JP2010075021A - Contactless power supply system - Google Patents

Contactless power supply system Download PDF

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JP2010075021A
JP2010075021A JP2008242932A JP2008242932A JP2010075021A JP 2010075021 A JP2010075021 A JP 2010075021A JP 2008242932 A JP2008242932 A JP 2008242932A JP 2008242932 A JP2008242932 A JP 2008242932A JP 2010075021 A JP2010075021 A JP 2010075021A
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Japan
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mother board
coil
resonance circuit
board
capacitors
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JP2008242932A
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JP5179305B2 (en
Inventor
Yasushi Nihata
康 二畠
Hiroshi Maeda
裕史 前田
Koichi Teraura
浩一 寺裏
Yoji Endo
洋治 遠藤
Yukihiro Matsunobu
幸博 松信
Masato Toki
政人 土岐
Shinji Hara
信次 原
Hironobu Hori
堀  宏展
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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Priority to JP2008242932A priority Critical patent/JP5179305B2/en
Priority to KR1020117006742A priority patent/KR101258003B1/en
Priority to PCT/IB2009/006874 priority patent/WO2010032116A1/en
Priority to CN200980137080.2A priority patent/CN102159423B/en
Priority to TW98131774A priority patent/TWI397236B/en
Publication of JP2010075021A publication Critical patent/JP2010075021A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To simplify the adjustment work of a resonance circuit in a non-contact power feed apparatus, equipped with a pickup section which is inductively coupled to a power feeding line, having high-frequency current flowing therethrough, and feeds power to a load by an induction electromotive force induced in the pickup section. <P>SOLUTION: The resonance circuit 60 includes: a rectangular mother board 61, housed inside parallel to the inner bottom of a second case 51, in the vicinity of the inner bottom; a plurality of child boards 62, each having two capacitors C mounted thereon; and a plurality of connectors 63 each provided on the mother board 61 and each of the child boards 62. The child boards 62, each having the capacitors C mounted thereon, is attached or removed on the mother board 61 by the connectors 63, thereby readily adjusting the capacitance value of the capacitors C. As a result, the adjustment work of resonance circuit 60 is simplified. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、高周波電流が流れる給電線と誘導結合されるピックアップ部を備え、ピックアップ部に誘起される誘導起電力によって負荷に給電する非接触給電装置に関するものである。   The present invention relates to a non-contact power supply apparatus that includes a pickup unit that is inductively coupled to a power supply line through which a high-frequency current flows, and that supplies power to a load by an induced electromotive force induced in the pickup unit.

この種の非接触給電装置として、例えば、移動体の移動線路に沿って高周波電流を流す給電線を張設し、前記給電線と誘導結合されたピックアップ部を前記移動体に配置し、前記ピックアップ部に誘起される誘導起電力によって負荷(移動体を移動させる電動機)に給電するものが提供されている(特許文献1,2参照)。   As this type of non-contact power supply device, for example, a power supply line that allows a high-frequency current to flow along a moving line of a moving body is stretched, and a pickup unit that is inductively coupled to the power supply line is disposed on the moving body. There is provided one that supplies power to a load (an electric motor that moves a moving body) by an induced electromotive force induced in the section (see Patent Documents 1 and 2).

ピックアップ部は、給電線を周方向に沿って囲む筒状のコアと、コアに巻線を巻回してなるコイルと、コイルとともに共振回路を構成するコンデンサとを有し、コイルに誘起される誘導起電力を共振回路による共振作用で増大させるようになっている。
特開2002−272021号公報 特開2005−261194号公報
The pickup unit has a cylindrical core that encloses the power supply line along the circumferential direction, a coil formed by winding a winding around the core, and a capacitor that forms a resonance circuit together with the coil, and is induced in the coil. The electromotive force is increased by the resonance action of the resonance circuit.
JP 2002-272021 A JP 2005-261194 A

