JP2010080122A - Chip type solar power generation element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dye-sensitized solar power generation element (solar cell) capable of a wide range of use as a component single body, to say nothing of a use as a solar cell module, and that, excellent in mechanical strength, and easy to handle as an electronic component. <P>SOLUTION: The solar power generation element is provided with a package 2 equipped with electrode terminals 4, 5 led from inside toward outside, and a dye-sensitized solar power generation part 3 equipped with a translucent substrate 31, as well as a translucent conductive film 32, a dye-content semiconductor film 33, and an electrolyte film 34 fitted in that order at a side opposite to a light-receiving face 31a of the translucent substrate 31 and arranged inside the package 2. The light-receiving face 31a of the translucent substrate 31 is exposed from a top face of the package 2, the translucent conductive film 32 is electrically conducted to an electrode terminal part 41 by conductive paste 6, and the electrolyte film 34 is conducted to an electrode terminal part 51. The translucent conductive film 32 and the electrode terminal part 51 are fixed by a sealing material 7 fitted around the film 33 and the film 34. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a chip-type solar power generation device in which a dye-sensitized solar power generation device (a dye-sensitized solar cell) is packaged.

  Solar cells include silicon semiconductor solar cells {crystalline (single crystal, polycrystalline), amorphous (non-crystalline)} and compound semiconductor solar cells. Recently, dye-sensitized solar cells have attracted attention. ing. Compared with other solar cells, dye-sensitized solar cells are not only low in material cost, simple in structure, do not require large-scale manufacturing facilities, are low in cost, and have high photoelectric conversion efficiency. Is extensive.

A dye-sensitized solar cell having such characteristics is generally a module having a certain size by connecting a plurality of cells having a small area in series or in parallel (opposed cell module, Z-type module, etc .: unit panel). Offered as. In order to increase the current value by photovoltaic power generation, it is necessary to increase the surface area of a semiconductor film (eg, titanium dioxide: TiO ₂ ) as a photoelectrode. However, if the surface area is increased, conversion efficiency decreases. This is because problems arise.

  However, in the case of a module, if some of the cells are deteriorated or damaged, it is necessary to replace the entire module, which is wasteful and expensive.

  From such a viewpoint, for the purpose of facilitating attachment / detachment to / from the unit panel body, a translucent substrate (glass substrate), a substrate (ceramic substrate) disposed opposite to the translucent substrate, and a transparent substrate A negative electrode comprising a semiconductor electrode having a sensitizing dye disposed on one surface side of a light substrate, a catalyst electrode disposed on one surface side of the substrate, and an electrolyte, and being electrically connected to the semiconductor electrode on the other surface side of the substrate There is a dye-sensitized solar cell provided with a positive electrode terminal that is electrically connected to a side electrode terminal and a catalyst electrode (see, for example, Patent Document 1).

This Patent Document 1 describes a case where both the negative electrode terminal and the positive electrode terminal are pins protruding from the substrate, and are provided on both surfaces or one surface of the protruding portion of the substrate.
JP 2005-235715 A

  However, the dye-sensitized solar cell described in Patent Document 1 is directed to the unit panel main body regardless of whether the negative electrode terminal and the positive electrode terminal are pins or provided on the protruding portion of the substrate. Therefore, the translucent substrate and the substrate are exposed as a whole. For this reason, in order to use the dye-sensitized solar cell as a component alone for applications other than unit panels, it is less versatile and inferior in mechanical strength reliability than general electronic components such as resistors and capacitors. On top of that, there are also difficulties in handling.

  The present invention has been made paying attention to such a problem, and can be widely used as a single component as well as a solar cell module, and has excellent mechanical strength and is easy to handle as an electronic component. An object is to provide a sensitized solar power generation device (solar cell).

  The above problems are solved by the chip type photovoltaic power generation device of the present invention. That is, the chip-type photovoltaic power generation device of the present invention is provided in order on a package having a pair of electrode terminals led out from the inside to the outside, a translucent substrate, and a side opposite to the light receiving surface side of the translucent substrate. And a dye-sensitized solar power generation unit disposed inside the package, the dye-sensitized solar power generation unit including the light-transmitting conductive film, the dye-containing semiconductor film, and the electrolyte film. The light-receiving surface of the optical substrate is exposed from the surface of the package, the translucent conductive film located inside the package is conducted to one electrode terminal portion inside the package, and the electrolyte membrane is a counter electrode inside the package. It is characterized by being conducted to the other electrode terminal portion.

