JP2010080071A - Lighting fixture for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting fixture for vehicle capable of accurately mounting a semiconductor light source on a light source mounting face of a heat sink member. <P>SOLUTION: An underside of a substrate 10A of the semiconductor light source 10 is superposed on the light source mounting face 21 of the heat sink member 20, and its rear-side end face is made in plane-contact with a rear-side stopper 30R set in protrusion on the mounting face 21 for locking contact. Then, a front-side end face of the substrate 10A is pressed toward the rear-side stopper 30R side with a leaf spring 31, so that the substrate 10A is pinch-pressed in a front-and-rear direction with the rear-side stopper 30R and the leaf spring 31 to be positioned. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vehicular lamp used for a rear combination lamp, a fog lamp, and the like including an automobile headlamp.

Conventionally, as shown in, for example, Patent Document 1 as a vehicle lamp, a semiconductor light source such as a light emitting diode (LED) is used as a light source, and this is assembled to a heat sink member (fixing member) together with a reflector. A heat source is known in which heat generated by a light source is diffused by the heat sink member.
JP 2006-302714 A

  In the conventional vehicular lamp, the semiconductor-type light source is positioned and fixedly disposed on the power supply attachment member, and the semiconductor-type light source is fixed to the heat sink member by inserting and fixing the power supply attachment member to the heat sink member. It is arranged at the site.

  Therefore, the assembly error between the semiconductor light source and the power supply attachment member and the assembly error between the power supply attachment member and the heat sink member are integrated, and the optical positional relationship between the semiconductor light source and the reflector, shade, projection lens, etc. It is undeniable that an error will occur and the light distribution performance will be adversely affected.

  On the other hand, the rear surface of the semiconductor type light source and the light source mounting surface of the heat sink member are provided with a locating pin and a locating hole that are engaged with each other, and the semiconductor type light source is positioned by the engagement between the locating pin and the locating hole, Although it is also directly fixed to the light source mounting surface, it is difficult to manage the processing accuracy of the locating pin and the locating hole, and in this case also, the positional relationship between the semiconductor light source and other optical system members is delicate. It will cause madness.

  Therefore, the present invention provides a vehicular lamp that can accurately assemble a semiconductor-type light source on a light source mounting surface of a heat sink member, and can improve light distribution performance.

  In the vehicular lamp of the present invention, a semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, and an optical system member such as the semiconductor-type light source and the reflector are provided. A flat light source mounting surface on which the semiconductor light source of the heat sink member is fixedly disposed and protrudes on the light source mounting surface, and at least one of the semiconductor light sources. A stopper that is engaged with the side end surface, and a spring member that is disposed to face the stopper and presses the other end surface of the semiconductor-type light source toward the stopper side are provided. And the spring member is positioned by opposing clamping force.

  The semiconductor-type light source has its rear surface overlapped with the light source mounting surface of the heat sink member, and one side end surface of the semiconductor-type light source is brought into surface contact with and locked to a stopper projecting on the light source mounting surface. Thus, the arrangement reference position of the semiconductor light source is determined. And the arrangement | positioning position of this semiconductor type light source is decided by pressing the other side end surface of this semiconductor type light source toward the said stopper side with the said spring member.

  According to the present invention, the arrangement reference position of the semiconductor light source on the light source mounting surface is brought into contact with the stopper projecting on the light source mounting surface of the heat sink member by abutting one end face of the semiconductor light source on the surface. Since the arrangement position of the semiconductor light source is determined by the opposing clamping pressure between the stopper and the spring member, there is no intermediate medium as in the conventional power supply attachment member, and the semiconductor light source is assembled. Accuracy can be increased.

  In addition, the accuracy of the contact surface between the stopper and the semiconductor-type light source only needs to be obtained, so that the processing accuracy can be easily managed and the positioning of the semiconductor-type light source can be performed accurately, and the optical positional relationship with other reflectors, etc. is not correct. Thus, the light distribution performance can be improved.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings by taking a vehicle headlamp as an example.

