JP2010050210A - Connection terminal component and electronic component - Google Patents

Connection terminal component and electronic component Download PDF

Info

Publication number
JP2010050210A
JP2010050210A JP2008211818A JP2008211818A JP2010050210A JP 2010050210 A JP2010050210 A JP 2010050210A JP 2008211818 A JP2008211818 A JP 2008211818A JP 2008211818 A JP2008211818 A JP 2008211818A JP 2010050210 A JP2010050210 A JP 2010050210A
Authority
JP
Japan
Prior art keywords
connection terminal
terminal component
hole
component
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008211818A
Other languages
Japanese (ja)
Inventor
Atsushi Ninomiya
淳 二宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to JP2008211818A priority Critical patent/JP2010050210A/en
Publication of JP2010050210A publication Critical patent/JP2010050210A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of attaching/detaching a connection terminal component even after a package is assembled. <P>SOLUTION: The electronic component 1 includes: a base 20 having a through-hole 21; and the connection terminal component 10 fixed to the base 20 and electrically connected to the base 20. The connection terminal component 10 has: a head portion 11 protruding from a principal surface of the base 20 and functioning as a connection terminal; and a fixed portion 12 extended from the head portion 11 and inserted into the through-hole 21 to threadably engage with the through-hole 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、接続端子部品、及び前記接続端子部品が搭載された電子部品に関する。   The present invention relates to a connection terminal component and an electronic component on which the connection terminal component is mounted.

従来、複数のはんだバンプが二次元的に配置された面を有する電子部品として、フリップチップにおいてバンプ接続されるＢＧＡ（Ball Grid Array）パッケージや、はんだバンプがＢＧＡパッケージよりもさらに狭ピッチで配置されたＣＳＰ （Chip Size Package）などが知られている。   Conventionally, as an electronic component having a surface on which a plurality of solder bumps are two-dimensionally arranged, a BGA (Ball Grid Array) package that is bump-connected in a flip chip, or solder bumps are arranged at a narrower pitch than a BGA package. CSP (Chip Size Package) is known.

複数のはんだバンプは、一般的に、リフローと呼ばれる工程を経て基板表面に接合される。リフローとは、電子部品のはんだバンプと基板表面に設けられたランド（通常、基板表面にクリームはんだにより印刷される）とを接触させ、基板を加熱し、これによりバンプ等を溶融させてはんだ付け（接合）する工程をいう。   The plurality of solder bumps are generally bonded to the substrate surface through a process called reflow. In reflow, solder bumps of electronic components and lands (usually printed with cream solder on the substrate surface) are brought into contact with the solder bumps, and the substrate is heated, thereby melting the bumps and soldering. The process of joining.

図５に、一般的なＢＧＡパッケージの概略模式図を示す。ＢＧＡパッケージ１５０は、ボールバンプ１１１、電極パッド１１２、プリント配線板等の基体１２０、半導体チップ１３０、ボンディングワイヤ１３１、モールド樹脂１４０等を備えている。ボールバンプ１１１は、ボールマウンタ（不図示）等を用いて電極パッド１１２上に載置され、熱処理によりはんだボールを溶融せしめることにより形成される。熱処理温度は、はんだの溶融温度以上で行う。   FIG. 5 shows a schematic diagram of a general BGA package. The BGA package 150 includes a ball bump 111, an electrode pad 112, a substrate 120 such as a printed wiring board, a semiconductor chip 130, a bonding wire 131, a mold resin 140, and the like. The ball bump 111 is placed on the electrode pad 112 using a ball mounter (not shown) or the like, and is formed by melting the solder ball by heat treatment. The heat treatment temperature is higher than the melting temperature of the solder.

特許文献１においては、ボールバンプに代わる接続端子部品として、コーン形状（錘体形状）のコーングリッドアレイ（ＣＧＡ）が提案されている。図６に、特許文献１に記載のコーン（接続端子部品）の模式図を示す。接続端子部品２１０は、同図に示すように、錐体状の頭部（ヘッド部）２１１と、固定部（固設部）２１２とから構成されている。固設部２１２は、略Ｏ状の開口部２１５が中央部に設けられ、付勢力が発生するように左右に膨らみ２１２ｂが設けられている。   Patent Document 1 proposes a cone-shaped (weight-shaped) cone grid array (CGA) as a connection terminal component that replaces a ball bump. FIG. 6 shows a schematic diagram of a cone (connection terminal component) described in Patent Document 1. The connection terminal component 210 includes a cone-shaped head (head portion) 211 and a fixed portion (fixed portion) 212 as shown in FIG. The fixed portion 212 has a substantially O-shaped opening 215 at the center, and is provided with bulges 212b on the left and right so as to generate a biasing force.