  This chip type photovoltaic power generation device is packaged, and the light receiving surface of the light-transmitting substrate of the dye-sensitized photovoltaic power generation unit is covered with the package, and a pair of electrode terminals are led out from this package. ing. Therefore, the photovoltaic power generation element of the present invention can be handled in the same manner as chip-type electronic components such as resistors and capacitors, and has high versatility.

  In this chip-type solar power generation element, the light-transmitting conductive film of the dye-sensitized solar power generation section and the other electrode terminal portion inside the package are the dye-containing semiconductor film and electrolyte of the dye-sensitized solar power generation section. It is preferable to be fixed with a sealing material provided around the membrane.

  Moreover, it is preferable that the translucent conductive film of the dye-sensitized solar power generation unit and one electrode terminal portion inside the package are connected by a conductive paste.

  In the present invention, translucency means having a property of transmitting light that contributes to solar power generation. However, the transmittance is preferably as high as possible, but this is not a problem in the present invention.

  According to the first aspect of the invention, the conversion efficiency is high due to the chip-type structure, and it is easy to secure necessary voltages and currents. The solar cell module is of course versatile as a single component. In addition, since it is ultra-small (chip component type), not only mass production is possible, it is excellent in mechanical strength and easy to handle as an electronic component.

  For example, in the case of a solar cell module, it is possible to provide a photovoltaic power generation system that can be mounted on a printed circuit board in the same manner as a general chip-type electronic component and that has improved conversion efficiency and versatility at low cost. It becomes possible. Moreover, it becomes easy to produce solar cell modules of various shapes (rectangle, square, line shape, etc.). Furthermore, even if a part of the photovoltaic power generation element is deteriorated or damaged in the solar cell module, it is only necessary to replace the photovoltaic power generation element, and the replacement is easy.

  According to the invention of claim 2, the dye-sensitized solar power generation unit is securely fixed and held inside the package, and the dye-containing semiconductor film and the electrolyte membrane of the dye-sensitized solar power generation unit are translucent. Sealing between the conductive film and the other electrode terminal portion is ensured.

  According to invention of Claim 3, a translucent conductive film and one electrode terminal part can be reliably conduct | electrically_connected.

  Hereinafter, the present invention will be described in more detail with reference to embodiments.

  FIG. 1 is an external perspective view of a chip-type photovoltaic power generation device according to the embodiment, FIG. 2 is a plan view (top view), and FIG.

  The chip-type solar power generation element 1 has a rectangular parallelepiped shape as a whole, and includes a package 2 having a pair of electrode terminals 4 and 5 led out from the inside to the outside, and a dye-sensitized solar power generation disposed inside the package 2. Part 3. As an example, the chip-type solar power generation element 1 has a size of length × width × height = 5 × 5 × 3.2 mm (see FIGS. 2 and 5).

  The package 2 is made of resin, ceramic, or the like, similar to a normal packaged electronic component. The package 2 may be translucent or non-translucent.

  The pair of electrode terminals 4 and 5 are surface-treated with, for example, platinum (Pt) having a catalytic action, graphite or the like, appear from the side surface of the package 2 to the outside, and extend to the bottom surface. The electrode terminals 4 and 5 have portions 41 and 51 located inside the package 2. The electrode terminal portion 51 has a larger area than the electrode terminal portion 41 depending on the dye-containing semiconductor film 33 and the electrolyte film 34 described later. Has been.

  The dye-sensitized solar power generation unit 3 includes a translucent substrate 31, a translucent conductive film 32, a dye-containing semiconductor film 33, and a translucent conductive film 32 provided in this order on the side opposite to the light receiving surface 31a side of the translucent substrate 31. It has an electrolyte membrane 34.

  The translucent substrate 31 is a glass substrate or a film substrate, and in the embodiment, is particularly a glass substrate. The light receiving surface 31a of the translucent substrate 31 is exposed from the surface of the package 2, and forms a flat surface with the upper surface of the package 2.

  The translucent conductive film 32 is provided on the entire surface of the translucent substrate 31 opposite to the light receiving surface 31 a side. As the translucent conductive film 32, for example, a thin film (indium / tin / oxide: ITO film) in which several percent of tin is added to indium oxide, or a thin film (fluorine-doped tin oxide) in which several percent of fluorine is added to tin oxide. : FTO film).

