JP2010044955A - Lamp with socket, and lamp device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamp with socket for suppressing displacement of a burner, and a lamp device. <P>SOLUTION: The lamp with socket includes a metal band 7 installed at the outer face of a burner 1 supported by a metal support member 9 formed in a socket 8, and the burner 1 and the socket 8 are integrated. An oxidized layer is formed on the surface of the metal band 7, and its depth is 10 nm or more. Furthermore, an oxidized layer is formed also on the surface of the metal support member 9 and it is desirable that its depth is 15 nm or more. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lamp with a socket and a lamp device used for a headlamp of an automobile.

  In general, a lamp with a socket used for an automobile headlamp or the like is used in a state where a burner and a socket are integrated. For the connection between the burner and the socket, a metal band provided on the outer surface of the burner is held by a metal holding piece protruding from the socket, as described in Japanese Patent Publication No. 10-502770 (hereinafter referred to as Patent Document 1). The structure is known.

Japanese National Patent Publication No. 10-502770

  This lamp with a socket is required to have little burner displacement even when vibration is applied. This is because when the burner is displaced, the position with respect to the reflector or the like is shifted, which affects the light distribution. However, in the lamp with a socket as in Patent Document 1, a light distribution failure due to the displacement of the burner has been reported, and a lamp with a socket in which the burner is difficult to displace is demanded.

  The objective of this invention is providing the lamp | ramp with a socket which can suppress the displacement of a burner.

  In order to achieve the above object, in the lamp with a socket according to the present invention, a metal band provided on the outer surface of the burner is held on a metal holding piece formed on the socket, and the burner and the socket are integrated. In the lamp with a socket, an oxide layer is formed on the surface of the metal band, and the depth thereof is 10 nm or more.

  According to the present invention, the displacement of the burner can be suppressed.

(First embodiment)
Below, the lamp with a socket of one embodiment of the present invention is explained with reference to drawings. FIG. 1 is a cross-sectional view for explaining a lamp with a socket according to a first embodiment of the present invention, FIG. 2 is a side view for explaining the lamp with a socket according to the first embodiment, and FIG. It is a figure for demonstrating the state which looked at the lamp with a socket of 1st Embodiment from the front end side.

  The lamp with a socket shown in the figure is a so-called D4 type HID lamp used for an automobile headlamp, and has a burner 1 as a main part. The burner 1 is composed of an inner tube 2 and an outer tube 3.

  The inner tube 2 is an elongated glass member made of quartz glass. Near the center, a substantially elliptical light emitting portion 21 is formed. A plate-like seal portion 22 is continuously formed at both ends of the light emitting portion 21, and a cylindrical portion 24 is continuously formed at both ends via a boundary portion 23.

Inside the light-emitting portion 21, central substantially cylindrical shape, both ends in tapered ^discharge space 25 of the volume of 20mm ³ ~30mm 3 is formed. The discharge space 25 is filled with a discharge medium composed of a metal halide 4 composed of halides of sodium, scandium, zinc, and indium and xenon having a pressure of 13 atm or higher at room temperature (25 ° C.). . Mercury is not included.

  The electrode mount 5 is sealed to the seal portion 22. The electrode mount 5 includes a metal foil 51, an electrode 52, a coil 53, and a lead wire 54.

  The metal foil 51 is a thin metal plate made of molybdenum.

  The electrode 52 is a triated tungsten electrode (a tungsten electrode doped with thorium oxide). One end thereof is connected to the light emitting portion 21 side end portion of the metal foil 51, and the other end is maintained within the discharge space 25 with an inter-electrode distance of 4.0 mm to 4.4 mm in terms of appearance. Are arranged to face each other. As the electrode material, pure tungsten, doped tungsten, rhenium tungsten, or the like can be used.

  The coil 53 is a metal wire made of doped tungsten, and is wound spirally around the axis of the shaft portion of the electrode 52 sealed to the seal portion 22.

  The lead wire 54 is a metal wire made of molybdenum. One end thereof is connected to the metal foil 51 so as to face the electrode 52, and the other end is extended to the outside of the inner tube 2 along the tube axis. Among these, a support wire 55 is connected to a lead wire 54 extending to the front end side of the lamp. The support wire 55 is an L-shaped metal wire made of nickel, and a sleeve 6 made of ceramic is attached to a portion parallel to the inner tube 2.