図７（ａ）に、接続端子部品２１０の挿着過程の断面図を、図７（ｂ）に、接続端子部品２１０の離脱過程の断面図を示す。まず、絶縁基板２２０にスルーホール２２１を穿設し、その上面とば口２２２ａ、内周面２２２ｂ、及び下面とば口２２２ｃに銅メッキ２２３を施す。次いで、接続端子部品２１０のヘッド部２１１を吸着可能な保持部材２３０によって保持し、絶縁基板２２０のスルーホール２２１に先端２１４から挿入し、上面とば口２２２ａの銅メッキ２２３に、接続端子部品２１０のヘッド部２１１の下面２１３が当接するまで押し込む。   FIG. 7A shows a cross-sectional view of the connection terminal component 210 insertion process, and FIG. 7B shows a cross-sectional view of the connection terminal component 210 removal process. First, a through hole 221 is formed in the insulating substrate 220, and copper plating 223 is applied to the upper surface and the inner surface 222b, and the lower surface and the outer surface 222c. Next, the head portion 211 of the connection terminal component 210 is held by an adsorbable holding member 230, inserted from the tip 214 into the through hole 221 of the insulating substrate 220, and connected to the copper plating 223 of the top surface 222 a on the connection terminal component 210. Until the lower surface 213 of the head portion 211 comes into contact.

一方、接続端子部品２１０を離脱させる際には、図７（ｂ）に示すように、抜きピン工具２４０を絶縁基板２２０の挿着側とは反対側の主面から挿入し、接続端子部品２１０の先端２１４の先端面に当接して押し込むことにより抜き取る。
特開２００４−３２７５７３号公報 On the other hand, when detaching the connection terminal component 210, as shown in FIG. 7B, the extraction pin tool 240 is inserted from the main surface opposite to the insertion side of the insulating substrate 220, and the connection terminal component 210 is removed. It is removed by abutting against the tip surface of the tip 214 and pushing it in.
JP 2004-327573 A

図５のような従来例に係るＢＧＡパッケージにおいては、ボールバンプ１１１を取り付け後にボールバンプ１１１の部分的な修正や交換を行うことは困難であった。これは、ボールバンプの着脱には、再度の加熱工程を必要とするためである。   In the BGA package according to the conventional example as shown in FIG. 5, it is difficult to partially correct or replace the ball bump 111 after the ball bump 111 is attached. This is because a second heating process is required to attach and detach the ball bumps.

上記特許文献１の方法によれば、図７に示すように、接続端子部品２１０は絶縁基板２２０に対して着脱自在である。従って、接続端子部品２１０の部分的な修正や交換を行うことが可能である。しかしながら、接続端子部品２１０を離脱させるためには接続端子部品２１０の挿入側とは反対側から抜きピン工具２４０を挿入する必要があるため、接続端子部品２１０の離脱は、抜きピン工具２４０が挿入できる段階であるパッケージ組立前に限られていた。   According to the method of Patent Document 1, the connection terminal component 210 is detachable from the insulating substrate 220 as shown in FIG. Accordingly, the connection terminal component 210 can be partially corrected or replaced. However, in order to detach the connection terminal part 210, it is necessary to insert the extraction pin tool 240 from the side opposite to the insertion side of the connection terminal part 210. Therefore, the removal of the connection terminal part 210 is performed by the extraction pin tool 240. It was limited before the assembly of the package, which is a possible stage.

本発明に係る電子部品は、スルーホールを有する基体と、前記基体に固設され、前記基体と電気的に接続される接続端子部品とを備え、前記接続端子部品は、前記基体の主面から突出し、接続端子として機能するヘッド部と、前記ヘッド部から延在され、前記スルーホールに挿入されて、当該スルーホールと螺合するおねじが形成された固設部とを有するものである。   An electronic component according to the present invention includes a base body having a through hole, and a connection terminal part fixed to the base body and electrically connected to the base body. The connection terminal part is formed from a main surface of the base body. A head portion that protrudes and functions as a connection terminal, and a fixed portion that extends from the head portion, is inserted into the through hole, and is formed with a male screw that is screwed into the through hole.

