JP2010080293A - Pressure-sensitive adhesive film for sealing organic electroluminescent element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive film for sealing an organic electroluminescent element in which the invasion of oxygen, humidity or the like is prevented, and deterioration caused by a sealing material is suppressed. <P>SOLUTION: This pressure-sensitive adhesive film for sealing the organic electroluminescent element has a pressure-sensitive adhesive layer that contains as a main component on one face of a base material a rubber component composed of 50 to 100 wt.% of A-B-A type styrene block copolymer rubber and/or its hydrogenated product, 0 to 50 wt.% of A-B type styrene block copolymer rubber and/or its hydrogenated product, and a pressure-sensitive adhesive layer containing 50 pts.wt. or more of tackifier resin with respect to 100 pts.wt. of the rubber component. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a pressure-sensitive adhesive film for sealing an organic electroluminescence element used for sealing an organic electroluminescence element.

  In recent years, with the diversification of information equipment, there has been an increasing need for flat display elements that consume less power than commonly used CRTs (cathode ray tubes). As one of such flat display elements, an organic electroluminescence (hereinafter abbreviated as “organic EL”) element having features such as high efficiency, thinness, light weight, and low viewing angle dependency has attracted attention. There are active developments in the display using the.

  The organic EL element injects electrons and holes from the electron injection electrode and the hole injection electrode into the light emitting part, recombines the injected electrons and holes at the emission center to bring the organic molecules into an excited state, and the organic molecules Is a self-luminous element that emits fluorescence when it returns from the excited state to the ground state.

  When the organic EL element is driven for a certain period, there is a problem that light emission characteristics such as light emission luminance, light emission efficiency, and light emission uniformity are significantly deteriorated as compared with the initial case. The causes of such deterioration of the light emission characteristics include oxidation of the electrode due to oxygen that has entered the organic EL element, oxidative decomposition of the organic material due to heat generation during driving, and the electrode due to moisture in the air that has entered the organic EL element Examples thereof include oxidation and modification of organic substances. Furthermore, the interface of the structure peels off due to the influence of oxygen and moisture, the heat generation during driving and the environment during driving are high temperature, etc. Mechanical deterioration of the structure, such as stress generated at the interface of the body and peeling of the interface, can also be cited as a cause of the deterioration of the light emission characteristics.

  In order to suppress such a problem, the technique which seals an organic EL element and suppresses a contact with a water | moisture content or oxygen is examined. For example, Patent Document 1 describes a technique in which when a hermetic space is formed by a substrate and a shield member, both are bonded with a cationic curing type ultraviolet curing epoxy resin adhesive. Patent Document 2 describes a technique in which a flexible film on which a gas barrier layer is formed is coated on the outer surface of an organic EL element as a sealing substrate. Patent Document 3 discloses a technique for bonding a substrate and a sealing plate through a sealing agent in a reduced-pressure atmosphere, and then curing the sealing agent, and an organic electroluminescent element with a low-viscosity first sealing. It describes a technique of sealing with a stopper and sealing with a high-viscosity sealant containing a filler so as to surround the organic electroluminescence element. Further, Patent Document 4 discloses a light having a structure in which an electronic component is sealed by a sealant layer including an uncured surface sealant portion and an uncured outer frame sealant portion surrounding the surface sealant portion. A device manufacturing method is described. Patent Document 5 describes an organic EL device having an adhesive film including an adhesive sealing composition having a hydrogenated cyclic olefin polymer and a polyisobutylene having a weight average molecular weight of 500,000 or more. ing.

JP-A-10-233283 Japanese Patent No. 4010394 JP 2004-265615 A JP 2006-244978 A JP 2007-197517 A

  However, the conventional techniques as described above are still not sufficient from the viewpoint of suppressing the deterioration of the element. If this reason is presumed, in these conventional techniques, since the curable resin such as epoxy is used in the upper part and the peripheral part (side surface part) of the organic electroluminescence element, it is included in the curable resin. A highly reactive component such as a curing agent adversely affects the portion in contact with the organic electroluminescence element, causing deterioration of the element. In Patent Document 5, a curable resin is not used as a sealant for an organic electroluminescence element, but polyisobutylene having a weight average molecular weight of 500,000 or more needs to be dissolved in a solvent and applied or formed into a film. For this reason, it is estimated that the residual solvent in the polyisobutylene composition contributes to device deterioration.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to prevent the intrusion of oxygen and moisture from the outside and suppress the deterioration caused by the sealing material. It is providing the adhesive film for element sealing.

  The pressure-sensitive adhesive film for sealing an organic electroluminescence device according to the present invention has an ABA type styrene block copolymer rubber and / or a hydride thereof in an amount of 50 to 100% by weight on one surface of a substrate, and The main component is an A-B type styrene block copolymer rubber and / or a rubber component comprising 0 to 50% by weight of a hydride thereof, and a tackifier resin of 50 parts by weight or more based on 100 parts by weight of the rubber component. It has an adhesive layer to contain.

  In the present invention, as an adhesive layer for laminating on and around the organic EL element, ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight, and AB Adhesive containing, as a main component, a rubber component composed of 0 to 50% by weight of a styrene block copolymer rubber and / or a hydride thereof and 50 parts by weight or more of a tackifying resin with respect to 100 parts by weight of the rubber Use layers. Since the adhesive layer of the present invention prevents direct entry of oxygen and moisture from the outside, even if it comes into direct contact with the organic EL element, highly reactive components such as curing agents and residual solvents do not have an adverse effect. In addition, it is possible to suppress deterioration due to the sealing material of the organic electroluminescence element.

  In the pressure-sensitive adhesive film for sealing an organic EL device according to the present invention, the pressure-sensitive adhesive layer comprises a styrene-isoprene-styrene block copolymer rubber, a styrene-butadiene-styrene copolymer rubber, a styrene-ethylene-butylene-styrene copolymer. It is preferable from the point of suppression of deterioration of an organic EL element to contain 1 or more types selected from the group which consists of a united rubber and a styrene-ethylene-propylene-styrene copolymer rubber.

  In the adhesive film for sealing an organic EL device according to the present invention, the ABA type styrene block copolymer rubber or the hydride thereof in the adhesive layer is 10 to 40 mol%. This is preferable from the viewpoint of suppressing deterioration of the element.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, it is preferable that the pressure-sensitive adhesive layer does not contain a curing agent from the viewpoint of suppressing deterioration of the organic EL element.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, it is one or more kinds selected from the group consisting of hydrogenated petroleum resin, rosin resin, and terpene resin, in terms of suppressing deterioration of the element, And from the viewpoint of transparency.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, the pressure-sensitive adhesive layer preferably contains a getter agent from the viewpoint of suppressing deterioration of the element.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, it is preferable to further have a getter layer from the viewpoint of suppressing deterioration of the element.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, when the base material is a sealing base material, it can be used for sealing the organic EL element together with the pressure-sensitive adhesive layer.