The dye-containing semiconductor film 33 has a thickness of about 10 μm, for example, and is formed in a square shape near one side (right side in the drawing) of the translucent conductive film 32. The dye to be used is not specified as long as it has an absorption range in sunlight. For example, there are a complex dye and an organic dye, the complex dye includes a ruthenium complex dye and an osmium complex dye, and the organic dye includes polymethine. Pigments, merocyanine pigments, and the like. The dye-containing semiconductor film 33 is formed by, for example, applying titanium dioxide (TiO ₂ ) on the light-transmitting conductive film 32 formed on the light-transmitting substrate 31, and then allowing the dye to permeate. The translucent substrate 31, the translucent conductive film 32, and the dye-containing semiconductor film 33 serve as a negative electrode (photoelectrode).

The electrolyte membrane 34 is formed in the same shape and size as the dye-containing semiconductor film 33. As electrolytes, I ₂ and iodide, Br ₂ and bromide, metal complexes (ferrocyanate-ferricyanate, ferrocene-ferricinium ion, etc.), sulfur compounds (polysulfide sodium, alkylthiol-alkyl disulfide, etc.) Viologen dye, hydroquinone-quinone, and the like. Examples of the solvent for these electrolytes include carbonates, heterocyclic compounds, ethers, alcohols, nitriles and the like.

  The electrolyte membrane 34 obtained by blending an electrolyte with the solvent may be used as an electrolyte solution, but may be a gel or a solid. In particular, when used as an electrolyte solution, it is important to securely seal the electrolyte solution.

  The translucent conductive film 32 of the dye-sensitized solar power generation unit 3 is electrically connected to the electrode terminal portion 41 inside the package 2 by a conductive paste (Ag paste or the like) 6, and the electrolyte film 34 is connected to the positive electrode ( It is conducted to the electrode terminal portion 51 as a counter electrode).

  The translucent conductive film 32 and the electrode terminal portion 51 of the dye-sensitized solar power generation unit 3 are fixed by an adhesive sealing material 7 provided around the dye-containing semiconductor film 33 and the electrolyte film 34. . By this sealing material 7, the dye-sensitized solar power generation unit 3 is securely fixed and held inside the package 2, and the dye-containing semiconductor film 33 and the electrolyte film 34 are made of the translucent conductive film 32 and the electrode terminal portion 51. It is surely sealed between.

  As is apparent from the structure of the chip-type solar power generation device 1 configured in this way, the substrate for forming the electrode terminal portion 41 using the package portion 21 as the electrode terminal portion 41 and the positive electrode portion of the package 2. It is intended to be used as That is, the chip-type photovoltaic power generation device 1 is entirely packaged by a package 2 having a package portion 21 serving as a counter electrode-side substrate, and the translucent substrate of the dye-sensitized solar power generation unit 3 The light receiving surface 31a other than 31 is covered with the package 2, and a pair of electrode terminals 4 and 5 are led out from the package 2.

  This chip-type solar power generation element 1 has high conversion efficiency due to the chip-type structure, easily secures necessary voltages and currents, and has high versatility as a single component as well as a solar cell module. In addition, since it is ultra-small (chip component type), not only mass production is possible, it is excellent in mechanical strength and easy to handle as an electronic component.

  For example, in the case of a solar cell module, it is possible to provide a photovoltaic power generation system that can be mounted on a printed circuit board in the same manner as a general chip-type electronic component and that has improved conversion efficiency and versatility at low cost. It becomes possible. Moreover, it becomes easy to produce solar cell modules of various shapes (rectangle, square, line shape, etc.). Furthermore, even if a part of the photovoltaic power generation element is deteriorated or damaged in the solar cell module, it is only necessary to replace the photovoltaic power generation element, and the replacement is easy.

  Next, an example of a manufacturing method of the chip type solar power generation element 1 configured as described above will be outlined with reference to FIGS. 4 and 5. The conductive material (ITO, FTO, etc.) is formed on the entire surface opposite to the light-receiving surface of the light-transmitting substrate having a size capable of manufacturing a plurality of photovoltaic power generation elements. Then, for example, titanium dioxide is partially applied onto the light-transmitting conductive film by using a screen printing method, a spraying method, or the like. Next, a dye-containing semiconductor film is formed by infiltrating titanium dioxide with a forwardly inclined dye having an absorption range in sunlight.