本発明に係る電子部品によれば、接続端子部品と基体との固定を、接続端子部品に設けたおねじと基体のスルーホールとを螺合させることにより行っているので、一方向から接続端子部品の着脱を行うことができる。従って、パッケージ組立後においても、接続端子部品を離脱させることが可能である。   According to the electronic component of the present invention, the connection terminal component and the base are fixed by screwing the male screw provided in the connection terminal component and the through hole of the base, so that the connection terminal can be viewed from one direction. Parts can be attached and detached. Accordingly, it is possible to remove the connection terminal parts even after the package is assembled.

本発明によれば、パッケージ組立後においても、接続端子部品を着脱可能な電子部品を提供することができるという優れた効果を有する。   According to the present invention, there is an excellent effect that it is possible to provide an electronic component in which the connection terminal component can be attached and detached even after the package is assembled.

以下、本発明を適用した実施形態の一例について説明する。なお、本発明の趣旨に合致する限り、他の実施形態も本発明の範疇に属し得ることは言うまでもない。   Hereinafter, an example of an embodiment to which the present invention is applied will be described. It goes without saying that other embodiments may also belong to the category of the present invention as long as they match the gist of the present invention.

［実施形態１］
本発明に係る接続端子部品は、ＢＧＡパッケージや、ＣＳＰなどに適用されるボールバンプに代わる接続端子として好適に適用することができるものである。無論、ＢＧＡパッケージやＣＳＰ以外の接続端子にも好適に適用することができる。本発明に係る電子部品は、前記接続端子部品が基体に固設された電子部品全般を云い、例えば、プリント配線基板に半導体チップが搭載されたＢＧＡパッケージ、ＣＳＰ等のＬＳＩパッケージである。 [Embodiment 1]
The connection terminal component according to the present invention can be suitably applied as a connection terminal in place of a ball bump applied to a BGA package, a CSP, or the like. Of course, it can be suitably applied to connection terminals other than BGA packages and CSPs. The electronic component according to the present invention is a general electronic component in which the connection terminal component is fixed to a base, and is, for example, an LSI package such as a BGA package or a CSP in which a semiconductor chip is mounted on a printed wiring board.

図１（ａ）に、本実施形態に係る接続端子部品の模式図を示す。図中の上側の図が上面図であり、下側の図が正面図である。接続端子部品１０は、ボールバンプと同様の役割を担うヘッド部１１、基板に対する固設部としての機能を担う固設部１２を備える。同図に示すように、ヘッド部１１は、略球状であり、固設部１２は、おねじ（ねじ溝、ねじ山）が形成されている。ヘッド部１１の上面側から見た円形状の直径ｄは、特に限定されるものではないが、ＢＧＡパッケージやＣＳＰに適用されるボールバンプの直径と同等の大きさとすることができる。   FIG. 1A is a schematic diagram of a connection terminal component according to this embodiment. The upper diagram in the figure is a top view, and the lower diagram is a front view. The connection terminal component 10 includes a head portion 11 that plays the same role as the ball bump and a fixed portion 12 that functions as a fixed portion for the substrate. As shown in the figure, the head portion 11 is substantially spherical, and the fixed portion 12 is formed with a male screw (screw groove, screw thread). The circular diameter d viewed from the upper surface side of the head portion 11 is not particularly limited, but may be the same size as the diameter of a ball bump applied to a BGA package or CSP.

接続端子部品１０は、導電性を有し、接続端子部品としての十分な機械的強度を有するものであれば特に限定されない。例えば、はんだ、Ａｕ，Ｎｉ、Ｃｕ、Ａｇ、その他の金属、又は合金などを好適に適用することができる。ヘッド部１１と固設部１２は、同一材料により一体的に形成してもよいし、異なる材料のユニットを接合してもよい。固設部１２は、固設機能を発揮する観点から、機械的強度の高い材料であることが好ましい。接続端子部品１０の一部に非導通体があってもよい。   The connection terminal component 10 is not particularly limited as long as it has conductivity and has sufficient mechanical strength as the connection terminal component. For example, solder, Au, Ni, Cu, Ag, other metals, or alloys can be suitably applied. The head portion 11 and the fixed portion 12 may be integrally formed of the same material, or units of different materials may be joined. The fixed portion 12 is preferably a material having high mechanical strength from the viewpoint of exerting a fixed function. A part of the connection terminal component 10 may have a non-conductive body.

ヘッド部１１の上面側からみた形状は、円形状に限定されるものではなく、例えば、正方形状等の多角形状であってもよい。接続端子部品１０の挿抜工具（不図示）を係合させるための溝などの係合部をヘッド部１１のサイド部などに設けていてもよい。   The shape seen from the upper surface side of the head portion 11 is not limited to a circular shape, and may be, for example, a polygonal shape such as a square shape. An engaging portion such as a groove for engaging with an insertion / extraction tool (not shown) of the connection terminal component 10 may be provided on the side portion of the head portion 11 or the like.

