JP2010041213A - Solid-state image pickup device, method for manufacturing the same, and electronic appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which a dust absorption part is formed without increasing the number of manufacturing processes. <P>SOLUTION: A camera module 1 includes curable adhesive 10 applied on a support part of a transparent board 4 in a center holder 5. The curable adhesive 10 includes a curable region C where the curable adhesive applied on a mounting part of the transparent board 4 in the support part 11 is cured and a non-curable region S where the curable adhesive 10 applied on a peripheral part of the mounting part is not cured. The center holder 5 holds an optical structure 6 provided with a lens barrel 8 and a focus adjustment mechanism 9. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device capable of forming a dust adsorbing portion that adsorbs dust generated during manufacturing and use without increasing manufacturing steps, a manufacturing method thereof, and an electronic apparatus.

  An imaging camera module (solid-state imaging device) used for a mobile phone or the like includes a solid-state imaging device (CCD (charge-coupled device) or CMOS (complementary metal-oxide semiconductor) sensor IC (integrated circuits)), an infrared filter, And a module in which a wiring board having terminals, a lens, and a lens holder are integrated. In recent years, in order to cope with the downsizing of the camera module, the manufacturing process of the solid-state imaging device has been miniaturized. When the camera module is further miniaturized, an image defect occurs due to minute dust (for example, 25 μm or more) existing on the optical path. The image defect occurs because the shadow of the dust is projected on the imaging screen as a black spot or a spot.

  Such dust causing image defects is, for example, one that was originally attached when the components of the camera module were received, or one that was generated by dust generation during the manufacturing process. Here, the dust adhering at the time of arrival is often a minute resin piece. On the other hand, dust generated by dust generation during the manufacturing process is often metal. This metal is generated by wear of the camera module manufacturing apparatus.

If the dust generated in this way adheres to the optical path, the dust can be removed during the shipping inspection included in the manufacturing process of the camera module. However, dust temporarily attached to portions other than the optical path cannot be detected at the time of shipping inspection and is shipped as a non-defective product. For this reason, if vibration or impact is applied in the process of transporting the camera module after shipment, dust adhering to a portion other than the optical path moves and adheres to the optical path. As a result, an image defect occurs at the shipping destination (user origin; for example, the seller of the camera-equipped mobile phone).
Conventionally, as one countermeasure against such image defects, when components of the camera module are delivered, dust already attached to the components is screened. Depending on the degree of dust adhesion, dust is blown off using air blow, water cleaning using ultrasonic waves, or HFE (Hydrofluoroether) cleaning is performed.
On the other hand, attempts have been made to increase the cleanliness of the production line in order to prevent dust adhering to the components of the camera module due to dust generation during the production process. For example, manufacturing is performed in a clean room that is blocked from the outside world.

  In this case, however, capital investment, maintenance management, and manufacturing process maintenance (device cleaning and replacement of worn parts) are required. That is, enormous costs are required for the installation of clean rooms, the investment in air circulation equipment (air curtain, air circulation, filtration equipment, cleaning equipment), and the maintenance of these equipment. Moreover, as described above, even when dust is prevented from being mixed when the camera module is assembled in the clean room, there is a possibility that dust is generated inside the camera module even when the camera module is used recently. For this reason, it is no longer sufficient to remove the dust by ensuring the cleanliness of the manufacturing process.

Therefore, Patent Document 1 proposes a method for adsorbing dust on grease as a countermeasure against such dust. FIG. 8 is a cross-sectional view illustrating a part of the solid-state imaging device 100 described in Patent Document 1. As shown in FIG. 8, in the solid-state imaging device 100, the grease 101 that adsorbs the dust D is applied to the wall surface or the like in the optical structure, thereby preventing image defects due to the dust D during the manufacturing process and during use. . In the solid-state imaging device 100, since the grease 101 is applied so as to avoid the optical path, it is possible to reduce image defects due to adhesion of dust D on the optical path.
JP 2008-85511 A (published March 19, 2008)

  However, in the configuration of Patent Document 1, a step of applying grease is separately required during the manufacturing process of the solid-state imaging device in order to prevent image defects due to dust adhesion. For this reason, there exists a problem that a manufacturing process inevitably increases.

