JP2010075981A - Soldering iron cleaning apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering iron cleaning apparatus capable of reducing consumption of an iron tip of a soldering iron and a cleaning member of the soldering iron cleaning apparatus by preventing liquid solder deposited on the iron tip from being solidified, and deposited on the cleaning member of the soldering iron cleaning device, and to facilitate discharge of waste solder. <P>SOLUTION: The soldering iron cleaning apparatus 1 has a cleaner layer 13 for removing waste solder deposited on an ironing tip 23 by rubbing the ironing tip 23 of a soldering iron 22, and also has a heater wire 14 for heating the cleaner layer 13. Further, a motor 4 for turning the cleaner layer 13 is provided, a spiral groove 17 is formed in an inner surface of the cleaner layer 13, and a discharge port 18 is opened in a side surface in contact with a bottom surface of the cleaner layer 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering iron cleaning device for removing solder scraps attached to a soldering iron tip.

  Many devices for removing solder scraps attached to the tip of a soldering iron have been proposed. For example, in Patent Document 1, a cleaning member for removing solder scraps is rotated toward the tip of the soldering iron while rotating around the tip of the soldering iron, and the solder scraps are moved forward of the soldering iron. A soldering iron cleaning device is disclosed which is scattered. Patent Document 2 discloses a soldering iron cleaning device that uses a flat plate blade rotated by a drive source as a cleaning member.

JP 2002-66732 A JP 2006-346702 A

  Since the soldering iron cleaning devices described in Patent Document 1 and Patent Document 2 flip off solder scraps with a rotating cleaning member, the solder scraps can be efficiently removed.

  However, the surface temperature of the cleaning member is usually much lower than the melting point of the solder, and the heat capacity of the entire soldering iron cleaning device including the cleaning member is large. There was a problem of solidifying and sticking to the cleaning member.

  In particular, since the so-called lead-free solder has a high melting point, it easily solidifies with a slight temperature drop and sticks to the cleaning member. In addition, the tip is provided with a solder plating layer to improve the affinity (wetting) to the molten solder, but if the solidified solder scraps stick to the cleaning member, the solder plating layer is damaged by friction. There is a problem of peeling off. Further, when the solder plating layer is exposed due to friction, oxidation of the solder plating layer proceeds and the solder plating layer is lost from the tip. As a result, the wear of the tip becomes intense and the frequency of replacement of the tip member increases. Similarly, there is also a problem that the cleaning member is consumed more frequently and the frequency of replacement of the cleaning member is increased.

  Further, since the soldering iron cleaning devices described in Patent Literature 1 and Patent Literature 2 lack means for receiving the solder scraps bounced by the cleaning member, the solder scraps are contained inside the housing of the soldering iron cleaning device. There was also a problem that it took time to clean up.

  The present invention has been made in view of the above circumstances, and prevents the solder scrap from solidifying and sticking to the cleaning member of the soldering iron cleaning device, and the soldering iron and the cleaning member are less consumed. Providing a cleaning device.

  In order to solve the above problems, a soldering iron cleaning device of the present invention includes a cleaning member that rubs a soldering iron tip and removes solder scraps attached to the ironing tip. And a heating means for heating the cleaning member.

  The heating means may keep the surface temperature of the cleaning member at a temperature higher than the melting point of the solder attached to the tip.

  Moreover, you may make it provide the output adjustment means which adjusts the output of the said heating means and adjusts the surface temperature of the said cleaning member.

  The cleaning member may be made of a flexible heat-resistant resin, and the heating means may be a heating wire embedded in the cleaning member.

  In addition, the cleaning member may have a bottomed cylindrical shape, and may include a rotation driving unit that rotationally drives the cleaning member around a central axis of the cylinder.

  Moreover, you may make it equip the inside surface of the said cleaning member with the spiral groove | channel which circulates around the center axis | shaft of the said cylinder, and the solder waste discharge port opened to the lower side surface of the said cleaning member.

  A plurality of the spiral grooves may be provided.