図１（ｂ）〜（ｄ）に、接続端子部品の変形例を示す。図１（ｂ）に示すように、ヘッド部１１ａが楕円形状であってもよい。これにより、接続端子部品１０の厚み方向を小さくし、電子部品の小型化に寄与することができる。また、図１（ｃ）に示すように、ヘッド部１１ｂが円柱形状であってもよい。さらに、図１（ｄ）に示すように、ヘッド部１１ｄが図１（ｃ）の円柱形状の中央部に凸部を備える構造体であってもよい。その他、本発明の趣旨を逸脱しない範囲において、ヘッド部は、円錐形状、多角錐形状、ピン形状、Ｖ溝構造等の種々の形状とすることができる。   1 (b) to 1 (d) show modified examples of connection terminal parts. As shown in FIG.1 (b), the head part 11a may be elliptical shape. Thereby, the thickness direction of the connection terminal component 10 can be made small, and it can contribute to size reduction of an electronic component. Moreover, as shown in FIG.1 (c), the head part 11b may be cylindrical. Furthermore, as shown in FIG.1 (d), the head part 11d may be a structure provided with a convex part in the column-shaped center part of FIG.1 (c). In addition, the head portion can have various shapes such as a conical shape, a polygonal pyramid shape, a pin shape, and a V-groove structure without departing from the spirit of the present invention.

図２（ａ）に、接続端子部品１０のヘッド部１１側からみた電子部品１の部分拡大平面図を、図２（ｂ）に、図２（ａ）の切断部断面図を示す。但し、図２（ｂ）においては、ヘッド部１１が下側になるように図示している。また、図３に、接続端子部品１０の基体２０への挿抜方法を説明するための模式的断面図を示す。なお、図２（ｂ）及び図３の断面図において、説明の便宜上、接続端子部品１０は切断部断面図とせずに図示している。   2A is a partially enlarged plan view of the electronic component 1 as viewed from the head portion 11 side of the connection terminal component 10, and FIG. 2B is a cross-sectional view of the cut portion of FIG. However, in FIG. 2B, the head portion 11 is illustrated on the lower side. FIG. 3 is a schematic cross-sectional view for explaining a method of inserting / removing the connection terminal component 10 to / from the base body 20. In FIG. 2B and FIG. 3, for convenience of explanation, the connection terminal component 10 is shown without being a cut-away section view.

電子部品１において、図２（ａ）に示すように、基体２０に複数の接続端子部品１０がアレイ状に固設されている。基体は、プリント配線板等の絶縁性の基板を好適に適用することができる。基体２０には、接続端子部品１０の固設部１２を挿入するための貫通孔であるスルーホール２１が形成されている（図３参照）。スルーホール２１の内周面、及び下面とば口２２には、メッキ２３が施されている。メッキ２３は、例えば、銅メッキとすることができる。そして、メッキ２３の表面にはめねじ（不図示）が形成されている。   In the electronic component 1, as shown in FIG. 2A, a plurality of connection terminal components 10 are fixed to the base 20 in an array. As the substrate, an insulating substrate such as a printed wiring board can be suitably applied. A through hole 21 that is a through hole for inserting the fixing portion 12 of the connection terminal component 10 is formed in the base 20 (see FIG. 3). The inner peripheral surface of the through hole 21, the lower surface and the opening 22 are plated 23. The plating 23 can be, for example, copper plating. An internal thread (not shown) is formed on the surface of the plating 23.

接続端子部品１０の基体２０への取り付けは、まず、基体２０にスルーホール２１を穿設し、その内周面及び下面とば口２２にメッキを施す。メッキ材としては、導電特性を有し、その表面にめねじが形成できるものであれば特に限定されない。例えば、銅を用いることができる。次いで、メッキ２３表面に工具等を用いてめねじを形成する。めねじをスルーホール２１に直接形成し、その後にメッキ２３を施してもよい。   To attach the connection terminal component 10 to the base body 20, first, through holes 21 are formed in the base body 20, and the inner peripheral surface, the lower surface, and the opening 22 are plated. The plating material is not particularly limited as long as it has conductive characteristics and a female screw can be formed on the surface thereof. For example, copper can be used. Next, a female screw is formed on the surface of the plating 23 using a tool or the like. A female screw may be formed directly in the through hole 21 and then plated 23.