  Such an increase in the production process leads to a reduction in production efficiency in all aspects such as production capacity, production cost and quality control.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a solid-state imaging device capable of forming a dust adsorbing portion without increasing manufacturing steps, a manufacturing method thereof, and an electronic device. It is in.

In order to solve the above-described problems, a solid-state imaging device of the present invention has an optical structure that forms a subject image, a solid-state imaging device that converts the subject image into an electrical signal, an optical structure, and a solid-state imaging device inside. A sensor holder that is housed in a transparent substrate disposed between the optical structure and the solid-state imaging device and supported by the sensor holder;
In the solid-state imaging device in which the space in which the optical structure and the solid-state imaging element are arranged is partitioned by the transparent substrate,
A curable adhesive is applied to the support portion of the transparent substrate in the sensor holder,
In the curable adhesive, the curable adhesive applied to the mounting portion of the transparent substrate in the support portion is cured, and the curable adhesive applied to the peripheral portion of the mounting portion is not cured. It is characterized by having a non-hardened region.

  According to said invention, the curable adhesive is apply | coated to the support part of the transparent substrate in a sensor holder. The curable adhesive has a cured region where the curable adhesive is cured and a non-cured region that is not cured.

  The cured region is a region where the curable adhesive applied to the mounting portion of the transparent substrate on the support portion is cured. In the curing region, the transparent substrate is bonded onto the support portion by curing the curable adhesive. That is, the curable adhesive in the cured region functions as an adhesive portion of the transparent substrate.

  On the other hand, the non-cured region is a region where the curable adhesive applied to the periphery of the mounting portion of the transparent substrate on the support portion is not cured. For this reason, the curable adhesive in the non-cured region has viscosity. Thereby, even if dust is generated during manufacture or use, the generated dust can be adsorbed to the non-cured region. That is, the curable adhesive in the non-cured region functions as a dust adsorbing portion.

  Thus, according to said invention, a curable adhesive is utilized not only as an adhesive of a transparent substrate but as a dust adsorption part. For this reason, the adhesion part and dust adsorption part of a transparent substrate can be formed simultaneously. That is, it is not necessary to provide a separate process for forming the dust adsorbing portion. Therefore, it is possible to provide a solid-state imaging device capable of forming a dust adsorbing portion without increasing the manufacturing process.

  In the solid-state imaging device according to the present invention, the curable adhesive is preferably a photocurable adhesive.

  According to said invention, since a curable adhesive is a photocurable adhesive, a photocurable adhesive can be hardened by light irradiation. Accordingly, the curing operation can be easily performed.

  In the solid-state imaging device according to the present invention, the photocurable adhesive is preferably an ultraviolet curable adhesive.

  According to said invention, since a photocurable adhesive is an ultraviolet curable adhesive, hardening time can be shortened. Therefore, the hardened region and the non-hardened region can be formed in a short time.

  In the solid-state imaging device according to the present invention, the optical structure includes an imaging lens, a lens barrel that holds the lens, and a focus adjustment mechanism that adjusts the focus of the lens by moving the lens barrel in the optical axis direction. It is preferable to provide.

  According to the above invention, the optical structure includes the focus adjustment mechanism that adjusts the focus of the lens. Here, the focus adjustment mechanism is an optical mechanism such as autofocus, zoom, or macro. When such a focus adjustment mechanism operates, dust is likely to be generated.

  According to the above invention, even if dust is generated by the operation of the focus adjustment mechanism, the generated dust can be adsorbed to the non-cured region. Therefore, image defects due to dust can be prevented.

  In the solid-state imaging device according to the present invention, it is preferable that the non-cured region is formed below a contact portion between the lens barrel and the focus adjustment mechanism.