  1 is an exploded perspective view showing a lamp unit in a headlamp according to the present invention, FIG. 2 is a sectional view of the lamp unit, FIG. 3 is a perspective view showing a positioning state of a semiconductor light source, and FIG. 4 is an assembled state of a spring member FIG. 5 is a perspective view showing the assembled state of the power feeding member, and FIG. 6 is a perspective view showing the assembled state of the fixed frame.

  The lamp unit 1 of the headlamp shown in FIGS. 1 to 6 is configured as a projector type, and includes a semiconductor-type light source 10 and a reflector 11 having a concave reflection surface 11a that reflects a part of light emitted from the semiconductor-type light source 10. A projection lens 12 that collects the direct light from the semiconductor light source 10 and the reflected light from the reflector 11 and irradiates the light forward, and the semiconductor light source 10, the reflector 11, and the projection lens 12 are optically connected. A heat sink member 20 arranged in a concentrated manner.

  This lamp unit 1 is disposed in a lamp chamber formed by a lamp housing (not shown) and a transparent outer lens to constitute a headlamp.

  The reflecting surface 11a of the reflector 11 is an ellipse or a reflecting surface based on an ellipse, for example, a free-form surface based on a spheroid or ellipse. In the vertical cross section of FIG. 2, the reflecting surface 11a of the reflector 11 has, for example, a semi-elliptical shape in which an ellipse is halved along its long axis, and the front end side of the reflecting surface 11a is a semi-columnar hood portion 11A. It is said that.

  The reflector 11 is formed of, for example, a light-impermeable synthetic resin material, and the reflective surface 11a is formed by performing aluminum vapor deposition or silver coating on the inner surface of the reflector 11.

  The reflecting surface 11a of the reflector 11 includes a first focal point F1 and a second focal point F2, and the light emitting unit 10a of the semiconductor-type light source 10 is disposed at or near the first focal point F1. Thereby, of the light emitted from the semiconductor-type light source 10, the light reflected by the reflecting surface 11 a of the reflector 11 is collected at the second focal point F <b> 2 of the reflector 11 or in the vicinity thereof.

  The semiconductor light source 10 is a light source using luminescence (light emission development) obtained by applying a voltage to a semiconductor, such as a light emitting diode (LED) or an electroluminescence (EL) including an organic EL and an inorganic EL.

  This semiconductor-type light source 10 has a flat rectangular substrate 10A, terminals 10b are provided on the upper surfaces of the left and right sides of the substrate 10A, and a transparent dome-shaped cover 10c is attached to cover the light emitting portion 10a. .

  The projection lens 12 is a convex lens having a spherical or substantially spherical shape on at least one side surface. In this embodiment, both side surfaces of the projection lens 12 have a convex substantially spherical shape, and the side surface (front surface) on the front side of the lamp has a smaller radius of curvature than the side surface (rear surface) on the rear side of the lamp. The shape of the projection lens 12 is not limited to this, and may be any convex lens whose thickness in the lens optical axis direction becomes thinner from the center to the outer periphery. For example, a plano-convex lens whose side surface (rear surface) on the rear side of the lamp is a substantially flat surface. It may be.

  The projection lens 12 has a horizontal or substantially horizontal lens optical axis Z1, and the first focal point F1 and the second focal point F2 of the reflector 11 are set on the lens optical axis Z1. As a result, the light focused at or near the second focal point F2 of the reflector 11 is condensed into a light beam parallel or substantially parallel to the lens optical axis Z1 when passing through the projection lens 12, and is projected forward of the lamp. The

  Since the semiconductor-type light source 10 generates less heat than a halogen lamp or HID lamp (high-intensity discharge lamp), a lens made of a synthetic resin that is lighter than a glass lens, such as an acrylic lens, is used as the projection lens 12. Is done.

  The heat sink member 20 is made of a metal material having a high thermal conductivity, for example, aluminum die casting. The heat sink member 20 is formed in a substantially rectangular box shape with the lower side open, and a plurality of vertical fins 20a are arranged at equal intervals in the vehicle width direction on the lower side.

  The heat sink member 20 also serves as a base on which the semiconductor-type light source 10, the reflector 11, and the projection lens 12 are optically concentrated as described above, and dissipates heat generated by the semiconductor-type light source 10. Thus, the upper surface is formed flat, and the mounting surface 21 of the semiconductor light source 10 and the mounting surface 22 of the reflector 11 are formed.

