JP2010080784A - Circuit board, method for manufacturing circuit board, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a circuit board in which the number of layers can be optimized on a plurality of rigid parts; a method for manufacturing the circuit board; and an electronic device having the circuit board. <P>SOLUTION: The circuit board 100 includes: a rigid flexible board unit 110 having a first rigid part 130 composed of a given number of layers, a second rigid part 140 composed of the same number of layers as the first rigid part 130, and a flexible first flex part 160 connecting the first rigid part 130 to the second rigid part 140; and a rigid board unit 120 which is overlaid on the first rigid part 130 to be fixed and electrically connected thereto. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board, a method for manufacturing the circuit board, and an electronic apparatus including the circuit board.

  2. Description of the Related Art Conventionally, a mobile phone as an electronic apparatus having an operation unit and a display unit includes a main substrate disposed on the operation unit side and a display substrate disposed on the display unit side. The main board and the display board are composed of a rigid rigid board, and the main board and the display board are connected by a flexible board having flexibility. This flexible substrate is connected to the main substrate and the display substrate via a connector.

In recent years, mobile phones have been required to be smaller and thinner. Therefore, a mobile phone using a rigid flexible substrate in which a flexible substrate having flexibility is sandwiched in a multilayer structure of a rigid rigid substrate has been proposed (for example, see Patent Document 1).
According to such a rigid flexible substrate, since the plurality of rigid portions are directly connected by the flex portion without using a connector, the circuit board can be reduced in size and thickness, and the mobile phone can be reduced in size and thickness. Can be achieved.
JP 2006-203155 A

By the way, since a larger number of electronic components are mounted on the main board arranged in the operation unit than in the display board arranged in the display unit, the main board needs to be configured in multiple layers than the display board. It becomes.
However, in the rigid flexible substrate, the plurality of rigid portions are all configured to have the same number of layers. Therefore, in the method proposed in Patent Document 1, the plurality of rigid portions such as the main substrate and the display substrate are each optimal in the number of layers. There was a problem that could not be configured.

  Therefore, an object of the present invention is to provide a circuit board capable of optimizing the number of layers in each of the plurality of rigid portions, a method for manufacturing the circuit board, and an electronic apparatus including the circuit board.

  The present invention provides a first rigid portion having a predetermined number of layers, a second rigid portion having the same number of layers as the first rigid portion, and a first flexible portion connecting the first rigid portion and the second rigid portion. The present invention relates to a circuit board comprising: a rigid flexible substrate portion having a flex portion; and a rigid substrate portion that is laminated and fixed to the first rigid portion and is electrically connected to the first rigid portion.

  The rigid flexible substrate unit includes a third rigid part having the same number of layers as the first rigid part and the second rigid part, and the third rigid part and the first rigid part or the second rigid part. It is preferable to further include a second flex portion that is connected and has flexibility.

  The first flex portion and the second flex portion preferably have a crank shape in plan view.

  A surface different from a surface facing the rigid substrate portion in the first rigid portion, a surface different from a surface facing the first rigid portion in the rigid substrate portion, one main surface in the second rigid portion, and It is preferable that an electronic component is mounted on each of the main surface and / or one main surface and / or the other main surface of the third rigid portion.

  According to another aspect of the present invention, there is provided the circuit board according to any one of the above, a first housing for housing the first rigid part and the rigid board part in the circuit board, and a second housing for housing the second rigid part. The present invention relates to an electronic device that includes a housing, a first housing and a second housing that are pivotably coupled, and a coupling portion in which the first flex portion is disposed.

  The present invention provides a rigid flexible substrate having a first rigid portion and a second rigid portion each having the same number of layers, and a first flex portion having a flexibility by connecting the first rigid portion and the second rigid portion. In a state where the one main surface of the first rigid portion and the one main surface of the second rigid portion are held at the same height position, and the first main surface of the first rigid portion and the first rigid surface A first mounting step of mounting electronic components on one main surface of each of the two rigid portions; a fixing step of fixing one main surface of the rigid substrate portion to the other main surface of the first rigid portion; and the rigid substrate portion The other main surface of the rigid substrate portion and the other main surface of the second rigid portion in a state where the other main surface of the second rigid portion and the other main surface of the second rigid portion are held at the same height. Each And mounting the components, and a second mounting step of obtaining a circuit board, a method of manufacturing a circuit board comprising a.