  The contact portion between the lens barrel and the focus adjustment mechanism is particularly liable to generate dust during the operation of the focus adjustment mechanism. According to said invention, the non-hardened area | region is formed in the lower part (directly below) of the place where dust is easy to generate | occur | produce in this way. Thereby, the dust which fell from the contact part of a lens barrel and a focus adjustment mechanism can be adsorbed immediately after dropping. Therefore, dust can be effectively adsorbed to the non-cured region.

In order to solve the above problems, a method for manufacturing a solid-state imaging device according to the present invention includes an optical structure that forms a subject image, a solid-state imaging device that converts the subject image into an electrical signal, a solid-state imaging while holding the optical structure. A sensor holder that houses the element, and a transparent substrate that is disposed between the optical structure and the solid-state imaging element and supported by the sensor holder;
In the method for manufacturing a solid-state imaging device in which a space in which the optical structure and the solid-state imaging element are arranged is partitioned by the transparent substrate,
An application step of applying a curable adhesive to the support portion of the transparent substrate in the sensor holder;
A curing step of curing the curable adhesive,
The curing step is characterized in that the curable adhesive applied to the mounting portion of the transparent substrate in the support portion is cured while the curable adhesive applied to the peripheral portion of the mounting portion is not cured.

  According to the invention, in the curing step, by selectively curing the curable adhesive, there are a cured region in which the curable adhesive is cured and a non-cured region in which the curable adhesive is not cured. It is formed.

  That is, in the curing step, among the curable adhesive applied on the support portion of the transparent substrate in the sensor holder, the curable adhesive applied to the mounting portion of the transparent substrate on the support portion is selectively cured. . Thereby, the hardening area | region of a curable adhesive is formed and a transparent substrate is adhere | attached on a support part. That is, a hardened region that is an adhesive portion of the transparent substrate is formed.

  On the other hand, in the curing step, the curable adhesive applied to the peripheral portion of the mounting portion of the transparent substrate on the support portion is not cured. Thereby, the non-hardened area | region of a curable adhesive is formed. For this reason, even if dust is generated during production or use, the generated dust can be adsorbed to the non-cured region. That is, a non-cured region that becomes a dust adsorbing portion is formed.

  Thus, according to said invention, the adhesion part (hardening area | region) and dust adsorption part (non-hardening area | region) of a transparent substrate are formed simultaneously by a hardening process. For this reason, it is not necessary to provide the process of forming a dust adsorption part separately. Therefore, it is possible to manufacture a solid-state imaging device capable of forming a dust adsorbing portion without increasing the manufacturing process.

  In order to solve the above problems, an electronic apparatus of the present invention includes any one of the solid-state imaging devices. Therefore, it is possible to provide an electronic device that can form a dust adsorbing portion without increasing the number of manufacturing steps.

  As described above, in the solid-state imaging device of the present invention, the curable adhesive is applied to the cured region where the curable adhesive applied to the mounting portion of the transparent substrate in the support portion is cured, and to the peripheral portion of the mounting portion. The applied curable adhesive has a non-cured region that is not cured.

  In addition, the method for manufacturing a solid-state imaging device according to the present invention cures the curable adhesive applied to the mounting portion of the transparent substrate in the support portion, while the curable adhesive applied to the peripheral portion of the mounting portion. It is a method having a curing step that does not cure.

  Therefore, it is possible to provide a solid-state imaging device capable of forming a dust adsorbing portion, a manufacturing method thereof, and an electronic device without an increase in manufacturing steps.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

(1) Solid-state imaging device of this embodiment The solid-state imaging device of this embodiment adheres a transparent substrate in a cured region of a curable adhesive and adsorbs dust in a non-cured region of a curable adhesive. The adhesive of the transparent substrate and the adsorption of dust are realized with the same curable adhesive.

  The solid-state imaging device according to this embodiment is suitable for electronic devices capable of photographing such as camera-equipped mobile phones, digital still cameras, and security cameras. In this embodiment, a camera module with an autofocus mechanism (solid-state imaging device) applied to a camera-equipped mobile phone will be described.

