JP2010062398A - Method for manufacturing circuit component, circuit component, and apparatus for manufacturing circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit component, inexpensively achieving improvement of heating efficiency in flip-chip mounting. <P>SOLUTION: The method for manufacturing a circuit component has: a power-on process turning on electricity with predetermined current causing a conductor portion of a circuit board to generate heat; and a bonding process crimping and bonding a chip in one surface side of the circuit board heated by the generation of heat. Since electricity is turned on with the predetermined current to cause the conductor portion of the circuit board, for example, a ground conductor foil, an inner layer pattern, or an electrode of a bonding target, to generate heat, the electrode is heated more efficiently than in the case of transmitting heat to the circuit board from outside. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit component manufacturing method for bonding a chip to a circuit board, and relates to a technique for bonding a chip by pressure bonding to a heated circuit board.

  As one of high-density mounting technology for electronic circuit components, flip chip mounting is known in which a semiconductor integrated circuit (chip) is mounted on an electrode of a circuit board, and a conductor portion of the circuit board and a protruding electrode (bump) of the chip are joined. ing. Patent Document 1 describes an example of a circuit component manufacturing apparatus that joins a circuit board and a chip by such flip chip mounting.

As an example of a bonding method in flip chip mounting, a circuit board electrode and a chip bump are crimped and a metal bond is generated between the circuit board electrode and the chip bump by ultrasonic vibration, and the circuit board electrode and the chip bump A bonding method for bonding bumps is known. In this bonding method, the bonding surface can be stabilized by heating the bonding surface to a predetermined temperature (70 to 80 ° C.), thereby stabilizing the bonding. Therefore, in order to improve productivity, the mounting base on which the circuit board is placed at the time of bonding is equipped with an electric heater, and heat is transferred to the circuit board by the electric heater to shorten the bonding time. A method has been proposed.
JP 2007-24542 A

  However, in the above method of heating the entire circuit board, the heating efficiency is limited by the heat transfer efficiency of the circuit board. In this regard, a method for improving productivity by providing a preheating mounting table in addition to the bonding mounting table in the production line and preheating the circuit board prior to bonding has also been proposed. There arise problems such as securing a space for providing a plurality of mounting tables and generating additional costs.

  Accordingly, an object of the present invention is to provide a circuit component manufacturing method capable of realizing an improvement in heating efficiency at a low cost.

  In order to achieve the above object, according to a first aspect of the present invention, an energization step of energizing a predetermined current for generating heat in a conductor portion of a circuit board, and one side of the circuit board heated by the heat generation A circuit component manufacturing method including a bonding step of bonding a chip by pressure bonding to the chip is provided.

  According to a preferred aspect of the above aspect, in the energization step, the conductor portion (ground conductor foil) provided on the first surface side of the circuit board is energized, and in the joining step, the second of the circuit board is provided. The chip is bonded to the surface side.

  According to another preferred aspect of the above aspect, in the energization step, a conductor portion (electrode or inner layer pattern) provided on the first surface side or inside of the circuit board is penetrated from the second surface side of the circuit board. The chip is bonded to the first surface side of the circuit board in the bonding step by energizing through a hole.

  According to still another preferred aspect of the above-described side surface, in the energization step, the conductor portion (electrode) provided on the first surface side of the circuit board is energized, and in the bonding step, the first surface side The chip is bonded to the conductor portion (electrode).

  According to the above aspect, since a predetermined current for generating heat in the conductor portion of the circuit board is supplied, the electrode can be heated more efficiently than when heat is transferred to the circuit board from the outside.

  That is, according to the preferable aspect, in the energization step, the conductor portion (ground conductor foil) provided on the first surface side of the circuit board is energized, and in the bonding step, the second of the circuit board is supplied. Since the chip is bonded to the surface side, the electrode can be heated more efficiently than when the electrode is heated by transferring heat from the electric heater of the mounting table to the ground conductor foil.

  According to another preferable aspect, in the energization step, the conductor portion (electrode or inner layer pattern) provided on the first surface side or inside of the circuit board is energized through the through hole, so that the heating efficiency Can be improved. In particular, when energizing the inner layer pattern, the circuit board can be heated more uniformly than when the circuit board is heated from one side. Therefore, it is possible to suppress the deformation of the circuit board and prevent a decrease in bonding accuracy and bonding reliability.