ところで、高周波電流の周波数と共振回路の共振周波数を一致させたときに最も効率よく電力を伝達することができるが、ピックアップ部のコイルのインダクタンスにはばらつきが生じやすく、共振回路の共振周波数が高周波電流の周波数にほぼ一致するようにコンデンサの容量値を調整する必要がある。従来は、一つのプリント配線板に多数のコンデンサを予め実装しておき、施工現場においてプリント配線板から不要なコンデンサを除去したり、容量値の異なる別のコンデンサをプリント配線板に実装することでコンデンサの容量値(プリント配線板に実装されている全ての有効なコンデンサの合成容量値)を調整していた。   By the way, power can be transmitted most efficiently when the frequency of the high-frequency current and the resonance frequency of the resonance circuit are matched, but the inductance of the coil of the pickup unit is likely to vary, and the resonance frequency of the resonance circuit is high. It is necessary to adjust the capacitance value of the capacitor so as to substantially match the frequency of the current. Conventionally, a large number of capacitors are mounted in advance on one printed wiring board, and unnecessary capacitors are removed from the printed wiring board at the construction site, or another capacitor having a different capacitance value is mounted on the printed wiring board. The capacitance value of the capacitor (the combined capacitance value of all effective capacitors mounted on the printed wiring board) was adjusted.

しかしながら、上記従来例のように施工現場でプリント配線板からコンデンサを取り外したりプリント配線板にコンデンサを実装することでコンデンサの容量値を調整した場合、調整作業に多大な手間がかかってしまうという問題があった。   However, when the capacitance value of the capacitor is adjusted by removing the capacitor from the printed wiring board at the construction site or mounting the capacitor on the printed wiring board as in the above-mentioned conventional example, the adjustment work takes a lot of trouble. was there.

本発明は上記事情に鑑みて為されたものであり、その目的は、共振回路の調整作業を簡素化できる非接触給電装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a non-contact power feeding device that can simplify the adjustment work of a resonance circuit.

請求項1の発明は、上記目的を達成するために、高周波電流が流れる給電線と誘導結合されるピックアップ部を備え、ピックアップ部に誘起される誘導起電力によって負荷に給電する非接触給電装置において、ピックアップ部は、給電線を周方向に沿って囲む筒状のコアと、コアに巻線を巻回してなるコイルと、コイルを含む共振回路とを有し、共振回路は、コイルと電気的に接続される導体パターンが形成された母基板と、それぞれに1乃至複数のコンデンサが実装される複数の子基板と、母基板に対して各子基板を着脱自在に接続する複数のコネクタとを有することを特徴とする。   In order to achieve the above object, a first aspect of the present invention provides a non-contact power feeding device that includes a pickup unit that is inductively coupled to a feeder line through which a high-frequency current flows, and that feeds a load by induced electromotive force induced in the pickup unit The pickup unit includes a cylindrical core surrounding the power supply line along the circumferential direction, a coil formed by winding a winding around the core, and a resonance circuit including the coil. The resonance circuit is electrically connected to the coil. A mother board formed with a conductor pattern connected to each other, a plurality of daughter boards each having one or more capacitors mounted thereon, and a plurality of connectors for detachably connecting each child board to the mother board. It is characterized by having.

請求項1の発明によれば、コンデンサが実装されている子基板をコネクタによって母基板に着脱することにより、コイルとともに共振回路を構成するコンデンサの容量値を調整することができ、その結果、従来例と比較して共振回路の調整作業を簡素化できる。   According to the first aspect of the present invention, the capacitance value of the capacitor constituting the resonance circuit together with the coil can be adjusted by attaching and detaching the sub board on which the capacitor is mounted to the mother board by the connector. Compared with the example, the adjustment work of the resonance circuit can be simplified.

請求項2の発明は、請求項1の発明において、コネクタは、母基板並びに子基板の法線方向が互いに直交する向きに母基板と子基板を接続してなることを特徴とする。   According to a second aspect of the invention, in the first aspect of the invention, the connector is characterized in that the mother board and the sub board are connected in a direction in which normal directions of the mother board and the sub board are orthogonal to each other.