その後、接続端子部品１０を基体２０に取り付けるために、図３に示すように、スルーホール２１に接続端子部品１０の固設部１２を挿入し、メッキ２３の表面に設けられためねじ（不図示）に固設部１２のおねじを螺合させる。ヘッド部１１の底面１３が下面とば口２２に当接するまで、挿抜工具（不図示）を用いてスルーホール２１内に固設部１２を挿入する。挿抜工具としては、特に限定されないが、例えば、接続端子部品１０のヘッド部１１をゴム部材などにより挟持して圧着することにより保持し、回し込み可能な装置を適用することができる。   Thereafter, in order to attach the connection terminal component 10 to the base body 20, as shown in FIG. 3, the fixing portion 12 of the connection terminal component 10 is inserted into the through hole 21 and is provided on the surface of the plating 23. ) Is screwed with the external thread of the fixed portion 12. The fixed portion 12 is inserted into the through hole 21 using an insertion / extraction tool (not shown) until the bottom surface 13 of the head portion 11 contacts the bottom surface and the opening 22. Although it does not specifically limit as an insertion / extraction tool, For example, the apparatus which can be hold | maintained by pinching and crimping | bonding the head part 11 of the connecting terminal component 10 with a rubber member etc. can be applied.

ヘッド部１１の底面１３、及び固設部１２の表面と、スルーホール２１の表面及び下面とば口２２に設けられたメッキ２３との当接により、接続端子部品１０と基体２０とが電気的に接続される。なお、接続端子部品１０と基体２０とが電気的に接続されていればよく、必ずしも上記領域すべてにおいて電気的に接続されていなくてもよい。例えば、下面とば口２２にメッキを施さずに、スルーホール内のみにメッキ２３を施し、接続端子部品１０の固設部１２によりメッキ２３との電気的接続を図ってもよい。   The connection terminal component 10 and the base body 20 are electrically connected to each other by contact of the bottom surface 13 of the head portion 11 and the surface of the fixed portion 12 with the surface 23 and the bottom surface of the through hole 21 and the plating 23 provided on the opening 22. Connected to. Note that the connection terminal component 10 and the base body 20 need only be electrically connected, and may not necessarily be electrically connected in the entire region. For example, the lower surface and the opening 22 may be plated without plating, and the plating 23 may be plated only in the through hole, and electrical connection with the plating 23 may be achieved by the fixed portion 12 of the connection terminal component 10.

固設部１２の先端１４を、基体２０のスルーホールの孔径よりも小さくしているので、接続端子部品１０を基体２０に挿入する際のガイドとして機能し、接続端子部品１０のスルーホール２１への挿着を容易に行うことができる。なお、固設部１２の先端１４は、必ずしも円錐形状とする必要はなく、固設部１２の直径を同一とした円柱形状であってもよい。これにより、基体２０のスルーホール２１との接触面積を増やし、基体２０への接続端子部品１０の導電特性や固定強度をより効果的に高めることができる。   Since the distal end 14 of the fixed portion 12 is made smaller than the hole diameter of the through hole of the base body 20, it functions as a guide when the connection terminal component 10 is inserted into the base body 20, and enters the through hole 21 of the connection terminal component 10. Can be easily inserted. Note that the tip 14 of the fixed portion 12 does not necessarily have a conical shape, and may have a cylindrical shape with the same diameter of the fixed portion 12. Thereby, the contact area with the through hole 21 of the base 20 can be increased, and the conductive characteristics and fixing strength of the connection terminal component 10 to the base 20 can be more effectively increased.

接続端子部品１０を基体２０に取り付け後、設計変更、若しくは接続不良等により、接続端子部品１０を基体２０から除去する場合には、挿抜工具により、ねじを緩めることにより機械的に取り外すことができる。熱処理を行わないので、隣接する接続端子部品への負荷を与えることなしに取り外すことができる。また、本実施形態の方法によれば、リフロー工程が不要のため、従来のボールバンプによるおいて生じていた圧着不良や溶着不良という問題もない。   When the connection terminal part 10 is removed from the base 20 due to a design change or a connection failure after the connection terminal part 10 is attached to the base 20, it can be mechanically removed by loosening a screw with an insertion / extraction tool. . Since no heat treatment is performed, it can be removed without applying a load to the adjacent connection terminal parts. In addition, according to the method of the present embodiment, since the reflow process is not required, there is no problem of poor crimping or poor welding that has occurred due to the conventional ball bump.