  In the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention, a sealing layer surrounding the pressure-sensitive adhesive layer is further provided on the surface of the substrate having the pressure-sensitive adhesive layer, and the sealing layer is made of a curable resin. It is preferable to contain it as a main component from the viewpoint of suppressing deterioration of the element.

  In the pressure-sensitive adhesive film for sealing an organic EL device according to the present invention, a film having a release-treated film on the pressure-sensitive adhesive layer is preferable from the viewpoint of preventing dust adhesion and the like before use.

The pressure-sensitive adhesive film for sealing an organic EL device according to the present invention has adhesiveness and low moisture permeability, and is caused by the sealing agent of the organic electroluminescence device even if it is arranged in direct contact with and around the organic EL device. Deterioration can be suppressed.
If the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention is used, the sealing process of the organic EL element can be simplified. Moreover, if the adhesive film for organic EL element sealing by this invention is used, the organic EL panel by which the clearance gap between the sealing base material and the organic EL element was uniformly hold | maintained by the adhesion layer can be obtained.
The pressure-sensitive adhesive layer of the pressure-sensitive adhesive film for sealing an organic EL element according to the present invention can fill a space formed by the base material, the organic EL element, and the sealing base material. Even when a flexible material is used, the adhesive layer has high elasticity and high strength, so it has the function of easily returning to its original shape even when it is deformed by use or impact. There is also an effect that it is possible to suppress the generation of scratches and cracks in the EL layer.

  The pressure-sensitive adhesive film for sealing an organic electroluminescence device according to the present invention has an ABA type styrene block copolymer rubber and / or a hydride thereof in an amount of 50 to 100% by weight on one surface of a substrate, and The main component is an A-B type styrene block copolymer rubber and / or a rubber component comprising 0 to 50% by weight of a hydride thereof, and a tackifier resin of 50 parts by weight or more based on 100 parts by weight of the rubber component. It has an adhesive layer to contain.

  The pressure-sensitive adhesive layer in the pressure-sensitive adhesive film for sealing an organic EL element of the present invention covers the entire surface of the organic EL element and the entire periphery (side surface), thereby allowing oxygen and moisture to enter the organic EL element from the outside. Can be suppressed. The pressure-sensitive adhesive layer used in the present invention contains the specific rubber component and the tackifying resin as described above as main components, and does not essentially contain a curing component or moisture that adversely affects the element, It is non-curable and sticky. Moreover, the adhesive layer of the present invention can be heat-melted without using a solvent. Therefore, even if the adhesive layer in the adhesive film for sealing an organic EL element of the present invention is in direct contact with the organic EL element, the deterioration of the element due to a highly reactive component such as a curing agent or a residual solvent is suppressed. The moisture resistance of the element can be improved.

  Moreover, the adhesive layer in the adhesive film for sealing an organic EL element of the present invention has high elasticity and high strength while having flexibility. Accordingly, the organic EL element is first coated with a relatively soft component having adhesiveness, and further covered with a sealing material having a high gas barrier property and a relatively hard sealing, thereby further improving the barrier property against oxygen and moisture of the element. Can be improved. In addition, since the adhesive layer has high elasticity and high strength, it has a function of easily retaining its outer shape even when it is deformed by use or impact, and also prevents the organic EL layer from being scratched or cracked. There is also an effect that it is possible.

  Hereinafter, it demonstrates using drawing. FIG. 1 shows an example of an adhesive film for sealing an organic EL element of the present invention. In this example, an adhesive layer 2 containing a specific rubber component and a tackifying resin as main components is provided on one surface of the substrate 1.

  FIG. 2 is a schematic cross-sectional view showing another example of the adhesive film for sealing an organic EL element of the present invention. In this example, it has the adhesion layer 2 which contains a specific rubber component and tackifying resin as a main component on one surface of the base material 1, and further has a release treatment film 3 on the adhesion layer 2. It is what you have.

  FIG. 3 is a schematic cross-sectional view showing another example of the adhesive film for sealing an organic EL element of the present invention. In this example, the adhesive layer 2 containing a specific rubber component and a tackifying resin as main components is provided on one surface of the substrate 1, and the adhesive layer 2 has a multilayer structure (2 ′ And 2 ″), and the adhesive layer 2 ′ contains a getter agent and also serves as a getter layer.

  FIG. 4 is a schematic cross-sectional view showing another example of the adhesive film for sealing an organic EL element of the present invention. In this example, the adhesive layer 2 containing a specific rubber component and a tackifying resin as main components is provided on one surface of the substrate 1. It further has a getter layer 4 in between.

FIG. 5 is a schematic cross-sectional view showing another example of the pressure-sensitive adhesive film for sealing an organic EL element of the present invention. In this example, on one surface of the substrate 1, the adhesive layer 2 containing a specific rubber component and a tackifying resin as main components is included, and the substrate 1 has the adhesive layer 2 on the surface. Furthermore, it has the sealing layer 5 surrounding the said adhesion layer. In FIG. 6, the typical top view of the adhesive film for organic EL element sealing of the example of FIG. 5 is shown.
Hereafter, each element which comprises such an organic EL element sealing adhesive film of this invention is demonstrated concretely.

1. Base Material The base material used in the present invention is not particularly limited as long as it can support an adhesive layer containing a specific rubber component and a tackifying resin as main components. The base material used for the adhesive film of the present invention may be one that supports the adhesive layer until the adhesive layer is used to seal the organic EL element, and then peels off the organic EL element. It may be used for sealing an organic EL element together with an adhesive layer as a sealing substrate.

  Accordingly, the material of the substrate is not particularly limited, and may be, for example, a flexible material or a hard material depending on the application. Specific examples of materials that can be used include polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polymethyl acrylate, polyester, polycarbonate, and other plastics, glass, paper, metal foil, and the like. It may be a film or sheet of the above material.

In the case of a substrate used in a mode in which the organic EL element is peeled after sealing, it is preferable that the peeling treatment is performed with, for example, a silicone resin.
The film thickness of the base material in the case of the base material used in a mode of peeling after sealing the organic EL element is usually within a range of 5 μm to 1000 μm, preferably within a range of 10 μm to 500 μm, particularly 25 μm to 400 μm. It is preferable to be within the range.

