JP2010074183A - Mechanism for placing inspection object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mechanism for placing an inspection object always horizontally holding a chuck top 11 even when a biased load acts in the vicinity of the outer periphery of the chuck top 11 in inspection, and thereby improving reliability of the inspection. <P>SOLUTION: The mechanism 10 for placing an inspection object includes: the chuck top 11 for placing a wafer thereon; a support base 12 supporting the chuck top 11 rotatably forward and backward; a θ-rotation drive mechanism 13 rotating the chuck top 11 forward and backward on the support base 12; and a lifting/guiding mechanism 16 lifting/guiding the chuck top 11 with respect to the support base 12. The support base 12 includes: a vacuum suction part 14 having an evacuation passage 14B for sucking and fixing the chuck top 11 on the support base 12 by vacuum force; and a lifting mechanism having a gas supply part 15 for lifting the chuck top 11 from the support base 12 by compressed air, or landing the chuck top 11 on the support base 12 by releasing the compressed air. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting mechanism for an object to be inspected, such as a wafer. The present invention relates to a mounting mechanism for an inspection object.

  As shown in FIGS. 7 and 8, a conventional probe apparatus of this type generally has a loader chamber 1 for transferring a wafer W and pre-aligning the wafer W, and receiving the wafer W from the loader chamber 1 for its electrical And a prober chamber 2 for performing a physical characteristic inspection. As shown in FIG. 8, the loader chamber 1 is provided with tweezers 3 and a sub chuck 4 which are transfer mechanisms. While the wafer W is transferred by the tweezers 3, the sub chuck 4 uses the orientation flat or the notch as a reference. Pre-align. The prober chamber 2 is provided with a main chuck 5 and an alignment mechanism 6 having an upper and lower camera. The main chuck 5 on which the wafer W is placed moves in the X, Y, Z and θ directions, and the wafer is moved by the alignment mechanism 6. Alignment between W and the probe needle 7A of the probe card 7 is performed. Then, the wafer W on the aligned main chuck 5 and the probe needle 7A are brought into electrical contact, and the wafer W is inspected via the test head T. The main chuck 5 has a built-in temperature adjustment mechanism, and the temperature adjustment mechanism is used to set the temperature of the wafer W in a wide range of, for example, −50 ° C. to + 160 ° C. Can perform low temperature inspection and high temperature inspection.

  Therefore, when the electrical characteristics inspection of the wafer W is performed, the wafer W is placed on the main chuck 5 set to the inspection temperature by the temperature adjustment mechanism, and the wafer W and the probe needle 7A are aligned using the alignment mechanism 6. Thereafter, the main chuck 5 is moved in the X, Y, and Z directions so that the electrode pads of the wafer W and the probe needles 7A are in electrical contact, and the electrical characteristics of the wafer W are inspected via the test head T. The probe card 7 is detachably attached to a head plate 8 that forms the top surface of the prober chamber 2.

  By the way, the main chuck 5 is, for example, as shown in FIG. 9, a ring shape having a chuck top 5A, a support base 5B for supporting the chuck top 5A, and a cross roller provided between the chuck top 5A and the support base 5B. 10A and 11B, the chuck top 5A is rotated forward and backward in the θ direction on the support 5B via the bearing 5C by the θ rotation drive mechanism shown in FIGS. 10 and 11 are connected to the chuck top 5A of the main chuck 5, and can rotate forward and backward in the θ direction during inspection.

10 includes a motor 8A, a ball screw 8B coupled to the motor 8A, a nut 8C screwed to the ball screw 8B, and a belt 8D coupled between the nut 8C and the chuck top 5A in a slid state. has the door, chuck top 5A through a belt 8D by the movement of the nut 8C is forward and reverse rotation by the arrow theta ₁ direction.

Further, the θ rotation drive mechanism 9 of FIG. 11 includes a motor 9A, a ball screw 9B connected to the motor 9A, a nut 9C screwed to the ball screw 9B and connected to the chuck top 5A, and the ball screw 9B as indicated by an arrow θ _2. and a support member 9D is pivotally supported in the direction, the ball screw 8B together with the chuck top 5A is forward and reverse rotation by the arrow theta ₁ direction by the movement of the nut 9C is swung in the arrow theta ₂ direction.