  The outer tube 3 is a cylindrical glass member obtained by adding oxides such as titanium, cerium, and aluminum to quartz glass, and a part thereof is welded in the vicinity of the cylindrical portion 24 located at the front and rear ends of the inner tube 2. By doing so, they are connected so as to be concentric with the inner tube 2. By this connection, the space between the inner tube 2 and the outer tube 3 is kept airtight, and an inert gas having a pressure of 0.3 atm or less is sealed in the airtight space.

  A metal band 7 having a thickness of about 0.5 mm is attached to the outer peripheral surface on the rear end side of the burner 1 configured as described above. The metal band 7 is provided with first and second projecting portions 71 and 72 and a loop portion 73. The first and second projecting portions 71 and 72 are portions that are formed so as to project substantially perpendicularly to the outer surface of the burner 1, and the respective surfaces are joined by welding. The loop portion 73 is a portion for absorbing play with respect to the burner 1 and is formed as a pair at a location of ± 90 ° around the circumference from the first and second projecting portions 71 and 72. Further, the surface of the metal band 7 is oxidized, and the depth of the oxide layer is set to 10 nm or more. For the metal band 7, it is desirable to use a metal material mainly composed of iron such that the ratio of iron is 65% or more. For example, SUS430 (iron 82%, chromium 18% alloy) or SUS304 (iron 74). %, Chromium 18%, nickel 8%) and the like are suitable.

  A socket 8 made of PPS resin containing glass fibers is disposed on the rear end side of the burner 1. The socket 8 is formed with an opening 81, a bottom terminal 82, and a side terminal 83. The opening 81 is a space located on the front end side, and one end of the burner 1 is inserted therein. The bottom terminal 82 is a metal terminal located on the bottom and the side terminal 83 is located on the side, to which a lead wire 54 and a support wire 55 are connected, respectively.

  The socket 8 is formed with four metal holding pieces 9 having a thickness of about 0.5 mm at equal intervals. One end of the metal holding piece 9 is fixed near the opening 81 by press-fitting or embedding, and the other end protrudes toward the front end and radially inward, and a part of the protruding portion is an outer peripheral surface of the metal band 7. It is connected to the. Further, the surface of the metal holding piece 9 is oxidized, and the depth of the oxide layer is set to 15 nm or more. The metal holding piece 9 is preferably made of the same metal as the metal band 7.

  Here, a method of connecting the burner 1 and the socket 8 will be described.

  First, after arranging the metal band 7 along the outer peripheral surface of the burner 1, the first and second protrusions 71 and 72 are welded, and the metal band 7 is attached to the burner 1. Thereafter, the metal band 7 is heat-treated. As this heat treatment, for example, a method capable of selectively heating the metal band 7 such as a gas burner is desirable, and the heating condition is a condition in which an oxide layer having a depth of 10 nm or more is formed on the surface of the metal band 7. If it is. By this heat treatment, the metal band 7 is tightened tightly, so that the displacement of the burner 1 can be suppressed. That is, before the heat treatment, as shown in FIG. 4A, there are few contact points between the burner 1 and the metal band 7, and in particular, there are gaps S near the first and second protrusions 71 and 72 and the loop part 73. Because it is formed, deviation and rotation of the burner 1 are likely to occur. However, after the heat treatment, as shown in (b), the gap S is reduced and the number of contact points is increased, so that deviation of the burner 1 is suppressed. can do.

  On the other hand, the socket 8 is similarly heat-treated. This heat treatment is preferably a method in which the socket 8 and the metal holding piece 9 can be heated, such as heating by an electric furnace, and the heating condition is that an oxide layer having a depth of 15 nm or more is formed on the surface of the metal holding piece 9. As long as the conditions are met. By this heat treatment, the metal holding piece 9 is baked and hardened, the elastic force is reduced, and it becomes difficult to be deformed even when a mechanical force is applied, so that the displacement of the burner 1 can be suppressed. Moreover, since the impure gas contained in the resin of the socket 8 can be released by this heat treatment, various problems in the mounting state on the lighting device can be prevented.