  Furthermore, according to another preferable aspect, in the energization step, the conductor portion (electrode) provided on the first surface side of the circuit board is energized, and in the joining step, the first surface side Since the chip is bonded to the conductor portion (electrode), the electrode can be directly and locally heated. Therefore, the heating efficiency can be improved, and the expansion of the circuit board can be suppressed by minimizing the heating of the entire circuit board, and the deterioration of the bonding accuracy and the bonding reliability can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the matters described in the claims and equivalents thereof.

  FIG. 1 is a diagram illustrating the overall configuration of a circuit component manufacturing apparatus according to the present embodiment. The circuit component manufacturing apparatus 10 has a protruding electrode such as gold on a circuit board 34 on which a wiring pattern or an electrode 36 (that is, a conductor portion) made of a conductive foil such as copper or gold is formed on or inside a resin substrate. A circuit component manufacturing apparatus for manufacturing a so-called flip-chip circuit component by loading a semiconductor integrated circuit (chip) 30 having (bump) 32 and bonding electrodes 36 of a circuit board 34 and bumps 32 of the chip 30. It is. Here, the circuit components include, for example, a high-frequency circuit used for a millimeter-wave radar or a digital broadcast transceiver, an arithmetic processing circuit such as an audio device or a microcomputer.

  The circuit component manufacturing apparatus 10 includes a mounting table 26 on which a circuit board 34 is mounted, an imaging unit 22 that images the mounted circuit board 34, and a chip 30 that faces the surface of the circuit board 34, for example, by vacuum suction. A holding unit 20 that holds, a drive mechanism such as a motor that moves the position of the holding unit 20 in the horizontal and vertical directions, and a drive unit 14 that includes a detector such as a linear encoder that detects the amount of movement of the holding unit 20. Have. The circuit component manufacturing apparatus 10 further detects the position of the electrode 36 on the mounting table 26 based on the captured image of the circuit board 34 captured by the imaging unit 22, and aligns the bump 32 of the chip 30 with the detected position of the electrode 36. And a control unit 12 that derives the driving amount of the holding unit 20 and instructs the driving unit 14. The control unit 12 includes a microcomputer as an example.

  The holding unit 20 includes a pressure sensor 16, and the pressure sensor 16 detects a pressure when the bump 32 of the chip 30 contacts the electrode 36 of the circuit board 34 and outputs a detection signal to the control unit 12. The holding unit 20 is provided with a joining jig 18 having a vibrator that generates ultrasonic vibrations.

  In the circuit component manufacturing apparatus 10 described above, when the circuit board 34 is transported to a predetermined position facing the joining jig 18 of the mounting table 26 by a transport mechanism (not shown) or manually, the circuit board 34 is positioned on the mounting table 26. Placed and fixed, for example, by vacuum suction.

  When the control unit 12 detects the position of the electrode 36 on the circuit board 34, the bump 32 of the chip 30 is aligned with the electrode 36 on the circuit board 34 while closely adjusting the position of the holding unit 20 by the driving unit 14. . Then, a predetermined pressure is applied while detecting the pressure applied to the bump 32 of the chip 30 by the detection signal from the pressure sensor 16. At the same time, the control unit 12 outputs an instruction signal for driving the joining jig 18 to apply ultrasonic vibration to the chip 30. In this manner, metal bonding is generated at the bonding surface between the electrode 36 of the circuit board 34 and the bump 32 of the chip 30, and the electrode 36 of the circuit board 34 and the bump 32 of the chip 30 are bonded by pressure bonding.

  Note that, as a configuration in which an operation input by an operator is input to the control unit 12 from an operation input unit (not shown), the control unit 12 may execute the control operation in response to the input.