  However, coupled with the fact that the chip of the wafer becomes ultrafine and the pitch between the electrode pads becomes narrower, the number of probe needles 7A increases abruptly due to an increase in the same number of measurements of the chip. In particular, when inspecting a chip in the vicinity of the outer periphery of the wafer W, for example, as shown by an arrow in FIG. 9, a large needle pressure of several kg acts on the chuck top 5A as an uneven load. In addition, the outer diameter of the ring-shaped bearing 5C is generally smaller than the outer diameter of each of the chuck top 5A and the support base 5B, and a gap is interposed outside the ring-shaped bearing 5C. The eccentric load applied to the top 5A causes a slight plastic deformation of the bearing 5C. As a result, the chuck top 5A tilts as shown exaggeratedly by the alternate long and short dash line. There was a problem that reliability was lowered. Further, when the wafer size is increased, the distance from the center of the main chuck 5 to the action point becomes longer than before, so that the inclination of the main chuck 5 becomes more prominent and the needles between the plurality of probe needles 7A. There is a risk that the variation in the pressure becomes remarkable, and in some cases, the probe needle 7A that does not come into contact with the wafer W is generated, and thus the reliability of the inspection is significantly lowered.

Further, it has been found that the conventional θ rotation drive mechanism shown in FIGS. 10 and 11 has a problem. That is, since theta rotation driving mechanism 8 shown in FIG. 10, which is connected to the chuck top 5A through belt 8D, weak theta ₁ direction rigidity of the chuck top 5A is a main chuck 5A is overdriven, the wafer and the probe If an uneven load is applied to the chuck top 5A during contact with the needle, the chuck top 5A rotates slightly in the θ direction to cause a positional deviation, which reduces the reliability of inspection. Further, since the θ rotation drive mechanism 9 shown in FIG. 11 has a structure in which the ball screw 9B swings in the θ ₂ direction around the support 9D, the rigidity in the θ ₂ direction is also weak and the ball screw 9B swings. There is a problem that extra space is required. In particular, such problems should be solved as soon as the ultra-miniaturization of chips and the increase in diameter of wafers are rapidly progressing.

  The present invention has been made to solve the above-described problems. Even when an uneven load is applied to the vicinity of the outer periphery of the chuck top (mounting table) at the time of inspection, the mounting table is always held horizontally, thereby improving the reliability of the inspection. An object of the present invention is to provide a mounting mechanism for an object to be inspected.

  According to the first aspect of the present invention, there is provided a mounting mechanism for an object to be inspected, a mounting table for mounting the object to be inspected, a support table for supporting the mounting table so as to be rotatable forward and backward, A rotation drive mechanism that rotates the table in a forward and reverse direction; and a lift guide mechanism that guides the table to move up and down with respect to the support table. The support table has a vacuum force applied to the table on the support table. A vacuum suction mechanism having a vacuum exhaust path for adsorbing and fixing, and the mounting table is floated from the support table by compressed gas, and the compressed gas is released to land the mounting table on the support table. And an elevating mechanism for this purpose.

According to a second aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to the first aspect of the invention, wherein the vacuum suction mechanism is provided on the upper surface of the support base and contacts the lower surface of the mounting base. A projecting wall portion that forms a sealed space between the support table and the mounting table, and a vacuum exhaust path that is open on the upper surface of the support table and surrounded by the projecting wall portion. To do.
It is characterized by this.

  According to a third aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to the first or second aspect, wherein the elevating mechanism includes a protrusion formed on the upper surface of the support base and the protrusion. And a gas supply part opened in the part.

  Further, in the invention described in any one of claims 1 to 3, the placement mechanism of the object to be inspected according to claim 4 of the present invention is the vacuum suction mechanism and the lifting mechanism, respectively. It arrange | positions at equal intervals in the circumferential direction of a support stand, It is characterized by the above-mentioned.

  According to a fifth aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to any one of the first to fourth aspects, wherein the elevating guide mechanism includes the mounting table and the support. A spline shaft that is pivotally supported by one of the bases so as to rotate forward and backward, and an engagement that is fixed to the other one of the mounting table and the support base and that moves up and down while meshing with the spline shaft. And a member.

  According to a sixth aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to any one of the first to fifth aspects. A rectilinear drive mechanism having a ball screw that linearly moves the movable body by a driving force of a motor, a rectilinear guide mechanism having a guide rail for guiding the movable body in a rectilinear direction, and the movable body. And a link mechanism that connects the mounting table and converts the linear movement of the movable body into the rotational movement of the mounting table.

  According to a seventh aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to the sixth aspect of the present invention, wherein the movable body has a through-hole in which a groove to be screwed into the ball screw is formed. The link mechanism has both ends connected to the mounting table side and the movable body side, respectively.