  Then, after inserting the rear end side of the burner 1 into the opening 81 of the socket 8, the tip end portions of the four metal holding pieces 9 and the outer peripheral surface of the metal band 7 are contacted, and then the contact portions are laser welded. Thus, the connection between the metal band 7 and the metal holding piece 9 is completed. As described above, the lamp with the socket in which the burner 1 and the socket 8 are integrated with each other makes it difficult for the burner 1 to be displaced even when vibration is applied, so that the influence on the light distribution and the like can be reduced.

Here, the depth of the metal oxide layer can be measured by analyzing the metal surface by XPS (X-ray photoelectron spectroscopy) and then converting it to SiO ₂ . Specifically, using the depth direction analysis function of an XPS apparatus manufactured by Alpha Backphi, X-ray: monochromatic Al Kα, detection area: 100 μm, detection angle: 45 °, ion beam: Ar ion, acceleration voltage: After analyzing the surface of the metal under the condition of ₂ kV, it is converted to SiO ₂ to obtain data as shown in FIG. Then, from the figure, a point α where iron and iron oxide cross each other is searched, and the sputter depth of this point α is defined as the oxide layer depth in the present invention. For example, in the metal band 7 of the present invention shown in FIG. 5, the depth of the oxide layer is about 12.5 nm. In addition to iron and iron oxide, the metal in FIG. 5 also includes chromium and chromium oxide, and there is a crossing point β, but in a metal material mainly composed of iron, The point β is not particularly considered.

One specification of the embodiment of the lamp with socket of the present invention is shown below.
(Example)
Burner 1: outer diameter = 9.0 mm,
Metal band: SUS430, surface oxide layer depth = 12 nm,
Socket 8: made of PPS resin containing glass fiber,
Metal holding piece 9: made of SUS430, surface oxide layer depth = 20 nm.

  A glass ball displacement test defined in JIS C 7506-2 was performed using the lamp of this example and the conventional lamp in which the metal band 7 and the metal holding piece 9 were not heat-treated. As a result, the burner 1 was displaced by 0.2 mm or more with respect to the socket 8 in the conventional lamp, whereas the lamp in the example was displaced by only about 0.1 mm. It has been found that the displacement of 1 is improved.

  Next, a test was performed in which the depth of the oxide layer from the surface of the metal band 7 was changed to measure the amount of displacement of the burner. The result is shown in FIG. In this test, a metal holding piece 9 having an oxide layer depth of 20 μm was used.

  As can be seen from the results, the displacement amount decreases as the depth of the oxide layer increases, and the displacement amount is remarkably improved at 10 nm or more, and the displacement amount can be kept low at 12 nm or more. Therefore, the depth of the oxide layer of the metal band 7 is preferably 10 nm or more, and more preferably 12 nm or more. However, if the depth of the oxide layer of the metal band 7 is increased, the metal band 7 is too tightly bonded to the burner 1 and the glass may be broken. Therefore, the depth is 25 nm or less. Is desirable.

  Next, a test for measuring the amount of displacement of the burner by changing the depth of the oxide layer from the surface of the metal holding piece 9 was performed. The result is shown in FIG. In this test, a metal band 7 whose surface was hardly oxidized was used.

  As can be seen from the results, the amount of displacement decreases as the depth of the oxide layer increases, and the amount of displacement is remarkably improved at 15 nm or more, and further, the amount of displacement can be kept low at 20 nm or more. Therefore, the depth of the oxide layer of the metal holding piece 9 is preferably 15 nm or more, and more preferably 20 nm or more. However, if the depth of the oxide layer of the metal holding piece 9 is increased, the elasticity is lost and the metal holding piece 9 is easily broken, and when the heat treatment is applied to the entire socket 8, the socket 8 is melted. The depth is preferably 30 nm or less.

  Therefore, in the present embodiment, the metal holding piece 9 formed on the socket 8 holds the metal band 7 provided on the outer surface of the burner 1, and the lamp with the socket in which the burner 1 and the socket 8 are integrated. In FIG. 5, an oxide layer is formed on the surface of the metal band 7, and when the depth is 10 nm or more, the gap between the burner 1 and the metal band 7 is reduced, and the metal band 7 can be strongly tightened. Therefore, the displacement of the burner 1 can be suppressed even when vibration is applied. In addition, an oxide layer is also formed on the surface of the metal holding piece 9, and the depth is 15 nm or more, so that the metal is baked and hardened and the elasticity becomes weak. Can be further suppressed.