  In the case of a base material used for sealing an organic EL element together with an adhesive layer as a sealing base material for an organic EL element, the base material is made of glass or metal from the viewpoint of suppressing element deterioration due to oxygen or moisture. Alternatively, a base material having a high gas barrier property made of a material such as a resin is preferably used.

In order to obtain a flexible organic EL panel, a flexible film is used as a sealing substrate, and specifically, a flexible resin film with a gas barrier layer and a thickness of about 10 to 100 μm. A thin sheet glass, an insulating metal sheet, or the like is used.
The film thickness of the flexible film used as the substrate is usually in the range of 5 μm to 1000 μm, preferably in the range of 20 μm to 500 μm, particularly in the range of 50 μm to 300 μm. It is preferable from the viewpoint of balance between thinning and strength.

  The material of the film is not particularly limited as long as it can be formed into a film. Polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polymethyl acrylate, polyester, polycarbonate, fluororesin, polychlorinated resin Vinyl, polyvinyl fluoride, polystyrene, ABS resin, polyamide, polyacetal, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyethersulfone, polyamideimide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polybutylene terephthalate, polyethylene Naphthalate, polymicroxylene dimethylene terephthalate, polyoxymethylene, polyethersulfone, polyetherether Examples include terketone, polyacrylate, acrylonitrile-styrene resin, ABS resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, epoxy resin, polyurethane, silicone resin, amorphous polyolefin, and inorganic thin film. .

  In the present invention, it is particularly preferable to use polyethylene terephthalate, polycarbonate, or polyethersulfone.

  When the base material of the adhesive film in the present invention is used as a sealing base material for an organic EL element, it is preferable that a gas barrier layer having gas barrier properties is formed on the flexible film. . Since a resin film generally has poor gas barrier properties, a resin film having a gas barrier layer formed on it is preferably used.

  Such a gas barrier layer is not particularly limited as long as it has gas barrier properties, but is preferably light transmissive. The gas barrier layer may be a single layer or a stack of a plurality of layers. Further, the formation method may be a wet method, but generally a gas barrier layer formed by a vacuum film formation method is preferably used.

Preferable materials constituting the gas barrier layer in the present invention include SiO _x , SiO _x N _y , and SiN _x . (Here, X and Y are 0 to 2.)
In the case where a resin film is used, it is preferably a film formed by sputtering or plasma CVD, and is preferably SiO _X N _Y. Further, in order to fill the pin hole of the SiO _X N _Y layer, a hybrid with an organic layer may be used.

The gas barrier property required when the substrate of the pressure-sensitive adhesive film in the present invention is used as a sealing substrate of an organic EL device is not particularly limited, but generally has an oxygen permeability of 10 ⁻³ cc. / M ² / day or less, and the water vapor transmission rate is preferably 10 ⁻⁶ g / m ² / day or less.

2. Adhesive layer As described above, the feature of the present invention is that the ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight, and the AB type styrene block copolymer rubber and An organic EL element is sealed with an adhesive layer containing, as a main component, a rubber component composed of 0 to 50% by weight of a hydride thereof and 50 parts by weight or more of a tackifying resin based on 100 parts by weight of the rubber component. It is in the point used for stopping. In addition, containing as a main component means that the total amount of the rubber component and the tackifying resin is 50% by weight or more, preferably 80% by weight or more, more preferably 90% by weight or more in the total amount of the adhesive layer. Represents that.

The first component, ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight, and AB type styrene block copolymer rubber and / or its hydride 0 The rubber component consisting of ˜50% by weight is a component that gives the adhesive layer high elasticity, high strength and flexibility. The rubber component as described above is thermoplastic and does not require a vulcanization step, has high strength, has high flexibility, and exhibits rubber elasticity at room temperature.
Moreover, when a tackifying resin is combined with such a rubber component at a specific ratio, appropriate viscosity and tackiness are imparted. Therefore, the pressure-sensitive adhesive layer of the present invention can be adhered and covered while following the substrate or organic EL element that is the adherend. By having such moderate tackiness, the pressure-sensitive adhesive layer used in the present invention does not need to undergo a curing reaction using a curing agent, element deterioration due to the curing agent, high heat used for the curing reaction, and light irradiation. Deterioration of the element due to is suppressed.

In addition, the rubber component and tackifying resin used in the pressure-sensitive adhesive layer of the present invention do not contain a highly reactive component such as an acid. Furthermore, from ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight, and AB type styrene block copolymer rubber and / or its hydride 0 to 50% by weight Since the resulting rubber component can be hot-melt processed, it is not necessary to use a solvent when laminating on the organic EL element or when forming the adhesive layer, and the adverse effect of the residual solvent in the adhesive layer on the element can also be prevented.
In the present invention, as a layer for covering not only the upper part of the organic EL element but also the surrounding part (side surface), the adhesive layer is directly made organic by combining a specific rubber component and tackifying resin in a specific ratio. Even when bonded to the EL element, it is possible to prevent the element from being deteriorated by a component derived from the adhesive layer.

  In addition, according to the present invention, by combining a specific rubber component or tackifier resin at a specific ratio, the space formed by the base material, the organic electroluminescence element, and the sealing base material is highly elastic, The adhesive layer having high strength, flexibility and adhesiveness can be filled. As a result, the obtained EL element panel retains its outer shape so that it can easily return to its original shape even when it is used or deformed due to impact, even when a sealing substrate or a flexible substrate is used. There is a function, and it is possible to prevent the organic EL layer from being scratched or cracked.

  Furthermore, since the rubber component used in the present invention is excellent in transparency, even when light is led out from the side opposite to the base of the organic EL panel, that is, the adhesive layer covering the EL element, It can be designed not to block light.

In the A-B-A block copolymer rubber and the A-B block copolymer rubber, A is a styrene polymer block, B is a butadiene polymer block, an isoprene polymer block, or a vinyl-isoprene polymer block. It is. These block copolymer rubbers are styrene block copolymers having polystyrene as a hard segment. Specifically, the ABA block copolymer rubber and its hydride are styrene-butadiene-styrene block copolymer rubber (SBS), styrene-isoprene-styrene block copolymer rubber (SIS), Styrene-vinyl isoprene-styrene block copolymer rubber (SVIS), SBS hydride styrene-ethylene-butene-styrene block copolymer rubber (SEBS), SIS hydride styrene-ethylene-propylene- Styrene block copolymer rubber (SEPS). In addition, the AB type block copolymer rubber and its hydride are styrene-butadiene block copolymer rubber (SB), styrene-isoprene block copolymer rubber (SI), and styrene-ethylene which is a SB hydride. -Butene block copolymer rubber (SEB), styrene-ethylene-propylene block copolymer rubber (SEP) which is a hydride of SI.
Among them, it is preferable to include styrene-isoprene-styrene block copolymer rubber and / or styrene-ethylene-propylene-styrene copolymer rubber from the viewpoint that adhesion to an EL element and choices of tackifying resin are expanded.