  According to the eighth aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to the sixth aspect of the present invention, wherein the movable body has a through-hole formed therein with a groove screwed into the ball screw. The link mechanism includes a spline shaft having one end connected to the mounting table side, a link having one end connected to the other end of the spline shaft, and a link connected to the other end of the link and the moving body. And a support shaft erected on the head.

  According to a ninth aspect of the present invention, there is provided a mounting mechanism for an object to be inspected according to any one of the sixth to eighth aspects, wherein the guide rail is engaged with a lower portion of the movable body. It is a LM guide to be combined.

  According to a tenth aspect of the present invention, in the invention described in any one of the first to fifth aspects, the rotational drive mechanism includes the moving body and the above-described mechanism. A rectilinear drive mechanism having a ball screw that moves the moving body straight by a driving force of a motor on the side of the mounting table, and the moving body and the mounting table are connected to each other. A link mechanism for converting to a movement, wherein the link mechanism is loosely fitted in an engagement groove formed in a direction perpendicular to the side surface of the movable body and in an engagement groove of the movable body. An engaging protrusion extending in a horizontal direction from the mounting table; and a roller and a spring provided on both sides of the engaging groove and elastically sandwiching the engaging protrusion in the engaging groove It is.

According to the present invention, it is possible to provide a mounting mechanism for an object to be inspected that can always hold the mounting table horizontally even if an uneven load is applied to the vicinity of the outer periphery of the mounting table at the time of inspection, thereby improving the reliability of the inspection. be able to.

It is a top view which shows one Embodiment of the mounting mechanism of the to-be-inspected body of this invention. It is sectional drawing of the mounting mechanism of the to-be-inspected object shown in FIG. It is sectional drawing which shows the principal part of other embodiment of the mounting mechanism of the to-be-inspected body of this invention. It is a top view which shows the rotational drive mechanism used for the mounting mechanism of the to-be-inspected object of this invention. It is a side view of the rotation drive mechanism shown in FIG. It is sectional drawing which shows the principal part of one Embodiment of the mounting mechanism of the to-be-inspected body of this invention to which the rotational drive mechanism shown in FIG. 4 is applied. It is a figure which shows the conventional probe apparatus, and is a front view which fractures | ruptures and shows the front of a prober chamber. It is a top view of the probe apparatus shown in FIG. It is sectional drawing which shows a part of mounting mechanism of the probe apparatus shown in FIG. It is a top view which shows an example of the conventional rotational drive mechanism. It is a top view which expands and shows the other example of the conventional rotational drive mechanism.

Hereinafter, the present invention will be described based on the embodiment shown in FIGS.
An inspecting device mounting mechanism (hereinafter simply referred to as “mounting mechanism”) 10 according to the present embodiment is configured as shown in FIGS. 1 and 2, for example. The present invention can be applied to various inspection apparatuses that perform characteristic inspection. Therefore, only the mounting mechanism of the present embodiment will be described below, and description of the entire inspection apparatus will be omitted.

  As shown in FIGS. 1 and 2, the mounting mechanism 10 of this embodiment includes a mounting table (hereinafter referred to as “chuck top”) 11 on which a wafer is mounted, and the chuck top 11 can be rotated forward and backward. And a θ rotation drive mechanism 13 for rotating the chuck top 11 forward and backward in the θ direction on the support table 12, and an XY guide rail (not shown) in the prober chamber of the inspection apparatus. And reciprocates along the vertical direction. The chuck top 11 includes, for example, two upper and lower aluminum plates 111 and 112 formed to have the same outer diameter, and a ceramic ring plate 113 interposed therebetween. It has become a structured. The ring plate 113 is configured as a heat insulating material that blocks heat conduction between the upper and lower plates 111 and 112 and prevents heat transfer from the chuck top 11 to the support base 12 as much as possible. The ring plate 113 has an outer diameter that is the same as that of the plates 111 and 112, and an inner diameter that is large enough to create a space for accommodating a part of a lifting guide mechanism described later. The support base 12 includes a support plate 121 and a cylindrical body 122 that shares the axis with the support plate 121.

  Thus, the support base 12 is provided with a vacuum suction portion 14 that sucks and fixes the chuck top 11 to the upper surface of the support base 12 and supplies air when the vacuum suction by the vacuum suction portion 14 is released. A gas supply unit 15 that floats the chuck chip 11 from the support 12 is provided. As shown in FIG. 1, the vacuum suction part 14 and the gas supply part 15 are arrange | positioned alternately by three places over the circumferential direction perimeter, for example in the outer periphery vicinity of the support stand 12 upper surface.