  Further, the rigid flexible substrate portion is disposed around the first rigid portion and the second rigid portion, and one main surface of the first rigid portion and one main surface of the second rigid portion are both at the same height position. It is preferable that the substrate is held by a holding substrate having a holding unit for holding.

  In addition, it is preferable that after the first mounting step is finished, the holding substrate is separated from the first rigid portion and the second rigid portion.

  A state in which the one main surface of the first rigid portion and the one main surface of the second rigid portion are both held at the same height, and the other main surface and the second rigid of the first rigid portion. In a state where the other main surfaces of the parts are held so that both are at the same height position, it is preferable that the top and bottom are inverted.

  ADVANTAGE OF THE INVENTION According to this invention, the circuit board which can optimize the number of layers in each of several rigid parts, the manufacturing method of this circuit board, and the electronic device provided with this circuit board can be provided.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
First, a cellular phone 1 as an electronic apparatus including a circuit board according to the present invention will be described with reference to FIGS.
FIG. 1 is an external perspective view of a mobile phone 1 according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing a cross section along the longitudinal direction of the mobile phone 1.

  As shown in FIG. 1, the mobile phone 1 includes an operation unit side housing 2 as a first housing, a display unit side housing 3 as a second housing, an operation unit side housing 2 and a display unit side. And a connecting portion 4 that connects the housing 3.

The operation unit side body 2 includes an operation unit 11 and a microphone 12 on the surface unit 10.
The operation unit 11 includes a function setting operation button 13 for operating various functions such as various setting functions, a phone book function, and a mail function, an input operation button 14 for inputting a telephone number and mail, and determination in various operations. And a determination operation button 15 for performing scrolling and the like.
The microphone 12 is used for inputting a voice uttered by a user of the mobile phone 1 during a call.

As shown in FIG. 1, the display unit side body 3 is configured to include a display unit 21 and a receiver 22 on the surface unit 20.
The display unit 21 displays various information such as the telephone number, mail address, and mail content of the other party of the call. The receiver 22 outputs the voice of the other party on the call.

As shown in FIG. 2, a main substrate 210, a key substrate 220, a battery 230, and the like are accommodated in the operation unit side body 2.
A plurality of electronic components 30 used for performing a signal processing function and the like are mounted on the main board 210. A plurality of electronic components 30 for performing predetermined processing according to the operation of the operation unit 11 is mounted on the key board 220.
The battery 230 is electrically connected to one of the electronic components 30 mounted on the main board 210 and supplies power to the main board 210.

  A display substrate 310 is accommodated inside the display unit side body 3. Electronic components 30 such as a drive circuit for driving a liquid crystal panel that displays various types of information are mounted on the display substrate 310.

The connection unit 4 connects the operation unit side body 2 and the display unit side body 3 so as to be rotatable. The mobile phone 1 relatively rotates the operation unit side body 2 and the display unit side body 3 connected via the connection unit 4, so that the operation unit side body 2 and the display unit side body 3 are rotated. Can be brought into an open state (open state), or the operation unit side body 2 and the display unit side body 3 can be folded (closed state).
As shown in FIG. 2, a first flex section 160 described later is disposed inside the coupling section 4, and the main board 210 accommodated in the operation section side body 2 and the display section side casing are disposed. The display substrate 310 housed in the body 3 is electrically connected.

The cellular phone 1 according to the present embodiment includes a circuit board 100 including the main board 210, the key board 220, and the display board 310 described above.
FIG. 3A is a plan view of a state in which the first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 of the circuit board 100 are positioned on the same plane. FIG.3 (b) is the sectional view on the AA line of Fig.3 (a).

As shown in FIGS. 3A and 3B, the circuit board 100 includes a rigid flexible board portion 110 and a rigid board portion 120.
The rigid flexible board 110 includes a hard first rigid part 130, a second rigid part 140, a third rigid part 150, a flexible first flex part 160, and a second flex part 170. The 1 rigid part 130, the 2nd rigid part 140, the 3rd rigid part 150, the 1st flex part 160, and the 2nd flex part 170 are integrally formed.

  Specifically, a hard insulating layer is laminated on a predetermined portion of a flexible flexible substrate to form the first rigid portion 130, the second rigid portion 140, and the third rigid portion 150. And the 1st flex part 160 and the 2nd flex part 170 are formed in the part in which the hard insulating layer is not laminated | stacked in a flexible substrate.