図５の例のようなＢＧＡパッケージにおいては、実装基板にパッケージを実装する際、未使用のボールバンプはＶＤＤやＧＮＤとして利用していた。本実施形態によれば、パッケージ組立後において必要性がなければ接続端子部品１０を取り外すことができる。そして、接続端子部品１０を外したスペースにおいて、実装基板の配線性を向上させることが可能となる。また、従来のＢＧＡパッケージにおいては、パッケージ組立後に、パッケージ内のチップでＶＤＤとＧＮＤの接続ミス、設計ミスがあった場合にチップを修正するか実装基板の配線をカットすることにより対処していた。本実施形態によれば、接続端子部品１０を取り外すことにより対応可能であるため、実装基板を無駄にすることがない。   In the BGA package as in the example of FIG. 5, when the package is mounted on the mounting substrate, the unused ball bumps are used as VDD or GND. According to this embodiment, the connection terminal component 10 can be removed if there is no need after the assembly of the package. And in the space which removed the connection terminal component 10, it becomes possible to improve the wiring property of a mounting board. Further, in the conventional BGA package, when there is a connection error or a design error between VDD and GND in a chip in the package after the assembly of the package, the chip is corrected or the wiring of the mounting board is cut. . According to the present embodiment, since it is possible to cope by removing the connection terminal component 10, the mounting board is not wasted.

接続端子部品１０を取り外した基体２０には、図４に示すように、非導通体のキャップ３０を取り付けてもよい。キャップ３０は、図４に示すように、おねじが形成された固設部３２、フラット形状のヘッド部３１を備える。これにより、導電特性を有するスルーホール２１の露出をなくし、実装時等にスルーホール２１内に半田等が付着するのを防止することができる。   As shown in FIG. 4, a non-conductive cap 30 may be attached to the base body 20 from which the connection terminal component 10 has been removed. As shown in FIG. 4, the cap 30 includes a fixed portion 32 formed with a male screw and a flat head portion 31. Thereby, it is possible to eliminate the exposure of the through hole 21 having conductive characteristics and prevent the solder or the like from adhering to the through hole 21 during mounting or the like.

上記特許文献１においては、抜きピン工具２４０を、接続端子部品２１０の挿入側とは反対側の主面から差し込む必要があるため、パッケージ組立後においては、接続端子部品２１０の着脱を行うことができなかった。本実施形態によれば、接続端子部品１０の基体２０への固定をねじにより行い、接続端子部品１０の着脱を一方向から行う構成としたので、パッケージ組立後であっても接続端子部品１０の基体からの着脱を自在に行うことができる。従って、従来のボールバンプの接続工程順を変更し、パッケージ組立後に接続端子部品１０の実装を行うことも可能であり、プロセス自由度を高めることができる。また、パッケージ組立後に接続端子部品１０の設置の変更が可能であるため、少量多品種の製造にも適している。   In Patent Document 1, since it is necessary to insert the extraction pin tool 240 from the main surface opposite to the insertion side of the connection terminal component 210, the connection terminal component 210 can be attached and detached after the assembly of the package. could not. According to the present embodiment, the connection terminal component 10 is fixed to the base body 20 with screws, and the connection terminal component 10 is attached and detached from one direction. It can be freely detached from the substrate. Therefore, it is possible to change the order of the conventional ball bump connection process and mount the connection terminal component 10 after the assembly of the package, thereby increasing the degree of freedom of the process. Further, since the installation of the connection terminal component 10 can be changed after the assembly of the package, it is also suitable for manufacturing a small variety of products.

また、本実施形態においては、従来のボールバンプのようにリフロー工程を含まないので、熱ストレス等の問題が生じない。なお、本発明においてリフロー工程を排除するものではなく、求められるニーズや用途に応じてリフロー工程を行ってもよい。この場合、接続端子部品１０の着脱が不要となった段階でリフロー工程を行うようにすれば、本発明の効果を得ることができる。リフロー工程を行うことにより、接続端子部品１０とメッキ２３との接続をより確実、かつ強固に行うことができるので、接続端子部品１０の固設部１２の長さを短く設定することも可能である。   In addition, in this embodiment, since a reflow process is not included unlike the conventional ball bump, problems such as thermal stress do not occur. In the present invention, the reflow process is not excluded, and the reflow process may be performed according to required needs and applications. In this case, the effect of the present invention can be obtained if the reflow process is performed at the stage where the connection terminal component 10 is not required to be attached or detached. By performing the reflow process, the connection terminal component 10 and the plating 23 can be more reliably and firmly connected. Therefore, the length of the fixed portion 12 of the connection terminal component 10 can be set short. is there.