  As shown in FIGS. 1 and 2, the vacuum suction portion 14 includes an endless protruding wall portion 14A formed so as to form a substantially fan shape on the upper surface of the support base 12, and an inner central portion of the protruding wall portion 14A. The vacuum exhaust path 14B is opened, and the vacuum exhaust path 14B is connected to a vacuum exhaust apparatus (not shown) via a vacuum pipe (not shown). The projecting wall portion 14A is formed such that the upper end thereof contacts the chuck top 11 to form a sealed space, and when the vacuum exhaust passage 14B is evacuated, the sealed space becomes a decompressed space. The gas supply unit 15 includes a projection plane 15A formed on the upper surface of the support 12 at the same height as the projection wall 14 and the same outer shape as the projection wall 14A, and a compressed air supply opening in the projection plane 15A. The air supply passage 15B is connected to a compressed air supply source (not shown) via an air pipe (not shown). The projection flat portion 15A is formed with a substantially cross-shaped very shallow groove 15C, and an air supply path 15B is opened at the intersection of the grooves 15C, and compressed air discharged from the air supply path 15B flows through the cross-shaped groove 15C. The top chuck 11 is floated by the air pressure of this portion.

  Therefore, when wafer alignment is performed, after the vacuum suction of the vacuum suction unit 14 is released and then air is discharged from the gas supply unit 15, the chuck top 11 is lifted from the support 12 by the air pressure at this time. During this time, the θ rotation drive mechanism 13 is driven, and the top chuck 11 rotates forward and backward in the θ direction to perform alignment in the θ direction. Thereafter, when the supply of air from the gas supply unit 15 is stopped and evacuation is performed from the vacuum exhaust path 14B of the vacuum suction unit 14, the chuck top 11 is landed on the protruding wall portion 14A and the protruding flat surface portion 15A, and on the support base 12. Adsorbed and fixed. Thus, since the chuck top 11 is a floating rotation system, the chuck top 11 has no sliding portion and does not generate particles.

  As shown in FIG. 2, an elevating guide mechanism 16 is provided between the chuck top 11 and the support base 12, and the chuck top 11 follows the elevating guide mechanism 16 when the vacuum suction section 14 and the gas supply section 15 work alternately. It goes up and down. As shown in the figure, the elevation guide mechanism 16 includes an angular bearing 16A attached to the lower surface of the support base 12, a spline shaft 16B whose lower end is rotatably supported by the angular bearing 16A, and the spline. An engaging member 16C fixed to the center of the plate 112 of the chuck top 11 so as to engage with the shaft 16B is provided. The engaging member 16 </ b> C has a spline linear motion guide that engages with the spline shaft 16 </ b> B on the inner surface, and an upper end thereof is fixed via a flange 16 </ b> D disposed at the center of the plate 112 of the chuck top 11. Therefore, when the chuck top 11 moves up and down, the chuck top 11 moves up and down in the vertical direction according to the spline shaft 16B via the engaging member 16C.

  As shown in FIGS. 1 and 2, for example, the θ rotation drive mechanism 13 includes a ball screw 13B that rotates forward and backward by a motor 13A fixed in a prober chamber, a nut 13C that the ball screw 13B is screwed with, and a nut 13C. And an engaging protrusion 13E that is loosely fitted in an engaging groove 13D that is notched so as to be orthogonal to the ball screw 13B and that extends in the horizontal direction from the outer peripheral surface of the chuck top 11. A roller 13F is rotatably supported on one side surface of the engagement groove 13D, and a spring 13G is mounted on the other side surface, and the engagement projection 13E is elastically held between the roller 13F and the spring 13G. . Accordingly, when the motor 13A is driven and the ball screw 13B rotates forward and backward, the nut 13C reciprocates according to the ball screw 13B. As a result, the chuck top 11 passes through the engagement protrusion 13E in a predetermined angle range (for example, ± 7 to The wafer is aligned forward and backward at 8 °).

  Next, the operation will be described. When the wafer pre-aligned by the mounting mechanism 10 in the prober chamber (not shown) is received on the chuck top 11, the alignment mechanism (not shown) is moved while the mounting mechanism 10 moves in the X and Y directions. The X- and Y-direction alignment of the wafer is performed, and the chuck top 11 is rotated forward and backward in the θ-direction via the θ-rotation driving mechanism 13 to align the wafer in the θ-direction.