  FIG. 2 is a cross-sectional view of the camera module of the present embodiment. As shown in FIG. 2, the camera module 1 includes a wiring board 2, a solid-state imaging device 3, a transparent substrate 4, a sensor holder 5, and an optical structure 6, and these are integrated. Specifically, the sensor holder 5 holding the solid-state imaging device 3 and the transparent substrate 4 is mounted on the wiring board 2, and the optical structure 6 is laminated on the sensor holder 5.

  The wiring board 2 takes out an electrical signal from the solid-state imaging device 3. The wiring board 2 has a patterned wiring (not shown) for electrical connection with the solid-state imaging device 3. A solid-state image sensor 3 is mounted at the center of the wiring board 2. The wiring board 2 and the solid-state imaging device 3 are electrically connected by a bonding wire and can send and receive electrical signals to each other. The wiring board 2 is, for example, a printed board or a ceramic board.

  The solid-state imaging device 3 converts a subject image formed by the optical structure 6 into an electric signal. That is, it is a sensor device that photoelectrically converts incident light incident from the optical structure 6. A light receiving surface (not shown) in which a plurality of pixels are arranged in a matrix is formed on the surface (upper surface) of the solid-state imaging device 3. Then, the optical image formed on the light receiving surface is converted into an electrical signal and output as an analog image signal. The solid-state imaging device 3 is, for example, a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or a threshold voltage modulation image sensor (VMIS).

  On the wiring board 2, a DSP (digital signal processor) for adjusting the optical axis, a CPU that performs various arithmetic processes according to the program, a ROM that stores the program, data of each process, etc. are stored on the wiring board 2. An electronic component such as a RAM is also provided. By these, the whole camera module 1 is controlled.

  The optical structure 6 is a photographing optical system that forms a subject image. That is, the optical structure 6 is an optical system for imaging light from the subject on the solid-state imaging device 3. In the present embodiment, the optical structure 6 includes an imaging lens 7, a lens barrel (lens barrel) 8 that holds the lens 7 in the center, and the lens barrel 8 by moving the lens barrel 8 in the optical axis direction. And an autofocus unit (focus adjustment mechanism) for adjusting the angle. The optical axis of the lens 7 coincides with the central axis of the lens barrel 8.

  In this embodiment, the lens 7 is made of translucent glass or resin, and the lens barrel 8 is made of resin or metal. Further, as shown in FIG. 2, the autofocus unit 9 limits the movement range of the lens 7 and the lens barrel 8 when the lens 7 is stored in the lens barrel 8.

  The sensor holder 5 accommodates the solid-state imaging device 3 and holds the optical structure 6. The sensor holder 5 is a cylindrical member made of resin, for example, and has a space A in which the solid-state imaging device 3 is housed in the lower part and a space B in which the optical structure 6 is held in the upper part. The sensor holder 5 has a support portion 11 extending perpendicularly from the inner surface to the optical axis. The support part 11 supports the transparent substrate 4.

  The transparent substrate 4 is disposed between the solid-state imaging device 3 and the optical structure 6 and bonded to the support portion 11 of the sensor holder 5. The transparent substrate 4 covers at least the light receiving surface of the solid-state imaging device 3. In addition, the optical structure 6 and the solid-state imaging device 3 are separated by the transparent substrate 4. That is, in the camera module 1, there is a space A formed by the wiring board 2, the sensor holder 5, and the transparent substrate 4, and a space B formed by the optical structure 6, the sensor holder 5, and the transparent substrate 4. , Partitioned by the transparent substrate 4. As a result, the solid-state imaging device 3 is sealed in the space A. The transparent substrate 4 is made of, for example, translucent glass or resin. An optical filter such as an infrared cut filter may be formed on the transparent substrate 4 (the surface facing the lens 7).

