial SY1 again. Returned to

  The operation of the ultrasonic inspection apparatus of the second embodiment is shown in the flowchart of FIG. Since steps S1 to S17 are the same as the corresponding steps in the first embodiment shown in FIG. 6, the description in the first embodiment is used for the description of these steps. Steps S21 to S24 are steps newly added in the second embodiment.

  In step S8, when it is determined that the peak value is equal to or greater than the threshold value Vth as a result of comparing the peak value obtained from the measurement data with the preset threshold value Vth, the MPU 8 It is determined that there is a defective portion at the data acquisition position, and in subsequent step S21, it is determined whether or not the data acquisition interval in the main scanning axis direction is the non-defective portion measurement interval SX1. When the data acquisition interval in the main scanning axis direction is the non-defect portion measurement interval SX1, the MPU 8 drives the scanning mechanism 2 by the scanning control device 4 in step S22 to scan the probe 1 in the main scanning. After returning by the data acquisition interval in the axial direction, in the subsequent step S10, the data acquisition interval in the main scanning axis direction is set to SX2, which is the defect measurement interval, and in step S11, the defect detection flag is turned on. .

  On the other hand, if it is determined in step S21 that the data acquisition interval in the main scanning axis direction is not the non-defect portion measurement interval SX1, the process proceeds to step S12 without performing steps S22, S10, and S11. The MPU 8 scans the probe 1 by the data acquisition interval in the main scanning axis direction.

  Further, if the result of checking the state of the defect detection flag in step S13 is the ON state, the MPU 8 detects a defective portion at least at one of the data acquisition positions on the main scanning line for which measurement has been completed immediately before. In step S23, it is determined whether the data acquisition interval in the sub-scanning axis direction is the non-defect portion measurement interval SY1. If the data acquisition interval in the sub-scanning axis direction is the non-defect portion measurement interval SY1, the MPU 8 drives the scanning mechanism 2 by the scanning control device 4 in step S24, and sub-scans the probe 1. After returning by the data acquisition interval in the axial direction, the process proceeds to the subsequent step S15, where the data acquisition interval in the sub-scanning axis direction is set to a small SY2 that is a defect measurement interval.

  On the other hand, if it is determined in step S23 that the data acquisition interval in the sub-scanning axis direction is not the non-defect portion measurement interval SY1, the process proceeds to step S16 without performing the processes in steps S24 and S15, and the MPU 8 The probe 1 is scanned in the sub-scanning axis direction for the data acquisition interval.

In this way, when the defective portion is detected, the probe 1 can be scanned with the small data acquisition intervals SX2 and SY2 after returning the probe 1 by the data acquisition intervals SX1 and SY1.
FIG. 11 shows a specific defect inspection result in the second embodiment. The defect portion C in FIG. 11 is the same as the defect portion C shown in FIG. 7 in the first embodiment.

Measurement is started from the data acquisition position Q1, and the measurement is continued at the data acquisition positions Q2, Q3,... While scanning the probe 1 at the data acquisition interval SX1 along the first main scanning line L1. Since the defect portion C does not exist on the first main scanning line L1, the probe 1 is scanned at the data acquisition interval SX1 until the scanning end position of the first main scanning line L1.
Since the defective portion C is not detected on the first main scanning line L1, the data acquisition interval in the Y-axis direction, which is the sub-scanning axis, is set to a relatively large SY1, and the first main scanning line L1 extends to the Y-axis direction. Measurement is performed while scanning the probe 1 at the data acquisition interval SX1 from the data acquisition position Q4 along the second main scanning line L2 sent by SY1.