As shown in FIG. 3A, each of the first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 has a rectangular shape in plan view, and the width of each rigid portion is substantially the same. Are equally formed.
The first rigid part 130 is disposed between the second rigid part 140 and the third rigid part 150. Specifically, the second rigid portion 140 is disposed on one end side in the longitudinal direction of the first rigid portion 130, and the third rigid portion 150 is disposed on the other end side in the longitudinal direction of the first rigid portion 130. Each rigid part is arrange | positioned so that the position of the width direction may correspond.

The first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 have electrode wirings formed on both surfaces of a flexible substrate having the same configuration as the first flex portion 160 and the second flex portion 170 described later. The insulating layers thus formed are laminated. This insulating layer is composed of a hard insulating base material.
The first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 are formed by stacking the same number of insulating layers on the flexible substrate.
Examples of the insulator base material include a glass woven fabric impregnated with an epoxy resin. The electrode wiring is formed by printing a predetermined wiring pattern on the surface of the insulating layer.

The first flex part 160 electrically connects the first rigid part 130 and the second rigid part 140. The second flex part 170 electrically connects the first rigid part 130 and the third rigid part 150.
As shown in FIG. 3A, each of the first flex portion 160 and the second flex portion 170 has a crank shape in plan view.
Specifically, the first flex portion 160 has a first end 131 side at a side edge extending along the width direction of the first rigid portion 130 and a side edge extending along the width direction of the second rigid portion 140. The first end 141 side is connected. The first flex portion 160 has a bent portion that is bent so as to protrude toward the second end portions 132 and 142 in the width direction of the first rigid portion 130 and the second rigid portion 140.
The second flex portion 170 has a second end 132 side at a side edge extending along the width direction of the first rigid portion 130 and a second end portion 152 at a side edge extending along the width direction of the third rigid portion 150. Is connected to the side. The second flex portion 170 has a bent portion that is bent so as to protrude toward the first end portions 131 and 151 in the width direction of the first rigid portion 130 and the third rigid portion 150.
Accordingly, the bent portion of the first flex portion 160 or the bent portion of the second flex portion 170 can be deformed, so that the distance between the first rigid portion 130 and the second rigid portion 140 or the first rigid portion. The distance between the part 130 and the third rigid part 150 can be changed.

  The first flex portion 160 and the second flex portion 170 include a base film having an electrode wiring formed on the surface thereof, and a cover lay covering the electrode wiring (both not shown). The electrode wiring is made of copper foil. The base film and the coverlay are made of, for example, a polyimide resin.

The rigid substrate portion 120 has a multilayer structure formed by stacking a plurality of hard insulating layers having electrode wirings formed on the surface thereof.
As shown in FIG. 3B, the rigid substrate unit 120 is stacked and fixed on the first rigid unit 130 and is electrically connected to the first rigid unit 130.
Specifically, the rigid substrate portion 120 and the first rigid portion 130 are fixed via an anisotropic conductive film 180 as shown in FIG. The electrode wiring formed on one main surface 120A of the rigid substrate portion 120 and the electrode wiring formed on the other main surface 130B of the first rigid portion 130 are electrically connected.

In the present embodiment, as shown in FIG. 2, the main substrate 210 is constituted by the first rigid portion 130 and the rigid substrate portion 120, the display substrate 310 is constituted by the second rigid portion 140, and the key is constituted by the third rigid portion 150. A substrate 220 is configured. In addition, the third rigid portion 150 is folded by bending the second flex portion 170 and is disposed opposite to the first rigid portion 130 and is accommodated in the operation unit side body 2 in the other state.
The electronic components 30 are mounted on both surfaces of the main board 210, the key board 220, and the display board 310, respectively.

  According to the circuit board 100 and the mobile phone 1 including the circuit board 100, the following effects can be obtained.

  The main board 210 was configured by connecting the rigid board part 120 to the first rigid part 130 in the rigid flexible board part 110. Thereby, it is possible to increase only the number of layers of the main substrate 210 having a large number of electronic components 30 to be mounted while using a rigid flexible substrate in which the number of layers of the plurality of rigid portions is the same. Therefore, since the number of layers of each of the plurality of substrates can be optimized, the mobile phone 1 including the circuit board 100 can be reduced in size and thickness.