  These A-B-A type block copolymer rubber and its hydride, and the AB-type block copolymer rubber and its hydride have a weight average molecular weight of 1,000 to 500, The weight average molecular weight of the B block part is preferably 15,000 to 1,000,000. The weight average molecular weight in the present invention is calculated based on a calibration curve prepared using a polystyrene standard material by gel permeation chromatography (GPC) measurement.

  The ABA type block copolymer rubber and the hydride thereof are those having a styrene component of less than 10% by mole because the tackiness is too high and rubber elasticity may not be exhibited. Is preferred. On the other hand, when the styrene component exceeds 40 mol%, the tackiness is too weak, and it may become hard and may not exhibit rubber elasticity.

  The AB type block copolymer rubber and its hydride, and the AB type block copolymer rubber and its hydride are, for example, Nippon Zeon Co., Ltd., Asahi Kasei Corporation, Kuraray Co., Ltd., It is marketed by JSR Corporation and is available.

The AB-A type block copolymer rubber or hydride thereof and the AB-type block copolymer rubber or hydride thereof, when the total amount of the rubber components is 100% by weight, ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight, and AB type styrene block copolymer rubber and / or its hydride 0 to 50% by weight Used by mixing. By using at such a mixing ratio, the effect of the adhesive layer as described above can be suitably obtained.
In particular, when the total amount of the rubber component is 100% by weight, the ABA type styrene block copolymer rubber and / or its hydride 50 to 90% by weight, and the AB type styrene block copolymer weight The combined rubber and / or hydride thereof is preferably mixed and used in the range of 10 to 50% by weight from the viewpoint of adhesion to the element substrate and the sealing substrate and the development of rubber elasticity.
The AB-A type block copolymer rubber or hydride thereof and the AB type block copolymer rubber or hydride thereof may be used in addition to using a mixture obtained by mixing the two in advance. When preparing the rubber component used in the above, it is also possible to use both in such a manner that the mixing ratio of both falls within the above range.

On the other hand, the tackifying resin as the second component imparts an appropriate viscosity and adhesiveness, and improves the wettability and adhesion during hot melting of the rubber component.
Examples of tackifying resins include rosin, rosin derivatives (hydrogenated rosin, disproportionated rosin, polymerized rosin, rosin ester (such as esterified rosin such as alcohol, glycerin and pentaerythritol)), terpene resin (α-pinene, β- Pinene), terpene phenol resin, aromatic modified terpene resin, hydrogenated terpene resin, aliphatic petroleum resin, aromatic petroleum resin, copolymer petroleum resin, alicyclic petroleum resin, coumarone-indene resin, styrene resin , Phenol resin, xylene resin and the like.

  Among them, at least one selected from the group consisting of hydrogenated petroleum resins, rosin resins, and terpene resins has good compatibility with the specific rubber component and can form an adhesive layer with excellent transparency. Are preferably used. Examples of such hydrogenated petroleum resins include water, which is a C5 petroleum resin hydration resin obtained by copolymerizing C5 fractions such as pentene, isoprene, piperine, and 1.3-pentadiene produced by thermal decomposition of petroleum naphtha. Dicyclopentadiene resin (Tonex Co., Ltd .: Escorez 5300,5400 series, Eastman Co .: Eastotac H series, etc.), partially hydrogenated aromatic modified dicyclopentadiene resin (Tonex Co., Ltd .: Escorez 5600) Series, etc.), hydrogenated C9 petroleum resin obtained by copolymerization of C9 fractions such as indene, vinyltoluene, α- or β-methylstyrene produced by thermal decomposition of petroleum naphtha (Arakawa Chemical Industries Ltd.) Company-made: Alcon P or M series), a resin obtained by hydrogenating the above-mentioned copolymer petroleum resin of C5 fraction and C9 fraction (made by Idemitsu Kosan Co., Ltd .: Lee Marv series), and the like. Among these, alicyclic saturated hydrocarbon resins are preferably used from the viewpoint of good compatibility with the specific rubber component.

The compounding in the pressure-sensitive adhesive layer used in the present invention is 50 to 100% by weight of ABA type styrene block copolymer rubber and / or hydride thereof, and AB type styrene block copolymer rubber and / or 50 parts by weight or more of tackifying resin is used with respect to 100 parts by weight of the rubber component composed of 0 to 50% by weight of the hydride.
This is because if the tackifying resin is less than 50 parts by weight with respect to 100 parts by weight of the rubber component, the tackiness is too weak and it may not adhere to the EL element substrate and the sealing substrate. Especially, it is preferable that tackifying resin is used in the ratio of 50-200 weight part with respect to 100 weight part of said rubber components from the point of adhesion with an EL element substrate and a sealing substrate, and expression of rubber elasticity.

  The pressure-sensitive adhesive layer of the present invention can contain an optional additive in addition to the specific rubber component and the tackifier resin as long as the effects and transparency of the present invention are not impaired. Examples of such additives include getter agents, fillers, softeners, ultraviolet absorbers, ultraviolet stabilizers, oxidation inhibitors, and resin stabilizers. As the softening agent, for example, paraffin, naphthenic oil, various waxes and the like are used.

In the present invention, the getter agent is a substance having at least a hygroscopic function, preferably also having a gas (for example, oxygen) absorption and adsorption function. As the getter agent, a hygroscopic agent, a desiccant, an oxygen absorbent and the like are used alone or in a mixed state. The getter agent may be dispersed in the adhesive layer, but may be locally disposed. Further, as shown in FIG. 3, the adhesive layer may have a multilayer structure such as a two-layer structure, and may be dispersed only in the adhesive layer 2 ′ on the side not in contact with the organic EL element.
Or as shown in FIG. 4, the structure where the getter layer 4 which has a getter agent as a main component is provided as a different layer from the adhesion layer may be sufficient.

  Examples of the getter agent include metal oxides such as calcium oxide, magnesium oxide and barium oxide, sulfates such as magnesium sulfate, sodium sulfate and nickel sulfate, and organic metal compounds such as aluminum oxide octylate.

  A getter agent may be used independently and may mix and use 2 or more types. When added to the adhesive layer, the amount of getter agent added is preferably 0.01 to 20% by weight based on the total amount of the adhesive layer.