  A solder waste receiving box for receiving and storing the solder waste discharged from the solder waste discharge port may be provided at a location facing the solder waste discharge port outside the cleaning member.

  According to the present invention, since the heating means for heating the cleaning member is provided, even if the tip is brought into contact with the cleaning member, the solder scrap is not solidified and does not stick to the cleaning member. Therefore, the life of the tip and the cleaning member can be extended. Moreover, since the spiral groove is provided on the inner surface of the cylindrical cleaning member and the solder waste is guided to the solder waste discharge port, the removal of the solder waste is easy.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a side sectional view showing an internal structure of a soldering iron cleaning device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an appearance of the soldering iron cleaning device. In addition, in order to avoid complexity, illustration of electrical wiring etc. is omitted.

  As shown in FIGS. 1 and 2, the soldering iron cleaning device 1 includes a motor 4, a gear unit 5, a drum unit 6, a power supply unit 7, and a fan 8 inside a housing 3 in which the soldering iron insertion portion 2 is opened. Is provided.

  The motor 4 and the gear unit 5 are fixed to the housing 3 via a bracket 9 and rotate the drum unit 6 around the rotation shaft 10. A part of the power of the motor 4 is transmitted to the fan 8 through the gear unit 5 and the flexible joint 11.

  The drum unit 6 has a cup-shaped drum 12 that is tapered so that the diameter of the bottom is smaller than the diameter of the upper part. Inside the drum 12, a resin (for example, silicon) having flexibility and heat resistance is provided. A cleaner layer 13 made of a resin is provided, and a heater wire 14 is embedded in the cleaner layer 13.

  The power supply unit 7 includes a rectifier and a transformer (not shown), transforms and rectifies electric power supplied from a commercial power supply (not shown), and supplies it to the motor 4 and the drum unit 6.

  The end of the heater wire 14 is connected to a slip ring 15 exposed on the lower surface of the drum 12. The slip ring 15 is a conductor that forms a ring centered on the rotation shaft 10, and is in contact with a contact 16 fixed to the bracket 9. Further, the contact 16 is connected to the power supply unit 7 through an electric wiring (not shown). Therefore, no matter how the drum unit 6 rotates about the rotary shaft 10, the slip ring 15 can keep contact with the contact 16 and supply power from the power supply unit 7 to the heater wire 14. In this way, power is supplied from the power supply unit 7 to the heater wire 14, the heater wire 14 generates heat, and the cleaner layer 13 is heated.

  A spiral groove 17 is formed on the inner surface of the cleaner layer 13, and a discharge port 18 is opened on the lower side surface of the drum unit 6. In addition, a waste receptacle 19 is provided below the drum unit 6 at a location facing the discharge port 18.

  A power switch 20 and a temperature adjustment knob 21 are provided on the front surface of the housing 3. By operating the power switch 20, the power supply to the power supply unit 7 can be turned on / off. If the temperature adjustment knob 21 is operated, the temperature of the cleaner layer 13 can be adjusted by adjusting the power supplied to the heater wire 14.

  The temperature of the cleaner layer 13 is used by the soldering iron 22 (that is, attached to the tip 23) by adjusting the electric power supplied to the heater wire 14 by operating the temperature adjusting knob 21. If it is made slightly higher, even if the tip 23 is brought into contact with the cleaner layer 13, the solder scraps adhering to the tip 23 may solidify and stick to the surface of the cleaner layer 13. Absent.

  Next, the operation of the soldering iron cleaning device 1 will be described.

  First, before cleaning the tip 23, the heater wire 14 is energized to heat the cleaner layer 13, and the surface temperature of the cleaner layer 13 is used by the soldering iron 22 (= attached to the tip 23). Keep it slightly higher than the melting point of the solder scrap). Then, the motor 4 is energized, and the tip 23 is inserted from the soldering iron insertion portion 2 while rotating the drum unit 6 around the rotation shaft 10, and the tip 23 is brought into contact with the surface of the cleaner layer 13. .