  As will be described later, the semiconductor-type light source 10 has a light emitting portion 10a facing upward on the light source mounting surface 21, and the light emission center is substantially horizontal at a fixed position where the position of the first focal point F1 of the reflector 11 or a position in the vicinity thereof. Accordingly, the light source mounting surface 21 is formed stepwise with respect to the reflector mounting surface 22 to a depth that allows the emission center of the semiconductor light source 10 to be taken on the lens optical axis Z1. .

  On the other hand, the reflector 11 is fastened and fixed to the reflector mounting surface 22 from above by using screws or the like covering the upper and rear sides of the semiconductor light source 10, and the general upper surface of the heat sink member 20 including the reflector mounting surface 22 is the lens. It is formed as a flat surface substantially aligned on the optical axis Z1.

  In this embodiment, the front end edge of the general upper surface of the heat sink member 20 constitutes a shade 23, and the shade 23 is reflected light that is emitted from the semiconductor-type light source 10 and reflected by the reflecting surface 11 a of the reflector 11. A predetermined light distribution pattern having a cut-off line with the remaining reflected light, for example, a passing light distribution pattern (low beam) is formed.

  Further, the rear flat surface of the shade 23 on the general upper surface of the heat sink member 20 is located behind the lamp 23 in the first reflective surface 11a when the reflective surface 11a of the reflector 11 is the first reflective surface. It is formed as a second reflecting surface 24 that reflects the reflected light reflected at the position in an obliquely upward direction toward the upper portion of the projection lens 12.

On the other hand, a third reflecting surface 25 that reflects a part of the light emitted from the semiconductor-type light source 10 toward the position immediately before the shade 23 is formed on the upper portion of the front end portion of the hood portion 11A of the reflector 11. Has been. The third reflecting surface 25, the front end upper portion of the hood portion 11A, by forming the bulge portions 11A ₁ projecting section inverted triangular shape toward the inside, slopes inclined forward of the rear of the inner Formed with.

  In addition, a fourth reflecting surface 26 that reflects the reflected light reflected by the third reflecting surface 25 toward the upper portion of the projection lens 12 is formed immediately before the shade 23. The fourth reflection surface 26 is formed as an inclined surface inclined obliquely downward, and the third and fourth reflection surfaces 25 and 26 are for overhead sign forming a light distribution pattern at a position above the low beam light distribution pattern. This constitutes the reflective surface.

  Similar to the first reflecting surface 11a and the third reflecting surface 25 of the reflector 11, the second reflecting surface 24 and the fourth reflecting surface 26 on the heat sink member 20 side are formed by performing aluminum deposition or silver coating, It can also be easily obtained by mirror-finishing the ground surface of the aluminum die casting constituting the heat sink member 20 by polishing.

  Further, the projection lens 12 is held and fixed at its peripheral edge by a lens holder. In the present embodiment, a lens holder portion 27 is integrally formed at the front end portion of the heat sink member 20, The projection lens 12 is held and fixed by the lens holder portion 27.

  The lens holder portion 27 is integrally formed as an extension portion having left and right side walls and a bottom wall from the front end surface of the heat sink member 20, and an inner peripheral surface thereof is formed in a concave semicircular shape. A groove 27 a is formed in a stepped manner in the lower central portion of the inner periphery of the front end of the lens holder portion 27. The projection lens 12 is fixed by fitting a lower locking projection 12a extending along the lower peripheral edge of the projection lens 12 into the groove 27a, and a semicircle (not shown) on the upper locking projection 12b extending along the upper peripheral edge. The ring-shaped retainer is engaged, and the retainer is fastened to the front end surfaces of the left and right side walls of the lens holder portion 27 with screws or the like and fixed.

  In addition, a ventilation window 27b having a relatively large opening area is formed at the center of the bottom wall of the lens holder 27 so that heat does not accumulate at the bottom of the lens holder 27.

  Here, the semiconductor type light source 10 is fixedly disposed on the light source mounting surface 21 of the heat sink member 20 as described above. The semiconductor type light source 10 includes a stopper 30 and a U-shaped leaf spring as a spring member. It is fixed and arranged accurately by the positioning means comprising 31.