  When alignment in the θ direction is performed, first, when compressed air is discharged from the three gas supply units 15, the chuck top 11 is lifted by the compressed air. At this time, the chuck top 11 is splined by the lift guide mechanism 16. It rises by a predetermined distance in the vertical direction via the shaft 16B and the engaging member 16C and floats from the support base 12. When the θ rotation drive mechanism 16 is driven in this state, the chuck top 11 rotates forward and backward in the θ direction, and alignment is performed in the θ direction. When the alignment in the θ direction is completed, the supply of air is stopped and the chuck top 11 is lowered in the vertical direction via the elevation guide mechanism 16, and the lower surface of the chuck top 11 is the projection wall portion 14 A of the vacuum suction portion 14 and the air discharge portion. It contacts 15 projection flat portions 15A. Since the protruding wall portion 14A and the protruding flat portion 15A are precisely formed at the same height, the chuck top 11 is landed on the protruding wall portion 14A and the protruding flat portion 15A in a horizontal state, and the protruding wall of the vacuum suction portion 14 A sealed space is formed inside the portion 14A. Subsequently, when air is exhausted from the vacuum exhaust path 14B of the vacuum suction portion 14, the sealed space is decompressed, and the chuck top 11 is fixed to the protruding wall portion 14A of the vacuum suction portion 14 of the support base 12. 11 alignment in the θ direction is completed.

  After the alignment in the θ direction is completed, the mounting mechanism 10 is overdriven vertically upward, the probe needle is in contact with the vicinity of the outer periphery of the wafer, and the protruding wall portion 14A of the vacuum suction portion 14 is supported even when a large needle pressure is applied. Since it is located in the vicinity of the outer periphery of the base 12, the top chuck 11 is always kept horizontal, and the probe needle is not displaced from the alignment position as in the prior art, and a reliable and stable inspection can be performed at the alignment position. .

  As described above, according to the present embodiment, the vacuum table 14 and the gas supply unit 15 are alternately provided in the vicinity of the outer periphery of the upper surface of the support table 12 at equal intervals in the circumferential direction. A lift guide mechanism 16 for lifting and lowering the chuck top 11 is provided between the support bases 12 so that the chuck top 11 is simultaneously landed on the vacuum suction portion 14 and the gas supply portion 15 during vacuum suction. Even if the pressure acts as an unbalanced load, the chuck top 11 can always be held horizontally by the vacuum suction portion 14 and the gas supply portion 15, preventing displacement from the alignment position of the probe needle, and thus the reliability of the inspection. Can be increased. Further, when the rotating chuck top 11 rotates forward and backward in the θ direction, the chuck top 11 rotates in a state where it floats from the support base 12, and the angular bearing 16 </ b> A that is a sliding portion is in the cylindrical body 122. Thus, inspection can be performed in an environment in which particles are reduced and particles are reduced, and contamination of the wafer by particles can be suppressed.

  Moreover, FIG. 3 is sectional drawing which shows the principal part of other embodiment of this invention. The mounting mechanism 20 of the present embodiment is configured in the same manner as the mounting mechanism 10 of the above-described embodiment except that the structure of the lifting guide mechanism 26 is different. Therefore, the elevation guide mechanism 26 will be described. As shown in FIG. 3, the lift guide mechanism 20 includes an angular bearing 26A attached to the upper surface of the plate 212 of the chuck top 21, a spline shaft 26B whose upper end is rotatably supported by the angular bearing 26A, An engagement member 26C fixed to the center of the support base 22 so as to mesh with a plurality of keys of the spline shaft 26B is provided. The engaging member 26C and the spline shaft 26B are configured in the same manner as in the above embodiment. A spherical portion 26D is formed at the lower end of the spline shaft 26B, and this spherical portion 26D is in contact with an inverted conical recess 26F of a positioning member 26E attached to the lower surface of the support base 22.

  Accordingly, when the chuck top 21 is raised, the chuck top 21 is vertically raised according to the engaging member 26C via the spline shaft 26B, and when the chuck top 21 is lowered, the chuck top 21 is engaged with the engaging member via the spline shaft 26B. Ascending in the vertical direction according to 26C. Further, when the chuck top 21 is lowered, the spherical portion 26D at the lower end of the spline shaft 26B is guided by the concave portion 26F of the positioning member 26E, so that the chuck top 21 is reliably positioned on the shaft core.