請求項2の発明によれば、母基板の小型化が図れる。   According to invention of Claim 2, size reduction of a motherboard can be achieved.

本発明によれば、共振回路の調整作業を簡素化できる。   According to the present invention, the adjustment work of the resonance circuit can be simplified.

以下、図面を参照して本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本実施形態の非接触給電装置は、図3(a)に示すようにループ状に設置された給電線100と、給電線100に高周波電流を流す高周波電源110と、給電線100と誘導結合されるピックアップ部1とを備え、ピックアップ部1から負荷(例えば、インバータ並びにモータ)111に給電するものである。   The contactless power supply device according to the present embodiment is inductively coupled to a power supply line 100 installed in a loop shape as shown in FIG. 3A, a high-frequency power source 110 that supplies a high-frequency current to the power supply line 100, and the power supply line 100. The pickup unit 1 supplies power to the load (for example, an inverter and a motor) 111 from the pickup unit 1.

給電線100は、図3(b)に示すように円筒形状の内管部101と、内管部101の外側に配置された円筒形状の外管部102と、内管部101と外管部102を互いに同心となるように連結する連結部103とが金属板を曲げ加工することで一体に形成された導体を、角筒状の合成樹脂成形品からなる絶縁体104で被覆して構成されている。すなわち、高周波電流が流れる給電線においては、導体の材料(金属板)が有する電気抵抗以外に表皮効果と近接効果による抵抗(高周波抵抗)が存在するが、図3(b)に示す二重管構造の導体を給電線100に用いれば、円柱形状の導体に比較して高周波抵抗を低減し且つ損失を減少させることができる。   As shown in FIG. 3B, the power supply line 100 includes a cylindrical inner tube portion 101, a cylindrical outer tube portion 102 disposed outside the inner tube portion 101, an inner tube portion 101, and an outer tube portion. The connecting part 103 that connects the two parts 102 so as to be concentric with each other is formed by coating a conductor integrally formed by bending a metal plate with an insulator 104 made of a synthetic resin molded product having a rectangular tube shape. ing. That is, in the feeder line through which high-frequency current flows, there is resistance (high-frequency resistance) due to the skin effect and proximity effect in addition to the electrical resistance of the conductor material (metal plate), but the double tube shown in FIG. If a conductor having a structure is used for the feeder line 100, high-frequency resistance can be reduced and loss can be reduced as compared with a cylindrical conductor.

ピックアップ部1は、コア2、コイル3、ボビン4、ケース5、受電回路部6を有している。受電回路部6は、コイル3とともに共振回路60を形成するコンデンサ(後述する)、コイル3並びにコンデンサの共振回路60から出力される共振電圧を定電圧化する定電圧回路などを有している。   The pickup unit 1 includes a core 2, a coil 3, a bobbin 4, a case 5, and a power receiving circuit unit 6. The power receiving circuit unit 6 includes a capacitor (to be described later) that forms a resonance circuit 60 together with the coil 3, a constant voltage circuit that makes the resonance voltage output from the resonance circuit 60 of the coil 3 and the capacitor constant, and the like.

コア2は、図1に示すように内周面及び外周面の双方が曲面(円筒面)で構成され且つ軸方向(紙面に垂直な方向)に交差する断面形状が略C形に形成されている。ここで、開口溝2aを挟んで対向するコア2の両端部20,20は、コア2の当該両端部20を除く部位(以下、「胴部」と呼ぶ。)21よりも、軸方向に沿った断面の面積が大きく形成されている。   As shown in FIG. 1, the core 2 has both an inner peripheral surface and an outer peripheral surface formed of curved surfaces (cylindrical surfaces), and has a substantially C-shaped cross section that intersects the axial direction (direction perpendicular to the paper surface). Yes. Here, both end portions 20 and 20 of the core 2 facing each other across the opening groove 2a are more along the axial direction than portions (hereinafter referred to as “body portions”) 21 excluding the both end portions 20 of the core 2. The area of the cross section is large.