  Furthermore, in the present embodiment, the mounting table 26 is provided with energizing means 28, and a predetermined amount of current acquired by the energizing means 28 from the power source is energized to the conductor portions of the circuit board 34, the electrodes 36, etc. Heat up. As a result, the electrode 36 is heated to a predetermined temperature (70 to 80 ° C.) to activate the metal bond on the bonding surface. By doing so, joining time can be shortened. In addition to this, heat generating means such as an electric heater may be provided in the joining jig 18 to heat the chip 30 to further activate the metal bond.

  According to the above means, by using the conductor portion of the circuit board 34 as a heating element, the electrode 36 can be heated more efficiently than when the mounting base 26 is provided with an electric heater and heat is transferred from the outside of the circuit board 34 by the electric heater. Therefore, the heating efficiency of the electrode can be improved without providing a mounting table for preheating and without requiring additional cost.

  Here, the circuit component manufacturing process by the circuit component manufacturing apparatus 10 will be described.

  FIG. 2 is a flowchart for explaining the circuit component manufacturing process. First, the circuit board 34 in which the bonding surface of the electrode 36 has been cleaned in advance by plasma cleaning or the like is transported and placed at a predetermined position on the mounting table 26 (S2). Then, an energization step of energizing and heating the electrode 36 of the circuit board 34 by the energizing means 28 is performed (S4). When the chip 30 held by the holding unit 20 is aligned with the electrode 36 of the circuit board 34 (S6), a bonding process is performed in which the bonding jig 18 press-bonds the chip (S8). The manufacturing process ends. The joined circuit components are filled with an underfill agent that prevents the joined portion from being peeled off and cooled.

  In the following description, an embodiment according to the configuration of the energization means 28 provided on the mounting table 26 will be described. 3 to 5 schematically show cross-sectional views of the mounting table 26 and the circuit board 34 of the circuit component manufacturing apparatus 10.

  FIG. 3 is a diagram for explaining the first embodiment. The first embodiment shows a configuration of the energization means 28 suitable when the circuit board 34 has the ground conductor foil 34a on the back surface. That is, the mounting table 26 includes the energization terminal 28a at a position where the circuit board 34 contacts the ground conductor foil 34a when the circuit board 34 is mounted at a predetermined position. Therefore, the energization terminal 28 a corresponds to the energization means 28.

  Here, the energizing means 28 energizes the ground conductor foil 34 a provided on the back surface of the circuit board 34 to generate heat and heats the electrodes 36 provided on the surface of the circuit board 34. By doing so, the electrode 36 can be raised to a predetermined temperature, and the metal bond at the time of performing crimping | compression-bonding can be activated.

  In this case, since the electrode 36 is heated by causing the ground conductor foil 34a itself to generate heat, the electrode is more efficiently produced than the conventional method in which the ground conductor foil 34a is heated from the outside by the electric heater of the mounting table 26 and transferred to the electrode 36. 36 can be heated.

  FIG. 4 is a diagram for explaining the second embodiment. The second embodiment shows a configuration of the energizing means 28 suitable when the circuit board 34 has an inner layer pattern 34b and the electrode 36 and the inner layer pattern 34b are connected by a through hole 34c. That is, the mounting table 26 is provided with the energization terminal 28a at a position where the circuit board 34 comes into contact with the through hole 34c when the circuit board 34 is mounted at a predetermined position. Therefore, the energization terminal 28 a corresponds to the energization means 28.

  In such a configuration, the energization means 28 generates heat by energizing the electrodes 36 of the circuit board 34 through the through holes 34c. Alternatively, the energization means 28 energizes the inner layer pattern 34b through the through hole 34c to generate heat and heat the electrode 36. By doing so, the metal bond at the time of crimping | bonding can be activated.

  In the second embodiment, when the electrode 36 is first heated, the heating efficiency can be improved by causing the electrode 36 to self-heat.

  When the inner layer pattern 34b generates heat, the circuit board 34 can be heated more efficiently than the conventional method in which the circuit board 34 is heated by the electric heater of the mounting table 26 to transfer heat to the electrode 36. Since heating can be performed uniformly, deformation (warping) of the circuit board 34 can be suppressed. When warping occurs due to heating, the positions of the electrodes 36 on the circuit board 34 and the bumps 32 of the chip 30 are slightly shifted to reduce the bonding accuracy, or due to stress when the circuit board 34 is cooled after bonding, the bonding surface. However, this problem can be prevented by suppressing the warpage of the circuit board 34. Therefore, a relatively inexpensive resin substrate can be used for the circuit board 34, and a decrease in bonding accuracy and bonding reliability can be prevented without using a material such as an expensive ceramic that is less warped by heating.