  The stopper 30 protrudes from the light source mounting surface 21 and a pair of left and right rear stoppers 30R that the rear end surface of the substrate 10A of the semiconductor-type light source 10 is locked and the rear portions of the left and right side end surfaces of the substrate 10A are locked. Side stopper 30S.

  The rear stopper 30R is erected in a vertical wall shape extending in the left-right direction, and the side stopper 30S is erected in a quadrangular column shape so as to be in surface contact with the rear end surface and the side end surface of the substrate 10A. . The stoppers 30R and 30S are erected so as to be at a slightly lower height than the upper surface of the substrate 10A.

  In the present embodiment, the semiconductor light source 10 is placed on a pedestal 32 made of the same metal material as the heat sink member 20, and is positioned together with the pedestal 32 by a stopper 30 and a leaf spring 31.

  The pedestal 32 is formed in a square shape that matches the projected plane shape of the substrate 10A, and at the center of the bottom surface thereof is integrally provided with a square columnar leg portion 32a whose front end surface is flush with the front end surface of the pedestal 32. Yes.

  On the other hand, the light source mounting surface 21 is formed with a flat rectangular fitting hole 28 having a predetermined depth at which the U-shaped bottom portion of the leaf spring 31 bottoms. The fitting hole 28 fits and arranges the leg portion 32a of the pedestal 32 together with the leaf spring 31, and is set to be larger than the front and rear dimensions of the leg portion 32a, and a remaining portion 28a is formed on the front side of the leg portion 32a. I am doing so.

  The rear stopper 30R and the side stopper 30S are erected along the rear edge and the left and right side edges of the fitting hole 28.

  The pedestal 32 has its leg 32a fitted into the fitting hole 28 from above, and the rear end surface and the side end surface of the pedestal 32 are brought into surface contact with the rear stopper 30R and the side stopper 30S and locked. Sub-assembled in the fitting hole 28.

  The semiconductor-type light source 10 places the substrate 10A on the pedestal 32 thus sub-assembled in the fitting hole 28, and the rear end surface and the left and right end surfaces of the substrate 10A are connected to the rear stopper 30R and the side stopper 30S. With the plate spring 31 inserted into the remaining portion 28a on the front side of the fitting hole 28 in a state of being brought into surface contact with the base plate, the base plate 10A is moved in the front-rear direction by the rear stopper 30R and the plate spring 31 together with the base 32. Positioning in the front-rear direction is performed by being pinched, and positioning in the left-right direction is performed by the left and right side stoppers 30S.

  At this time, the upper end edge of the front spring piece 31a of the U-shaped leaf spring 31 is aligned with the mounting surface 21, and the upper end edge of the rear spring piece 31b is the substrate 10A. The length is set so as to be flush with or slightly above the upper surface. The upper end of the spring piece 31b on the rear side of the leaf spring 31 is bent and formed as a guide piece 31c slightly inclined toward the front side, and the leaf spring 31 is inserted into the remaining portion 28a of the fitting hole 28 first. The substrate 10A of the semiconductor light source 10 is inserted between the stopper 30 and the guide piece 31c from above and can be engaged later.

  As described above, the semiconductor-type light source 10 that is accurately positioned on the light-source mounting surface 21 of the heat sink member 20 by the stopper 30 and the leaf spring 31 is electrically connected to the semiconductor-type light source 10. The power supply member 40 and the fixed frame 50 are firmly fixed to the heat sink member 20.

  The power supply member 40 is made of an appropriate synthetic resin material, and includes a holder 41 that presses the peripheral edge of the semiconductor light source 10, specifically, the peripheral edge of the substrate 10 </ b> A from above, and one side end of the holder 41. And a connector portion 42 that projects integrally outward and to which a power supply side connector (not shown) is connected.