ボビン4は、円弧状に湾曲した角筒形状の合成樹脂成形品からなり、軸方向の両端部に外鍔40が設けられている。尚、コア2は開口溝2aと反対側の箇所で胴部21が二分割されており、それぞれの胴部21,21にボビン4,4が外挿された後に胴部21,21の端部同士が接合されることによって、図1に示すコア2が構成されている。   The bobbin 4 is formed of a rectangular tube-shaped synthetic resin molded product that is curved in an arc shape, and outer casings 40 are provided at both ends in the axial direction. The core 2 has a body 21 divided into two parts on the opposite side of the opening groove 2a. After the bobbins 4 and 4 are extrapolated to the body 21 and 21, the ends of the body 21 and 21 are inserted. The core 2 shown in FIG. 1 is comprised by joining each other.

コイル3は、絶縁被覆を有する巻線がボビン4,4に単層巻きされることで形成されている。尚、コア2の端部20と胴部21との段差が巻線の直径よりも大きく設定されており、コイル3がコア2の端部20よりも外側にはみ出さないようになっている。このようにコイル3がコア2の端部20よりも外側にはみ出さないことにより、コイル3の端部からコア2の端部20の外へ漏れる磁束を減らすことができる。   The coil 3 is formed by winding a winding having an insulating coating around the bobbins 4 and 4 in a single layer. The step between the end 20 of the core 2 and the body 21 is set larger than the diameter of the winding so that the coil 3 does not protrude beyond the end 20 of the core 2. Thus, since the coil 3 does not protrude outside the end portion 20 of the core 2, magnetic flux leaking from the end portion of the coil 3 to the outside of the end portion 20 of the core 2 can be reduced.

ケース5は、絶縁性を有する合成樹脂成形品からなり、コア2及びコイル3を収納する第1ケース50と、コイル3を除いた共振回路60を収納する第2ケース51とを具備している。第1ケース50は、コア2の形状に合わせて断面形状が略C字形に形成されている。第2ケース51は、一面が開口した矩形箱形に形成されている。   The case 5 is made of a synthetic resin molded product having insulating properties, and includes a first case 50 that houses the core 2 and the coil 3, and a second case 51 that houses the resonance circuit 60 excluding the coil 3. . The first case 50 has a substantially C-shaped cross section in accordance with the shape of the core 2. The second case 51 is formed in a rectangular box shape with one surface open.

共振回路60は、第2ケース51の内底面近傍に当該内底面と平行して収納された矩形の母基板61と、それぞれに1乃至複数(図示例では2個)のコンデンサCが実装された複数の子基板62と、母基板61並びに各子基板62にそれぞれ設けられた複数のコネクタ63とで構成されている。母基板61の表面に導体パターン(図示せず)が形成されており、第1ケース51から第2ケース52へ引き込まれたコイル3の端末(図示せず)と当該導体パターンとが電気的に接続されている。子基板62は母基板61の数分の1程度の大きさであって、コネクタ63を構成する一対の端子ピン63b,63bが一の端面より突出している(図2(a)参照)。また、子基板62の表面に2個のコンデンサCが実装されており、子基板62の裏面には各コンデンサCの端子と端子ピン63b,63bとを電気的に接続する導体パターン(図示せず)が形成されている。   In the resonance circuit 60, a rectangular mother board 61 housed in parallel with the inner bottom surface in the vicinity of the inner bottom surface of the second case 51, and one or more (two in the illustrated example) capacitors C are mounted. It comprises a plurality of sub-boards 62, a mother board 61 and a plurality of connectors 63 provided on each sub-board 62. A conductor pattern (not shown) is formed on the surface of the mother board 61, and the terminal (not shown) of the coil 3 drawn into the second case 52 from the first case 51 and the conductor pattern are electrically connected. It is connected. The sub board 62 is about a fraction of the size of the mother board 61, and a pair of terminal pins 63b and 63b constituting the connector 63 protrude from one end face (see FIG. 2A). Two capacitors C are mounted on the front surface of the sub board 62, and a conductor pattern (not shown) for electrically connecting the terminals of the capacitors C and the terminal pins 63b and 63b is mounted on the back surface of the sub board 62. ) Is formed.