  The defect portion C is not detected until the data acquisition position Q5 on the second main scanning line L2, and enters the area of the defect portion C for the first time at the next data acquisition position Q6. Detected. Therefore, the probe 1 is returned to the position just before the data acquisition interval SX1, that is, the data acquisition position Q5, where the data acquisition interval in the X-axis direction is changed from the initial SX1 to a smaller SX2, and the data acquisition positions Q5 to SX2 are changed. The next measurement is performed at the data acquisition position Q7 that has been scanned only. Since the data acquisition position Q7 is located within the area of the defect portion C, the defect portion C is detected and the small data acquisition interval SX2 is maintained. In this way, as long as the defective portion C is detected, scanning is performed at the data acquisition interval SX2, and when the data acquisition position Q8 is reached, the data acquisition position Q8 is located outside the area of the defective portion C. As a result, the defective portion C is not detected, and as a result, the data acquisition interval in the X-axis direction is returned from SX2 to the original SX1.

  When the probe 1 is scanned to the scanning end position of the second main scanning line L2, since the defective portion C is detected on the second main scanning line L2, the probe 1 acquires data in the Y-axis direction. The position is returned to the position just before the interval SY1, that is, to the position of the first main scanning line L1, and the data acquisition interval in the Y-axis direction is changed from SY1 to a small SY2. The measurement is performed while scanning the probe 1 at the data acquisition interval SX1 from the data acquisition position Q9 along the third main scan line L3 sent by SY2 in the Y-axis direction from the first main scan line L1. Done.

  When the measurement is continued in the same manner and the detection of the defective portion C continues until the sixth main scanning line L6, and reaches the seventh main scanning line L7 with the small data acquisition interval SY2, the seventh main scanning line is reached. Since the defective portion C is not detected at any data acquisition position on L7, the data acquisition interval in the Y-axis direction is returned from SY2 to the initial SY1. Therefore, the eighth main scanning line L8 is a position that is sent from the seventh main scanning line L7 by SY1 in the Y-axis direction.

As described above, measurement is performed in the entire scanning region, and a region A3 indicated by a hatched portion in FIG. 11 is obtained as the shape of the defective portion C detected.
By comparing FIG. 11 with FIG. 7 in the first embodiment, it can be seen that in the second embodiment, the position, shape, and size of the defect portion C are detected with higher accuracy.

  In the first and second embodiments, the measurement data in the areas A1 and A3 detected as the defective part C are obtained from the data acquisition positions distributed at the small data acquisition intervals SX2 and SY2, and the areas A1 and A3 The measurement data in the so-called non-defect portion other than A3 is obtained from data acquisition positions distributed at large data acquisition intervals SX1 and SY1. Therefore, for example, as shown in FIG. 12, by interpolating the measurement data in the non-defective part, as shown by the broken lines, the positions distributed at the small data acquisition intervals SX2 and SY2 similar to the areas A1 and A3 are obtained. By creating interpolation data and adding these interpolation data to non-defective parts, it is possible to display the areas A1 and A3, which are defective parts, and other non-defective parts on the display 13 at the same scale. It becomes.

  Alternatively, the MPU 8 creates image data of only the areas A1 and A3 using the measurement data obtained from the data acquisition positions distributed at the small data acquisition intervals SX2 and SY2, while being distributed at the large data acquisition intervals SX1 and SY1. Image data of only the non-defect portion is created using the measurement data obtained from the data acquisition position, and the non-defect portion is displayed on the display 13 as shown in FIG. 13, for example. The images of the areas A1 and A3 may be superimposed (superimposed) on the image. Even in this way, the areas A1 and A3, which are defective portions, and the other non-defective portions can be displayed at the same scale.

  In the first and second embodiments described above, as shown in FIG. 3, the probe 1 is scanned one line in the X-axis direction from the scanning start position at a predetermined data acquisition interval SX1, and then scanning is started. The scanning method has been used in which the operation of returning to the position, sending the data at the predetermined data acquisition interval SY1 in the Y-axis direction, and scanning again at the data acquisition interval SX1 in the X-axis direction has been adopted. It is not a thing. For example, as shown in FIG. 14, after the probe 1 is scanned one line in the X-axis direction from the scanning start position at a predetermined data acquisition interval SX1, here, the predetermined data acquisition interval SY1 in the Y-axis direction. It is also possible to scan on the XY plane by so-called reciprocating scanning in the X-axis direction, in which the scanning is performed only at the data acquisition interval SX1 in the −X-axis direction.