  Examples of the filler include calcium carbonate such as calcium carbonate, magnesium carbonate, and dolomite, magnesium carbonate, kaolin, calcined clay, pyrophyllite, pentite, sericite, zeolite, talc, attapulgite, wollastonite, and the like. Silicates such as silicate, diatomaceous earth, and silica powder, barium sulfate such as aluminum hydroxide, pearlite, and precipitated barium sulfate, calcium sulfate such as gypsum, calcium sulfite, carbon black, zinc oxide, and titanium dioxide.

  For these fillers, for example, when considering a decrease in transparency of the adhesive layer due to light scattering, the average primary particle diameter of the filler is preferably 1 to 100 nm, and more preferably 5 to 50 nm. Further, when a plate-like or flake-like filler is used to further improve the low moisture permeability, the average primary particle diameter is preferably 0.1 to 5 μm. Further, from the viewpoint of dispersibility with respect to the resin, a hydrophilic filler whose surface is subjected to a hydrophobic treatment is preferably used. Hydrophobic fillers can be prepared by treating the surface of normal hydrophilic fillers with silylating agents such as n-octyltrialkoxysilane, alkyl having a hydrophobic group, aryl, aralkyl silane coupling agents, dimethyldichlorosilane, hexamethyldisilazane, etc. And polydimethylsiloxane having a hydroxyl group at the terminal, or higher alcohols such as stearyl alcohol, and those obtained by treatment with higher fatty acids such as stearic acid.

  A filler may be used independently and may be used in mixture of 2 or more types. When added, the amount of filler added is preferably 0.01 to 20% by weight based on the total amount of the adhesive layer.

  Examples of the ultraviolet absorber include benzotriazole compounds, oxazolic acid amide compounds, and benzophenone compounds. When added, the amount of the ultraviolet absorber added can usually be in the range of about 0.01 to 3% by weight based on the total amount of the adhesive layer.

  Examples of UV stabilizers include hindered amine compounds. When added, the added amount of the UV stabilizer can be generally in the range of about 0.01 to 3% by weight based on the total amount of the adhesive layer.

  Examples of the oxidation inhibitor include hindered phenol compounds and phosphate ester compounds. When added, the addition amount of the oxidation inhibitor is usually within a range of about 0.01 to 2% by weight based on the total amount of the adhesive layer.

  Examples of the resin stabilizer include a phenol resin stabilizer, a hindered amine resin stabilizer, an imidazole resin stabilizer, a dithiocarbamate resin stabilizer, a phosphorus resin stabilizer, and a sulfur ester resin stabilizer. Can do.

  The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the organic EL element can be appropriately covered, but is usually in the range of 1 to 200 μm, preferably in the range of 3 to 100 μm, and more preferably in the range of 5 to 50 μm. is there.

  The pressure-sensitive adhesive layer may be laminated on the entire surface of the one surface of the substrate, or may be laminated in a state in which, for example, the peripheral portion of the surface of the substrate is exposed.

In addition, it is preferable that the adhesion layer surface of the side laminated | stacked on an EL element is protected by the peeling process film before the adhesion layer of this invention is laminated | stacked on an organic EL element. As a peeling process film, the same thing as the base material used in the aspect peeled after organic electroluminescent element sealing among the said base materials can be used.
However, it is preferable that the adhesive strength is different between the pressure-sensitive adhesive layer and the base material, and the pressure-sensitive adhesive layer and the release treatment film from the viewpoint that the pressure-sensitive adhesive layer is easily laminated and sealed on the organic EL element.

3. Sealing layer In the pressure-sensitive adhesive film for sealing an organic EL element of the present invention, a sealing layer surrounding the pressure-sensitive adhesive layer may be further provided on the surface of the substrate having the pressure-sensitive adhesive layer, It is preferable to contain a curable resin as a main component.
When a sealing layer containing a curable resin as a main component is arranged around the adhesive layer in a frame shape, the sealing effect of the organic EL element can be further improved. “Containing as a main component” means that the cured resin is contained in the total amount of the sealing layer by 50% by weight or more, preferably 80% by weight or more, and more preferably 90% by weight or more.

  The curable resin can be a cured resin such as a light and / or thermosetting resin, for example, by being cured by light and / or heat when the organic EL element is sealed. Since such a cured resin has high moisture resistance, it has a characteristic that gas barrier properties are good. However, on the other hand, since the curable resin to be used contains a component having a highly reactive functional group such as a curing agent, when used in a portion in direct contact with the EL element, the deterioration of the EL element is promoted. There was a case. In the pressure-sensitive adhesive film for sealing an organic EL element of the present invention, a sealing layer containing a curable resin as a main component is disposed around the pressure-sensitive adhesive layer that is not directly in contact with the EL element and used for sealing. Accordingly, it is possible to improve the gas barrier property while suppressing the deterioration of the EL element due to the sealant, and to suppress the deterioration of the EL element from their synergistic effect. Note that light includes not only electromagnetic waves having wavelengths in the visible and invisible regions, but also particle beams such as electron beams, and radiation or ionizing radiation that collectively refers to electromagnetic waves and particle beams.

  Examples of the curable resin used in the present invention include various ultraviolet curable resins, electron beam curable resins, thermosetting resins, and two-component curable resins. More specifically, thermosetting resins such as urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, unsaturated polyester resin, polyurethane resin or acrylic resin; ester acrylate, urethane Radical type photocurable resins using resins such as various acrylates such as acrylates, epoxy acrylates, melamine acrylates, acrylic resin acrylates, or urethane polyesters; and cationic photocurable resins using resins such as epoxies and vinyl ethers. .

  The curable resin used in the present invention is not particularly limited as long as the layer shape can be maintained as a sealing layer on the substrate. In this case, a photocurable resin composition having a relatively high viscosity is preferably used for the sealing layer. For such a sealing layer, a photocurable resin having a relatively high viscosity may be selected and used, a delayed curable photocurable resin may be used, or a curable type so as to increase the viscosity. You may add and use additives, such as a filler, suitably to resin.

  The sealing layer of this invention can contain arbitrary additives in addition to the said curable resin in the range which does not impair the effect and transparency of this invention. Examples of such additives include getter agents, fillers, ultraviolet absorbers, ultraviolet stabilizers, oxidation inhibitors, and resin stabilizers as described in the adhesive layer.