上記図５に示すようなボールバンプを用いた接続端子部品においては、リフロー工程等においてボールバンプに位置ずれが発生するという問題があったが、本実施形態によれば、固設部１２とヘッド部１１が固定されているので、ヘッド部１１の位置ずれが生じることがない。従って、隣接する接続端子部品間でショート等が発生するのを防止することができる。また、パッドとボールバンプの機能を一体的な接続端子部品としているので、これらの接続不良が生じない。   The connection terminal part using the ball bump as shown in FIG. 5 has a problem that the ball bump is displaced in the reflow process or the like. According to the present embodiment, the fixed portion 12 and the head Since the part 11 is fixed, the positional deviation of the head part 11 does not occur. Therefore, it is possible to prevent a short circuit from occurring between adjacent connection terminal components. Further, since the function of the pad and the ball bump is an integral connection terminal part, these connection failures do not occur.

また、本実施形態に係るヘッド部１１は、必ずしも球状とする必要はなく、前述したように、種々の形状とすることができる。そのため、ニーズに応じて種々の形状を適用することができる。また、上記特許文献１のように付勢力により固設する場合に比して、接続端子部品１０自体の機械的強度を高めることができる。   In addition, the head portion 11 according to the present embodiment does not necessarily have a spherical shape, and can have various shapes as described above. Therefore, various shapes can be applied according to needs. Moreover, compared with the case where it fixes with urging | biasing force like the said patent document 1, the mechanical strength of connecting terminal component 10 itself can be raised.

さらに、本発明に係る接続端子部品によれば、ワイヤ・ボンディング方式に比して、配線の長さが短いため電気特性に優れ、高速化や高密度化に対応できる。また、ＣＳＰに適用する場合、半導体チップの真下にもピンを二次元的に配置できるため数千ピンという多ピン化が容易である。   Furthermore, according to the connection terminal component according to the present invention, since the length of the wiring is short as compared with the wire bonding method, the electrical characteristics are excellent, and it is possible to cope with high speed and high density. In addition, when applied to CSP, pins can be two-dimensionally arranged directly under the semiconductor chip, so that it is easy to increase the number of pins to several thousand pins.

なお、基体２０に設けるスルーホール２１が貫通孔である例について説明したが、貫通していないものであってもよい。本実施形態によれば、接続端子部品１０の着脱を同部品の挿入側のみから行っているので、スルーホールを貫通構造としない態様においても適用可能である。   In addition, although the example in which the through hole 21 provided in the base body 20 is a through hole has been described, the through hole 21 may not be penetrated. According to the present embodiment, since the connection terminal component 10 is attached and detached only from the insertion side of the component, the present invention can also be applied to an embodiment in which the through hole does not have a through structure.

（ａ）は、実施形態に係る接続端子部品の上面図と正面図、（ｂ）〜（ｄ）は、実施形態又は変形例に係る接続端子部品の上面図と正面図。(A) is the top view and front view of the connection terminal component which concern on embodiment, (b)-(d) is the top view and front view of the connection terminal component which concern on embodiment or a modification. （ａ）は、実施形態に係る電子部品の模式的平面図、（ｂ）は図２（ａ）のＩＩｂ−ＩＩｂ切断部断面図。(A) is a typical top view of the electronic component which concerns on embodiment, (b) is IIb-IIb cutting part sectional drawing of Fig.2 (a). 実施形態に係る接続端子部品の挿抜方法を説明するための模式図。The schematic diagram for demonstrating the insertion / extraction method of the connection terminal component which concerns on embodiment. 実施形態に係る電子部品の模式的断面図。1 is a schematic cross-sectional view of an electronic component according to an embodiment. 従来例に係るＢＧＡパッケージの模式図。The schematic diagram of the BGA package which concerns on a prior art example. 特許文献１に記載の接続端子部品の模式図。The schematic diagram of the connection terminal component of patent document 1. FIG. （ａ）は、特許文献１に記載の接続端子部品の挿着方法の説明図、（ｂ）は、同文献の接続端子部品の離脱方法の説明図。(A) is explanatory drawing of the insertion method of the connection terminal component of patent document 1, (b) is explanatory drawing of the removal method of the connection terminal component of the literature.