  The holder portion 41 is formed in a flat rectangular shape, and includes a flange portion 41 a that is formed in a stepped shape integrally with the peripheral portion thereof and is superposed on the light source mounting surface 21 of the heat sink member 20. At the center of the holder portion 41, a flat rectangular opening portion 41b is formed in which the dome-shaped cover 10c of the semiconductor light source 10 and the spring piece 31b on the rear side of the leaf spring 31 can be exposed. Further, a pair of leaf spring terminals that can be electrically connected to the light source side terminals 10b provided on the left and right side edge portions of the upper surface of the substrate 10A of the semiconductor-type light source 10 are provided on the left and right side edge portions of the opening portion 41b. 41c.

  A locating pin 41 d that fits into a locating hole 21 a provided in the light source mounting surface 21 is integrally projected on the back surfaces of the left and right side portions of the flange portion 41.

  The connector portion 42 is projected in a straight shape toward the rear of the lamp at the center of the rear end of the flange portion 41. The connector portion 42 is formed in a quadrangular prism shape whose upper surface is flush with the upper surface of the flange portion 41, and thus the connector portion 42 protrudes downward from the lower surface of the flange portion 41.

  On the other hand, the light source mounting surface 21 is formed with a rectangular groove 29 in which a substantially lower half of the connector part 42 is fitted at a position corresponding to the connector part 42.

  In the power supply member 40, the holder portion 41 is crowned on the peripheral portion of the substrate 10A of the semiconductor light source 10, and the locating pin 41d of the flange portion 41a is press-fitted into the locating hole 21a of the light source mounting surface 21, The connector portion 42 is temporarily fixed to the light source mounting surface 21 by press-fitting into the rectangular groove portion 29 of the light source mounting surface 21. At this time, the semiconductor-type light source 10 is electrically connected to the terminal 10b of the substrate 10A by elastic contact of the spring terminal 41c of the holder portion 41, and the light source mounting surface is pressed by the spring terminal 41c. 21 is fixed. The leaf spring 31 is fixed by contacting the upper end edge of the spring piece 31a on the front side thereof with the lower surface of the front portion of the flange portion 41a. On the other hand, the connector part 42 is disposed so as to protrude from the square groove part 29 to the rear side of the lamp of the heat sink member 20.

  The fixed frame 50 is formed in a planar rectangular frame shape that is fitted on the outer peripheral edge of the holder portion 41 of the power supply member 40 with a metal plate having a required rigidity and overlaps on the flange portion 41a.

  Leg pieces 51 are bent downward at substantially right angles on the left and right sides of the front and rear side edges of the fixed frame 50. A locking hook 51a that protrudes obliquely upward is cut and raised at the lower side of each leg piece 51.

  On the other hand, the light source mounting surface 21 of the heat sink member 20 is formed with a slit 21 b penetrating in the vertical direction corresponding to the leg piece 51 of the fixed frame 50.

  Accordingly, the fixed frame 50 has its leg piece 51 inserted into the slit 21b of the light source mounting surface 21 from above, and the locking hook 51a passes through the jaw portion 21c formed in the middle of the slit 21b and enters the jaw portion 21c. By being engaged, the power supply member 40 is mounted on the flange portion 41a. In order to ensure engagement between the locking hook 51a and the jaw portion 21c of the slit 21b, a curved spring portion 52 that protrudes downward is formed at the center of the left and right sides of the fixed frame 50. The spring portion 52 is elastically brought into contact with the surface of the flange portion 41a of the power supply member 40 to bend and deform so that a biasing force in a direction in which the locking hook 51a engages with the jaw portion 21c of the slit 21b is obtained. As a result, the power supply member 40 and the semiconductor-type light source 10 are permanently fixed onto the light source mounting surface 21.

  The semiconductor light source 10 is assembled to the heat sink member 20 as follows.

  First, the semiconductor-type light source 10 is placed on the upper surface of the pedestal 32 sub-assembled in the fitting hole 28 of the light source mounting surface 21 with the light emitting portion 10a facing upward, and the substrate 10A is slid on the pedestal 32. Then, the rear end face and the left and right side end faces of the substrate 10A are set in contact with the rear stopper 30R and the side stopper 30S by surface contact, respectively (see FIG. 3).