  Moreover, since the number of layers of each of the plurality of substrates can be optimized, the manufacturing cost of the circuit board 100 can be reduced.

  Further, the main substrate 320, the key substrate 220, and the display substrate 310 accommodated in the mobile phone 1 are configured by one circuit substrate 100. Therefore, all the substrates accommodated in the mobile phone 1 can be incorporated at the same time.

Next, an embodiment of a preferred method for manufacturing the circuit board 100 of the present invention will be described with reference to FIGS.
FIG. 4 is a view showing a first mounting step in the method for manufacturing the circuit board 100 of the present embodiment, and FIG. 5 is a view showing a fixing step. FIG. 6 is a diagram showing a reversal process, FIG. 7 is a diagram showing a separation process, and FIG. 8 is a diagram showing a second mounting process.
The method for manufacturing a circuit board according to this embodiment includes a first mounting step, a fixing step, an inversion step, a separation step, and a second mounting step.

In the first mounting process, as shown in FIGS. 4A and 4B, the one main surface 130A of the first rigid portion 130 and the one main surface 140A of the second rigid portion 140 in the rigid flexible substrate portion 110 and The electronic components 30 are mounted on the one main surface 150A of the third rigid portion 150, respectively.
Specifically, the rigid flexible substrate unit 110 is held on the holding substrate 50 via a plurality of holding units 40 arranged around the first rigid unit 130, the second rigid unit 140, and the third rigid unit 150, respectively. ing. The rigid flexible board 110 is held by the holding board 50, and the first main surface 130A of the first rigid portion 130, the one main surface 140A of the second rigid portion 140, and the one main surface of the third rigid portion 150. 150A are both at the same height position, and in this state, one main surface 130A of the first rigid portion 130, one main surface 140A of the second rigid portion 140 and one main surface 150A of the third rigid portion 150 are Each electronic component 30 is mounted.

  In the fixing process, as shown in FIG. 5, one main surface 120 </ b> A of the rigid substrate unit 120 is fixed to the other main surface 130 </ b> B of the first rigid portion 130. Accordingly, the first rigid portion 130 and the rigid substrate portion 120 are fixed and electrically connected.

In the reversing step, as shown in FIGS. 6A and 6B, the rigid flexible substrate portion 110 in a state where the rigid substrate portion 120 is fixed is reversed vertically.
The rigid flexible board part 110 turned upside down is arranged above the support base 60 as shown in FIG.

The support base 60 includes a first support part 61 capable of supporting the first rigid part 130, a second support part 62 capable of supporting the second rigid part 140, and a third support part capable of supporting the third rigid part 150. 63.
The first support portion 61 includes a placement surface 611 having a predetermined height and a recess 612 that is formed on the placement surface 611 and can accommodate the electronic component 30 mounted on the first rigid portion 130.
The second support portion 62 is formed on the placement surface 621 which is higher than the height of the placement surface 611 of the first support portion 61 by a predetermined height, and the second rigid portion 140 is formed on the placement surface 621. And a recess 622 that can accommodate the mounted electronic component 30. The difference between the height of the mounting surface 611 of the first support portion 61 and the height of the mounting surface 621 of the second support portion 62 is the thickness of the portion where the first rigid portion 130 and the rigid substrate portion 120 are stacked and the second. It is substantially equal to the difference with the thickness of the rigid part 140.
The third support portion 63 includes a placement surface 631 having the same height as the second support portion 62, and a recess 632 that is formed on the placement surface 631 and can accommodate the electronic component 30 mounted on the third rigid portion 150. .

In the separation step, as shown in FIGS. 7A and 7B, the plurality of holding portions 40 are cut, and the holding substrate 50, the first rigid portion 130, the second rigid portion 140, and the third rigid portion are cut. 150 are separated. Then, the 1st rigid part 130, the 2nd rigid part 140, and the 3rd rigid part 150 are mounted on the 1st support part 61, the 2nd support part 62, and the 3rd support part 63, respectively. Here, since the height of the first support part 61 is configured to be lower than the heights of the second support part 62 and the third support part 63, the first rigid part 130 sinks by a predetermined height. It is placed on the first support part 61. In addition, the first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 are placed on the mounting surfaces 611, 621, and 631, respectively, of the first support portion 61, the second support portion 62, and the third support portion 63. Recesses 612, 622, and 632 that can accommodate the electronic components 30 mounted on the respective one main surfaces 130A, 140A, and 150A are formed.
Thereby, the other main surface 120B of the rigid board part 120, the other main surface 140B of the second rigid part 140, and the other main surface 150B of the third rigid part 150 are all supported at the same height and supported by the support base. (Refer FIG.7 (b)).