  Such imaging by the camera module 1 is performed when the solid-state imaging device 3 takes in incident light transmitted through the lens 7 and the transparent substrate 4.

  The camera module 1 of this embodiment is a camera module with an autofocus function that includes an autofocus unit 9. Furthermore, the camera module 1 also has a macro function, and the lens barrel 8 moves (lifts and lowers) in the optical axis direction by operating a lever (not shown). Thereby, it is possible to switch between the normal photographing mode and the close-up mode (macro mode).

  When the autofocus function is executed, the lens barrel 8 is automatically moved so as to have an appropriate focal length. The focal length indicates the distance from the light receiving surface of the solid-state imaging device 3 to the center of the lens 7.

  On the other hand, when the macro function is executed, the lens barrel 8 moves so that the focal length for the normal photographing mode or the focal length for the close-up mode is set in advance. Specifically, FIG. 2 described above shows the camera module 1 in the normal shooting mode. FIG. 3 is a cross-sectional view showing the camera module 1 in the close-up mode. When the normal photographing mode in FIG. 2 is switched to the close-up mode (macro mode) in FIG. 3, the lens barrel 8 in FIG. 2 rises and transitions to the position of the lens barrel 8 in FIG. As a result, the focal length in the close-up mode is switched. In this way, the focal length of each mode is switched by repeating the states of FIGS.

  Here, when the mode is switched, for example, at the time of transition to the state of FIGS. 2 to 3, a frictional portion F between the lens barrel 8 and the autofocus unit 9 occurs as shown in FIG. 3. For this reason, with use of the camera module 1, dust is generated from the friction portion F and dust D is generated. Similarly, dust D is generated from the friction portion F when the autofocus function is executed.

  Moreover, in the camera module 1, in addition to the dust D generated from the friction portion F, there is also dust D originally attached in the camera module 1. That is, there is dust D that is mixed in the camera module 1 during the manufacturing process and has not been detected at the time of shipping inspection. For this reason, when vibration or impact is applied to the camera module 1, the dust D moves in the camera module 1.

  As described above, there is a possibility that the camera module 1 generates the dust D generated from the friction portion F during use (the dust D during use) and the dust D mixed during the manufacturing process (the dust D during manufacturing). is there. When such dust D adheres to the optical path, the shadow of the dust D that has adhered is projected on the imaging screen as black dots or spots. That is, the dust D adhering to the optical path causes image defects.

  Therefore, in the camera module 1 of this embodiment, such dust D is attached to the curable adhesive. 4 is a cross-sectional view of the periphery of the sensor holder 5 of the camera module 1 of FIG. FIG. 5 is an enlarged cross-sectional view of the periphery of the support portion 11 of the sensor holder 5 of FIG.

  As shown in FIG. 4, a curable adhesive 10 is applied to the support portion 11 of the sensor holder 5. The transparent substrate 4 is bonded onto the support portion 11 by the curable adhesive 10.

  As shown in FIG. 5, the curable adhesive 10 has a cured region C in which the curable adhesive 10 is cured and a non-cured region S that is not cured. The cured region C is a region where the curable adhesive 10 applied to the mounting portion of the transparent substrate 4 on the support portion 11 is cured. On the other hand, the non-curing region S is a region where the curable adhesive 10 applied to the periphery of the mounting portion is not cured. That is, in the camera module 1, the curable adhesive 10 at the contact portion with the transparent substrate 4 is cured, while the curable adhesive 10 at the non-contact portion with the transparent substrate 4 is not cured.

  Here, the curable adhesive 10 becomes an adhesive when a liquid or semi-solid substance is cured under specific conditions. Examples of the curable adhesive 10 include a photocurable adhesive that is cured by light irradiation, a thermosetting adhesive that is cured by heat, and an adhesive that is cured by the action of humidity or a catalyst. The photo-curable adhesive is, for example, an ultraviolet curable adhesive that is cured by ultraviolet irradiation, a visible light curable adhesive that is cured by visible light irradiation, an infrared curable adhesive that is cured by infrared irradiation, or an electron beam irradiation. An electron beam curable adhesive may be used. The curable adhesive 10 is preferably a photocurable adhesive, and more preferably an ultraviolet curable adhesive.