  The thickness of the sealing layer is not particularly limited as long as the pressure-sensitive adhesive layer is appropriately covered and the space between the sealing substrate and the EL element substrate can be sealed. Usually, it is set to the same thickness as the adhesive layer, but may be smaller than the adhesive layer. The thickness of the sealing layer is usually in the range of 1 to 200 μm, preferably in the range of 3 to 100 μm, and more preferably in the range of 5 to 50 μm.

4). Preparation of pressure-sensitive adhesive film for sealing an organic electroluminescence element The pressure-sensitive adhesive layer is prepared by dissolving a material used for the pressure-sensitive adhesive layer in a solvent to prepare a pressure-sensitive adhesive layer-forming coating liquid, and sealing the liquid using the pressure-sensitive adhesive layer-forming coating liquid. It can also obtain by apply | coating on a stop base material or a peeling process film, and drying a solvent after that. However, in the present invention, the adhesive layer is preferably formed on the substrate by melting the material used for the adhesive layer without using a solvent. This is because when the adhesive layer is brought into direct contact with the organic EL element, it is preferable to eliminate the influence of the residual solvent as much as possible from the viewpoint of suppressing deterioration of the element.

  When laminating the adhesive layer on one surface of the substrate, the adhesive layer may be directly laminated on the substrate, or after forming the adhesive layer on the release treatment film, the formed adhesive layer is used as the substrate. It may be transferred and laminated. In the case where the base material used in the adhesive film of the present invention is a base material used in a mode in which it is peeled after sealing the organic EL element, it is preferably laminated directly, and the adhesive is used as the sealing base material for the organic EL element. In the case of a substrate used for sealing an organic EL element together with a layer, an adhesive layer is formed on a release-treated film, and then the formed adhesive layer is transferred and laminated on a sealing substrate. preferable.

  Examples of the method for applying the adhesive layer on the sealing substrate or the release treatment film include die coating, roll coating, reverse coating, gravure coating, knife coating, blade coating, rod coating, curtain coating, slide coating, spin coating, Screen printing, offset printing, flexographic printing, etc. are mentioned. Moreover, as a method of melting and forming an adhesion layer, melt extrusion coating etc. are mentioned, for example. In addition, as a means for laminating the formed adhesive layer on the sealing substrate after forming the adhesive layer on the release-treated film, a laminating method, a pressing method, and a method of attaching using a laminator while appropriately heating, Examples include an autoclave method.

  As shown in FIG. 4, when the getter layer 4 is provided as a separate layer from the adhesive layer 2, after the getter layer 4 is provided on the base material 1, the adhesive layer 2 is replaced with the base material 1 and the getter layer 4. Laminate on top. In this case, it is preferable to adjust the areas and shapes of the pressure-sensitive adhesive layer 2 and the getter layer 4 so that at least a part of the pressure-sensitive adhesive layer is directly bonded to the substrate surface. When the getter layer 4 is provided as a separate layer from the adhesive layer 2, the getter layer can be formed using a conventionally known method in accordance with the selected material.

  In addition, when preparing the organic EL element sealing pressure-sensitive adhesive film of the present invention, it is preferably performed in an environment where the oxygen concentration and the water concentration are low. For example, in a nitrogen atmosphere, the oxygen concentration is 1 ppm, the water concentration is 10 ppm or less, and the like. It is preferable to carry out under these conditions from the viewpoint of suppressing deterioration of the organic EL element due to moisture and oxygen.

5). Method of sealing an organic EL element Although the method of sealing an organic EL element using the adhesive film for organic EL element sealing of this invention is not specifically limited, For example, it can seal as follows.
The organic EL element sealing pressure-sensitive adhesive film of the present invention, for example, CaO, CaCO ₃ , BaO, silica gel, molecular sieve, etc., adsorbs moisture and oxygen adsorbed on the pressure-sensitive adhesive film during storage before being laminated on the organic EL element. It is preferable from the viewpoint of suppressing deterioration of the organic EL element.

  When the base material used for the organic EL element sealing pressure-sensitive adhesive film of the present invention is a base material to be used in a form that is then peeled off, first, as shown in FIG. 7 (A), the pressure-sensitive adhesive film of the present invention. Ten adhesive layers 2 are transferred onto the sealing substrate 11 to form an adhesive sealing substrate 12. On the other hand, when the base material used for the adhesive film for sealing an organic EL element of the present invention is a sealing base material, it can be used as the adhesive sealing base material 12 as it is.

Next, the adhesive sealing substrate 12 is laminated on the organic EL element 14 arranged on the base 13 so as to be arranged on and around the organic EL element to form a laminate 15 ( (See FIG. 7B). The organic EL element side surface disposed on the substrate and the adhesive layer side surface of the adhesive sealing substrate are opposed to each other, and the adhesive layer is laminated so as to completely cover the organic EL element. Examples of the laminating method include a laminating method in which a laminator is used while appropriately heating, a pressing method, an autoclave method, and the like. Since the adhesive layer mainly composed of the rubber component and the tackifying resin as described above is a thermoplastic resin, it can be wet and spread on the organic EL element and the EL element base material by heating at about 50 to 150 ° C. On the other hand, when it is returned to room temperature, it exhibits high strength, high elasticity and flexibility.
Even in the case of forming a laminated body, it is preferably performed in an environment where the oxygen concentration and the water concentration are low. For example, the organic EL element may be formed under a nitrogen atmosphere and under conditions such as an oxygen concentration of 1 ppm and a water concentration of 10 ppm or less. From the viewpoint of suppressing deterioration due to moisture and oxygen.

  Next, the curable resin composition 16 is applied around the adhesive layer so as to seal between the base material and the sealing base material in the laminate (see FIG. 7C). A curable resin composition is applied around the adhesive layer in the gap between the base material and the sealing base material so that the surface of the adhesive layer is not exposed. By doing in this way, since between the said base material and the said sealing base material in the said laminated body can be sealed and an organic EL element can be sealed, suppression of deterioration of an organic EL element can be improved further. it can.

As the curable resin composition used for forming the sealing layer, a composition mainly composed of the curable resin described in the sealing layer can be used. The curable resin composition applied and used in this way is not particularly limited in viscosity when used. Preferred resins include epoxy resins such as a two-component thermosetting epoxy resin, a one-component thermosetting epoxy resin, and an ultraviolet curable epoxy resin. More specifically, two-component epoxy resin (20X-325) manufactured by Three Bond Co., Ltd., WORLD ROCK 8723L2 manufactured by Kyoritsu Chemical Industry Co., Ltd., and the like can be given.
Examples of the method for applying the curable resin composition include a method using a dispenser and a screen printing method.