  Furthermore, in the first and second embodiments, as shown in step S12 of FIG. 6 and FIG. 10, a command signal for moving in the main scanning direction by the data acquisition interval is output after the measurement is completed. The amount of movement in the main scanning direction may be detected, and measurement may be performed when the data acquisition position is reached, and movement in the main scanning direction may be continued during this measurement.

  In the first and second embodiments, the defect measurement intervals SX2 and SY2 are set to ½ of the non-defect measurement intervals SX1 and SY1, respectively. However, the present invention is not limited to this. If the defect measurement intervals SX2 and SY2 are set to values smaller than the non-defect measurement intervals SX1 and SY1, respectively, efficient inspection becomes possible, and defect detection is accurately performed in a short time. can do. Therefore, the defect measurement intervals SX2 and SY2 may be 1/3 or 1/4 of the non-defect measurement intervals SX1 and SY1, and are not divisible by the non-defect measurement intervals SX1 and SY1. It may be a value.

  In the second embodiment, when a defective portion is first detected, the data is returned by a large data acquisition interval SX1 in the main scanning direction and then advanced in the main scanning direction by a smaller data acquisition interval SX2. When a defective portion is detected, it may be returned by a small data acquisition interval SX2 or a distance (SX1-SX2) in the main scanning direction. Further, the return in the sub-scanning direction may be similarly returned by a small data acquisition interval SY2 or a distance (SY1-SY2). In addition, when scanning at a small data acquisition interval SX2 or SY2, the position once scanned is measured again, but the data once measured is stored in the memory area 10a in association with the data acquisition position, You may make it abbreviate | omit the measurement in the location where a measurement overlaps.

  In the first and second embodiments described above, a defective portion generated on the boundary surface 15 of the subject M is detected as the singular portion. However, in addition to the defective portion, the mixed foreign matter, the peeled bonded portion, and the alteration of the inspection location It is possible to detect a wide range of singular parts such as a part whose reflectance with respect to ultrasonic waves changes.

  It is possible to provide an ultrasonic inspection program that causes a computer to execute each operation shown in the flowcharts illustrated in the first and second embodiments. This program can be recorded on a computer-readable medium such as a hard disk, CD-ROM, DVD disk, magneto-optical disk, IC card, or IC memory.

It is a block diagram which shows the structure of the ultrasonic inspection apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the positional relationship of the subject and probe at the time of a measurement. FIG. 8 is a diagram schematically showing a probe scanning operation in the first embodiment. The echo signal obtained from a subject is shown, (a) is a waveform diagram of an echo signal from a non-defect portion, and (b) is a waveform diagram of an echo signal from a defect portion. 6 is a diagram illustrating a method of changing a data acquisition interval when a defective portion is detected in Embodiment 1. FIG. 3 is a flowchart showing the operation of the first embodiment. It is a figure which shows the test result at the time of test | inspecting a specific defective part in Embodiment 1. FIG. It is a figure which shows the test result at the time of test | inspecting a specific defective part with the conventional method. FIG. 10 is a diagram illustrating a method for changing a data acquisition interval when a defective portion is detected in the second embodiment. 6 is a flowchart showing the operation of the ultrasonic inspection apparatus according to the second embodiment. It is a figure which shows the test result at the time of test | inspecting a specific defective part in Embodiment 2. FIG. It is a figure which shows the method of displaying a defective part and a non-defect part on the mutually same scale. It is a figure which shows the other method of displaying a defective part and a non-defect part with the mutually same scale. It is a figure which shows schematically the scanning operation | movement of the probe in other embodiment.