  As will be described later, when the curable adhesive 10 is a photocurable adhesive, the photocurable adhesive can be cured by light irradiation. Accordingly, the curing operation can be easily performed. On the other hand, when the curable adhesive 10 is an ultraviolet curable adhesive, the curing time can be shortened. Therefore, the hardened region and the non-hardened region can be formed in a short time.

  Since the curable adhesive 10 in the cured region C is not cured, the transparent substrate 4 is bonded onto the support portion 11. That is, the curable adhesive 10 in the cured region C functions as an adhesive portion of the transparent substrate 4.

  On the other hand, since the curable adhesive 10 in the non-cured region S is not cured, it has viscosity. For this reason, it becomes possible to make the dust D adhere to the non-cured region S. Specifically, FIG. 6 is a cross-sectional view of the camera module 1 in which the dust D is adsorbed by the non-cured region S. As described above, when the autofocus function or the macro function is executed, the lens barrel 8 and the autofocus unit 9 come into contact with each other. For this reason, dust D is generated in the friction part F. However, the curable adhesive 10 in the non-cured region S has viscosity. Thereby, even if the dust D is generated, the generated dust D can be adsorbed to the non-cured region S. Thus, the curable adhesive 10 in the non-cured region S functions as a dust adsorbing portion.

  Moreover, in the camera module 1 of the present embodiment, the non-cured region S is formed below (directly below) the contact portion between the lens barrel 8 and the autofocus unit 9 where dust D is likely to be generated. Thereby, the dust D dropped from the contact portion between the lens barrel 8 and the autofocus unit 9 can be adsorbed immediately after dropping. Therefore, dust can be effectively adsorbed to the non-cured region S.

  Thus, in the camera module 1, the curable adhesive 10 is used not only as an adhesive for the transparent substrate 4 (cured region C) but also as a dust adsorbing portion (non-cured region S). For this reason, as will be described later, the bonded portion and the dust adsorbing portion of the transparent substrate 4 can be formed simultaneously. That is, it is not necessary to provide a separate process for forming the dust adsorbing portion. Therefore, it is possible to provide the camera module 1 capable of forming the dust adsorbing portion without increasing the manufacturing process.

  In Patent Document 1, since grease is used as a dust adsorbing portion, a step of applying grease is required in addition to the step of bonding the transparent substrate. In addition, due to the properties of grease, the structural viscosity changes with temperature changes. For this reason, grease droops as the temperature rises, and it may cause image defects by being dispersed on the optical path. As a countermeasure, it has been proposed to form a weir to prevent the inflow of grease, but the possibility of grease dripping has not been solved.

  On the other hand, in the camera module 1 of the present embodiment, the curable adhesive 10 has a very low possibility of causing dripping as compared with grease. For this reason, there exists an effect which can suppress generation | occurrence | production of the image defect by disperse | distributing the curable adhesive 10 on an optical path. The viscosity adjustment of the curable adhesive in the non-cured region S can be adjusted by changing the curing conditions and components of the curable adhesive 10.

  In the present embodiment, the camera module 1 having the autofocus and macro functions has been described. However, the present invention can also be applied to a camera module that does not have a focus adjustment function such as an autofocus function. In this case as well, dust D at the time of manufacture or use can be adsorbed to the non-cured region S, and image defects can be prevented.

(2) Manufacturing method of solid-state imaging device of this embodiment Next, an example of the manufacturing method of the camera module 1 of this embodiment is demonstrated.

  The manufacturing method of the solid-state imaging device according to the present embodiment is such that the transparent substrate is fixed and dust is adsorbed in the bonding process of the transparent substrate without selectively increasing the manufacturing process by selectively curing the curable adhesive. The generation of the parts is realized simultaneously.