符号の説明Explanation of symbols

１ 電子部品
１０ 接続端子部品
１１ ヘッド部
１２ 固設部
２０ 基体
２１ スルーホール
２２ 下面とば口
２３ メッキ DESCRIPTION OF SYMBOLS 1 Electronic component 10 Connection terminal component 11 Head part 12 Fixing part 20 Base | substrate 21 Through hole 22 Bottom face 23

Claims (6)

スルーホールを有する基体と、
前記基体に固設され、前記基体と電気的に接続される接続端子部品とを備え、
前記接続端子部品は、前記基体の主面から突出し、接続端子として機能するヘッド部と、
前記ヘッド部から延在され、前記スルーホールに挿入されて、当該スルーホールと螺合するおねじが形成された固設部とを有する電子部品。 A substrate having a through hole;
A connection terminal component fixed to the base and electrically connected to the base;
The connection terminal component protrudes from the main surface of the base body and functions as a connection terminal; and
An electronic component having a fixed portion that extends from the head portion, is inserted into the through hole, and has a male screw that is screwed into the through hole. 前記スルーホールの内周面にメッキが施されていることを特徴とする請求項１に記載の電子部品。   The electronic component according to claim 1, wherein the inner peripheral surface of the through hole is plated. 前記スルーホールの内周面に、前記固設部と螺合するめねじが形成されていることを特徴とする請求項１又は２に記載の電子部品。   The electronic component according to claim 1, wherein a female screw that is screwed into the fixed portion is formed on an inner peripheral surface of the through hole. 前記接続端子部品は、前記基体の一主面上にアレイ状に形成されていることを特徴とする請求項１〜３のいずれか１項に記載の電子部品。   The electronic component according to claim 1, wherein the connection terminal component is formed in an array on one main surface of the base. スルーホールを有する基体の主面から突出し、接続端子として機能するヘッド部と、
前記ヘッド部から延在され、前記スルーホールに挿入されて、当該スルーホールと螺合するおねじが形成された固設部とを備える接続端子部品。 A head portion protruding from the main surface of the base body having a through hole and functioning as a connection terminal;
A connection terminal component comprising: a fixed portion that extends from the head portion, is inserted into the through hole, and is formed with a male screw that is screwed into the through hole. 前記ヘッド部の形状が、概略球状であることを特徴とする請求項５に記載の接続端子部品。   The connection terminal component according to claim 5, wherein the shape of the head portion is substantially spherical.
JP2008211818A 2008-08-20 2008-08-20 Connection terminal component and electronic component Pending JP2010050210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008211818A JP2010050210A (en) 2008-08-20 2008-08-20 Connection terminal component and electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008211818A JP2010050210A (en) 2008-08-20 2008-08-20 Connection terminal component and electronic component

Publications (1)

Publication Number Publication Date
JP2010050210A true JP2010050210A (en) 2010-03-04

Family

ID=42067073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008211818A Pending JP2010050210A (en) 2008-08-20 2008-08-20 Connection terminal component and electronic component

Country Status (1)

Country Link
JP (1) JP2010050210A (en)

Similar Documents

Publication Publication Date Title
US8105002B2 (en) Weld assembly
US6224392B1 (en) Compliant high-density land grid array (LGA) connector and method of manufacture
JP5500870B2 (en) Substrate with connection terminal and socket for electronic parts
JP2018174017A (en) socket
JP2008277525A (en) Substrate with pin as well as wiring substrate and semiconductor device
JP2005512335A (en) Ball grid array package
US20110014827A1 (en) Lead pin for package substrate
JP2006210852A (en) Circuit board with surface-mounting circuit component, and its manufacture
JP2018174018A (en) socket
JP2006261565A (en) Electronic functional component mounted body and its manufacturing method
US8125081B2 (en) Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these
JP2015173005A (en) Circuit board and manufacturing method of the same
US6830177B2 (en) Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
JP2010050210A (en) Connection terminal component and electronic component
JP2010278069A (en) Arranging method of connection terminal
JP2008263001A (en) Electronic component mounting structure and electronic component mounting method
JP2009038192A (en) Manufacturing method of semiconductor device, and interposer
JP2007027701A (en) Wiring board
JP2007157745A (en) Circuit device
JP2000091380A (en) Flip-chip mounting structure
JP2009231467A (en) Board unit, electronic apparatus, and board unit manufacturing method
US20150262957A1 (en) Semiconductor package
JP2007180255A (en) Printed wiring board and substitutive pad
JP2010251354A (en) Electronic circuit board
JP2011035211A (en) Component mounting module, component mounting module built-in wiring board, and method of manufacturing component mounting module built-in wiring board