  In the second mounting step, as shown in FIGS. 8A and 8B, the other main surface 120B of the rigid board portion 120 and the other main surface of the second rigid portion 140, which are arranged at the same position height, respectively. The electronic components 30 are mounted on the other main surface 150B of 140B and the third rigid portion 150, respectively. Thereby, the circuit board 100 is manufactured.

  According to the method for manufacturing the circuit board 100 of the present embodiment, the following effects can be obtained.

The electronic component 30 is mounted in a state where the one main surface 130A of the first rigid portion 130, the one main surface 140A of the second rigid portion 140, and the one main surface 150A of the third rigid portion 150 are arranged at the same height. did. Further, the other main surface 140B of the second rigid portion 140 and the other main surface 150B of the third rigid portion 150, and the first rigid portion 130 and the rigid having different thicknesses from the second rigid portion 140 and the third rigid portion 150. The electronic component 30 was mounted in a state where the other main surface 120B of the rigid substrate portion 120 in the laminate of the substrate portions 120 was disposed at the same position height.
Therefore, in the manufacturing process of the circuit board 100, a plurality of electronic components 30 can be simultaneously mounted on the one main surface 130A, 140A and 150A side, and a plurality of electronic components 30 can be simultaneously mounted on the other main surface 120B, 140B and 150B side. . In addition, all functional tests on the circuit board 100 can be performed simultaneously.

  Further, the first flex portion 160 and the second flex portion 170 have a crank shape. Accordingly, when the holding substrate 50 and the first rigid portion 130, the second rigid portion 140, and the third rigid portion 150 are separated in the separation step, the position in the height direction of the first rigid portion 130, and the second Adjustment with the height direction position of the rigid part 140 and the 3rd rigid part 150 is attained.

While the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be implemented in various forms.
For example, in the present embodiment, the first rigid portion 130 and the rigid substrate portion 120 are connected via the anisotropic conductive film 180, but the present invention is not limited thereto. That is, as shown in FIG. 9A, the first rigid portion 130 and the rigid substrate portion 120 may be connected via a plurality of conductive balls 180a, and as shown in FIG. You may connect through the prepreg 180b which is a layer, and the some conductor bump 180c embedded in this prepreg 180b. Further, as shown in FIG. 9C, the first rigid portion 130 and the rigid substrate portion 120 may be connected via a prepreg 180b and a plurality of conductor bumps 180d embedded in the prepreg 180b.

  In the present embodiment, the rigid substrate unit 120 is stacked only on the first rigid unit 130, but the present invention is not limited to this. That is, the rigid substrate portion may be stacked not only on the first rigid portion 130 but also on the second rigid portion 140 or the third rigid portion 150.

  In addition, the electronic device of the present invention is not a foldable electronic device including the connecting portion 4 as in each of the above-described embodiments, but from a state in which the operation unit side body 2 and the display unit side body 3 are overlapped. A sliding electronic device in which one housing is slid in one direction may be used. Alternatively, a rotary (revolver) electronic device in which one casing is rotated around an axis line along the overlapping direction of the operation unit side casing 2 and the display unit side casing 3 may be used.

  The present invention can be applied to portable electronic devices other than cellular phones, and can also be applied to electronic devices other than portable electronic devices. Examples of portable electronic devices other than mobile phones include PHS (registered trademark: Personal Handyphone System), portable game machines, portable navigation devices, PDAs (Personal Digital Assistants), notebook computers, EL displays or liquid crystal displays equipped with an operation unit. Is mentioned.

  Furthermore, examples of electronic devices other than portable electronic devices include electronic dictionaries, calculators, electronic notebooks, digital cameras, video cameras, and radios.

