JP2010066492A5 - - Google Patents

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Publication number
JP2010066492A5
JP2010066492A5 JP2008232443A JP2008232443A JP2010066492A5 JP 2010066492 A5 JP2010066492 A5 JP 2010066492A5 JP 2008232443 A JP2008232443 A JP 2008232443A JP 2008232443 A JP2008232443 A JP 2008232443A JP 2010066492 A5 JP2010066492 A5 JP 2010066492A5
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JP
Japan
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JP2008232443A
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Japanese (ja)
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JP5141458B2 (en
JP2010066492A (en
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Publication of JP2010066492A5 publication Critical patent/JP2010066492A5/ja
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JP2008232443A 2008-09-10 2008-09-10 Positive radiation-sensitive resin composition and resist pattern forming method using the same Active JP5141458B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008232443A JP5141458B2 (en) 2008-09-10 2008-09-10 Positive radiation-sensitive resin composition and resist pattern forming method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008232443A JP5141458B2 (en) 2008-09-10 2008-09-10 Positive radiation-sensitive resin composition and resist pattern forming method using the same

Publications (3)

Publication Number Publication Date
JP2010066492A JP2010066492A (en) 2010-03-25
JP2010066492A5 true JP2010066492A5 (en) 2010-05-06
JP5141458B2 JP5141458B2 (en) 2013-02-13

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JP2008232443A Active JP5141458B2 (en) 2008-09-10 2008-09-10 Positive radiation-sensitive resin composition and resist pattern forming method using the same

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5729180B2 (en) * 2010-07-14 2015-06-03 Jsr株式会社 Radiation sensitive resin composition
KR101907705B1 (en) * 2010-10-22 2018-10-12 제이에스알 가부시끼가이샤 Pattern-forming method and radiation-sensitive composition
JP5978137B2 (en) 2012-02-23 2016-08-24 東京応化工業株式会社 Resist composition and resist pattern forming method
US11347147B2 (en) 2016-11-07 2022-05-31 Toyo Gosei Co., Ltd. Metal-containing onium salt compound, photodegradable base, resist composition, and method for manufacturing device using said resist composition
JP7250422B2 (en) * 2017-12-28 2023-04-03 東京応化工業株式会社 Resist composition and resist pattern forming method
JP7394591B2 (en) 2019-11-14 2023-12-08 東京応化工業株式会社 Resist composition and resist pattern forming method

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