JP2010042468A5 - - Google Patents
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- Publication number
- JP2010042468A5 JP2010042468A5 JP2008207678A JP2008207678A JP2010042468A5 JP 2010042468 A5 JP2010042468 A5 JP 2010042468A5 JP 2008207678 A JP2008207678 A JP 2008207678A JP 2008207678 A JP2008207678 A JP 2008207678A JP 2010042468 A5 JP2010042468 A5 JP 2010042468A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- load
- control means
- polishing load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008207678A JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008207678A JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010042468A JP2010042468A (ja) | 2010-02-25 |
| JP2010042468A5 true JP2010042468A5 (https=) | 2011-07-28 |
Family
ID=42014269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008207678A Withdrawn JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010042468A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102398213B (zh) * | 2011-05-11 | 2014-06-18 | 上海双明光学科技有限公司 | 反压式双面研磨抛光机 |
| CN104772692A (zh) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | 一种上盘万向调心加载机构 |
| JP7560320B2 (ja) * | 2020-10-29 | 2024-10-02 | 株式会社ディスコ | ウェーハの研削方法 |
-
2008
- 2008-08-12 JP JP2008207678A patent/JP2010042468A/ja not_active Withdrawn
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