  Next, in accordance with the curable resin composition used, light such as ultraviolet rays and electron beams and / or heating is performed to perform a curing reaction, thereby forming a sealing layer. When performing light irradiation, it is preferable to irradiate only the part which apply | coated the photocurable resin composition from the point of deterioration suppression of an organic EL element.

  Further, for example, as shown in FIGS. 5 and 6, an adhesive film in which a sealing layer 5 is previously laminated on the base material 1 together with the adhesive layer 2 in a frame shape around the adhesive layer is used. A sealing base material may be formed, the adhesive sealing base material may be laminated on the organic EL element, and a sealing layer may be formed.

  Alternatively, the adhesive layer may be directly laminated on and around the organic EL element without being previously laminated on the sealing substrate. In this case, the sealing layer may be formed after laminating the sealing substrate, or the sealing substrate may be laminated after forming the sealing layer.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

<Example 1>
100 parts by weight of styrene-isoprene-styrene resin (manufactured by JSR, SIS5200, styrene content 15 mol%, diblock content 20% by weight) as the rubber component of the adhesive layer, and alicyclic saturated hydrocarbon resin ( 100 parts by weight of Arakawa Chemical Industries, Alcon P-100, softening point 100 ° C) was used. The rubber component was heated and dissolved at 150 to 200 ° C. for 60 minutes, and the tackifying resin was added to the dissolved rubber component. The rubber component and the tackifying resin were mixed and stirred until they were in a uniform state to obtain a resin mixture for forming an adhesive layer.

The adhesive layer-forming resin mixture obtained above was applied to a peeled surface of a 38 μm-thick release-treated polyester film (Purex, manufactured by Teijin DuPont Films) using a spreader so as to be 50 g / m ^2. did. The pressure-sensitive adhesive layer side was further laminated with a release surface of a 38 μm release-treated polyester film (Fujimori Kogyo Co., Ltd., film binder) to produce an organic EL device sealing pressure-sensitive adhesive film having a uniform thickness. The thickness of the obtained adhesive layer was 50 μm.

About the obtained adhesion layer, when water vapor transmission rate was measured in 60 degreeC and 90% RH atmosphere using the water vapor transmission rate measuring device (MOCON water vapor transmission rate measuring device PERMATRAN-W 3/61 by MOCON), 10 g / m ² / day.
Moreover, about the obtained adhesion layer, based on JIS Z 0237, when the 180 degree peel test was done with respect to the stainless steel plate and the adhesive force was measured, it was 23 N / 25mm.

<Example 2>
Gas barrier film for sealing with outer dimensions of 120 mm x 120 mm as the sealing substrate (based on PEN substrate (thickness 200 µm, Teijin DuPont, Teonex Q65F), SiOxNy (x, y = 0 to 2) inorganic layer Hybridized organic layer (water vapor transmission rate of 1 × 10 ⁻³ g / m ² / day or less) was used. The pressure-sensitive adhesive film formed in Example 1 was cut into an outer dimension of 115 mm × 115 mm, the release-treated polyester film on one side was peeled off, and attached to the center of the sealing gas barrier film using a laminator (nitrogen atmosphere oxygen concentration 1ppm or less, roll temperature 70 ℃). Thus, the adhesive film for organic EL element sealing of Example 2 which laminated | stacked the adhesion layer so that the peripheral part of the said surface might be exposed on one surface of the sealing base material was produced.

<Example 3>
In Example 1, instead of using 100 parts by weight of styrene-isoprene-styrene resin (manufactured by JSR, SIS5200, styrene content 15 mol%, diblock content 20 wt%) as the rubber component of the adhesive layer, styrene-ethylene -The organic of Example 3 in the same manner as in Example 1 except that 100 parts by weight of propylene-styrene copolymer rubber (Kuraray Septon 2063, styrene content 13 mol%, JISA rubber hardness 36 °) was used. An adhesive film for sealing an EL element was produced.

<Example 4>
In Example 2, instead of using the adhesive film formed in Example 1, the organic EL element sealing of Example 4 was performed in the same manner as in Example 2 except that the adhesive film obtained in Example 3 was used. An adhesive film was prepared.

<Example 5>
In Example 2, when preparing the adhesive layer, a calcium oxide powder having an average particle size of 5 μm as a getter agent was dispersed in the adhesive mixture forming resin mixture by 10 wt% based on the total amount of the adhesive layer. In the same manner as in Example 2, an organic EL element sealing adhesive film of Example 5 was produced.

<Example 6>
In Example 2, before the adhesive film formed in Example 1 was attached to the sealing gas barrier film, a getter sheet (manufactured by Dynic; HD-S05) was attached on the sealing gas barrier film as shown in FIG. Except having attached, it carried out similarly to Example 2, and produced the organic EL element sealing adhesive film of Example 6. FIG.

[Evaluation 1]
1. Preparation of organic EL element The organic EL element arrange | positioned on the base material was prepared as follows.
First, a glass substrate with an ITO film (manufactured by Sanyo Vacuum Industry Co., Ltd., ITO film thickness: 150 nm, sheet resistance: 14 Ω / □, glass thickness 0.7 mm, outer dimensions 150 mm × 150 mm) was prepared. The ITO film was patterned by a photolithography method to form an ITO electrode pattern.

  The surface of the obtained substrate with the ITO electrode pattern was wet-cleaned, and an insulating layer was formed by photolithography. The number of pixels was 40 × 40, the openings were 2.0 mm □, the pixel pitch was 2.5 mm, and the insulating layer height was 1.5 μm. Thereafter, a cathode separator having a height of 4 μm was formed between the pixel pitches in the cathode direction by photolithography.

A surface treatment was performed on the substrate with an atmospheric pressure plasma apparatus, and then a hole injection layer with a thickness of 60 nm and an organic light emitting layer with a thickness of 90 nm were formed by gravure printing.
As the hole injection material, poly 3,4-ethylenedioxythiophene / polystyrene sulfonate aqueous dispersion (PEDOT / PSS = 1: 20, trade name: CLEVIOS P CH8000, HCStarck) is used and formed by gravure printing Then, drying was performed in the atmosphere at 120 ° C. for 30 minutes. Also, as the organic light emitting material, a polyfluorene derivative-based green light emitting material (weight average molecular weight 300,000) is formed by gravure printing, followed by drying at 180 ° C. for 1 hour at an oxygen concentration of 1 ppm or less in a nitrogen atmosphere. It was.

Thereafter, a Ca layer (electron injection layer) having a thickness of 10 nm and an Al electrode having a thickness of 300 nm were stacked by vacuum deposition. The pressure during vacuum deposition was 2 × 10 ⁻⁷ torr. The deposition rate was about 1.0 Å / s for Ca and about 5 Å / s for aluminum.