Explanation of symbols

1 probe, 2 scanning mechanism, 3 ultrasonic flaw detector, 4 scanning control device, 5 interface, 6 main control device, 7 A / D conversion circuit, 8 MPU. 9 bus, 10 memory, 11 image memory, 12 input device, 13 display, 14 surface, 15 boundary surface, 10a memory area, 10b plane scanning program, 10c defect echo detection program, 10d data acquisition interval change program, M subject SX1, SY1 Non-defect portion measurement interval, SX2, SY2 Defect portion measurement interval, W1 to W3 echo waveform, Vth threshold, C defect portion, P1 to P9, Q1 to Q9 Data acquisition position, L1 to L8 main Scanning line, A1-A3 area,

Claims (7)

A probe placed opposite to the subject;
Scanning means for causing the probe to scan a predetermined range with respect to the subject;
Based on echo signals from the subject received by the probe at a plurality of data acquisition positions set at predetermined data acquisition intervals while transmitting an ultrasonic signal from the probe to the subject. Detecting means for detecting a singular part in the subject,
When the singular part is not detected by the detection means, the predetermined data acquisition interval is set to a preset first interval, and when the singular part is detected by the detection means, the predetermined data acquisition interval is set to the predetermined interval. An ultrasonic inspection apparatus comprising: control means for setting a second interval smaller than the first interval. The control means includes
The scanning means alternately scans the probe in the main scanning direction and the sub-scanning direction,
When the singular part is not detected by the detection means, the predetermined data acquisition interval in the main scanning direction is set to the first main scanning direction interval and the predetermined data acquisition interval in the sub scanning direction is set to the first sub scanning direction. Set the interval for
When the detection unit detects the singular part, a predetermined data acquisition interval in the main scanning direction is set to a second main scanning direction interval that is smaller than the first main scanning direction interval and in the sub-scanning direction. The ultrasonic inspection apparatus according to claim 1, wherein the predetermined data acquisition interval is set to a second sub-scanning direction interval that is smaller than the first sub-scanning direction interval.   The control means moves the probe to the first when the singular part is detected by the detection means based on an echo signal received by the probe scanned at the first interval. 3. The ultrasonic wave according to claim 1, wherein the scanning unit is controlled to scan at the second interval after returning the scanning position by an interval or a distance shorter than the first interval. Inspection device. The detection means includes measurement means for obtaining a measurement value at the data acquisition position based on an echo signal from the subject received by the probe,
4. The display device according to claim 1, further comprising a display unit configured to display an image of the examination target surface of the subject based on the measurement values obtained at the plurality of data acquisition positions obtained by the measurement unit. The ultrasonic inspection apparatus according to item.   5. The display unit according to claim 4, wherein the area where the probe is scanned at the first interval and the area where the probe is scanned at the second interval are displayed at the same scale. 6. Ultrasonic inspection equipment. Scanning a predetermined range with respect to the subject with a probe disposed opposite the subject;
Based on echo signals from the subject received by the probe at a plurality of data acquisition positions set at predetermined data acquisition intervals while transmitting an ultrasonic signal from the probe to the subject. Detecting a specific part in the subject,
When the singular part is not detected, the predetermined data acquisition interval is set to a preset first interval, and when the singular part is detected, the predetermined data acquisition interval is set to a second smaller than the first interval. An ultrasonic inspection method, characterized by being set to an interval of. Scanning a predetermined range with respect to the subject with a probe disposed opposite the subject; and
Based on echo signals from the subject received by the probe at a plurality of data acquisition positions set at predetermined data acquisition intervals while transmitting an ultrasonic signal from the probe to the subject. Detecting a singular part in the subject,
When the singular part is not detected, the predetermined data acquisition interval is set to a preset first interval, and when the singular part is detected, the predetermined data acquisition interval is set to a second smaller than the first interval. An ultrasonic inspection program that causes a computer to execute the step of setting the interval.

Images