(Second Embodiment)
FIG. 8 is a diagram for explaining a lamp device according to a second embodiment of the present invention. About each part of this 2nd Embodiment, about each part of 2nd Embodiment and the following embodiments, the same part as each part of the lamp with a socket of 1st Embodiment is shown with the same code | symbol, and the description Is omitted.

  The lamp device includes a lamp 101 with a socket, a reflector 102, a light shielding plate 103, a lens 104, and an igniter 105.

  As described in detail in the first embodiment, the lamp 101 with the socket holds the metal band 7 provided on the outer surface of the burner 1 on the metal holding piece 9 formed on the socket 8. 8 is integrated.

  The reflector 102 is a parabolic metal member provided to reflect light generated by the lamp 101 with the socket. Openings are formed at the front and rear ends, and the socket 8 is fixed to the rear end opening in a state where the burner 1 of the lamp 101 with the socket is inserted.

  The light shielding plate 103 is a metal member provided to form a desired light distribution (cut line), and is disposed substantially vertically from the bottom of the reflector 102.

  The lens 104 is a convex lens provided to collect the light reflected by the reflector 102 to form a desired light distribution, and is arranged at the opening on the tip side of the reflector 102.

  The igniter 105 is a circuit provided for applying a high voltage to the lamp at the time of starting and causing a dielectric breakdown between the electrodes. The igniter 105 is connected to the bottom side of the socket 8 of the lamp 101 with the socket, The side terminal 83 is electrically connected. The igniter 105 is connected to a ballast (not shown) for supplying power to the lamp via a wiring. From this ballast, for example, about 35 W is supplied to the lamp when it is stable, and about 75 W, which is twice or more that when the start is stable, is supplied to the lamp.

  In such a lamp device, when the burner 1 is displaced due to vibration or the like, the position of the light emitting unit 21 with respect to the reflector 102 changes, and thus a light distribution failure of the lamp device occurs. Since the burner 1 is difficult to displace, the influence of the light distribution of the lamp device due to the displacement of the burner 1 can be reduced.

  The embodiment of the present invention is not limited to the above, and for example, the following changes may be made.

  In the present embodiment, the metal band 7 and the metal holding piece 9 are connected after the heat treatment is performed in separate steps, but the heat-treated metal band 7 and the unheated metal holding piece 9 are connected. After that, the entire lamp is heat treated, or the entire lamp is heat treated after the unheat-treated metal band 7 and the metal holding piece 9 are connected to each other. May be formed.

Sectional drawing for demonstrating the lamp with a socket of the 1st Embodiment of this invention. The side view for demonstrating the lamp with a socket of 1st Embodiment. The figure for demonstrating a state when the lamp with a socket of 1st Embodiment is seen from the front end side. The figure for demonstrating the mounting state of the metal band before and behind heat processing. The figure for demonstrating the metal state of the depth direction of the metal band of this invention. The figure for demonstrating the displacement amount when changing the depth of the oxide layer of a metal band. This is for explaining the amount of displacement when the depth of the oxide layer of the metal band is changed. The figure for demonstrating the lamp device of the 2nd Embodiment of this invention.

Explanation of symbols

1 Burner 2 Inner tube 3 Outer tube 7 Metal band 8 Socket 9 Metal holding piece

Claims (6)

In the lamp with the socket in which the metal band provided on the outer surface of the burner is held on the metal holding piece formed on the socket, and the burner and the socket are integrated,
A lamp with a socket, wherein an oxide layer is formed on a surface of the metal band, and the depth thereof is 10 nm or more.   The metal band has first and second protrusions protruding substantially perpendicular to the outer surface of the burner, and the first and second protrusions are surface joined. The lamp with a socket according to claim 1.   3. The lamp with socket according to claim 1, wherein the oxide layer is formed by heating the metal band after the metal band is provided on the burner. 4.   The lamp with a socket according to any one of claims 1 to 3, wherein an oxide layer is formed on a surface of the metal holding piece and the depth thereof is 15 nm or more.   The lamp with socket according to any one of claims 1 to 4, wherein the metal band and the metal holding piece are made of a material mainly composed of iron. A lamp with a socket in which the burner according to any one of claims 1 to 5 and a socket are integrated;
A reflector holding the socketed lamp so that the burner is disposed inside;
And a lighting circuit connected to the socket.

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