  Next, a U-shaped leaf spring 31 is press-fitted into the remaining portion 28a on the front side of the fitting hole 28 from above until the leaf spring 31 bottoms into the fitting hole 28 using its elasticity. As a result, the spring piece 31b on the rear side of the leaf spring 31 is brought into elastic contact with the front end surface of the substrate 10A, and the substrate 10A is sandwiched between the rear stopper 30R and the leaf spring 31 in the front-rear direction, and the light source mounting surface The mounting position in the front-rear direction on 21 is defined, and the mounting position in the left-right direction is defined by the left and right side stoppers 30S (see FIG. 4).

  The assembly order of the semiconductor-type light source 10 and the leaf spring 31 may be reversed. That is, the leaf spring 31 is first press-fitted into the front side portion of the fitting hole 28, and the rear spring piece 31b is elastically contacted with the front end surface of the base 32 to be sub-assembled into the fitting hole 28. The substrate 10A of the light source 10 is pushed forward by the front end of the substrate 10A toward the portion surrounded by the rear stopper 30R, the left and right stopper 30S, and the guide piece 31c of the spring piece 31b on the rear side of the leaf spring 31. Even if it is inserted in this manner, the assembling positions of the substrate 10A in the front-rear direction and the left-right direction are accurately determined in the same manner as described above.

  After positioning the semiconductor light source 10 in this manner, the dome-shaped cover 10c is opened by placing the power supply member 40 with its holder 41 on the peripheral edge of the substrate 10A of the semiconductor light source 10 from above. The connector portion 42 is press-fitted into the rectangular groove portion 29 of the light source mounting surface 21 while the holder portion 41 is covered with the peripheral edge portion of the substrate 10A, and the locating pin 41d on the lower surface of the holder portion 41 is inserted. Is press-fitted into the locating hole 21 a of the light source mounting surface 21. Thereby, the spring terminal 41c of the holder part 41 is elastically contacted with the terminal 10b of the substrate 10A so that the power supply member 40 and the semiconductor light source 10 are electrically connected, and the substrate 10A is pressed against the light source mounting surface 21. In addition, the semiconductor light source 10 and the power supply member 40 are temporarily fixed (see FIG. 5).

  Therefore, as described above, the leg piece 51 of the fixed frame 50 is inserted into the slit 21b of the light source mounting surface 21 from above and is mounted on the flange portion 41a of the power supply member 40 so that the semiconductor light source 10 and the power supply member 40 are connected. By permanently fixing, the assembly of the semiconductor light source 10 to the heat sink member 20 is completed in a state where the semiconductor light source 10 is accurately positioned on the light source mounting surface 21 (see FIG. 6).

  After the semiconductor light source 10 is assembled to the heat sink member 20 as described above, the reflector 11 is fastened and fixed to the reflector mounting surface 22 with screws or the like, or press-fitting positioning means using a locate pin and a locate hole. It is assembled by means of equality.

  According to the headlamp of the present embodiment having the above configuration, the one end face of the semiconductor light source 10 is brought into surface contact with the stopper 30 protruding on the light source mounting surface 21 of the heat sink member 20, thereby The arrangement reference position of the semiconductor light source 10 on the light source mounting surface 21 is determined, and the arrangement position of the semiconductor light source 10 is determined by the opposing clamping pressure between the stopper 30 and the spring member 31. There is no intermediate medium like a conventional power supply attachment member, and the assembly accuracy of the semiconductor light source 10 can be increased.

  In addition, since the accuracy of the mutual contact surface between the stopper 30 and one side end surface of the semiconductor light source 10 can be obtained, the processing accuracy can be easily managed, and the positioning of the semiconductor light source 10 can be performed accurately. In this way, the optical positional relationship is not deviated and the light distribution performance can be improved.

  Here, particularly in the present embodiment, the stopper 30 includes a rear stopper 30R in which the rear end surface of the substrate 10A of the semiconductor light source 10 comes into contact with the surface and the left and right side end surfaces of the substrate 10A are surfaces. A pair of side stoppers 30S that come into contact with and come into contact with each other. The substrate 10A is inserted and placed in a portion surrounded by the stoppers 30R and 30S, and a U-shaped leaf spring 31 is used as a spring member. Is inserted into the fitting hole 28 (the surplus portion 28a) of the light source mounting surface 21, and the substrate 10A is clamped and fixed in the front-rear direction by the rear stopper 30R and the leaf spring 31. Therefore, the position accuracy in the front-rear direction between the shade 23 formed on the heat sink member 20 and the semiconductor-type light source 10 can be increased, and the position accuracy in the left-right direction can be increased by the left and right side stoppers 30S. The optical positional relationship between the semiconductor light source 10 and the reflector 11 can be performed as designed, and the light distribution performance can be further improved.