  FIG. 5 is a diagram for explaining the third embodiment. In the third embodiment, the mounting table 26 is provided with a current-carrying terminal 28a at a position that contacts the electrode 36 provided on the surface of the circuit board 34 when the circuit board 34 is placed at a predetermined position. Therefore, the energization terminal 28 a corresponds to the energization means 28.

  In such a configuration, the energization means 28 energizes the electrode 36 of the circuit board 34 to generate heat and to self-heat. By doing so, the metal bond at the time of joining can be activated.

  In the third embodiment, the electrode 36 is heated by energizing a narrower range than in the first and second embodiments. Therefore, the heating efficiency of the electrode 36 can be further improved. At the same time, heating of the entire circuit board 34 can be further suppressed, and expansion of the circuit board 34 can be suppressed. Therefore, it is possible to prevent the bonding accuracy and the bonding reliability from being lowered due to the circuit board 34 being expanded by heating.

  According to the first to third embodiments described above, the heating efficiency can be improved by shortening the heating time of the electrode 36. Further, as a further effect in the first to third embodiments, power consumption can be reduced. That is, as compared with the power consumption of the conventional electric heater in which the electric heater built in the mounting table 26 generates heat and heats the circuit board 34 together, it is necessary to generate heat in the conductor portion of the circuit board 34 in the above-described embodiment. The power is smaller. Thus, manufacturing cost can be reduced by reducing power consumption.

  Compared with the case where the mounting table 26 is provided with an electric heater 40 that locally heats the electrode 36 on the surface of the circuit board 34 from the outside (FIG. 6), the electrode 36 itself is mounted as in the third embodiment. It is possible to reduce power consumption by self-heating this by locally generating heat.

  In addition, arrangement | positioning and the number of the energization terminals shown to the above-mentioned description and drawing are examples, Comprising: It is not restricted to the above-mentioned example.

  As described above, since the circuit component manufacturing apparatus according to the present invention includes the energization means for energizing the current that generates heat in the conductor portion of the circuit board, the heating efficiency of the electrodes can be obtained without the additional cost of the preheating means. Can be improved.

It is a figure explaining the whole structure of the circuit component manufacturing apparatus in this embodiment. It is a flowchart figure explaining a circuit component manufacturing process. It is a figure explaining a 1st Example. It is a figure explaining a 2nd Example. It is a figure explaining a 3rd Example. It is a figure explaining the structure at the time of providing the electric heater 40 in the mounting base 26. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Circuit component manufacturing apparatus, 18: Joining jig, 26: Mounting base, 28: Current supply means, 28a: Current supply terminal, 30: Chip, 32: Bump, 34: Circuit board, 34a: Ground conductor foil, 34b: Inner layer Pattern, 34c: Through hole, 36: Electrode

Claims (6)

An energization step of energizing a predetermined current that heats a conductor portion of the circuit board;
A circuit component manufacturing method comprising: a bonding step of pressing and bonding a chip to one side of the circuit board heated by the heat generation. In claim 1,
In the energization step, energize the conductor portion provided on the first surface side of the circuit board,
In the joining step, the chip is joined to the second surface side of the circuit board. In claim 1,
In the energization step, the conductor portion provided on or on the first surface side of the circuit board is energized through a through hole from the second surface side of the circuit board,
In the joining step, the chip is joined to the first surface side of the circuit board. In claim 1,
In the energization step, energize a conductor portion provided on the first surface side of the circuit board,
In the joining step, the chip is joined to the conductor portion on the first surface side.   A circuit component having a circuit board and a chip to be joined by the circuit component manufacturing method according to claim 1. Energizing means for energizing a predetermined current for generating heat on the conductor portion of the circuit board;
A circuit component manufacturing apparatus, comprising: a joining jig that crimps and joins a chip to one side of the circuit board heated by the heat generation.

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