  4-6 is a figure which shows the mounting mechanism to which the rotational drive mechanism of this invention is applied. As shown in FIGS. 4 to 6, the mounting mechanism 10 of the present embodiment includes a chuck top 11, a support base 12, a lifting guide mechanism 16, and a θ rotation drive mechanism 18, except for the θ rotation drive mechanism 18. It is configured according to the mounting mechanism shown in FIGS. As shown in FIG. 6, the support 12 includes a θ table 12A and a base plate 12B. In addition, although not shown in figure, the support stand 12 is provided with the vacuum suction part and gas supply part which were mentioned above. Further, as shown in FIG. 6, a hole 12C is formed in the center of the support base 12, and a plate center 19 is horizontally provided slightly below the hole 12C. A chuck is provided on the plate center 19 during alignment. An elevating guide mechanism 16 that guides the top 11 in the vertical direction on the support base 12 is provided, and the chuck top 11 vertically elevates a small distance on the support base 12 via the elevating guide mechanism 16. For example, as shown in FIG. 6, the elevating guide mechanism 16 has an angular bearing 16A, a spline shaft 16B, and an engaging member 16C provided at the center on the plate center 19, and the chuck top 11 is positioned during the alignment in the θ direction. When moving up and down, the chuck top 11 moves up and down on the support base 12 by the spline shaft 16B moving up and down in the vertical direction according to the spline linear motion guide of the engaging member 16C.

  Thus, for example, as shown in FIGS. 4 to 6, the θ rotation drive mechanism 18 moves straight through the rectilinear drive mechanism 181 provided on the side of the chuck top 11 and the rectilinear drive mechanism 181. A moving body 182, a rectilinear guide mechanism 183 that guides the moving body 182 in the rectilinear direction, a moving body 182 that moves according to the rectilinear guide mechanism 183, and a link mechanism 184 that connects the chuck top 11, The moving distance, that is, the rotation angle of the chuck top 11 is controlled with high accuracy via an encoder 185 attached to the motor 181A of the linear drive mechanism 181 and a control device (not shown).

  The linear drive mechanism 181 includes a motor 181A fixed to the chuck top 11 side and a ball screw 181B coupled to the motor 181A, and always maintains a constant posture. A moving body 182 (that is, a nut 182) is screwed into the ball screw 181B, and the nut 182 advances straight from side to side as indicated by arrows in FIGS. 4 and 5 through forward and reverse rotation of the motor 181A through the ball screw 181B. In addition, the encoder 185 can detect the rotation speed of the motor 181A, in other words, the rotation speed of the ball screw 181B, with high accuracy, so that the moving distance of the nut 182 and thus the rotation angle of the chuck top 11 can be controlled with high accuracy. .

  As shown in FIGS. 4 to 6, the linear guide mechanism 183 is provided on the motor 181A so as to support the guide rail 183A composed of an LM guide disposed in parallel with the guide screw 183A immediately below the ball screw 181B. And a substantially L-shaped support body 183B that is fixed. A nut 182 engages with the guide rail 183A on the lower surface, and the rigidity of the nut 182 that goes straight through the guide rail 183A according to the ball screw 181B is improved, so that the operation accuracy of the link mechanism 184 is improved.

  As shown in FIGS. 4 and 5, the link mechanism 184 includes a spline shaft 184B splined at the lower end to an engaging portion 184A fixed to the peripheral surface of the chuck top 11, and an upper end of the spline shaft 184B. A link 184C connected to one end of the link 184C and a support shaft 184D connected to the other end of the link 184C at the upper end and erected on the upper surface of the nut 182 are provided. For example, a bearing (not shown) is incorporated in the connecting portion of the link 184C. The upper end of the spline shaft 184B is rotatably supported by the bearing at one end of the link 184C, and the support shaft 184D is rotatably supported by the bearing at the other end. The chuck top 11 moves up and down on the support base 12 via a spline coupling portion with the spline shaft 184B of the engaging portion 184A.

  Therefore, when the chuck top 11 floats during wafer alignment and the linear drive mechanism 181 is driven, the nut 182 reciprocates left and right via the ball screw 181B and the guide rail 183A without swinging the linear drive mechanism 181. Accordingly, as indicated by the arrows in FIGS. 4 and 5, the chuck top 11 rotates forward and backward by a predetermined angle range (for example, ± 7 to 8 °) in the θ direction via the link mechanism 184 to align the wafer. It can be carried out.