一方、端子ピン63b,63bが挿抜自在に差込接続される複数のジャック63aが母基板61の表面に実装され、導体パターンによってコイル3と電気的に接続されている。つまり、ジャック63aと端子ピン63b、63bによってコネクタ63が構成されており、コネクタ63を介してコイル3とコンデンサCが電気的に接続されることで共振回路60が形成されている。但し、このようなコネクタ63については従来周知であるから、詳細な構造についての図示並びに説明は省略する。   On the other hand, a plurality of jacks 63a into which the terminal pins 63b and 63b are inserted and connected so as to be freely inserted and removed are mounted on the surface of the mother board 61 and are electrically connected to the coil 3 by a conductor pattern. That is, the connector 63 is constituted by the jack 63 a and the terminal pins 63 b and 63 b, and the resonance circuit 60 is formed by electrically connecting the coil 3 and the capacitor C through the connector 63. However, since such a connector 63 is conventionally well-known, illustration and description about a detailed structure are abbreviate | omitted.

而して、開口溝2aを通してコア2の内側に配置される給電線100に高周波電流が流れると、給電線100を中心とする同心円上に高周波磁界(磁束)が発生し、磁束の大半がコア2内を周方向に沿って通過する。そして、当該磁束が高周波電流に応じて変化することによってコイル3に誘導起電力が生じる。コイル3に生じた誘導起電力は、コイル3とコンデンサCからなる共振回路60の共振作用で増大され、共振回路60から出力される共振電圧が定電圧回路において定電圧化されて負荷111に供給される。   Thus, when a high-frequency current flows through the opening groove 2a to the feeder line 100 disposed inside the core 2, a high-frequency magnetic field (magnetic flux) is generated on a concentric circle centering on the feeder line 100, and most of the magnetic flux is the core. 2 passes along the circumferential direction. And the said magnetic flux changes according to a high frequency current, and an induced electromotive force arises in the coil 3. FIG. The induced electromotive force generated in the coil 3 is increased by the resonance action of the resonance circuit 60 including the coil 3 and the capacitor C, and the resonance voltage output from the resonance circuit 60 is made constant in the constant voltage circuit and supplied to the load 111. Is done.

ここで、図2(c)に示すように母基板61に複数個のコンデンサCが直接実装されている場合、共振回路60におけるコンデンサCの容量値を調整する作業においては、第2ケース51から母基板61を取り出し、母基板61に実装されているコンデンサCの端子から半田を除去して取り外す作業や、別のコンデンサCの端子を半田付けする作業などが必要となり、しかも、一度の作業で調整できなければ当該作業を何度も繰り返すことになるから、調整作業に多大な手間がかかってしまう。   Here, when a plurality of capacitors C are directly mounted on the mother board 61 as shown in FIG. 2C, in the operation of adjusting the capacitance value of the capacitors C in the resonance circuit 60, the second case 51 is used. An operation of taking out the mother board 61, removing the solder from the terminals of the capacitor C mounted on the mother board 61 and removing it, and soldering another terminal of the capacitor C are required. If the adjustment cannot be made, the operation is repeated many times, so that the adjustment operation takes much time.

これに対して本実施形態では、図2(a),(b)に示すようにコンデンサCが実装されている子基板62をコネクタ63によって母基板61に着脱することによってコンデンサCの容量値を簡単に調整することができる。その結果、図2(c)の従来構成と比較して、共振回路60の調整作業を簡素化できるものである。   On the other hand, in this embodiment, as shown in FIGS. 2A and 2B, the capacitance value of the capacitor C is set by attaching / detaching the sub board 62 on which the capacitor C is mounted to the mother board 61 by the connector 63. Can be easily adjusted. As a result, the adjustment work of the resonance circuit 60 can be simplified as compared with the conventional configuration of FIG.