  The drum unit 6 may be started and stopped manually (switch operation), or a sensor may be attached to the soldering iron insertion portion 2 or the cleaner layer 13 so that the tip 23 is a soldering iron insertion portion. The drum unit 6 may automatically rotate when passing through 2 or contacting the cleaner layer 13.

  Since the tip 23 is in contact with the cleaner layer 13 of the rotating drum unit 6, the solder scraps attached to the tip are wiped off by the cleaner layer 13 and transferred to the surface of the cleaner layer 13. Further, since the surface temperature of the cleaner layer 13 is kept higher than the melting point of the solder, the solder scraps transferred to the surface of the cleaner layer 13 are kept in a liquid state.

  Further, the liquid solder scrap transferred to the surface of the cleaner layer 13 flows down to the bottom of the spiral groove 17 by centrifugal force, and further flows to the bottom of the drum unit 6 by flowing through the groove 17 by centrifugal force and gravity. It passes through the outlet 18 and falls into the waste receptacle 19. That is, the solder scraps wiped off by the cleaner layer 13 are guided to the groove 17, guided to the discharge port 18, and discharged from the discharge port 18 to the waste receptacle 19.

  In this way, the solder scrap removed from the tip 23 is collected in the waste receptacle 19 while being in a liquid state, and solidifies in the waste receptacle 19. In addition, when the solder waste accumulates in the waste receptacle 19, the waste receptacle 19 is pulled out from the housing 3 and the solder waste is discharged.

  In this embodiment, the concave portion is formed on the inner surface of the cleaner layer 13 to form the groove 17. However, a spiral convex portion is formed on the inner surface of the cleaner layer 13, and the groove 17 is formed between the convex portion. May be.

  Further, in the present embodiment, one groove 17 is spirally arranged on the inner surface of the cleaner layer 13. However, as shown in FIG. 3, the plurality of grooves 24 draw a gentle spiral on the inner surface of the cleaner layer 13. You may arrange as follows.

It is a sectional side view which shows the internal structure of the soldering iron cleaning apparatus which concerns on embodiment of this invention. It is a perspective view which shows the external appearance of the said soldering iron cleaning apparatus. It is a perspective view which shows the modification of the cleaner layer of the said soldering iron cleaning apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Soldering iron cleaning device 2 Soldering iron insertion part 3 Case 4 Motor 5 Gear unit 6 Drum unit 7 Power supply unit 8 Fan 9 Bracket 10 Rotating shaft 11 Flexible joint 12 Drum 13 Cleaner layer 14 Heater wire 15 Slip ring 16 Contact 17 Groove 18 Discharge port 19 Scrap receptacle 20 Power switch 21 Temperature control knob 22 Soldering iron 23 Tip 24 Groove

Claims (8)

In a soldering iron cleaning device comprising a cleaning member that rubs the tip of a soldering iron and removes solder scraps attached to the tip,
A soldering iron cleaning device comprising heating means for heating the cleaning member. The soldering iron cleaning apparatus according to claim 1, wherein the heating means keeps the surface temperature of the cleaning member higher than the melting point of the solder attached to the tip. The soldering iron cleaning apparatus according to claim 1, further comprising an output adjusting unit that adjusts an output of the heating unit to adjust a surface temperature of the cleaning member. The cleaning member is made of a flexible heat resistant resin,
The soldering iron cleaning apparatus according to claim 1, wherein the heating means is a heating wire embedded in the cleaning member. The cleaning member has a bottomed cylindrical shape,
The soldering iron cleaning apparatus according to claim 1, further comprising: a rotational driving unit that rotationally drives the cleaning member around a central axis of the bottomed cylinder. A spiral groove around the central axis of the bottomed cylinder on the inner surface of the cleaning member;
The soldering iron cleaning apparatus according to claim 5, further comprising a solder scrap discharge port that opens on a lower side surface of the cleaning member. The soldering iron cleaning apparatus according to claim 6, comprising a plurality of the spiral grooves. The solder scrap receiving box for receiving and storing the solder scrap discharged from the solder scrap discharge port is provided at a location facing the solder scrap discharge port outside the cleaning member. The soldering iron cleaning apparatus according to 7.

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