JP2010056188A - Soldering device and soldering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device and a soldering method, wherein a cycle time is shortened. <P>SOLUTION: This invention relates to the soldering device, wherein a connection terminal of the rigid printed wiring board is soldered to a connection terminal of a flexible printed wiring board having a heating means provided at a mounting stand for a rigid printed wiring board. The soldering device includes a means of measuring the temperature of the rigid printed wiring board mounted on the mounting stand before the soldering, and starts soldering the connection terminals when the temperature obtained by the measuring means exceeds predetermined temperature. The soldering method is characterized by using the device. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering apparatus and a soldering method for soldering a connection terminal of a flexible printed wiring board to a connection terminal of a rigid printed wiring board, for example, and in particular, an apparatus for soldering when the heat capacity of the rigid printed wiring board is large, and It is about the method.

  The printed wiring board and the flexible printed wiring are heated by pressing with a heater chip from above the flexible printed wiring board so that the connecting terminal of the flexible printed wiring board is placed on the connecting terminal of the printed wiring board. Devices and methods for directly soldering the connection terminals of each board are known. It is also known to preheat the soldering apparatus with a heating mechanism (for example, Patent Document 1).

JP 2004-247403 A

By providing the heating mechanism in this way, it is possible to solder a printed wiring board having a large heat capacity, but the preheating time is set to a temperature at which the preheating temperature becomes appropriate by the heating mechanism, for example, about 50 seconds. It was determined empirically, and it was a fixed time unrelated to the soldering target.
For this reason, if a certain amount of time does not elapse after reaching a preheating temperature sufficient to solder the flexible printed wiring board and the connection terminal of the printed wiring board by heating while applying pressure with the heater chip, There was a drawback that soldering was not performed and the tact time was long. It is also possible to provide a new temperature measurement unit in the pulse heat power supply that supplies current to heat the heater chip, detect the temperature and solder it, but this method requires modification of the pulse heat power supply. However, there was a drawback that the cost would be high.
The present invention has been made to solve the above problems, and provides a soldering apparatus that can shorten the tact time by measuring the temperature of a printed wiring board and operating a heater chip based on this temperature. The second object is to provide a soldering method using this soldering apparatus.

  A soldering apparatus according to the present invention is a soldering apparatus for soldering a connection terminal of a flexible printed wiring board to a connection terminal of the rigid printed wiring board provided with a heating means on a mounting base of the rigid printed wiring board, Before starting, soldering is started when the temperature of the rigid printed wiring board placed on the mounting table is measured and the temperature obtained by the measuring means exceeds a predetermined temperature. It is characterized by this.

  Further, the soldering method according to the present invention is a soldering method for soldering the connection terminal of the flexible printed wiring board to the connection terminal of the rigid printed wiring board while heating the mounting board of the rigid printed wiring board, It is equipped with measuring means for measuring the temperature of the rigid printed wiring board placed on the mounting table before attaching, and soldering is started when the temperature obtained by this measuring means exceeds a predetermined temperature It is characterized by doing.

According to the first aspect of the present invention, the temperature of the rigid printed wiring board is measured, and soldering is started when the temperature exceeds a predetermined temperature. A soldering apparatus for soldering connection terminals of a wiring board can be provided.

  According to the invention of claim 2, the temperature of the rigid printed wiring board is measured, and soldering is started when a predetermined temperature is exceeded. A soldering method for soldering connection terminals of a flexible printed wiring board can be provided.

Next, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic diagram of a soldering apparatus according to the present invention, and a soldering target is a state in which soldering is performed with a connecting terminal of a flexible printed wiring board facing a connecting terminal of a rigid printed wiring board. 2 is a partially enlarged view centering on a soldered portion of the rigid printed wiring board and the flexible printed wiring board shown in FIG. 1, and FIG. 3 is a connection terminal of the rigid printed wiring board using the soldering apparatus. It is a flowchart figure which shows the general | schematic process when making a connection terminal oppose and soldering.