1 is an external perspective view of a mobile phone according to an embodiment of the present invention. It is the figure which showed typically the cross section along the longitudinal direction of a mobile telephone. FIG. 3A is a plan view of a state in which the first rigid portion, the second rigid portion, and the third rigid portion of the circuit board are positioned on the same plane. FIG.3 (b) is the sectional view on the AA line of Fig.3 (a). It is a figure which shows the 1st mounting process in one embodiment of the manufacturing method of the circuit board of this invention, Fig.4 (a) is a top view, FIG.4 (b) is the BB sectional view of Fig.4 (a). FIG. It is a figure which shows the adhering process in one embodiment of the manufacturing method of the circuit board of this invention. It is a figure which shows the inversion process in one embodiment of the manufacturing method of the circuit board of this invention, Fig.6 (a) is a top view, FIG.6 (b) is CC sectional view taken on the line of Fig.6 (a). is there. It is a figure which shows the isolation | separation process in one embodiment of the manufacturing method of the circuit board of this invention, Fig.7 (a) is a top view, FIG.7 (b) is the DD sectional view taken on the line of Fig.7 (a). is there. It is a figure which shows the 2nd mounting process in one embodiment of the manufacturing method of the circuit board of this invention, Fig.8 (a) is a top view, FIG.8 (b) is the EE sectional view taken on the line of Fig.8 (a). FIG. It is a figure which shows the modification of the circuit board of this invention.

Explanation of symbols

1 Mobile phone (electronic equipment)
2 Operation unit side housing (first housing)
3 Display unit side housing (second housing)
4 connecting portion 30 electronic component 40 holding portion 50 holding substrate 100 circuit board 110 rigid flexible substrate portion 120 rigid substrate portion 130 first rigid portion 140 second rigid portion 150 third rigid portion 160 first flex portion 170 second flex portion

Claims (10)

A first rigid portion having a predetermined number of layers, a second rigid portion having the same number of layers as the first rigid portion, and a first flex portion having flexibility by connecting the first rigid portion and the second rigid portion, Having a rigid flexible substrate part;
A circuit board comprising: a rigid substrate portion that is laminated and fixed to the first rigid portion and electrically connected to the first rigid portion.   The rigid flexible substrate unit connects the third rigid unit having the same number of layers as the first rigid unit and the second rigid unit, and connects the third rigid unit and the first rigid unit or the second rigid unit. The circuit board according to claim 1, further comprising a second flex portion having flexibility.   The circuit board according to claim 2, wherein the first flex portion and the second flex portion have a crank shape in plan view.   A surface different from a surface facing the rigid substrate portion in the first rigid portion, a surface different from a surface facing the first rigid portion in the rigid substrate portion, one main surface in the second rigid portion, and / or 4. The circuit board according to claim 2, wherein an electronic component is mounted on each of the other main surface and the one main surface and / or the other main surface of the third rigid portion. A circuit board according to any one of claims 1 to 4,
A first housing for housing the first rigid part and the rigid board part in the circuit board;
A second housing that houses the second rigid portion;
An electronic apparatus comprising: a connecting portion that rotatably connects the first housing and the second housing and in which the first flex portion is disposed. A rigid flexible substrate portion including a first rigid portion and a second rigid portion each having the same number of layers, and a first flex portion having a flexibility by connecting the first rigid portion and the second rigid portion,
One main surface of the first rigid portion and the second rigid portion in a state where the one main surface of the first rigid portion and the one main surface of the second rigid portion are both held at the same height position. A first mounting step of mounting electronic components on one side main surface of
A fixing step of fixing one main surface of the rigid substrate portion to the other main surface of the first rigid portion;
The other main surface of the rigid substrate portion and the second rigid portion in a state where the other main surface of the rigid substrate portion and the other main surface of the second rigid portion are both held at the same height position. And a second mounting step of obtaining a circuit board by mounting electronic components on the other main surface of the circuit board. The rigid flexible substrate portion is
A holding portion disposed around the first rigid portion and the second rigid portion, and holding the first rigid portion so that one main surface of the first rigid portion and one main surface of the second rigid portion are at the same height position; The circuit board manufacturing method according to claim 6, wherein the circuit board is held by the holding board provided.   The method for manufacturing a circuit board according to claim 7, wherein after the first mounting step is finished, the holding substrate is separated from the first rigid portion and the second rigid portion.   A state in which one main surface of the first rigid portion and one main surface of the second rigid portion are both held at the same height position, and the other main surface of the first rigid portion and the second rigid portion 9. The method for manufacturing a circuit board according to claim 6, wherein the upper and lower sides are reversed with respect to each other when the other main surfaces are held so as to be at the same height position.   The circuit board manufacturing method according to claim 6, wherein the first flex portion has a crank shape in a plan view.

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