  FIG. 1 is a cross-sectional view showing an outline of the camera module 1 of the present embodiment. As shown in FIG. 1, the camera module 1 is manufactured by combining, for example, a separately manufactured wiring board 2 having a solid-state imaging device 3 and a sensor holder 5 holding an optical structure 6 and a transparent substrate 4. can do.

  As described above, the feature of the camera module 1 is that the hardened region C of the curable adhesive 10 is used as an adhesive portion of the transparent substrate 4 while the non-hardened region S is used as a dust adsorbing portion. Manufacturing other than the generation of the cured region C and the non-cured region S where the transparent substrate 4 is fixed by the curable adhesive 10 can be manufactured by a known method (for example, Japanese Patent Application Laid-Open No. 2002-066242). Is omitted.

  Below, the formation method of the hardening area | region C and the non-hardening area | region S which fix the transparent substrate 4 with the curable adhesive 10 is mainly demonstrated. In order to form the cured region C and the non-cured region S, an application step of applying the curable adhesive 10 to the support portion 11 of the transparent substrate 4 in the sensor holder 5, and a curing step of curing the curable adhesive 10 I do.

  Specifically, first, the curable adhesive 10 is applied to the support portion 11 of the sensor holder 5 (application process). The coating method of the curable adhesive 10 is not particularly limited, and can be performed by spray coating, tipping coating, flow coating coating, or the like.

  The application position is not particularly limited as long as it includes the mounting portion of the transparent substrate 4 and its peripheral portion. However, the curable adhesive 10 needs to be applied with a larger diameter than the transparent substrate 4 in order to make the peripheral portion of the transparent substrate 4 a non-cured region S (dust adhesion portion).

  Next, the curable adhesive 10 applied to the support portion 11 is cured (curing step). FIG. 7 is a cross-sectional view showing a curing step in the method for manufacturing the camera module 1 of the present embodiment. As shown in FIG. 7, after the curable adhesive 10 is applied to the support portion 11, the transparent substrate 4 is set on the support portion 11. Then, the curable adhesive 10 in contact with the transparent substrate 4 (area in the broken line in FIG. 7) is selectively cured. That is, conditions for the curable adhesive 10 to be cured are given only to the adhesive portion of the transparent substrate 4.

  The curing conditions of the curable adhesive 10 vary depending on the type of the curable adhesive 10. For example, when an ultraviolet curable adhesive is used as the curable adhesive 10, other regions are masked so that only the region to be cured is irradiated with ultraviolet rays. Thereby, only the curable adhesive 10 in contact with the transparent substrate 4 irradiated with ultraviolet rays can be cured, and a cured region C is formed. On the other hand, the curable adhesive 10 in the peripheral portion of the transparent substrate 4 that is not irradiated with ultraviolet rays is not cured, and a non-cured region S is formed. Therefore, in the curing step, the cured region C and the non-cured region S can be formed simultaneously. Note that a mask is not required when only a region to be cured is irradiated with ultraviolet rays in a highly directional state such as a laser.

  As described above, in the curing step, the cured region C that becomes the bonding portion of the transparent substrate 4 and the non-cured region S that becomes the dust adsorption portion are simultaneously formed. For this reason, it is not necessary to provide the process of forming a dust adsorption part separately. Accordingly, it is possible to manufacture the camera module 1 that can form the dust adsorbing portion without increasing the manufacturing process. Therefore, it is possible to easily manufacture the camera module 1 having a useful mechanism for preventing image defects due to dust adhesion.

  Moreover, when a photocurable adhesive is used as the curable adhesive 10, the curable adhesive 10 can be cured by light irradiation. For this reason, a hardening process can be performed simply. Further, when an ultraviolet curable adhesive is used as the curable adhesive 10, the curing process can be easily performed and the curing time can be shortened. Therefore, the curing process can be performed in a short time.