2. Manufacture of an organic EL panel An organic EL panel was manufactured as follows.
The release-treated polyester film on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film for sealing an organic EL element of Example 2 obtained above was peeled off to remove moisture adsorbed on the pressure-sensitive adhesive layer. The pixel side of the EL element in which the element side surface of the organic EL element formed on the glass substrate and the surface on the adhesive layer side of the adhesive sealing substrate face each other, and the adhesive layer is disposed on and around the EL element Was pasted using a laminator so as to completely cover. (Nitrogen atmosphere oxygen concentration 1ppm or less, roll temperature 70 ℃)

  In the gap formed between the sealing gas barrier film and the organic EL substrate (periphery of the adhesive layer), a thermosetting epoxy resin (manufactured by Three Bond, two-component epoxy resin; 20X-325) is dispensed. Was applied and cured at 80 ° C. for 1 hour to form a sealing layer.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer.

[Evaluation 2]
When forming the sealing layer of Evaluation 1, an ultraviolet curable adhesive (manufactured by Kyoritsu Chemical Industry Co., Ltd.) is formed in the gap (outer periphery of the adhesive layer) formed between the sealing gas barrier film and the organic EL substrate. , WORLD ROCK 8723L2) was applied using a dispenser, and the sealing layer was formed by irradiating only the coated part with ultraviolet rays under conditions of 6 J / cm ² or more and curing it. An element panel was manufactured.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer.

[Evaluation 3]
In Evaluation 1, instead of using the organic EL element sealing adhesive film of Example 2, the organic EL element sealing adhesive film obtained in Example 4 was used in the same manner as in Evaluation 1, except that the organic EL element sealing adhesive film was organic. An EL panel was obtained.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer.

[Evaluation 4]
In Evaluation 1, instead of using a glass substrate as the base of the organic EL element, a sealing gas barrier film (PEN base material (thickness 200 μm, manufactured by Teijin DuPont, Teonex Q65F) was used as a base, and SiOxNy (x, y = 0 Organic EL of Example 2 in the same manner as in Evaluation 1 except that a hybrid of the inorganic layer and organic layer of ~ 2) was used except that the water vapor transmission rate was 1 × 10 ⁻³ g / m ² / day or less). An organic EL panel using an element sealing adhesive film was produced.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer. Further, it was confirmed that the organic EL panel sample was flexible so that its appearance and performance did not change even after a test in which the sample was wound around a 60 mmφ rod.

[Evaluation 5]
In Evaluation 1, instead of using the organic EL element sealing adhesive film of Example 2, the organic EL element sealing adhesive film obtained in Example 5 was used in the same manner as in Evaluation 1, except that the organic EL element sealing adhesive film was organic. An EL panel was obtained.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer.

[Evaluation 6]
In Evaluation 1, instead of using the organic EL element sealing adhesive film of Example 2, the organic EL element sealing adhesive film obtained in Example 6 was used in the same manner as in Evaluation 1, except that the organic EL element sealing adhesive film was organic. An EL panel was obtained.

After the obtained organic EL panel was stored in the atmosphere at room temperature for 10 days, a direct current voltage of 12 V was applied and the light emitting part was observed, and no occurrence of dark spots was observed.
It was estimated that the gas barrier properties from moisture and oxygen were improved and the organic EL element was not deteriorated by impurities generated from the sealant.
The clearance between the sealing substrate and the organic EL element was uniformly maintained by the adhesive layer.

It is sectional drawing which shows typically an example of the adhesive film for organic EL element sealing of this invention. It is sectional drawing which shows typically another example of the adhesive film for organic EL element sealing of this invention. It is sectional drawing which shows typically another example of the adhesive film for organic EL element sealing of this invention. It is sectional drawing which shows typically another example of the adhesive film for organic EL element sealing of this invention. It is sectional drawing which shows typically another example of the adhesive film for organic EL element sealing of this invention. It is a top view which shows typically the organic EL element sealing adhesive film of FIG. FIG. 7 (A) to FIG. 7 (C) are cross-sectional views schematically showing an example of use of the adhesive film for sealing an organic EL element of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2, 2 'and 2 "Adhesion layer 3 Release process film 4 Getter layer 5 Sealing layer 10 Adhesive film for organic EL element sealing 11 Sealing base material 12 Adhesive sealing base material 13 Base body 14 Organic EL element 15 laminate 16 curable resin composition

Claims (10)

  ABA type styrene block copolymer rubber and / or its hydride 50 to 100% by weight on one side of the substrate, and AB type styrene block copolymer rubber and / or its hydrogen Adhesive for sealing an organic electroluminescence device, comprising an adhesive layer containing as a main component a rubber component consisting of 0 to 50% by weight of a chemical compound and 50 parts by weight or more of a tackifier resin with respect to 100 parts by weight of the rubber component the film.   The adhesive layer is made of styrene-isoprene-styrene block copolymer rubber, styrene-butadiene-styrene copolymer rubber, styrene-ethylene-butylene-styrene copolymer rubber, and styrene-ethylene-propylene-styrene copolymer rubber. The pressure-sensitive adhesive film for sealing an organic electroluminescent element according to claim 1, comprising at least one selected from the group consisting of:   The adhesive film for sealing an organic electroluminescent element according to claim 1 or 2, wherein the ABA type styrene block copolymer rubber or the hydride thereof in the adhesive layer is 10 to 40 mol%. .   The pressure-sensitive adhesive film for sealing an organic electroluminescence element according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive layer does not contain a curing agent.   The organic electroluminescence according to any one of claims 1 to 4, wherein the tackifying resin in the adhesive layer is at least one selected from the group consisting of hydrogenated petroleum resins, rosin resins, and terpene resins. An adhesive film for device sealing.   The adhesive film for organic electroluminescent element sealing in any one of Claims 1 thru | or 5 in which the said adhesion layer contains a getter agent.   Furthermore, the adhesive film for organic electroluminescent element sealing in any one of the Claims 1 thru | or 6 containing a getter layer.   The pressure-sensitive adhesive film for sealing an organic electroluminescence element according to claim 1, wherein the base material is a sealing base material.   The substrate according to any one of claims 1 to 8, further comprising a sealing layer surrounding the adhesive layer on the surface having the adhesive layer of the substrate, wherein the sealing layer contains a curable resin as a main component. The adhesive film for organic electroluminescent element sealing of description.   The pressure-sensitive adhesive film for sealing an organic electroluminescence element according to claim 1, wherein the pressure-sensitive adhesive layer has a release treatment film.

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