  1 and 2, reference numeral 1 denotes a base, 2 denotes a column standing on the base, 3 denotes a reflow head (hereinafter also simply referred to as a head), which is provided on the slide rail 5 provided on the column 2 and the head 3. The slide block 4 is attached to the column 2 so as to be movable up and down. 6 is a motor that moves the head 3 up and down by a ball screw 6a and a nut 3a, 7 is a heater chip that heats by instantaneously flowing a large current and melts the solder by this heat, and 8 is embedded in the base 1 In this soldering apparatus, the heating unit preheats a part having a large heat capacity such as a rigid printed wiring board.

  10 is a rigid printed wiring board, 10a is a connection terminal formed on the rigid printed wiring board 10, 11 is a flexible printed wiring board connected to the rigid printed wiring board 10, and 11a is a connection formed on the flexible printed wiring board 11. Terminals 13, 13 are solder applied to the surfaces of the connection terminals 10a and 11a by appropriate means, 14 is a pulse heat power source for generating a large current to be supplied to the heater chip 7, and 16 is a head by rotation of the motor 6. 3 is a control unit that detects the load of the head 3, detects the load of the head 3, adjusts the appropriate load, and controls the current and drive timing of the pulse heat power supply 14.

  21 is a protective member that covers the thermocouple for measuring the temperature of the rigid printed wiring board. The thermocouple 31 is sandwiched between almost the end portions 21a of the protective member 21, and the head 3 is lowered so that the tip of the thermocouple 31 is rigid printed wiring. Even when pressed against the plate 10, the thermocouple 31 is secured with a constant pressing force at this load, and is provided with a bellows portion 21b that can be expanded and contracted to some extent in the vertical direction in the figure. It is prevented from being applied to 31 and protects the thermocouple 31 from damage.

Next, the soldering operation of such a soldering apparatus will be described with reference to FIGS.
[Condition setting]
Before starting soldering, the following conditions necessary for the control unit 16 are set (S201 in FIG. 3).
The surface temperature T1 of the base 1 (temperature lower than the melting temperature of the solder) due to the heating of the heating unit 8 that preheats the rigid printed wiring board 10, the connection terminals 10a of the rigid printed wiring board 10 to be soldered and the flexible print Heating is performed by the pressing force P1 of the overlapping portion of the wiring board 11 with the connection terminal 11a, the duration t1 of the pressing force P1, and the temperature of the base 1 that determines the timing of current flow to generate heat after the pressing. As a result, the surface temperature T2 of the rigid printed wiring board 10 that rises, the heat generation temperature T3 of the heater chip 7 necessary for soldering (temperature higher than the melting temperature of the solder), the duration t2, and the soldering location are cooled. For example, the cooling time t3 (t1> (t2 + t3)) required for solidification.

[Soldering operation]
After setting such required conditions, the actual soldering operation is started.
First, a heating command is output from the control unit 16 to the heating unit 8 to cause the heating unit 8 to generate heat, and the surface temperature of the base 1 at this time is feedback-controlled so that the surface temperature T1 of the base 1 is set. Next, the base 1 is heated by the heat generated by the heating unit 8 (S202 in FIG. 3).

Next, the rigid printed wiring board 10 is placed at a predetermined position of the base 1 so that the connection terminal 10a is on the upper side (S203 in FIG. 3).
Subsequently, the flexible printed wiring board 11 is placed on the lower side of the rigid printed wiring board 10 while the connecting terminals 10a of the rigid printed wiring board 10 and the connecting terminals 11a of the flexible printed wiring board 11 are positioned so as to overlap each other. (S204 in FIGS. 2 and 3).

  In this state, a drive signal and a rotation angle are sent from the control unit 16 to the motor 6, and the head 3 is lowered by the rotation of the motor 6. This rotation angle will be described later. At this time, since the rotation angle information from the encoder built in the motor 6 is fed back to the control unit 16, the control unit 16 can know that the motor 6 has rotated as instructed.

  In this way, the motor 6 is rotated to lower the head 3 and the heater chip 7 and the protection member 21 (thermocouple 31) disposed below the head 3 are lowered to cause the rigid printed wiring board 10 and the flexible print. The overlapping portion of the connection terminals 10 a and 11 a with the wiring board 11 is pressed by the heater chip 3 and the thermocouple 31 is pressed against the surface of the rigid printed wiring board 10.