  In the application step, it is preferable to apply the curable adhesive 10 so that the non-cured region S is formed below (directly below) the contact portion between the lens barrel 8 and the autofocus unit 9. Thereby, it is possible to adsorb dust that has dropped from a contact portion where dust is likely to be generated, immediately after dropping. Therefore, dust can be effectively adsorbed to the non-cured region S. Even if the non-cured region S is not formed below the contact portion, dust generated when the camera module 1 is used or dust that has moved during use can be adsorbed to the non-cured region S.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The camera module of the present invention has a hardened region that serves as an adhesive portion of a transparent substrate and a non-hardened region that serves as a dust adsorbing portion. Each region can be formed simultaneously when the transparent substrate is bonded to the lens holder. Therefore, the dust adsorbing portion can be formed without increasing the manufacturing process. Therefore, it is possible to promote cost reduction by improving quality and yield.

It is sectional drawing of the camera module of this invention. It is sectional drawing which shows the time of normal imaging | photography mode of the camera module of this invention. It is sectional drawing which shows the time of close-up mode of the camera module of this invention. It is sectional drawing which shows the peripheral part of the sensor holder in the camera module of FIG. It is sectional drawing to which the support part periphery of the sensor holder of FIG. 4 was expanded. It is sectional drawing which shows the adsorption | suction state of the dust by the non-hardening area | region in the camera module of this invention. It is sectional drawing which shows the hardening process in the manufacturing method of the camera module of this invention. 1 is a cross-sectional view of a solid-state imaging device described in Patent Document 1. FIG.

Explanation of symbols

1 Camera module (solid-state imaging device)
2 Wiring board 3 Solid-state imaging device 4 Transparent substrate 5 Sensor holder 6 Optical structure 7 Lens 8 Lens barrel 9 Autofocus unit (focus adjustment mechanism)
10 Curing Type Adhesive 11 Support Part A Space B Space C Curing Area D Dust F Friction Part (Contact Part)
L Optical path S Non-hardening area

Claims (7)

An optical structure that forms a subject image, a solid-state imaging device that converts the subject image into an electrical signal, a sensor holder that holds the optical structure and accommodates the solid-state imaging device, and an optical structure and a solid-state imaging device A transparent substrate disposed between and supported by the sensor holder,
In the solid-state imaging device in which the space in which the optical structure and the solid-state imaging element are arranged is partitioned by the transparent substrate,
A curable adhesive is applied to the support portion of the transparent substrate in the sensor holder,
The curable adhesive applied to the mounting portion of the transparent substrate in the support portion is cured, and the curable adhesive applied to the peripheral portion of the mounting portion is not cured. A solid-state imaging device having an uncured region.   The solid-state imaging device according to claim 1, wherein the curable adhesive is a photo-curable adhesive.   The solid-state imaging device according to claim 2, wherein the photocurable adhesive is an ultraviolet curable adhesive.   The optical structure includes an imaging lens, a lens barrel that holds the lens, and a focus adjustment mechanism that adjusts the focal point of the lens by moving the lens barrel in the optical axis direction. The solid-state imaging device of any one of 1-3.   The solid-state imaging device according to claim 4, wherein the non-hardening region is formed below a contact portion between the lens barrel and the focus adjustment mechanism. An optical structure that forms a subject image, a solid-state imaging device that converts the subject image into an electrical signal, a sensor holder that holds the optical structure and accommodates the solid-state imaging device, and an optical structure and a solid-state imaging device A transparent substrate disposed between and supported by the sensor holder,
In the method for manufacturing a solid-state imaging device in which a space in which the optical structure and the solid-state imaging element are arranged is partitioned by the transparent substrate,
An application step of applying a curable adhesive to the support portion of the transparent substrate in the sensor holder;
A curing step of curing the curable adhesive,
In the solidifying process, the curing step cures the curable adhesive applied to the mounting portion of the transparent substrate in the support portion, but does not cure the curable adhesive applied to the peripheral portion of the mounting portion. Manufacturing method of imaging apparatus.   The electronic device provided with the solid-state imaging device of any one of Claims 1-5.

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