  The semiconductor light source 10 is fixed onto the light source mounting surface 21 by a power supply member 40 and a fixed frame 50 electrically connected to the semiconductor light source 10, and the power supply member 40 is a semiconductor light source. A connector portion 42 integrally projecting from one side end of a flat plate-shaped holder portion 41 that presses the peripheral edge portion of the plate 10 from above is formed into a quadrangular prism shape, and this is press-fitted into a rectangular groove portion 29 formed on the light source mounting surface 21. Therefore, the connector portion 42 can be stiffened by the rectangular groove portion 29, and deformation or breakage of the connector portion 42 when the power supply side connector 43 is attached / detached can be prevented, thereby improving the quality. Moreover, since the end portion of the connector portion 42 is disposed so as to protrude to the side of the heat sink member 20, for example, the rear side, the work for attaching and detaching the power source side connector 43 can be easily performed from the rear of the lamp. In addition, the power supply side connector 43 can be prevented from falling off due to vibration or the like, and the quality and reliability can be further enhanced.

  Further, as in the above-described embodiment, the assembly of the semiconductor light source 10, the leaf spring 31, the power feeding member 40, and the fixed frame 50 on the light source mounting surface 21 of the heat sink member 20 is sequentially inserted or press-fitted from above. Since the fastening member is unnecessary, the assembly work can be simplified to improve workability, and there is an advantage that the assembly by the robot can be easily automated.

  In the above embodiment, the structure in which the light emitted from the semiconductor-type light source 10 is reflected by the single reflector 11 toward the front of the lamp is illustrated. However, the structure is a structure in which a plurality of reflectors reflect the light from the front of the lamp in multiple stages. It is also possible to apply to lamp configurations other than the projector type.

  Further, the present invention can be applied to a rear combination lamp or a fog lamp in addition to the headlamp.

The disassembled perspective view which shows the lamp unit in one Embodiment of this invention. Sectional drawing of a lamp unit. The perspective view which shows the positioning state of a semiconductor type light source. The perspective view which shows the assembly | attachment state of a spring member. The perspective view which shows the assembly | attachment state of an electric power feeding member. The perspective view which shows the assembly | attachment state of a fixed frame.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lamp unit 10 Semiconductor type light source 11 Reflector 12 Projection lens 20 Heat sink member 21 Light source mounting surface 22 Reflector mounting surface 23 Shade 30 Stopper 30R Rear stopper 30S Side stopper 31 Leaf spring (spring member)
40 Power supply member 41 Holder part 42 Connector part

Claims (2)

A semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, and a heat sink member in which optical system members such as the semiconductor-type light source and the reflector are collectively arranged. ,
On the flat light source mounting surface on which the semiconductor light source of the heat sink member is fixedly disposed, a stopper that protrudes on the light source mounting surface and engages with at least one side end surface of the semiconductor light source, and the stopper A spring member that is disposed oppositely and presses the other end surface of the semiconductor-type light source toward the stopper side;
The vehicular lamp, wherein the semiconductor-type light source is positioned by opposing clamping pressure between the stopper and the spring member. The fixing of the semiconductor type light source on the light source mounting surface is performed by a power supply member that is positioned and fixed on the light source mounting surface and electrically connected to the semiconductor type light source,
The power supply member includes a flat plate-shaped holder portion that presses the peripheral edge of the semiconductor light source from above, and a rectangular column-shaped connector portion that protrudes outwardly integrally to one side end of the holder portion. The connector portion is fitted and fixed in a rectangular groove formed on the light source mounting surface, and an end portion of the connector portion is arranged to protrude to the side of the heat sink member. The vehicular lamp according to 1.

Images