At this time, the pressing force from the heater chip 7 to the overlapping portion is detected by a pressure detection element such as a load cell built in the head 3, and the temperature of the rigid printed wiring board 10 is detected by the thermocouple 31. Feedback.
The control unit 16 determines the rotation angle of the motor 6 by performing feedback control so that the pressure detection value matches the set pressing force P1, and rotates the motor 6 so that the rotation angle becomes the same, thereby overlapping the connection terminals 10a and 11a. Control is performed so that the pressing force applied to the part becomes the set pressing force P1 (S205 in FIG. 3).

  At this time, the same pressing force is also applied to the protection member 21, and the same pressing force is also applied to the thermocouple 31. However, although not shown, the thermocouple 31 is supported in the head 3 so as to be movable up and down. Since the protective member 21 is provided with the bellows portion 21b, the pressing force is absorbed here, so the pressing force of the thermocouple 31 to the rigid printed wiring board 10 is applied to the overlapping portion. Small compared to the pressing force. For this reason, the thermocouple 31 and the clamping part 21a of the thermocouple 31 are not damaged as described above.

  On the other hand, the controller 16 measures the surface temperature of the rigid printed wiring board 10 detected by the thermocouple 31 (S206 in FIG. 3). Then, the measured value is compared with the surface temperature T2 of the rigid printed wiring board that determines the timing of passing a current to the set heater chip. When the measured value exceeds the set surface temperature T2, the pulse heat power supply 14 is connected to the heater chip. 7 and a duration t2 of this temperature are output (Yes in S207 of FIG. 3).

  Upon receiving this command, the pulse heat power supply 14 causes a current to flow through the heater chip 7 so that the temperature T3 is set during the time t2 when the heater chip 7 is set (S208 in FIG. 3). This current is obtained by detecting the temperature of the heater chip 7 from a thermocouple (not shown) disposed on the heater chip 7 and performing feedback control so that the detected temperature becomes the set temperature T3. .

  The temperature T3 of the heater chip 7 melts the solders 13 and 13 applied to the connection terminals 10a and 11a of the overlapped portion, so that they are united. Then, this state continues for the set time (t2).

  Thus, after the current is passed through the heater chip 7 for a set time (t2), after the heater chip 7 is held at the temperature T3, when the energization is stopped, the temperature of the heater chip 7 starts to decrease. The temperature also decreases, and the solders 13 and 13 once melted finally solidify. Here, rotation information and a drive command are given from the control unit 16 to the motor 6, the motor 6 is driven, the head 3 is raised and returned to the original position, and the load on the overlapping portion is released. In this way, the soldering between the connection terminals of the rigid printed wiring board 10 and the flexible printed wiring board is completed.

Overview of the soldering apparatus according to the present invention A partially enlarged view centered on the soldered part of the rigid printed wiring board and flexible printed wiring board of FIG. Flow chart of soldering

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 Support | pillar 3 Reflow head 4 Slide block 5 Slide rail 6 Motor 7 Heater chip 8 Heating part 10 Rigid printed wiring board 11 Flexible printed wiring board 16 Control part 21 Protection member 31 Thermocouple

Claims (2)

A soldering device for soldering the connecting terminal of the rigid printed wiring board and the connecting terminal of the flexible printed wiring board, each having a heating means on a mounting table for the rigid printed wiring board,
Comprising measuring means for measuring the temperature of the rigid printed wiring board placed on the mounting table before soldering;
A soldering apparatus, wherein soldering is started when a temperature obtained by the measuring means exceeds a predetermined temperature. A soldering method for soldering a connection terminal of a flexible printed wiring board to a connection terminal of the rigid printed wiring board while heating a mounting table of the rigid printed wiring board,
Comprising measuring means for measuring the temperature of the rigid printed wiring board placed on the mounting table before soldering;
A soldering method characterized by starting soldering when the temperature obtained by the measuring means exceeds a predetermined temperature.

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