  Next, the operation will be described. When the wafer on which the mounting mechanism 10 is pre-aligned in the prober chamber (not shown) is received on the chuck top 11, the alignment mechanism (not shown) is moved while the mounting mechanism 10 moves in the X and Y directions. Then, the wafer is aligned in the X and Y directions, and the chuck top 11 is rotated forward and backward in the θ direction via the θ rotation drive mechanism 18 to align the wafer in the θ direction.

  When performing the alignment in the θ direction, when the lifting mechanism of the chuck top 11 is driven, the chuck top 11 is moved from the solid line position in FIG. 5 to the position indicated by the one-dot chain line through the spline shaft 16B and the engaging member 16C of the lifting guide mechanism 16. And the engaging portion 184A rises in the spline connection with the link mechanism 184. In this state, the θ rotation drive mechanism 18 is driven.

  When the θ rotation drive mechanism 18 is driven, the straight drive mechanism 181 is always in a fixed posture via the ball screw 181B and the guide rail 183A with the movement distance being controlled with high accuracy via the encoder 185 and the control device. Continue straight while maintaining. At this time, the link mechanism 184 converts the linear motion of the nut 182 into the rotational motion of the chuck top 11, and the chuck top 11 rotates in the θ direction by a predetermined angle to perform alignment of the wafer in the θ direction. When the alignment is completed, the chuck top 11 is lowered via the lifting mechanism and is fixed on the support base 12 by vacuum suction. Subsequently, the probe needle and the chuck top 11 come into contact with each other due to overdrive of the chuck top 11, and in some cases, an offset load acts on the chuck top 11 from the probe needle, and a rotational force in the θ direction acts on the chuck top 11. . However, since the rigidity of the chuck top 11 in the θ direction is remarkably improved by the guide rail 183A and the link mechanism 184, rotation of the chuck top 11 in the θ direction is prevented, and the probe needle and the predetermined electrode pad are accurately provided. The contactor can reliably perform a predetermined electrical inspection. Further, since the θ rotation drive mechanism 18 converts the straight movement into the rotation movement via the link mechanism 184, the occupied space can be reduced as compared with the conventional case.

  As described above, according to the present embodiment, the θ rotation drive mechanism 18 includes the rectilinear drive mechanism 181 provided on the side of the chuck top 11, the nut 182 that moves rectilinearly via the rectilinear drive mechanism 181, Since the linear guide mechanism 183 that guides the nut 182 in the straight direction and the link mechanism 184 that connects the chuck top 11 and the nut 182 that moves according to the straight guide mechanism 183 are provided, the rigidity of the chuck top 11 in the θ direction is provided. Thus, even when a rotational force in the θ direction acts on the chuck top 11 during the wafer inspection, the rotation of the chuck top 11 in the θ direction can be surely prevented, and the positional deviation in the θ direction can be assured. Can be prevented. Further, since the θ rotation drive mechanism 18 converts the straight movement into the rotation movement via the link mechanism 184, the occupied space can be reduced as compared with the conventional structure, and the mounting mechanism 10 can be saved. Space can be achieved.

  Further, according to the present embodiment, since the θ rotation drive mechanism 18 is provided in the mounting mechanism 10 of the probe device, the rigidity of the chuck top 11 in the θ direction is remarkably improved, and the chuck top 11 is inspected with respect to the chuck top 11 during wafer inspection. Thus, even if the rotational force in the θ direction is applied, the rotation of the chuck top 11 in the θ direction can be reliably prevented, the positional deviation in the θ direction can be reliably prevented, and the reliability of the inspection can be improved. it can.

  In each of the above embodiments, the case where the chuck tops 11 and 21 land on the vacuum suction units 14 and 24 and the gas supply units 15 and 25 disposed in the vicinity of the outer periphery of the support bases 12 and 22 has been described. In addition to the parts 14 and 24 and the gas supply parts 15 and 25, protrusions may be provided in the vicinity of the outer periphery of the support table over the entire circumference. In short, any mounting mechanism that is configured such that the mounting table moves up and down on the support table according to the guidance of the lifting guide mechanism by the function of the vacuum suction unit and the gas supply unit is included in the present invention.

  In each of the above-described embodiments, the case where the θ rotation drive mechanism is provided in a place other than the placement mechanism has been described. However, further space saving can be achieved by providing the θ rotation drive mechanism directly on the placement mechanism. In short, any system that employs a linear guide mechanism and a link mechanism of a moving body as components of the rotation drive mechanism and increases the rigidity between the mounting table and the rotation drive mechanism is included in the present invention.