  Next, the translucent substrate is individually divided by, for example, dicing the translucent substrate or by performing an extract hand after half-cutting by dicing. The divided transparent substrate 31 is shown in FIG. As an example, the translucent substrate 31 has a size of horizontal × height = 3.8 × 1.8 mm.

  On the other hand, in FIG. 5, a two-pole package 2 is prepared in which a conductive metal (platinum or the like) is formed by sputtering, plating or the like to form a pair of electrode terminals 4 and 5. This package 2 has a rectangular parallelepiped hole 25 into which the translucent substrate 31 of FIG. 4 is fitted. The horizontal dimension of the hole 25 is 4 mm as an example, and is somewhat larger than the horizontal dimension of 3.8 mm of the translucent substrate 31 by the fitting allowance.

  In the hole 25, the conductive paste 6 is applied to the electrode terminal portion 41. In addition, the sealing material 7 is applied around the electrode terminal portion 51, and the electrode terminal portion 51 inside the sealing material 7 is filled with an electrolyte solution in which, for example, iodine and iodide are mixed in a solvent as an electrolyte. Alternatively, the electrolyte membrane 34 is formed by molding in a gel state or a solid state.

  Thereafter, the translucent substrate 31 is fitted into the hole 25 of the package 2, whereby the chip type solar power generation element 1 as shown in FIG. 3 is manufactured.

  In addition, in the said manufacturing method, when using electrolyte solution in a gel state or a solid state, you may shape | mold by the photopolymerization on the pigment | dye containing semiconductor film 33 of the translucent board | substrate 31. FIG. That is, the electrolyte membrane 34 may be provided on the translucent substrate 31 side.

  For reference, FIG. 6 shows a mounting example in the case where the chip type photovoltaic power generation elements 1 are arranged on a printed board. In FIG. 6, a plurality of chip type solar power generation elements 1A, 1B,... Are connected in series. That is, the electrode terminal 4 of the power generating element 1A is connected to the wiring pattern 91 on the printed circuit board 9, the electrode terminal 5 is connected to the wiring pattern 92, and the electrode terminal 4 of the power generating element 1B is connected to the wiring pattern 92, Terminal 5 is connected to wiring pattern 93. Thereby, the solar cell module of various shapes can be produced easily.

It is an external appearance perspective view of the chip type photovoltaic power generation element concerning an embodiment. It is a top view (top view) of the chip type solar power generation element. It is a longitudinal cross-sectional view of the same chip type photovoltaic power generation element. It is a longitudinal cross-sectional view by the side of the translucent board | substrate for demonstrating an example of the manufacturing method of the chip type photovoltaic power generation element. It is a longitudinal cross-sectional view by the side of the package for demonstrating an example of the manufacturing method of the chip type photovoltaic power generation element. It is a partially-omitted side view which shows the example of mounting in the case of arranging the chip type photovoltaic power generation element on a printed circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip type photovoltaic power generation element 2 Package 3 Dye-sensitized photovoltaic power generation part 4,5 Electrode terminal 6 Conductive paste 7 Sealing material 21 Package part 31 Translucent substrate 31a Light-receiving surface 32 Translucent conductive film 33 Dye containing Semiconductor film 34 Electrolyte film 41, 51 Electrode terminal part

Claims (3)

  A package having a pair of electrode terminals led out from the inside to the outside, a translucent substrate, a translucent conductive film provided in this order on the side opposite to the light-receiving surface side of the translucent substrate, a dye-containing semiconductor film, and And a dye-sensitized solar power generation unit disposed inside the package, the dye-sensitized solar power generation unit including a light-receiving surface of the translucent substrate from a surface of the package. The light-transmitting conductive film exposed and located inside the package is conducted to one electrode terminal portion inside the package, and the electrolyte membrane is conducted to the other electrode terminal portion as a counter electrode inside the package. A chip-type solar power generation element characterized by the above.   The translucent conductive film of the dye-sensitized solar power generation unit and the other electrode terminal portion inside the package are provided around the dye-containing semiconductor film and the electrolyte film of the dye-sensitized solar power generation unit. The chip type solar power generation element according to claim 1, wherein the chip type solar power generation element is fixed with a sealing material.   The translucent conductive film of the dye-sensitized solar power generation unit and one electrode terminal portion inside the package are connected by a conductive paste. Chip-type solar power generation device.