ここで、本実施形態におけるコネクタ63(ジャック63aと端子ピン63b,63b)は、母基板61並びに子基板62の法線方向が互いに直交する向きに母基板61と子基板62を接続するものであるから、母基板61の小型化が図れるという利点がある。   Here, the connector 63 (the jack 63a and the terminal pins 63b and 63b) in the present embodiment connects the mother board 61 and the child board 62 so that the normal directions of the mother board 61 and the child board 62 are orthogonal to each other. Therefore, there is an advantage that the mother board 61 can be downsized.

本発明の実施形態1におけるピックアップ部の要部断面図である。It is principal part sectional drawing of the pick-up part in Embodiment 1 of this invention. (a),(b)は同上におけるピックアップ部の要部斜視図、(c)は従来技術を適用したピックアップ部の要部斜視図である。(A), (b) is a principal part perspective view of the pick-up part in the same as the above, (c) is a principal part perspective view of the pick-up part to which a prior art is applied. (a)は同上の全体構成図、(b)は同上における給電線の断面図である。(A) is a whole block diagram same as the above, (b) is sectional drawing of the feeder in the same as the above.

符号の説明Explanation of symbols

1 ピックアップ部
2 コア
3 コイル
60 共振回路
61 母基板
62 子基板
C コンデンサ
DESCRIPTION OF SYMBOLS 1 Pickup part 2 Core 3 Coil 60 Resonant circuit 61 Mother board 62 Child board C Capacitor

Claims (2)

高周波電流が流れる給電線と誘導結合されるピックアップ部を備え、ピックアップ部に誘起される誘導起電力によって負荷に給電する非接触給電装置において、
ピックアップ部は、給電線を周方向に沿って囲む筒状のコアと、コアに巻線を巻回してなるコイルと、コイルを含む共振回路とを有し、
共振回路は、コイルと電気的に接続される導体パターンが形成された母基板と、それぞれに1乃至複数のコンデンサが実装される複数の子基板と、母基板に対して各子基板を着脱自在に接続する複数のコネクタとを有することを特徴とする非接触給電装置。
In a non-contact power feeding device that includes a pickup unit that is inductively coupled to a power feed line through which a high-frequency current flows, and that feeds a load by an induced electromotive force induced in the pickup unit,
The pickup unit has a cylindrical core surrounding the power supply line along the circumferential direction, a coil formed by winding a winding around the core, and a resonance circuit including the coil,
The resonant circuit includes a mother board on which a conductor pattern electrically connected to the coil is formed, a plurality of daughter boards each having one or more capacitors mounted thereon, and each child board is detachable from the mother board. And a plurality of connectors connected to the contactless power feeding device.
コネクタは、母基板並びに子基板の法線方向が互いに直交する向きに母基板と子基板を接続してなることを特徴とする請求項1記載の非接触給電装置。   2. The non-contact power feeding apparatus according to claim 1, wherein the connector is formed by connecting the mother board and the child board in directions in which normal directions of the mother board and the child board are orthogonal to each other.
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JP2008242932A JP5179305B2 (en) 2008-09-22 2008-09-22 Non-contact power feeding device
KR1020117006742A KR101258003B1 (en) 2008-09-22 2009-09-18 Contactless power supply system
PCT/IB2009/006874 WO2010032116A1 (en) 2008-09-22 2009-09-18 Contactless power supply system
CN200980137080.2A CN102159423B (en) 2008-09-22 2009-09-18 Contactless power supply system
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10797523B2 (en) 2016-02-17 2020-10-06 Fuji Corporation Non-contact power supply device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359902A (en) * 1991-03-26 2002-12-13 Auckland Uniservices Ltd Induction power distribution system
JP2006141115A (en) * 2004-11-11 2006-06-01 Asyst Shinko Inc Power supplying apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359902A (en) * 1991-03-26 2002-12-13 Auckland Uniservices Ltd Induction power distribution system
JP2006141115A (en) * 2004-11-11 2006-06-01 Asyst Shinko Inc Power supplying apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10797523B2 (en) 2016-02-17 2020-10-06 Fuji Corporation Non-contact power supply device

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