  The present invention can be suitably used for an inspection apparatus for inspecting a wafer.

10, 20 Mounting mechanism 11, 21 Chuck top (mounting table)
12, 22 Support base 13 θ rotation drive mechanism 14 Vacuum suction part 14A Projection wall part 14B Vacuum exhaust path 15 Gas supply part 15A Projection flat part 15B Air supply path 16 Lift guide mechanism 16A, 26A Angular bearing (rotary bearing)
16B, 26B Spline shaft 16C, 26C Engagement member 18 θ rotation drive mechanism (rotation drive mechanism)
181 Linear drive mechanism 181A Motor 181B Ball screw 182 Nut (moving body)
183A Guide rail (straight guide mechanism)
184 Link mechanism 184B Spline shaft 184C Link 184D Support shaft

Claims (10)

A mounting table on which the object to be inspected is mounted; a support table that supports the mounting table so as to be rotatable forward and backward;
A rotation drive mechanism for rotating the mounting table forward and backward on the support table, and a lifting guide mechanism for guiding the lifting table with respect to the support table.
The support table includes a vacuum suction mechanism having a vacuum exhaust path for vacuum-fixing the mounting table on the support table by a vacuum force;
An elevating mechanism for levitating the mounting table from the support table with compressed gas and releasing the compressed gas to land the mounting table on the support table. Body mounting mechanism. The vacuum suction mechanism is provided on the upper surface of the support table and contacts the lower surface of the mounting table to form a sealed wall between the support table and the mounting table; the upper surface of the support table and the protrusion 2. A mounting mechanism for an object to be inspected according to claim 1, further comprising: an evacuation passage that is open on an inner side surrounded by a wall portion.   3. The mounting of the object to be inspected according to claim 1 or 2, wherein the elevating mechanism has a protrusion formed on the upper surface of the support base and a gas supply section that opens at the protrusion. Placement mechanism.   The said vacuum suction mechanism and the said raising / lowering mechanism are respectively arrange | positioned at equal intervals in the circumferential direction of the said support stand, The mounting of the to-be-inspected object of any one of Claims 1-3 characterized by the above-mentioned. Placement mechanism.   The ascending / descending guide mechanism is fixed to the spline shaft pivotally supported on one of the mounting table and the support table so as to be rotatable forward and backward, and fixed to the other one of the mounting table and the support table; An inspecting member mounting mechanism according to any one of claims 1 to 4, further comprising an engaging member that moves up and down while meshing with the spline shaft. The rotational drive mechanism is
A moving object,
A rectilinear drive mechanism having a ball screw that moves the moving body straight by a driving force of a motor on the side of the mounting table,
A rectilinear guide mechanism having a guide rail for guiding the moving body in a rectilinear direction;
A link mechanism that connects the moving body and the mounting table and converts the linear movement of the moving body into a rotational motion of the mounting table. 2. A mounting mechanism for an object to be inspected according to item 1. The moving body has a through hole in which a groove to be screwed into the ball screw is formed.
7. The mounting mechanism for an object to be inspected according to claim 6, wherein both ends of the link mechanism are connected to the mounting table side and the moving body side, respectively. The moving body has a through hole in which a groove to be screwed into the ball screw is formed.
The link mechanism includes a spline shaft having one end connected to the mounting table side, a link having one end connected to the other end of the spline shaft, and a link connected to the other end of the link and standing on the moving body. A mounting mechanism for an object to be inspected according to claim 6.   The mounting mechanism for an object to be inspected according to any one of claims 6 to 8, wherein the guide rail is an LM guide that engages with a lower portion of the movable body. The rotational drive mechanism is
A moving object,
A rectilinear drive mechanism having a ball screw that moves the moving body straight by a driving force of a motor on the side of the mounting table,
A link mechanism that connects the moving body and the mounting table and converts the linear movement of the moving body into the rotational movement of the mounting table;
The link mechanism is
An engagement groove formed on a side surface of the movable body in a direction perpendicular thereto;
An engagement protrusion loosely fitted in the engagement groove of the moving body and extending in a horizontal direction from the mounting table;
A roller and a spring provided on both side surfaces of the engagement groove and elastically sandwiching the engagement protrusion in the engagement groove, respectively. 6. A mounting mechanism for the object to be inspected according to the item.

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